KR101619312B1

KR101619312B1 - Parts feeder of Chip mounter

Info

Publication number: KR101619312B1
Application number: KR1020090113888A
Authority: KR
Inventors: 한정일
Original assignee: 한화테크윈 주식회사
Priority date: 2009-11-24
Filing date: 2009-11-24
Publication date: 2016-05-13
Also published as: KR20110057466A

Abstract

A die supply apparatus for a component sealant according to the present invention comprises a wafer supply unit installed in a main body and configured to pick up any one of a plurality of wafers to be moved to a work area, A wafer stage which is placed movably in the X and Y axes, a wafer stage which is placed movably in the X and Y axes, a die of the wafer placed on the wafer stage is adsorbed and separated, and a lower side of the die is positioned by rotation, A die supply unit for moving the die from the die supply unit to the start position, and a pair of dies for transferring one of the dies transferred from the die supply unit to the mounting area, Shuttle.

Parts, wafer, supply, die, shuttle

Description

Parts feeder of Chip mounter

The present invention relates to a die supply apparatus, in particular, it is possible to reduce the waiting time of a pick-up head through a circulating operation of a pair of die shuttles, and simultaneously mount a plurality of dies when a plurality of dies are applied to a component mounting machine The present invention relates to a die feeder for a component die having a wide range of use because the productivity can be improved and the installation direction of the die can be changed according to the type of the die bonding operation.

2. Description of the Related Art In general, a semiconductor manufacturing process includes a fab (FAB) process for forming a plurality of semiconductor chips on a semiconductor wafer, a semiconductor fabrication process for separating a plurality of semiconductor chips formed in the fab process, package assembly process.

The assembly process includes a wafer mounting process for attaching an adhesive tape to the back surface of the wafer to prevent the semiconductor chips from being separated when the wafer is subjected to a sawing process and a wafer mounting process using a diamond cutter, A wafer sawing process for separating a plurality of semiconductor chips from each other, and a chip bonding process for picking up individual semiconductor chips and bonding them to a printed circuit board or the like.

Among the above processes, the chip bonding process is performed by the bonders. The bonders include a die bonder, a wire bonder, and a flip chip bonder. Normally, the die bonder and the wire bonder are used continuously, and the flip chip bonder is used separately.

Here, the die bonder refers to a device for picking up a semiconductor chip (also referred to as a " die ") manufactured by a semiconductor chip manufacturing process and bonding the same to a printed circuit board or the like. Refers to a device for bonding leads formed on a circuit board to each other with a wire such as a gold wire. The flip chip bonder is formed by forming a solder bump on a pad which is an input / output terminal of a semiconductor chip and then turning the semiconductor chip upside down to form a circuit pattern such as a carrier substrate or a circuit tape Pattern) directly to the device.

BACKGROUND ART Conventional die bonding apparatuses include a pick-up stage that loads a wafer loaded from an unloaded wafer from a wafer magazine (wafer cassette) and inspects the state of the die and the position corresponding to this state, An alignment stage in which the die is fixedly mounted on a mount head and the die is fixed and aligned on the mount head; a die transfer device for transferring the die from the die pick-up stage to the alignment stage; A guide rail for transferring a printed circuit board having a plurality of unit substrates from the substrate magazine to a die bonding position near the alignment stage and a bonding head for bonding the die mounted on the mount head to the lower surface of the unit substrate, And the state of the die Storing the position corresponding to this state, and is composed of the alignment such as the stay support and the die and transfer control unit for controlling parts of the bonding head.

However, since the above-described conventional die nodule device is used in a component mounting machine by a single device, there is a disadvantage in that the type of the wafer to be supplied is limited to one kind, and the mounting position of the die, which varies depending on the type of work, The use was limited. Further, since the die component is supplied to one shuttle, there is a disadvantage that the waiting time of the pick-up head becomes long.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide a component space in which a pair of a die shuttle is circulated to a mounting area and a die feed position, The first purpose is to provide a long-term die feeder.

The present invention can be applied to a component mounting apparatus having a plurality of pick-up heads in a case where a plurality of pick-up heads are provided, so that wafers and die components of different sizes can be supplied at the same time, The second purpose is to provide.

It is also a third object of the present invention to provide a die feeder for a component die capable of varying the installation direction of the die during the process according to the type of die, and simultaneously applying the same to various die processes.

According to an aspect of the present invention, there is provided a die supply apparatus for a component sealant, comprising: a wafer supply unit installed in a main body and configured to pick up one of a plurality of wafers to be moved to a work area; A wafer stage in which the wafer moved by the wafer stage is placed so as to be movable in the X and Y axes, a wafer stage on which a wafer is placed, A die supply unit for moving the die to a transfer start position after one of the dies is moved to a mounting area after one of the dies moved from the die supply unit is moved to the mounting area, And a pair of die shuttles for moving the die to receive the die.

The wafer supply unit includes a wafer cassette installed in the main body and configured to position a plurality of wafers stacked in a predetermined height through a sequence of elevating and lowering movements and a wafer cassette for picking up any one of the wafers loaded on the wafer cassette And a wafer transferring portion for transferring the wafer.

The wafer cassette, the wafer supply unit, the wafer stage, the die supply unit, and the pair of die shuttles are preferably provided in the main body in a plurality of units.

The die supply unit includes a main pickup unit for sucking and separating the die of the wafer at an upper portion of the wafer stage and for positioning the lower surface of the die by rotation, And a die transfer section for sucking again at the top and aligning the die with at least one of the pair of die shuttles through X and Y axis movements.

The die supply unit further includes an auxiliary pick-up unit for picking up the die positioned on the lower side by rotation of the main pick-up unit and then reversing the die by rotation to return the die to the original direction, It is preferable that the picker adsorbs the die attracted to the auxiliary pick-up portion and aligns them with the pair of die shuttles.

The main body may further include a conveyor unit that receives the mounted substrate from the flip chip mounter and discharges the processed substrate to a next process.

The pair of die shuttles includes a guide shaft having a length in the body and the component mounting machine, a drive motor provided on the guide shaft for transmitting a drive force, and a drive motor And a die aligning portion on which the die is aligned.

As described above, according to the present invention, the waiting time of the pick-up head is shortened by making the pair of the die shuttles circulate to the mounting area and the die feed position, So that the mounting speed and productivity can be improved.

Further, by varying the installation direction of the die depending on the type of the process, it is possible to apply the process to various processes at the same time, thereby providing a wide range of use.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In describing the present invention, the defined terms are defined in consideration of the function of the present invention, and should not be understood in a limiting sense of the technical elements of the present invention.

Fig. 1 is a plan view schematically showing a die feeder of a component seal according to the present invention, Fig. 2 is a first operating state diagram according to Fig. 1, Fig. 3 is a second operating state diagram according to Fig. 3 is a third operational state diagram according to Fig.

1 to 4, a die feeder 100 according to the present invention includes a main body 200, a wafer supply unit 300, a wafer stage 400, a die supply unit 500, And a pair of die shuttles 600. Further, a conveyor unit 700 for discharging the substrate P transferred from the component body 10 may be further included.

The main body 200 is installed on one side of the component body 10 and a wafer supply unit 300, a wafer stage 400, a die supply unit 500, a die shuttle 600, (700). Here, the wafer supply unit 300, the wafer stage 400, the die supply unit 500, and the pair of die shuttles 600 may be installed in the main body 200 in a plurality of units.

The wafer supply unit 300 includes a wafer cassette 310 installed in the main body 200 for positioning the plurality of wafers S in a predetermined height through a sequential up and down movement, And a wafer transfer section 320 for picking up any one of the wafers S and moving the wafer S to the work area. Here, the wafer cassette 310 may be provided with a separate elevating device (not shown) for moving the wafer S up and down.

The wafer transfer section 320 may be formed with a grip section 321 for holding or unfolding a part of the wafer S and the grip section 321 may be formed by a wafer cassette 310 and a guide And can be installed movably by the unit 322. Here, a separate pneumatic device (not shown) may be connected to the grip portion 321 to provide pneumatic pressure.

The wafer stage 400 is for moving the wafer S placed on the upper side in the X and Y axis directions. The wafer stage 400 has a configuration in which the wafer S, which is moved by the wafer supply unit 300, And X and Y axis guide parts 420 'and 420' 'which are installed so as to cross the seating part 410 in the X and Y axis directions and the X and Y axis guide parts 420' And a driving motor 430 for moving the seating part 410 in the X and Y axis directions.

Here, the seating part 410 may be structured such that two first and second seating members 411 and 412 are slidably coupled vertically. That is, the first seating member 411 is movably installed on the X-axis guide portion 420 ', and the Y-axis guide portion 420' 'is provided on one side of the first seating member 411, It is possible to move the member 412 in the Y-axis direction.

The position of the die S 'formed on the surface of the wafer S can be varied when the wafer S loaded on the seating part 410 moves in the X and Y directions.

The die supply unit 500 is configured to suck and separate the die S 'of the wafer S at the top of the wafer stage 400 and to rotate the main pickup unit And the die S 'sucked to the main pick-up unit 510 is again sucked from the upper side and the die S' is inserted into the pair of die shuttles 600 through the movement of the X and Y axes And a die transfer section 520 for aligning the plurality of the semiconductor chips.

The main pick-up unit 510 is installed on the upper part of the main body 200. The main pick-up unit 510 is lowered to suck the die S 'of the lower wafer S, . Then, the main pick-up unit 510 rotates 180 degrees to position the lower surface of the die S 'upward.

To this end, the main pick-up unit 510 is provided with a suction nozzle 511 installed to be rotatable 180 ° about a rotation axis, a driving device 512 for rotating the suction nozzle 511, A separate pneumatic device (not shown) or the like may be connected. Meanwhile, a separate elevating device (not shown) for elevating and lowering the main pickup 510 may be further provided.

The die transfer section 520 is installed to be movable in the X and Y axes by a guide section (not shown) provided on the upper part of the main body 200 and includes a die S ', And then moves to the transport start position where the pair of die shuttles 600 are located.

On the other hand, the die supply unit 500 is provided on the upper part of the main body 200 and sucks the die S 'located on the lower side by the rotation of the main pickup unit 510, And an auxiliary pick-up part 530 which reversely turns the die S 'back in the original direction. At this time, the die transfer unit 520 sucks the die S 'sucked by the auxiliary pickup unit 530 and transfers the sucked die S' to the die shuttle 600 located in the die S 'supply direction among the pair of die shuttles 600 .

That is, the auxiliary pickup unit 530 takes into consideration the installation position of the die S 'depending on the type of work, and after the die S' adsorbed on the main pickup unit 510 is adsorbed from the upper side, .

To this end, the auxiliary pickup unit 530 is provided with a suction nozzle 531 rotatably mounted on a horizontal axis, and a driving unit 532 for transmitting a driving force for moving and rotating the suction nozzle 531 . In addition, a pneumatic device (not shown) may be connected to the adsorption nozzle 531 to provide pneumatic pressure.

The pair of die shuttles 600 includes a guide portion 610 having a length in the main body 200 and the component body 10 and a guide portion 610 provided at one end in the longitudinal direction of the guide portion 610, A motor 620 and a die aligning part 630 which is installed to be movable along the guide part 610 by the rotational force of the drive motor 620 and in which at least one die S ' .

The die aligning portion 630 of the die shuttle 600 is disposed on the die transfer portion 520 side of the die supply unit 500 while one of the die aligning portions 630 is positioned in the mounting region of the component sealant 10 And the die S 'is aligned. That is, the pair of die aligning parts 600 are circulatively moved in opposite directions to shorten the waiting time of the pick-up head 11 of the component sealant 10.

The conveyor unit 700 is for transferring the mounted substrate P from the component sealant 10 to the next process and has a structure in which the mounted substrate P transferred from the component sealant 10, At least one transfer roller (not shown) rotatably installed between the pair of backup plates 710, and at least one transfer roller (not shown) rotatably installed on the transfer roller And a transfer belt (not shown) for moving the transferred substrate P in one direction may be provided.

Hereinafter, a process of supplying the die feeder of the component seal according to the present invention will be described.

2 to 4, the wafer transfer unit 320 picks up one wafer S of the wafers S loaded on the wafer cassette 310 and places the wafers S on the wafer stage 400.

Then, the main pick-up unit 510 descends to suck the die S 'of the wafer S, and then ascends and separates. At this time, the main pick-up unit 510 is rotated by 180 degrees so that the lower surface of the die S 'is moved upward.

On the other hand, when the die S 'is to be fed in the forward direction, the auxiliary pick-up unit 530 sucks the upper portion of the die S' rotated by 180 ° and then rotates again by 180 ° to rotate the die S ' As shown in FIG. The operation of the auxiliary pickup unit 530 may be selectively performed as needed.

At this time, after the die transfer unit 520 sucks the die S 'from above, it moves to the transfer start position of the die shuttle 600 and aligns the die S' to the die aligning unit 630. When a plurality of such processes are repeated, a plurality of dies S 'are aligned on the upper portion of the die aligning portion 630. [

Thereafter, when one die aligning portion 630 in which the die S 'are aligned is moved to the mounting region of the component body 10, the other die aligning portion 630 is moved toward the die supplying unit 500 side do. It is possible to continuously supply the die S 'to the mounting region of the component body 10 while repeating such a circulating operation.

Thereafter, the pick-up head 11 of the component body 10 mounts the die S 'aligned on the die shuttle 600 onto the substrate P arranged in the work area. Then, the mounted substrate P is discharged to the next process through the conveyor unit 700 of the die feeder 100. [

As a result, the pair of die shuttles 600 are circulated to the mounting area and the die feed position to shorten the waiting time of the pick-up head, and when a plurality of die shuttles 600 are installed, So that the mounting speed and productivity can be improved.

Further, by varying the installation direction of the die S 'according to the type of the process, it is possible to simultaneously apply the process to various processes, which is advantageous in a wide range of use.

While the present invention has been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

Accordingly, it is a matter of course that various modifications and variations of the present invention are possible without departing from the scope of the present invention. And are included in the technical scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view schematically showing a die feeder of a component seal according to the present invention; Fig.

Fig. 2 is a first operating state diagram according to Fig. 1; Fig.

Figure 3 is a second operating state diagram according to Figure 2;

Figure 4 is a third operating state diagram according to Figure 3;

Description of the Related Art

10: Component part 11: Pick-up head

100: die feeder 200: main body

300: wafer supply unit 310: wafer cassette

320: transferring wafer 400: wafer stage

430: drive motor 500: die feed unit

510: main pick-up unit 520:

530: auxiliary pickup section 600: die shuttle

610: guide portion 620: drive motor

630: die aligner 700: conveyor unit

P: substrate S: wafer

S ': die

Claims

A wafer supply unit installed in the main body, for picking up any one of the plurality of wafers and moving the wafers to a work area;

A wafer stage on which the wafer moved by the wafer supply unit is located, and which is installed movably in X and Y axes;

A die supply unit for sucking and separating a die of the wafer placed on the wafer stage, positioning a lower side of the die by rotation and moving the die to a transfer start position; And

A pair of die shutters for transferring one of the dies transferred from the die supply unit to the mounting area, the other being moved to the die supply unit to receive the die; Wherein the die feed device is a die feed device.

The method according to claim 1,

Wherein the wafer supply unit comprises: a wafer cassette installed in the main body, for positioning a plurality of loaded wafers at a predetermined height through a sequential elevation movement; And

And a wafer transfer unit for picking up any one of the wafers loaded on the wafer cassette and moving the wafers to a work area.

Claim 3 has been abandoned due to the setting registration fee.

3. The method of claim 2,

Wherein the wafer cassette, the wafer supply unit, the wafer stage, the die supply unit, and the pair of die shuttles are installed in the main body in a large number.

Claim 4 has been abandoned due to the setting registration fee.

The method of claim 3,

Wherein the die supply unit comprises: a main pick-up unit for sucking and separating the die of the wafer at an upper portion of the wafer stage and for positioning the lower side of the die by rotation; And

And a die transfer section for sucking the die attracted to the main pick-up section from the upper side and aligning the die with at least one of the pair of die shuttles through X and Y axis movements / RTI >

Claim 5 has been abandoned due to the setting registration fee.

5. The method of claim 4,

The die supply unit further includes an auxiliary pick-up unit for picking up the die positioned on the lower side by rotation of the main pick-up unit and then reversing the wafer by rotation to return the die to the original direction,

Wherein the die transfer section sucks the die sucked by the auxiliary pick-up section and aligns the die with the pair of die shuttles.

Claim 6 has been abandoned due to the setting registration fee.

The method according to claim 1,

Wherein the main body further comprises a conveyor unit for transferring the mounted substrate from the component body to the next process.

The method according to claim 1,

The pair of die shuttles include a pair of guide shafts having a length to the body and the component mounting machine;

A driving motor installed on the guide shaft for transmitting driving force; And

And a die aligning part installed to be movable along the guide shaft by a rotational force of the drive motor, the die aligning part being arranged at an upper part of the die aligning part.