CN205920952U - Chip paster equipment - Google Patents
Chip paster equipment Download PDFInfo
- Publication number
- CN205920952U CN205920952U CN201620808371.7U CN201620808371U CN205920952U CN 205920952 U CN205920952 U CN 205920952U CN 201620808371 U CN201620808371 U CN 201620808371U CN 205920952 U CN205920952 U CN 205920952U
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- Prior art keywords
- chip
- absorption
- intermediate station
- patch device
- placing
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Abstract
The utility model provides a chip paster equipment, set up at the chip suction means in chip storage district, well revolving stage and the chip placer of a setting in chip paster district including one, chip suction means absorbs the chip in chip storage district and places it on the mesa of well revolving stage, chip placer follows draw the chip on the mesa of well revolving stage and place it to distinguish at the chip paster and carry out die attach. The utility model has the advantages of, adopt chip suction means, well revolving stage and the three device of chip placer to get and put the chip, chip suction means only is responsible for transporting the chip to well revolving stage, chip placer only is responsible for will chip therefrom revolving stage transports to the base plate in chip paster district on, can shorten chip suction means and chip placer's shift motion, improve equipment output efficiency.
Description
Technical field
This utility model is related to field of semiconductor package, more particularly, to a kind of chip patch device.
Background technology
High-tech electronic product is just towards little, light, thin trend development.In contrast, by cost and otherwise
The area of market pressure, lead frame or encapsulating carrier plate develops towards large-sized direction on the contrary.Most popular fan-out-type at present
Encapsulation technology, is based particularly on the encapsulation technology of large area encapsulating carrier plate, and the area of its package carrier has reached tradition envelope
Load 10 times to 20 times about of body (as lead frame).In the face of this technological trend, it is each for how improving load/paster efficiency
Each top device fabrication commercial city of the individual whole world is in the problem considering.
In order to solve the above problems, typically can be predetermined being placed into after chip pick-up using special chip patch device
Position.Referring to Fig. 1, a kind of existing chip fetching device 100 mainly includes suction nozzle 103, and suction nozzle 103 is from chip-stored area
101 and chip rest area 102 pick and place chip.Described chip-stored area 101 is used for depositing chip to be drawn, and described chip is put
Put area 102 for placing the device of chip to be laid, such as in light emitting diode, be used for the metal rack of chip placement, suction nozzle
Closer and farther from chip-stored area 101 and chip rest area 102 under 103 driving means (not indicating in accompanying drawing) driving.Described core
The work process of piece fetching device is as follows: close to chip-stored area 101 under the driving of driving means, suction nozzle 103 exists suction nozzle 103
Absorption chip 104 in the presence of external force such as pressure, then away from chip-stored area 101 under driving means driving, close to core
Piece rest area 102, chip placement 104 in the presence of external force such as pressure, complete chip 104 from the process being drawn to placement,
So circulation repeatedly, chip is persistently placed into chip rest area 102 from chip-stored area 101.But, such chip picks and places
Device, operational efficiency is relatively low, and paster precision also reduces, and limits overall production efficiency.
Especially for fan-out-type (fan-out) encapsulation and modularized encapsulation, its encapsulating carrier plate area increases, every piece of support plate
The upper number of chips double growth compared with traditional frame-type carrier needing attachment, enters according to existing chip patch device
Row chip attachment, then efficiency and precision are extremely low, significantly reduce overall production efficiency.
Therefore, need a kind of chip patch device of high-efficiency high-precision badly.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of chip patch device, and it can improve equipment and produce
Go out efficiency, improve paster precision.
In order to solve the above problems, this utility model provides a kind of chip patch device, is arranged on chip including one and deposits
The chip absorption device of storage area, intermediate station and one are arranged on the chip apparatus for placing of chip Chip Area, described chip absorption device
The chip of absorption chip memory block simultaneously places it on a table top of described intermediate station, and described chip apparatus for placing is from described
Absorption chip place it in chip Chip Area and carry out chip attachment on the table top of turntable.
Further, also include a rotating disk being arranged on chip-stored area, described rotating disk is arranged on chip and is inhaled with described chip
Take between device, described rotating disk includes rotating shaft and the multiple suction nozzles around the setting of described shaft circumference, described suction nozzle is used for adsorbing
The chip in chip-stored area, described axis of rotation draws described chip, described chip absorption device successively to drive described suction nozzle
Draw the chip of described suction, and place it on described intermediate station.
Further, the table top of described intermediate station is provided with multiple cavitys, for accommodating described chip, to avoid described core
Piece moves.
Further, described intermediate station has a drive shaft, to drive described intermediate station to rotate.
Further, described drive shaft is arranged on described table top lower surface.
Further, described drive shaft is arranged on described table top upper surface, and described chip is placed around described drive shaft.
Further, further comprise a visual system, for obtaining the position of the chip of chip apparatus for placing absorption, with
Improve placement accuracy.
Further, described chip absorption device is suction nozzle, and described chip apparatus for placing is suction nozzle.
The utility model has the advantage of, taken using chip absorption device, intermediate station and three devices of chip apparatus for placing
Put chip, described chip absorption device is merely responsible for for chip being transported to intermediate station, described chip apparatus for placing is merely responsible for will be described
Chip is transported to the substrate of chip Chip Area from intermediate station, can shorten the mobile row of chip absorption device and chip apparatus for placing
Journey, improves equipment output efficiency, improves paster precision.
Brief description
Fig. 1 is the structural representation of existing chip patch device；
Fig. 2 is the structural representation of the first specific embodiment of this utility model chip patch device；
Fig. 3 is another structural representation of this utility model chip patch device；
Fig. 4 is the structural representation of the second specific embodiment of this utility model chip patch device；
Fig. 5 is the work process schematic diagram of chip patch device of the present invention.
Specific embodiment
The chip patch device below in conjunction with the accompanying drawings this utility model being provided and its specific embodiment of application are done in detail
Describe in detail bright.
Referring to Fig. 2, in this utility model first specific embodiment, this utility model chip patch device includes arranging
Chip absorption device 203 in chip-stored area 201, intermediate station 204 and a chip being arranged on chip Chip Area 202 place dress
Put 205.
The chip 206 of described chip absorption device 203 absorption chip memory block 201 simultaneously places it in described intermediate station
On 204 table top 207.Further, described chip 206 Pasting is stored, herein not to chip in cutting film 300
Location mode is limited.In this embodiment, described chip absorption device 203 is a suction nozzle.Adopt arrow in Figure 5
Head schematically indicates the motion path of chip absorption device 203: described chip absorption device 203 moves to chip memory area
201 position of chip 206 absorption chip 206；After absorption chip 206, it is adsorbed with the described chip absorption device of chip 206
203 move to intermediate station 204, and described chip 206 is placed on the table top 207 of intermediate station 204.
Described intermediate station 204 is used for the chip receiving described chip absorption device 203 to transport.Further, described intermediate station
204 is rotatable turntable.Described intermediate station 206 has a drive shaft 209, to drive described intermediate station 204 to rotate.In this tool
In body embodiment, described drive shaft 209 is arranged on described table top 207 lower surface, drives described table top 207 to rotate, and supports
Described table top 207.Referring to Fig. 3, described in other specific embodiments of this utility model, drive shaft 209 is arranged on described table top
207 upper surfaces, described chip 206 is placed around described drive shaft 209.
Preferably, the table top 207 of described intermediate station 204 is provided with multiple cavitys 208, for accommodating described chip
206, to avoid described chip 206 mobile, described cavity 208 can be embedded in described table top 207 it is also possible to protrude from described
Table top 207, referring to Fig. 2, described cavity 208 protrudes from described table top 207 in this embodiment.Described chip pick-up dress
After putting 203 absorption chips 206, described chip 206 is positioned in described cavity 208, to avoid rotating when institute in intermediate station 204
State chip shift position, lead to subsequent technique to be difficult to carry out.
Described chip apparatus for placing 205 absorption chip 206 placing it in from the table top 207 of described intermediate station 204
Chip Chip Area 202 carries out chip attachment.Described chip 206 can be mounted in existing various products, for example, be mounted on lead
On framework, chip is not limited by patch product herein.In this embodiment, described chip apparatus for placing 205
For a suction nozzle.Schematically indicate the motion path of chip apparatus for placing 205 in Figure 5 using arrow: described chip is placed
Device 205 moves to above intermediate station 204, and absorption chip 206 from described table top 207；After absorption chip 206, it is adsorbed with
Described chip apparatus for placing 205 movement of chip 206 is placed with area 202 to chip, described chip 206 is placed on chip and is placed with area
202 pasted on product 210, completes movement and the attachment of chip 206.
This utility model chip patch device adopts chip absorption device 203, intermediate station 204 and chip apparatus for placing 205
Three devices pick and place chip, and described chip absorption device 203 is merely responsible for for chip being transported to intermediate station 204, and described chip is placed
Device 205 is merely responsible for being transported to the substrate of chip Chip Area 202 described chip from intermediate station 204, can shorten chip pick-up
Device 203 and the shift motion of chip apparatus for placing 205, improve equipment output efficiency.
The chip patch device of this utility model first specific embodiment can be used in the formal dress encapsulation of chip.If described
When chip absorption device 203 draws described chip 206, it draws the front of described chip 206, then during chip 206 is placed on
When on turntable 204, it is still the face-up of described chip 206, chip apparatus for placing 205 absorption chip from intermediate station 204
When 206, the front being still chip 206 of absorption, when chip 206 is placed paster by chip apparatus for placing 205, it is still chip
206 face-up, the back side with by attachment product contact.Therefore, the chip patch device of this specific embodiment just can be used for
Dress encapsulation.
Further, in this utility model second specific embodiment, this utility model chip patch device also includes one
It is arranged on the rotating disk 310 in chip-stored area 201.Referring to Fig. 4, described rotating disk 310 is arranged on chip 206 and described chip pick-up dress
Put between 203.Described rotating disk 310 includes rotating shaft 311 and the multiple suction nozzles 312 around the setting of described rotating shaft 311 circumference.Described suction
Mouth 312 is used for adsorbing the chip 206 of chip memory block 201, and described rotating shaft 311 rotates to drive described suction nozzle 312 to draw successively
Described chip 206, described chip absorption device 203 draws the chip 206 of described suction nozzle 312 absorption, and places it in described
On intermediate station 204.
The chip patch device of this utility model second specific embodiment can be used in the flip-chip packaged of chip.If described
When the suction nozzle 312 of rotating disk 310 draws described chip 206, it draws the front of described chip 206, then described rotating disk 310 rotates,
The suction nozzle 312 being adsorbed with chip 206 rotates, described chip absorption device 203 from described suction nozzle 312 during absorption chip 206, its
Draw is the exposed back side of chip 206 (now, the front of chip 206 is adsorbed by suction nozzle 312), then chip absorption device 203
When chip 206 is placed on intermediate station 204, upward, chip apparatus for placing 205 is from intermediate station 204 at the back side of described chip 206
During upper absorption chip 206, the back side being still chip 206 of absorption, when chip 206 is placed paster by chip apparatus for placing 205,
It is still the back side of chip 206 upward, the front of chip 206 contacts with by attachment product, thus can achieve the upside-down mounting envelope of chip
Dress.Therefore, the chip patch device of this specific embodiment can be used in flip-chip encapsulation.
Further, described chip patch device also includes a visual system 400, inhales for obtaining chip apparatus for placing 205
The position of attached chip 206, to improve placement accuracy.
The work process of this utility model chip patch device is as follows:
Shown in Figure 5, the mobile route of its chips adopts arrows, and described chip absorption device 203 draws institute
State chip 206 and chip 206 is placed on intermediate station 204；Chip apparatus for placing 205 absorption chip from intermediate station 204
206, chip 206 is placed paster by chip apparatus for placing 205.
The above is only preferred implementation of the present utility model it is noted that common skill for the art
Art personnel, on the premise of without departing from this utility model principle, can also make some improvements and modifications, these improvements and modifications
Also should be regarded as protection domain of the present utility model.
Claims (8)
1. a kind of chip patch device is arranged on the chip absorption device in chip-stored area, intermediate station it is characterised in that including one
And the chip apparatus for placing being arranged on chip Chip Area, the chip of described chip absorption device absorption chip memory block and by its
Be placed on a table top of described intermediate station, described chip apparatus for placing from the table top of described intermediate station absorption chip and by its
It is placed on chip Chip Area and carry out chip attachment.
2. chip patch device according to claim 1 is arranged on chip-stored it is characterised in that further comprising one
The rotating disk in area, described rotating disk is arranged between chip and described chip absorption device, and described rotating disk includes rotating shaft and around described
Multiple suction nozzles of shaft circumference setting, described suction nozzle is used for adsorbing the chip of chip memory block, and described axis of rotation is to drive
State suction nozzle and draw described chip successively, described chip absorption device draws the chip of described suction, and places it in institute
State on intermediate station.
3. chip patch device according to claim 1 is it is characterised in that further, the table top of described intermediate station sets
It is equipped with multiple cavitys, for accommodating described chip, to avoid described chip to move.
4. chip patch device according to claim 1 is it is characterised in that further, described intermediate station has a driving
Axle, to drive described intermediate station to rotate.
5. chip patch device according to claim 4 is it is characterised in that described drive shaft is arranged on described table top following table
Face.
6. chip patch device according to claim 4 is it is characterised in that described drive shaft is arranged on described table top upper table
Face, described chip is placed around described drive shaft.
7. chip patch device according to claim 1, it is characterised in that further comprising a visual system, is used for
Obtain the position of the chip of chip apparatus for placing absorption, to improve placement accuracy.
8. chip patch device according to claim 1 is it is characterised in that described chip absorption device is suction nozzle, described
Chip apparatus for placing is suction nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620808371.7U CN205920952U (en) | 2016-07-28 | 2016-07-28 | Chip paster equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620808371.7U CN205920952U (en) | 2016-07-28 | 2016-07-28 | Chip paster equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205920952U true CN205920952U (en) | 2017-02-01 |
Family
ID=57872658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620808371.7U Active CN205920952U (en) | 2016-07-28 | 2016-07-28 | Chip paster equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205920952U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106903978A (en) * | 2017-02-21 | 2017-06-30 | 深圳市华星光电技术有限公司 | The transfer device of transfer template and micro- light emitting diode |
| CN109216240A (en) * | 2018-08-30 | 2019-01-15 | 大连佳峰自动化股份有限公司 | A kind of chip encapsulating device |
| US10211363B2 (en) | 2017-02-21 | 2019-02-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Transfer printing template and transfer printing device of micro light-emitting diode |
| CN109461684A (en) * | 2018-11-13 | 2019-03-12 | 江苏澳芯微电子有限公司 | Chip patch automatic fixer |
| WO2021026957A1 (en) * | 2019-08-09 | 2021-02-18 | 苏州艾科瑞思智能装备股份有限公司 | High-precision large panel-level micro-assembly device |
| CN115384179A (en) * | 2022-07-01 | 2022-11-25 | 华玻视讯(珠海)科技有限公司 | Shuttle type glass silk screen printing baking production line |
-
2016
- 2016-07-28 CN CN201620808371.7U patent/CN205920952U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106903978A (en) * | 2017-02-21 | 2017-06-30 | 深圳市华星光电技术有限公司 | The transfer device of transfer template and micro- light emitting diode |
| CN106903978B (en) * | 2017-02-21 | 2019-01-11 | 深圳市华星光电技术有限公司 | Transfer the transfer device of template and micro- light emitting diode |
| US10211363B2 (en) | 2017-02-21 | 2019-02-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Transfer printing template and transfer printing device of micro light-emitting diode |
| CN109216240A (en) * | 2018-08-30 | 2019-01-15 | 大连佳峰自动化股份有限公司 | A kind of chip encapsulating device |
| CN109216240B (en) * | 2018-08-30 | 2024-01-19 | 大连佳峰自动化股份有限公司 | Chip packaging equipment |
| CN109461684A (en) * | 2018-11-13 | 2019-03-12 | 江苏澳芯微电子有限公司 | Chip patch automatic fixer |
| WO2021026957A1 (en) * | 2019-08-09 | 2021-02-18 | 苏州艾科瑞思智能装备股份有限公司 | High-precision large panel-level micro-assembly device |
| CN115384179A (en) * | 2022-07-01 | 2022-11-25 | 华玻视讯(珠海)科技有限公司 | Shuttle type glass silk screen printing baking production line |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |