KR100639399B1 - Pick and place apparatus for semiconduct - Google Patents

Abstract

A semiconductor processing apparatus is provided to eliminate the necessity of an additional process for adjusting an absorption reference point by disposing an ejector and a rotary picker in the same axis and by aligning a package on a wafer frame by a relative movement with a work table. A wafer frame(W) supplied from an on-loading unit is placed on a work table(200). An ejector separates a process material on the wafer frame placed on the work table into individuals. A rotary picker picks up the process material from the work table. The ejector and the rotary picker are disposed in the same axis. The processed material on the wafer frame is aligned by a relative movement with the work table. The ejector and the rotary picker are incorporated to be capable of transferring in the X-axis or Y-axis direction. The work table is installed to be capable of transferring in the Y-axis or X-axis direction, aligning the processed material on the wafer frame.

Description

Semiconductor Processing Equipment {PICK AND PLACE APPARATUS FOR SEMICONDUCT}

1 is a plan view showing a schematic configuration of a conventional semiconductor processing system;

2 is a plan view showing an arrangement relationship of a semiconductor system to which a semiconductor processing apparatus according to a first embodiment of the present invention is applied;

3 is a perspective view showing a semiconductor processing apparatus according to a first embodiment of the present invention;

4 is a front view illustrating the semiconductor processing apparatus shown in FIG. 3;

FIG. 5 is a side view illustrating the semiconductor processing apparatus shown in FIG. 3;

FIG. 6 is a front view illustrating a state in which an alignment vision photographs a workpiece on a wafer frame seated on a work table through a reflector in the semiconductor processing apparatus shown in FIG.

7A to 7G are front views illustrating the operating state of the semiconductor processing apparatus shown in FIG.

8 is a perspective view showing a semiconductor processing apparatus according to a second embodiment of the present invention;

FIG. 9 is a side view illustrating the semiconductor processing apparatus shown in FIG. 8;

10 is a side view showing a semiconductor processing apparatus according to a third embodiment of the present invention,

Fig. 11 is a side view showing a semiconductor processing apparatus according to the fourth embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

100: on-loading unit 110: magazine

120: gripper 200: worktable

210: table main body 220: clamping device

230: first guide member 232: first guide rail

234: first ball screw 236: first drive motor

240: second guide member 242: second guide rail

244: second bolts 246: second drive motor

248: second nut 250: moving plate

300: ejector 310: ejector body

320: ejector pin 400: rotary picker

410: lifting block 420: rotation motor

430: rotating plate 440: rotary picker head

450: alignment vision 460: inspection vision

500: transport picker 600: offloading unit

W: Wafer frame P, P1, P2, P3: Package

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor processing apparatus, and more particularly, to a semiconductor processing apparatus that separates and processes a workpiece attached to a wafer frame.

In general, semiconductor chips are manufactured by forming circuits such as IC and LSI in a plurality of regions arranged in a lattice on a surface of a disk-shaped semiconductor wafer, and each region in which these circuits are formed is cut along a predetermined cutting line. do.

In addition, in recent years, WLP (Wafer Level Package) technology has been developed to realize a significant cost reduction by eliminating the need for wire bonding and plastic packaging, and shortening an additional assembly process. The WLP (Wafer Level Package) method is different from the conventional package method of chip cutting → PCB circuit board attachment → wire bonding (gold wire connection) → plastic packaging → ball attachment process. It is produced by the attachment process.

Such a wafer level semiconductor chip or package is usually attached to a wafer frame on which an adhesive tape is mounted and cut individually. The semiconductor chip or package cut in this manner is separated by an individual semiconductor processing device (Pick and Place Apparatus) and then offloaded by a predetermined transfer means.

This conventional semiconductor processing apparatus is shown in FIG.

As shown in FIG. 1, the conventional semiconductor processing apparatus includes an onloading unit 100 for supplying a wafer frame to which a workpiece cut separately is attached, and a wafer frame supplied from the onloading unit 100 is seated. The work table 200 to be separated, the ejector 300 for separating the workpiece on the wafer frame seated on the work table 200, and the workpiece is adsorbed from the work table 200 and then transferred to the process progress direction Vision inspection comprising a transfer picker 500, a temporary loading device 610 for temporarily loading a workpiece delivered from the transfer picker 500, and upper and lower inspection visions (612, 614) for photographing the state of the workpiece. A unit, a sorting picker 620 for absorbing and transporting a workpiece from the temporary loading device 610 of the vision inspection unit, and an offloading unit 600 in which a workpiece is loaded according to the inspection result of the vision inspection unit. Configured There. In addition, an alignment vision 450 for photographing the alignment of the workpiece on the wafer frame seated on the work table 200 is installed on the moving block of the transfer picker 500. As described above, in the conventional semiconductor processing apparatus, the ejector 300 and the work table 200 are designed to move independently of each other.

In the conventional semiconductor processing apparatus configured as described above, the ejector 300 and the transfer picker 500 move independently of each other to match the adsorption reference point according to the inspection result of the alignment vision 450, and the working table 200 ) Moves independently on the X-axis and / or Y-axis to align the workpiece, and then the transfer picker 500 descends to adsorb the workpiece separated by the ejector 300 from the wafer frame. It works.

Therefore, in the conventional semiconductor processing apparatus, since the ejector 300, the transfer picker 500, and the work table 200 move independently of each other on the X axis and / or the Y axis to align the workpieces, their adsorption reference points are adjusted. It was not easy to fit, which often caused the workpiece to be seated on the work table 200 unstablely picked up by the transfer picker 500.

In addition, in the conventional semiconductor processing apparatus, the alignment vision 450 photographs the alignment of the workpiece on the wafer frame seated on the work table 200, and then aligns the workpiece according to the result. Since the transfer picker 500 is configured to absorb the workpieces one by one, the package pick-up operation cannot be performed while photographing the alignment of the workpieces on the wafer frame seated on the work table 200.

In addition, the workpieces adsorbed by the transport picker 500 is inspected for the package because the size, height, attachment position and shape of the ball attached to the package is inspected in a state of being temporarily seated in the temporary loading device 610. A separate additional process was required for this purpose, and thus the semiconductor chip or package was more likely to be damaged or damaged when it is seated in the temporary loading device 610 or adsorbed from the temporary loading device 610.

In addition, if the workpiece has to be turned upside down before and after the process to check the marking status of the workpiece, or if the finished package has to be loaded upside down on trays, tubes, reels, etc. There was a problem in that additional furring device must be installed.

The present invention has been proposed to solve the above-mentioned conventional problems, an object of the present invention is a semiconductor having a structure that can quickly and accurately absorb the workpiece attached to the wafer frame seated on the worktable 200 It is to provide a treatment device.

Another object of the present invention is to provide a semiconductor processing apparatus capable of simultaneously performing alignment, inspection of defects, and flipping operations on a workpiece attached to a wafer frame.

In order to achieve the above object, a semiconductor processing apparatus according to the present invention includes an ejector for separately separating a worktable on which a wafer frame supplied from an onloading unit is seated, and a workpiece on a wafer frame seated on the worktable; And a rotary picker for picking up a workpiece from the work table, wherein the ejector and the rotary picker are disposed coaxially, and the work piece on the wafer frame is aligned by relative movement with the work table.

Here, the ejector and the rotary picker are fixedly arranged on the coaxial, the worktable is installed to be movable in the X-axis and Y-axis to align the workpiece on the wafer frame.

On the other hand, the worktable is fixedly installed, the ejector and the rotary picker may be integrally coupled and installed to be movable in the X-axis and Y-axis to align the workpiece on the wafer frame.

On the other hand, the ejector and the rotary picker is integrally coupled to be installed to move in the X-axis or Y-axis, the work table is installed to be movable in the Y-axis or X-axis, respectively, to be configured to align the workpiece on the wafer frame Can be.

The ejector and the rotary picker may be installed to face each other at both ends of the 'c' shaped coupling frame.

The rotary picker is rotatably installed about the Y axis, and includes four rotary picker heads for sucking the workpiece at intervals of 90 degrees in the radial direction.

One side of the rotary picker is further provided with an alignment vision for photographing the alignment of the workpiece on the wafer frame seated on the work table, the front side of the rotary picker is further provided with a reflector, the rotary picker is The alignment of the workpiece on the wafer frame seated on the worktable can be taken while rotating the workpiece.

One side of the rotary picker may further include an inspection vision for photographing a state of one surface of the workpiece already adsorbed to the rotary picker while the rotary picker adsorbs the workpiece on the wafer frame seated on the work table.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

In describing the embodiments according to the present invention, the components described in the prior art and the preceding embodiments are given the same names and the same reference numerals, and detailed description thereof will be omitted. In addition, symmetrically arranged or plural components will be described with reference numerals only for one of them for convenience of expression. In addition, below, the case where a package is a to-be-processed object is demonstrated as an example.

First, a semiconductor processing apparatus according to a first embodiment of the present invention will be described.

FIG. 2 is a plan view showing an arrangement relationship of a semiconductor system to which a semiconductor processing apparatus according to a first embodiment of the present invention is applied, FIG. 3 is a perspective view showing a semiconductor processing apparatus according to a first embodiment of the present invention, and FIG. 3 is a front view showing the semiconductor processing apparatus shown in FIG. 3, FIG. 5 is a side view showing the semiconductor processing apparatus shown in FIG. 3, and FIG. 6 is a work table in which the alignment vision is reflected through a reflector in the semiconductor processing apparatus shown in FIG. It is a front view which shows the state which image | photographs the to-be-processed object on the wafer frame seated in the.

2 to 5, the semiconductor processing system to which the semiconductor processing apparatus according to the first embodiment is applied is largely on-loading unit 100, work table 200, ejector 300, rotary picker 400 , The transport picker 500 and the offloading unit 600 are configured.

The onloading unit 100 is an element for supplying a wafer frame W having a package attached thereto to the work table 200. The on-loading unit 100 includes a magazine 110 in which a wafer frame W is stacked, and a gripper 120 that grips the wafer frame W from the magazine 110 and loads the wafer frame W into the work table 200. Consists of. The gripper 120 is installed to be movable along the gripper rail 122 installed in the Y-axis direction.

3 to 5, the work table 200 is an element on which the wafer frame W supplied from the onloading unit 100 is seated. The work table 200 has a table main body 210 having a seating unit 212 on which the wafer frame W is mounted, and a wafer frame W seated on the seating unit 212. The clamping device 220, the first moving means for moving the table body 210 in the Y-axis direction and the second moving means for moving the table body 210 in the X-axis direction.

The first moving means is formed on a pair of first guide members 230 formed at both ends of the lower portion of the table body 210, and at both ends of the upper portion of the movable plate 250 disposed below the table body 210. And a first ball screw 234 coupled to a pair of first guide rails 232 guiding the first guide member 230 and a first nut (not shown) formed at one side of the table body 210. It is composed of a first drive motor 236 that provides an operating force to). The second moving means includes a pair of second guide members 240 formed at both ends of the lower portion of the movable plate 250, and a pair of second guide members 240 formed at the base 102 to guide the second guide member 240. The second guide rail 242, and the second drive motor 246 for providing an actuation force to the second ball screw 244 coupled to the second nut 248 formed on one side of the movable plate 250 have. On the other hand, if the first and second moving means 240 can move the table body 210 in the Y-axis and X-axis, respectively, various well-known linear movement in addition to the ball screw-nut combination shown in this embodiment It may be replaced by means.

4 to 5, the ejector 300 is an element that separates the packages on the wafer frame W seated on the work table 200 individually. The ejector 300 is an ejector body 310 disposed below the work table 200 and an ejector pin movably installed on the ejector body 310 to directly push a package on the wafer frame W ( 320, and a pin driving means (not shown) for providing a moving force to the ejector pin (320). Here, the ejector pin 320 is designed to move up and down coaxially with the rotary picker head 440 of the corresponding rotary picker 400. On the other hand, the pin driving means (not shown) may be used a known driving device, such as cam drive, ball screw drive, step motor.

As shown in Figures 3 to 5, the rotary picker 400 is an element that is inverted by the rotation operation after the suction of the package from the work table 200. The rotary picker 400 has a lifting block 410 installed to be able to move up and down along a vertical guide rail 104 installed perpendicularly to the base 102, and a rotating motor 420 installed at the lifting block 410. And a rotary plate 430 provided at the front of the rotary motor 420 and four rotary picker heads 440 provided at intervals of 90 degrees in the radial direction to the rotary plate 430. The rotary picker 400 is designed such that the rotary picker head 440 located at the lower portion of the drawing moves in the Z-axis direction coaxially with the ejector pin 320.

The rotary motor 420 is controlled to rotate the rotary picker head 440 about the Y axis at 90 degree intervals. In addition, the rotary picker 400 is controlled such that the lifting and lowering is repeated periodically in the Z-axis direction by known lifting and lowering driving means.

As shown in FIG. 6, in the vicinity of the rotary picker 400, the alignment state of the package on the wafer frame W seated on the work table 200 while the rotary picker 400 picks up and rotates the package. Alignment inspection device for photographing is installed. The alignment inspection apparatus includes a reflector frame 452 installed on the side frame 106 fixed to the base 102, a reflector 454 installed at an angle of about 45 degrees downward to the reflector frame 452, and Arranged to face the rotary picker head 440 of the rotary picker 400 on the side frame 106 fixed to the base 102 to align the package on the wafer frame (W) through the reflector 454 It is composed of a vision 450. That is, when the rotary picker head 440 located in the lower part of the drawing is absorbing the package from the work table 200, the inspection path of the alignment vision 450 is determined by the rotary picker head 440 located in the left part of the drawing. When the rotary picker head 440 located in the lower portion of the drawing is rotated counterclockwise in the drawing while absorbing the package, the inspection path of the alignment vision 450 is opened through the reflector 454. While the rotary picker 400 picks up and rotates the package, the alignment of the package on the wafer frame W seated on the work table 200 is photographed. Therefore, in this embodiment, the package alignment operation and the package adsorption operation are performed at the same time. According to the photographing result of the alignment vision 450, the worktable 200 moves properly in the X-axis and Y-axis directions to align the packages, so that the rotary picker 400 correctly adsorbs the next package without errors. You can do it.

On the other hand, depending on the design conditions, the alignment vision 450 is installed on one side of the work table 200 so as not to interfere with the rotation operation of the rotary picker 400 without the reflector 454, the work table ( It may be designed to photograph the alignment of the package on the wafer frame seated on 200).

In addition, the rotary picker 400 located at the lower side on the other side of the rotary picker 400 while the rotary picker head positioned at the right side in the drawing while the package on the wafer frame seated on the work table 200 is absorbed. An inspection vision 460 for photographing the state of one surface of the package adsorbed to 440 is provided. Here, the inspection vision 460 inspects the marking state of the opposite side of the adsorption of the package, as well as checking the chipping, orientation, position, etc. Axial and Y-axis corrections provide relevant information to ensure proper suction of the package.

Meanwhile, the number and attachment positions of the rotary picker heads 440 attached to the rotary picker 400 may be changed in various ways according to design conditions. In addition, as a configuration for adsorbing a package, the rotary picker head 440 may be designed to be directly lowered and lowered in the Z-axis direction instead of the rotary picker 400 being designed to be lowered in the Z-axis direction. .

The transport picker 500 is installed on the rotary picker 400 so as to be movable in X, Y, and Z-axis directions by the rotary picker 400 according to an inspection result of the inspection vision 460. It is an element that picks up the inverted package and transfers it to the offloading unit 600.

The offloading unit 600 is an element that vision-tests the package delivered from the transport picker 500 and loads it according to the result. The offloading unit 600 may be changed in various forms such as a reel type and a tray type according to design conditions.

Hereinafter, an operating state of the semiconductor processing apparatus according to the first embodiment will be described.

7A to 7G are front views illustrating the operating state of the semiconductor processing apparatus shown in FIG. For reference, each component and package shown in FIGS. 7A to 7G is schematically shown for ease of understanding and is shown to be different from the actual size and ratio. The packages are represented by P1, P2 and P3 in the adsorption order.

First, the gripper 120 grips the wafer frame W loaded in the magazine 110 and loads the work table 200 (see FIG. 7A). In this state, the ejector pin 320 is raised to separate the package on the wafer frame W, and at the same time, the rotary picker 400 is lowered so that the rotary picker head 440 located at the lower part of the drawing is the wafer frame W. The package P1 on the bed is adsorbed (see FIGS. 7B and 7C).

Next, when the rotary picker 400 rotates counterclockwise on the drawing and rotates about 45 degrees, the inspection path of the alignment vision 450 is opened through the reflector 454. Therefore, the alignment vision 450 photographs the alignment of the new package P2 on the wafer frame W seated on the work table 200 through the reflector 454 (see FIG. 7D). As described above, according to the photographing result of the alignment vision 450, the work table 200 moves on the X-axis and / or Y-axis to perform alignment of the package P2.

Next, when the rotary picker 400 continues to rotate counterclockwise and rotates about 90 degrees, the inspection vision 460 installed on the right side of the rotary picker 400 in the drawing is absorbed by the rotary picker head 440 ( Photograph the marking status, orientation, and position of P1). At this time, the rotary picker head 440 located in the lower portion of the drawing will correctly suck the aligned new package P2 (see FIG. 7E).

Next, when the rotary picker 400 continues to rotate in the counterclockwise direction and rotates about 180 degrees, the package P1, which has completed the marking inspection and the like, is inverted and positioned at the top of the rotary picker 400. At this time, the rotary picker head 440 located in the lower portion of the drawing is to correctly suck the new package (P3) after the work table 200 is moved according to the inspection result of the alignment vision 450, The package P2 adsorbed on the rotary picker head 440 located on the right side is photographed by the inspection vision 460 in a marking state (see FIG. 9F).

Next, the inverted package P1 is sequentially adsorbed to the transport picker 500 (see FIG. 9G), and the inverted packages P1, P2, P3,, to all transport picker heads of the transport picker 500. Are adsorbed to the offloading unit 600.

Therefore, in the semiconductor processing apparatus according to the first embodiment, the workpiece to be seated on the work table 200 is fixed because the ejector 300 and the rotary picker 400 are coaxially fixed so that the suction reference point is always aligned. Can be picked up stably. In addition, since the rotary picker 400 sucks the package attached to the wafer frame W and rotates, the alignment, marking inspection, and flippering of the package are simultaneously performed. The equipment and processing process has been simplified and the package processing time has been significantly reduced.

Hereinafter, a semiconductor processing apparatus according to a second embodiment of the present invention will be described.

8 is a perspective view showing a semiconductor processing apparatus according to a second embodiment of the present invention, and FIG. 9 is a side view showing the semiconductor processing apparatus shown in FIG.

8 and 9, the configuration and operation of the semiconductor processing apparatus according to the second embodiment are basically the same as those of the first embodiment. However, the ejector 300 and the rotary picker 400 are installed to face each other at both ends of the 'c' shaped coupling frame 340. On the other hand, the coupling frame 340 may be designed to move up and down in the Z-axis direction, the coupling frame 340 is fixed to the base 102, the ejector pin 320 and the ejector 300 of the The rotary picker head 440 of the rotary picker 400 may be designed to move up and down in the Z-axis direction.

As such, the ejector 300 and the rotary picker 400 are manufactured as one bundle in the 'c' shaped coupling frame 340, so that the ejector pin 320 and the rotary picker 400 of the ejector 300 are formed. The suction reference point of the rotary picker head 440 can be easily adjusted.

Hereinafter, a semiconductor processing apparatus according to a third embodiment of the present invention will be described.

10 is a side view showing a semiconductor processing apparatus according to a third embodiment of the present invention.

As shown in Fig. 10, the configuration and operation of the semiconductor processing apparatus according to the third embodiment are basically the same as those of the first embodiment. Unlike the first embodiment, the work table 200 is fixedly installed on the fixed frame 108 installed perpendicular to the base 102, and the ejector 300 and the rotary picker 400 have a '-' shape. The coupling frame 340 is coupled to one bunch. Here, the coupling frame 340 is provided with a first frame moving means which is the X-axis direction moving means, and a second frame moving means that is the Y-axis direction moving means.

The first frame moving means includes a pair of first frame guide members 342 formed at both ends of the lower portion of the coupling frame 340 and an upper portion of the frame moving plate 350 disposed below the coupling frame 340. A pair of first frame guide rails 344 formed at both ends and guiding the first frame guide member 342, and coupled to a first frame nut (not shown) formed at one side of the coupling frame 340. It is composed of a first frame drive motor (not shown) that provides an operating force to the first frame ball screw (not shown). The second frame moving means is a pair of second frame guide member 352 formed on both ends of the lower frame moving plate 350 and the base 102 to form the second frame guide member 352 A pair of guiding second frame guide rail 354 and a second frame ball screw 356 coupled to a second frame nut (not shown) formed on one side of the frame moving plate 350 to provide an operating force The second frame driving motor 358 is configured. On the other hand, if the first and second frame moving means can move the coupling frame 340 to the X-axis and Y-axis, respectively, various well-known linear movement means in addition to the ball screw-nut combination shown in this embodiment Can be replaced with

That is, in the present embodiment, the working table 200 is configured to move the bundle of the ejector 300 and the rotary picker 400 in a fixed state to align the packages according to the inspection result of the alignment vision 450. .

Hereinafter, a semiconductor processing apparatus according to a fourth embodiment of the present invention will be described.

11 is a side view showing a semiconductor processing apparatus according to the fourth embodiment of the present invention.

As shown in Fig. 11, the configuration and operation of the semiconductor processing apparatus according to the fourth embodiment are basically the same as those of the first embodiment. However, the ejector 300 and the rotary picker 400 are coupled to one bundle to the 'c' shaped coupling frame 340 and installed in a movable direction in the X-axis direction, and the work table 200 is Y It is installed to be movable in the axial direction.

That is, the ejector 300 and the rotary picker 400 are moved in the X-axis direction, and the work table 200 is moved in the Y-axis direction to align the packages according to the inspection result of the alignment vision 450. It is configured to.

On the other hand, depending on the design conditions, the ejector 300 and the rotary picker 400 is coupled to one bundle in the 'c' shaped coupling frame 340 is installed to be movable in the Y-axis direction, the work table The 200 may be installed to be movable in the X-axis direction.

In this embodiment, since the work table 200 is installed to be movable only in one direction, design freedom may be increased when additional equipment is to be arranged.

As in the above example, the present invention may be variously applied using the same principle by appropriately modifying the above embodiments. Therefore, it should be interpreted that the above description does not limit the scope of the present invention, which is defined by the limits of the following claims. That is, in the present embodiments, examples applied to pick and place equipment for separately separating and transporting semiconductor packages are disclosed. However, the present invention is not limited thereto and may be applied to LCD and PDP processing equipment. In addition, in the present embodiment, an example in which a wafer level package is used as a workpiece is disclosed, but it should be interpreted that it belongs to the scope of the present patent even when a semiconductor chip or other similar products are processed.

As described above, in the semiconductor processing apparatus according to the present invention, the ejector and the rotary picker are coaxially arranged, and a process for aligning the adsorption reference point is necessary because the packages on the wafer frame are aligned by relative movement with the worktable. Not, it is possible to reliably pick up the workpiece seated on the work table 200.

In addition, since the marking inspection of the package is simultaneously performed while the package is rotated while being sucked by the rotary picker, there is no need to install a separate temporary loading device for marking inspection of the workpiece. In addition, in the semiconductor processing apparatus according to the present invention, an alignment vision 450 installed on one side of the rotary picker while the package is rotated while being sucked by the rotary picker is aligned with the workpiece on the wafer frame seated on the work table 200. Since it is configured to photograph the state, the design freedom with respect to the installation position of the alignment vision is improved, it is possible to effectively arrange the components. In addition, in the semiconductor processing apparatus according to the present invention, since it is easily reversed by the rotary operation of the rotary picker, a separate flippering device is required even when the workpiece is to be flipped before and after the process according to its characteristics and manufacturing process during various processes. There is no need to install additional.

As described above, in the semiconductor processing apparatus according to the present invention, the alignment, marking inspection and flippering of the package are simultaneously performed while the rotary picker adsorbs the package attached to the wafer frame and is rotated. This simplifies the overall equipment and processing process and significantly shortens the package handling time.

Claims (8)

A worktable on which the wafer frame supplied from the onloading unit is seated; An ejector for separately separating the workpieces on the wafer frame seated on the work table; A rotary picker for picking up a workpiece from the work table; And the ejector and the rotary picker are coaxially arranged, and the workpieces on the wafer frame are aligned by relative movement with the work table. The method of claim 1, And the ejector and the rotary picker are fixedly disposed coaxially, and the worktable is movably installed on the X and Y axes to align the workpiece on the wafer frame. The method of claim 1, The work table is fixedly installed, and the ejector and the rotary picker are integrally coupled to each other, and are movably installed in the X-axis and the Y-axis so as to align the workpiece on the wafer frame. The method of claim 1, The ejector and the rotary picker are integrally coupled to be installed to be movable in the X-axis or the Y-axis, and the worktable is installed to be movable in the Y-axis or the X-axis, respectively, to align the workpiece on the wafer frame. Semiconductor processing apparatus. The method according to any one of claims 2 to 4, The ejector and the rotary picker is a semiconductor processing apparatus, characterized in that installed on each opposite end of the '' 'shaped coupling frame opposite each other. The method according to any one of claims 1 to 4, The rotary picker is rotatably installed around the Y axis, and the semiconductor processing apparatus comprises four rotary picker heads for adsorbing the workpieces at intervals of 90 degrees in the radial direction. The method according to any one of claims 1 to 4, One side of the rotary picker is further provided with an alignment vision for photographing the alignment of the workpiece on the wafer frame seated on the work table, a front side of the rotary picker is further provided with a reflector, And an alignment state of the workpiece on the wafer frame seated on the work table while the rotary picker sucks and rotates the workpiece. The method according to any one of claims 1 to 4, One side of the rotary picker is further provided with an inspection vision for photographing the state of one surface of the workpiece already adsorbed on the rotary picker while the rotary picker adsorbs the workpiece on the wafer frame seated on the work table. Semiconductor processing apparatus.

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