TW201812968A - Semiconductor strip alignment apparatus and semiconductor strip alignment method capable of accurately aligning and cutting various semiconductor strips made of different materials - Google Patents
Semiconductor strip alignment apparatus and semiconductor strip alignment method capable of accurately aligning and cutting various semiconductor strips made of different materials Download PDFInfo
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Abstract
Description
構成半導體封裝件切割系統的半導體導帶排列裝置及利用其的半導體導帶排列方法(Semiconductor Strip Align Apparatus And Semiconductor Strip Align Method Using The Same)。更詳細地，關於半導體導帶排列裝置及利用其的半導體導帶排列方法，即，無需在由半導體導帶供給部供給的厚度薄且種類多樣的半導體導帶形成位置確定孔等，也能夠進行半導體切割工序，以進行準確及有效的半導體導帶的排列。 A semiconductor conduction band alignment device constituting a semiconductor package cutting system and a semiconductor strip alignment method (Semiconductor Strip Align Apparatus And Semiconductor Strip Align Method Using The Same). In more detail, the semiconductor conduction band aligning device and the semiconductor conduction band aligning method using the semiconductor conduction band aligning device can be performed without forming position determining holes and the like in the semiconductor conduction band having a thin thickness and various types supplied from the semiconductor conduction band supply unit. Semiconductor cutting process for accurate and efficient alignment of semiconductor conduction bands.
半導體導帶切割系統透過選擇半導體的導帶拾取器來選擇半導體導帶並將其設置在檢查工作台之後，向用於進行切割作業的作業空間移送檢查工作台來執行將半導體導帶切割成單個半導體的作業。 The semiconductor conduction band cutting system selects a semiconductor conduction band by selecting a semiconductor conduction band picker, and sets the semiconductor conduction band after the inspection workbench, and then transfers the inspection workbench to a work space for cutting work to perform the cutting of the semiconductor conduction band into individual pieces. Semiconductor operations.
通常，半導體封裝件是在製作在由矽形成的半導體基板上形成有如電晶體和電容器等的電路部的半導體晶片之後，對其進行包裝來構成半導體導帶，上述半導體導帶在半導體導帶切割系統中被刀具所切割，從而完成單個半導體封裝件。此時，在檢查工作台上的準確位置放置 半導體導帶至關重要。在導帶未放置在檢查工作台上的準確位置的狀態下，若透過刀具進行切割，則刀具的磨損變得嚴重，而且，檢查工作台也會受損，從而導致壽命縮短。 Generally, a semiconductor package is a semiconductor wafer in which a circuit portion such as a transistor and a capacitor are formed on a semiconductor substrate made of silicon, and is then packaged to form a semiconductor conduction band. The semiconductor conduction band is cut at the semiconductor conduction band. The system is cut by a tool to complete a single semiconductor package. At this time, it is important to place the semiconductor conduction tape at the exact position on the inspection table. In the state where the guide belt is not placed at the exact position on the inspection table, if the cutting is performed by the cutter, the abrasion of the cutter becomes serious, and the inspection table is also damaged, resulting in shortened life.
為了防止上述問題，構成以往的半導體導帶切割系統的半導體導帶排列裝置及排列方法中，在選擇半導體導帶的導帶拾取器形成有定位銷及連鎖銷，所述定位銷使得半導體導帶一直在拾取器的規定位置，所述連鎖銷使得被選擇的半導體導帶準確放在檢查工作台上，在半導體導帶和檢查工作台上也形成有與其相應的銷孔和銷插入槽。導帶拾取器利用定位銷來插入于形成於半導體導帶的銷孔的狀態下，進行準確的選擇之後，利用向檢查工作台的插入槽內插入的連鎖銷來將半導體導帶放置在檢查工作台上的方法來排列放置於檢查工作台的半導體導帶的位置。 In order to prevent the above-mentioned problems, in the semiconductor guide band aligning device and the arranging method constituting the conventional semiconductor guide band cutting system, a guide pin picker that selects a semiconductor guide band is formed with a positioning pin and a chain pin, and the positioning pin makes the semiconductor guide Always at the prescribed position of the picker, the interlocking pin allows the selected semiconductor tape to be accurately placed on the inspection table, and corresponding pin holes and pin insertion grooves are also formed on the semiconductor tape and the inspection table. The guide tape picker is inserted into a pin hole formed in a semiconductor guide tape using a positioning pin. After accurate selection, the semiconductor guide tape is placed in the inspection work by using an interlocking pin inserted into an insertion slot of the inspection table. On-stage method to arrange the position of the semiconductor conduction tape placed on the inspection table.
但是，近來，隨著半導體晶片的大小的微型化，在半導體導帶的厚度變薄的情況下，無法在半導體導帶形成銷孔，或者所形成的銷孔擴大或被撕裂等損傷的半導體導帶或者在扭曲嚴重的導帶的情況下，很難進行正常的裝載以及透過排列材料來向檢查工作台傳遞。並且，若半導體導帶的種類或大小發生改變，則與導帶的定位銷相對應地，導帶拾取器的定位銷也需要變化。 However, recently, with the miniaturization of the size of semiconductor wafers, it is not possible to form pin holes in the semiconductor conduction tape when the thickness of the semiconductor conduction tape becomes thin, or to expand the formed pin holes or damage the semiconductor such as tearing. In the case of a conductive tape or a severely twisted conductive tape, it is difficult to carry out normal loading and pass the alignment material to the inspection table. In addition, if the type or size of the semiconductor tape is changed, the positioning pins of the tape pickup need to be changed corresponding to the positioning pins of the tape.
並且，在材料扭曲嚴重的情況下，在確定的位置透過夾子等引出每張材料進行裝載時，無法引出的情況也會頻頻發生，當排列材料並放置於檢查工作台上時，為 了確認是否正常進行工作，只能透過形成在檢查工作台的一側的大片的視野來進行檢測，並且，在排列不良時，為了重新排列，只能在導帶拾取器回歸至可進行選擇的區域後才可進行排列作業，因此，排列和檢查延遲了相當時間。 In addition, when the material is severely twisted, when each material is pulled out by a clip or the like at a certain position for loading, it may not be pulled out frequently. When the materials are arranged and placed on the inspection table, in order to confirm whether it is normal Work can only be performed through the large field of view formed on the side of the inspection table. In the case of poor alignment, in order to rearrange, only after the tape guide returns to a selectable area The arranging operation is performed, and therefore the arranging and checking are delayed considerably.
因此，在將切割物件半導體導帶放置於檢查工作台的過程中，為了半導體導帶的排列，除了使用形成於導帶拾取器、檢查工作台機半導體導帶的銷和孔等的方法之外，還需要新的半導體導帶排列裝置及半導體導帶排列方法。 Therefore, in the process of placing the cut semiconductor semiconductor tape on the inspection table, in order to arrange the semiconductor tape, in addition to using methods such as pins and holes formed in the tape pickup and inspecting the semiconductor tape of the table, Also, a new semiconductor conduction band arrangement device and a semiconductor conduction band arrangement method are needed.
本發明的目的在於，提供半導體導帶排列裝置及利用其的半導體導帶排列方法，即，無需在從半導體導帶供給部供給的厚度薄且種類多樣的半導體導帶形成位置確定孔等，也能夠進行半導體切割工序，以進行準確及有效的排列。 An object of the present invention is to provide a semiconductor conduction band aligning device and a semiconductor conduction band aligning method using the semiconductor conduction band aligning device, that is, it is not necessary to form a position determination hole or the like in a thin and diverse semiconductor conduction band supplied from a semiconductor conduction band supply unit, Enables semiconductor dicing process for accurate and efficient alignment.
為了解決上述問題，本發明提供半導體導帶排列裝置，其特徵在於，包括：料盒，分別層疊多個半導體導帶；導軌，用於引導從上述料盒引出的上述半導體導帶；排列工作台，形成於上述導軌的內側，在放置所引導的上述半導體導帶的狀態下執行Y軸方向排列或θ軸方向排列；以及導帶拾取器，選擇在上述排列工作台排列的半導體導帶，在執行X軸方向排列的狀態下，以能夠將半導體導帶放置於檢查工作台的方式能夠向X軸移動，在上述導 帶拾取器的一側，夾子及排列視覺單元以能夠一同向Y軸方向移動的方式安裝，上述夾子從上述料盒引出上述半導體導帶並放置於在上述導軌進行引導的上述排列工作台，上述排列視覺單元為了檢查放置於上述排列工作台或檢查工作台的上述半導體導帶而進行下方成像。 In order to solve the above problems, the present invention provides a semiconductor tape guide arrangement device, which includes: a material box, each of which is stacked with a plurality of semiconductor tapes; a guide rail for guiding the semiconductor tapes led out from the material boxes; and an alignment table , Formed on the inner side of the guide rail, performing the Y-axis direction alignment or the θ- axis direction alignment in a state where the guided semiconductor guide band is placed; and a tape guide picker, which selects the semiconductor guide bands arranged on the alignment table, in In the state where the X-axis alignment is performed, the semiconductor tape can be moved to the X-axis so that the semiconductor tape can be placed on the inspection table. On the side of the above-mentioned tape pickup, the clip and the vision unit can be aligned in the Y-axis direction together. It is installed in a moving manner, the clip leads the semiconductor guide tape from the magazine and is placed on the alignment table where the guide is guided. The alignment vision unit is used to inspect the semiconductor guide placed on the alignment table or inspection table. The tape was imaged downward.
並且，上述排列工作台可安裝在用於θ軸方向旋轉的θ軸旋轉馬達，上述θ旋轉馬達能夠向Y軸方向移動，並能夠對上述半導體導帶進行真空吸附。 Further, the arrangement may be mounted θ axis table in θ-axis motor for rotating the θ rotation of the motor can be moved in the Y-axis direction, and capable of vacuum suction to the semiconductor conduction band.
而且，上述導軌能夠獨立地向Y軸方向移送，能夠調節導軌之間的間隔，在透過上述排列工作台執行排列的過程中，上述導軌將會展開。 In addition, the guide rails can be independently moved in the Y-axis direction, and the interval between the guide rails can be adjusted. During the process of performing the alignment through the alignment table, the guide rails will be deployed.
其中，上述排列視覺單元可在上述排列工作台的上部檢查上述半導體導帶的排列狀態、對於形成上述半導體導帶的各個半導體封裝件的全數檢查或是否發生溢料飛邊。 The alignment vision unit may check the alignment state of the semiconductor conduction bands on the upper part of the alignment table, check all the semiconductor packages forming the semiconductor conduction bands, or whether flashover occurs.
在此情況下，上述排列視覺單元檢查形成於上述檢查工作台的一側的包含半導體導帶的資訊的二維碼，根據二維碼檢查結果，自動向裝置的系統輸入材料的切割資訊及進行聯動。 In this case, the array vision unit inspects the two-dimensional code containing information of the semiconductor conduction band formed on one side of the inspection table, and automatically enters the cutting information of the material into the system of the device and performs the inspection based on the two-dimensional code inspection result. Linkage.
並且，為了解決上述問題，本發明提供半導體導帶排列方法，其特徵在於，包括：夾子從分別層疊多個半導體導帶的料盒引出上述半導體導帶的步驟；引出上述半導體導帶來向導軌引導上述半導體導帶並將上述半導體導帶放置于能夠向Y軸方向及θ軸方向進行排列的排列工 作台的上部的步驟；透過能夠與上述夾子一同向Y軸方向移動的排列視覺單元檢查放置於上述排列工作台的上部的半導體封裝件的排列狀態的步驟；根據上述排列視覺單元的檢查結果，在將上述半導體導帶放置於上述排列工作台的狀態下，使上述排列工作台向Y軸方向進行移動或者向θ軸方向進行旋轉來對半導體導帶進行排列的步驟；以及透過導帶拾取器選擇在上述排列工作台上排列的上述半導體導帶來向X軸方向移送，調節與X軸位置誤差值相應的移送量來在檢查工作台放置上述半導體導帶的步驟。 In addition, in order to solve the above problems, the present invention provides a method for arranging semiconductor conductive tapes, which includes the steps of: a clip pulling out the semiconductor conductive tapes from a magazine in which a plurality of semiconductor conductive tapes are stacked; and guiding the semiconductor conductive tapes to guide the guide rails. The step of placing the semiconductor conduction band on the upper part of the alignment table capable of arranging in the Y-axis direction and the θ- axis direction; inspecting and placing the semiconductor conduction band through an alignment vision unit capable of moving with the clip in the Y-axis direction The step of arranging the state of the semiconductor packages on the upper part of the alignment table; according to the inspection result of the alignment vision unit, in a state where the semiconductor guide tape is placed on the alignment table, the alignment table is oriented in the Y-axis direction Steps of arranging semiconductor conduction bands by moving or rotating in the θ- axis direction; and selecting the semiconductor conduction bands arranged on the alignment table to be transferred to the X-axis direction by a conduction band picker, and adjusting the positional error with the X-axis Place the semiconductor on the inspection table by the corresponding transfer amount Step belt.
並且，在上述檢查工作台進行放置的步驟之後，還包括排列狀態驗證步驟，透過上述排列視覺單元驗證放置的上述半導體導帶的排列狀態，在上述排列狀態驗證步驟中，在判斷排列狀態無法滿足預先設定的基準的情況下，透過上述導帶拾取器選擇放置於上述檢查工作台的半導體導帶來向上述排列工作台送還之後，再次執行上述排列狀態檢查步驟、在上述工作台進行放置的步驟、上述檢查工作台放置步驟及上述排列狀態驗證步驟。 In addition, after the step of placing the inspection workbench, an alignment state verification step is further included, in which the alignment state of the placed semiconductor conduction tape is verified through the alignment vision unit. In the alignment state verification step, it is determined that the alignment state cannot be satisfied. In the case of a preset reference, after the semiconductor tape selected on the inspection table is returned to the alignment table through the guide belt picker, the alignment state inspection step, the placing step on the table, and the like are performed again. The above-mentioned inspection table placement step and the above-mentioned arrangement state verification step.
而且，在引出上述半導體導帶的步驟中，根據上述半導體導帶的扭曲程度，向Y軸方向移動上述夾子來選擇上述半導體導帶的一側。 In the step of drawing out the semiconductor conduction band, the side of the semiconductor conduction band is selected by moving the clip in the Y-axis direction according to the degree of twist of the semiconductor conduction band.
其中，透過上述導帶拾取器來校正上述半導體導帶的X軸誤差值，透過上述排列工作台來校正上述半導體導帶的Y軸及θ軸誤差值，在上述半導體導帶的X軸、Y軸及θ軸被排列的狀態下放置於上述檢查工作台。 Wherein, the X-axis error value of the semiconductor conduction band is corrected through the conduction band picker, and the Y-axis and θ- axis error values of the semiconductor conduction band are corrected through the alignment table. The axes and theta axes are placed on the inspection table in a state where they are aligned.
在此情況下，在上述排列工作台的上部放置上述半導體導帶的步驟為上述排列工作台真空吸附上述半導體導帶的步驟，在真空吸附上述半導體導帶的步驟之後，還包括確認上述排列工作台上的半導體導帶的真空吸附狀態的步驟，僅在上述真空吸附狀態為預先設定的真空度以上範圍的情況下，執行下一個步驟。 In this case, the step of placing the semiconductor conduction band on the upper part of the alignment table is a step of vacuum absorbing the semiconductor conduction band by the alignment table. After the step of vacuum adsorbing the semiconductor conduction band, the method further includes confirming the alignment work. The step of the vacuum suction state of the semiconductor conduction band on the stage is performed only when the vacuum suction state is in a range above a preset vacuum degree.
根據本發明的半導體導帶排列裝置及利用其的半導體導帶排列方法，以能夠切割從構成半導體切割系統的半導體導帶供給部供給的薄的材料、沒有位置針孔的材料、被毀損的材料、彎曲嚴重的材料等的多種半導體導帶的方式進行準確地排列。 According to the semiconductor conduction band aligning device of the present invention and the semiconductor conduction band aligning method using the same, it is possible to cut a thin material, a material without position pinholes, and a damaged material supplied from a semiconductor conduction band supply unit constituting a semiconductor cutting system. , And a variety of semiconductor conduction bands such as materials with severe bending.
並且，根據本發明的半導體導帶排列裝置及利用其的半導體導帶排列方法，在向半導體導帶切割裝置移送從排列工作台選擇並被放置於檢查工作台的半導體導帶之前，可透過檢測驗證狀態來進行校正，因此，在需要排列狀態的校正的情況下，可使半導體導帶的移送軌跡最小化，從而可提高排列過程的有效性。 In addition, according to the semiconductor conduction band aligning device and the semiconductor conduction band aligning method using the same, before the semiconductor conduction band selected from the alignment table and placed on the inspection table is transferred to the semiconductor conduction band cutting device, it can pass through the inspection Verification is performed to verify the state. Therefore, when alignment of the alignment state is required, the transfer trajectory of the semiconductor conduction band can be minimized, thereby improving the effectiveness of the alignment process.
並且，根據本發明的半導體導帶排列裝置及利用其的半導體導帶排列方法，用於從半導體導帶供給部牽引半導體導帶的夾在以從導帶拾取器的一側向Y軸方向移送的方式安裝於Y軸移送單元，因此，在半導體導帶的彎曲嚴重的情況下，也可向Y軸方向移送，從而可夾住半導體導帶的變形少的周邊部分來進行牽引，因此，與彎曲相對應地可準確移送半導體導帶。 In addition, according to the semiconductor conduction band aligning device and the semiconductor conduction band aligning method using the semiconductor conduction band aligning device of the present invention, the clamp for pulling the semiconductor conduction band from the semiconductor conduction band supply unit is moved from the side of the conduction band pickup to the Y-axis direction. It is mounted on the Y-axis transfer unit. Therefore, when the semiconductor conduction band is severely bent, it can also be transported in the Y-axis direction, so that the peripheral portion with less deformation of the semiconductor conduction band can be clamped for traction. Correspondingly, the semiconductor conduction band can be accurately transferred.
並且，根據本發明的半導體導帶排列裝置及利用其的半導體導帶排列方法，排列視覺單元與上述夾子一同安裝於Y軸移送單元，再次以用於升降導帶拾取器的Z軸移送單元為介質，安裝于向X軸移送導帶拾取器的X軸移送單元，因此，透過上述排列視覺單元可提高放置於上述排列工作台或上述檢查工作台的半導體導帶的X-Y平面全部區域中的排列狀態的檢查或驗證的準確性。此時，排列視覺單元不僅可檢查排列狀態，而且還可檢測存儲材料切割資訊的二維碼、材料是否不良或溢料飛邊。 In addition, according to the semiconductor tape arrangement device and the semiconductor tape arrangement method using the same, the arrangement vision unit is mounted on the Y-axis transfer unit together with the clip, and the Z-axis transfer unit for raising and lowering the tape pickup is again The medium is mounted on the X-axis transfer unit that transfers the tape guide picker to the X-axis. Therefore, the alignment vision unit can improve the arrangement in the entire XY plane of the semiconductor guide tape placed on the alignment table or the inspection table. Check or verify the accuracy of the status. At this time, the alignment vision unit can not only check the alignment status, but also detect the two-dimensional code that stores the cutting information of the material, whether the material is defective or flashover.
1‧‧‧半導體導帶切割系統 1‧‧‧Semiconductor tape cutting system
100‧‧‧半導體導帶供給部 100‧‧‧Semiconductor tape supply department
200‧‧‧半導體導帶排列裝置 200‧‧‧Semiconductor band alignment device
210‧‧‧夾子 210‧‧‧clip
220‧‧‧排列視覺單元 220‧‧‧Arrange visual unit
230‧‧‧Y軸移送單元 230‧‧‧Y-axis transfer unit
230‧‧‧第一側移送單元 230‧‧‧First side transfer unit
240‧‧‧Z軸升降單元 240‧‧‧Z-axis lifting unit
250‧‧‧導帶拾取器 250‧‧‧ Guide belt picker
250‧‧‧半導體導帶 250‧‧‧ semiconductor conduction band
250‧‧‧X軸移送單元 250‧‧‧X-axis transfer unit
270‧‧‧上下方視覺單元 270‧‧‧Up and down visual unit
280‧‧‧排列工作台 280‧‧‧Arrange workbench
281‧‧‧θ軸旋轉馬達 281‧‧‧θ axis rotation motor
286‧‧‧第二Y軸移送單元 286‧‧‧Second Y-axis transfer unit
290‧‧‧導軌 290‧‧‧rail
293‧‧‧驅動裝置 293‧‧‧Drive
310‧‧‧檢查工作台 310‧‧‧ Inspection Workbench
310‧‧‧價差工作台 310‧‧‧Spread Workbench
400‧‧‧半導體切割部 400‧‧‧Semiconductor Cutting Department
SS‧‧‧半導體導帶 SS‧‧‧ semiconductor conduction band
S100‧‧‧半導體導帶移送步驟 S100‧‧‧Semiconductor tape transfer steps
S200‧‧‧排列狀態檢查步驟 S200‧‧‧Arrangement check procedure
S300‧‧‧工作台排列步驟 S300‧‧‧Workbench arrangement steps
S400‧‧‧檢查工作台放置步驟 S400‧‧‧Check the steps
S500‧‧‧排列狀態驗證步驟 S500‧‧‧Arrangement status verification steps
S600‧‧‧排列狀態滿足預先設定的基準 S600‧‧‧arrangement meets preset benchmarks
S700‧‧‧半導體導帶送還步驟 S700‧‧‧Semiconductor tape return procedure
圖1示出包括本發明的半導體導帶排列裝置的半導體導帶切割系統的俯視圖。 FIG. 1 shows a plan view of a semiconductor tape cutting system including a semiconductor tape arrangement of the present invention.
圖2示出本發明的半導體導帶排列裝置的立體圖。 FIG. 2 is a perspective view of a semiconductor conduction band arrangement device of the present invention.
圖3示出本發明的半導體導帶排列裝置的主視圖。 FIG. 3 is a front view of a semiconductor conduction band alignment device of the present invention.
圖4示出本發明的半導體導帶排列裝置的側視圖。 FIG. 4 is a side view of the semiconductor conduction band alignment device of the present invention.
圖5示出本發明的半導體導帶排列方法的方塊圖。 FIG. 5 is a block diagram showing a semiconductor conduction band arrangement method of the present invention.
以下，參照附圖，詳細說明本發明的較佳實施例。但是，本發明並不局限於在此說明的實施例，而是可體現為其他形態。反而，在此說明的實施例為使所公開的內容變得完整並向本發明所屬技術領域的普通技術人員充 分傳遞本發明的思想而提供。在說明書整體中，對相同附圖標記賦予相同結構要素。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiment described here, but may be embodied in other forms. Rather, the embodiments described herein are provided to complete the disclosure and to fully convey the ideas of the present invention to those skilled in the art to which the present invention pertains. Throughout the specification, the same reference numerals are given to the same constituent elements.
圖1示出本包括發明的半導體導帶排列裝置200的半導體導帶切割系統1的俯視圖，圖2示出本發明的半導體導帶排列裝置200的立體圖。 FIG. 1 shows a plan view of a semiconductor tape cutting system 1 including a semiconductor tape arrangement 200 of the present invention, and FIG. 2 shows a perspective view of a semiconductor tape arrangement 200 of the present invention.
本發明的半導體導帶排列裝置200的特徵在於，包括：料盒，分別層疊有多個半導體導帶；導軌290，用於引導從上述料盒引出的上述半導體導帶；排列工作台280，其形成於上述導軌的一側，被引導的上述半導體導帶在放置的的狀態下執行Y軸方向排列或θ軸方向排列；以及，導帶拾取器250，其選擇在上述排列工作台排列的半導體導帶，並向X軸移動，使得半導體導帶在向X軸方向排列的狀態下放置於檢查工作台310，在上述導帶拾取器的一側，以能夠一同向Y軸方向移動的方式安裝有夾子210及排列視覺單元220，上述夾子210從上述料盒引出上述半導體導帶並放置於上述導軌所引導的上述排列工作台上，上述排列視覺單元220為了檢查放置於上述排列工作台或檢查工作台的上述半導體導帶而進行下方成像。 The semiconductor conduction band aligning device 200 of the present invention is characterized by comprising: a magazine, each of which is stacked with a plurality of semiconductor conduction tapes; a guide rail 290 for guiding the semiconductor conduction tapes led out from the magazine; and an alignment table 280, which Formed on one side of the guide rail, the semiconductor guide tape being guided is arranged in a Y-axis direction arrangement or a θ- axis direction arrangement while being placed; and, a tape guide picker 250 that selects semiconductors arranged on the arrangement table The guide belt is moved to the X axis, so that the semiconductor guide belt is placed on the inspection table 310 in a state of being aligned in the X axis direction, and is mounted on the side of the above-mentioned guide belt pickup so as to be able to move together in the Y axis direction. There are a clip 210 and an alignment vision unit 220. The clip 210 leads the semiconductor guide tape from the magazine and is placed on the alignment table guided by the guide rail. The alignment vision unit 220 is placed on the alignment table or inspection for inspection. The semiconductor conduction band of the table performs imaging downward.
如圖1及圖2所示，上述夾子210及上述排列視覺單元220以能夠在導帶拾取器250的一側一同向Y軸方向移送的方式安裝於第一Y軸移送單元230。上述夾子210及上述排列視覺單元220在安裝於上述第一Y軸移送單元230的狀態下一同向Y軸方向移送。 As shown in FIGS. 1 and 2, the clip 210 and the array vision unit 220 are mounted on the first Y-axis transfer unit 230 so as to be able to be moved together in the Y-axis direction on one side of the tape guide pickup 250. The clip 210 and the array vision unit 220 are moved in the Y-axis direction together in a state of being mounted on the first Y-axis transfer unit 230.
為了排列半導體導帶，需要校正X軸、Y軸及 θ軸。此時，導帶拾取器往返排列工作台和檢查工作台之間並可向X軸移動，因此，為了檢查整個導帶，將視覺單元一同設置於導帶拾取器的一側，則即使沒有其他驅動部也可有效進行檢查。因此，在導帶拾取器的一側形成視覺單元時可向Y軸移動地設置，使得可以進行對於構成導帶的各個半導體導帶的視覺檢查。並且，在限定的作業空間內，夾子引出半導體導帶來將其放置於排列工作台的動作和導帶拾取器將放置於排列工作台的半導體導帶放置在檢查工作台的動作中，夾子和導帶拾取器分別位於不同的驅動部時，可存在夾子和導帶拾取器發生碰撞的問題，因此，在本發明中，夾子與視覺單元一同設置於導帶拾取器的一側，夾子和視覺單元可一同向Y軸驅動，由此，可提高對於半導體導帶的彎曲的對應力。 In order to arrange the semiconductor conduction band, the X-axis, Y-axis, and θ-axis need to be corrected. At this time, the guide belt picker moves back and forth between the alignment table and the inspection table and can move to the X axis. Therefore, in order to check the entire guide belt, the vision unit is set on one side of the guide belt pickup, even if there is no other The drive section can also be checked effectively. Therefore, when the vision unit is formed on one side of the guide belt pickup, it is provided so as to be movable toward the Y axis, so that a visual inspection of each semiconductor guide belt constituting the guide belt can be performed. Moreover, in a limited work space, the operation of the clip leading out of the semiconductor guide belt and placing it on the alignment table and the tape picker placing the semiconductor guide on the alignment table during the movement of the inspection table. When the belt guide pickers are respectively located at different driving parts, there may be a problem that the clip and the belt guide collide. Therefore, in the present invention, the clip and the vision unit are provided on one side of the belt guide picker, the clip and the vision The cells can be driven to the Y axis together, thereby increasing the pairing stress on the bending of the semiconductor conduction band.
因此，夾子和排列視覺單元設置于可向X軸方向移動的導帶拾取器的一側，由此，夾子和排列視覺單元也可一同向X軸、Y軸方向移動。 Therefore, the clip and the alignment vision unit are provided on one side of the tape pickup that is movable in the X-axis direction, and thus the clip and the alignment vision unit can also be moved in the X-axis and Y-axis directions together.
另一方面，上述夾子210引導有導軌，所述導軌從半導體導帶供給部100，例如，層疊有多個半導體導帶的料盒將一個半導體導帶以夾持的狀態引出並向X軸方向移送，並將上述半導體導帶放置於上述排列工作台280。 On the other hand, the clip 210 guides a guide from the semiconductor tape supply unit 100, for example, a magazine in which a plurality of semiconductor tapes are stacked, and one semiconductor tape is pulled out in a clamped state and directed in the X-axis direction. The semiconductor conductive tape is transferred and placed on the alignment table 280.
如下所述，上述排列工作台280中，透過上述夾子210引出的半導體導帶透過導軌以被第一次排列的狀態引導並被移送，在排列工作台放置有半導體導帶的狀態下，透過形成於導帶拾取器的一側的排列視覺單元檢查上 述半導體導帶的排列狀態之後，根據檢查結果，執行Y軸方向排列或θ軸方向排列作業。 As described below, in the alignment table 280, the semiconductor guide tape led out through the clip 210 is guided by the guide rails and transferred for the first time, and the semiconductor guide tape is transmitted through the guide table in a state where the semiconductor guide tape is placed. After the alignment vision unit on one side of the tape guide picker checks the arrangement state of the semiconductor tape, the Y-axis direction alignment or θ-axis direction alignment operation is performed according to the inspection result.
本發明的半導體導帶排列裝置200包括導帶拾取器250，所述導帶拾取器選擇排列在上述排列工作台280的半導體導帶，在X軸方向上排列並移動之後，將所選擇的半導體導帶250放置於檢查工作台310上。 The semiconductor conduction band aligning device 200 of the present invention includes a conduction band picker 250 that selects the semiconductor conduction bands arranged on the alignment table 280, and arranges and moves the selected semiconductors in the X-axis direction. The guide tape 250 is placed on the inspection table 310.
上述導帶拾取器250選擇在上述排列工作台280排列的半導體導帶來向X軸方向移送，在移送過程中，執行X軸方向排列之後，可將其放置於檢查工作台310。因此，上述導帶拾取器250可安裝於X軸移送單元250。 The guide belt picker 250 selects the semiconductor guide belts arranged on the alignment table 280 to be transferred in the X-axis direction. During the transfer process, after the alignment in the X-axis direction is performed, it can be placed on the inspection table 310. Therefore, the above-mentioned tape guide pickup 250 can be mounted on the X-axis transfer unit 250.
並且，上述導帶拾取器250呈在排列工作台280選擇半導體導帶並將其放置於檢查工作台310的結構，所述導帶拾取器包括以向Z軸方向升降的方式使上述導帶拾取器250向Z軸方向升降的Z軸升降單元240。 In addition, the above-mentioned guide tape picker 250 has a structure in which a semiconductor guide tape is selected on the alignment table 280 and is placed on the inspection table 310. The guide tape picker includes a method of picking up the guide tape in a manner of lifting and lowering in the Z-axis direction. A Z-axis lifting unit 240 for lifting and lowering the actuator 250 in the Z-axis direction.
而且，上述第一Y軸移送單元230安裝於上述Z軸升降單元240，上述Z軸升降單元240安裝於上述X軸移送單元250，因此，上述夾子210和上述排列視覺單元220可向X軸方向及Y軸方向移送。 In addition, the first Y-axis transfer unit 230 is mounted on the Z-axis lifting unit 240, and the Z-axis lift unit 240 is mounted on the X-axis transfer unit 250. Therefore, the clip 210 and the alignment vision unit 220 can be oriented in the X-axis direction. And Y-axis movement.
對此，上述夾子210透過第一Y軸移送單元230向任意的Y軸方向移送之後，在夾住半導體導帶的狀態下，透過X軸移送單元250向X軸方向移送，從而可在上述排列工作台280放置半導體導帶。即，根據半導體導帶的彎曲程度，向Y軸方向移動夾子來選擇半導體導帶的一側。 In this regard, after the clip 210 is transferred to an arbitrary Y-axis direction through the first Y-axis transfer unit 230, it is transferred to the X-axis direction through the X-axis transfer unit 250 while the semiconductor tape is clamped, so that the above arrangement can be performed. The stage 280 places a semiconductor conduction band. That is, one side of the semiconductor conduction band is selected by moving the clip in the Y-axis direction according to the degree of bending of the semiconductor conduction band.
具體地，半導體導帶的邊緣部分被盒子支撐的 狀態下層疊於料盒，最近的半導體導帶的厚度變薄，從而，特定部位，例如，在中心部位引起半導體導帶的彎曲，在此情況下，雖然存在無法透過夾子210準確夾住的情況，但是，相對地，透過後述的導軌290等引導的半導體導帶的邊緣區域不存在半導體導帶的彎曲現象或者處於緩和的狀態。因此，上述夾子210在向Y軸移送的狀態下，夾住物件半導體導帶的邊緣附近區域的方法。 Specifically, the edge portion of the semiconductor conduction band is laminated on the magazine in a state where the edge portion of the semiconductor conduction band is supported by the box, and the thickness of the nearest semiconductor conduction band becomes thinner, so that a specific portion, for example, causes the semiconductor conduction band to be bent at the center portion. In this case, Although it may not be accurately clamped by the clip 210, the edge region of the semiconductor conduction band guided through the guide rail 290 and the like described later does not have the phenomenon of bending or relaxation of the semiconductor conduction band. Therefore, the above-mentioned clamp 210 is a method of clamping the area near the edge of the semiconductor conduction band of the object in a state of being transferred to the Y axis.
綜上所述，上述夾子210在半導體導帶供給部100夾住半導體導帶的位置在Y軸方向確定，在Y軸方向確定的位置上夾住半導體導帶之後向X軸方向移送，從而可向上述排列工作台280移送上述半導體導帶。透過這種方法，本發明的夾子可從導帶拾取器的一側向Y軸方向移送半導體導帶，並可對半導體導帶的彎曲具有優秀的對應力。 In summary, the position of the clamp 210 in the semiconductor tape supply portion 100 for clamping the semiconductor tape is determined in the Y-axis direction, and the semiconductor tape is clamped at a position determined in the Y-axis direction, and then transferred to the X-axis direction. The semiconductor conduction band is transferred to the alignment table 280. By this method, the clip of the present invention can transfer the semiconductor conduction band from the side of the conduction band picker to the Y-axis direction, and can have excellent stress against bending of the semiconductor conduction band.
並且，與上述夾子210一同安裝於上述第一Y軸移送單元230的排列視覺單元220在上述排列工作台280全部區域可進行用於檢查排列狀態的成像。 In addition, the alignment vision unit 220 mounted on the first Y-axis transfer unit 230 together with the clip 210 can perform imaging for checking the alignment state in the entire area of the alignment table 280.
即，上述排列視覺單元220透過上述第一側移送單元230及上述X軸移送單元250來向X-Y平面上的任意位置移送的狀態下，為了檢測放置於上述排列工作台280的半導體導帶的排列誤差，可執行下方成像檢查。 That is, in a state where the alignment vision unit 220 is transferred to an arbitrary position on the XY plane through the first side transfer unit 230 and the X-axis transfer unit 250, in order to detect the alignment error of the semiconductor conduction band placed on the alignment table 280, , You can perform the imaging inspection below.
並且，上述排列視覺單元220除了檢查在排列工作台上的排列狀態，還可執行材料的全數檢查、溢料飛邊檢查等。 In addition, in addition to checking the alignment state on the alignment table, the alignment vision unit 220 may also perform full material inspection, flashover inspection, and the like.
半導體導帶是以彎曲面朝下的狀態供給，當彎 曲時，因飛邊，可能會發生向形成有凸面或凹面流入溢料的情況。此時，透過排列視覺單元檢測材料的凸面或凹面來檢查是否存在溢料飛邊，如果存在溢料飛邊，則不進行排列或切割，而是返送半導體導帶或者獲取對應區域的資訊來視為不良品。 The semiconductor tape is supplied with the curved surface facing downward. When it is bent, flashing may occur due to flashing to the convex or concave surface. At this time, the convex or concave surface of the material is checked by arranging the visual unit to check whether there is flashover. If there is flashover, then the alignment or cutting is not performed. Instead, the semiconductor conduction band is returned or the corresponding area information is obtained for viewing. For defective products.
而且，排列視覺單元不僅可在排列工作台，還可以在檢查工作台的上部執行視野檢查。例如，在用於驗證排列狀態的成像檢查、二維碼檢查或被切割材料的狀態檢查中也可使用排列視覺單元。 Furthermore, the alignment vision unit can perform visual field inspection not only on the alignment table but also on the upper part of the inspection table. For example, an alignment vision unit may be used in an imaging inspection, a two-dimensional code inspection, or a state inspection of a cut material for verifying an alignment state.
通常，若改變材料的種類，則檢查工作台也根據材料而替換，在檢查工作台的一側形成有包含材料資訊的二維碼。透過檢查二維碼來切割材料的切割資訊，例如，可確認材料的矩陣資訊、切割螺距、切割速度等的切割時所需的材料資訊。若透過排列視覺單元識別二維碼，則向裝置的系統自動輸入材料的切割資訊，從而使用人員無需用手一一檢查材料資訊的輸入，而是簡單地向裝置的系統自動輸入材料的切割資訊及進行聯動來獲取材料切割所需的資訊。 Generally, if the type of material is changed, the inspection table is also replaced according to the material, and a two-dimensional code including material information is formed on one side of the inspection table. Check the cutting information of the material by checking the QR code. For example, you can confirm the material information of the material, the cutting pitch, and the cutting speed. If the two-dimensional code is identified by arranging the visual units, the cutting information of the material is automatically input to the system of the device, so that the user does not need to manually check the input of the material information one by one, but simply automatically enters the cutting information of the material into the system of the device. And linkage to get the information needed for material cutting.
另一方面，當夾子從料盒引出彎曲嚴重的導帶來向導軌引導並放置于排列工作台時，在彎曲程度相當大的情況下，導軌拾取器很難選擇排列工作台上的導帶。並且，當在排列工作台切割導帶時，可能會發生真空裂痕，且很難進行控制，因此，在此情況下不進行排列或切割，而是視為不良而返送。 On the other hand, when the clip leads the curved guide belt from the magazine to the guide rail and places it on the alignment table, it is difficult for the rail picker to select the guide belt on the alignment table under the condition of considerable bending. In addition, when the guide tape is cut on the alignment table, a vacuum crack may occur and it is difficult to control. Therefore, in this case, the alignment or cutting is not performed, and it is returned as a defect.
如上所述，上述排列視覺單元220與上述夾子210一同移送並執行下方成像檢查，在固定在上述排列工作台280前方的位置還可形成上下方視覺單元270，用於上方成像檢查。上述上下方視覺單元270可執行成像作業，所述成像作業用於判斷透過上述夾子210以被夾的狀態移送的半導體導帶的方向或種類等。 As described above, the alignment vision unit 220 is moved together with the clip 210 and performs a lower imaging inspection, and an upper and lower vision unit 270 may be formed at a position fixed in front of the alignment table 280 for the upper imaging inspection. The upper and lower vision unit 270 may perform an imaging operation for determining a direction or a type of a semiconductor guide tape transferred in a clamped state through the clamp 210.
圖3示出本發明的半導體導帶排列裝置200的主視圖。 FIG. 3 is a front view of a semiconductor conduction band alignment device 200 according to the present invention.
圖3示出為了說明排列工作台280的排列過程而去除系統的蓋或外罩的狀態。 FIG. 3 illustrates a state in which a cover or a cover of the system is removed in order to explain the alignment process of the alignment table 280.
如上所述，上述排列工作台280可以放置有透過上述夾子210移送的半導體導帶ss的狀態執行Y軸方向排列或θ軸方向排列。 As described above, the alignment table 280 may perform the Y-axis alignment or the θ-axis alignment in a state where the semiconductor conduction band ss transferred through the clip 210 is placed.
即，與基準位置比較，在透過上述排列視覺單元220成像的半導體導帶ss的排列狀態變亂時，上述排列狀態的誤差或彎曲可分為X軸方向誤差、Y軸方向誤差及θ軸方向誤差。 That is, compared with the reference position, when the arrangement state of the semiconductor conduction band ss imaged through the arrangement vision unit 220 is disordered, the above-mentioned arrangement state error or bending can be divided into an X-axis direction error, a Y-axis direction error, and a θ-axis direction error. .
而且，如上所述，上述X軸方向誤差可在透過上述導帶拾取器250選擇在排列工作台280中排列的半導體導帶ss來放置於上述檢查工作台310的過程中進行校正，因此，在上述排列工作台280防止半導體導帶ss的狀態下，透過上述排列視覺單元220成像檢查的半導體導帶的Y軸方向誤差及θ軸方向誤差可透過排列工作台280自身的Y軸方向移送和θ軸方向旋轉來校正。 Moreover, as described above, the X-axis direction error can be corrected during the process of selecting the semiconductor conduction band ss arranged in the alignment table 280 through the conduction band picker 250 to place on the inspection table 310. Therefore, in In the state where the alignment table 280 prevents the semiconductor conduction band ss, the Y-axis direction error and θ-axis direction error of the semiconductor conduction band imaged and inspected through the alignment vision unit 220 can be transmitted through the Y-axis direction transfer and θ of the alignment table 280 itself. Rotate the axis to correct it.
為此，上述排列工作台280安裝在用於θ軸方向旋轉的θ軸旋轉馬達281，上述θ軸旋轉馬達281可安裝於第二Y軸移送單元286。 To this end, the alignment table 280 is mounted on a θ-axis rotation motor 281 for rotation in the θ-axis direction. The θ-axis rotation motor 281 may be mounted on the second Y-axis transfer unit 286.
如圖3所示，上述排列工作台280下部與θ軸旋轉馬達281相連接，在上述θ軸旋轉馬達281的下部形成有第二Y軸移送單元286，從而可分別校正Y軸方形誤差及θ軸方向誤差。 As shown in FIG. 3, the lower part of the alignment table 280 is connected to the θ-axis rotation motor 281, and a second Y-axis transfer unit 286 is formed at the lower part of the θ-axis rotation motor 281, so that the Y-axis square error and θ can be corrected respectively. Axis direction error.
作為具體方法，從透過上述排列視覺單元220拍攝的圖像判斷的排列誤差中，Y軸方向誤差透過上述第二Y軸移送單元286向Y軸方向移送上述排列工作台280來校正，θ軸方向誤差透過上述θ軸旋轉馬達281來向θ軸方向旋轉上述排列工作台280來進行校正。 As a specific method, among the alignment errors determined from the images captured through the alignment vision unit 220, the Y-axis direction error is corrected by transferring the alignment table 280 to the Y-axis direction through the second Y-axis transfer unit 286, and the θ-axis direction The error is corrected by rotating the alignment table 280 in the θ-axis direction through the θ-axis rotation motor 281.
並且，在本發明中，排列工作台可進行真空吸附。當對發生彎曲的半導體導帶進行視野檢查時，若存在彎曲的部分和無彎曲的部分之間的焦點距離發生變化，則在獲取導帶的位置資訊的過程中，不得不面臨難題。對此，在排列工作台上真空吸附半導體導帶來維持平平的狀態，由此，排列視覺單元的焦點距離可一直維持相同焦點，從而可獲得對於半導體導帶的準確位置資訊。同時，在透過排列工作台的真空吸附功能矯正θ軸方向誤差的過程中獲得準確性和精密性。 Further, in the present invention, the alignment table can perform vacuum adsorption. When performing a visual field inspection of a semiconductor conduction band that is bent, if the focal distance between a bent portion and a non-curved portion changes, it is necessary to face difficulties in obtaining the position information of the conduction band. In this regard, the semiconductor suction belt is vacuum-sucked on the alignment table to maintain a flat state, so that the focal distance of the alignment vision unit can always maintain the same focus, thereby obtaining accurate position information on the semiconductor conduction belt. At the same time, accuracy and precision are obtained in the process of correcting the θ-axis direction error through the vacuum suction function of the alignment table.
如上所述，透過上述排列工作台280對Y軸方向誤差及θ軸方向誤差進行校正的半導體導帶ss被上述導帶拾取器250選擇的狀態向上述檢查工作台310移送， 在向上述檢查工作台310放置半導體導帶的過程中，還可對X軸方向誤差進行校正。 As described above, the semiconductor guide band ss that corrects the Y-axis direction error and the θ-axis direction error through the alignment table 280 is transferred to the inspection table 310 in a state selected by the guide belt picker 250, and is moved to the inspection work. During the placement of the semiconductor conduction band on the stage 310, the X-axis direction error can also be corrected.
半導體導帶在向X、Y、θ軸方向進行排列的狀態下，放置於檢查工作台310。但是，即使存在機械誤差或其他理由，放置於檢查工作台的半導體導帶也有可能無法正常排列，因此，透過排列視覺單元再次確認檢查工作台上的半導體導帶的排列狀態並檢查排列狀態。 The semiconductor conduction bands are placed on the inspection table 310 in a state of being aligned in the X, Y, and θ axis directions. However, even if there is a mechanical error or other reasons, the semiconductor conduction bands placed on the inspection table may not be aligned properly. Therefore, the alignment state of the semiconductor conduction bands on the inspection table is reconfirmed by the alignment vision unit and the alignment state is checked.
本發明透過上述方法來對切割物件半導體導帶進行排列，省略形成於以往導帶拾取器的定位銷等，同樣，也省略在半導體導帶形成的用於插入定位銷的銷孔，將半導體導帶放置於排列工作台的狀態，可校正與軸方向誤差或θ軸方向誤差，在導帶拾取器將半導體導帶放置於檢查工作台的過程中，可校正X軸方向誤差，因此，可省略透過以往的連鎖銷等的位置確定方法。 The present invention uses the above method to arrange the semiconductor guide tape of the cut object, omitting the positioning pins and the like formed in the conventional guide tape pickup, and also omitting the pin holes formed in the semiconductor guide tape for inserting the positioning pins to guide the semiconductor guide. When the belt is placed on the alignment table, it can correct the error in the axial direction or the θ-axis direction. In the process of placing the semiconductor guide belt on the inspection table by the belt guide pickup, the X-axis direction error can be corrected, so it can be omitted. Positioning methods based on conventional chain pins.
可省略上述各種銷和孔的優點是，即使排列物件導帶拾取器的種類改變也可省略額外的機械交替作業，可提高裝置的用途或維護。 The advantage of being able to omit the various pins and holes described above is that even if the type of the guided belt picker of the arranged object is changed, additional mechanical alternate operations can be omitted, which can improve the use or maintenance of the device.
詳細說明了本發明的半導體導帶排列裝置的各個結構，半導體導帶排列方法可如下說明。 Each structure of the semiconductor conduction band arrangement device of the present invention is explained in detail, and the semiconductor conduction band arrangement method can be described as follows.
半導體排列方法包括：夾子從分別層疊多個半導體導帶的料盒引出上述半導體導帶的步驟；引出上述半導體導帶來向導軌引導上述半導體導帶，並將上述半導體導帶放置于能夠向Y軸方向及θ軸方向進行排列的排列工作台的上部的步驟；透過能夠與上述夾子一同向Y軸方向 移動的排列視覺單元檢查放置於上述排列工作台上部的半導體封裝件的排列狀態的步驟；根據上述排列視覺單元的檢查結果，以將上述半導體導帶放置於上述排列工作台的狀態，使上述排列工作台向Y軸方向進行移動或者向θ軸方向進行旋轉來對半導體導帶進行排列的步驟；以及，透過導帶拾取器選擇在上述排列工作台上排列的上述半導體導帶來向X軸方向移送，調節與X軸位置誤差值相應的移送量來在檢查工作台放置上述半導體導帶的步驟。 The method for arranging semiconductors includes the steps of: pulling out the semiconductor conductive tapes from a magazine in which a plurality of semiconductor conductive tapes are stacked; pulling out the semiconductor conductive tapes; guiding the semiconductor conductive tapes to a guide rail; Step of arranging the upper part of the alignment table in the direction and the θ axis direction; step of inspecting the alignment state of the semiconductor packages placed on the alignment table by an alignment vision unit capable of moving in the Y-axis direction together with the clip; The inspection result of the alignment vision unit is a step of arranging the semiconductor conduction band in a state where the semiconductor conduction band is placed on the alignment table, and the alignment stage is moved in the Y-axis direction or rotated in the θ-axis direction. ; And, the step of selecting the semiconductor guide belts arranged on the alignment table to be moved to the X-axis direction by a guide belt picker, and adjusting the transfer amount corresponding to the X-axis position error value to place the semiconductor guide belts on the inspection table. .
其中，在引出半導體導帶的步驟中，根據半導體導帶的彎曲程度，向Y軸方向移送上述夾子來選擇上述半導體導帶的步驟，在排列工作台的上部放置半導體導帶的步驟為排列工作台真空吸附上述半導體導帶的步驟。 Among them, in the step of extracting the semiconductor conduction band, the step of selecting the semiconductor conduction band by moving the clip in the Y-axis direction according to the degree of bending of the semiconductor conduction band, and the step of placing the semiconductor conduction band on the upper part of the alignment table is the alignment work. The stage vacuum-adsorbs the semiconductor conduction band.
在真空吸附上述半導體導帶的步驟之後，還包括確認上述排列工作台上的半導體導帶的真空吸附狀態的步驟，僅在上述真空吸附狀態達到預先設定的真空度以上範圍的情況下才執行下一個步驟。 After the step of vacuum-adsorbing the semiconductor conduction band, the method further includes a step of confirming the vacuum adsorption state of the semiconductor conduction bands on the alignment table, which is performed only when the vacuum adsorption state reaches a range above a predetermined vacuum degree. One step.
並且，在上述檢查工作台放置步驟之後，還包括透過上述排列視覺單元驗證放置的上述半導體導帶的排列狀態的排列狀態驗證步驟，在判斷排列狀態無法滿足預先設定的基準的情況下，透過上述導帶拾取器選擇放置於上述檢查工作台的半導體導帶來向上述排列工作台送還之後，再次執行上述工作台排列步驟、上述檢查工作台放置步驟及上述排列狀態驗證步驟。 In addition, after the step of placing the inspection table, an alignment state verification step of verifying the alignment state of the semiconductor conduction tapes placed through the alignment vision unit is further included. After the guide belt picker has selected the semiconductor guide belt placed on the inspection table to be returned to the alignment table, the above-mentioned table alignment step, the inspection table placement step, and the alignment state verification step are performed again.
另一方面，圖4示出本發明的半導體導帶排列 裝置200的側視圖。 On the other hand, Fig. 4 shows a side view of a semiconductor conduction band alignment device 200 of the present invention.
如上所述，上述半導體導帶供給部100，例如，透過夾子210，從層疊半導體導帶ss的導帶料盒等依次夾住半導體導帶的方法，可向上述排列工作台280移送半導體導帶。此時，在向排列工作台移送的過程中，為了防止所移送的半導體導帶的傾斜或脫離，透過上述夾子210，從上述半導體導帶供給部100夾住半導體導帶ss來引出，用於支撐半導體導帶的兩側端部的一對導軌290以隔開的狀態向與X軸平行的方向形成於上述排列工作台280的外側。 As described above, the semiconductor tape supply unit 100 can transfer the semiconductor tape to the arranging table 280 by sequentially clamping the semiconductor tape from a tape cassette such as a laminated semiconductor tape ss through the clip 210. . At this time, in the process of transferring to the alignment table, in order to prevent the transferred semiconductor guide tape from being tilted or detached, the semiconductor guide tape ss is clamped from the semiconductor guide tape supply unit 100 through the clip 210 and is used for extraction. A pair of guide rails 290 supporting the ends of both sides of the semiconductor conductive tape are formed on the outside of the alignment table 280 in a spaced-apart direction parallel to the X axis.
一對導軌290可獨立向Y軸方向驅動，可透過調節導軌290之間的間隔來對應多種大小的半導體導帶的移送工序，也執行改變Y軸方向半導體導帶的移送軌跡的作用。 The pair of guide rails 290 can be independently driven in the Y-axis direction, and can adjust the interval between the guide rails 290 to correspond to the transfer process of semiconductor conductive tapes of various sizes.
各個導軌290可透過沿著Y軸方向配置的滾珠螺栓等的驅動裝置293來驅動。 Each of the guide rails 290 can be driven by a driving device 293 such as a ball bolt arranged along the Y-axis direction.
上述導軌290僅在半導體導軌從上述半導體導軌供給部100向上述排列工作台280移送的過程中引導半導體導帶的兩端，在上述排列工作台280放置半導體導帶的狀態下被吸附來校正排列狀態的誤差的工作台排列步驟中，不能妨礙基於排列工作台280的Y軸方向移送或θ軸方向旋轉的半導體導帶的移動。 The guide rail 290 guides both ends of the semiconductor guide tape only during the process of transferring the semiconductor guide rail from the semiconductor guide supply unit 100 to the alignment table 280, and is sucked to correct the alignment while the semiconductor guide tape is placed on the alignment table 280. In the stage alignment step of the state error, the movement of the semiconductor conduction band by the Y-axis direction transfer or the θ-axis direction rotation of the alignment table 280 cannot be prevented.
因此，在透過上述排列工作台280執行排列的過程中，為不妨礙基於上述排列工作台280的半導體導帶排列作業，上述導軌290可會展開。 Therefore, in the process of performing the alignment through the alignment table 280, the guide rail 290 may be unfolded so as not to hinder the semiconductor guide tape alignment operation based on the alignment table 280.
透過上述方法，完成放置於上述排列工作台280的半導體導帶的排列的半導體導帶透過上述導帶拾取器250選擇，向上述檢查工作台310，向X軸方向移送，同時，在校正X軸方向排列誤差之後，放置於上述檢查工作台310，並防止切割對象半導體導帶ss。 Through the above method, the semiconductor conduction bands that have completed the arrangement of the semiconductor conduction bands placed on the alignment table 280 are selected by the conduction band picker 250 and moved to the inspection table 310 in the X-axis direction, and at the same time, the X-axis is corrected. After the alignment errors, they are placed on the inspection table 310 to prevent cutting of the semiconductor guide tape ss.
但是，在放置於檢查工作台310的狀態下，在上述檢查工作台310的基準位置放置的半導體導帶的排列狀態一直處於超出預先確定的基準的狀態。 However, in the state of being placed on the inspection table 310, the alignment state of the semiconductor conduction tape placed at the reference position of the inspection table 310 is always in a state exceeding a predetermined reference.
因此，可執行在上述檢查工作台310放置半導體導帶的狀態下，並非直接向半導體導帶切割部移送檢查工作台310，而是透過上述排列視覺單元220來驗證放置於上述檢查工作台310的半導體導帶的排列狀態的排列狀態驗證步驟。 Therefore, in the state where the semiconductor guide tape is placed on the inspection table 310, the inspection table 310 is not directly transferred to the semiconductor tape cutting section, but the placement on the inspection table 310 can be verified through the arrangement vision unit 220. An alignment state verification step of the alignment state of the semiconductor conduction band.
驗證放置於上述檢查工作台310的半導體導帶的排列狀態的排列狀態驗證步驟，是透過成像上述排列視覺單元來判斷顯示在檢查工作台的基準線和形成於半導體導帶的基準孔等的誤差的大小的方法，是在切割工序中，在切割器沿著檢查工作台的轉移槽進行切割的情況下，分析是否可執行正常切割的步驟。 The alignment state verification step of verifying the alignment state of the semiconductor conduction band placed on the inspection table 310 is to judge the errors such as the reference line displayed on the inspection table and the reference hole formed in the semiconductor conduction band by imaging the alignment vision unit. The method is to analyze whether the normal cutting can be performed in the cutting process when the cutter is cutting along the transfer groove of the inspection table.
在上述檢查工作台上，將半導體導帶個別化為多個半導體封裝件的切割工序在吸附半導體導帶的狀態下執行，因此，在半導體導帶傾斜允許範圍以上的狀態下，若執行切割作業，則整體半導體導帶的吸附狀態會被解除，且無法執行切割工序，因此，透過上述驗證步驟，若 判斷屋內並未充分校正排列狀態的誤差，則透過上述導帶拾取器選擇放置於上述檢查工作台的半導體導帶來向上述排列工作台送回之後，再次執行上述排列狀態檢查步驟、上述工作台排列步驟、上述檢查工作台放置步驟及上述排列狀態驗證步驟。 On the inspection table described above, the cutting process of individually separating the semiconductor conduction band into a plurality of semiconductor packages is performed while the semiconductor conduction band is being adsorbed. Therefore, when the semiconductor conduction band is tilted above the allowable range, the cutting operation is performed. , The adsorption state of the overall semiconductor conduction band will be released, and the cutting process cannot be performed. Therefore, through the above verification step, if it is judged that the error in the alignment state is not sufficiently corrected in the house, the conduction band picker is selected to be placed on the above. After the semiconductor lead of the inspection table is returned to the alignment table, the alignment state inspection step, the alignment table step, the inspection table placement step, and the alignment state verification step are performed again.
即，上述排列視覺單元220成像放置於上述檢查工作台310的半導體導帶的排列狀態之後，在判斷為超出預先設定的誤差的情況下，再次透過上述導帶拾取器250選擇所放置的半導體導帶來向上述排列工作台280移送之後再次執行半導體導帶的排列作業。 That is, after the alignment vision unit 220 images the alignment state of the semiconductor guide belts placed on the inspection table 310, and if it is determined that it exceeds a preset error, the semiconductor guides to be placed are selected again through the guide belt picker 250. After the belt is transferred to the alignment table 280, the alignment operation of the semiconductor tape is performed again.
以往，價差工作台310向設置有用於切割的刀片的切割部的一側移動，利用形成於切割部的上部的視野來確認切割線。若沒有異常，則會執行切割，但是，若在上述半導體導帶切割部400發現無法進行切割作業的排列狀態的誤差，則上述檢查工作台310從切割部再次嚮導帶拾取器250的可選擇的位置移送來校正排列狀態，但是，上述檢查工作台310的移送軌跡變長，且回收半導體導帶的時間也變長，從而引起工序延遲。 Conventionally, the spread table 310 is moved to a side of a cutting section provided with a blade for cutting, and a cutting line is confirmed using a field of view formed at an upper portion of the cutting section. If there is no abnormality, cutting will be performed. However, if an error in the arrangement state of the cutting operation cannot be found in the semiconductor tape cutting section 400, the inspection table 310 guides the optional part of the tape picker 250 again from the cutting section. The position is transferred to correct the alignment state. However, the transfer trajectory of the inspection table 310 is longer, and the time for recovering the semiconductor conduction band is also longer, which causes a delay in the process.
但是，透過形成於導帶拾取器的一側的上述排列視覺單元220驗證完成本發明的半導體導帶排列裝置200及半導體導帶排列方法排列作業的半導體導帶的排列狀態，在超出預先確定的基準的情況下，透過上述導帶拾取器250選擇放置於檢查工作台310的半導體導帶來向排列工作台280回收之後，再次執行上述半導體導帶排列步 驟。 However, the alignment state of the semiconductor guide bands 200 and the semiconductor guide band arrangement method according to the present invention is verified by the above-mentioned arrangement vision unit 220 formed on one side of the guide band picker. In the case of a standard, after the semiconductor guide tape selected on the inspection table 310 is recovered by the guide tape pickup 250 to the alignment table 280, the semiconductor guide tape alignment step is performed again.
上述排列狀態驗證步驟可在上述檢查工作台310放置完成排列作業的半導體導帶的狀態下執行，因此，上述排列狀態驗證步驟透過上述排列視覺單元200成像檢查放置於上述檢查工作台310的半導體導帶的排列狀態，來反復執行驅動，直到檢查結果滿足預先確定的基準。 The above-mentioned alignment state verification step may be performed in a state where the semiconductor guide tapes on which the alignment work is completed are placed on the inspection table 310. Therefore, the alignment state verification step imagingly inspects the semiconductor guides placed on the inspection table 310 through the alignment vision unit 200. The arrangement of the belts is repeatedly performed until the inspection result meets a predetermined reference.
因此，包括本發明的半導體導帶排列裝置200的半導體導帶切割系統1以符合預先確定的基準的方式排列切割物件半導體導帶之後，向半導體導帶切割部移送檢查工作台310來透過切割器來將半導體導帶個別化為多個半導體封裝件之後，透過構成上述半導體封裝件送回部的單位拾取器進行選擇，並透過半導體封裝件洗滌單元進行洗滌，從而裝載於託盤等來送回。 Therefore, after the semiconductor guide tape cutting system 1 including the semiconductor guide tape aligning device 200 of the present invention arranges and cuts the semiconductor guide tape so as to meet a predetermined standard, the semiconductor guide tape cutting unit transfers the inspection table 310 to the semiconductor guide tape cutting section to pass through the cutter. After the semiconductor conductive tape is individually divided into a plurality of semiconductor packages, selection is performed by a unit picker constituting the semiconductor package return section, and the semiconductor package is washed by a semiconductor package washing unit, and then loaded on a tray or the like and returned.
圖5示出本發明的半導體導帶排列方法的方塊圖。 FIG. 5 is a block diagram showing a semiconductor conduction band arrangement method of the present invention.
如上所述，本發明的半導體導帶排列方法可包括：半導體導帶移送步驟S100，在半導體導帶供給部100中，透過夾子210將半導體導帶放置於排列工作台280來進行移送；排列狀態檢查步驟S200，在上部，透過排列視覺單元220對放置於上述排列工作台280的半導體導帶進行下方成像來進行檢查；工作台排列步驟S300，根據上述排列成像步驟的成像結果，在將上述排列成像步驟中成像的半導體導帶放置於上述排列工作台280的狀態下向Y軸方向移送或向θ軸方向旋轉來排列半導體導帶；以及，檢 查工作台放置步驟S400，透過導帶拾取器250選擇在上述工作台排列步驟中排列的半導體導帶來向X軸方向移送並進行排列之後，將其放置於檢查工作台310。 As described above, the semiconductor conduction band arrangement method of the present invention may include the semiconductor conduction band transfer step S100. In the semiconductor conduction band supply unit 100, the semiconductor conduction band is placed on the alignment table 280 through the clip 210 for transfer; the alignment state In the inspection step S200, in the upper part, the semiconductor guide tape placed on the alignment table 280 is imaged downward through the alignment vision unit 220 to perform inspection. The alignment step S300 is based on the imaging results of the alignment imaging step, and the above alignment is performed. The semiconductor guide tape imaged in the imaging step is placed in the above-mentioned alignment table 280 while being transferred to the Y-axis direction or rotated in the θ-axis direction to arrange the semiconductor guide belt; and, the inspection table placement step S400 is passed through the guide belt pickup 250 After the semiconductor tapes selected in the above-mentioned stage alignment step are selected and transferred in the X-axis direction and aligned, they are placed on the inspection stage 310.
並且，上述檢查工作台放置步驟S400中，還可包括排列狀態驗證步驟S500，透過上述排列視覺單元220驗證放置的上述半導體導帶的排列狀態，在上述排列狀態驗證步驟S500中，在步驟S600中判斷排列狀態無法滿足預先設定的基準的情況下，透過上述導帶拾取器選擇放置於上述檢查工作台310的半導體導帶來向上述排列工作台280送還的半導體導帶送還步驟S700之後，再次執行上述排列狀態檢查步驟S200、上述工作台排列步驟S200、上述檢查工作台放置步驟S400、上述排列狀態驗證步驟。 In addition, the inspection table placement step S400 may further include an alignment state verification step S500, and the arrangement state of the semiconductor conduction bands is verified through the alignment vision unit 220. In the alignment state verification step S500, in step S600, In the case where it is determined that the alignment state cannot meet the preset reference, the semiconductor guide tape placed on the inspection table 310 is selected through the guide belt picker, and the semiconductor guide tape returned to the alignment table 280 is returned to step S700, and then the above is performed again. The arrangement state checking step S200, the above-mentioned table arrangement step S200, the above-mentioned inspection table placing step S400, and the above-mentioned arrangement state verification step.
而且，放置於上述檢查工作台的半導體導帶一直透過上述排列視覺單元進行成像檢查，因此，上述排列狀態驗證步驟中，直至放置於上述檢查工作台的半導體導帶的排列狀態滿足預先確定的基準一直反復執行。 Moreover, the semiconductor guide tape placed on the inspection table has been subjected to imaging inspection through the arrangement vision unit. Therefore, in the arrangement state verification step, until the arrangement state of the semiconductor guide tape placed on the inspection table satisfies a predetermined reference. Repeatedly.
參照本發明的較佳實施例，對本發明進行了說明，在不超出本發明的思想及區領域的範圍內，對應技術領域的普通技術人員可對本發明進行多種校正及變更。因此，只要變形的實施基本包括發明要求保護範圍的結構要素，則均屬於本發明的技術範圍。 The present invention has been described with reference to the preferred embodiments of the present invention, and those skilled in the art in the corresponding technical field can make various corrections and changes to the present invention without departing from the scope and spirit of the present invention. Therefore, as long as the implementation of the deformation basically includes structural elements within the scope of protection claimed by the invention, they all belong to the technical scope of the present invention.
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