KR100315514B1 - Two-head type CSP bonder apparatus - Google Patents

Abstract

PURPOSE: A 2-head type CSP(Chip Size Package) bonder is provided to reduce efficiently a bonding time by performing a pre-compression process and a main compression process of a semiconductor chip to a lower end portion of a CSP film. CONSTITUTION: A CSP film supply portion(10) is formed with a loading case(11) for laminating a multitude of CSP film. A film transfer portion(20) is used for transferring the CSP films to a movable rail(31) by using a vacuum pad(21). A wafer supply portion(40) is used for transferring semiconductor chips, sequentially. A wafer loading portion(50) is used for transferring the semiconductor chips supplied from the wafer supply portion(40). A chip transfer portion(60) is used for transferring the semiconductor chips to a mount stage(70). The first bonding portion(80) is used for pressing the semiconductor chip. The second bonding portion(90) is used for adhering the CSP film and the semiconductor chip to each other under a predetermined temperature and a pressure. A stacker(100) is used for stacking the transferred CSP films.

Description

Two-head type CSP bonder apparatus

The present invention relates to a two-head type CSP bonder, and more particularly, when performing die bonding to attach a semiconductor chip to a chip size package (CSP) film including a ball grid array (BGA) film. For each unit CSP film arranged in rows and rows from row to row 8, the semiconductor chip is press-bonded to the correct position at low temperature and for a short time, and then main bonding is performed again to prevent defects caused by deformation of the film. A two-head type CSP bonder is provided.

In general, CSP film is a small size, thin and light, so the use of the recent trend is increasing.

In addition, the CSP film is formed into a predetermined shape by using a press mold apparatus in which a thin film having a predetermined width is sequentially transferred or formed into a predetermined shape through an etching process using chemicals.

In the thin film of the CSP film, the semiconductor package is formed by forming a plurality of chip mounting portions and a space around the vertically and horizontally and vertically with a predetermined thickness, and patterning the lead wire thinly on the bottom of the thin film. To be prepared.

In one thin film of the above, the CSP film member of the unit is formed by fusing an adhesive tape for mounting the chip at an accurate position of the center lower end of the unit CSP film including the chip seat and the space around the unit.

The die CSP film fused with the adhesive tape is aligned on a rail by vacuum adsorption, and then die bonding is performed.

In the above die bonding process, a chip is sucked by a nozzle or the like on a silicon wafer in which a large number of chips as a single element are formed, transferred to a predetermined position and seated, and then the seated portion is transported and mounted under the aligned CSP film. After the bonding is bonded using a thermocompression mechanism.

The bonded CSP film is transferred to the following process to complete the semiconductor device.

That is, conventionally performing a taping process to form a unit CSP film member by fusing the adhesive tape for mounting the chip on the bottom of the plurality of unit CSP film formed of one thin film,

Lead On Chip (LOC) die bonding is commonly used to move the taped CSP film so that the adhesive tape faces downward while attaching the chip of the memory element by one bonding portion from below.

During the die bonding, a plurality of micro BGAs of the CSP film were checked for defects, and in the case of defects, normal chips were simply attached or bad chips were found.

However, in the die bonding process of attaching a chip, which is a semiconductor wafer, to a CSP film having an adhesive tape attached to the conventional bottom surface as described above, the chip is transferred to a camera of a mount stage, and then at a temperature of 200 ° C. in one bonding portion. Since it adhered by fusion by applying a pressure of 2 Kg to 10 Kg for 2 to 4 seconds, the film was deformed by heat when the chip was pressed to each unit CSP film arranged in rows and rows from 3 to 8 rows. As a result, the accuracy of the location information is lowered, such that the chip cannot be stably attached to the correct position.

In addition, if the bonding unit recognizes the defects while checking the CSP film to attach the chip, even if the normal chip is attached, there is a disadvantage in that only a waste of chips because the product is manufactured.

And if a bad micro BGA is recognized while transferring from the transfer head to check the bad chip micro BGA of the CSP film, the normal chip currently being transferred is withheld and the bad chip through the separate transfer head again. Will be transferred.

At this time, after confirming the information that the wafer mounting part recognized the bad chip, the bad chip should be placed under the transfer head while moving in the X-axis and Y-axis. There was a problem brought about.

Accordingly, the present invention is to solve the above shortcomings, when the chip is a semiconductor element to the integrated CSP film of the lead by die bonding the chip at the bottom of each unit CSP film at low temperature and short time Provides a two-head type CSP bonder device that improves working efficiency while significantly reducing the time for pressing by performing main pressing on the whole unit CSP film at the proper temperature and pressure after pressing the film on the whole unit CSP film. It aims to do it.

In addition, the present invention, if the defective chip is confirmed in the wafer mounting unit is transferred to the mounting plate of the chip transfer unit, if the defect of the micro BGA is recognized, the bad chip of the mounting plate is transferred to the chip transfer unit without transferring the normal chip to the chip transfer unit of the defective unit micro BGA Another purpose is to quickly and simply attach a defective chip to a chip.

The two-head type CSP bonder device according to the present invention for achieving the above object is a CSP film supply unit formed to accommodate a plurality of CSP films fused adhesive tape on the bottom,

A film conveying unit for transferring the CSP films stacked on the CSP film supply unit one by one to a moving rail,

A moving rail unit for moving the CSP film transferred by the film conveying unit to the front on the moving rail using a mill piece;

A wafer supply unit for sequentially transferring and supplying a semiconductor chip artificially supplied from the outside;

A wafer mounting part for moving the chip to a predetermined position while moving the circular ring while photographing with a camera when the chip is supplied through the wafer supply part;

If defective chips are found while holding chips of the semiconductor wafer transferred to a fixed position of the wafer mounting unit one by one and transferring them to the mount stage, which is a work position for die bonding, the remaining time during transfer or when replacing the wafers is about 10 And the chip transfer unit for temporarily storing the conveyance on the mounting plate by vacuum adsorption method,

Defect detection camera 81 for confirming whether or not the defect is received when the CSP film is moved forward from the moving rail unit through the moving rail,

Checking the center while recognizing the two reference points formed at the diagonal positions of the CSP film of each unit of the CSP film via the defect detection camera, or confirming that the lower chip transferred through the mount stage is in the correct position. Positioning camera,

A first bonding part in which the chip is press-bonded by the positioning camera for a low temperature and a short time at an accurate position where the adhesive tape of the CSP film is fused;

A second bonding part which completely attaches the CSP film and the chip press-bonded by the first bonding part to each other for 1 to 2 seconds at an appropriate temperature and pressure;

When the CSP film to which the chip of the semiconductor device is attached is transferred from the second bonding part, the die bonding process may be performed by stokers that move the magazines up and down.

1 is a perspective view showing the overall configuration of the present invention.

2 is a plan view showing a CSP film of the present invention.

3 is a plan view showing a unit CSP film of the present invention.

Figure 4 is a perspective view showing in detail the configuration of the chip transfer unit of the present invention.

Figure 5 (a) is a plan view showing a state of confirming the position of the unit CSP film and the chip of the present invention.

Figure 5 (b) to (d) is a plan view showing a process of bonding the gold lead of the CSP film of the present invention to the bonding pad of the chip.

Figure 6 is a side view schematically showing the configuration of the bonding portion of the present invention

Explanation of symbols on the main parts of the drawings

10: CSP film supply part 20: film transfer part

30: moving rail part 40: wafer supply part

50: wafer mounting portion 60: chip transfer portion

70: mount stage 80: first bonding portion

90: second bonding unit 100: stoka

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 shows an overall configuration according to an embodiment of the present invention,

A CSP film supply unit 10 formed in the form of a stacking box 11 to stack and accommodate a plurality of CSP films 1;

A film transfer part 20 for holding the CSP film 1 laminated on the CSP film supply part 10 with the vacuum pad 21 one by one and transferring the CSP film 1 to the moving rail 31;

The moving rail part 30 which moves forward by using the mill piece 32, so that the CSP film 1 carried by the vacuum pad 21 of the said film conveying part 20 may be mounted on the moving rail 31, and ,

A wafer supply unit 40 which sequentially transfers and supplies the chips 5 of the semiconductor element artificially supplied from the outside,

A wafer mounting unit 50 for transporting one by one while checking the chip 5 supplied through the wafer supply unit 40 with the camera 51;

If a defective chip is found while holding the chips 5 of the semiconductor element transferred to a predetermined position of the wafer mounting unit 50 and feeding them to the mount stage 70 which is a work position of die bonding, the spare time during the transfer Alternatively, the chip transfer unit 60 temporarily stores about 10 wafers to be replaced by a vacuum suction method on the mounting plate 63, and transfers them.

When one CSP film 1 transferred forward from the moving rail 31 of the moving rail unit 30 is transferred through the moving rail 31, the defect detecting camera 81 checks whether there is a defect and then again. Recognizing centers while recognizing two reference points (2) (2a) formed at diagonal positions of each unit CSP film (1a) through the positioning camera (82) or the lower end conveyed through the mount stage (70) The first bonding part 80 for pressing the chip 5 to the correct position where the adhesive tape of the CSP film 1 is fused by checking whether the chip 5 of the chip 5 is in the correct position;

A second bonding part 90 for completely pressing the unit CSP film 1a and the chip 5 pressed by the first bonding part 80 at a suitable temperature and pressure for 1 to 2 seconds, and

When the CSP film 1 to which the chip 5, which is a semiconductor element, is stably attached, is transferred from the second bonding unit 90, the stacker 100 may be loaded.

1 to 5 show a detailed configuration according to an embodiment of the present invention, the CSP film 1 artificially laminated to the stacking box 11 of the CSP film supply unit 10 of the main body of the film transfer unit 20 ( 22 is held by the vacuum pad 21, which is moved up and down in accordance with the pneumatic cylinder 23, so as to be seated on the moving rail 31 of the moving rail unit 30 by the rotation of the rotor 24. .

When the CSP film 1 having the adhesive tape 7 attached to the bottom is moved to the moving rail 31, the push piece 32 is operated to move forward.

When the user artificially supplies the chip 5 of the semiconductor device to the supply box 41 of the wafer supply unit 40, the chip 5 is held on the wafer supply path 42 by a wafer loading / unloader (not shown). Let's do it.

When the chips 5 through the wafer supply path 42 of the wafer supply unit 40 are transferred to the circular ring 52 of the wafer mounting unit 50, they move back and forth to the front and rear driver 53 installed on the bottom, and at the same time, the left and right movers. By the 54 to move left and right so that the chips 5 inside can be transported one by one.

The vacuum pad of the chip transfer unit 60 recognizes the position of the normal chip 5 through the camera 51 at the upper end with respect to the chip 5 of the semiconductor element seated on the circular ring 52 of the wafer mounting unit 50. One by one with 61 is mounted on the mount stage 70 while moving along the guide rail 62 which is conveyed by the drive of a motor not shown in the figure.

If a defective chip marked as defective is found during inspection during the chip transfer, the position of the chip is stored, and the guide rail is held one by one with the vacuum pad 61 during the spare time during the transfer or during the break to replace the wafer. Put one on the convex portion 64 of the mounting plate 63 separately installed on the lower side of the side (62) and then operate the vacuum pump 65 to stably suspend the bad chip by the suction force through the connection hole 66 Keep it.

In the first bonding unit 80 that determines whether there is a defect while receiving the CSP film 1 along the moving rail 31 and recognizes the defect indication with the defect detection camera 81, each unit micro Two reference points (2) (2a) formed at a position diagonal to the BGA (1a) are recognized while photographing with a positioning camera (82) that photographs a small range, and arithmetic is performed to confirm the center of the center position. .

When the center of each CSP film 1a is identified, information about the CSP film 1a is transmitted to the mount stage 70, and each of the CSP films 1 to be worked by the chip 5 of the semiconductor element by the driver 71 is operated. Move so that it is located just below the center of the unit CSP film 1a.

When the chip 5 is positioned below the unit CSP film 1a, the positioning point 6 of the chip 5 is placed between the gold lead 3 of the CSP film 1 through the positioning camera 81. ) To determine the correct position.

When the chip 5 is supplied to the lower right position of each unit CSP film 1a of the CSP film 1, the heat from the heater 83 is moved while moving the head 82 of the first bonding part 80 downward. The chip 5 is attached to the adhesive tape 7 fused to the bottom surface of the CSP film 1 while being press-bonded for a short time.

Here, the first bonding portion 80 is press-bonded and fused with the head 82 while supporting the chip 5 with the mount stage 70 on the bottom surface of the CSP film 1 and then the second bonding portion 90. Ensure complete fusion at.

The second bonding part 90 receives the heat generated by the heater 92 inside while supporting the chip attacher 91 from the lower surface of the CSP film 1 moving while being mounted on the upper surface of the moving rail 31. Main compression is carried out while squeezing completely with (93).

When the CSP film 1 to which the chip 5 of the semiconductor device is attached is transferred from the second bonding unit 90 through the moving rail 31 one by one, the extractor 102 grips it and the stocker 100 is held. By laminating and storing them in order, they can be moved to the next process.

In the two-head type CSP bonder device of the present invention configured as described above, the vacuum pad 21 of the film transfer part 20 in a state in which the CSP film 1 is artificially laminated to the loading box 11 of the CSP film supply part 10. 1) is held one by one, and is seated on the moving rail 31 of the moving rail part 30 by the rotation of the rotor 24 during the ascending and descending according to the pneumatic cylinder 23 in the state installed in the main body 22.

And when the said CSP film 1 with the adhesive tape 7 attached to the bottom surface is moved to the moving rail 31, the moving rail part 30 will operate the push piece 32, and the CSP as shown in FIG. Allow the film 1 to move forward.

On the other hand, when the user artificially supplies the chip 5 of the semiconductor element to the supply box 41 of the wafer supply unit 40, the chip 5 is held on the wafer supply path 42 by a wafer loading / unloading machine.

When the chips 5 through the wafer supply path 42 of the wafer supply unit 40 are transferred to the circular ring 52 of the wafer mounting unit 50, the positions of the normal chips 5 through the camera 51 at the upper end thereof. While operating the front and rear driver 53 installed on the bottom while recognizing the circular ring 52 to move back and forth, or the left and right mover 54 to move the circular ring 52 to the left and right while the chip 5 ) Are positioned at the bottom of the vacuum pad 61 of the chip transfer unit 60 so that they can be transferred one by one.

When the chip 5 of the semiconductor device is inspected, if it is not normal, an abnormal mark is printed so that it can be transported while recognizing whether the chip 5 is normal or abnormal when the position is recognized by the camera 51.

If the chip 5 is normal, the vacuum pads 61 of the chip transfer unit 60 are gripped one by one and placed on the mount stage 70 while moving along the guide rails 62 transferred by the driving of the motor.

When the chip transfer unit 60 detects a defective chip, which is indicated as a defective product during inspection, during the chip transfer, the position of the chip is stored and the spare time during the transfer or the wafer is replaced. The vacuum pump 65 is operated by holding one by one with a vacuum pad 61 at a break time and placing them one by one on the convex portion 64 of the mounting plate 63 separately installed on the lower side of the guide rail 62. Store bad chips stably by suction force through (66).

Here, the bad chip is placed on the convex portion 64 of the mounting plate 63 so that the chip 5 may be stably stored by vacuum suction regardless of whether the chip 5 is large or small.

While receiving one CSP film 1 along the moving rail 31, the first bonding unit 80, which recognizes a defect mark with the defect detection camera 81 and determines whether there is a defect, is the CSP film 1. If the defective unit micro BGA (1a) is confirmed in the information transfer to the chip transfer unit 60 for this to transfer the defective chip to the mount stage 70 in this process.

In addition, the first bonding portion 80 receiving the CSP film 1 may have two reference points 2 formed at diagonal positions of the respective unit micro BGAs 1a as shown in FIG. 2a) is photographed and recognized by the positioning camera 82, and the center of the center position is confirmed by adding the sinusoidal values of the two reference points (2) and (2a) and then dividing by two.

When the center of each micro BGA 1a is identified, the information about the micro BGA 1a is transmitted to the mount stage 70 so that each of the CSP films 1 on which the chip 5 of the semiconductor device is to be worked by the driver 71. Move so that it is located just below the center of the unit micro BGA 1a.

When the chip 5 is positioned below the unit micro BGA 1a, the gold lead of the CSP film 1 is photographed by the positioning camera 82 as shown in FIG. While checking the positioning point 6 of the chip 5 between 3), it is determined whether the chip 5 is supplied at the correct position.

As shown in (b) of FIG. 5, when the chip 5 is supplied at the lower end of the unit CSP film 1a of the CSP film 1, the head 83 of the first bonding part 80 is removed. Heat is generated in the heater 84 while moving downward, so that the adhesive tape 7 fused to the bottom surface of the CSP film 1 is preheated for a while, so that the head 83 and the mounting stage 70 move downward. The chip 5 is attached as shown in FIG.

Here, the first bonding part 80 is press-bonded and fused with the head 83 while supporting the chip 5 with the mount stage 70 on the bottom surface of the CSP film 1, and then the second bonding part 90 Ensure complete fusion at.

The second bonding part 90 receives the heat generated by the heater 92 inside while supporting the chip attacher 91 from the lower surface of the CSP film 1 moving while being mounted on the upper surface of the moving rail 31. Main compression is carried out while squeezing completely with (93).

That is, in the first bonding part 80, the pressure bonding is performed for less than 1 second, which is 30% to 40% of the time required for die bonding at a temperature of 15 to 50 ° C, and then 200 ° C in the next second bonding part 90. At the temperature of 1 to 2 seconds, 60% to 70% of the remaining time required for die bonding is completely fused and adhered.

When the CSP film 1 to which the chip 5 of the semiconductor device is attached is transferred from the second bonding unit 90 through the moving rail 31 one by one, the extractor 102 grips it and the stocker 100 is held. The following process of adhering to the bonding pads 6 of the chip 5 while cutting the ends of the gold lead 3 of the CPS film 1 by laminating and storing them in succession to FIG. To be performed.

Therefore, according to the two-head type CSP bonder of the present invention, when bonding a chip, which is a semiconductor element, to a CSP film having an integrated lead by die bonding, the chip is pressed at the lower end of the unit CSP film at a low temperature and in a short time. Then, the main unit CSP film is subjected to main compression at an appropriate temperature and pressure, thereby significantly reducing the time for pressing and die-bonding at a low temperature at the first bonding, thereby reducing work efficiency due to deformation of the film. None, of course, high-precision die-bonding is possible, and if a defective chip is found in the wafer mounting unit, it is transferred to the mounting plate of the chip transfer unit. If the defect of the micro BGA is recognized, the chip is not transferred to the chip transfer unit. Bad micro BGA by transferring bad chip and attaching bad chip to bad unit micro BGA quickly and simply Normal to one in order to prevent a delay of the process and hence cumbersome to attach the chip to find a defect in a waste or a beulryang micro BGA attaching a semiconductor chip.

Claims (4)

A film conveying unit for holding the CSP film by laminating it to the CSP film supply unit and holding the CSP film one by one with a vacuum pad, and transferring the film to the moving rail; A moving rail unit for moving the CSP film, which is moved by the vacuum pad, to the front by the push piece in the moving rail, A wafer mounting part for transferring one by one while checking the chip supplied from the outside through the wafer supply part with a camera; If a defective chip is found during the transfer and supply to the mount stage, which is the work position for die bonding, by holding the chips in the wafer mounting unit one by one, the vacuum board may be placed on the mounting plate for about 10 wafers during spare time during transfer or replacement of the wafer. A chip feeder for temporarily storing and transporting the same by the method; The CSP film moved forward from the moving rail of the moving rail unit is detected by the defect detection camera for defects, and then the center checks the center or recognizes the two reference points of each unit CSP film with the positioning camera or mounts the mount. A first bonding part which press-bonds the chip to the exact position where the adhesive tape of the CSP film is fused after confirming that the chip transferred through the stage is in the correct position; CSP bonder device of the two-head type characterized in that the second bonding portion for attaching the CSP film and the chip pressed in the first bonding portion by thermocompression bonding and then transported to the stock. According to claim 1, wherein the chip transfer unit by a vacuum pad while recognizing whether the chip is normal and its position through the camera to check the upper end in the circular ring of the wafer mounting portion where the chips are transferred through the wafer supply path To be transported, If the chip is normal, the vacuum pad is sequentially held and seated on the mount stage while moving along the guide rail conveyed by the driving of the motor, If the chip is found to be defective by the camera, the position of the mounting plate installed at the bottom of the side of the guide rail is memorized by the vacuum pad, one after the other, during the spare time during the transfer or during the break to replace the wafer. A two-head type CSP bonder having a bad chip mounting means for stably storing a bad chip by suction force through a connection hole by placing a vacuum pump on the convex part one by one. The two-head type CSP bonder of claim 1, wherein the first bonding portion is pressed against the chip at a temperature of 50 ° C. for less than one second at a precise position where the adhesive tape of the CSP film is fused. The two-head type CSP bonder according to claim 1, wherein the second bonding part is completely pressed and attached to the pressurized CSP film and the chip at a temperature of 200 ° C for 1-2 seconds.