JPS54170779U - - Google Patents

Info

Publication number
JPS54170779U
JPS54170779U JP6865478U JP6865478U JPS54170779U JP S54170779 U JPS54170779 U JP S54170779U JP 6865478 U JP6865478 U JP 6865478U JP 6865478 U JP6865478 U JP 6865478U JP S54170779 U JPS54170779 U JP S54170779U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6865478U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6865478U priority Critical patent/JPS54170779U/ja
Publication of JPS54170779U publication Critical patent/JPS54170779U/ja
Pending legal-status Critical Current

Links

JP6865478U 1978-05-23 1978-05-23 Pending JPS54170779U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6865478U JPS54170779U (en) 1978-05-23 1978-05-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6865478U JPS54170779U (en) 1978-05-23 1978-05-23

Publications (1)

Publication Number Publication Date
JPS54170779U true JPS54170779U (en) 1979-12-03

Family

ID=28976734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6865478U Pending JPS54170779U (en) 1978-05-23 1978-05-23

Country Status (1)

Country Link
JP (1) JPS54170779U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020068281A (en) * 2018-10-24 2020-04-30 キヤノンマシナリー株式会社 Magazine device, transfer device, transfer method, die bonder, and bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020068281A (en) * 2018-10-24 2020-04-30 キヤノンマシナリー株式会社 Magazine device, transfer device, transfer method, die bonder, and bonding method

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