TWI668172B - Device handler - Google Patents

Abstract

The present invention relates to a component processor, and more particularly to picking up components from a loading component such as a wafer ring loaded with a plurality of components and unloading the components.

The present invention discloses a component processor comprising: a loading component table (200) that receives a loading component (60) from a loading component latch (100) loaded with a plurality of loading components (60) to which a plurality of components (1) are attached. And moving the loading member (60) in the horizontal direction; the unloading portion (300) is separately disposed in the horizontal direction from the loading member table (200), and is provided with an unloading member (70), wherein the unloading member (70) is loaded from The component (60) receives the component (1) and loads the component (1); and the transfer tool module (500) picks up the component ( ₁ ) from the loading component (60) at the pickup position (P1) at each unloading section (300) The unloading position (P ₂ ) unloads the component ( ₁ ) to the unloading unit (70).

Description

Component processor

The present invention relates to a component processor, and more particularly to a transfer tool module and a component processor having the transfer tool module, the transfer module picking up components from a loading component such as a wafer ring loaded with a plurality of components and unloading element.

In general, semiconductor components such as SD memory, flash memory, LSI, and LED (hereinafter referred to as "components") are put on the market after completing the semiconductor process, completing the dicing process, packaging process, and the like.

In addition, with the diversification of terminal structures such as lead frames and BGAs of devices, the types of wafers have also become diverse.

Furthermore, with the development of fine processes such as nanometer processes, semiconductor components are in a tendency to be significantly smaller than the existing components.

In addition, according to the development of smart phones and the ultra-thin trend of smart phones, when applied to smart phones, smart watches, etc., not only the size of components but also the thickness is required to be minimized.

In order to meet the above trends and requirements, such as Korean Patent No. 10-1088205, a semiconductor device is using a WL-CSP (Wafer level chip scale pacake) as described below: a package process is performed at the wafer level. Then, the package process is packaged into individual components by a cutting process instead of performing a packaging process by injection molding or the like using a bonding machine after the cutting process.

On the other hand, in the case of forming a WL-CSP element, in the case of forming a small element, there is a great limitation in forming a ball terminal at the wafer level, and thus there is a problem that it is difficult to perform a component process.

Accordingly, for the components for completing the semiconductor process, a so-called Fan-Out WLP process is proposed, and specifically, after performing the cutting process, injection molding is performed on individual components, and terminals are formed.

On the other hand, in the semiconductor market such as LSI (such as SD memory, mobile phone SD memory, and collection CPU), as competition intensifies, it is very urgent to save component manufacturing costs and ultimately increase productivity.

In addition, the production of semiconductors is performed in a clean room, and the processing speed of the devices performing the various processes in the clean room is directly related to the productivity, so that the components are unloaded at the wafer level without the packaging process or at the previous wafer level. It is also important that the processor increases the processing speed of the device.

In particular, in the production of semiconductors, it is also important to increase the processing speed of the device for component processors that unload components at the wafer level.

However, the structure of the component processor at the wafer level unloading element is as follows: After the wafer ring pickup component of the semiconductor process and the dicing process is completed, it is loaded on a loading member such as a carrier tape, thereby unloading the component from the wafer ring.

Here, the component is picked up from the wafer ring, and the processing speed of the component processor is determined by the processing amount of the component placed on the loading member (such as the carrier tape) (generally, the number of processing per hour (UPH) is calculated).

Specifically, the processing speed of the component processor is determined by the component pick-up efficiency on the wafer ring, such as the position of the camera recognition component and the position of the wafer ring and the pickup, and the efficiency of loading the component to the loading member after picking up.

Further, with respect to the processing speed of the component processor, the processing speed is determined by the pickup accuracy and the pickup speed of the pickup element from the wafer ring to which the plurality of components are attached.

On the other hand, the component processor has a problem that even if the processing speed is fast, if the space occupied by the device is large, there is a reduction in the occupancy efficiency of the device.

In order to solve the above problems, it is an object of the present invention to provide a transfer tool module capable of quickly picking up components from a wafer to significantly increase the processing speed of the apparatus, and an element processor having the transfer tool module.

The present invention has been made in order to achieve the object of the present invention as described above, and an object processor includes a loading component table (200) loaded with a plurality of loading components to which a plurality of components (1) are attached The loading member latching portion (100) of (60) receives the loading member (60) and moves the loading member (60) in the horizontal direction; the unloading portion (300) from which the loading member table (200) is horizontally The directions are spaced apart and are provided with an unloading member (70), wherein the unloading member (70) receives the component (1) from the loading member (60) and loads the component (1); and the transfer tool module (500) in the pickup position (P ₁₎ pickup element (1) from the loading member (60), said unloading means to unload the respective portion (300) of the unloading position (P ₂₎ (70) unloading element (1 ).

The transfer tool module (500) may include: a first rotation driving portion (10) having a first rotation axis (11); a plurality of pickups (20) along a radial direction and the first rotation axis (11) Combining and arranging in the circumferential direction of the first rotating shaft (11) and rotating about the first rotating shaft (11); the second rotating driving portion (30) having the first rotation a second rotation axis (31) perpendicular to the shaft (11), and rotating the first rotation driving portion (10) around the second rotation axis (31) and the second rotation axis (31) The second rotation driving portion (30) is rotated centrally.

The number of the plurality of pickers (20) is preferably 2n (n is a natural number).

The transfer tool (500) may include: a first transfer means (510), a pickup element (1) at the picking position ₍₁ P); and a second transfer means (520), from the first transfer means (510) The receiving element unloads the element (1) at the unloading position (P ₂ ).

a first rotating shaft (11) and a second rotating shaft (31) of the first transfer tool (510) and a first rotating shaft (11) and a second rotating shaft (31) of the second transfer tool (520), respectively Parallel to each other, a virtual center (O) connecting the pickup (20) of the first transfer tool (510) and a virtual center (O) of the pickup (20) of the second transfer tool (520) The line (L) is perpendicular to the first rotation axis (11) and the second rotation axis (31) of the first transfer tool (510), from the pickup (20) of the first transfer tool (510) to the first The pickup (20) of the second transfer tool (520) conveys the conveyance position (P ₃ ) of the component (1) at a rotation center (O) of the pickup (20) of the first transfer tool (510) and the Between the centers of rotation (O) of the pickers (20) of the second transfer tool (520).

The first transfer tool (510) and the second transfer tool (520) are detachably coupled to each other.

The first transfer tool (510) and the second transfer tool (520) are separable from each other and movable, the first transfer tool (510) and the need to flip when the unloading component loads the component said second transfer means (520) in said pickup position (P ₁₎ according to the order pick-up element (1), in the unloading position may be further (P ₂₎ the element (1) is loaded to the unloading member (70).

The present invention may further include an image acquisition device (90) disposed on the side of the second transfer tool (520) and acquiring a back image of the component (1) picked up by the pickup (20).

The present invention may further include an image acquisition device (80) disposed on the side of the first transfer tool (510) and acquiring the back side of the component (1) picked up by the pickup (20) of the first transfer tool (510) image.

The unloading portion (300) is provided with at least two in the vicinity of the loading component table (200), and the transfer tool module (500) may be provided with at least two to respectively correspond to the at least two Unloading section (300).

The at least two unloading portions (300) may include a first unloading portion (300) and a second unloading portion (300) disposed opposite to each other centering on the loading member table (200), the at least two The transfer tool module (500) may include: a first transfer tool module (500), transferring the component (1) between the loading component table (200) and the first unloading portion (300); The second transfer tool module (500) transfers the component (1) between the loading component table (200) and the second unloading section (300).

The at least two unloading portions (300) may include: a first unloading portion (300) disposed in front of the loading member table (200) with respect to the loading member table (200); at least one second The unloading portion (300) is disposed on at least one of a left side and a right side of the loading member table (200) with respect to the loading member table (200); the at least two transfer tool modules (500) Included: a first transfer tool module (500), in the a transfer component (1) between the loading component table (200) and the first unloading portion (300); and a second transfer tool module (500) at the loading component table (200) and the first The component (1) is transferred between the two unloading sections (300).

The loading member (60) comprises a plurality of tape attachment element (1), said transfer tool (500) may comprise: a plurality of pick-up (20), in said pickup position (P ₁₎ according to the order pick-up attachment An element (1) of the loading member (60); a pickup moving portion for sequentially picking up the plurality of pickups (20) to attach the component (1) attached to the loading member (60) At least one of the rotational movement and the linear movement is sequentially moved to the pickup position (P ₁ ); and may include at least one of the first linear movement portion (623) and the second linear movement portion (622), The first linear moving portion (623) linearly moves the transfer tool module (500) along the X-axis direction, and the second linear moving portion (622) linearly moves the transfer tool module along the Y-axis direction. (500).

The transfer tool module (500) may further include at least one image acquisition device that acquires a back image of the component (1) picked up by the pickup (20).

According to the element processor of the present invention, the image acquired by the image acquisition means is stored in a memory constituting a part of the control section, and is moved to the said pickup unit (20) after the pickup element (20) has completed the pickup element (1) When the unloading position (P ₂ ) or the communication position for transmitting the components to other transfer tool modules, the control unit can complete the image analysis.

The transfer tool module and the component processor having the transfer tool module according to the present invention have an advantage in that a plurality of pickups are rotated by a rotation axis parallel to an upper surface of a loading member such as a wafer ring. The transfer tool module is configured to pick up and place a large number of components at a time when performing placement and picking up components, thereby significantly increasing the component unloading speed.

In particular, the transfer tool module and the component processor having the transfer tool module according to the present invention have an advantage in that when a component is picked up from a loading member (such as a blue film or a wafer ring) to which a plurality of components are attached Separately picking up the components separately, wherein the plurality of pickers rotating around the axis of rotation parallel to the upper surface of the loading member (such as the wafer ring) constitute a transfer module, and in the process of picking up and placing the actuators, Picking up and placing a large number of components at one time can significantly increase component unloading speed.

In addition, according to the transfer tool module of the present invention and the component processor having the transfer module, the transfer tool module is composed of a pair, that is, the first transfer tool module and the second transfer tool module. Further, after picking up and flipping the component, the component can be loaded on an unloading member such as a belt and a disk, wherein the plurality of pickups are rotated about a rotation axis parallel to the upper surface of the loading member such as the wafer ring.

Specifically, in the case where the flipping element is required, the component is picked up by the first transfer tool module, and the component picked up by the first transfer tool module is received by the second transfer tool module to be loaded on the unloading component (such as belt and The disc), in turn, can be loaded onto the unloading components (such as the belt and the disc) after picking up and flipping the components.

Here, the first transfer tool module and the second transfer tool module are detachably coupled, and only one of the first transfer tool module and the second transfer tool module is used without component flipping. In the case where the flipping element is required, the first transfer tool module and the second transfer tool module are used in combination with each other, so that the components can be loaded on the unloading members (such as the belt and the disc) after picking up and flipping the components.

In addition, the first transfer tool module and the second transfer tool module are disposed in a separated state, and then, when the flipping component is required, the component is picked up by the first transfer tool module, and the first transfer tool module picks up the component. The components are received by the second transfer tool module and loaded onto the unloading components (such as the belt and the disc), and the components can be loaded onto the unloading components (such as the belt and the disc) after picking up and flipping the components.

At this time, in the case where the flipping element is not required, the first transfer tool module and the second transfer tool module can be independently moved to pick up the components, so that the components can be loaded on the unloading component.

The pin member according to the present invention and the component processor having the pin member have an advantage that the tape to which the component is attached is first raised by the pin body provided with the pin member when the member is picked up by the pickup, The pin-attached member lifts the tape to which the component is attached twice, and when the component is picked up by the pickup, the tape to which the component is attached can be more rapidly raised, and the component pick-up speed can be remarkably improved.

Further, the pin member according to the present invention and the element processor having the pin member have an advantage that a vacuum pressure is formed in the pin member when the member is picked up by the pickup The tape to which the component is attached is attached to the upper surface, and in this state, the component to be picked up can be pressurized only by the pressurization of the pin member, so that the component picking operation can be stably performed.

1‧‧‧ components

2‧‧‧ boards

10‧‧‧First rotary drive

11‧‧‧First rotating shaft

13‧‧‧Rotary support parts

20‧‧‧ Picker

22‧‧‧Multiple holes

24‧‧‧Vacuum pressure generating device

30‧‧‧Second rotary drive

31‧‧‧second rotating shaft

33‧‧‧Support parts

60‧‧‧Loading parts

61‧‧‧With

62‧‧‧Frame parts

70‧‧‧Unloading parts

71‧‧‧ Pocket Department

78‧‧‧Roll parts

79‧‧‧Support parts

80‧‧‧Image acquisition device

90‧‧‧Image acquisition device

100‧‧‧Loading parts truck parts

200‧‧‧Loading parts workbench

300‧‧‧Unloading Department

311‧‧‧ Unwinding roll

312‧‧‧roller

320‧‧‧Rotary drive department

400‧‧‧Unloading Department

500‧‧‧Transfer tool module

510‧‧‧First Transfer Tool

520‧‧‧Second transfer tool

600‧‧‧ pin components

615‧‧‧ Pin parts

622‧‧‧Second linear moving part

623‧‧‧First Linear Moving Department

890‧‧‧Image Acquisition Department

P ₁ ‧‧‧ pick up location

P ₂ ‧‧‧Unloading position

P ₃ ‧‧‧Response location

1 is a plan view showing the concept of a component processor according to the present invention; and FIGS. 2a and 2b are respectively a perspective view and a cross-sectional view showing an example of a loading member used in the component processor of FIG. 1. FIG. FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 1; FIG. 5a is a cross-sectional view of the component processor of FIG. FIG. 5b is a perspective view showing the concept of the transfer tool module of the first embodiment in the component processor of FIG. 1. FIG. 6 is a side view of the transfer tool module of FIG. 7 is a front view of the transfer tool module of FIG. 6; FIG. 8a is a side view of the transfer tool module of the second embodiment as a variation example of the transfer tool module of FIG. 6, and FIG. 8b shows the transfer of FIG. 8a. A partial plan view of the operation process of the tool module; FIG. 9a shows a side view of the transfer tool module of the third embodiment as a variation example of the transfer tool module of FIG. 6, and FIG. 9b shows the transfer tool module of FIG. 9a. Partial plan view of the running process; and Figure 10 shows the figure A plan view of a variation of the component processor of 1.

Hereinafter, a transfer tool module and an element processor according to the present invention will be described below with reference to the accompanying drawings.

1, the processor element in accordance with the present invention comprises at least one tool transfer module, the transfer module tool in the pick-up position P ₁ from the loading member 60 is loaded with a plurality of elements pickup element 1, and uninstall Position P ₂ unloads element 1 from at least one unloading member 70.

Here, the component processor according to the present invention may include a loading component table 200 that receives the loading component 60 from a plurality of loading components 60 loaded with a plurality of components 1 attached thereto, and moves the loading in the horizontal direction. The member 60; and the unloading portion 300 are spaced apart from the loading member table 200 in the horizontal direction, and are provided with an unloading member 70 that receives and loads the component 1 from the loading member 60.

The loading member latching portion 100 has a configuration in which a plurality of loading members 60 to which a plurality of components 1 are attached is mounted, and has various configurations.

Here, there are a plurality of components mounted on the loading member 60, specifically, an element that performs a semiconductor process and a dicing process in a wafer state, and an element that is classified by another component processor by a visual inspection or the like in a wafer state.

In particular, for the element 1, unlike a conventional element which is subjected to a packaging process after a semiconductor process, a so-called wafer level element or the like which does not require a packaging process, and a plurality of elements can be the element 1.

On the other hand, as shown in FIGS. 2a and 2b, the loading member 60 is configured as a member 1 in which a semiconductor process and a cutting process are completed, and includes a tape 61 to which the component 1 is attached and a frame member 62 to which the tape 61 is attached.

Further, as for the belt 61, any member can be used as long as it is a member to which the component 1 can be attached, and a so-called adhesive tape can be used.

The frame member 62 has a structure as a structure for fixing the belt 61 to which the element 1 is attached, and may have various structures, specifically, a circular ring as shown in Figs. 2a and 2b, a square ring as shown in Fig. 3, and the like.

On the other hand, as for the unloading member 70, as long as it is a structure for loading components, any structure can be used, and various components temporarily loaded for placing on the market or performing other processes can be used, specifically, the belt shown in FIG. And a disk (a carrier tape and a cover tape), a plate member 2 having a bonding tape as shown in FIG. 3, a tray in which a plurality of insertion grooves of the loading member 1 are formed, and the like.

In addition, the unloading member 70, in addition to the components of the temporary loading component 1, may use components for a wafer mounting process, a packaging process, specifically a substrate such as a PCB on which the component 1 is mounted, a strip, for manufacturing. Lead frame of the wafer, etc.

The loading member lock portion 100 has a configuration for loading the plurality of loading members 60, and may have any configuration as long as it can stack the loading members 60 up and down.

The loading member table 200 may have various structures and has a structure in which the loading member 60 is received from the loading member latch portion 100 and the loading member 60 is moved in the horizontal direction.

As an example, the loading component table 200 may have various structures, specifically an XY table, an XY-θ table, etc., and the loading component table 200 is structured as follows: through a wafer ring loading portion (not shown) The loading member 60 is received from the loading member latch portion 100, and the loading member 60 is moved in the horizontal direction to cause the transfer tool module 500 to pick up the component 1.

In addition, the loading member table 200 can also move in the upward direction, that is, the Z-axis direction.

Further, as shown in FIG. 6 to FIG. 9a, preferably the lower side of the table needle pin element 200 in the loading member 600, and thus the pick-up position P ₁ smoothly pickup element.

The pin member 600 may have various structures and has a structure in which the bottom surface of the loading member 60 (for example, the belt 61 of the wafer ring) is pressed toward the pickup at the pickup position P _{1 when the} pickup unit 20 picks up the member 1 The 20 side pushes up the belt 61 to which the component 1 is attached.

As an example, the pin member 600 may have any structure as long as it includes the pin member 615 and the upper and lower driving portions, wherein the pin member 615 moves up and down on the lower side of the loading member 60, and the upper and lower driving portions are vertically moved. The pin member 615 is moved.

On the other hand, preferred image acquisition unit 890 is disposed in the pick-up position P ₁ at the upper side of the pickup 20 is mounted on the image acquisition element 60 of the loading member 1.

The image acquisition unit 890 has a configuration in which an image of the element 1 mounted on the loading unit 60 is acquired, and may have various configurations, specifically, a scanner, a camera, and the like.

In addition, the image acquisition section 890 can be flexibly applied to grasp the position at which the component 1 is picked up by the pickup 20, the upper surface of the inspection element 1, and the like.

In particular, the transfer tool module 500 described later has a plurality of pickers 20, and preferably a plurality of pickers 20 all pick up the component 1 and acquire images of the plurality of components 1.

Accordingly, the image acquisition unit 890 is preferably close to the loading member 60, and can be disposed horizontally or vertically in the upper portion of the loading unit table 200 in order to prevent interference with the transfer tool module 500. Image acquisition unit 890.

On the other hand, the loading member loading portion (not shown) is for conveying the loading member 60 from the loading member locking portion 100 to the loading member table 200, and The configuration in which the loading member 60 is taken out from the loading member lock portion 100 and the loaded loading member 60 is transmitted to the loading portion table 200 may have any configuration.

As an example, the loading component loading portion may have various structures, specifically, a linear driving device by a clamping device, or a linear driving device for a linearly moving thruster, or the like.

The unloading portion 300 may have various structures and has a structure in which it is spaced apart from the loading member table 200 in the horizontal direction, and an unloading member 70 that receives and loads the component 1 from the loading member 60 is provided.

In particular, in the unloading unit 300, the structure of the unloading unit 300 is determined in accordance with the configuration of the unloading member 70 such as a belt and a disk (carrier tape and cover tape).

As an example, as shown in FIGS. 1 and 4, the unloading portion 300 may include an unwinding roll portion 311 that forms a pocket portion 71 on which the component 1 is loaded along the length direction and a belt after loading the component (not shown) The sealed carrier tape constitutes the unloading member 70, rotatably disposed at one end to wrap the carrier tape of the component 1 to be loaded; the winding roller 312 is rotatably disposed at the other end, and is wound by the tape after the loading component The carrier tape and the carrier tape guide (not shown) guide the movement of the carrier tape so that the carrier tape unwound from the unwinding roller portion 311 passes the loading position.

Here, as shown in FIG. 4, the unloading portion 70 may form a plurality of holes 22 in the bottom surface of the pocket portion 71 on which the component 1 is mounted.

Further, when the unloading member 70 is at the loading position, the vacuum pressure generating device 24 that forms the vacuum pressure is disposed directly below the unloading member 70, and the component 1 can be stably loaded when the transfer tool module 500 is mounted.

Here, as shown in FIG. 4, when the unloading member 70 is a carrier tape, it can be guided by the guidance of the pair of roller members 78 provided to guide the wing portions of the carrier tape and the support members 79 of the fixed roller members. The movement of the carrier tape.

As another example of the unloading portion 300, as a case of the plate member 2 (refer to FIG. 3) to which the unloading member 70 is attached, the unloading portion 300 may include a plate loading portion at one end and loaded with a plurality of components 1 attached thereto The plate 2; the XY table moves and supports the plate 2 at the loading position, and further receives the component 1 through the transfer tool module 500; and the tray moving portion (not shown), and transmits the plate from the tray loading portion to the XY table Item 2. Reference numeral 400 in FIGS. 1 and 10 is illustrated when the unloading member 70 of the unloading portion 300 is the panel 2.

Here, as shown in FIG. 3, the panel member 2 has a structure similar to that of the loading member 60, and includes: a belt to which the component 1 is attached; and a frame member to which the fixing tape is marked with a LOT number, a classification level, and the like. Alternatively, as the tray forming the plurality of insertion grooves of the loading member 1, a normalized tray may be used depending on the type of the element 1; that is, a JEDEC tray.

On the other hand, as shown in FIG. 1, the unloading portion 300 is constituted only by a structure in which the first structure 311, 312 for loading the component 1 on the carrier tape and the second structure for loading the component 1 in the panel member 2 or the like. Or include two or all of the structures in the first structure and the second structure.

In addition, the unloading portion 300 may of course be provided with at least two identical structures, specifically a first structure 311, 312 for loading the component 1 on the carrier tape, a second structure for loading the component 1 on the panel 2, and the like.

For example, the unloading portion 300 may be provided with at least two first structures 311, 312 for loading the component 1 on the carrier tape, as shown in FIG. 1, for example, four first structures may be arranged in parallel.

On the other hand, in order to quickly unload the components from the loading member 60, the unloading portion 300 is preferably provided with at least two attachments on the loading member table 200.

That is, as shown in FIGS. 1 and 10, the component processor according to the present invention may include at least two unloading portions 300 respectively disposed in the horizontal direction from the loading member table 200, respectively, and receiving and loading components from the loading member 60. 1.

At this time, the transfer tool module 500 respectively corresponding to the at least two unloading section 300, and at least two unloading unit 300, i.e., at least two, and further the pickup position P ₁ pickup element 1 from the loading member 60, and The element 1 is unloaded to the unloading member 70 at the unloading position P _{2 of} each unloading portion 300.

On the other hand, the at least two unloading sections 300 may have various configurations depending on the configuration.

As an example, as shown in FIG. 1, the at least two unloading portions 300 may include a first unloading portion 300 and a second unloading portion 300 that are disposed opposite each other with the loading member table 200 as a center.

At this time, the at least two transfer tool modules 500 may include: a first transfer tool module 500 that transfers the component 1 between the loading component table 200 and the first unloading portion 300; and the loading component table 200 and The second transfer tool module 500 of the component 1 is transferred between the second unloading portions 300.

As another example, as shown in FIG. 10, the at least two unloading portions 300 may include: a first unloading portion 300 disposed in front of the loading member table 200 with reference to the loading member table 200; and a loading member The table 200 is provided with one or more second unloading portions 300 provided on at least one of the left side and the right side of the loading unit table 200 as a reference.

At this time, the at least two transfer tool modules 500 may include: a first transfer tool module 500 that transfers the component 1 between the loading component table 200 and the first unloading loading portion 300; and the loading component table 200 The second transfer tool module 500 of the component 1 is transferred between the second unloading unit 300.

The transfer configuration tool module 500 determines the processing speed of the device in accordance with and has the following structure: P ₁ position of the pickup at the pickup element 1 from a loading member 60 carrying a plurality of elements 1 and P ₂ in the unloading position to unload the unloading means 70 Element 1.

According to this, as shown in FIG. 5a to FIG. 8b, the transfer tool module 500 according to the first embodiment of the present invention may include: a first rotary driving portion 10 having a first rotating shaft 11; and a first rotating axis along a radial direction 11 a plurality of pickups 20 combined and rotating in the circumferential direction of the first rotating shaft 11 and rotating around the first rotating shaft 11; having a second rotating shaft 31 perpendicular to the first rotating shaft 11, and rotating in the second The shaft 31 is a second rotation driving unit 30 that rotates the first rotation driving unit 10 around the second rotation shaft 31.

The first rotation driving portion 10 has a structure including a first rotating shaft 11 that couples the plurality of pickups 20, and may be constituted by a rotary motor.

Here, the first rotating shaft 11 is configured to rotate the plurality of pickups 20 by rotation, and is preferably parallel to the upper surface of the loading member 60 or the upper surface of the unloading member 70, that is, perpendicular to the Z-axis.

In particular, the first rotating shaft 11 may be perpendicular to the Z axis, that is, parallel to the X axis or the Y axis, and more preferably arranged in parallel with the X axis.

Then, the rotation direction of the first rotating shaft 11 may be unidirectional or bidirectional rotation or the like, and rotation in various directions may be performed according to control of the rotation direction of the pickup 20.

The plurality of pickers 20 may have various structures and have a structure in which it is combined with the first rotating shaft 11 in the radial direction, and is disposed in the circumferential direction of the first rotating shaft 11 and rotates around the first rotating shaft 11 .

The pickup 20 can pick up the component 1 from the loading member 60 by vacuum pressing.

As an example, the pickup 20 may include: an air pressure connection portion that receives air pressure from the outside; and a pickup head that is disposed at the end and that is conveyed by the air pressure connection portion to pick up or release the pickup element 1.

In addition, the plurality of pickers 20 may include a rotation support member 13 when connected to the first rotating shaft 11.

The rotation support member 13 has a structure in which a plurality of pickups 20 are combined to support the plurality of pickups 20, and may have various structures.

As an example, the rotation support member 13 may have a structure similar to that of the rotation driving portion 320 (Korean Patent No. 10-1338182).

On the other hand, the number of the plurality of pickups 20 is different depending on the number of sets of the unloading members 70, and may be composed of 2n (n is a natural number) as an example.

Further, it is necessary for the plurality of pickups 20 to linearly move to the upper surface of the loading member 60 or the upper surface of the unloading member 70, so that the work can be easily performed when the component 1 is picked up and placed.

According to this, the plurality of pickups 20 can linearly move in the radial direction with respect to the first rotating shaft 11, and can be linearly moved in the radial direction by the radial direction moving portion (not shown).

The linear driving portion has a structure that linearly moves at least a part of the pickup 20 in the radial direction of the first rotating shaft 11, and may have various structures, specifically, by contacting the electric or pneumatic brake with the pickup 20 in a radial direction. A can member or the like that selectively pressurizes and linearly moves at least a part of the pickup 20.

Further, the plurality of pickups 20 are arranged at equal angles of 180°, 90°, 60° or the like centering on the first rotating shaft 11 .

On the other hand, the plurality of pickups 20 are rotated about the first rotating shaft 11, and in order to smoothly transmit the vacuum pressure to the pickup 20, and can be externally received by the air pressure rotary joint capable of transmitting the air pressure. Air pressure.

The second rotation driving portion 30 may have various structures and has a structure having a second rotation shaft 31 perpendicular to the first rotation shaft 11 and rotating the first rotation driving portion 10 around the second rotation shaft 31. .

The second rotation driving portion 30 has a configuration in which the second rotation shaft 31 has the second rotation shaft 11 and is rotated, and can be constituted by a rotary motor.

Further, the second rotation driving unit 30 moves the second rotation driving unit 30 in at least one of the X-axis movement and the Y-axis movement by a linear movement unit to be described later.

The second rotating shaft 31 has various structures and has a structure of supporting the first rotation driving portion 10 and further rotating the first rotation driving portion 10 by rotation.

Here, the second rotating shaft 31 can support the first rotational driving portion 10 in various shapes, and in combination with the supporting member 33 that supports the first rotational driving portion 10, and can further support the first rotational driving portion 10.

On the other hand, in order to smoothly correct the error of the θ direction of the element 1 picked up by the pickup 20, that is, the error of the rotation angle of the Z axis as the rotation axis, the second rotation axis 31 preferably passes through the plurality of pickups 20 The center of rotation O.

On the other hand, the transfer tool module 500 may further include image acquisition devices 80, 90 that acquire the back image of the component 1 picked up by the pickup 20.

As shown in FIG. 5a and FIG. 6, the image acquisition devices 80, 90 are configured as a back image of the acquisition element 1 to calculate the horizontal error of the component 1 picked up by the pickup 20, and may have a scanner, a camera, and the like. structure.

Here, the image acquisition devices 80, 90 can also be flexibly applied to the back image of the analysis element 1 to perform a visual inspection of the back side of the component 1.

The arrangement position of the image capturing devices 80, 90 is preferably a pickup, in view of stopping the rotation of the pickup 20 when picking up the component and interfering with other components in the case of transferring the tool module in combination as described below. when the rotational direction of the pickup element 20 as a reference element or load, compared to a pickup position P located on the _{pickup. 1} or the unloading position P 20 of the pickup ₂ is further provided to the rear side 20 opposite positions.

Specifically, when the load pickup element or elements, the pick-up position P ₁ located at the unloading position P or the pickup 20 is referred to as No. ₂ 1, provided the case where four pickup 20 after the pick position, is located 2 Preferably, the pickers No. 3 and No. 4 are located at No. 2 or No. 4 (in the case of the picker No. 3, it is preferable not to increase the height of the second rotary drive unit 30), and more preferably in the No. 4 picker.

As shown later, the transfer tool according to the first embodiment of the module 500 having the structure described above, the pickup position 60 on the loading member, such as a wafer ring P ₁ of the pickup device 11, to move from the loading The unloading member 70, which is provided at intervals 60 of the member, loads the component 1 at the unloading position P ₂ .

Accordingly, the transfer tool module 500 linearly moves in the X-axis direction and the Y-axis direction with reference to the arrangement direction of the loading position P ₁ and the unloading position P ₂ , for example, in the Y-axis direction.

In addition, the transfer tool module 500 may be provided in plurality, specifically, in a pair, or the like.

To this end, the component processor may include: a first linear moving portion 623 that supports and linearly moves the transfer tool module 500 in the X-axis direction for linear driving of the transfer tool module 500; and supports and linearizes in the Y-axis direction The second linear moving portion 622 of the first linear moving portion 623 is moved.

The first linear moving portion 623 may have various structures and has a structure for supporting and linearly moving the transfer tool module 500 in the X-axis direction in order to transfer the linear driving of the tool module 500.

The second linear moving portion 622 has a structure that supports and linearly moves the first linear moving portion 623 in the Y-axis direction, and may have various structures, and specifically may have a guide rail or the like.

The first linear moving portion 623 and the second linear moving portion 622 can of course also constitute an X-Y robot.

On the other hand, the transfer tool module 500 is preferably in the pick-up position P ₁ all pickup pickup element 20 1.

Then, when the transfer tool module 500 is located at the unloading position P _{2 in} order to smoothly load the component at the unloading position P ₂ , it is preferable that the first rotating shaft 11 as the rotating shaft of the pickup 20 is perpendicular to the moving direction of the unloading member 70 . .

Further, with respect to the transfer tool module 500, in the case of the configuration of a plurality of unloading members 70 in parallel, in order to smooth the unloading position P ₂ located at the unloading position of the load elements P _2, the rotation axis of the pickup 20 as a first The rotating shaft 11 can be parallel to the moving direction of the unloading member 70.

On the other hand, when the unloading member 70 is loaded after the pickup member 1, there is a case where the component 1 is loaded upside down, that is, there is a case where it is necessary to reverse the loading.

Accordingly, the transfer tool module has the basic structure of the transfer tool module (that is, the structure of FIGS. 5a to 7) according to the first embodiment, and various changes can be made, specifically, a plurality of the basic structures. Here, at least a part of the structures of FIGS. 5a to 7 can be changed when the transfer tool modules according to the first embodiment are combined.

For example, as shown in FIGS. 8a and 8b, the transfer tool module 500 according to the second embodiment of the present invention may include a first transfer tool 510 having the structure illustrated in FIGS. 5a through 7, and having FIGS. 5a through 7 A second transfer tool 520 in the illustrated structure.

That is, as shown in FIG. 8a and 8b, a second embodiment according to the present embodiment of the invention the transfer tool module 500 may include: a first transfer tool 510, as the transfer tool module according to the first embodiment, the pick-up position P ₁ a pickup element; a second transfer means 520, a transfer tool according to the first embodiment of the module, transfer from the first receiving element 510 and a tool element ₂ unloaded at the unloading position 1 P.

At this time, the first rotating shaft 11 and the second rotating shaft 31 of the first transfer tool 510 are disposed in parallel with the first rotating shaft 11 and the second rotating shaft 31 of the first transfer tool 510, respectively.

Further, the rotation center O of the pickup 20 connected to the first transfer tool 510 and the virtual line L of the rotation center O of the pickup 20 of the second transfer tool 520 and the first rotation axis 11 of the first transfer tool 510 and the The two rotating shafts 31 are vertical.

Further, from the first transfer means convey the pickup 510 to convey the position of the element 20 1 P _3, pickup means located at the first transfer 510 the rotational center O 20 and the second transfer means to the second pick-up 520 20 The center of rotation O of the picker 20 of the transfer tool 520.

Then, the first transfer tool 510 and the second transfer tool 520 form a module as mutually fixed states.

Here, for the first transfer tool 510 and the second transfer tool 520, one of the first transfer tool 510 and the second transfer tool 520 is separated as a transfer tool module without using the flipping element. In the case where an inverting element is required, the first transfer tool 510 and the second transfer tool 520 are used in combination as a transfer tool module.

In addition, at least one of the first transfer tool 510 and the second transfer tool 20 further includes an image acquisition device 90 that acquires a back image of the component 1 picked up by the pickup 20. The position error of the element 1 to be unloaded at the unloading position P _{2 can} be calculated from the image acquired by the image acquisition device 90.

As described above, the position error of the element 1 to be unloaded at the unloading position P _{2 can} be calculated in consideration of the image acquired by the image acquiring device 90, which is preferably disposed on the side of the second transfer tool 520.

At this time, the image acquisition device 80 separate from the image acquisition device 90 may be additionally provided on the side of the first transfer tool 510, and the image acquisition device 80 that is separately provided may be flexibly applied to the acquisition as compared with the calculation of the position error. The back side image of the element 1 picked up by the pickup 20 of the first transfer tool 510 is visually inspected by analyzing the image.

Further, the first transfer tool 510 located at the transfer position P ₃ and the pickup 20 of the second transfer tool 520 can be disposed at an appropriate interval by an experiment or the like so that the element 1 can be smoothly conveyed without being damaged or falling off.

In order to transfer the pickup tool 520 is conveyed smoothly to the second member 20, the communicating position P ₃ of the first transfer tool 510 of the pickup 20 is linearly transferred to the second tool 20 moves the pickup 520 is preferably in the .

That is, in the communicating position P ₃ of the first transfer tool 510 of the pickup 20 is moved to the second 20 side linear transporting pickup tool 520, and then to perform a second transfer means 520 pickup element 20 is smoothly conveyed.

On the other hand, as shown in FIG. 8a to 9b, for the first conveying direction of the binding tool 510 and the second transfer means 520, preferably connected to the pickup position at the unloading position P ₁ and P ₂ of a straight line (i.e., The first transfer tool 510 and the second transfer tool 520 are arranged in order in the Y-axis direction.

As shown in FIG. 8b and FIG. 9, when the first transfer tool 510 and the second transfer tool 520 are arranged in this order in the Y-axis direction, the moving distance is minimized to increase the communication speed of the component 1, and the device can be improved. processing speed, wherein a moving distance in a first pick-up position P ₁ is moved by feeding means from a second receiving element 520 is transferred to the tool elements after unloading position P ₂ pickup element 510.

At least one of the transfer tool modules 500 according to the second embodiment having the structure as described above may be provided, and a pair may be provided as shown in FIG.

At this time, according to the transfer tool module of the second embodiment, as in the first embodiment, the arrangement direction of the loading position P ₁ and the unloading position P ₂ is taken as a reference, for example, in the Y-axis direction, and further along the X. The axis direction and the Y axis direction move linearly.

On the other hand, another method of inverting the loading member 1 when loaded on the unloading member 70 after the pickup member 1, that is, a method for flip loading, is detachably set in the structure of the transfer tool module according to the second embodiment. The first transfer tool 510 and the second transfer tool 520.

That is, as shown in FIG. 9a and FIG. 9b, the transfer tool module according to the third embodiment of the present invention may include: a first transfer tool 510 as a transfer tool module of the first embodiment different from the second embodiment, in the pick-up position P ₁ pickup element 1, and the pickup is moved between the _second position and the convey position P ₁ P; a second transfer means 520, a transfer tool according to the first embodiment of the module, in communicating from the first position P ₃ tool module 510 receives the transfer element 1 and P ₂ at the unloading position unloading element 1, and moves between a communicating position and the unloading position P ₃ P _2.

At this time, the first rotating shaft 11 and the second rotating shaft 31 of the first transfer tool 510 are disposed in parallel with the first rotating shaft 11 and the second rotating shaft 31 of the second transfer tool 520, respectively.

In addition, the first transfer tool 510 transmits the component to the second transfer tool 520, and when the second transfer tool 520 is approached, the rotation center O of the pickup 20 connected to the first transfer tool 510 and the second transfer tool 520 are picked up. The virtual line L of the rotation center O of the device 20 is perpendicular to the first rotation axis 11 and the second rotation axis 31 of the first transfer tool 510.

On the other hand, the communicating position P ₃ from the rotation center position of the first transfer means 20 to convey the pickup 510 to the second transfer means 20, pickup element 1 520, located between the first transfer means 20 of the pickup 510 O is between the rotation center O of the pickup 20 of the second transfer tool 520.

In particular, the communication position P ₃ is located between the loading position P ₁ and the unloading position P ₂ .

In addition, as shown in FIG. 9b, the first transfer tool 510 is configured to transmit the component to the second transfer tool 520. When approaching the second transfer tool 520, the first transfer tool 510 and the second transfer tool 520 are in FIG. 9a. State of the show.

Here, as described in the second embodiment, in the conveyed position P ₃ , the pickup 20 of the first transfer tool 510 preferably transmits the component to the pickup 20 of the second transfer tool 520, preferably The pickup 20 of the transfer tool 510 linearly moves toward the pickup 20 of the second transfer tool 520.

That is, in the communicating position P ₃ in the first transfer means 20 of the second pickup 510 feeding the pickup tool 520 is moved linearly to 20 side, and thus can be smoothly carried out 20 of the second transfer means to convey the pickup element 520.

On the other hand, in synthesizing the above-described embodiments, the present invention discloses the following structure.

According to the background of the present invention, when the component 1 is picked up from the loading member 60 (such as a wafer ring), since the structure of the pin member is limited, it is recognized from the beginning that a problem of separately picking up the respective components 1 is required. Loading element 60 includes a strip that is attached to a plurality of elements 1.

Because of the limitations of the number of pickups of such an element 1, the speed at which components are unloaded from the loading member 60, such as a wafer ring, to the unloading member 70, such as a belt and disk (T&R), is limited. Then, in order to limit the unloading speed of the element, the production speed of the semiconductor element or the like is lowered, thereby further limiting the yield.

Accordingly, the transfer tool according to the characteristic of the module of the present invention is that the pick-up position P ₁ at least two pickup elements 1 from the loading member 60, preferably a plurality of pickup elements 1, after the movement to the unloading position P ₂ located in the unloading The unloading member 70 of position P ₂ unloads the element 1 , wherein the loading member 60 includes a belt to which the plurality of elements 1 are attached. Here, for the pickup position P ₁ , in the case where the component 1 to the unloading member 70 are sequentially unloaded from the loading member 60 in sequence by the two transfer tool modules, the pickup position can be replaced by the transfer position of the other transfer tool module. Position P ₁ .

The transfer tool comprises a module wherein a plurality of pickup 20, a pickup element according to the order, and further the pickup position P ₁ in particular pickup element portion 600 Pins provided at least two elements 1.

For the transfer tool module as described above, as a specific embodiment, the transfer tool module shown in FIGS. 5a to 6 may be used.

Further, as described above, in another example of the transfer tool module including the plurality of pickups 20, as long as the plurality of pickups 20 are provided in one support structure and the respective pickups 20 can sequentially pick up the components 1 in order Structure, can have any structure.

On the other hand, as described above, the transfer tool comprising a plurality of pickup module 20, at ₁ 20 located at the respective pickup pickup position P, the order can be provided with a pin portion of the needle member 600 is effective pickup element 1, the preferred The pickup 20 is provided to move linearly to the pin member 600.

Further, as described above, the transfer tool module including the plurality of pickups 20 preferably moves the plurality of pickups 20 as one module to the unloading position P ₂ or the conveying position after the pickup member 1.

On the other hand, as described above, the transfer tool module including the plurality of pickups 20 may further include an image acquisition device that calculates the horizontal error of the components picked up by the respective pickups 20 after picking up the component 1, And the back image of the component 1 picked up by the pickup 20 is acquired for surface visual inspection of the component or the like.

The image acquisition device 90 may have various structures according to functions, and has a structure of calculating a horizontal error of an element picked up by each of the pickups 20 after picking up the component 1, picking up a surface visual inspection of the component, etc., and picking up by the pickup 20. The back image of component 1.

As an example, the element 1 picked up by each of the pickups 20 may have a horizontal error of the element 1 picked up by the pickup 20 during the pickup, and may not be properly mounted on the unloading member 70 if the horizontal error tolerance is exceeded. There may be problems with poor installation.

Here, the horizontal error refers to an error in the X-Y direction of the element 1 picked up by the pickup 20 during the pickup, a rotation error in the reference X-Y direction, that is, a θ error, and the like.

Accordingly, it is necessary to confirm the horizontal error of the component 1 of the pickup 20 during the pickup process, particularly whether there is a rotation error, and thereby correct the error to mount the component 1 when mounted to the unloading member 70.

Therefore, the image obtaining means can acquire the back side of the element 1 picked up by the pickup 20 in order to calculate the horizontal error of the element 1 picked up by the respective pickups 20 after the pickup element 1 (here, the back side refers to An image of the opposite side of one side of the component 1 picked up by the pickup 20.

In addition, in order to perform visual inspection separately on the back surface of the element 1 while calculating the horizontal error, that is, presence or absence of a 2D inspection or the like of a crack, a pad formation state, or the like, the image pickup device can acquire the back surface of the component 1 picked up by the pickup 20. image.

On the other hand, the image acquisition device may be provided separately from the transfer tool module or, in order to effectively perform visual inspection, preferably form the same module as the transfer tool module.

In particular, the image acquisition device and the transfer tool module form a module with the following advantages: First, as described above, the transfer tool module according to the present invention is characterized by including a plurality of pickers 20, at least two pickup elements 1, ₁ at the pickup position P is provided with a particular portion of the needle pin element 600 pickup element 1.

However, picking up the image of the element 1 and the acquisition element 1, especially in the case of acquiring an image in parallel and analyzing the image, there is a problem that the speed at which the image of the element 1 is acquired can reduce the pickup speed of the element 1.

According to the present invention, the transfer tool module according to the present invention is acquired by the image acquisition device when the respective pickups 20 move to the unloading position P ₂ after completing the pickup element 1 or to convey the communication position of the components to the other transfer modules. The back image of the component 1 picked up by each of the pickups 20 further performs image analysis.

Here, for acquiring an image by the image acquiring device, according to the specification of the image to be acquired (ie, resolution, depth of field, etc.), the image capturing speed does not affect the picking speed of the component 1, but according to the present invention The transfer tool module can pick up the components separately in parallel with the plurality of pickers 20 and acquire the back image of the component 1 after picking up.

Here, with regard to the image acquired by the image acquisition device, it is considered that the image analysis speed is slow, and it is stored in a memory or the like constituting a part of the control unit, and is moved to the unloading after the respective pickups 20 complete the pickup element 1. The control unit performs image analysis when the position P _{2 is} used to convey the communication position of the component to the other transfer tool module.

That is, the transfer tool module and the component processor having the transfer tool module according to the present invention can include an image acquisition device as a module.

Then, the transfer tool according to the present invention, elements having a processor module and transferring the tool module, pick-up position P ₁ in the pickup element, acquisition means to an image pickup element side mobile moving at least one of rotational movement and the linear movement by a The pickup 20 picks up an image of the picked up component 1. Here, for the image acquisition process, it is of course also possible to perform the image acquisition speed when moving to the unloading position P ₂ after the pickup element or for transferring the communication position of the component to the other transfer tool module.

Then, according to the transfer tool module of the present invention and the component processor having the transfer tool module, after the back image of the component 1 is acquired after the parallel component pickup and pickup, the memory constituting a part of the control section is stored and moved to When the unloading position P ₂ or the conveying position of the component is transmitted to the other transfer tool module, the control section is caused to perform image analysis.

In particular, the visual inspection requires a sufficient image processing speed compared to the calculation of the horizontal error. After the components are respectively picked up by the plurality of pickups 20 in parallel and the back image of the component 1 is acquired after the pickup, the image is stored in a part of the control section. The memory or the like causes the control section to complete the image analysis when the respective pickups 20 move to the unloading position P ₂ after the pickup of the component 1 or to convey the communication position of the components to the other transfer tool modules.

As described above, if the parallel component picks up and acquires an image, performs image analysis when the finished component 1 is moved to the unloading position P ₂ after picking up, or when the transfer position for transmitting the component to the other transfer tool module is transmitted, there is no need to set another The visual inspection device or module is used to unload components and perform the advantages of visual inspection.

Further, the present invention has an advantage of significantly improving the unloading speed of the component by performing image analysis when the parallel component picks up and acquires the image and moves after the completion of the pickup of the component 1.

As described above, the transfer tool module for image pickup and the image analysis for the parallel component pick-up and acquisition of the image after the completion of the pickup of the component 1 can employ the structure of the transfer tool module illustrated in FIG. 5a.

At this time, the transfer tool module preferably sets the image pickup devices 80, 90 on the direction side of the rotation after the respective pickups 20 are picked up.

Specifically, in FIGS. 5a and 6b, when each of the pickups 20 picks up the component 1 and rotates in the clockwise direction, it is preferable that the image pickup devices 80, 90 are positioned on the left side with respect to the rotation axis O of the pickup 20.

On the other hand, the image acquisition devices 80, 90 preferably set at least two according to the purpose of acquiring an image (calculation level error, visual inspection).

Here, since the calculation of the horizontal error is performed relatively quickly, it is preferable to use the rotation axis O of the pickup 20 and the rotation direction of the rotation axis O as a reference, compared to image acquisition for visual inspection. The image acquisition device 90 for calculating the horizontal error by the device 80 is further disposed on the rear side.

That is, the pickup 20 for the pickup element 1 is preferably provided with the image acquisition device 90, first by rotating through the image acquisition device 80 for visual inspection, and then passing through the image acquisition device for calculating the horizontal error. 90.

On the other hand, as described above, at least one of the image capturing devices 80, 90, particularly the image capturing device 80 for visual inspection, preferably moves with the transfer tool module.

On the other hand, the image acquisition devices 80 and 90 have a structure in which the back image of the component 1 is acquired, and may have various configurations, specifically, a scanner, a camera, and the like.

The above description is only a part of a preferred embodiment that can be implemented by the present invention. Therefore, it is known that the scope of the present invention is not limited by the above embodiments, and the technical idea and the fundamental technical idea of the present invention described above should all be included in the present invention. The scope.

Claims (12)

A component processor comprising: a loading component table (200) that receives the loading component (60) from a loading component latching portion (100) loaded with a plurality of loading components (60) to which a plurality of components (1) are attached And moving the loading member (60) in a horizontal direction; at least two unloading portions (300) are respectively disposed apart from the loading member table (200) in a horizontal direction, and are provided with an unloading member (70), wherein the unloading means (70) receiving said element (1) from the loading member (60) and said loading element (1); and at least two transfer tool module (500), at the picking position (P ₁₎ Picking up the elements (1) from the loading member (60) corresponding to the at least two unloading portions (300), respectively, the unloading position (P ₂ ) of the unloading portion (300) toward the unloading member ( 70) unloading the elements (1); pins element disposed (600) on the lower side of the loading table member (200), said needle pin element (600) with the pick-up position (P ₁₎ relative to configuration corresponds; wherein said at least two unloading portion (300) comprises: a first unloading portion (300) and a second unloading portion (300), at said pickup position (P ₁₎ to each other centering surface Opposite or at right angles; the at least two transfer tool modules (500) include: a first transfer tool module (500), the loading component table (200), and the first unloading portion (300) The transfer member (1); and the second transfer tool module (500) transfer the component (1) between the loading member table (200) and the second unloading portion (300). The component processor according to claim 1, wherein the transfer tool module (500) comprises: a first rotary drive portion (10) having a first rotation axis (11); and a plurality of pickups ( 20) is coupled to the first rotating shaft (11) in a radial direction, and is disposed along a circumferential direction of the first rotating shaft (11) and rotated about the first rotating shaft (11); a second rotation driving portion (30) having a second rotation perpendicular to the first rotation axis (11) a shaft (31) that rotates the first rotation driving portion (10) around the second rotation shaft (31) and rotates the second rotation driving portion around the second rotation shaft (31) ( 30). The component processor according to claim 2, wherein the number of the plurality of pickers (20) is set to 2n, and n is a natural number. The component processor of claim 1, wherein the transfer tool module (500) comprises: a first transfer tool (510) that picks up the component at the pickup position (P ₁ ) ); and a second transfer means (520), from the first transfer means (510) receiving element, unloading the element (1) in the unloading position (P _2). The component processor according to claim 4, wherein the first rotating shaft (11) and the second rotating shaft (31) of the first transfer tool (510) are respectively associated with the second transfer tool ( a first rotating shaft (11) and a second rotating shaft (31) of 520) are disposed in parallel with each other, and connect a rotation center O of the pickup (20) of the first transfer tool (510) with the second transfer tool ( a virtual line L of a rotation center O of the pickup (20) of 520) is perpendicular to the first rotation axis (11) and the second rotation axis (31) of the first transfer tool (510), The pickup (20) of the first transfer tool (510) conveys the conveyance position (P ₃ ) of the component (1) to the pickup (20) of the second transfer tool (520) at the first transfer tool ( 510) between the center of rotation O of the pickup (20) and the center of rotation O of the pickup (20) of the second transfer tool (520). The component processor of claim 4, wherein the first transfer tool (510) and the second transfer tool (520) are coupled to each other and detachable. The component processor of claim 4, wherein the first transfer tool (510) and the second transfer tool (520) are separated from each other and movable, and are not required when the unloading component loads components flip case, the first transfer means (510) and said second transfer means (520) in said pickup position (P ₁₎ according to the order of said pickup element (1), and further in the unloading position (P ₂ ) Loading the component (1) on the unloading member (70). The component processor according to claim 4, further comprising: an image acquiring device (90) disposed on the side of the second transfer tool (520) and acquiring the picked up by the pickup (20) The back image of the component (1). The component processor according to claim 8 , further comprising: an image acquiring device (80) disposed on the side of the first transfer tool (510) and acquired by the first transfer tool ( 510) The back image of the component (1) picked up by the pickup (20). The component processor according to any one of claims 2, 3, 5, wherein the loading member (60) includes a belt to which a plurality of the components (1) are attached, the transfer tool module (500) comprising: a plurality of said pickup (20), in said pickup position (P ₁₎ according to the order pickup element is attached to (1) the loading member (60); moving the pickup section, such that The plurality of pickers (20) sequentially pick up the elements (1) attached to the loading member (60), and sequentially move to the pickup position in order by at least one of a rotational movement and a linear movement (P) ₁ ); and at least one of the first linear moving portion (623) and the second linear moving portion (622), wherein the first linear moving portion (623) linearly moves the transfer tool mold in the X-axis direction In the group (500), the second linear moving portion (622) linearly moves the transfer tool module (500) in the Y-axis direction. The component processor according to claim 10, wherein the transfer tool module (500) further comprises at least one image acquisition device for acquiring an element picked up by the pickup (20) (1) ) The back image. The component processor according to claim 11, wherein the image acquired by the image acquisition device is stored in a memory constituting a part of the control section, and the pickup is completed at the respective pickups (20) The control unit performs image analysis when the component (1) is subsequently moved to the unloading position (P ₂ ) or when the communication position of the component is communicated to the other transfer tool module.