KR100545374B1 - Apparatus for bonding CSP dies - Google Patents

Abstract

Disclosed is a CSP die bonder device having two bonding heads and a high production efficiency. The disclosed invention provides a boat moving unit for moving a boat to which a CSP film is bonded, and a boat mounted thereon, whereby a die bonding operation is performed. And a second index, a die supply means for positioning the wafer at a supply position and determining the quality of the die, a robot arm for selectively transferring the die according to the quantity thereof, and positioning of the die transferred by the robot arm. And correcting the position and supplying the first and second mounting stages supporting the die during bonding, and the boat from the boat moving part to the first and second indexes, and the dies on the first and second mounting stages being transferred to the CSP of the boat. And first and second head portions bonded to the film and unloading the completed boat bonding to the boat moving portion.

CSP die, CSP die bonder, bonding head, mounting stage, robot arm

Description

Sispi die bonder device {Apparatus for bonding CSP dies}             

1 is a perspective view showing a conventional CSP die bonder.

Figure 2 is a perspective view showing a CSP die bonder device according to an embodiment of the present invention.

3 is a plan view of a boat showing a boat used in the CSP die bonder shown in FIG.

Figure 4 is a perspective view of the index and the head of the CSP die bonder of Figure 2;

5 is a perspective view showing a robot arm part of the CSP die bonder device of FIG.

6 is a cross-sectional view of the robot arm shown in FIG. 5.

7 is a perspective view showing a mounting portion of the CSP die bonder of FIG.

8 is a front view illustrating a state in which the CSP portion and the die are bonded by thermal bonding.

* Description of the symbols for the main parts of the drawings *

1, boat 2, CSP film

3, CSP part 4, reference hole

8; wafer 9; die

100; boat loading unit 110; boat moving unit

120; first index 130; wafer supply unit

132; linear motion shaft 140; die feed means

142; wafer camera 148; linear movement axis

150; robot arm 152; vacuum pad

160; first mounting stage 162; Dai camera

170; first head 180; first head assembly

190; moving unit 195; crimping unit

200; boat unloading unit 220; second index

260; second mounting stage 262; Dai camera

270; second head portion 290; moving unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonder, and more particularly, to a die-sip bonder (hereinafter referred to as "CSP") die bonder used in the production of CSP (Chip Size Package) type semiconductor devices.

In general, a die is a semiconductor chip constituting one semiconductor device, and is a piece of a processed wafer, and the CSP die bonder device is a device for adhering the die to a CSP portion, which is an input / output terminal of a semiconductor chip formed on a CSP film.

In general, the CSP film 2 is provided with a plurality of CSP portions 3, and is supplied in a state of being attached to a frame having a certain strength to prevent sagging of the film, which is called a boat 1.

1, a conventional CSP die bonder device is shown.

This CSP die bonder is largely comprised of the boat conveyance part which conveys a boat, the die conveyance part which conveys a die, and the bonding part which adhere | attaches the said film and die | dye.

The boat transfer unit includes a boat magazine 10, a boat takeout means 20, a moving rail 30, and a film checking camera 31. The boat magazine 10 loads a plurality of boats so that the boat take-out means 20 can take out the boats one by one. The boat take-out means 20 supplies the boat to the moving rail 30 from the boat magazine 10 by the vacuum pad 21. The moving rail 30 moves the boat to the crimping portion, and the film checking camera 31 determines whether the CSP portion of the film is attached to the boat.

The die transfer unit includes a wafer supply unit 40, a die supply unit 50, a die transfer unit 60, and a die checking camera 51. The wafer supply unit 40 extracts the wafers one by one from the wafer cassette mounted by the operator and supplies them to the die supply unit 50. The die supply unit 50 positions the die at the supply position so that the die movement unit 60 can continuously suck and supply the die. The die checking camera 51 checks both sides of the die located at the die supply position.

The die moving unit 60 picks up only the die of a good die among the positioned dies as a three-axis orthogonal robot to which the vacuum pad 61 is attached and places it on the mounting stage 70 of the bonding portion. The defective die is placed in a separate defective die seat 63 using a spare time or a wafer replacement time during the working time.

The bonding part includes first and second compression heads 80 and 90, a positioning camera 82, a mounting stage 70, and a chip attaching machine (not shown). The positioning camera 82 confirms whether the positions of the CSP portion and the die coincide, and the first pressing head 80 and the mounting stage 70 press-fit the die and the CSP portion. The pressing die and the CSP part are main pressed by the second pressing head 90 and the chip attaching machine.

Referring to the operation performed by the conventional CSP die bonder as described above as follows.

The boat loaded in the boat magazine 10 is supplied to the moving rail 30 by the boat take-out means 20. The moving rail 30 is moved to the film confirming camera 31, and after confirming both parts of the CSP portion of each boat-like film, it is moved to the first bonding portion.

The wafer taken out from the wafer cassette is loaded into the die supply unit 50. The die supply unit 50 checks the quality of the die and moves the die to be supplied to the supply position. The die die is supplied to the mounting stage 70 by the die movement unit 60.

The positioning camera 82 checks whether the CSP portion and the die on the film are in the correct position, and if so, the first compression head 80 and the mounting stage 70 are pressed. The die that has been press-bonded is subjected to main press by the second press head 90 and the chip attaching machine to complete bonding.

However, the conventional CSP die bonder described above attempts to improve the productivity by dividing the bonding process into two stages of pressing and main bonding. However, when the bonding time is long, the productivity improvement effect is large, but the bonding time is short. The problem was that it was insignificant.

In addition, since there is only one vacuum pad that picks up the die into the die moving unit, there is a problem that a separate working time is required to take out the defective die.

Moreover, since the crimping operation is carried out while the boat is held by the vacuum pad, the boat is slipped, which causes the problem of difficult bonding.

The present invention has been made to solve the above problems, regardless of the long and short bonding time, the productivity is high, and no additional work time is required to take out the bad die, the boat is securely crimped It is an object of the present invention to provide a CSP die bonder device capable of accurate pitch transfer without slippage during operation.

The CSP die bonder device according to the present invention for achieving the above object is a boat moving unit for moving the boat to which the CSP film is bonded, the boat is mounted, the first and second indexes to bond the die, A die supply means for positioning the wafer at a supply position and determining the quality of the die, a robot arm for selectively transporting the die according to the quality of the die, and positioning and correction of the die transferred by the robot arm. The first and second mounting stages supporting the die during ding, and the boat are supplied from the boat moving part to the first and second indexes, and the dies on the first and second mounting stages are bonded to the CSP film of the boat and the bonding is performed. And a first and second head portion for unloading the completed boat into the boat moving portion.

The first and second indexes include a guide pin for fixing the position of the boat, a rectangular through hole through which the CSP film part of the boat is exposed, and a plurality of vacuum generating holes for adsorbing the CSP film part on both sides of the square through hole. And a boat seating portion, a linear movement portion for linearly moving the boat seating portion, and a motor for driving the linear movement portion.

The die supply means includes a wafer camera for confirming the reference position of the wafer, the die position check, and the quality of the die, a rotation axis for matching the direction of the wafer, and a lower side of the rotation axis, and the wafer is placed on the plane. The positioning key at the feed position of the die to be moved among the wafers includes two linear axes of movement and an eject unit for holding the die to be transferred.

An eject unit includes a plurality of eject pins, one end of which is connected to the plurality of eject pins, and the other end of which is a cam follower formed link, a cam for rolling the cam follower and moving the eject pin up and down, and the cam. It consists of a motor to drive.

The robot arm includes a die sucking means, a turning arm for turning the die sucking means, a lifting unit for raising and lowering the turning arm up and down, and a direction holding means for keeping the direction of the die sucking means constant.

The mounting stage includes a seating portion for placing the die transferred by the robot arm and bonding with the head, a die camera for checking the state of the die seated on the seating portion, and a seating portion provided below the seating portion. A position correction unit consisting of one rotary shaft for correcting the pressure and two linear motion shafts mounted on the lower side of the rotary shaft and performing two-dimensional positioning on the mounting plane of the seat, and the die for which position correction is impossible with the position correction unit. A discharge unit, and a defective die seating portion for mounting a plurality of defective dies.

The head unit unloads the loading hand that absorbs the boat and loads it into the index, the bonding head that thermally compresses and bonds the die, the bonding camera which checks both the position and location of the CSP film, and the boat seated on the index to the boat moving part. It consists of a head assembly consisting of an unloading hand, a moving unit for moving the head assembly two-dimensionally in a plane, and a pressing unit for pressing the bonding head at a constant pressure.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the present invention will be described in more detail.

2 is a perspective view showing a CSP die bonder device according to an embodiment of the present invention, Figure 3 is a plan view of a boat showing a boat used in the CSP die bonder device shown in FIG. 4 is a perspective view illustrating only the index and the head portion in FIG. 2, FIG. 5 is a perspective view illustrating the robot arm in FIG. 2, and FIG. 6 is a cross-sectional view of the robot arm of FIG. 5. FIG. 7 is a perspective view illustrating the mounting stage in FIG. 2, and FIG. 8 is a front view illustrating a state in which the CSP portion of the boat film and the die are bonded by thermal bonding.

As shown in FIG. 2, the CSP die bonder according to an embodiment of the present invention includes a boat loading unit 100, a boat moving unit 110, first and second indexes 120 and 220, and a wafer. Supply unit 130, die supply means 140, robot arm 150, the first and second mounting stage 160, 260, the first and second head portion 170, 270 and the boat unloading portion It contains 200.

The boat loading unit 100 includes a pneumatic cylinder for taking out boats one by one from a boat magazine loaded with a plurality of boats 1 and a pair of rollers for moving the taken out boat to the boat moving unit 110.

Another embodiment of the boat loading unit 100 is to directly connect the film cutting / attaching device and the boat loading unit which is a pre-processing device.

The boat moving unit 110 includes a belt 111 for moving the boat 1 from the boat loading unit 100 to the boat unloading unit 200, a motor for driving the belt, and a boat 1 for driving the belt. It consists of two stoppers for stopping at the 2nd index feed position.

The first index 120 is installed at the boat loading part side, and the second index 220 is installed at the boat unloading part side. Each index 120, 220 includes a boat seat 124, a linear motion 126, and a motor 128.

The boat seating portion 124 is provided with two guide pins 122 which reliably fix the boat 1 at a predetermined position, and a rectangle formed so that the CSP film portion 3 of the boat 1 can be exposed one by one. The through holes 124a are formed in the same number as the number of columns of the CSP film part 3, and both sides of each rectangular through hole 124a are provided at positions where the corresponding CSP film parts 3 can be respectively adsorbed. Vacuum hole 123 is provided.

The linear moving part 126 linearly moves the boat seating part 124 and the motor drives the linear moving part 126.

The wafer supply unit 130 includes a mounting table for loading wafer cassettes in which a plurality of wafers in which the processing is completed in the wafer processing process and divided into a plurality of dies are loaded, lifting units and wafers for raising and lowering the loading table up and down. It consists of a single-axis orthogonal robot 132 is attached to the gripper to hold the one by one to transport the die supply means.

The die supply means 140 is composed of a wafer camera 142, a rotation axis, two linear motion axes 148, and an eject unit.

The wafer camera 142 is installed on the ceiling of the main body frame on the upper side of the wafer 8 to check the reference position of the wafer, the position of the die, and confirm both parts of the die. The rotating shaft consists of a plate for supporting the wafer and a rotating means for rotating the plate, and the rotating means includes a drive motor and a reducer.

The two linear motion shafts 148 are provided under one of the rotary shafts, and the other one is provided under the linear motion shafts, so that the die 9 forming the wafer 8 is the same as the plane on which the wafer is placed. It can be moved to any position on the plane. The linear motion axis 148 is composed of a linear motion part for guiding linear motion and a motor for driving the linear motion part.

The eject unit includes a plurality of eject pins which are lifted up and down through a hole penetrated through the rotating shaft, a link that is connected to the plurality of eject pins at one end thereof, and a cam follower formed at the other end thereof, and the eject follow pins while rolling the cam follower with the cam follower. And a cam configured to move up and down, and a motor for driving the cam.

The robot arm 150 includes two die adsorption means, a pivot arm, a lifting unit, and an orientation means.

The die adsorption means is composed of two vacuum pads 152 and two pneumatic cylinders 153 for raising and lowering the vacuum pads 152, respectively.

The pivotal arm is composed of a pivotal rock member 154, one end of which is fixed to the die adsorption means and the other end is coupled to the motor 155, and a motor 155 for pivoting the pivotal rock member 154, the pivotal rock member At the bottom of 154, direction maintaining means for maintaining a constant direction of the die suction means is provided.

The direction maintaining means includes a timing pulley 157 coupled to the two vacuum pads 152, a timing pulley coupled to a fixed shaft of the motor 155, and a timing belt 159 assembled to connect the respective timing pulleys. ), So that the direction of the die adsorbed by the die adsorption means does not change even when the swivel rock swings.

The lifting unit includes a linear motion guide and a block 156 for guiding the up and down linear motion as a means of elevating the turning motor 155, a cam 158 for generating the lifting motion, and a motor 151 for driving the cam. When the motor rotates and the cam follower 158a whose long axis of the cam is attached to the pivotal arm is pressed, the pivotal arm is lowered. When the motor further rotates and the short axis of the cam 158 comes in contact with the cam follower 158a. The turning rock is raised by the spring 158b.

The first and second mounting stages 160 and 260 each include a seating portion 161, a die camera 162, a position correction unit, and a discharge unit.

Four vacuum generating holes are formed in the upper surface of the seating portion 161 to settle the die. The lower end of the seating portion 161 is coupled to the rotary shaft 163 of the position correction unit.

The position correction unit includes a rotating shaft 163 for rotating the seating portion, and two linear motion shafts 164 mounted on the lower side of the rotating shaft 163 to allow two-dimensional positioning on the mounting plane.

The discharge unit is separately mounted to the main body base frame next to the position correction unit, and is composed of the discharge position moving cylinder 165, the moving plate 166, the discharge cylinder 167 and the bad die seating unit 169.

The moving plate 166 is fixed to the moving part of the discharge position moving cylinder 165, and the discharge cylinder 167 is assembled above the moving plate 166. On one side of the moving plate 166, a defective die mounting portion 169 for mounting a defective die is formed in an iron shape. The rod end of the discharge cylinder 167 is attached to the "a" shaped discharge cap 168 for discharging the die.

The first and second heads 170 and 270 move the head assembly 180 and the head assembly 180 for loading / unloading, locating and crimping the position of the boat 1, and thermocompressing, respectively. It consists of a unit 190 and a crimping unit 195.

The head assembly 180 is thermo-compression-bonding the die (9) and the loading hand 182 consisting of a vacuum pad (183) for absorbing the boat (1) to load the first and second index (120, 220) Bonding heads 184 for generating heat for bonding, bonding cameras 186 for identifying both sides and bonding positions of the CSP film, and boats seated on the first and second indexes 120 and 220. It consists of an unloading hand 188 consisting of a vacuum pad for unloading (1) into the boat moving part 110.

The movement units 190 and 290 are composed of two linear movement axes to linearly move the head assembly 180 in front, rear, left and right, and the compression unit 195 moves the bonding head 184 at a constant pressure. It consists of a linear motion guide 197 for guiding the lifting movement of the pressing member 196 and the pressing member 196 and a cam for driving the cam and the cam for lifting the pressing member 196.

Hereinafter, the operation of the CSP die bonder apparatus according to an embodiment of the present invention configured as described above will be described.

When the pneumatic cylinder of the boat loading unit 100 is pushed to a pair of rollers one by one, a pair of rollers rotate to move the boat 1 to the boat moving unit 110. The boat 1 supplied is moved by the belt 111 of the boat moving part 110, and is selectively stopped by the stopper installed in the 1st or 2nd index supply position during a movement.

When the boat 1 stops at the first index supply position, the head assembly 180 of the first head portion 170 is operated to suck the boat 1 by the vacuum pad 183 of the loading hand 182 and to remove the boat 1. 1 is seated on the seating portion 124 of the index (120). Since the reference hole 4 formed in the boat 1 is inserted into the guide pin 122 protruding from the boat seating portion 124 on the first index 120 when the boat 1 is seated, the boat 1 is Since the film is always fixed at the correct position and the respective CSP film portions 3 are adsorbed through the vacuum generating holes 123, the film is firmly fixed.

When the boat 1 is placed on the first index 120, the bonding camera 186 of the first head part head assembly 180 checks both sides and positions of the boat film CSP part 3. At this time, both parts judgment of the film CSP part 3 can be performed by recognizing defect indications, such as a hole displayed at the film manufacturing process.

On the other hand, when an operator loads a wafer cassette containing a large number of processed wafers onto the wafer supply table 130, the wafer to be taken out is positioned by lifting means composed of linear motion axes, and the linear motion shaft of one axis with grippers is positioned. By 132, the wafers are taken out one by one and placed on the support plate of the die supply means.

When the wafer 8 is placed on the support plate, the wafer camera 142 checks the placing direction of the wafer 8 on which the wafer 8 is placed. If the wafer 8 is different from the reference position, the wafer direction is matched by the rotation axis.

When the wafer 8 is fixed at the reference position, the wafer camera 142 checks both sides of a certain number of dies in a certain range of the wafer. Determination of the distribution state of the good and defective dies and the state of the first and second mounting stages 160 and 260, and in the case of good quality, is adsorbed by the good die die adsorption means of the robot arm 150, and is defective in the vicinity of the good. If there is a die, it is adsorbed by the defective die adsorption means, and the good quality is selectively settled in the mounting portions of the first mounting stage 160 and the second mounting stage 260, and in the case of failure, the first and second mounting stages. The defective die mounting portion 169 or the mounting portion 161 is selectively placed.

When the die is sucked by the die adsorption means, first, as the motor of the eject unit operates, the eject pin is raised to raise the die to be supplied, and in this state, the vacuum pad 152 of the adsorption means sucks the die. Since the die is a cut piece of the wafer, since the die is supplied to the flexible adhesive film when the wafer is supplied, the die can be adsorbed smoothly by minimizing the adhesive force applied when the vacuum pad 152 adsorbs the die. It is necessary to make sure.

When the die is placed in the seating portion 161 of the first mounting stage 160, the seating portion 161 is moved below the die camera 162 by the linear movement shaft 164 of the position correction unit.

The die camera 162 checks the seating state of the die and compares whether or not it can be matched with the position of the CSP unit 3 confirmed by the bonding camera 186. Rotate 161 to correct the position of the die. If the deviation is so great that the correction is impossible, the seat 161 is moved to the die discharge position by the linear movement shaft 164 of the position correction unit, and then the die is discharged by the discharge unit.

The die is discharged to the discharge area on the moving plate 166 by the combined operation of the discharge position moving cylinder 165 and the discharge cylinder 167 of the discharge unit.

When the position of the die settled in the seating portion 161 is corrected, the CSP portion to be bonded in the boat film in which the seating portion 161 is seated at the first index 120 by the linear movement shaft 164 of the position correction unit. It is moved to the lower side of (3).

When the seating portion 161 is positioned below the CSP portion 3 to be bonded, the bonding camera 186 of the first head portion head assembly 180 is positioned at the crimp position of the CSP portion 3 so that the die 9 is correctly positioned. Check if it is done.

If the CSP portion 3 and the die 9 are exactly matched, the bonding head 184 of the first head portion head assembly 180 is moved to the bonding position. When the bonding head 184 is located at the bonding position, the bonding head 184 presses the CSP portion 3 by the pressing unit 195, and this pressing force is applied to the seating portion 161 of the first mounting stage on which the die is placed. Will receive.

At this time, the bonding head 184 heats the CSP part 3 to a predetermined temperature by operating the heater, so that the bonding head 184 bonds the CSP part 3 and the die 9 by thermocompression.

When the bonding of one die is completed, the first mounting stage 160 is supplied with the die 9 again by the robot arm 150 and performs the above-described operation, thereby performing the die 9 to the next CSP unit 3. Bond the.

When the bonding of one row is completed, the first index 120 performs the accurate pitch transfer by the CSP unit 3 by the motor 128 and the linear movement unit 126 so that bonding can be performed in the next row.

When the bonding of one boat is completed through the above operation, the boat 1 is moved onto the boat moving unit 110 by the unloading hand 188 of the first head unit head assembly. When the bonded boat 1 is placed on the boat moving unit 110, the belt 111 is driven to move the boat 1 to the boat unloading unit 200.

The boat that is bonded in the boat unloading unit 200 is loaded in the boat magazine.

In addition, when the boat 1 is placed in the first index 120, since the first index supply position stopper of the boat moving unit 110 does not operate, the boat 1 is moved to the second index supply position and the stopper is moved. Stopped by When the boat 1 is stopped, the second index 220, the second mounting stage 260, and the second head part 270 describe the first index 120, the first mounting stage 160, and the first head. Bonding is performed by performing the same operation as that of the head unit 170.

As described above, according to the present invention, since the two bonding heads are provided, the production efficiency is high regardless of the length or length of the bonding time. There is no need for a separate working time for the die, and the boat seating part of the index makes the CSP film firmly fixed so that the boat is fixed and the pitch is shifted.

Although the preferred embodiments of the present invention have been illustrated and described above, the present invention is not limited to the above-described specific preferred embodiments, and the present invention belongs without departing from the gist of the present invention as claimed in the following claims. Those skilled in the art will be able to implement various modifications.

Claims (11)

A boat moving unit for moving the boat to which the CSP film is bonded; First and second indexes on which the boat is mounted to bond the die; Die supply means for positioning the wafer at a supply position and for determining the quality of the die; A robot arm for selectively transporting the die according to its quantity; First and second mounting stages for positioning and correcting the die transferred by the robot arm and supporting the die during bonding; And Supplying the boat from the boat moving part to the first and second indexes, bonding dies on the first and second mounting stages to the CSP film of the boat, and unloading the completed boat to the boat moving part CSP die bonder apparatus comprising a first and a second head portion. The method of claim 1, wherein the first and second indexes, A guide seat for fixing the position of the boat, a plurality of square through holes exposed to the CSP film part of the boat, and a plurality of holes for vacuum generation on both sides of each square through hole, the vacuum generating holes adsorbing the CSP film part; A linear movement part for linearly moving the boat seating part, and CSP die bonder device comprising a motor for driving the linear motion portion. The method of claim 1, wherein the die supply means, A wafer camera for confirming the reference position of the wafer, the die position check, and the quality of the die; A rotating shaft for matching the direction of the wafer; Two linear motion shafts provided below the rotational shaft to move the wafer on a flat surface to position a die to be moved among the wafers at a supply position; And an eject unit for lifting the die to be transferred. The method of claim 3, wherein the eject unit, A plurality of eject pins, One end is connected to the plurality of eject pins and the other end is a link formed cam follow, A cam for rolling the cam follower and moving the eject pin up and down, and CSP die bonder device comprising a motor for driving the cam. The method of claim 1, wherein the robot arm, Die adsorption means, A swivel arm for turning the die adsorption means; An elevating unit for elevating the slewing rock up and down, and CSP die bonder apparatus comprising a direction holding means for maintaining a constant direction of the die suction means. The method of claim 5, wherein the die adsorption means, CSP die bonder device comprising a vacuum pad and a pneumatic cylinder for raising and lowering the vacuum pad. The method of claim 5, wherein the slewing rock, Drive motor, one end is coupled to the drive motor, the other end is a CSP die bonder device, characterized in that consisting of a swing arm member coupled to the die adsorption means. The method of claim 5, wherein the direction maintaining means, And a timing pulley coupled to each of the vacuum pad and the fixed portion of the driving motor, and a timing belt connecting the pulleys to each other, the CSP die bonder apparatus installed under the pivotal rock member. The method of claim 1, wherein the first and second mounting stage, A seating part for placing the die transferred by the robot arm and bonding the first and second head parts together; A die camera for checking a state of a die seated on the seating part; A position correction unit comprising one rotary shaft installed at the lower side of the seating part and correcting distortion of the seating part, and two linear motion shafts mounted at the lower side of the rotary shaft and performing two-dimensional positioning on the mounting plane of the seating part; A discharge unit for discharging a die that cannot be positioned with the position correction unit CSP die bonder device comprising a bad die mounting portion for mounting a plurality of bad die. The method of claim 1, wherein the first and second head portion, The boat moving unit may include a loading hand for adsorbing the boat and loading it in the index, a bonding head for bonding the die, a bonding camera for checking the quantity and location of the CSP film, and the boat seated at the index. Head assembly consisting of an unloading hand for unloading; A movement unit for moving the head assembly two-dimensionally in a plane; And CSP die bonder device comprising a pressing unit for pressing the bonding head at a predetermined pressure. The method of claim 1, wherein the die supply means, A CSP die bonder device, wherein the wafer is supplied from the wafer cassette one by one by a wafer supply unit.

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