KR102159183B1 - Device handler and method for handling device - Google Patents

Abstract

The present invention relates to a device handler, and more particularly, to a device handler for picking up and unloading devices that have completed a semiconductor process and a sawing process from a wafer.
The present invention includes: a first image acquisition unit for acquiring an image including a plurality of devices as an image of at least a portion of a wafer ring to which a plurality of devices that have completed a semiconductor process and a sawing process are attached; At least one of linear movement and rotational movement after picking up all of the plurality of devices included in the image obtained by the first image acquisition unit according to each device position calculated from the image acquired by the first image acquisition unit Disclosed is an element handler comprising at least one first transfer tool for transferring the element to the loading member by movement of the element.

Description

Device handler and method for handling device}

The present invention relates to a device handler, and more particularly, to a device handler and a device handling method for picking up and unloading devices that have completed a semiconductor process and a sawing process from a wafer.

Semiconductor devices (hereinafter referred to as'devices') such as SD RAM, Flash RAM, LSI, and LEDs are generally shipped to the market after completing the semiconductor process and then the sawing process and packaging process.

In addition, in order to secure the reliability of products shipped to the market, quality products are selected and shipped to the market through automatic inspection and classification according to inspection results by inspection devices, sorting devices, inspection and sorting devices, etc.

In addition, the types of chips are diversifying, such as SD RAM, Flash RAM, LSI and other lead frames, and BGA and other terminal structures.

In recent years, according to the demand for miniaturization and high integration of devices, it is increasing that devices are finalized at the wafer level without undergoing a molding process using resin or the like.

Meanwhile, as competition intensifies in the semiconductor market such as SD RAM, mobile SD RAM, and LSI such as mobile CPU, it is necessary to reduce device manufacturing costs and ultimately increase productivity.

In addition, semiconductor production is carried out in a clean room. As the processing speed of the equipment performing each process in the clean room is directly related to productivity, the device handler that unloads the device at the wafer level also increases the processing speed of the device. It is important.

However, the device handler for unloading the device at the wafer level is configured to pick up the device from the wafer ring that has completed the semiconductor process and sawing process, put it in a loading member such as a carrier tape, and unload the device from the wafer ring.

Here, the processing speed of the device handler (usually checked by the number of processing per hour (UPH)) is determined by the throughput of picking up the device from the wafer ring and placing the device on a mounting member such as a carrier tape.

In particular, the processing speed of the device handler is determined by the device pickup efficiency on the wafer ring, such as device recognition by the camera and position correction between the wafer ring and the picker, and the device loading efficiency to the loading member after pickup.

It is an object of the present invention to provide a device handler and a device handling method capable of remarkably increasing the processing speed of an apparatus for picking up an element from a wafer that has been subjected to a semiconductor process and a sawing process and loading it onto a loading member in accordance with the above trends and needs. Have.

The present invention was created in order to achieve the object of the present invention as described above, the present invention, a wafer ring cassette portion in which a plurality of wafer rings to which a plurality of elements having completed a semiconductor process and a sawing process are attached; A wafer ring table for receiving a wafer ring from the wafer ring cassette and moving the wafer ring in a horizontal direction; An unloading unit installed horizontally spaced apart from the wafer ring table and having a loading member for receiving and loading elements from the wafer ring; A first image acquisition unit installed on the upper side of the wafer ring table and acquiring an image of a part of the elements attached to the wafer ring seated on the wafer ring table; After moving a plurality of elements included in the image acquired by the first image acquisition unit to a pickup position using the acquired image, picking up all of the plurality of elements included in the acquired image, at least one of linear movement and rotation movement Disclosed is an element handler comprising a first transfer tool for transferring the element to the loading member of the unloading unit by any one movement.

The first transfer tool picks up all of the plurality of elements included in the image acquired by the first image acquisition unit, rotates 180° so that the bottom faces upward, and reverses the picked elements, and the first transfer tool It may further include a second transfer tool for transferring the device to the loading member of the unloading unit by at least one of linear movement and rotational movement after picking up the inverted device by the device.

The first transfer tool may include a plurality of pickers in an n×m array (n is a natural number greater than or equal to 1, m is a natural number greater than or equal to 2).

The first transfer tool includes a plurality of pickers, and a support member on which the plurality of pickers are supported and installed, and the support member includes any one of a circle, an ellipse, and a polygon in a direction in which the plurality of pickers are supported. It can have a shape.

The first transfer tool may include a plurality of pickers each radially disposed around a rotation axis of a rotation motor that is driven to rotate.

The first transfer tools may be installed in a pair in parallel, and the loading member may be moved in a parallel direction and a vertical direction formed by the pair of first transfer tools.

The device handler acquires an image of the bottom surface of the device for vision inspection on the bottom surface of the device picked up by the first transfer tool when the devices are transferred to the loading member of the unloading unit by the first transfer tool. It may further include a second image acquisition unit.

The device handler and device handling method according to the present invention include device location recognition through images of a plurality of devices, and pickup and place functions of a plurality of devices at a time, thereby picking up devices from a wafer that has completed a semiconductor process and a sawing process. There is an advantage of being able to significantly increase the processing speed of equipment by quickly loading it on the loading member.

Specifically, in the device handler and device handling method according to the present invention, after acquiring an image of a wafer ring to which a plurality of devices are attached, and grasping the device positions of a plurality of devices included in the obtained image, By performing the pick-up and place functions of the elements, the throughput per hour can be significantly increased, and the processing speed can be greatly improved.

Meanwhile, since the conventional device handler performs device recognition/vision inspection by a camera and device pickup and place functions by a single picker, device recognition/vision inspection and pickup and place functions must be performed as many as the number of devices to be picked up.

However, in the device handler and device handling method according to the present invention, device recognition/vision inspection for a plurality of devices is performed at one time, and pickup and place functions are also performed at once. By reducing the number of times the place function is executed, the throughput per hour can be significantly increased, and the processing speed can be greatly improved.

Furthermore, compared to the time required for device recognition/vision inspection, the time required for pickup and place is required relatively longer.By providing a pair or a plurality of transfer tools for pick-up and place, the throughput per hour is significantly increased and processing speed Can be greatly improved.

In addition, when device recognition/vision inspection for a plurality of devices is performed at one time, the location where the device does not exist can be recognized in advance, so that the picker of the transfer tool is prevented from being unnecessarily moved to a location where the device does not exist. Processing speed can be greatly improved by significantly increasing the throughput per hour.

In addition, when device recognition/vision inspection for a plurality of devices is performed at one time, the device is also inspected for defects, so the picker of the transfer tool is prevented from being unnecessarily moved to the location of the device determined to be defective, thereby reducing throughput per hour. By remarkably increasing the processing speed can be greatly improved.

In addition, the device handler and device handling method according to the present invention pick up the device from the wafer that has finished the semiconductor process and the sawing process, and after the device pick-up, the device is inverted with vision inspection on the bottom surface and quickly loaded onto the loading member to speed up equipment processing. There is an advantage that can be significantly increased.

In particular, the device handler according to the present invention acquires images of some of the devices attached to the wafer ring to determine the presence or absence of the device and the location of the device, and within the acquired image based on the identified device presence and device location. By picking up and unloading all of the included elements by a single transfer tool, there is an advantage in that the element unloading speed can be remarkably increased and the processing speed of the equipment can be remarkably increased.

In addition, by acquiring images of some of the devices attached to the wafer ring, the presence or absence of the device and the location of the device are identified, as well as inspection for abnormalities on the upper surface of the device, i.e., vision inspection, at the same time, speeds up vision inspection and device unloading. There is an advantage that can significantly increase the processing speed of the equipment by remarkably increasing the value.

According to an embodiment of the present invention, the image acquired by the first image acquisition unit 810 is the position of each element 1 relative to the wafer ring 10, that is, the picker 513 of the first transfer tool 500. ) Can be used to determine the position of the element 1 to be picked up.

In addition, based on the image acquired by the first image acquisition unit 810, it is possible to grasp the location of the wafer ring 10 to which the device 1 is not attached (indicated by × in FIG. 6). 1 It is possible to prevent the malfunction of the transfer tool 500 to increase the device pickup efficiency by the first transfer tool 500.

In addition, after the sawing is finished in the wafer state, each element 1 is not actually cut as shown in FIG. 2 but is cut with a deviation in the horizontal or vertical direction.

However, since the image acquired by the first image acquisition unit 810 includes a plurality of elements 1, it is possible to recognize a deviation in the horizontal or vertical direction in the arrangement of the adjacent elements 1, so that the first transfer tool 500 ) To increase the device pickup efficiency.

1 is a plan view showing the concept of an element handler according to the present invention.
2A and 2B are perspective and cross-sectional views illustrating a wafer ring used in the device handler of FIG. 1.
3 is a cross-sectional view taken in the direction III-III in FIG. 1.
4 is a plan view showing a modified example of the loading member used in the device handler of FIG. 1.
5 is a side view showing the concept of the device handler of FIG. 1.
6 is a conceptual diagram showing an image obtained by a first image acquisition unit among the device handlers of FIG. 1 and a state after device pickup by a first transfer tool.
7A to 7C are bottom views showing the bottom of the first transfer tool among the device handlers of FIG. 1.
8 is a plan view showing a modified example of a first transfer tool among the device handlers of FIG. 1.
9A and 9B are some conceptual diagrams showing a device handling method according to the present invention, and FIG. 9A is a conceptual diagram for performing a first image acquisition step of acquiring an image by a first image acquisition unit, and FIG. 9B is a device transfer It is a conceptual diagram showing the steps.
10A and 10B are partial plan views showing the device handling method shown in Figs. 9A and 9B, and Fig. 10A is a partial plan view of performing a first image acquisition step of acquiring an image by a first image acquisition unit, 10B is a partial plan view showing a device transfer step.
11 is a side view showing a modified example of the device handler of FIG. 1.

Hereinafter, a device handler according to the present invention will be described in detail with reference to the accompanying drawings.

The device handler according to the present invention is an image of at least a part of a wafer ring 10 to which a plurality of devices 1 having completed a semiconductor process and a sawing process are attached, as shown in FIG. 1, and a plurality of devices 1 A first image acquisition unit 810 for acquiring an image including them; Linear movement after picking up all the plurality of devices 1 included in the image acquired by the first image acquiring unit 810 according to each device position calculated from the image acquired by the first image acquiring unit 810 And one or more first transfer tools 500 for transferring the element 1 to the loading member 20 by at least one of the rotational movements.

In addition, the device handler according to the present invention includes: a wafer ring cassette unit 100 in which a plurality of wafer rings 10 to which a plurality of devices 1 have completed a semiconductor process and a sawing process in a wafer state are mounted; A wafer ring table 200 that receives the wafer ring 10 from the wafer ring cassette unit 100 and moves the wafer ring 10 in the horizontal direction; It may include an unloading unit 300 installed horizontally spaced apart from the wafer ring table 200 and having a loading member 20 for receiving and loading the device 1 from the wafer ring 10.

The wafer ring cassette unit 100 may have various configurations as a configuration in which a plurality of wafer rings 10 to which a plurality of elements 1 having completed a semiconductor process and a sawing process in a wafer state are attached are stacked.

Here, the device loaded on the wafer ring 10 is a device that has completed a semiconductor process and a sawing process in a wafer state.

In particular, the device 1 may be a so-called wafer-level device that does not require a packaging process, unlike a conventional device that undergoes a packaging process after a semiconductor process.

On the other hand, the wafer ring 10, as shown in Figs. 2A and 2B, is a configuration in which the element 1 that has completed the semiconductor process and sawing process is loaded, and the tape 11 and the tape to which the element 1 is attached. It may be configured to include a frame member 12 for fixing (11).

In addition, the tape 11 may be any member as long as it is a member to which the elements 1 can be attached, and a so-called blue tape may be used.

The frame member 12 is a configuration for fixing the tape 11 to which the elements 1 are attached, and various configurations such as a circular ring and a square ring are possible.

Meanwhile, the loading member 20 may be of any configuration as long as the element is loaded, and the tape and reel (carrier tape and cover tape) as shown in FIG. 1, a plate with blue tape, and the element 1 are Various members temporarily loaded for carrying out market shipments or other processes, such as a tray in which a plurality of insertion grooves are formed may be used.

In addition, the mounting member 20 includes, in addition to a member on which the device 1 is temporarily mounted, a substrate such as a PCB on which the device 1 is mounted, a strip, and a lead frame for chip manufacturing. A member for mounting and packaging processes may be used.

The wafer ring cassette unit 100 is a configuration for loading a plurality of wafer rings 10, and any configuration is possible as long as the wafer rings 10 are stacked up and down.

The wafer ring table 200 is configured to receive the wafer ring 10 from the wafer ring cassette unit 100 and move the wafer ring 10 in a horizontal direction, and various configurations are possible.

For example, the wafer ring table 200 receives the wafer ring 10 from the wafer ring cassette unit 100 by a wafer ring loading unit (not shown), and the first transfer tool 400 transfers the device 1 As a configuration for moving the wafer ring 10 in a horizontal direction so as to be picked up, various configurations such as an XY table and an XY-θ table are possible.

In addition, the wafer ring table 200 may be moved in the vertical direction, that is, in the Z-axis direction.

On the other hand, the wafer ring loading unit for transferring the wafer ring 10 from the wafer ring cassette unit 100 to the wafer ring table 200 is to take out the wafer ring 10 from the wafer ring cassette unit 100 and Any configuration is possible as long as the ring 10 can be transferred to the wafer ring table 200.

The unloading unit 300 is installed horizontally spaced apart from the wafer ring table 200 and includes a loading member 20 for receiving and loading the element 1 from the wafer ring 10. Various configurations are provided. It is possible

In particular, the configuration of the unloading unit 300 is determined according to the configuration of the loading member 20 such as tape and reel (carrier tape and cover tape).

As an example, in the unloading part 300, as shown in FIGS. 1, 3, 5, and 11, the pocket part 21 on which the device 1 is loaded is formed along the longitudinal direction, and the device is loaded. When a carrier tape sealed by a tape (not shown) is installed rotatably at one end, the unwinding roll part 311 on which the carrier tape to be loaded is wound, and the other end A carrier tape guide that is installed rotatably and guides the movement of the carrier tape so that the carrier tape unwound from the unwinding roll part 311 passes through the loading position and the winding roll part 312 where the carrier tape sealed by the tape is wound after loading the element. It may be configured to include the unit 313.

Here, as shown in FIG. 3, in the loading member 20, a plurality of holes 22 may be formed on the bottom surface of the pocket portion 21 in which the element 1 is contained.

And when the loading member 20 is positioned at the loading position, a vacuum pressure forming device 24 for forming a vacuum pressure directly under the loading member 20 is installed to be loaded by the first transfer tool 500 to be described later. When the device 1 can be stably loaded.

Here, when the loading member 20 is a carrier tape, as shown in FIG. 3, a pair of roller members 28 installed to guide the wing portion of the carrier tape, and the support member 29 to which the roller member is fixed. Its movement can be guided by a guide.

As another example of the unloading unit 300, in the case of a plate to which the loading member 20 is attached (see FIG. 4), the unloading unit 300 is positioned at one end to attach a plurality of elements 1 The plate loading part in which the plate is loaded, the XY table supporting and moving the plate at the loading position so that the elements 1 are transferred by the first transfer tool 500, and the plate transferring from the tray loading part to the XY table. It may be configured to include a tray moving part (not shown).

Here, the plate is a structure similar to the wafer ring 10, as shown in FIG. 4, and the tape 21 to which the element 1 is attached, and the LOT number, classification grade, etc. while fixing the tape 21 As a tray configured to include the supporting member 14 having the device 1 or formed with a plurality of insertion grooves for the device 1, a tray standardized according to the type of the device 1, that is, a JEDEC tray may be used.

In addition, the plate shown in FIG. 4 may be used in the unloading unit 300 according to the configuration of the tray 30 and the unloading unit 300 of the reject unit 700 in FIG. 1.

Meanwhile, as shown in FIG. 1, the unloading unit 300 is configured with only one configuration 1 (310) for loading the element 1 on the carrier tape, and the configuration 2 for loading the element 1 on a plate. Or, it may be configured to include two or both of configurations 1 and 2.

The first image acquisition unit 810 is installed on the upper side of the wafer ring table 200 and acquires images of some of the elements 1 attached to the wafer ring 10 seated on the wafer ring table 200. As a configuration, it can be configured with a CCD camera or the like.

In addition, the first image acquisition unit 810, as shown in FIG. 6, acquires an image of a part of the elements 1 attached to the wafer ring 10 and transfers the obtained image to a control unit (not shown). I can deliver.

And the image acquired by the first image acquisition unit 810 is the position of each element 1 relative to the wafer ring 10, that is, by the pickers 513 of the first transfer tool 500 to be described later. It can be used to grasp the element position of each element 1 to be picked up.

Also, based on the image acquired by the first image acquisition unit 810, it is possible to grasp the location of the wafer ring 10 to which the element 1 is not attached (indicated by × in FIG. 6), so that the first transfer described later It is possible to increase the device pickup efficiency by the tool 500.

In addition, after the sawing is finished in the wafer state, each element 1 is not actually cut as shown in FIG. 2 but is cut with a deviation in the horizontal or vertical direction.

However, since the image acquired by the first image acquisition unit 810 includes a plurality of elements 1, it is possible to recognize the deviation in the horizontal or vertical direction in the arrangement of the adjacent elements 1, so that the first transfer tool described later The device pickup efficiency by 500 can be improved.

However, in the case of a conventional device handler, the device is picked up after each device is recognized by the camera, and despite the absence or deviation of the device 1 at the location to be picked up, there is no device 1 or deviation only after the location is recognized. As a result, the device pickup efficiency decreases.

On the contrary, in the case of the present invention, the position where the element 1 is not attached (indicated by × in FIG. 6) and the deviation of the arrangement of the adjacent element 1 can be recognized in advance, so that the first transfer tool 500 described later The device pickup efficiency can be improved by this.

In addition, the image acquired by the first image acquisition unit 810 may be used for vision inspection of the upper surface of the device 1 attached to the wafer ring 10.

Meanwhile, images of the plurality of devices 1 acquired by the first image acquisition unit 810 are transmitted to a control unit (not shown) and then analyzed, and the control unit includes the presence or absence of the device 1, the device 1 The position of the device 1, the state of the device 1, etc. will be analyzed.

In particular, the control unit analyzes the images of the plurality of elements 1 acquired by the first image acquisition unit 810, and when it is determined to be suitable according to a predetermined criterion according to the analysis result, the unloading unit ( The loading member 20 of 300), if it is determined to be inappropriate, is removed to a separately installed element collection unit, or the element 1 is transferred to the reject unit 700 described above.

The control unit receives an image of a part of the elements 1 attached to the wafer ring 10 and transfers the image on the wafer ring 10 so that the element 1 can be picked up by a first transfer tool 500 to be described later. As a configuration for calculating the device location of each device 1 of, various configurations are possible, such as configured together with the first image acquisition unit 810 or configured separately.

In addition, the controller may receive images of some of the devices 1 attached to the wafer ring 10 and perform vision inspection on the device 1 together with the calculation of the device location.

Meanwhile, since the first image acquisition unit 810 requires precise recognition of the device 1, it needs to be disposed close to the wafer ring 10.

However, when the first image acquisition unit 810 is installed close to the wafer ring 10, interference with the first transfer tool 810 occurs.

Accordingly, the device handler according to the present invention, as shown in Figs. 9A to 10B, moves the first image acquisition unit 810 to a first position on the wafer ring 10 where an image is to be acquired, and a first transfer tool ( 500) may include a first moving unit (not shown) for moving to a second position where there is no interference when the device is picked up.

The first moving unit moves the first image acquisition unit 810 to a first position on the wafer ring 10 in which an image is to be acquired, and a second position that does not interfere with device pickup by the first transfer tool 500 Any configuration is possible as long as it can be configured.

The first moving unit may be configured to move the first image acquisition unit 810 by linear movement or rotational movement of the first image acquisition unit 810 in a horizontal direction.

In addition, the first moving unit may move the first image acquisition unit 810 upward when the device is picked up by the first transfer tool 500.

The first transfer tool 500 moves a plurality of devices 1 included in the image acquired by the first image acquisition unit 810 to a pickup position using the acquired image, and moves the plurality of devices 1 included in the acquired image. After picking up all of the elements 1 of, the element 1 is transferred to the loading member 20 of the unloading unit 300 by at least one of linear movement and rotational movement.

As an example, the first transfer tool 500, as shown in Figs. 1, 5, 7A to 7C, and 8, a plurality of images included in the image acquired by the first image acquisition unit 810 A plurality of pickers 513 may be included to move the elements 1 of the device 1 to a pickup position using the acquired image to pick up all of the plurality of devices 1 included in the acquired image.

In addition, various configurations are possible according to a support structure and a driving method of the pickers 513 of the transfer tool 500.

The first transfer tool 500, as shown in Figs. 1, 5, 7A to 7C, a plurality of pickers 513 and a plurality of pickers 513 are supported and installed as a support member ( 514).

The plurality of pickers 513 are configured to pick up the element 1 from the wafer ring 10 by vacuum pressure, and various configurations are possible.

The plurality of pickers 513 are generally arranged in a matrix in which the elements 1 attached to the wafer ring 10 are arranged at a substantially right angle. The first transfer tool 810 corresponds to this, It can be arranged in an array (n is a natural number greater than or equal to 1, m is a natural number greater than or equal to 2).

In the device pickup of the plurality of pickers 513, the devices 1 attached to the wafer ring 10 can be picked up at one time, but in consideration of positional deviation, etc., one by one by relative movement with the wafer ring 10. The element 1 can be picked up.

Meanwhile, as shown in FIGS. 7A to 7C, the support member 514 may have various shapes such as a circular shape, an oval shape, and a polygonal shape in a direction in which the plurality of pickers 513 are supported.

As another example of the first transfer tool 500, the first transfer tool 500, as shown in FIG. 8, is a plurality of radially disposed around a rotation axis of a rotation motor 515 that rotates It may include pickers 513.

At this time, it is preferable that the wafer ring 10 and the loading member 20 are disposed in a position opposite to each other, that is, in the X-axis direction based on the first transfer tool 500.

On the other hand, the first transfer tool 500 picks up all the devices 1 that are included in the image acquired after image acquisition and analysis by the first image acquisition unit 810, that is, capable of image analysis.

That is, the device handler according to the present invention is included in the image acquired after image acquisition and analysis by the first image acquisition unit 810, that is, device unloading by picking up and transferring all the devices 1 capable of image analysis. It can speed up significantly.

Meanwhile, the first transfer tool 500 includes one linear movement, that is, a linear movement in the X-axis or Y-axis direction, and two or more linear movements of the element 1, that is, the X-axis direction, the Y-axis direction, and the Z-axis. It may include a picker moving unit for moving a plurality of pickers 513 picking up the element 1 by two or three movements among linear movements in the direction.

In this case, the picker moving unit may include linear moving units (not shown) according to the number of linear movements.

For example, the first transfer tool 500 is linearly moved in the X-axis direction along the guide rails 522 and 532 between the wafer ring 10 and the loading member 20, as shown in FIG. 1. It can be installed as much as possible.

At this time, the support members 514 supporting the plurality of pickers 513 are supported by support brackets 521 and 531 that are linearly moved along the guide rails 522 and 532, and may be installed to move linearly in the Y-axis direction. have.

Meanwhile, the first transfer tool 500 is installed in a pair in parallel in consideration of the transfer efficiency of the element 1, and at this time, the loading member 20 is a parallel structure formed by the pair of first transfer tools 500. It can be moved in a direction perpendicular to the direction.

In addition, when the first transfer tool 500 is configured as a pair, it is moved vertically or in the Y-axis direction, so that interference can be prevented when the first transfer tools 500 are moved.

In addition, as an embodiment of the first transfer tool 500 according to the movement method, the arrangement direction of the wafer ring 10 and the loading member 20 is the X-axis direction, the direction perpendicular to the X-axis on the horizontal plane is the Y-axis direction, When the X-axis and the direction perpendicular to the Y-axis are the Z-axis direction, and the rotational direction with the Z-axis as the θ-direction, the first transfer tool 500 includes linear movement in the X-axis direction, linear movement in the Y-axis direction, It may be configured to pick up the element 10 from the wafer ring 10 by linear movement in the Z-axis direction and rotational movement in the θ direction.

At this time, correction of the device position for the device 1 to be picked up from the wafer ring 10 is a linear movement in the X-axis direction, a linear movement in the Y-axis direction, a linear movement in the Z-axis direction, and the θ direction. It can be done by rotating movement.

Here, it goes without saying that the correction of the device position for the device 1 to be picked up from the wafer ring 10 may be performed by the wafer ring table 200 on which the wafer ring 10 is loaded.

In addition, as an embodiment of the first transfer tool 500 according to the movement method, the first transfer tool 500 is carried out by linear movement in the X-axis direction and linear movement in the Y-axis direction along with the movement of the wafer ring table 200. It can be configured to pick up the device 1 from the wafer ring 10.

Here, the wafer ring 10 is linearly moved in the Z-axis direction and rotated in the θ direction for the wafer ring table 200 when the element 1 is picked up by the first transfer tool 500, and the wafer ring 10 Correction for the position of the device for the device 1 to be picked up from is also performed by linear movement in the Z-axis direction and rotational movement in the θ direction of the wafer ring table 200 on which the wafer ring 10 is loaded, and the wafer ring table 200. Can be.

On the other hand, the element 1 to be loaded on the mounting member 20 may need to be stacked with the upper surface of the wafer ring 10 as the bottom surface, that is, inverted and stacked depending on process conditions, types of devices, and the like.

Accordingly, the device handler according to the present invention, unlike the embodiment shown in Figs. 1 to 8, as shown in Fig. 11, the first transfer tool 810 is in the first image acquisition unit 810 After picking up all of the plurality of elements 1 included in the image obtained by the method, the elements 1 are rotated 180° so that the bottom faces upward, and the picked elements 1 are inverted, and the elements reversed by the first transfer tool 810 After picking up (1), a second transfer tool 600 for transferring the element 1 to the loading member 20 of the unloading unit 300 by at least one of linear movement and rotation movement is added. Can include.

The configuration of the first transfer tool 810 is substantially the same or similar except that it rotates 180° up and down.

At this time, the first transfer tool 810 is further provided with a rotating device that rotates the support member 514 to which the plurality of pickers 513 are coupled by 180° in the configuration shown in FIGS. 7A to 7C.

The second transfer tool 600 picks up the inverted element 1 by the first transfer tool 810 and then loads the unloading unit 300 by at least one of linear movement and rotational movement. It is a configuration that transmits the element 1 to the member 20.

The second transfer tool 600 is preferably configured to have the same arrangement as the first transfer tool 810 in consideration of picking up the inverted element 1 by the first transfer tool 810.

Meanwhile, when the first transfer tools 400 are disposed in a pair, the second transfer tools 600 may be installed in parallel to correspond thereto.

In this case, in the unloading unit 300 described above, the loading member 20 may be moved in a parallel direction and a vertical direction formed by the pair of second transfer tools 600.

As described above, since the second transfer tool 600 is configured as a pair, the device 1 can be quickly transferred.

In addition, when the second transfer tools 600 are configured as a pair, they are moved up and down or in the Y-axis direction, so that interference can be prevented when they are moved.

Meanwhile, in the element handler according to the present invention, the element 1 loaded on the wafer ring 10 is in a state that has been previously inspected by a separate inspection device, and only good-quality elements 1 determined to be inadequate according to the inspection results previously inspected. It may be configured to be loaded on the loading member 20.

At this time, the device handler further includes a reject unit 700 in which the reject loading member 30 is installed in which the device 1 determined to be inappropriate according to the pre-inspected inspection result is loaded by the second transfer tool 600 can do.

The reject unit 700 may have a configuration similar to a configuration including a tray among examples of the configuration of the unloading unit 300. In addition, in order to increase the efficiency of device transfer, it is preferable that the first transfer tool 400 is installed facing the unloading unit 300 with the center of the first transfer tool 400 as shown in FIG. 1.

Meanwhile, when the device 1 is transferred by the first transfer tool 500 or the second transfer tool 600, the device handler is a second image acquisition unit that acquires an image on the bottom of the untested device 1 It may further include 820.

The second image acquisition unit 820 is configured to acquire an image of the bottom surface of the device 1 in a pickup state of the device 1 by the first transfer tool 500 or the second transfer tool 600 CC cameras or the like can be used.

Meanwhile, the image acquired by the second image acquisition unit 820 is transmitted to the control unit, and rotational movement and linear movement of the first transfer tool 500 or the second transfer tool 600 by image analysis by the control unit, Alignment of the loading position of the element 1 of the element 1 picked up by the first transfer tool 500 or the second transfer tool 600 by various combinations, such as a combination of linear movement of the loading member 20 can do.

In addition, the device handler is a third device that acquires an image of the loading state after the first transfer tool 500 or the second transfer tool 600 loads the device 1 onto the loading member 20 at the loading position. An image acquisition unit (not shown) may be additionally included.

The third image acquisition unit stops the system when it is determined that the device 1 is improperly loaded on the loading member 20 by acquiring and analyzing an image of the loading state after the element 1 is loaded on the loading member 20. Or, take appropriate measures, such as notifying that it has been improperly loaded through sound or visual signals, or re-picking up the element 1 by the first transfer tool 500 or the second transfer tool 600, discarding or reloading it. You can do it.

In addition, the device handler may further include a fourth image acquisition unit (not shown) for acquiring an image of the carrier tape to which the cover tape is attached after the carrier tape is sealed by a cover tape (not shown).

The fourth image acquisition unit, after the carrier tape is sealed by a cover tape (not shown), acquires and analyzes an image of the carrier tape to which the cover tape is attached, and stops the system when it is determined that the sealing state is inappropriate. It may be possible to take appropriate measures, such as notifying that it has been improperly sealed through sound or visual signals, or re-sealing by moving the carrier tape in reverse.

Meanwhile, the device handler having the above configuration displays an image including a plurality of devices 1 as an image of at least a part of the wafer ring 20 to which the plurality of devices 1 that have completed the semiconductor process and the sawing process are attached. Obtaining a first image acquisition step; Calculate the device positions of the plurality of devices 1 included in the image acquired in the first image acquisition step by using the acquired image of the plurality of devices 1 included in the image acquired in the first image acquisition step A position calculation step; The first transfer tool 500 for picking up the devices 1 is sequentially moved to the device positions of the devices 1 calculated in the position calculation step, and a plurality of images included in the image acquired in the first image acquisition step It is possible to implement a device handling method comprising a device transfer step of transferring the device to the loading member 20 by at least one of linear movement and rotational movement after picking up all the devices 1.

The first image acquisition step is a step of acquiring an image including a plurality of devices 1 as an image of at least a part of the wafer ring 20 to which the plurality of devices 1 having completed the semiconductor process and the sawing process are attached. As can be formed by various methods.

Meanwhile, in the first image acquisition step, as shown in FIGS. 9A and 10A, a first image acquisition unit 810 positioned above the wafer ring 10 to acquire an image of at least a part of the wafer ring 10. ), and in the device transfer step, as shown in FIGS. 9B and 10B, the first image acquisition unit 810 is moved to a first position on the wafer ring 10 where an image is to be acquired, and a first transfer tool. When the device is picked up by 500, it can be moved to a second position that does not interfere.

In the case of the embodiment shown in FIGS. 10A and 10B, unlike the first transfer tool 500 shown in FIG. 1, which is capable of only linear movement, the device is loaded on the mounting member 20 at the device pickup position on the wafer ring 10. It shows an example that is moved by horizontal rotation to the position.

Meanwhile, the device handling method according to the present invention may further include a vision inspection step in which vision inspection is performed on the plurality of devices 1 included in the image acquired in the first image acquisition step.

The device transfer step may be picked up except for the device 1 inspected as defective in the vision inspection step, or removed from the first transfer tool 500 before being placed on the loading member 20 after picking up.

In the position calculation step, the device position of each device 1 is calculated in the image for the wafer ring 10, and the device transfer step is a first transfer tool only for the device positions calculated as having the device 1 The element 1 can be picked up by moving 500.

Since the above is only described with respect to some of the preferred embodiments that can be implemented by the present invention, as well known, the scope of the present invention should not be limited to the above embodiments and should not be interpreted. It will be said that both the technical idea and the technical idea together with the fundamental are included in the scope of the present invention.

100: wafer ring cassette part 200: wafer ring table
300: unloading part 500: first transfer tool
810: first image acquisition unit

Claims (18)

A first image acquisition unit for acquiring an image including a plurality of elements as an image of at least a portion of the wafer ring to which the plurality of elements having completed the semiconductor process and the sawing process are attached;
At least one of linear movement and rotational movement after picking up all of the plurality of devices included in the image obtained by the first image acquisition unit according to each device position calculated from the image acquired by the first image acquisition unit It includes at least one first transfer tool for transferring the element to the loading member by the movement of,
The first transfer tool picks up all of the plurality of elements included in the image acquired by the first image acquisition unit and rotates 180° so that the bottom faces upwards to invert the picked elements,
An element handler, characterized in that it further comprises a second transfer tool that picks up the inverted element by the first transfer tool and transfers the element to the loading member by at least one of linear movement and rotational movement. . The method according to claim 1,
And a first moving unit for moving the first image acquisition unit to a first position on the wafer ring in which an image is to be acquired, and a second position that does not interfere when the device is picked up by the first transfer tool. The method according to claim 1,
The device handler, characterized in that the image acquired by the first image acquisition unit is used for vision inspection of a plurality of devices included in the image acquired by the first image acquisition unit. The method according to claim 1,
A wafer ring cassette unit on which a plurality of wafer rings to which a plurality of devices having completed a semiconductor process and a sawing process are attached are loaded;
A wafer ring table for receiving a wafer ring from the wafer ring cassette and moving the wafer ring in a horizontal direction;
And an unloading unit installed horizontally spaced apart from the wafer ring table and provided with a loading member for receiving and loading the device from the wafer ring by the first transfer tool. The method according to claim 1,
The loading member is at least one of a carrier tape, a plate having a blue tape, a tray in which a plurality of insertion grooves are formed to contain an element, a substrate on which the element is mounted, a strip to which the element is coupled, and a lead frame for chip manufacturing. Element handler, characterized in that. delete The method according to claim 1,
Wherein the first transfer tool includes a plurality of pickers in an n×m array (n is a natural number greater than or equal to 1, m is a natural number greater than or equal to 2). The method of claim 7,
The first transfer tool includes a plurality of pickers and a support member on which the plurality of pickers are supported and installed,
The device handler, wherein the support member has a shape of any one of a circle, an ellipse, and a polygon in a direction in which the plurality of pickers are supported. The method of claim 7,
Wherein the first transfer tool includes a plurality of pickers each radially disposed about a rotation axis of a rotation motor that is driven to rotate. The method according to claim 1,
Rotation in which the wafer ring and the mounting member are arranged in the X-axis direction, the direction perpendicular to the X-axis on the horizontal plane is the Y-axis, the X-axis and the Y-axis are the Z-axis, and the Z-axis is the rotational axis. When the direction is the θ direction,
The first transfer tool picks up the device from the wafer ring by linear movement in the X-axis direction, linear movement in the Y-axis direction, linear movement in the Z-axis direction, and rotational movement in the θ direction. The method according to claim 1,
Rotation in which the wafer ring and the mounting member are arranged in the X-axis direction, the direction perpendicular to the X-axis on the horizontal plane is the Y-axis, the X-axis and the Y-axis are the Z-axis, and the Z-axis is the rotational axis. When the direction is the θ direction,
The wafer ring is linearly moved in the Z-axis direction and rotated in the θ direction for the wafer ring table when the element is picked up by the first transfer tool,
And the first transfer tool picks up an element from the wafer ring by linear movement in the X-axis direction and linear movement in the Y-axis direction together with the movement of the wafer ring table. The method according to claim 1,
The first transfer tool is installed in a pair in parallel,
The loading member is an element handler, characterized in that moving in a direction parallel to and perpendicular to a direction formed by the pair of first transfer tools. The method according to claim 1,
A second image acquisition unit for obtaining an image of the bottom of the device for vision inspection of the bottom of the device picked up by the first transfer tool when the devices are transferred to the loading member by the first transfer tool. Device handler comprising a. A first image acquisition step of acquiring an image including a plurality of devices as an image of at least a portion of the wafer ring to which the plurality of devices having completed the semiconductor process and the sawing process are attached;
Position calculation step of calculating the position of each device of a plurality of devices included in the image acquired in the first image acquisition step by using the acquired image of a plurality of devices included in the image acquired by the first image acquisition step Wow;
After the first transfer tool for picking up the elements is sequentially moved to the element positions of the elements calculated in the position calculation step, all the plurality of elements included in the image obtained in the first image acquisition step are picked up and then linearized. An element transfer step of transferring the element to the loading member by at least one of movement and rotational movement,
The device transfer step,
After picking up all of the plurality of elements included in the image obtained by the first image acquisition step through the first transfer tool, the picked elements are rotated 180° so that the bottom faces upward, and the picked elements are reversed, and the first transfer After picking up the inverted element by the tool, the element is transferred to the loading member through a second transfer tool that transfers the element to the loading member by at least one of linear movement and rotational movement. Handling method. The method of claim 14,
The first image acquisition step,
It is performed by the first image acquisition unit located above the wafer ring to acquire an image of at least a part of the wafer ring,
The device transfer step comprises moving the first image acquisition unit to a first position on the wafer ring in which an image is to be obtained and a second position where no interference is caused when the device is picked up by the first transfer tool. . The method of claim 14,
And a vision inspection step of performing a vision inspection on a plurality of devices included in the image acquired in the first image acquisition step. The method of claim 16,
The device transfer step,
The device handling method, characterized in that the device is picked up except for the device inspected as defective in the vision inspection step, or is removed from the first transfer tool after pickup and before being placed on the loading member. The method of claim 14,
In the position calculation step, the device position of each device is calculated in the image of the wafer ring,
The device handling method, wherein in the device transfer step, the device is picked up by moving the first transfer tool only for device positions calculated as having the device.

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