JP6636681B1 - Backup plate supply / recovery device, die bonder, and bonding method - Google Patents

Abstract

The backup plate is transported to the plate body by the transport mechanism while being supported by the transport rail. As the plate body is raised via the lifting mechanism, the plate body and the backup plate are integrated. When the plate body is lowered via the lifting mechanism, the backup plate is supported by the transport rail. Thereby, the plate body and the backup plate are separated. The separated backup plate is transported to the magazine mechanism by the transport mechanism while being supported by the transport rail.

Description

  The present invention relates to a backup plate supply / recovery device, a die bonder, and a bonding method.

  A bonding apparatus for bonding a chip to a lead frame, for example, as described in Patent Document 1, transports an island portion of a lead frame to a paste application position, applies paste to the island portion, and further applies the island portion. Is transported to a bonding position, and a chip is bonded to this island portion. At the paste application position and the bonding position, the lead frame is supported from below by a backup plate to stabilize the paste application operation and the bonding operation.

  That is, when the adhesive film (DAF: die attach film) previously attached to the back surface of the chip (semiconductor chip) is heated and attached to the substrate (lead frame or organic substrate), it is transported to the bonding position (bonding position). A backup plate is used to mount a chip on a substrate with high accuracy and high quality (voidless, uniform bonding strength). For this reason, the backup plate is manufactured according to the substrate size, the substrate design pattern, and the like, and there are various types, and it is necessary to replace the backup plate according to the substrate.

  Conventionally, the number of days for bonding to the same substrate is large, and the frequency of replacing the backup plate is as small as several weeks to one month. For this reason, there was not much problem in productivity. However, in recent years, low-volume, multi-product production has become mainstream, and there are tens of types, depending on the user, and the frequency of replacement increases, sometimes daily, and sometimes several times a day.

Japanese Patent No. 6124969

  If the frequency of replacement of the backup plate increases, the productivity will deteriorate. In addition, since the backup plate that has been working is heated and the replacement is performed manually, it is necessary to wait until the backup plate cools down, and the time for one replacement is long. In addition, there are many types of backup plates, and there is a possibility that the backup plate is replaced with a backup plate different from the backup plate to be replaced. Further, there is a possibility that the backup plate may not be mounted in a normal state after the replacement.

  The present invention has been made in view of the above problems, and provides a backup plate supply / recovery device, a die bonder, and a bonding method that can automate backup plate replacement and achieve improved productivity.

  The backup plate supply / recovery device of the present invention supplies an arbitrary one of a plurality of types of backup plates to a plate body, and a backup plate supply / recovery device that collects the supplied backup plate from the plate body. A collection device, comprising: a magazine mechanism capable of sending out any one backup plate from a plurality of types of backup plates; and an elevating mechanism for relatively elevating and lowering the plate body and the backup plate. The backup rate sent from the magazine mechanism is arranged at the upper position or the lower position, and the plate body and the backup plate are integrated by the relative ascent or descent of the plate body and the backup plate via the elevating mechanism. , Play via lifting mechanism At relative lowering or rising the body and the backup plate, and the plate body and the backup plate is intended to separate.

  In the backup plate supply / recovery device of the present invention, any one of the plurality of types of backup plates can be sent out from the magazine mechanism. When the plate body is moved up via the elevating mechanism, the plate body and the backup plate are integrated. Further, by lowering the plate main body via the elevating mechanism in a state where the plate main body and the backup plate are integrated, the plate main body and the backup plate are separated. The backup plate thus separated can automatically supply and collect (replace) the backup plate instead of manually.

  A transport mechanism for transporting either a substrate to be held on a shuttle integrated with the plate body and the backup plate, or a backup plate of a magazine mechanism can be provided. In the apparatus provided with such a transport mechanism, the substrate and the backup plate can be transported from the magazine mechanism to the plate body side, or can be collected from the plate body side to the magazine mechanism.

  With one magazine mechanism, the backup plate of this magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is provided via the one transport mechanism or another transport mechanism. , And can be collected by the one magazine mechanism. With this configuration, only one magazine mechanism that can be supplied to the plate main body and collected from the plate main body is required, and the entire apparatus can be made compact.

  At least one pair of magazine mechanisms is provided, and the backup plate of one magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via one transport mechanism or another transport mechanism. Thus, the configuration may be such that the magazine is collected by the one magazine mechanism or another magazine mechanism. With this configuration, the backup plate to be collected can be collected in the magazine mechanism or another magazine mechanism that has supplied the backup plate, and the workability can be improved.

  At least three or more magazine mechanisms are provided, and a backup plate of any one of the magazine mechanisms is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is the one transport mechanism or another backup mechanism. A configuration may be adopted in which the backup plate is collected by a magazine mechanism supplied thereto or another magazine mechanism via a transport mechanism. With this configuration, various types of backup plates can be supplied to the plate body from three or more magazine mechanisms, and the backup plate can be collected by any one of the magazine mechanisms. Become.

  The transport mechanism transports the backup plate from the magazine mechanism to the plate body along the transport rail, or transports the backup plate separated from the plate body to the magazine mechanism along the transport rail. It is preferable to provide a pair of guide rails facing each other, and each of the guide rails has a plate support for receiving the backup plate. With this configuration, the backup plate is transported while being supported by the transport rail, and can be transported stably when transporting the backup plate by the transport mechanism.

  The pair of guide rails can expand and contract the guide rail interval, allow the backup plate to pass between the guide rails when the interval is expanded, and allow the guide rail to receive the backup plate on the guide rail when the interval is reduced It is preferred that

  The backup plate preferably includes information for identifying the type. As described above, the apparatus having the information for identifying the type can identify the backup plate to be supplied, and can prevent erroneous use (erroneous mounting).

  In this case, it is preferable to provide an identification mechanism for identifying information on the backup plate. As described above, in the apparatus provided with the identification mechanism, the reliability of prevention of erroneous use (erroneous mounting) is improved.

  It is preferable that the backup plate is provided with a posture detecting mechanism for detecting a mounting posture of the backup plate to the plate body. In a device provided with such a posture detecting mechanism, the backup plate can be mounted on the plate body in a stable posture (normal posture).

  The backup plate and the plate main body can be configured to be integrated with each other by a concave-convex fitting structure. In this way, the integration by the concave-convex fitting structure makes it possible to integrate the backup plate and the plate body with a simple or simple structure. Here, the concave-convex fitting structure means that a convex portion is provided on one member, and a concave portion is formed on the other member so that the convex portion is fitted. Thus, these two members are integrated. For this reason, a convex portion can be provided on the backup plate side and a concave portion can be provided on the plate body side, or a concave portion can be provided on the backup plate side and a convex portion can be provided on the plate body side. As means for maintaining the plate body and the backup plate in an integrated state, it is desirable to have a vacuum suction or a lock mechanism.

  The die bonder of the present invention is a die bonder for bonding a chip to an island portion of a substrate, wherein a backup plate is transported by the backup plate supply / recovery device, and the backup plate and the plate body are integrated, The substrate is supported by the backup plate.

  ADVANTAGE OF THE INVENTION According to the die bonder of this invention, the backup plate suitable for board size and board design pattern can be used, and a board | substrate can be supported by this backup plate. Therefore, the chip on the substrate can be stably bonded.

  The bonding method of the present invention is a bonding method of bonding a chip to an island portion of a substrate, wherein the backup plate supply / recovery device transports the backup plate to the plate body, and integrates the plate body and the backup plate. Then, the substrate is bonded to the island portion of the substrate while the substrate is supported by the backup plate.

  ADVANTAGE OF THE INVENTION According to the bonding method of this invention, a board | substrate can be supported by the backup plate suitable for board | substrate size and board | substrate design pattern. Therefore, the chip on the substrate can be stably bonded.

  According to the present invention, the supply and recovery (replacement) of the backup plate can be performed automatically instead of manually. When the backup plate is heated and used, the backup plate can be replaced without waiting for so-called cooling, and the productivity is excellent.

It is a simplified block diagram of a backup plate supply / recovery device of the present invention. FIG. 2 is a perspective view of a transfer rail for supplying and collecting a backup plate shown in FIG. 1. It is a simplified diagram of a backup plate supply / recovery device of the present invention. FIG. 4 is a schematic cross-sectional view of a main part showing a relationship between a backup plate, a plate body, and a guide rail, in a state where the backup plate is transported to a position above the plate body via the guide rail. It is a principal part simplified sectional view in the state which showed the relationship between the backup plate, the plate main body, and the guide rail, lifted the plate main body, and integrated the backup plate and the plate main body. FIG. 4 is a simplified cross-sectional view of a main part showing a relationship between a backup plate, a plate main body, and a guide rail, in a state where a distance between guide rails is enlarged. FIG. 6 is a simplified cross-sectional view of a main part showing a relationship between a backup plate, a plate main body, and a guide rail, in a state where the plate main body is lowered in a state in which a space between the guide rails is enlarged. FIG. 4 is a simplified diagram showing a relationship between a backup plate, a plate body, and a guide rail, and showing a state in which a substrate is transferred onto the backup plate via the guide rail. FIG. 4 is a simplified view showing a relationship between a backup plate, a plate body, and a guide rail, in a state where the plate body is raised and a substrate is sucked to the backup plate. It is a simplified diagram showing a work. It is a simplified diagram showing the operation of the bonding device.

  Hereinafter, an embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a simplified block diagram of a backup plate supply / recovery device according to the present invention, FIG. 2 is a perspective view of a transfer rail of the backup plate supply / recovery device, and FIG. FIG. This backup plate supply / recovery device sends out one arbitrary backup plate 2 from a plurality of types of backup plates (adapter plates) 2 from a loader 15 and sends the backup plate 2 downstream via a transport path having a transport rail 5. The backup plate 2 is supplied to the plate body 1 which is conveyed to the side and disposed on the conveyance path, and the supplied backup plate 2 is recovered from the plate body 1 and supplied to the unloader 16.

  As shown in FIG. 1, the backup plate supply / recovery device includes one magazine mechanism (upstream magazine mechanism 3) that can send out any one backup plate 2 from a plurality of types of backup plates 2, The other magazine mechanism (downstream magazine mechanism 4) capable of storing any one of the types of backup plates 2 and the backup plate 2 sent from the upstream magazine mechanism 3 are transported to the transport rail 5. One transport mechanism (upstream transport mechanism 6) for transporting the plate body 1 along the other side, another transport mechanism (downstream transport mechanism 7) for transporting the plate body 1 to the downstream magazine mechanism 4, and the plate body 1 A lifting mechanism 8 for raising and lowering. The plate body 1 reciprocates along the transport rail 5 in the horizontal direction by the reciprocating mechanism 9 in addition to the elevating mechanism 8 moving up and down. The shuttle 10 is constituted by the plate main body 1 and the backup plate 2, and the shuttle 10 is moved up and down by a driving means 11 composed of an elevating mechanism 8 and a reciprocating mechanism 9, and reciprocates in a horizontal direction. I do. That is, the backup plate supply / recovery device shown in FIG. 1 includes a pair of magazine mechanisms 3 and 4 and a pair of transport mechanisms 6 and 7.

  As the elevating mechanism 8 and the reciprocating mechanism 9, known and public reciprocating mechanisms such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used. As shown in FIGS. 4A, 4B, and 5, the plate body 1 is formed of a rectangular flat plate, and has a projection 1a provided on the upper surface thereof. The backup plate 2 is formed of a flat rectangular body having notches 2a and 2a provided on the long side of the lower surface, and has a recess 2b in which the projection 1a is fitted. That is. The convex portion 1a and the concave portion 2b fitted to the convex portion 1a can constitute a concave / convex fitting structure M for integrating the plate body 1 and the backup plate 2.

  The shuttle 10 including the plate body 1 and the backup plate 2 is provided with a heating mechanism 12 and a suction mechanism 13. The heating mechanism 12 can be constituted by, for example, a heating wire built in the plate body 1 and a power supply for heating the heating wire, but is not limited to this, and is a device using steam. Or induction heating may be used. That is, it is sufficient if the substrate 22 needs to be heated and the heating method does not adversely affect the substrate 22 or the chip. The suction mechanism 13 includes, for example, a suction passage provided in the shuttle 10 (the plate body 1 and the backup plate 2) and a vacuum generator connected to the suction passage. 2 is formed with a suction port that opens on the upper surface. The vacuum generator may use a vacuum pump or an ejector system that controls the opening and closing of high-pressure air and discharges the high-pressure air from a nozzle to a diffuser to generate a negative pressure in a diffusion chamber.

  The upstream magazine mechanism 3 includes a loader 15 (see FIG. 3) in which a plurality of backup plates 2 are arranged vertically, a lifting mechanism (not shown) for raising and lowering the loader 15, and a predetermined height position. And a pusher mechanism (not shown) provided. For this reason, the loader 15 is raised and lowered, and one of the backup plates 2 stored in the loader 15 is made to correspond to the pusher mechanism. Then, in this state, the backup plate 2 whose height has been adjusted is pushed out toward the transport rail 5 by the pusher mechanism.

  The downstream magazine mechanism 4 includes an unloader 16 (see FIG. 3) in which a plurality of backup plates 2 are vertically arranged, a lifting mechanism (not shown) for raising and lowering the unloader 16, and a predetermined height. And a pusher mechanism (not shown) disposed at the position. The unloader 16 is moved up and down so that the storage portion at a predetermined height of the backup plate conveyed via the conveyance rail 5 corresponds to the pusher mechanism. Then, in this state, the backup plate 2 is pushed into the storage portion whose height has been adjusted.

  As shown in FIGS. 2, 4A, 4B, and 5A to 5D, the transfer rail 5 has a pair of guide rails 5a, 5a disposed in parallel, and expansion and contraction of a guide rail interval between the guide rails 5a, 5a. And a guide rail enlarging / reducing mechanism 17 (see FIG. 1) for performing the following. Each of the guide rails 5a, 5a is formed of a strip-shaped body, and a receiving piece 5a1, 5a1 is protruded from a central portion in the vertical direction of each opposing surface. As the guide rail expansion / contraction mechanism 17, a publicly-known and public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used. 4A and 4B, the pair of guide rails 5a, 5a approach each other to hold the backup plate 2, and the pair of guide rails 5a, 5b as shown in FIG. 5D. The guide rails 5a and 5a are separated from each other, and are displaced so that the backup plate 2 between the guide rails 5a and 5a can be lowered.

  Each of the upstream transport mechanism 6 and the downstream transport mechanism 7 has a chuck section for chucking the backup plate 2 and a reciprocating mechanism for reciprocating the chuck section along the transport rail 5. The chuck portion can be composed of, for example, an openable and closable chuck claw, and as the reciprocating mechanism, a known and public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, and a linear guide mechanism can be used.

  Further, as shown in FIG. 1, the apparatus includes a posture detecting mechanism 18 for detecting a mounting posture of the backup plate 2 to the plate body 1 and an identification mechanism 19 for identifying information on the backup plate 2. The information of the backup plate 2 is information for matching with information of a substrate to be attracted to the backup plate. Here, the information on the substrate includes a substrate size, a substrate design pattern, and the like.

  The posture detecting mechanism 18 includes an image recognition camera (not shown), and detects a difference between the position coordinates of the plate body 1 whose position coordinates have been calculated in advance and the position coordinates of the backup plate 2 calculated using the image recognition camera. Things. Therefore, correct mounting can be achieved by correcting this difference. That is, the image recognition camera can detect (calculate) the position coordinates of the plate body 1 and detect (calculate) the position coordinates of the backup plate 2. For this reason, the difference between these positions is calculated in the calculation unit of the control means 20 (see FIG. 1), whereby the position correction (position correction) of the plate body 1 and / or the backup plate 2 is performed, and the plate body 1 and the backup plate 2 can be aligned.

  The identification mechanism 19 reads an identified part provided on the backup plate 2. Here, the part to be identified can be composed of printed characters, symbols, figures, bar codes, QR codes (registered trademark), and the like. As a reading means, characters, symbols, figures, and the like can be read by image processing or the like, a bar code can be read by a bar code reader, and a QR code can be read by a QR code reader.

  The mechanisms 3, 4, 6, 7, 12, 13, 17, 18, and 19 are controlled by control means 20. The control means 20 is, for example, a microcomputer in which a ROM (Read Only Memory) and a RAM (Random Access Memory) are connected to each other via a bus centering on a CPU (Central Processing Unit), similarly to the bonding apparatus. is there. The ROM stores programs and data executed by the CPU.

  Further, in the shuttle 10 in which the backup plate 2 and the plate main body 1 are integrated, the supplied member S (substrate 22) transported via the transport rail 5 is provided with the transport rail 5 as shown in FIG. 5D, is attracted to the shuttle 10 as shown in FIG. 5D, and is transported to the supply position of the transport rail 5 in a state where the supplied member S is attracted, and as shown in FIG. The work W is mounted on the S supply site Sa.

  As shown in FIG. 6, the work W is a chip 21 cut out from a wafer (work aggregate) 26, and the chip 21 of the wafer 26 has a plurality of grades. In this embodiment, there are three types of grades, and these three types of grades are referred to as a first grade, a second grade, and a third grade. Further, in one wafer 26, the first grade is large, and the second and third grades are small. In this case, the second grade may be greater than the third grade, the third grade may be greater than the second grade, or the second and third grades may have the same number.

  The supplied member S is a substrate 22 such as a lead frame, and the supplied portion Sa is an island portion 22a on the substrate 22, and the chip 21 is bonded to each island portion 22a. At this time, a bonding apparatus (die bonder) as shown in FIG. 7 is used. Such a bonding apparatus picks up a chip (semiconductor chip) 21 cut out from a wafer 26 at a pickup position P with a collet (adsorption collet) 23 and transfers (mounts) it to a bonding position Q of a substrate 22 such as a lead frame. Is what you do. The wafer 26 is adhered onto a wafer sheet (adhesive sheet 25) stretched over a metal ring (wafer ring), and is divided (divided) into a number of chips 21 by a dicing process.

  As shown in FIG. 7, the collet 23 moves up in the direction of arrow A and descends in the direction of arrow B on the pickup position P, rises in the direction of arrow C and descends in the direction of arrow D on the bonding position Q, and picks up. Reciprocation in the directions of arrows E and F between the position P and the bonding position Q is enabled. The collet 23 is attached to a bonding head (not shown), and the bonding head is attached to a bonding arm (not shown). Therefore, the bonding arm is controlled by control means (not shown), and the movement of the collet 23 by the arrows A, B, C, D, E, and F is controlled. The control means is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus centering on a CPU (Central Processing Unit). The ROM stores programs and data executed by the CPU.

  As described above, in this embodiment, the chip 21 has the first grade, the second grade, and the third grade. Further, chips 21 of the same grade are mounted on one substrate 22. Therefore, the substrate 22 includes a substrate 22 (22A) on which the first-grade chip 21 is mounted, a substrate 22 (22B) on which the second-grade chip 21 is mounted, and a third grade. There is a substrate 22 (22C) on which the chip 21 is mounted.

  For this reason, the backup plate 2 includes a first backup plate 2A corresponding to the substrate 22A, a second backup plate 2B corresponding to the substrate 22B, and a third backup plate 2A for the substrate 22C. The loaders 15 include a first loader 15A in which the backup plate 2A is stored, a second loader 15B in which the backup plate 2B is stored, and a third loader 15C in which the backup plate 2C is stored. The unloader 16 includes a first unloader 16A in which the backup plate 2A is stored, a second unloader 16B in which the backup plate 2B is stored, and a third unloader 16C in which the backup plate 2C is stored. .

  Next, the operation of the backup plate supply / recovery device configured as described above will be described. For example, when a first-grade chip 21 is mounted, a substrate 22 (22A) on which the first-grade chip 21 is mounted is used. Therefore, the backup plate 2A corresponding to the substrate 22A is used as the backup plate 2 of the shuttle 10.

  The backup plate 2A is sent out from the loader 15, guided by the transport rail 5 (received by the receiving pieces 5a1, 5a1), and is transferred to the plate body 1 using the upstream transport mechanism 6 as shown in FIG. Position above. That is, the receiving pieces 5a1 and 5a1 of the transport rail 5 are fitted to the notches 2a and 2a of the backup plate 2 (2A) and are supported by the transport rail 5. Further, the plate body 1 descends and is positioned lower than the receiving pieces 5a1 and 5a1 of the transport rail 5. In this case, as described above, the difference between the position coordinates of the shuttle 10 and the position coordinates of the backup plate 2 is corrected by the image recognition camera.

  Then, by raising the plate body 1 from this state, the convex portion 1a of the plate body 1 is fitted into the concave portion 2b of the backup plate 2, and as shown in FIG. 4B, the plate body 1 and the backup plate 2 are separated from each other. Integrate. In this case, the backup plate 2 is chucked by the chuck portion of the upstream-side transport mechanism 6, and the elevation of the backup plate 2 with the elevation of the plate main body 1 is regulated. It can be fitted into the recess 2b.

  With the plate body 1 and the backup plate 2 integrated in this way, the substrate 22 (22A) is guided by the transport rail 5 (received by the receiving pieces 5a1, 5a1), and the upstream transport mechanism 6 As shown in FIG. 5A, the substrate 22A is positioned above the shuttle 10 including the plate main body 1 and the backup plate 2.

  For this reason, as shown in FIG. 5A, the guide rails 5a of the transport rail 5 are relatively separated. In other words, the guide rails 5a, 5a are expanded to make the interval between the receiving pieces 5a1, 5a1 larger than the width dimension of the backup plate 2. When the interval between the receiving pieces 5a1 and 5a1 is W1 and the width of the backup plate 2 is W, W1> W. Then, the shuttle 10 is lowered as shown in FIG. 5B. In this case, it is positioned lower than the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5s.

  The substrate 22 (22A) is sent out from a loader (a loader different from the loader 15 storing the backup plate 2 and storing the substrate 22), and the substrate 22A is guided by the transport rail 5. Then, as shown in FIG. 5C, the sheet is transferred onto the shuttle 10 using the upstream transfer mechanism 6. In this case, the backup plate 2 of the shuttle 10 has a shape corresponding to the substrate 22A, that is, the first plate 2A is mounted on the plate body 1. The interval between the receiving pieces 5a1 and 5a1 is smaller than the width of the substrate 22 (22A), and the dimension between the opposing surfaces of the guide rails 5a and 5a facing the receiving pieces 5a1 and 5a1 is the width of the substrate 22 (22A). It is larger than the size. That is, when the interval between the receiving pieces 5a1, 5a1 is W1, the width of the substrate 22 is W3, and the dimension between the opposing surfaces is W2, W1 <W3 <W2. Thus, the substrate 22 can be received by the receiving pieces 5a1 and 5a1.

  Then, as shown in FIG. 5C, in a state where the substrate 22 on the shuttle 10 is provided, as shown in FIG. 5D, the shuttle 10 is raised, and the substrate 22 is attracted to the upper surface of the shuttle 10. At this time, it is preferable to press the substrate 22 with a clamper or the like (not shown).

  As described above, the substrate 22 sucked and held by the shuttle 10 is heated, and the chip 21 as the work W is bonded to the island portion 22a of the substrate 22. In the bonding step, after the bonding to the islands 22a (see FIG. 7) in a row in a direction perpendicular to the transport direction (longitudinal direction) is completed, the shuttle 10 receiving the bonded substrate 22 is moved downstream. It is moved by a predetermined amount via the reciprocating mechanism 9 to enable bonding to the next row of island portions 22a.

  When the mounting of the chip 21 on the substrate 22 (22A) is completed, as shown in FIG. 5C, the substrate 22 is supported on the receiving pieces 5a1, 5a1 of the guide rails 5a, 5a, and Then, it is transported to a downstream unloader (an unloader different from the unloader 16 in which the backup plate 2 is stored, in which the substrate 22 is stored), and the substrate 22 is stored in this unloader.

  When the chip 22 to be mounted is changed or the like and the substrate 22A is changed to the substrate 22B, as shown in FIG. 4B, the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a are replaced with the notch 2a of the backup plate 2. 2a, the plate body 1 is lowered. Accordingly, only the plate body 1 is lowered in a state where the backup plate 2 is received by the receiving pieces 5a1 and 5a1 of the guide rails 5a and 5a, and the plate body 1 and the backup plate 2 are separated. In this state, the backup plate 2 is transported to the unloader 16 via the downstream transport mechanism 7, and the backup plate 2 is stored in the unloader 16.

  Thereafter, another backup plate 2, for example, the backup plate 2B is sent out from the loader 15B, and this backup plate 2B is arranged above the plate main body 1 using the upstream transport mechanism 6 as shown in FIG. 4A. Thereafter, by lowering the plate main body 1, the plate main body 1 and the backup plate 2B are integrated.

  Thereby, the shuttle 10 for the substrate 22B can be configured, and the substrate 22B is sent out from a loader (a loader different from the loader 15 storing the backup plate 2 and storing the substrate 22). By supplying the board 22B to the shuttle 10, the chip 21 can be mounted on the board 22B. When the mounting of the chip 21 on the substrate 22B is completed, the substrate 22B is unloaded on the downstream side (an unloader different from the unloader 16 in which the backup plate 2 is stored, in which the substrate 22 is stored). Can be supplied to

  Hereinafter, when mounting (bonding) the chip 21 of the different substrate 22, the backup plate 2 (2 C) can be replaced by the above-described process, and the substrate 22 C can be suction-held on the backup plate 2 C, and can be attached to the substrate 22 C. The chip 21 can be mounted.

  In the backup plate supply / recovery device of the present invention, any one of the plurality of types of backup plates 2 can be sent from the upstream magazine mechanism 4 and the backup plate 2 is transported to the upstream side. It can be transported to the plate body 1 by the mechanism 6. This conveyance is carried to the plate body 1 while being supported by the conveyance rail 5. Then, the plate main body 1 and the backup plate 2 are integrated by raising the plate main body 1 via the elevating mechanism 8. The plate body 1 and the backup plate 2 are separated from each other by lowering the plate body 1 via the elevating mechanism 8 in a state where the plate body 1 and the backup plate 2 are integrated. The backup plate 2 thus separated is transported by the downstream transport mechanism 7 to the downstream magazine mechanism 4. In this case, the backup plate 2 is transported while being supported by the transport rail 5.

  That is, the supply and recovery (replacement) of the backup plate 2 can be performed automatically instead of manually. When the backup plate 2 is heated and used, the backup plate 2 can be replaced without waiting for so-called cooling, and the productivity is excellent.

  Each of the guide rails 5a, 5a has a plate supporting portion (receiving pieces 5a1, 5a1) for receiving the backup plate 2. With this configuration, when the backup plate 2 is transported by the upstream transport mechanism 6 or the downstream transport mechanism 7, the backup plate 2 can be transported stably.

  Since the pair of guide rails 5a, 5a can expand and contract the guide rail interval, it is possible to stably support (receive) the backup plate 2 according to the size of the back plate 2. Further, since the backup plate 2 has information for identifying the type, the backup plate 2 to be supplied can be identified, and erroneous use (erroneous mounting) can be prevented. In the case where the identification mechanism for identifying the information of the backup plate 2 is provided, the reliability of prevention of erroneous use (erroneous mounting) is improved.

  In the apparatus provided with the posture detecting mechanism 18 for detecting the mounting posture of the backup plate 2 on the plate main body 1, the backup plate 2 can be mounted on the plate main body 1 in a stable posture (normal posture).

  When the backup plate 2 and the plate body 1 are integrated by the concave-convex fitting structure M, the backup plate 2 and the plate body 1 can be integrated with a simple structure. Here, the concave-convex fitting structure M means that a convex portion is provided on one side member, and a concave portion is formed on the other side member, where the convex portion is fitted. Then, these two members are integrated. For this reason, a convex portion can be provided on the backup plate 2 side and a concave portion can be provided on the plate body 1 side, or a concave portion can be provided on the backup plate 2 side and a convex portion can be provided on the plate main body 1 side. As means for maintaining the plate body and the backup plate in an integrated state, it is desirable to have a vacuum suction or a lock mechanism.

  According to the die bonder of the present invention, since the backup plate supply / recovery device according to the present invention is used, it is possible to use the backup plate 2 according to the substrate size and the substrate design pattern, and the substrate 22 is supported by the backup plate 2. can do. Therefore, the chip 21 on the substrate 22 can be stably bonded.

  According to the bonding method of the present invention, since the backup plate supply / recovery device according to the present invention is used, the base can be supported by the backup plate that matches the substrate size and the substrate design pattern. Therefore, the chip on the substrate can be stably bonded.

  By the way, the transport mechanisms 6 and 7 for transporting the backup plate 2 can also serve as transport mechanisms for transporting the substrate 22. That is, the transfer mechanisms 6 and 7 can be shared for transferring the backup plate 2 and transferring the substrate 22. By sharing in this way, the overall size of the apparatus can be reduced.

  In the above-described embodiment, the backup plate 2 is connected to the plate body 1 via an upstream transport mechanism 6 having a chuck section for chucking the backup plate 2 and a reciprocating mechanism for reciprocating the chuck section along the transport rail 5. However, the backup plate 2 may be transported to a position above the plate body 1 via another transporting means such as a crane. With this configuration, it is not necessary to use the transport rail 5, and the apparatus can be made compact.

  Further, in the above embodiment, the backup plate 2 is transported by the upstream transport mechanism 6, but the plate body 1 may be transported by the upstream transport mechanism 6, and the backup plate 2 and the plate body may be transported. Any of 1 and 2 may be transportable by the upstream transport mechanism 6. That is, at least one of the backup plate 2 and the plate body 1 is transported, and the backup plate 2 is disposed on the plate body 1 by the relative movement between the backup plate 2 and the plate body 1. Is also good.

  In the above embodiment, a pair of magazine mechanisms 3 and 4 and a pair of transport mechanisms 6 and 7 are provided, and the backup plate 2 of the magazine mechanism 3 is transported by the transport mechanism 6 to the plate body 1 side. The backup plate 2 separated from the plate body 1 is transported to the magazine mechanism 4 via the transport mechanism 7.

  On the other hand, the backup plate 2 of the magazine mechanism 4 is transported to the plate body 1 side by the transport mechanism 7, and the backup plate 2 separated from the plate body 1 is transported to the magazine mechanism 3 via the transport mechanism 6. May be used.

  Further, the backup plate 2 separated from the plate body 1 may be collected by the magazine mechanism 3 or the magazine mechanism 4 via the transport mechanism 6 or the transport mechanism 7. That is, the backup plate of one magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported to the one magazine via one transport mechanism or another transport mechanism. It may be collected in a mechanism or another magazine mechanism. With this configuration, the backup plate to be collected can be collected in the magazine mechanism or another magazine mechanism that has supplied the backup plate, and the workability can be improved.

  The magazine mechanism may be a single machine. That is, one of the magazine mechanisms 3 (4) is provided, and the backup plate 2 of the magazine mechanism 3 (4) is collected in the magazine mechanism 3 (4) by any of the transport mechanisms 6 (7). There may be. That is, the backup plate of the magazine mechanism is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is supplied to the one magazine mechanism via the one transport mechanism or another transport mechanism. It can be configured to be collected at the same time. With this configuration, only one magazine mechanism that can be supplied to the plate main body and collected from the plate main body is required, and the entire apparatus can be made compact.

  Further, at least three or more magazine mechanisms may be provided. That is, at least three or more magazine mechanisms are provided, and the backup plate of any one of the magazine mechanisms is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is the one transport mechanism or The back plate may be collected by the supplied magazine mechanism or another magazine mechanism via another transport mechanism. With such a configuration, various types of backup plates can be supplied to the plate body from three or more magazine mechanisms, and the backup plate can be collected by any one of the magazine mechanisms, resulting in a device that is excellent in convenience. .

  The present invention can be variously modified without being limited to the above-described embodiment. For example, in the above-described embodiment, the substrate 22 on which the chip 21 cut out from the wafer 26 is bonded as the supply target member S. However, instead of such a substrate 22, a card such as a credit card, a cash card, or an IC card, or a flat body such as a sheet metal may be used. For this reason, the work W supplied to the supply target member S is not limited to the chip 21, but is a component corresponding to the supply target member S. In addition, if the supply target member S is not the substrate 22 and does not require heating, the heating mechanism 12 of the shuttle 10 can be omitted.

  In the above embodiment, one shuttle 10 was used, but two or more shuttles may be provided. Further, the type of the backup plate 2 is not limited to three types, but may be one type, two types, or three or more types. When the backup plate 2 and the plate body 1 do not match each other in the case where the identification mechanism 19 is provided, when the backup plate 2 does not match (when an error occurs), a display means (for example, an alarm sound is generated when an error occurs). Or display that effect on a monitor or the like).

  In the embodiment, the concave portion 1b of the concave-convex fitting structure M is constituted by a through hole, but may be constituted by a stop hole having a bottom surface instead of the through hole. Further, the number of the protrusions 1a and the recesses 2b of the concave-convex fitting structure M is not limited to one each. Although the magazine mechanisms 3 and 4 are provided with the pusher mechanism in the embodiment, the magazine mechanisms 3 and 4 may not include such a pusher mechanism. When there is no pusher mechanism, the backup plate in the magazine mechanism 3 (4) can be pulled out by the transporting means 6, 7 or another pulling-out mechanism.

  Any one of the backup plates in the loader can be used to send any one of the backup plates, supply the backup plate to the plate body, and collect the supplied backup plate from the plate body. it can.

Reference Signs List 1 plate main body 1a convex portion 2, 2A, 2B, 2C backup plate 2b concave portion 3, magazine mechanism 5 transport rail 5a guide rail 5a1 receiving piece 6, 7 transport mechanism 8 elevating mechanism 9 reciprocating mechanism 10 shuttle 17 guide rail expanding and contracting mechanism 18 Posture detection mechanism 19 Identification mechanism 21 Chip 22, 22A, 22B, 22C Substrate

Claims (13)

A backup plate supply / collection device for supplying an arbitrary one of a plurality of types of backup plates to a plate body and collecting the supplied backup plate from the plate body,
A magazine mechanism that can send out any one backup plate from a plurality of types of backup plates, and a lifting mechanism that relatively raises and lowers the plate body and the backup plate,
The backup rate sent from the magazine mechanism is arranged at the upper position or the lower position of the plate body, and the plate body and the backup plate are moved up and down relative to the plate body and the backup plate via the elevating mechanism. Wherein the plate body and the backup plate are separated by a relative lowering or rising of the plate body and the backup plate via an elevating mechanism.   2. The backup according to claim 1, further comprising a transport mechanism for transporting any one of a substrate to be held on a shuttle in which the plate body and the backup plate are integrated, and a backup plate of a magazine mechanism. Plate supply and recovery device.   With one magazine mechanism, the backup plate of this magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is provided via the one transport mechanism or another transport mechanism. The backup plate supply / recovery device according to claim 1 or 2, wherein the backup plate is recovered by the one magazine mechanism.   At least one pair of magazine mechanisms is provided, and the backup plate of one magazine mechanism is supplied to the plate body via one transport mechanism, and the backup plate separated from the plate body is transported via one transport mechanism or another transport mechanism. The backup plate supply / recovery device according to claim 1 or 2, wherein the backup plate is recovered by the one magazine mechanism or another magazine mechanism.   At least three or more magazine mechanisms are provided, and a backup plate of any one of the magazine mechanisms is supplied to the plate main body via one transport mechanism, and the backup plate separated from the plate main body is the one transport mechanism or another backup mechanism. The backup plate supply / recovery device according to claim 1 or 2, wherein the backup plate is recovered by a magazine mechanism or another magazine mechanism to which the backup plate is supplied via a transport mechanism. The transport mechanism transports the backup plate from the magazine mechanism to the plate body along the transport rail, or transports the backup plate separated from the plate body to the magazine mechanism along the transport rail. The backup plate supply / recovery device according to claim 1 or 2, further comprising a pair of guide rails facing each other, each guide rail having a plate supporting portion for receiving a backup plate.   The pair of guide rails can expand and contract the guide rail interval, allow the backup plate to pass between the guide rails when the interval is expanded, and allow the guide rail to receive the backup plate on the guide rail when the interval is reduced The backup plate supply / recovery device according to claim 6, wherein:   The backup plate supply / recovery apparatus according to any one of claims 1 to 7, wherein the backup plate includes information for identifying a type.   The backup plate supply / recovery device according to claim 8, further comprising an identification mechanism for identifying information of the backup plate.   The backup plate supply / recovery device according to any one of claims 1 to 9, further comprising a posture detection mechanism for detecting a posture of the backup plate mounted on the plate body.   The backup plate supply / recovery device according to any one of claims 1 to 10, wherein the backup plate and the plate main body are integrated by an uneven fitting structure. A die bonder for bonding a chip to an island portion of a substrate,
A backup plate is transported by the backup plate supply / recovery device according to any one of claims 1 to 11, and a substrate is mounted on the backup plate in a state where the backup plate and the plate body are integrated. A die bonder characterized by being supported. A bonding method for bonding a chip to an island portion of a substrate,
The backup plate supply / recovery device according to any one of claims 1 to 11, wherein the backup plate is transported to the plate main body, the plate main body and the backup plate are integrated, and the backup plate is used as a substrate. A bonding method in which the substrate is supported and bonded to an island portion of the substrate.

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