JP2014027225A - Wafer cart and electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a die pickup cart capable of being replaced with a feeder cart and an electronic component mounting device.SOLUTION: A die pickup cart includes a wafer pickup part that fixes a wafer ring, picks up a die from a wafer in the wafer ring, and places the die on an intermediate stage on which the picked die is placed, and an inversion mechanism part attracts the die that is placed on the intermediate stage and rotates the die by 180° to hold the die so that the back side of the die faces upwardly, and the die pickup cart can be replaced with a feeder cart and can be set to an electronic component mounting device.

Description

  The present invention relates to a wafer cart and an electronic component mounting apparatus, and more particularly to a wafer cart that can be easily replaced with a feeder cart.

In order to produce circuit boards, an electronic component mounting apparatus that mounts electronic components on a printed circuit board has recently been desired to have a higher operating rate. In addition to the normal packaged electronic components, the components mounted on the printed circuit board include unpackaged semiconductor components (dies) such as bare chips.
These two types of parts can be installed at the same time for improving the operating rate or for high-mix low-volume production, or electronic parts that can be installed with two types of parts by a simple model change operation. A mounting device is desirable.

JP2012-109494A

Patent Document 1 is an electronic component supply apparatus that uses a feeder cart equipped with a tape feeder that supplies electronic components using a supply tape, and an electronic component mounting apparatus that uses a cart (die pickup cart) for supplying dies from a wafer. There is no description about. That is, in the electronic component mounting apparatus disclosed in Patent Document 1, it is not possible to supply a die from a wafer and mount it on a printed board.
In view of the above problems, an object of the present invention is to provide a wafer cart and an electronic component supply apparatus that can be replaced with a feeder cart.

  In order to achieve the above object, a wafer cart of the present invention includes a wafer pick-up unit that fixes a wafer ring, picks up a die from a wafer in the wafer ring, and places the die on an intermediate stage, and the picked-up die. An intermediate stage to be mounted; and a reversing mechanism unit that holds the die placed on the intermediate stage by suction and rotates from 180 ° down to above and holds the back of the die facing upward. The first feature is that it can be replaced with a feeder cart and set in the electronic component mounting apparatus.

  In order to achieve the above object, the wafer cart of the present invention includes a wafer pickup unit that fixes a wafer ring, picks up a die from a wafer in the wafer ring, and places the die on an intermediate stage. An intermediate stage that mounts a die and rises up to the height of the component outlet of the electronic component mounting device, and can be replaced with a feeder cart and set in the electronic component mounting device. Features.

  In the wafer cart according to the first feature or the second feature of the present invention, the wafer pickup unit has an expand ring for expanding the wafer ring after being fixed. And

  The wafer cart according to any one of the first to third features of the present invention further includes a wafer cassette installation unit for supplying the wafer ring to the wafer pickup unit. It is characterized by.

  In the wafer cart according to any one of the first to fourth features of the present invention, the intermediate stage can place a plurality of dies, and the reversing mechanism can pick up the dies simultaneously. This is the fifth feature of the present invention.

  In the wafer cart according to any one of the first to fifth features of the present invention, a sixth feature of the present invention is that a plurality of the intermediate stage and the reversing mechanism section are provided.

  In order to achieve the above object, an electronic component mounting apparatus of the present invention is provided with the wafer cart according to any one of the first to sixth features of the present invention in a detachable manner. Features.

  ADVANTAGE OF THE INVENTION According to this invention, the die pick-up cart and electronic component supply apparatus which can be replaced | exchanged for a feeder cart can be provided, and the die pick-up cart and electronic component mounting apparatus which are applicable to many electronic components and dies, and are easy to switch a model. Can be realized.

It is a top view which shows the structure of one Example of the electronic component mounting apparatus of this invention. It is a perspective view of one Example of the feeder cart in the electronic component mounting apparatus of this invention. It is a figure which shows the structural example of the general supply tape used for this embodiment. It is a top view for demonstrating one Example which replaces the feeder cart 50 with a wafer cart in the electronic component apparatus of this invention. It is a top view for demonstrating one Example of the wafer cart in the electronic component mounting apparatus of this invention. It is a perspective view for demonstrating one Example of the wafer cart in the electronic component mounting apparatus of this invention. It is an external appearance perspective view which shows the principal part of the wafer pick-up part which is one Embodiment of this invention. It is a schematic sectional drawing which shows the principal part of the wafer pick-up part which is one Embodiment of this invention. It is a typical side view for demonstrating one Example of the die pick-up operation | movement which is one Embodiment of this invention. It is a sectional side view for demonstrating one Example of the inversion mechanism part of the wafer pick-up part of the wafer cart of this invention. It is a sectional side view of the wafer cart part for demonstrating one Example of the electronic component mounting apparatus of this invention. It is a sectional side view of the wafer cart part for demonstrating one Example of the electronic component mounting apparatus of this invention. It is a timing chart for demonstrating one Example of the mounting | wearing operation | movement of die | dye in the electronic component mounting apparatus of this invention. It is a timing chart for demonstrating one Example of the mounting | wearing operation | movement of die | dye in the electronic component mounting apparatus of this invention.

Hereinafter, embodiments of a wafer cart and an electronic component mounting apparatus according to the present invention will be described with reference to the drawings.
In addition, the following description is for describing one embodiment of the present invention, and does not limit the scope of the present invention. Accordingly, those skilled in the art can employ embodiments in which these elements or all of the elements are replaced with equivalent ones, and these embodiments are also included in the scope of the present invention.
In the description of each drawing, the same reference numerals are assigned to components having the same function, and description thereof is omitted as much as possible to avoid duplication.

The first embodiment of the present invention will be described below. FIG. 1 is a plan view showing a configuration of an embodiment of an electronic component mounting apparatus according to the present invention. The electronic component mounting apparatus 1 has a total of four blocks, that is, two blocks LU and LD on the upper left and lower sides, and two blocks RU and RD on the right side, and a control device 80. In the drawing, reference numerals are basically written only for LU blocks.
In each block, a component supply area 13 in which a feeder cart loaded with a large number of tape feeders is set, a mounting head 6, a mounting head body 11 for moving the mounting head 6, and a suction holding state of electronic components in the suction head 6 A component recognition camera 19 is provided. The mounting head body 11 moves to the left and right on the left / right moving rail 18 constituted by the linear motor, and moves the up / down moving rail 16 constituted by the linear motor up and down like the left / right moving rail 18.

  With such a configuration, the suction nozzle of the mounting head 6 fixed to the mounting head body 11 sucks the electronic component 4 (see FIG. 3 described later) from the component supply area 13, and the component recognition camera 19 sucks the electronic component 4. The holding state is monitored, the substrate P is moved to a predetermined position, and the sucked electronic component 4 is mounted on the substrate P.

  Such an operation is performed in four blocks. Therefore, in the center, there are four chutes 5a to 5d for transporting the substrate P, the upper two chutes 5c and 5d are on the upper block substrate transport line U, and the lower two chutes 5a and 5b are on the bottom. A substrate transport line D for the side block is configured. The substrate P is distributed by the delivery unit 7 and carried into the substrate transport line U or D.

FIG. 2 is a perspective view of an embodiment of the feeder cart 50 set in the component supply area 13 of the electronic component mounting apparatus 1 of FIG.
The feeder cart 50 shown in FIG. 2 is roughly composed of a base portion 51, a feeder fixing portion 52 for fixing a tape feeder (not shown), a handle portion 53, and a component supply reel storage portion 54 storing a component supply reel 70. Has been.
The base portion 51 has four wheel fixing portions 51a for fixing a moving wheel (not shown) at four corners. When the feeder cart 50 is fixed to the electronic component mounting apparatus main body 1, the feeder cart 50 is placed on the floor. It has the lock pin 51b fixed to a surface. The feeder fixing part 52 is on the upper side of the feeder cart 50. The feeder fixing part 52 places the tape feeder on the feeder base 52a by causing the feeder fixing part guide 52c to guide the cassette fixing part of the tape feeder. Further, the feeder fixing unit 52 connects the interface unit of the tape feeder to the feeder signal connector 52d. The feeder fixing portion connectors 52c are regularly arranged on the feeder base 52a so that a large number of tape feeders can be mounted. Each tape feeder is supplied with a supply tape 60 on which the electronic component 4 is mounted from a supply reel storage section 54 by an operator.

  Further, at both ends of the feeder base 52a, there are feeder guides 52e that play a role of sliding a cart guide plate (not shown) provided on the main body 1 when the feeder cart 50 is inserted into the main body 1. Further, the feeder guide 52 e has a positioning hole 52 b for fixing the feeder cart 50 to the main body 1. Finally, there is a handle portion 53 so that the feeder cart 50 can be moved, and the operator moves the feeder cart 50 in the Y direction which is the direction of the main body 1 by the handle 53a of the handle portion 53 and inserts the feeder cart 50 into the main body. At this time, the front end 53c of the side plate 53b of the handle portion 53 serves as a stopper that prevents the feeder cart 50 from being inserted any further.

FIG. 3 is a diagram illustrating a configuration example of a general supply tape used in the present embodiment. 4 is an electronic component, 63 is a pocket for accommodating the electronic component 4, 62 is a carrier tape, 64 is a sprocket hole (tape feed hole), and 61 is a cover tape.
In the supply tape 60 of FIG. 3, the carrier tape 62 has a pocket 63 for accommodating the electronic component 4. Further, the carrier tape 62 is covered with a cover tape 61 so that the electronic component 4 accommodated in the pocket 63 does not jump out. A substantially circular sprocket hole (tape feed hole) 64 that engages with teeth of a sprocket 43 (see FIG. 4 to be described later) and moves the supply tape 60 is disposed at one end of the carrier tape 62 at a constant interval (constantly). For each pitch).

FIG. 4 is a diagram for explaining an embodiment in which the detachable feeder cart 50 set in one of the component supply areas 13 is replaced with a wafer cart 450 in the electronic component device 1.
As shown in FIG. 4, a detachable feeder cart 50 and a detachable wafer cart 450 are prepared in the electronic component device 1 of the present invention. That is, the electronic component device 1 can replace the feeder cart 50 and the wafer cart 450. FIG. 4 shows that the feeder cart 50 set in the component supply area 13 of the block LD in the electronic component apparatus 1 of FIG. 1 is taken out (arrow 401) and the wafer cart 450 is set (arrow 402).
In the electronic component mounting apparatus shown in FIG. 1, up to four feeder carts or wafer carts can be set.

5 and 6 are views for explaining an embodiment of the wafer cart of the present invention. FIG. 5 is a plan view for explaining one embodiment of a wafer cart in the electronic component mounting apparatus of the present invention. FIG. 6 is a perspective view for explaining an embodiment of the wafer cart in the electronic component mounting apparatus of the present invention.
The wafer cart 450 shown in FIGS. 5 and 6 is roughly composed of a base unit 51, a wafer pickup unit 502, and a wafer cassette installation unit 501 for carrying the wafer ring 503 into and out of the wafer pickup unit 502. The configuration of the part related to the attachment / detachment to the mounting device 1 is the same as that of the feeder cart 50 described in FIG.
For example, the base portion 51 is provided with four wheel fixing portions 51a at four corners for fixing a moving wheel (not shown). Further, the base portion 51 has lock pins 51b for fixing the wafer cart 450 to the floor surface when the wafer cart 450 is fixed to the electronic component mounting apparatus main body 1. The wafer pickup fixing unit 520 guides the wafer pickup unit 502 and fixes the wafer ring 503 at a predetermined position of the electronic component device main body 1. Further, the wafer pickup fixing unit 520 connects the interface unit of the wafer pickup unit 502 to the feeder signal connector 52d. Wafer ring 503 mounted on the cassette portion of wafer cassette setting portion 501 is supplied to wafer pickup portion 502 by an operator or a transport mechanism.

  The structure for connecting and fixing the wafer cart 450 and the electronic component mounting apparatus 1 such as the base unit 51 and the wafer pickup fixing unit 520 is the same as that of the feeder cart 50, and the cart that can exchange the feeder cart 50 and the wafer cart 450 with each other. It has a structure. Therefore, the movable range of the suction nozzle of the mounting head 6 is not changed in the same manner as the feeder cart 50. For example, the pick-up position is provided so that the suction nozzle of the mounting head 6 can pick up the die 3 from the die pick-up position of the wafer cart 450 (corresponding to each component outlet of the tape feeder of the feeder cart 50). That is, the movable range of the suction nozzle of the mounting head 6 is determined by the position (height, depth direction (Y direction) position) of the outlet for sucking the electronic component 4 from the tape feeder of the feeder cart 50. .

Next, the configuration of the wafer pickup unit 502 will be described with reference to FIGS. FIG. 7 is an external perspective view showing the main part of the wafer pickup unit 502 according to an embodiment of the present invention. FIG. 8 is a schematic cross-sectional view showing the main part of the wafer pickup portion according to one embodiment of the present invention.
In the wafer pickup unit 502, 705 is a wafer, 3 is an individual die of the wafer 705, 503 is a wafer ring, 715 is an expanding ring, 716 is a dicing tape, 717 is a support ring, 718 is a die attach film (die bonding tape), Reference numeral 750 denotes a push-up unit.

As shown in FIGS. 7 and 8, a die attach film 718 is affixed to the back surface of the wafer 705, and a dicing tape 716 is affixed to the back side thereof. Further, the edge of the dicing tape 716 is sandwiched and fixed between the wafer ring 503 and the expand ring 715.
That is, the wafer pickup unit 502 includes an expand ring 715 that holds the wafer ring 503, a support ring 717 that horizontally positions a dicing tape 716 held by the wafer ring 503 and bonded to a plurality of dies 3 (wafers 705), And a push-up unit 50 that is disposed inside the support ring 717 and pushes the die 3 upward. The push-up unit 750 is moved in the vertical (Z) direction, the X direction, and the Y direction by a driving mechanism (not shown), and the wafer pickup (described later) is similarly moved in the X direction, the Y direction, and the Z direction. It is supposed to move.

The wafer pickup unit 502 lowers the expand ring 715 holding the wafer ring 503 when the die 3 is pushed up. At this time, since the support ring 717 does not descend, the dicing tape 716 held on the wafer ring 503 is stretched to widen the distance between the dies 3 so that the dies 3 can be easily recognized and the individual dies 3 are separated. It becomes easy to raise.
The push-up unit 750 pushes up the die 3 from below and improves the pick-up property of the die 3 at the time of pick-up by a suction nozzle such as a collet. As the die 3 (wafer 705) is made thinner, the adhesive is changed from a liquid to a film, and a film-like adhesive material called a die attach film 718 is attached between the wafer 705 and the dicing tape 716. Dicing on the wafer 705 having the die attach film 718 is performed on the wafer 705 and the die attach film 718. Accordingly, in the peeling (pushing up) step, the die 3 and the die attach film 718 are peeled from the dicing tape 716, and a suction nozzle such as a collet sucks the die 3 and picks it up.

  In general, if the wafer is expanded in advance before being carried into the wafer cassette setting section, stress is applied for a long time, and damage such as cracking increases especially when the die is thin. However, when the die is expanded just before the die is picked up in this way, the rate of breakage such as cracks can be reduced due to stress when the die is thin.

FIG. 9 is a schematic side view for explaining an example of the die pickup operation according to the embodiment of the present invention.
In this die pickup operation, various dies (semiconductor chips) are mounted on the intermediate stage 504 or 505 before being mounted on the substrate P.
In FIG. 9, for example, a wafer 705 (not shown) in which a large number of dies 3 are assembled is placed on the wafer ring 503. A die attach film 718 (not shown) is affixed to the back surface of the wafer 705 and is diced so that it can be picked up separately for each die 3, and a dicing tape 716 is affixed to the back surface.
The intermediate stages 504 and 505 are tables on which a predetermined number (for example, four) of dies 3 are placed side by side. As shown in FIG. 5, the intermediate stages 504 and 505 are installed on the outer side of the wafer 705 on the back side of the wafer cart 450 and above the wafer 705 so as to overlap the outer edge of the wafer ring 503. The intermediate stages 504 and 505 are provided directly below a reversing mechanism 141 or 151 described later.
The collet unit 40 is provided in a bonding head (not shown), and the bonding head moves between the wafer 705 of the wafer ring 503 and the intermediate stage 901.

An embodiment of the pickup operation of the present invention will be described with reference to FIG.
In FIG. 9, the collet unit 40 moves to a position P <b> 1 above the position P <b> 2 that is a pickup point of the wafer pickup unit 502.
Next, the collet unit 40 descends to a position P2 that is the pickup point of the die 3 and sucks the die 3 on the wafer ring 503 in accordance with the push-up of the wafer pickup unit 502 (see the push-up unit 750 in FIG. 8). Return to the position P1 above the pickup point again.
The collet portion 40 that has sucked the die 3 moves to a position P3 above the intermediate stage 504. Subsequently, the die 3 is lowered to a position P4 that is a placement point of the intermediate stage 901, and the sucked die 3 is placed on the intermediate stage 901. Then, it returns to the upper position P3 again.
When the placement of the dies has been completed for all the placement positions of the intermediate stage 504 (for example, four places when fully loaded), the pickup operation to the other intermediate stage 505 is started.
In addition, as shown in FIG. 10A described later, the intermediate stages 504 and 505 fix the die 3 by vacuum suction.

  As will be described later, while the intermediate stage 504 (or 505) is mounting the die 3, the die 3 mounted on the intermediate stage 505 (or 504) is the mounting head of the electronic component mounting apparatus 1. The suction nozzle 6 is attached to the substrate P. Therefore, when the die 3 is placed on the intermediate stage 504 (or 505) with the maximum placement amount (four dies), the die 3 can be placed next on the other intermediate stage 505 (or 504). I have to. In this manner, the placement of the die 3 on the intermediate stage 504 or 505 and the mounting of the die 3 on the substrate P by the electronic component mounting apparatus 1 from the intermediate stage 504 or 505 can be performed alternately. Is raised.

  FIG. 10 is a side sectional view of a wafer cart for explaining one embodiment of the reversing mechanism portion of the wafer pickup portion of the present invention. In FIG. 10, the reversing mechanism unit 141 includes a rotating unit 102 that rotates 180 ° around a rotating shaft (horizontal axis) 103, and suction nozzles 104 and 105 that are provided above and below the rotating unit 102. The suction nozzles 104 and 105 pass through the center of the rotary shaft 103 and are provided in parallel in the vertical direction. When the rotary unit 102 is rotated 180 ° by driving a rotary drive unit (not shown), the vertical position is reversed. Further, the suction nozzles 104 and 105 are provided perpendicular to the paper surface with the same number of dies 3 that can be placed on the intermediate stage 504 (or 505) as the same pitch as the dies placed thereon. All the suction nozzles simultaneously rotate and suck.

As shown in FIG. 10A, in a state where the dies 3 are mounted at all the mounting positions of the intermediate stage 504 (full load state), the dies 3 are held by the intermediate stage and moved from the intermediate stage to the mounting position. An inversion operation is started.
In FIG. 10A, the intermediate stage 504 moves upward by a vertical drive mechanism (not shown) while the die 3 is fixed by vacuum suction, and the downward suction nozzle 104 of the reversing mechanism portion 141 moves the die 3 down. It stops at a height that can be adsorbed (position shown in FIG. 10B).
In FIG. 10B, the intermediate stage 504 stops vacuum suction, and conversely, the suction nozzle 104 starts vacuum suction. As a result, the die 3 that has been close to the suction nozzle 104 is sucked by the suction nozzle 104.
Thereafter, the intermediate stage 504 is lowered to the original height as shown in FIG. After the intermediate stage 504 starts to descend, the reversing mechanism unit 141 rotates 180 ° from below to above about the rotation shaft 103.
As shown in FIG. 10D, the suction nozzle 104 is held with the back surface of the die 3 facing upward by rotating 180 degrees and stopping.
The inversion mechanism unit 141 inverts all the dies 3 placed on the intermediate stage 504 at a time. The inverted dies 3 are sequentially sucked by the suction nozzle of the mounting head 6 of the electronic component mounting apparatus 1 and mounted on the substrate P.

As shown in FIG. 10 (d), after the reversing mechanism 141 rotates 180 °, the die 3 is fixed to the wafer ring 503 (or placed on the intermediate stages 504 and 505). In comparison, the front and back are reversed. By the operation of the reversing mechanism unit 141, the electronic component mounting apparatus 1 can reversely mount the die 3 on the substrate P and can perform flip chip bonding and face down bonding of the die.
The position of the suction nozzle 104 that stops upward is set to be within the movable range of the suction nozzle of the mounting head 6 of the electronic component mounting apparatus 1. For example, the suction nozzle 104 that has been turned upward and stopped may be provided at the same position (X coordinate, Y coordinate, and Z coordinate) as any one of the component outlets in the feeder cart 50. That is, it is not necessary to change the movable range of the suction nozzle of the mounting head 6 of the electronic component mounting apparatus 1.

When all the dies 3 sucked by the four suction nozzles 104 are mounted on the substrate P, the die 3 placed on the other intermediate stage 505 is provided with a reversing mechanism provided immediately above the intermediate stage 505. By the operation of the unit 151 (not shown), the state is reversed to the state shown in FIG. 10D, and the mounting on the board P by the electronic component mounting apparatus 1 is continued. The operations of the intermediate stage 505 and the reversing mechanism 151 are the same as those in FIG.
In FIG. 10, the number of suction nozzles provided in the reversing mechanism unit 141 is two in one set up and down (the suction nozzles 104 and 105), but may be one in one set. However, in order to reduce the fluctuation of the rotation of the rotation unit 102, it is desirable that the rotation unit 103 be symmetrical.
Moreover, although the cross-sectional shape of the rotation part 102 of the reversing mechanism part 141 is a square in the embodiment of FIG. 10, it may be any shape such as a circle.

FIG. 11 is a diagram for explaining an embodiment of (1) pickup operation, (2) reversing operation, and (3) component mounting operation in a state where the wafer cart 450 of the present invention is set in the electronic component mounting apparatus 1. It is a side view. That is, the electronic component mounting apparatus 1 in FIG. 11 can pick up the back surface of the die 3 and can perform flip chip bonding and face down mounting.
In FIG.
(0) As a pre-operation, first, a wafer ring 503 to which a wafer 705 that has been diced in advance is fixed is loaded from the wafer cassette setting unit 501, fixed to the wafer pickup unit 502, and expanded.
The wafer cassette installation unit 501 is provided with, for example, a wafer cassette, and is moved up and down by a magazine upper and lower elevator (not shown), and the wafer ring 503 is taken out from the wafer cassette by an arm mechanism (not shown). The wafer cassette installation unit 501 takes out the wafer ring 503 from the wafer pickup unit 502 and stores it in the wafer cassette.

  (1) In the pick-up operation, the collet 40 adsorbs the die 3 pushed in by the push-up unit 750 from the wafer ring 503 that is carried in from the wafer cassette setting portion 501, fixed to the wafer pick-up portion 502, and expanded. Place on stage 504. The intermediate stage 504 is provided so as to place four dies 3. In this operation, the dies 3 are picked up one by one and placed on the intermediate stage 504.

(2) In the reversing operation, the intermediate stage 504 on which the four dies 3 are placed is raised to a height at which the reversing mechanism 141 has a downward suction nozzle 104 (see FIG. 10A) that can suck the die. .
The suction nozzles 104 are provided in the same number as the maximum number of the dies 3 placed on the intermediate stage 504, and each is provided so as to be positioned at the center of the XY coordinates of the placement position of the dies 3. When the suction nozzle 104 starts vacuum suction and the intermediate stage 504 releases the vacuum suction, the four dies 3 are sucked by the respective suction nozzles 104. After sucking the die 3, the reversing device 141 rotates 180 ° around the rotation shaft 103, and the suction nozzle 104 that sucks the die 3 changes upward (see FIG. 10D).
In the intermediate stage 504, the surface of the die 3 faced upward. However, since the reversal is performed as described above, the back surface of the die 3 faces upward in the suction nozzle 104 (see FIG. 10D) of the reversal mechanism 141. As shown in FIG. 10D, the height of the tip of the suction nozzle 104 facing upward or the height of the back surface of the die 3 is substantially the same as that of the component outlet of the feeder cart 50.

(3) In the component mounting operation, the suction nozzle of the mounting head body 11 mounted on the left / right moving rail 18 of the electronic component mounting apparatus 1 moves to the position of the die 3 to suck one die 3; The substrate P is mounted at a predetermined position. Subsequently, the remaining three dies 3 are mounted, and all the dies 3 at the tip of the suction nozzle 104 are mounted.
The operations (1) to (3) are also executed at different timings in the other intermediate stage 505 and the reversing mechanism 151.

FIG. 12 is a view for explaining an embodiment of (1) pick-up operation, (2 ′) lifting operation, and (3) component mounting operation in a state where the wafer cart 450 of the present invention is set in the electronic component mounting apparatus 1. FIG. When this operation is executed, the die 3 is not changed from the front surface to the back surface. In FIG. 12, since the reversing mechanism 141 or 151 described in FIG. 11 is not required, the reversing mechanism 141 or 151 is moved by a driving mechanism (not shown) or removed when the apparatus is manufactured.
Therefore, after performing the operation (1) described in FIG. 11, (2 ′) the ascending operation is performed, and then (3) the mounting operation is performed.
The (0) pre-operation and the (1) pickup operation are the same as in FIG.
(2 ′) In the raising operation, the intermediate stage 504 on which the four dies 3 are placed is raised to a height at which the suction nozzle of the mounting head body 11 can suck the die.
(3) In the component mounting operation, the suction nozzle of the mounting head body 11 mounted on the left / right moving rail 18 of the electronic component mounting apparatus 1 moves to the position of the die 3 to suck one die 3; The substrate P is mounted at a predetermined position. Subsequently, the remaining three dies 3 are mounted, and all the dies 3 at the tip of the suction nozzle 104 are mounted.
The operations (1), (2 ′), and (3) are also executed at different timings in the other intermediate stage 505 and the reversing mechanism unit 151.

  In the wafer cart 450 of FIG. 11 or FIG. 12, the position of the wafer ring 503 of the wafer pickup unit 502 is provided as low as possible. Thus, the distance in the Z direction between the suction nozzle of the mounting head 6 of the electronic component mounting apparatus main body 1 and the surface that sucks the die 3 can be increased. As a result, intermediate stages 504 and 505 and reversing mechanism portions 141 and 151 can be provided between the wafer ring 503 and the surface on which the suction nozzle of the mounting head 6 sucks the die 3, thereby reducing the installation area. Can do.

FIG. 13 is a timing chart for explaining one embodiment of the die mounting operation in the electronic component mounting apparatus of the present invention.
As illustrated in FIG. 11, when the die 3 is inverted and mounted on the substrate P as described with reference to FIG. 11, the two stages of the system 1 and the system 2 and the reversing mechanism unit are used to efficiently It is for mounting. In FIG. 13, the system 1 uses the intermediate stage 504 and the reversing mechanism unit 141, and the system 2 uses the intermediate stage 505 and the reversing mechanism unit 151.
As described with reference to FIG. 11, after the pre-operation (0) is executed, in the system 1, (1) pickup operation, (2) reversing operation, and (3) mounting operation are successively executed. After the pickup operation is completed in the system 1, the system 2 receives the notification of the completion of the pickup operation, and (1) the pickup operation, (2) the reversing operation, and (3) the mounting operation are successively executed. The (1) pickup operation of the system 1 is also executed by receiving a notification of the completion of the pickup operation after the pickup operation is completed in the system 2.
As described above, when one system performs an operation, another system performs another operation, thereby improving the operation speed and the operation efficiency of the electronic component mounting apparatus.

FIG. 14 is a timing chart for explaining an embodiment of the die mounting operation in the electronic component mounting apparatus of the present invention.
14, as described in FIG. 12, when the die 3 is mounted on the substrate P without being inverted, the die 3 is efficiently mounted using the two intermediate stages of the system 1 and the system 2. Is. In FIG. 14, system 1 uses an intermediate stage 504, and system 2 uses an intermediate stage 505.
As described with reference to FIG. 12, after the pre-operation (0) is executed, in the system 1, (1) the pickup operation, (2 ′) the raising operation, and (3) the mounting operation are successively executed. . After the pickup operation is completed in the system 1, the system 2 receives the notification of the completion of the pickup operation, and (1) the pickup operation, (2 ′) the ascending operation, and (3) the mounting operation are successively executed. . The (1) pickup operation of the system 1 is also executed by receiving a notification of the completion of the pickup operation after the pickup operation is completed in the system 2.
As described above, when one system performs an operation, another system performs another operation, thereby improving the operation speed and the operation efficiency of the electronic component mounting apparatus.

According to the above-described embodiment, it is possible to realize a die pickup cart and an electronic component supply device that can be exchanged with a feeder cart.
In addition, since the die can be reversed directly by the reversing mechanism unit, it is possible to realize a wafer cart and an electronic component mounting apparatus that are relatively small and have a small apparatus area and can be flip-chip bonded or face-down bonded. In addition, since it can be replaced with a conventional feeder cart, not only a normal electronic component mounting, but also a wafer cart and an electronic component mounting device capable of mounting a die and flip chip or a face down mounting chip. realizable.
In the above embodiment, four dies are mounted on each intermediate stage. However, it is not necessary that the number is four, and it goes without saying that any number may be used.
Further, in the above-described embodiment, the electronic component mounting apparatus has been described only with the example of mounting the die. However, the electronic components may be mounted on a timely basis from a tape feeder set in another feeder cut instead of mounting the dies continuously.
In the above-described embodiment, the expansion is executed after the wafer ring is fixed to the wafer pickup portion of the wafer cart. However, a wafer that has been expanded in advance may be supplied before being carried into the wafer cassette installation unit and may not be expanded by the wafer pickup unit.

  DESCRIPTION OF SYMBOLS 1: Electronic component mounting apparatus (body), 3: Die, 4: Electronic component, 5a-5d: Chute, 6: Mounting head, 7: Delivery part, 11: Mounting head body, 13: Component supply area, 16: Up and down Rail for movement, 18: Rail for left and right movement, 19: Parts recognition camera, 40: Collet, 50: Feeder cart, 51: Base part, 51a: Wheel fixing part, 51b: Lock pin, 52: Feeder fixing part, 52a: Feeder base, 52b: positioning hole, 52c: feeder fixing part guide, 52d: feeder signal connector, 52e: feeder guide, 53: handle part, 53a: handle, 53b: side plate, 53c: tip, 54: parts supply reel storage part 60: Supply tape 61: Cover tape 62: Carrier tape 63: Pocket 6 : Sprocket hole (tape feed hole), 70: component supply reel, 80: control device, 141, 151: reversing mechanism, 102: rotating unit, 103: rotating shaft, 104: suction nozzle, 110: electronic component mounting device 111, 121: Z-direction movement range of the intermediate stage 504, 112: Movement direction of the mounting head body, 450: Wafer cart, 401, 402: Arrow, 450: Wafer cart, 501: Wafer cassette installation section , 502: Wafer pick-up part, 503: Wafer ring, 504, 505: Intermediate stage, 520: Wafer pick-up fixing part, 705: Wafer, 715: Expanding ring, 716: Dicing tape, 717: Support ring, 718: Die attach film (Die bonding tape), 50: push-up unit, D, U: lines, LU, LD, RU, RD: Block, P: substrate.

Claims (7)

A wafer pickup unit for fixing the wafer ring and picking up a die from the wafer in the wafer ring and placing the die on an intermediate stage;
An intermediate stage on which the picked-up die is placed;
A reversing mechanism that sucks the die placed on the intermediate stage and holds it with the back side of the die that has been sucked by rotating upward from 180 ° downward,
And a wafer cart that can be exchanged for a feeder cart and set in an electronic component mounting apparatus. A wafer pickup unit for fixing the wafer ring and picking up a die from the wafer in the wafer ring and placing the die on an intermediate stage;
Place the picked-up die, an intermediate stage that rises to the height of the component outlet of the electronic component mounting device;
And a wafer cart that can be exchanged for a feeder cart and set in the electronic component mounting apparatus.   3. The wafer cart according to claim 1, wherein the wafer pickup unit includes an expanding ring for expanding the wafer ring after being fixed. 4.   4. The wafer cart according to claim 1, further comprising a mask supply unit for supplying the wafer ring to the wafer pickup unit.   5. The wafer cart according to claim 1, wherein the intermediate stage can mount a plurality of dies, and the reversing mechanism unit can pick up the plurality of dies simultaneously. A featured wafer cart.   6. The wafer cart according to claim 1, wherein a plurality of the intermediate stage and the reversing mechanism section are provided.   An electronic component mounting apparatus comprising the wafer cart according to claim 1 detachably provided.

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