JP7281266B2 - Magazine device, transfer device, transfer method, die bonder, and bonding method - Google Patents

Description

The present invention relates to a magazine device, a transfer device, a transfer method, a die bonder, and a bonding method.

In the manufacture of semiconductor devices, a chip bonding method is used in which a wafer containing a large number of elements is diced to separate individual semiconductor chips, which are then bonded one by one to predetermined positions on a lead frame or the like. is adopted. A die bonder (bonding device) is used for this chip bonding.

As shown in FIG. 17, the bonding apparatus includes a bonding arm (not shown) having a collet 3 for sucking the semiconductor chip 1 of the supply unit 2 and a confirmation camera (not shown) for observing the semiconductor chip 1 of the supply unit 2. and a confirmation camera (not shown) for observing the island portion 5 of the lead frame 4 at the bonding position.

The supply unit 2 includes a semiconductor wafer 6 (see FIG. 18), and the semiconductor wafer 6 is divided into a large number of semiconductor chips 1 . That is, the wafer 6 is attached to an adhesive sheet (dicing sheet), and this dicing sheet is held by an annular frame. Then, the wafer 6 on the dicing sheet is separated into individual chips 1 using a circular blade (dicing saw) or the like. Also, the bonding arm holding the collet 3 can be moved between the pick-up position and the bonding position via a transfer mechanism.

Also, the chip 1 is vacuum-sucked through the suction hole opened in the lower end surface of the collet 3 , and the chip 1 is attracted to the lower end surface of the collet 3 . Note that the chip 1 is removed from the collet 3 when this vacuum suction (vacuum drawing) is released.

Next, a die bonding method using this die bonder will be described. First, the chip 1 to be picked up is observed by a camera for confirmation placed above the supply unit 2, and after the collet 3 is positioned above the chip 1 to be picked up, the collet 3 is moved as shown by an arrow B. to pick up this chip 1. After that, the collet 3 is raised as indicated by arrow A.

Next, the island portion 5 of the lead frame 4 to be bonded is observed by a confirmation camera placed above the bonding position, and the collet 3 is moved in the direction of arrow E to move the collet 3 above the island portion 5. After positioning, the collet 3 is moved downward in the direction of arrow D to supply the chips 1 to the island portion 5 . After the chips are supplied to the island portion 5, the collet 3 is lifted as indicated by arrow C, and then returned to the waiting position above the pick-up position as indicated by arrow F.

As shown in FIG. 16, the collet 3 moves up in the direction of arrow A above the pick-up position P, moves down in the direction of arrow B, and moves up in the direction of arrow B above the bonding position Q by a moving mechanism (not shown) as a transport mechanism. Upward movement in the direction of C, downward movement in the direction of arrow D, and reciprocating movement in the directions of arrows E and F between the pick-up position P and the bonding position Q are allowed. The movement of the arrows A, B, C, D, E, and F of the moving mechanism is controlled by control means (not shown). As the movement mechanism, various mechanisms such as a cylinder mechanism, a ball screw mechanism, and a motor linear mechanism can be used, and an XYZ axis stage (stage device) can be used.

By the way, dies (chips) on a wafer to be picked up come in a plurality of grades depending on their electrical characteristics. When mounting such dies having a plurality of grades on a substrate, a die bonder is used for each grade. As a result, the working time is long and the productivity is poor.

Therefore, conventionally, a classified die classification map is created in which dies having different electrical characteristics on a wafer are classified into a plurality of grades, and a die is picked up from the wafer and bonded onto a substrate or die by a bonding head. , a die bonder has been proposed which transports sorted substrates corresponding to the sorted dies by transport lanes in units of the sorted substrates, and has a single transport lane and a single bonding head (Patent Document 1).

That is, two transport units having a function of transporting a plurality of substrates are installed in the apparatus, and the substrates are transported onto heating stages provided at fixed positions on the respective transporting units, and the wafers are transferred from the wafer to the first substrate. A grade (top grade) chip is picked up and bonded to a substrate supplied onto one transfer unit (first lane) with a dedicated bonding head. Chips other than the 1st grade on the same wafer are bonded to multiple substrates supplied on another transfer unit (second lane) by the same dedicated bonding head while exchanging substrates for each grade. .

Japanese Patent No. 6124969

Generally, in a die bonder, a substrate is supplied from a loader to a bonding position, a chip is mounted on the substrate at this bonding position, and the substrate with the chip mounted thereon is supplied to an unloader.

However, the loader requires a number of magazines corresponding to the number of boards on which chips of multiple grades are to be mounted, and the unloader also requires chips of multiple grades. The number of magazines for accommodating the substrates mounted with chips is required to correspond to the number of substrates on which the chips are mounted.

In this case, one wafer has chips of different grades (eg, first grade chips, second grade chips, third grade chips, etc.), and the chips are mounted from this one wafer. Therefore, in a state in which the first grade chips are not completely mounted on one substrate, there may be cases where the first grade chips disappear from the wafer and the second grade chips and third grade chips remain. . In such a case, it is necessary to supply second grade substrates or third grade substrates to the bonding positions. When sending out a substrate from a loader (magazine), it is necessary to push out the substrate with a pusher provided in the loader (magazine). However, since this pusher is arranged at a predetermined position, it is necessary to move the substrate to be delivered to a position where it can be pushed out by the pusher.

Also, when the board is stored in the unloader (magazine), it is necessary to push the board into the unloader (magazine) with a pusher provided at a predetermined position. Therefore, it is necessary to move the substrate to be pushed into a position where it can be pushed by the pusher.

For this reason, conventionally, when loading boards of multiple grades, the boards are returned to the magazine on the loader side, or an intermediate buffer is installed to temporarily wait for the magazine in the middle of work in this intermediate buffer. I was responding. In other words, a magazine capable of accommodating a plurality of substrates is provided in the upper and lower stages to store a plurality of substrates. The substrate is supplied to the bonding position via the means, and the substrate on which the chip mounting is completed is housed in the magazine on the unloader side. In this case, the magazine containing substrates on which chips have been completely mounted is supplied to the lower stage.

However, when it becomes necessary to bond a second grade chip, the substrate on which the second grade chip is to be mounted must be supplied to the bonding position, and the substrate on which the second grade chip is to be mounted must be accommodated. It is necessary to transport the magazine to a position where it is supplied to a feeder, which is transport means. Therefore, it is necessary to withdraw the magazine containing the substrates on which the first grade chips are mounted from the position where they are supplied to this feeder. Therefore, an intermediate buffer for magazine retraction is provided, and the magazine is temporarily retracted into this intermediate buffer. Then, when it becomes necessary to mount a chip on a substrate in the magazine that has been evacuated to the intermediate buffer, this magazine is transported again to the position where it is supplied to the feeder.

For this reason, by providing two upper and lower parts for arranging the magazines and providing an intermediate buffer, the overall size of the apparatus is increased, the cost is increased, and a transport loss occurs. Also, substrates on which chips of different grades are mounted may differ in size, etc. Therefore, there are magazines of different sizes. match or not. However, with the configuration as described above, it is necessary to move the magazine to a predetermined position for collation, resulting in an increase in work time.

SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a magazine device, a transfer device, a transfer method, a die bonder, and a bonding method that can simplify the entire apparatus, do not cause transfer loss, and are excellent in production. do.

The magazine device of the present invention comprises a table on which a plurality of magazines are placed, a horizontal reciprocating mechanism for horizontally reciprocating the table, and an elevating mechanism for vertically reciprocating the table. The magazine stores a plurality of supplied members on which works of the same grade are mounted, and the magazine stores the supplied members on which works of one grade are mounted. , and a member to be supplied on which a work of a grade different from the one grade is loaded is stored, and the one magazine is arranged at a predetermined horizontal position by driving the horizontal reciprocating mechanism. In this state, the one magazine is maintained at a predetermined height position by the operation of the elevating mechanism, and in this state, the one supplied member stored in the one magazine is taken out, or the one magazine is loaded. It accommodates one supplied member.

According to the magazine device of the present invention, the table on which a plurality of magazines are placed can reciprocate in the horizontal direction via the horizontal reciprocating mechanism. Therefore, any magazine on the table can be positioned at a predetermined horizontal position. In addition, since the table can be moved up and down via an elevating mechanism, each magazine on the table can be positioned at a predetermined height. Therefore, a desired magazine can be held at a predetermined horizontal position and a predetermined height position.

Therefore, if this magazine device is used on the loader side, the supplied member on which the work of the desired grade is mounted is taken out from one magazine (magazine containing the supplied member on which the work of the desired grade is mounted). be able to. Further, if this magazine device is used on the unloader side, one magazine (magazine for storing supplied members on which workpieces of desired grades are loaded) can store supplied members on which workpieces of desired grades are loaded. can do. For this reason, the magazine can be arranged at a position and height at which it is possible to supply a supply target member on which a work of a desired grade is mounted, or at a position where a supply target member on which a work of a desired grade is mounted can be accommodated. and height.

A single supply/recovery position is provided for supplying and retrieving magazines, and with one magazine corresponding to this supply/recovery position, this magazine is recovered, and the placement position of the magazine to be supplied is supplied. - It can be configured so that the magazine to be placed is supplied to this placement position in a state corresponding to the collection position.

With this configuration, the supply and collection of magazines can be performed at one supply/recovery position, and the device can be made compact.

It is preferable to have a comparison means for comparing the information of the member to be supplied and the information of the magazine. With such a comparison means, the operation of the magazine device can be continued even when the information on the supplied member and the information on the magazine match. do not match, the operation by the magazine device can be stopped. By stopping in this manner, it is possible to prevent a work that should not be loaded from being loaded on the supplied member, or to supply a supplied member that does not match the size of the supplied member to the magazine, thereby damaging the magazine side or causing the magazine to be damaged. It is possible to effectively prevent the supply member from being damaged.

It is preferable that the table has positioning means for each magazine mounted thereon. Thus, by having the positioning means, each magazine can be arranged (mounted) at a predetermined position (regular position) even if there is a difference in size. Thereby, each magazine can be accurately held at a predetermined horizontal position and a predetermined height position.

The conveying device of the present invention conveys each of the supplied members to a supply position between a loader and an unloader in order to supply a plurality of types of workpieces of different grades to the supplied portions of the supplied member for each grade, In the conveying device for conveying the supplied member on which the workpiece has been mounted to the unloader, the magazine device is used as the loader and the unloader.

According to the conveying apparatus of the present invention, in the loader, a supplied member on which a work of a desired grade is mounted is selected from one magazine (magazine containing supplied members on which a work of a desired grade is mounted). can be taken out. Further, in the unloader, it is possible to store supplied members on which works of desired grades are mounted in one magazine (magazine that stores supplied members on which works of desired grades are mounted).

In the die bonder of the present invention, the workpiece is a chip of a wafer, and the member to be supplied is a substrate serving as an island portion, which is a portion to be supplied, and is transported to a bonding position, which is a supply position, by using the transport device. Chips are sequentially bonded to the island portion of the substrate.

According to the die bonder of the present invention, substrates on which chips of a desired grade are mounted can be taken out from one magazine (a magazine containing supplied members on which workpieces of a desired grade are mounted). As a result, a substrate on which a desired grade chip is mounted can be transported to the bonding position, and a work corresponding to this substrate can be bonded to the island portion of the substrate. In other words, chips of different grades can be mounted on the board on which the chips are to be mounted.

A conveying method of the present invention conveys each supplied member to a supply position between a loader and an unloader in order to supply a plurality of types of workpieces of different grades to the supplied portion of the supplied member for each grade, A conveying method for unloading a member to be supplied on which a workpiece has been mounted to an unloader, wherein the magazine device is used for the loader and the unloader.

According to the conveying method of the present invention, the loader selects a supplied member on which a work of a desired grade is mounted from one magazine (magazine containing supplied members on which a work of a desired grade is mounted). can be taken out. Further, in the unloader, it is possible to store supplied members on which works of desired grades are mounted in one magazine (magazine that stores supplied members on which works of desired grades are mounted).

In the bonding method of the present invention, the workpiece is a chip of a wafer, and the member to be supplied is a substrate serving as an island portion, which is the portion to be supplied. Chips are sequentially bonded to the island portion.

According to the bonding method of the present invention, the substrate is transported to the bonding position using the transport method. In this case, even if there are a plurality of grades of chips as workpieces, the chips of each grade can be sequentially bonded to the substrate to which the chips of that grade are to be bonded.

According to the present invention, since a plurality of magazines placed (arranged) on the table can be moved horizontally and vertically at the same time, there is no magazine transfer loss. In addition, since it is not necessary to provide an intermediate buffer or the like for waiting the magazine, or to provide a space for mounting the magazine on the upper and lower tiers, the entire apparatus can be simplified and the cost can be reduced. be able to.

1 is a simplified block diagram of a magazine device of the present invention; FIG. FIG. 2 is a front view of the magazine device shown in FIG. 1; 1. The magazine apparatus shown in FIG. 1 is shown, (a) is a front view of a state where the table was moved backward, and (b) is a front view of a state where the table is moved forward. 1. The magazine apparatus shown in FIG. 1 is shown, (a) is a front view of the state which raised the table upwards, (b) is a front view of the state which lowered the table below. FIG. 4 is a simplified plan view of a horizontal reciprocating mechanism; It is a simplified side view of a lifting mechanism. A simplified block of a transport device. It is a perspective view which shows the conveyance path between a loader and an unloader. Fig. 2 shows the relationship between a transport rail, a substrate, and a shuttle, (a) being a simplified diagram of a state in which the substrate is placed on the shuttle, and (b) being a simplified diagram of a state in which the substrate is sucked by the shuttle. . Fig. 2 shows the relationship between the transport rail, the substrate and the shuttle, (a) is a simplified diagram of a state in which the guide rail interval of the transport rail is enlarged, and (b) is a simplified diagram of a state in which the shuttle and the substrate are lowered. is. FIG. 4 is a process diagram showing the transfer method of the present invention, from mounting a first grade work to mounting a second grade work. It is a mounting process drawing of the workpiece|work of the 3rd grade which shows the conveyance method of this invention. 1A shows a substrate transfer process, FIG. 1A is a simplified diagram of a state in which a first grade substrate is arranged at a supply position, and FIG. 1B is a simplified diagram of a state in which a first grade substrate is unloaded. (c) is a simplified diagram of a state in which the next substrate is transported to the supply position, and (d) is a simplified diagram of a state in which a first grade chip is bonded to a first grade substrate. 1A is a simplified diagram of a state in which a first grade chip is bonded to a first grade substrate, and FIG. 1B is a second grade substrate to a second grade substrate. It is a simplified diagram of a state in which chips are bonded, (c) is a simplified diagram of a state in which mounting of a second grade chip is completed and the substrate is unloaded from the apparatus, and (d) is the following. It is a simplified diagram of the state in which the substrate has been transported to the supply position, (e) is a simplified diagram of the state in which the second grade chip is bonded to the substrate for the second grade, and (f) is the state for the third grade. (g) is a simplified diagram of a state in which the third grade substrate is unloaded from the apparatus. 1 is a simplified diagram showing a work; FIG. 4 is a simplified diagram showing the operation of the bonding apparatus; FIG. 1 is a simplified diagram showing the operation of a typical bonding device; FIG. 1 is a simplified diagram showing a wafer; FIG.

An embodiment of the present invention will be described below with reference to FIGS. 1 to 16. FIG.

FIG. 1 shows a simplified block diagram of a magazine device according to the present invention, and FIG. 2 shows a front view of the magazine device. This magazine device comprises a table 51 on which a plurality of magazines 50 are placed, a horizontal reciprocating mechanism 52 for reciprocating the table 51 in the horizontal direction, and a reciprocating mechanism 52 for reciprocating the table 51 in the vertical direction. and an elevating mechanism 53 for This device constitutes a loader 56 disposed upstream of the transport path T shown in FIG. 7, and an unloader 57 disposed upstream of the transport path T. As shown in FIG.

A conveying device is arranged on the conveying path T between the loader 56 and the unloader 57. FIG. 7 shows a simplified block diagram, and this conveying device carries a plurality of types of works W (see FIG. 15) of different grades. In order to supply the supplied members S (see FIG. 16) to the supplied portions Sa (see FIG. 16) of the supplied members S (see FIG. 16) for each grade, the supplied members S are sequentially conveyed to the supply position Q (see FIG. 16). Here, as shown in FIG. 15, the work W is a chip 21 cut out from a wafer (work aggregate) 26, and the chips 21 of this wafer 26 have a plurality of grades. In this embodiment, there are three types of grades, and these three types of grades are called first grade, second grade and third grade. Also, in one wafer, there are many first grades, and there are few second grades and third grades. In this case, the number of second grades may be greater than that of third grades, the number of third grades may be greater than that of second grades, or the number of second grades and third grades may be the same.

The supplied member S is the substrate 22 such as a lead frame, and the supplied portion Sa is the eyed portion 22a on the substrate 22, and the chip 21 is bonded to each eyed portion 22a. At this time, a bonding apparatus (die bonder) as shown in FIG. 16 is used. In such a bonding apparatus, a chip (semiconductor chip) 21 cut out from a wafer 26 is picked up by a collet (suction collet) 23 at a pickup position P, and transferred (mounted) to a bonding position Q of a substrate 22 such as a lead frame. It is something to do. The wafer 26 is adhered to a wafer sheet (adhesive sheet 25) attached to a metal ring (wafer ring), and is divided (divided) into a large number of chips 21 by a dicing process.

In this way, the chips 21 have a plurality of grades (three types in the embodiment), and the chips 21 of the same grade are mounted on one substrate 22 . For this reason, there are a plurality (three types in the embodiment) of the substrate 22 according to the grade of the chip 21 . That is, as the substrate 22, in this embodiment, a substrate 22A on which a first grade chip 21 is mounted, a substrate 22B on which a second grade chip 21 is mounted, and a third grade chip 21 are mounted. There is a substrate 22C that is

As shown in FIG. 16, the collet 23 rises above the pickup position P in the direction of the arrow A and lowers in the direction of the arrow B, rises above the bonding position Q in the direction of the arrow C and lowers in the direction of the arrow D, and picks up. Reciprocating movement in the directions of arrows E and F between position P and bonding position Q is allowed. The collet 23 is attached to a bonding head (not shown), and this bonding head is attached to a bonding arm (not shown). Therefore, this bonding arm is controlled by control means (not shown), and the movement of the collet 23 along the arrows A, B, C, D, E, and F is controlled. The control means is, for example, a microcomputer in which a CPU (Central Processing Unit) is centered and a ROM (Read Only Memory), a RAM (Random Access Memory), etc. are interconnected via a bus. The ROM stores programs and data executed by the CPU.

As shown in FIG. 8, the transport device includes transport rails 30 for transporting substrates 22 and shuttles 31 for holding substrates. The transport rail 30 has a pair of parallel guide rails 30a, 30a.

As shown in FIG. 7, a guide rail expansion/reduction mechanism 35 for expanding/contracting the guide rail interval between the guide rails 30a, 30a, a shuttle transport mechanism 36 for transporting the shuttle 31 along the transport rail 30, and a shuttle 31 are lifted and lowered. A shuttle elevating mechanism 37 (moving up and down) is provided. A heating mechanism 38 and a suction mechanism 39 are attached to the shuttle 31 .

As shown in FIGS. 9 and 10, the guide rails 30a, 30a are made of strip-shaped bodies, and are provided with receiving pieces 30a1, 30a1 at their upper facing portions. I can receive it. The guide rail expansion/contraction mechanism 35 can use a known/public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, or a linear guide mechanism. In this guide rail expansion/contraction mechanism 35, the pair of guide rails 30a, 30a approach each other as shown in FIG. are separated from each other, and the board 22 and the shuttle 31 between the guide rails 30a, 30a are displaced so that they can move up and down.

The shuttle 31 is placed via an elevating mechanism 37 on a base (not shown). The substrate reciprocates (reciprocates in one axial direction) along the transport rails 30 via the shuttle transport mechanism 36. In this case, three shuttles 31 are provided and arranged at a predetermined pitch along the reciprocating direction. be done. Further, the lifting mechanism 37 can use a known/public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear guide mechanism, or the like.

In FIG. 9A, the substrate 22 is placed on the receiving pieces 30a1 of the guide rails 30a, 30a, and the shuttle 31 facing the substrate 22 is lowered. In FIG. 9B, the shuttle 31 facing the substrate 22 is lifted, and the substrate 22 is received by the shuttle 31 and separated from the receiving pieces 30a1, 30a1.

In FIG. 10(a), the substrate 22 is received by the shuttle 31, and the space between the guide rails 30a, 30a is open. In FIG. 10(b), the shuttle 31 is lowered and the board 22 is positioned below the receiving pieces 30a1, 30a1 of the guide rails 30a, 30a. In addition, in FIG. 10(b), the gap between the guide rails 30a, 30a is in a closed state.

The shuttle 31 is made of a flat plate having a flat upper surface, and the heating mechanism 38 can be composed of, for example, a heating wire built into the shuttle 31 and a power source for heating the heating wire. However, it is not limited to this, and it may be one using steam or one using induction heating. In other words, any method may be used as long as the member S to be supplied requires heating and the heating method does not adversely affect the member S to be supplied or the work W. FIG. The suction mechanism 39 is composed of, for example, a suction passage provided in the shuttle 31 and a vacuum generator connected to the suction passage. It is As the vacuum generator, a vacuum pump may be used, or an ejector system may be used in which high-pressure air is controlled to be opened and closed and released from a nozzle to a diffuser to generate negative pressure in the diffusion chamber.

Further, the substrate 22 is transported along the transport rails 30 by the substrate transport mechanism 40 . The substrate transfer mechanism 40 has a chuck portion that chucks the substrate 22 and a reciprocating mechanism that reciprocates the chuck portion along the transfer rails 30 . For example, the chuck portion can be composed of an openable and closable chuck claw or the like, and as the reciprocating mechanism, a known or public reciprocating mechanism such as a cylinder mechanism, a ball screw mechanism, a linear guide mechanism, etc. can be used.

By the way, each mechanism 35 , 36 , 37 , 38 , 39 , 40 is controlled by control means 45 . The control means 45 is, for example, a microcomputer in which a CPU (Central Processing Unit) is connected to a ROM (Read Only Memory), a RAM (Random Access Memory), etc. through a bus. be. The ROM stores programs and data executed by the CPU. Therefore, the control means 45 may constitute the control means of the bonding apparatus.

Next, a method of bonding a chip to the island portion 22a of the substrate 22 using the transfer apparatus configured as described above will be described. First, the most downstream shuttle 31 (hereinafter referred to as shuttle 31A) is positioned at the bonding position (supply position) Q (see FIG. 8, etc.). Then, the substrate transport mechanism 40 transports the substrate 22 (22A) on which the first grade chip is mounted onto the shuttle 31A.

At this time, the substrate 22 is also transported above the other shuttles 31 (the shuttle 31 in the middle is called the shuttle 31B, and the most upstream shuttle 31 is called the shuttle 31C). That is, the substrate 22 (22B) on which the second grade chip 21 is mounted is transported on the middle shuttle 31B by the substrate transport mechanism 40, and the third grade chip is transported on the uppermost shuttle 31C. The substrate 22 ( 22 C) to be mounted is transported by the substrate transport mechanism 40 . That is, the shuttles 31A, 31B, 31C and the substrates 22A, 22B, 22C are in the state shown in FIG. 7(a).

In this state, as shown in FIG. 11, bonding of the first grade chip 21 is started (step S1). After that, the process proceeds to step S2 to determine whether or not the mounting of the first grade chip 21 is completed (in this case, it is determined whether or not the mounting of the chip on the substrate 22A is completed). If completed in step S2, the process proceeds to step S3 to start bonding the second grade chip 21. FIG. At this time, the substrate 22 on which the first grade chips 21 have been mounted is conveyed downstream along the conveying rails 30 and unloaded from the apparatus. In this case, it is carried out as the state shown in FIG. 13(b). After that, the state shown in FIG. 13(c) is reached, and the next substrate 22A is transported onto the pallet 31A. At this time, the intermediate shuttle 31B and the substrate 22B sucked by it and the most upstream pallet 31C and the substrate 22C sucked by it are lowered, and the next substrate 22A is transferred on the pallet 31A. No hindrance. After that, the state shown in FIG. 13(d), that is, the state shown in FIG. 13(a) is restored, and the chip 21 can be bonded to the most downstream substrate 22A.

If not completed in step S2, the process proceeds to step S4. When bonding the chip 21, after bonding to the row of island portions 22a in the direction orthogonal to the transport direction (longitudinal direction) of the transport rail 30 is completed, the shuttle 31 receiving the bonded substrate 22 is mounted. is moved downstream by a predetermined amount to enable bonding to the next row of island portions 22a.

In step S4, it is determined whether or not the first grade chips 21 remain on the wafer 26 (determines whether or not there are remaining chips). If there are remaining, the process returns to step S2 to continue bonding the first grade chips 21 . In step S4, if there is no remaining board 22, the first grade board 22 is transported downstream along the transport rail to put the first grade board 22 in a retracted state. (Step S5) Namely, the state shown in FIG. 14(a) is changed to the state shown in FIG. 14(b). After that, the process proceeds to step S3, and bonding of the second grade chip 21 is started.

Once the bonding of the second grade chip 21 is started, the process moves to step S6, and it is determined whether or not the mounting of the second grade chip 21 is completed. If completed, the process proceeds to step S7 in FIG. At this time, as shown in FIG. 14(c), the substrate 22 on which the mounting of the second grade chip 21 is completed is transported downstream along the transport rail and out of the apparatus. At the time of carrying out, the state shown in FIG. 10(b) is reached, in which the substrate 22A for the first grade on the downstream side is lowered to a retracted state. The substrate 22B on which the second grade chip 21 has been mounted can be transported downstream without being obstructed by the substrate 22A. In this case, as shown in FIG. 14(d), the next substrate 22B is transported onto the shuttle 31B at the bonding position Q, after which the substrate 22B is sucked by the shuttle 31B, and the chip 21 is ready for bonding. do.

If not completed in step S6, the process proceeds to step S8. Also, when bonding the chips 21 to the substrate 22B for the second grade, after the bonding to the row of island portions 22a (see FIG. 16) in the direction orthogonal to the transport direction (longitudinal direction) of the transport rail 30 is completed, , the shuttle 31 receiving the substrate 22 being bonded is moved downstream by a predetermined amount to enable bonding to the next row of island portions 22a.

In step S8, it is determined whether or not the second grade chips 21 remain on the wafer 26 (determines whether or not there are remaining chips). If there are remaining, the process returns to step S6 to continue bonding the second grade chips 21 . In step S8, if there is no remainder, the second grade board 22 is transported downstream along the transport rail 30, and the first grade board 22A is put into a retracted state as shown in FIG. 14(e). do. After step S9, the process proceeds to step S7 shown in FIG. 12, and bonding of the third grade chip 21 is started in the state shown in FIG. 14(f).

After the bonding of the third grade chip 21 is started, the process moves to step S11, and it is determined whether or not the mounting of the third grade chip 21 is completed. If completed, the process proceeds to step S12. At this time, as shown in FIG. 14(g), the substrate 22C on which the chip 21 has been mounted is ready for downstream transportation, and the substrate 22C is transported (discharged) out of the apparatus. In this case, the board 22C on which the third grade chip 21 has been mounted is transported downstream along the transport rail 30 and carried out of the apparatus. The substrate 22A for the first grade and the substrate 22B for the second grade are in a retracted state in which they are lowered. undisturbed.

When bonding the chips 21 of the third grade, after the bonding to the row of island portions 22a (see FIG. 16) in the direction orthogonal to the transport direction (longitudinal direction) of the transport rail 30 is completed, this bonding is performed. The shuttle 31C receiving the substrate 22C being held is moved downstream by a predetermined amount to enable bonding to the next row of island portions 22a.

If the mounting is completed in step S11, the process proceeds to step S12 to determine whether or not this work should be completed.

If the mounting is not completed in step S11, the process proceeds to step S13 to determine whether or not the third grade chips 21 remain on the wafer 26 (determines whether or not there are remaining chips). If there is a remainder, the process returns to step S11 to continue the bonding of the third grade chip 21 . In step S13, if there are no remaining chips, the process proceeds to step S14 to determine whether or not all the chips 21 on the wafer 26 have been picked up. When all the chips 21 have been picked up, the process proceeds to step S15, the wafer 26 at the pickup position is replaced, and the process proceeds to step S1 in FIG.

In step S14, if all chips 21 have not been picked up, the process moves to step S16, and the remaining chips 21 are picked up and bonded. In this case, if the first grade chips 21 remain, the first grade chips 21 are bonded, and if the second grade chips 21 remain, the second grade chips 21 are bonded. , and if a third grade chip 21 remains, the third grade chip 21 is bonded. The bonding operation is continued until all chips 21 are picked up.

In this way, the chips 21 of different grades can be successively bonded to the substrates 22A, 22B and 22C to be mounted, and the substrates 22A and 22B that have been mounted are removed from the apparatus on the downstream side. You can carry it out.

In the conveying apparatus of the present invention, when the supplied member S to which the work W of the highest grade is supplied is conveyed to the supply position Q, the highest grade is sequentially supplied to the supplied portion Sa of the supplied member S. be. Then, when the work W has been completely loaded onto all the supplied parts Sa of the supplied member S, the supplied member S is transported downstream, and the supplied member S on which the work W has been completely loaded is moved to the downstream side. A new supply target member S to which a work W of the highest grade (first grade) is supplied is supplied to the supply position Q which has been carried out to and emptied. At this time, the shuttle 31 and the supplied member S on the upstream side of the supply position Q are lowered, and the transportation of the new supplied member S to the supply position Q is not hindered.

Then, the workpieces W of the first grade are sequentially supplied to the supply target portion Sa of the new supply target member S transported to the supply position Q. As shown in FIG. By the way, when the work W has been completely loaded onto all the supplied parts Sa of the supplied member S, the supplied member S is carried out to the downstream side. , for first grade workpieces when the first grade workpiece W in the workpiece supply source (workpiece assembly) is exhausted and workpieces of other grades (second grade and third grade) remain in this workpiece assembly is once conveyed to the downstream side, and the next grade (for example, the second grade) of the supplied member S is conveyed to the supply position Q. After that, the second grade work W in the work aggregate is supplied to the second grade supplied member S. As shown in FIG.

Then, when the loading of the second grade work W on the second grade supplied member S is completed, this supplied member S is carried out downstream. At this time, the shuttle 31 or the supplied member S, which are arranged downstream of the supply position Q, are in a lowered state, so that the downstream delivery of the second grade supplied member S is not hindered. In addition, when the second grade work W in the work supply source (work aggregate) is exhausted before the loading of the second grade work W is completed, and the third grade work W remains in the work aggregate, The supplied material S for the second grade is also conveyed to the downstream side of the supply position Q, and the supplied material S for the third grade is conveyed to the supply position Q.

Then, the workpieces W of the third grade are sequentially supplied to the supplied member S for the third grade. The supply member S is carried out downstream. At this time, the shuttle 31 or the supplied member S, which are arranged downstream of the supply position, are in a lowered state, and do not hinder the downstream delivery of the supplied member S for the third grade. In addition, when the third grade work W in the work supply source (work aggregate) runs out before the loading of the third grade work W is completed, in this case, the work W in the work aggregate runs out, A new work set will be replenished.

Therefore, the first grade supplied member S is returned to the supply position, and the first grade workpiece W is supplied to the first grade supplied member S. FIG. After that, when the mounting of the work W is completed, the supplied member S is carried out downstream. In the same way, second grade and third grade workpieces S can be sequentially supplied and carried out to the downstream side in sequence.

Therefore, in this conveying apparatus, it is possible to utilize information on the remaining number of works W for each grade in the work supply source (work aggregate) and the remaining number of supplied parts of the supplied member S, thereby reducing the conveying loss. becomes. Moreover, even if the grade of the work W is one type, it can be handled with a plurality of types, and the production efficiency can be improved. In addition, a simple lane can be used as a transport mechanism, and a plurality of shuttles can be used. Therefore, the single-lane and multi-shuttle systems are adopted, the transport mechanism can be configured simply, and the simplification of the entire apparatus can be achieved.

The transport rail 30 is provided with a pair of guide rails 30a, 30a facing each other, and each of the guide rails 30a, 30a has member receivers 30a1, 30a1 for receiving the supplied member S when the shuttle 31 descends. There may be. By having the member receiver 30a1 in this manner, the supplied member S can be stably arranged on the conveying rail 30. As shown in FIG.

It is preferable that the pair of guide rails 30a, 30a be able to expand and contract the distance between the guide rails. In this manner, if the guide rail interval can be expanded or reduced, the shuttle or the supplied member can be raised and lowered without being hindered by the guide rails 30a, 30a by increasing the guide rail interval.

In this embodiment, the transport mechanism 36 performs supply transport for supplying the supplied member S from the upstream side to the shuttle 31, and carry-out transport for transporting the supplied member S on which the workpiece W has been mounted to the downstream side. is.

Since the shuttle 31 has a heating mechanism 38 for heating the supply target member S, the substrate can be heated. can be glued together.

As shown in FIG. 2, the table 51 of the magazine device according to the present invention is provided with a plurality of (four in the figure) magazine loading positions H (H1, H2, H3, H4). Magazines 50 are placed at positions H1, H2, H3 and H4. The magazine 50 is supplied to the table 51 via the supply/collection mechanism 54, and the magazine 50 on the table 51 is collected. The supply/recovery mechanism 54 can be composed of, for example, chuck claws for chucking the magazine 50 and a moving mechanism (such as an XYZ table) for moving the chuck claws in three axial directions. The table 51 also has positioning means 55 for positioning the magazine 50 at each position H. As shown in FIG.

As shown in FIG. 5, the horizontal reciprocating mechanism 52 includes guide rails 61, 61 arranged on a base 60, and moving the guide rails 61, 61 horizontally along the guide rails 61, 61. sliders 62 , 62 that slide along, a substrate 63 arranged and fixed on the sliders 62 , 62 , 62 , 62 , and a reciprocating mechanism 64 for driving the substrate 63 .

The reciprocating mechanism 64 uses a ball screw mechanism in this case. That is, it includes a screw shaft 65 , a nut member 66 screwed onto the screw shaft 65 , and a motor 67 that drives the screw shaft 65 to rotate. The tip of the screw shaft 65 (on the side opposite to the motor) is pivotally supported by a support portion 68 having a bearing. The screw shaft 65 and the output shaft of the motor 67 are connected by a coupling (not shown).

Then, the nut member 66 and the substrate 63 are integrated. Therefore, when the motor 67 is driven, the nut member 66 screwed onto the screw shaft 65 reciprocates along the axis of the screw shaft 65 . Thus, when the nut member 66 reciprocates along the axis of the screw shaft 65 , the substrate 63 integrated with the nut member 66 is guided along the axis of the screw shaft 65 to the guide rail 61 . and reciprocate.

A base 70 of the lifting mechanism 53 is erected on the substrate 63 . As shown in FIG. 6, the lifting mechanism 53 slides the guide rails 71, 71 disposed on the base 70 along the guide rails 71, 71 in the vertical direction. It has sliders 72 , 72 , a substrate 73 arranged and fixed on the sliders 72 , 72 , 72 , 72 , and a reciprocating mechanism 74 for driving the substrate 73 .

The reciprocating mechanism 74 uses a ball screw mechanism in this case. That is, it includes a screw shaft 75 , a nut member 76 screwed onto the screw shaft 75 , and a motor 77 that drives the screw shaft 75 to rotate. The tip of the screw shaft 75 (on the side opposite to the motor) is pivotally supported by a support portion 78 having a bearing. The screw shaft 75 and the output shaft of the motor 77 are connected by a coupling (not shown).

Then, the nut member 76 and the substrate 73 are integrated. A table 51 is attached to the substrate 73 . Therefore, when the motor 77 is driven, the nut member 76 screwed onto the screw shaft 75 reciprocates along the axis of the screw shaft 75 . In this way, if the nut member 76 reciprocates along the axis of the screw shaft 75, the table 51 moves along the axis of the screw shaft 75 through the substrate 73 integrated with the nut member 76. Guided by the guide rail 71, it reciprocates.

Therefore, by driving the elevating mechanism 53, the table 51 moves up and down, and by driving the horizontal reciprocating mechanism 52, the table 51 moves in the horizontal direction ( back and forth).

As shown in FIG. 2, the supply/recovery mechanism 54 is arranged at a position corresponding to the fourth magazine placement position H4 with the table 51 moved backward. That is, in the state shown in FIG. 3A, the magazine 50 can be supplied to the magazine mounting position H4 via the supply/recovery mechanism 54, and the magazine 50 on the magazine mounting position H4 can be recovered. Also, in the state shown in FIG. Therefore, the magazine 50 can be supplied to the magazine mounting position H1 via the supply/collection mechanism 54, and the magazine 50 on the magazine mounting position H1 can be collected. That is, by horizontally moving (back and forth) the table 51, each magazine mounting position H can be positioned at a position where the magazine 50 can be supplied or collected by the supply/collection mechanism 54. can. Therefore, the magazines 50 can be supplied to and retrieved from all the magazine loading positions H.

The positioning means 55 includes stoppers M (M1, M2, M3, M4) arranged on the table 51, and a pressing mechanism (not shown) that presses the magazine 50 at each magazine loading position H toward each stopper M side. and That is, by pressing the magazine 50 placed on the magazine placement position H of the table 51 toward the stopper M, the magazine 50 is pressed against the stopper M and placed at a predetermined position. In this case, the pressing portion of the pressing mechanism elastically presses the magazines 50, and even if the sizes of the magazines 50 are different, it can be handled.

This magazine device is also provided with a comparison means 80 as shown in FIG. Here, the comparison means 80 compares the information on the substrate 22 which is the member S to be supplied with the information on the magazine 50 . In this case, a chip storing an ID number or the like for identifying the type of magazine 50 is attached to each magazine 50, and a chip storing an ID number or the like for identifying the type of substrate is also attached to the substrate 22. be. In these cases, printed characters, bar codes, etc. may be used instead of chips.

Therefore, the comparing means 80 reads the ID number of the magazine 50 and the ID number of the board 22 and compares these ID numbers. That is, by collating the ID numbers, it is possible to determine whether or not the information in the magazine 50 and the information in the substrate 22 match. If they match, the magazine should contain the board 22 on which the chip 21 of the grade to be mounted is mounted. If not, the magazine should contain the board 22 on which the chip 21 of the grade to be mounted is mounted. It is not the magazine 50.

Incidentally, the horizontal reciprocating mechanism 52, the lifting mechanism 53, the supply/recovery mechanism 54, the positioning means 55, and the comparison means 80 are controlled by the control means 81 shown in FIG. The control means 81 is, for example, a microcomputer in which a CPU (Central Processing Unit) as a center and a ROM (Read Only Memory), a RAM (Random Access Memory), etc. are interconnected via a bus. The ROM stores programs and data executed by the CPU. Therefore, the control means 81 may be used in common with the control means 45 of the conveying device.

Next, the operation of arranging this magazine device on the loader side and supplying the substrate 22 to the transport path T will be described. In this case, the magazine 50 mounted on the first magazine mounting position H1 is the first magazine 50A that stores the substrate 22A for the first grade, and is mounted on the second magazine mounting position H2. The magazine 50 to be mounted is the first magazine 50A in which the board 22A for the first grade is stored, and the magazine 50 mounted in the third magazine mounting position H3 contains the board 22B for the second grade. The magazine 50 that is the second magazine 50B and is placed in the fourth magazine placement position H4 is the third magazine 50C that accommodates the board 22C for the third grade.

In this case, by moving the table 51 back and forth to locate each position H at a position corresponding to the supply/recovery mechanism 54, the magazine 50 to be placed at each magazine placement position H can be placed. . That is, by positioning each position H at a position corresponding to the line L with respect to the base 60, the magazine 50 can be supplied and retrieved via the supply/recovery mechanism .

In addition, the magazine 50 storing the substrates 22 (22A, 22B, 22C) to be supplied to the transport path T can be positioned at the supply-enabled position of the transport path T. FIG. For example, the table 51 is slid forward and backward to a position corresponding to the line L via the horizontal reciprocating mechanism 52 . Next, the table 51 is moved up and down via the lifting mechanism 53 to position the magazine 50 containing the substrates 22 to be supplied to the transport path T at a predetermined height position. Here, the predetermined height position is a height position at which one substrate 22 can be pushed out by a pusher provided on the loader side. , and the lifting mechanism 53 can correspond to these height positions.

Therefore, by sliding the table 51 in the front-rear direction to position each magazine 50 at the position in the front-rear direction having the pusher, and further adjusting the height position of the table 51, the board to be mounted with the chip 21 of the desired grade can be mounted. 22 (22A, 22B, 22C) can be supplied to the transport path T in sequence. Further, when the substrates 22 stored in the magazine 50 are exhausted, the empty magazine 50 can be recovered, the substrates 22 can be replenished, and the substrates 22 can be supplied to the magazine mounting position again.

Next, a method of arranging this magazine device on the unloader side and storing the board 22 with the chip 21 mounted thereon from the transport path T will be described. In this case, the magazine 50 mounted on the first magazine mounting position H1 is the first magazine 50A that stores the substrate 22A for the first grade, and is mounted on the second magazine mounting position H2. The magazine 50 to be mounted is the first magazine 50A in which the board 22A for the first grade is stored, and the magazine 50 mounted in the third magazine mounting position H3 contains the board 22B for the second grade. The magazine 50 that is the second magazine 50B to be accommodated and is placed in the fourth magazine placement position H4 is the third magazine 50C that accommodates the substrates 22C for the third grade.

In this case, by moving the table 51 back and forth to arrange each position at a position corresponding to the supply/recovery mechanism 54, the desired magazine 50 can be placed at each magazine placement position H. FIG. That is, by positioning each position H at a position corresponding to the line L with respect to the base 60, the magazine 50 can be supplied or retrieved via the supply/recovery mechanism . Further, the magazine 50 mounted on each magazine mounting position H can be mounted and fixed at a regular position by the positioning means 55 .

In addition, the magazine 50 in which the substrates 22 of the mounted chips 21 are to be stored can be positioned at a position where it can be supplied from the transport path T. For example, the table 51 is slid forward and backward to a position corresponding to the line L via the horizontal reciprocating mechanism 52 . Next, the table 51 is moved up and down via the elevating mechanism 53 to position the magazine 50 in which the substrates 22 to be stored are stored at a predetermined height position. Here, the predetermined height position is a height position at which one substrate 22 can be pushed out into the magazine 50 by a pusher provided on the loader side. and storage positions, and the lifting mechanism 53 can correspond to these height positions.

Therefore, by sliding the table 51 in the front-rear direction to position each magazine 50 at the position in the front-rear direction having the pushers, and further adjusting the height position of the table 51, the board on which chips 21 of the desired grade are mounted can be read. 22 (22A, 22B, 22C) can be supplied from the transport path T in sequence. When the magazine 50 is filled with the substrates 22 stored therein, the magazine 50 is recovered, the substrates 22 in the magazine 50 are recovered, and the empty magazine 50 is placed again in the magazine. Positions can be supplied.

According to the magazine device of the present invention, the table 51 on which the plurality of magazines 50 are placed can reciprocate in the horizontal direction via the horizontal reciprocating mechanism 52 . Therefore, any magazine on the table 51 can be positioned at a predetermined horizontal position. Further, since the table 51 can be moved up and down via the elevating mechanism 52, each magazine 50 on the table 51 can be positioned at a predetermined height position. Therefore, a desired magazine 50 can be held at a predetermined horizontal position and a predetermined height position.

That is, since the plurality of magazines 50 placed (arranged) on the table 51 can be horizontally moved and vertically moved at the same time, there is no transport loss of the magazines 50 . Moreover, since there is no need to provide an intermediate buffer or the like for waiting the magazine 50, or to provide a space for placing the magazines in the upper and lower stages, the entire apparatus can be simplified and the cost can be reduced. can be planned.

If this magazine device is used on the loader side, the supplied member S on which the work W of the desired grade is mounted can be loaded from one magazine (magazine 50 containing the supplied member S on which the work W of the desired grade is mounted). can be taken out. Further, if this magazine device is used on the unloader side, one magazine (magazine 50 for storing the supplied member S on which the work W of the desired grade is loaded) can be loaded with the work W of the desired grade. The supply member S can be accommodated. For this reason, the magazine 50 can be arranged at a position and height at which it is possible to supply the supply target member S on which the work W of the desired grade is mounted, or the magazine 50 can be arranged at a position and height where the supply target member S on which the work W of the desired grade is mounted. It can be placed at a position and height where S can be stored.

Since one supply/recovery position for supplying and recovering the magazine S is provided, the supply and recovery of the magazine 50 can be performed at one supply/recovery position, and the device can be made compact. be able to.

Since the comparison means 80 is provided for comparing the information of the supplied member S and the information of the magazine 50, when the information of the supplied member S matches the information of the magazine 50, the operation by the magazine device is continued. When the information on the supplied member S and the information on the magazine 50 do not match, the operation by the magazine device can be stopped. By stopping in this way, it is possible to prevent a workpiece W that is not to be loaded from being loaded on the supplied member, or to supply a supplied member that does not match the size to the magazine and damage the magazine side. , the supplied member can be effectively prevented from being damaged.

By having the positioning means 55, each magazine 50 can be arranged (placed) at a predetermined position (regular position) even if there is a size difference. Thereby, each magazine 50 can be accurately held at a predetermined horizontal position and a predetermined height position.

According to the carrier device of the present invention, in the loader, from one magazine (magazine 50 containing substrates 22 on which chips 21 of the desired grade are mounted), substrates 22 on which chips 21 of the desired grade are mounted are loaded. can be taken out. In the unloader, substrates 22 on which chips 21 of desired grade are mounted can be stored in one magazine (magazine 50 in which substrates 22 on which chips 21 of desired grade are mounted).

According to the die bonder of the present invention, a substrate 22 on which chips 21 of a desired grade are mounted can be taken out from one magazine (a magazine containing supplied members on which workpieces of a desired grade are mounted). As a result, the substrate 22 on which the desired grade chip 21 is mounted can be transported to the bonding position, and the chip 21 corresponding to this substrate 22 can be bonded to the island portion 22a of the substrate. That is, chips 21 of a plurality of grades can be mounted on the substrate 22 on which the chips 21 are to be mounted.

According to the transfer method of the present invention, in the loader, from one magazine (magazine 50 containing substrates 22 on which chips 21 of the desired grade are mounted), substrates 22 on which chips 21 of the desired grade are mounted. can be taken out. In the unloader, substrates 22 on which chips 21 of desired grade are mounted can be stored in one magazine (magazine 50 in which substrates 22 on which chips 21 of desired grade are mounted).

According to the bonding method of the present invention, the substrate is transferred 22 to the bonding position using the transfer method. In this case, even if the chips 21 as workpieces have a plurality of grades, the chips 21 of each grade can be successively bonded to the substrate 22 to which the chips 21 of that grade are to be bonded.

The present invention is not limited to the above-described embodiment, and various modifications are possible. It can be configured with various mechanisms such as a linear mechanism. In addition, the arrangement position of the supply/collection mechanism 54 can be arbitrarily set. Also, the supply position to the transport path T and the supply position from the transport path T can be arbitrarily set.

In the above-described embodiment, the substrate 22 for bonding the chip 21 cut out from the wafer 26 was used as the supplied member S to be conveyed. Alternatively, it may be a flat plate such as sheet metal. For this reason, the workpiece W to be supplied to the supplied member S is not limited to the chip 21, but is a component corresponding to the supplied member S.

When the magazine 50 and the member to be supplied S do not match (when an error occurs) in the apparatus provided with the comparison means 80, a display means (for example, an alarm sound is generated, a monitor or the like is It is also possible to provide a message to that effect.

Moreover, the grade of the workpiece W is not limited to three types, and may be one type or four or more types exceeding three types. Therefore, the types of magazines 50 are not limited to three types, and may be one type, or four or more types exceeding three types. In the above embodiment, the magazines 50A containing the first grade substrates 22A are arranged at the first magazine mounting position H1 and the second magazine mounting position H2. For this reason, the number of magazine placement positions H on the table 51 is one more than the number of types of magazines 50 (three types). On the other hand, the number of grades of workpieces W and the number of magazines 50 may be matched. Also, the first magazine 50A can be arranged at three magazine mounting positions, and the second magazine B and the third magazine C can be arranged at two magazine mounting positions.

Although the table 51 has a so-called cantilevered shape in the above embodiment, it may have a double-supported shape in order to stabilize the reciprocating motion and vertical movement of the table 51 in the horizontal direction.

H, H1, H2, H3, H4 Magazine placement position S Supply target member Sa Supply target site W Work 21 Chips 22, 22A, 22B, 22C Substrate 22a Eyed parts 50, 50A, 50B, 50C Magazine 51 Table 52 Horizontal reciprocation Moving mechanism 53 Lifting mechanism 54 Supply/recovery mechanism 55 Positioning means 56 Loader 57 Unloader 80 Comparison means

Claims (8)

A table on which a plurality of magazines are placed, a horizontal reciprocating mechanism for reciprocating the table in the horizontal direction, and a lifting mechanism for reciprocating the table in the vertical direction,
The magazine stores a plurality of supplied members on which works of the same grade are mounted, and the magazine stores a supplied member on which works of one grade are mounted, and a magazine for storing supplied members on which workpieces of a different grade are mounted, wherein the table stores the supplied members on which workpieces of one grade are mounted; A plurality of types of magazines are placed, including magazines for accommodating members to be supplied on which workpieces of other grades are mounted,
The horizontal reciprocating mechanism is driven to place one magazine at a predetermined horizontal position, and the elevating mechanism is operated to maintain this one magazine at a predetermined height position. One supplied member stored in a magazine is taken out, or one supplied member is stored in this one magazine, and another magazine is arranged at the predetermined horizontal position by driving the horizontal reciprocating mechanism. In this state, the other magazine is maintained at a predetermined height position by the operation of the elevating mechanism, and in this state, another supplied member stored in this other magazine is taken out, or the other magazine is loaded. A magazine device that accommodates other supplied members. A table on which a plurality of magazines are placed, a horizontal reciprocating mechanism for reciprocating the table in the horizontal direction, and a lifting mechanism for reciprocating the table in the vertical direction,
The magazine stores a plurality of supplied members on which works of the same grade are mounted, and the magazine stores a supplied member on which works of one grade are mounted, and Equipped with a storage for a supplied member on which a work of a grade different from the grade is mounted,
The horizontal reciprocating mechanism is driven to place one magazine at a predetermined horizontal position, and the elevating mechanism is operated to maintain this one magazine at a predetermined height position. taking out one supplied member stored in the magazine, or storing one supplied member in this one magazine,
A single supply/recovery position is provided for supplying and recovering the magazine, and one magazine is associated with this supply/recovery position. A magazine device characterized in that a magazine to be placed is supplied to the placement position in a state corresponding to the supply/recovery position. A table on which a plurality of magazines are placed, a horizontal reciprocating mechanism for reciprocating the table in the horizontal direction, and a lifting mechanism for reciprocating the table in the vertical direction,
The magazine stores a plurality of supplied members on which works of the same grade are mounted, and the magazine stores a supplied member on which works of one grade are mounted, and Equipped with a storage for a supplied member on which a work of a grade different from the grade is mounted,
The horizontal reciprocating mechanism is driven to place one magazine at a predetermined horizontal position, and the elevating mechanism is operated to maintain this one magazine at a predetermined height position. taking out one supplied member stored in the magazine, or storing one supplied member in this one magazine,
1. A magazine device comprising a comparison means for comparing information on supplied members and information on the magazine. 4. The magazine device according to any one of claims 1 to 3, wherein the table has positioning means for each magazine placed thereon. In order to supply a plurality of types of works with different grades to the parts to be supplied of the parts to be supplied for each grade, the parts to be supplied are conveyed to the supply position between the loader and the unloader, and the parts to be supplied that have been loaded with the workpieces are transported. A conveying device for unloading a member to an unloader,
A conveying apparatus, wherein the magazine apparatus according to any one of claims 1 to 4 is used as the loader and the unloader. The workpiece is a chip of a wafer, and the member to be supplied is a substrate serving as an island portion, which is the part to be supplied, and is transported to the bonding position, which is the supply position, by using the transportation apparatus according to claim 5. A die bonder that sequentially bonds chips to an island portion of a substrate. In order to supply a plurality of types of works with different grades to the parts to be supplied of the parts to be supplied for each grade, the parts to be supplied are conveyed to the supply position between the loader and the unloader, and the parts to be supplied that have been loaded with the workpieces are transported. A conveying method for unloading a member to an unloader,
A carrying method, wherein the magazine device according to any one of claims 1 to 4 is used as the loader and the unloader. The workpiece is a chip of a wafer, the member to be supplied is a substrate serving as an island portion which is the portion to be supplied, and the island of the substrate is transported to the bonding position by using the transport method according to claim 7. A bonding method characterized by sequentially bonding chips to a portion.

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