CN106783679B - Chip mounting apparatus and method of mounting chip - Google Patents
Chip mounting apparatus and method of mounting chip Download PDFInfo
- Publication number
- CN106783679B CN106783679B CN201611141417.5A CN201611141417A CN106783679B CN 106783679 B CN106783679 B CN 106783679B CN 201611141417 A CN201611141417 A CN 201611141417A CN 106783679 B CN106783679 B CN 106783679B
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- chip
- dispensing
- patch
- glue
- line
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000000853 adhesive Substances 0.000 claims abstract description 54
- 230000001070 adhesive effect Effects 0.000 claims abstract description 54
- 239000003292 glue Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000010586 diagram Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Die Bonding (AREA)
Abstract
The invention provides chip mounting equipment and a chip mounting method, wherein the chip mounting equipment comprises a chip taking and placing device, a first dispensing device and a second dispensing device, the chip taking and placing device is used for sucking a chip and placing the chip on a substrate, the first dispensing device and the second dispensing device are used for injecting adhesive into the chip mounting position of the substrate, and the first dispensing device and the second dispensing device are respectively arranged on two sides of the chip taking and placing device. The invention has the advantages that the glue dispensing devices are arranged on the two sides of the chip taking and placing device, and the chip mounting and the glue dispensing are performed simultaneously, so that the production efficiency is greatly improved.
Description
Technical Field
The present invention relates to the field of semiconductor packaging, and in particular, to a chip mounting apparatus and a method for mounting a chip.
Background
High-tech electronic products are moving toward small, light and thin trends. In contrast, the area of the lead frame or package carrier is instead moving toward larger dimensions, subject to cost and other market pressures. The most popular fan-out package technology at present, especially the package technology based on a large area package carrier, has an area of about 10 times to 20 times that of the conventional package carrier (such as a lead frame). In the face of this technological trend, how to improve the die/chip efficiency is a matter of consideration for the equipment manufacturers of the respective centers around the world.
The current general patch equipment comprises a dispensing machine and a chip taking and placing device, and the general patch method comprises the following steps:
referring to fig. 1A, a dispensing head 10 dispenses at a position to be pasted on a substrate 11; referring to fig. 1B, the substrate 11 is moved, and the chip pick-and-place device 12 places the sucked chip at a position where the glue has been dispensed, completing the bonding of the position; referring to fig. 1C, the substrate 11 is moved to make the dispensing head 10 dispense at the next position to be mounted; referring to fig. 1D, the substrate 11 is moved, and the chip pick-and-place device 12 places the sucked chip at a position where the adhesive has been dispensed, completing the position-mounting. And repeating the steps, dispensing once to mount the chip once until the whole substrate is fully mounted with the chip. The disadvantages of this method are: when the dispensing head works, the chip taking and placing device is idle, and when the chip taking and placing device works, the dispensing head is idle, so that the production efficiency is low and the requirements cannot be met.
Accordingly, there is a need to provide a new chip mounting apparatus and a method of mounting chips that solve the above-described problems.
Disclosure of Invention
The invention aims to solve the technical problem of providing chip mounting equipment and a chip mounting method, which can greatly improve the production efficiency.
In order to solve the problems, the invention provides chip mounting equipment, which comprises a chip taking and placing device, a first dispensing device and a second dispensing device, wherein the chip taking and placing device is used for sucking a chip and placing the chip on a substrate, the first dispensing device and the second dispensing device are used for injecting adhesive into the surface mounting position of the substrate, and the first dispensing device and the second dispensing device are respectively arranged on two sides of the chip taking and placing device.
Further, the chip picking and placing device is provided with a plurality of suction nozzles for sequentially sucking and placing chips.
Further, the chip taking and placing device is provided with a rotating shaft, and the suction nozzle is arranged along the circumference of the rotating shaft.
Further, the first adhesive dispensing device and the second adhesive dispensing device are symmetrically arranged on two sides of the chip taking and placing device.
The invention also provides a method for mounting chips by using the chip mounting equipment, wherein a plurality of groups of patch groups are arranged on a substrate to be subjected to patch in parallel, each patch group comprises a first patch row, a second patch row and a third patch row, and the method comprises the following steps: (a) The first dispensing device dispenses glue to a first patch row of a substrate, and a first dispensing row is formed on the substrate; (b) The chip taking and placing device starts the patch from the head end of the first adhesive dispensing line, the first adhesive dispensing device starts the adhesive from the middle part of the second patch line of the substrate, and when the chip taking and placing device finishes the patch at the front part of the first adhesive dispensing line, the first adhesive dispensing device forms the rear part of the second adhesive dispensing line at the rear part of the second patch line; (c) The chip taking and placing device continues to glue along the first glue dispensing line, the second glue dispensing device starts glue from the head end of the second glue dispensing line, and when the chip taking and placing device completes the pasting of the rear part of the first glue dispensing line, the second glue dispensing device forms the front part of the second glue dispensing line at the front part of the second glue dispensing line, so that a complete second glue dispensing line is formed; (d) The chip taking and placing device starts a patch from the tail end of the second adhesive dispensing line, the second adhesive dispensing device starts adhesive from the middle part of a third patch line of the substrate, and when the chip taking and placing device finishes the patch at the rear part of the second adhesive dispensing line, the second adhesive dispensing device forms the front part of the third adhesive dispensing line at the front part of the third patch line; (e) The chip taking and placing device continues to glue along the second glue dispensing line, the first glue dispensing device starts glue from the tail end of the third glue dispensing line, and when the chip taking and placing device completes the glue dispensing of the front part of the second glue dispensing line, the first glue dispensing device forms the rear part of the third glue dispensing line at the rear part of the third glue dispensing line, so as to form a complete third glue dispensing line; (f) repeating steps (b) - (e).
Further, in the steps (a) to (f), the substrate is moved so that the chip mounter corresponds to a position where the chip mounter needs to operate.
Further, the first adhesive dispensing device and the second adhesive dispensing device are symmetrically arranged on two sides of the chip taking and placing device.
Further, the distance from the dispensing position of the first dispensing device to the chip pick-and-place device patch position is equal to the distance from the dispensing position of the second dispensing device to the chip pick-and-place device patch position.
Further, the second patch row middle is one half of the second patch row, and the third patch row middle is one half of the third patch row.
Further, the chip picking and placing device is provided with a plurality of suction nozzles, and when one suction nozzle of the chip picking and placing device is used for placing a chip, the other suction nozzle is used for sucking the chip.
The invention has the advantages that the two sides of the chip taking and placing device are provided with the glue dispensing devices, the chip attaching process and the glue dispensing process are carried out simultaneously, and the production efficiency is greatly improved.
Drawings
FIGS. 1A-1D are process flow diagrams of a conventional bonding method;
FIG. 2 is a schematic diagram of a chip mounter according to the present invention;
fig. 3A to 3I are process flow diagrams of a method of mounting a chip according to the present invention.
Detailed Description
The following describes in detail the specific embodiments of the chip mounting apparatus and the method for mounting chips provided by the present invention with reference to the accompanying drawings.
Referring to fig. 2, the chip mounter of the present invention includes a chip pick-and-place device 20, a first dispensing device 21, and a second dispensing device 22.
The chip pick-and-place device 20 is used to pick up a chip and place the chip on a substrate 30 (see fig. 3A). Further, the chip pick-and-place device 20 includes a rotating shaft 29 and a plurality of suction nozzles 28 disposed along the circumference of the rotating shaft 29. The suction nozzle 28 is used for sucking the chip, and in this embodiment, the suction nozzle 28 is a vacuum suction nozzle. The rotation shaft 29 rotates to enable the suction nozzles 28 to face the chips to be sucked, the suction nozzles 28 stretch and suck the chips, the rotation shaft 29 rotates to enable the suction nozzles 28 to suck the chips in sequence, and therefore working efficiency is improved. Further, those skilled in the art may obtain the structure of the chip pick-and-place device 20 from the prior art, and the present invention is not limited thereto as long as the objects of the present invention are satisfied.
The first dispensing device 21 and the second dispensing device 22 are used for injecting adhesive into the patch position of the substrate 30, and the first dispensing device 21 and the second dispensing device 22 are separately arranged at two sides of the chip pick-and-place device 20. Preferably, the first dispensing device 21 and the second dispensing device 22 are symmetrically disposed at two sides of the chip pick-and-place device 20, and the distance from the dispensing position of the first dispensing device 21 to the chip pick-and-place device 20 patch position is equal to the distance from the dispensing position of the second dispensing device 22 to the chip pick-and-place device 20 patch position, so that efficient patch can be realized. Further, the person skilled in the art can obtain the structures of the first dispensing device 21 and the second dispensing device 22 from the prior art, and the present invention is not limited thereto as long as the objects of the present invention are satisfied.
The invention also provides a method for mounting the chip by using the chip mounting equipment. For the sake of clarity and conciseness in explaining the steps of the method for mounting chips of the present invention, it is assumed that a plurality of sets of patch groups are disposed in parallel on the substrate 30 to be mounted, each patch group includes a first patch row 31, a second patch row 32 and a third patch row 33, and the first patch row 31, the second patch row 32 and the third patch row 33 are formed by a plurality of positions to be mounted, and since the first patch row 31, the second patch row 32 and the third patch row 33 do not really exist, the positions thereof are marked by dotted lines.
The method for mounting the chip comprises the following steps:
step (a): referring to fig. 3A, 3B and 3C, the first dispensing device 21 dispenses the first adhesive on the first patch row 31 of the substrate 30, and forms a first adhesive dispensing row 34 on the substrate 30. In this embodiment, the substrate 30 is moved, as indicated by the arrow in the figure, so that the first dispensing device 21 dispenses at different positions, and in other embodiments of the present invention, the die attach device is moved, so that the first dispensing device 21 dispenses at different positions. The substrate 30 may be any structure requiring a patch in the prior art, and the present invention is not limited thereto.
Step (b): referring to fig. 3D, the chip pick-and-place device 20 attaches the chips 40 from the head end to the tail end of the first adhesive dispensing line 34, and the first adhesive dispensing device 21 dispenses adhesive from the middle of the second adhesive dispensing line 32 of the substrate 30 to the rear of the second adhesive dispensing line 32. The middle of the second patch row 32 refers to the middle of the second patch row 32, and in this embodiment, the middle of the second patch row 32 refers to one half of the second patch row 32. Referring to fig. 3E, when the chip pick-and-place device 20 completes the mounting of the front portion of the first dispensing line 34, the first dispensing device 21 forms a rear portion of the second dispensing line 35 at the rear portion of the second mounting line 32. In this embodiment, the substrate 30 is moved, as indicated by the arrow in the figure, so that the first dispensing device 21 dispenses glue at different positions, the chip pick-and-place device 20 patches at different positions, and in other embodiments of the present invention, the chip mounting apparatus is moved, so that the first dispensing device 21 dispenses glue at different positions, and the chip pick-and-place device 20 patches at different positions.
Step (c): referring to fig. 3F, the chip pick-and-place device 20 continues to attach the chips 40 along the first adhesive dispensing line 34, and the second adhesive dispensing device 22 dispenses adhesive from the head end to the tail end of the second adhesive dispensing line 32, where the first adhesive dispensing device 21 is at a position without the substrate 30, and no adhesive dispensing is performed. When the chip pick-and-place device 20 completes the mounting of the rear portion of the first dispensing line 34, the second dispensing device 22 forms a front portion of the second dispensing line 35 in front of the second mounting line 32, so as to form a complete second dispensing line 35. In this embodiment, the substrate 30 is moved, as indicated by the arrow in the figure, so that the second dispensing device 22 dispenses at different positions, the chip pick-and-place device 20 patches at different positions, and in other embodiments of the present invention, the chip mounting apparatus is moved, so that the second dispensing device 22 dispenses at different positions, and the chip pick-and-place device 20 patches at different positions.
Step (d): referring to fig. 3G, the chip pick-and-place device 20 attaches the chip 40 from the tail end of the second dispensing line 35 to the head end, and the second dispensing device 22 attaches the chip from the middle of the third dispensing line 33 of the substrate 30 to the head end of the third dispensing line 33. The middle of the third patch row 33 refers to the middle of the third patch row 33, and in this embodiment, the middle of the third patch row 33 refers to one half of the third patch row 33. Referring to fig. 3H, when the chip pick-and-place device 20 completes the mounting of the rear portion of the second dispensing line 35, the second dispensing device 22 forms a front portion of the third dispensing line 36 in front of the third mounting line 33. In this embodiment, the substrate 30 is moved, as indicated by the arrow in the figure, so that the second dispensing device 22 dispenses at different positions, the chip pick-and-place device 20 patches at different positions, and in other embodiments of the present invention, the chip mounting apparatus is moved, so that the second dispensing device 22 dispenses at different positions, and the chip pick-and-place device 20 patches at different positions.
Step (e): referring to fig. 3I, the chip pick-and-place device 20 continues to attach the chip 40 along the second dispensing line 35, the first dispensing device 21 starts the adhesive from the tail end of the third dispensing line 33, and when the chip pick-and-place device 20 completes the adhesive attaching in front of the second dispensing line 35, the first dispensing device 21 forms a third dispensing line 36 in the rear of the third dispensing line 33, so far, a complete third dispensing line 36 is formed.
Step (f): repeating steps (b) - (e) until the substrate 30 is full of chips 40.
Further, the first dispensing device 21 and the second dispensing device 22 are symmetrically disposed on two sides of the chip pick-and-place device 20, and the distance from the dispensing position of the first dispensing device 21 to the chip pick-and-place device 20 patch position is equal to the distance from the dispensing position of the second dispensing device 22 to the chip pick-and-place device 20 patch position, when the first dispensing device 21 or the second dispensing device 22 dispenses, the chip pick-and-place device 20 is just located above the chip pick-and-place device 20 patch position, so that simultaneous dispensing can be realized.
The method for mounting the chip of the invention mounts the chip while dispensing, thereby greatly providing production efficiency, saving cost and saving time.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention.
Claims (5)
1. A chip mounting apparatus is characterized in that,
the chip pick-and-place device is used for sucking a chip and placing the chip on a substrate, the first adhesive dispensing device and the second adhesive dispensing device are used for injecting an adhesive into the patch position of the substrate, and the first adhesive dispensing device and the second adhesive dispensing device are respectively arranged on two sides of the chip pick-and-place device;
the first dispensing device and the second dispensing device are symmetrically arranged on two sides of the chip picking and placing device, the distance from the dispensing position of the first dispensing device to the patch position of the chip picking and placing device is equal to the distance from the dispensing position of the second dispensing device to the patch position of the chip picking and placing device, and when the first dispensing device or the second dispensing device executes dispensing operation, the chip picking and placing device is just positioned above the patch position, and meanwhile, the chip picking and placing device executes patch operation;
the chip taking and placing device is provided with a plurality of suction nozzles for sequentially sucking and placing chips;
the chip taking and placing device is provided with a rotating shaft, and the suction nozzle is arranged along the circumference of the rotating shaft; and
the chip taking and placing device is provided with a plurality of suction nozzles, and when one suction nozzle of the chip taking and placing device is used for placing chips, the other suction nozzle is used for sucking the chips.
2. A method for mounting chips by using the chip mounting apparatus of claim 1, wherein a plurality of patch groups are arranged in parallel on a substrate to be mounted, each patch group comprises a first patch row, a second patch row and a third patch row,
the method comprises the following steps:
(a) The first dispensing device dispenses glue to a first patch row of a substrate, and a first dispensing row is formed on the substrate;
(b) The chip taking and placing device starts the patch from the head end of the first adhesive dispensing line, the first adhesive dispensing device starts the adhesive from the middle part of the second patch line of the substrate, and when the chip taking and placing device finishes the patch at the front part of the first adhesive dispensing line, the first adhesive dispensing device forms the rear part of the second adhesive dispensing line at the rear part of the second patch line;
(c) The chip taking and placing device continues to glue along the first glue dispensing line, the second glue dispensing device starts glue from the head end of the second glue dispensing line, and when the chip taking and placing device completes the pasting of the rear part of the first glue dispensing line, the second glue dispensing device forms the front part of the second glue dispensing line at the front part of the second glue dispensing line, so that a complete second glue dispensing line is formed;
(d) The chip taking and placing device starts a patch from the tail end of the second adhesive dispensing line, the second adhesive dispensing device starts adhesive from the middle part of a third patch line of the substrate, and when the chip taking and placing device finishes the patch at the rear part of the second adhesive dispensing line, the second adhesive dispensing device forms the front part of the third adhesive dispensing line at the front part of the third patch line;
(e) The chip taking and placing device continues to glue along the second glue dispensing line, the first glue dispensing device starts glue from the tail end of the third glue dispensing line, and when the chip taking and placing device completes the glue dispensing of the front part of the second glue dispensing line, the first glue dispensing device forms the rear part of the third glue dispensing line at the rear part of the third glue dispensing line, so as to form a complete third glue dispensing line;
(f) Repeating steps (b) - (e);
the first adhesive dispensing device and the second adhesive dispensing device are symmetrically arranged on two sides of the chip taking and placing device; the distance from the dispensing position of the first dispensing device to the chip pick-and-place device patch position is equal to the distance from the dispensing position of the second dispensing device to the chip pick-and-place device patch position.
3. The method for mounting chips on a chip mounting apparatus according to claim 2, wherein,
in the steps (a) - (f), the substrate is moved so that the chip mounting apparatus corresponds to a position where the chip mounting apparatus needs to operate.
4. The method for mounting chips on a chip mounting apparatus according to claim 2, wherein,
the middle part of the second patch row is one half of the second patch row, and the middle part of the third patch row is one half of the third patch row.
5. The method for mounting chips on a chip mounting apparatus according to claim 2, wherein,
the chip taking and placing device is provided with a plurality of suction nozzles, and when one suction nozzle of the chip taking and placing device is used for placing chips, the other suction nozzle is used for sucking the chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611141417.5A CN106783679B (en) | 2016-12-12 | 2016-12-12 | Chip mounting apparatus and method of mounting chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611141417.5A CN106783679B (en) | 2016-12-12 | 2016-12-12 | Chip mounting apparatus and method of mounting chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106783679A CN106783679A (en) | 2017-05-31 |
| CN106783679B true CN106783679B (en) | 2023-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611141417.5A Active CN106783679B (en) | 2016-12-12 | 2016-12-12 | Chip mounting apparatus and method of mounting chip |
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| Country | Link |
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| CN (1) | CN106783679B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107979970A (en) * | 2017-11-13 | 2018-05-01 | 北京七星华创微电子有限责任公司 | A kind of chip chip mounter and chip pasting method |
| CN109327267B (en) * | 2018-10-11 | 2021-09-17 | 深圳飞骧科技股份有限公司 | SMD debugger |
| CN109746599B (en) * | 2019-01-30 | 2023-11-17 | 无锡奥特维科技股份有限公司 | Battery piece processing equipment and method |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN106783679A (en) | 2017-05-31 |
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