CN116759334B - Chip mounting equipment - Google Patents
Chip mounting equipment Download PDFInfo
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- CN116759334B CN116759334B CN202310641809.1A CN202310641809A CN116759334B CN 116759334 B CN116759334 B CN 116759334B CN 202310641809 A CN202310641809 A CN 202310641809A CN 116759334 B CN116759334 B CN 116759334B
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- 239000000758 substrate Substances 0.000 claims abstract description 207
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 134
- 229910052710 silicon Inorganic materials 0.000 claims description 134
- 239000010703 silicon Substances 0.000 claims description 134
- 235000012431 wafers Nutrition 0.000 claims description 125
- 239000003292 glue Substances 0.000 claims description 46
- 238000013016 damping Methods 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 27
- 238000005520 cutting process Methods 0.000 claims description 26
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 238000000926 separation method Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
The invention relates to the technical field of chip mounting, and discloses chip mounting equipment, which comprises: for the chip mounting equipment, the invention sets the photoresist drawing device and the chip mounting device above the substrate conveying device instead of being arranged in a plane with the substrate conveying device, so that the plane area occupied by the whole chip mounting equipment can be reduced, and the area required by the chip mounting equipment is further reduced.
Description
Technical Field
The invention relates to the technical field of chip mounting, in particular to chip mounting equipment.
Background
In the process of manufacturing the circuit, a chip mounting process is used to mount the chip onto the substrate, thereby playing a role in thermal, electrical and mechanical connection. The existing chip mounting technology comprises the following steps: separating out the chips on the wafer, and then mounting the chip semicircle onto the substrate, wherein the substrate is provided with glue which is smeared according to a preset track, and finally the chips are pressed at the glue-coated positions on the substrate, so that the mounting of the chips is realized.
However, for the existing chip mounting equipment, the modules required for realizing the mounting process are distributed in a plane, so that the equipment is large in size and occupies a large equipment mounting area.
Disclosure of Invention
In view of the shortcomings of the background technology, the invention provides a chip mounting device, and aims to solve the technical problems that modules required by the mounting technology of the existing chip mounting device are all mounted in a plane, so that the device is large in size and occupies more mounting area.
In order to solve the technical problems, the invention provides the following technical scheme: a chip mounting apparatus comprising:
a silicon wafer moving and cutting device;
the base is provided with a fixing frame at the top;
the substrate conveying device is arranged at the top of the base along the transverse direction;
the substrate feeding device is arranged at the left end of the substrate conveying device and is used for providing a substrate for the substrate conveying device, and the substrate conveying device conveys the substrate along the transverse direction;
the silicon wafer feeding device and the silicon wafer moving and cutting device are both arranged on the base and are positioned on the same side of the substrate conveying device, the silicon wafer feeding device is used for providing silicon wafers for the silicon wafer moving and cutting device, and the silicon wafer moving and cutting device is used for driving the silicon wafers to move in a plane;
the chip separating device is used for jacking and separating the chip of the silicon chip on the silicon chip moving and cutting device;
the device comprises a fixing frame, a substrate conveying device, a glue drawing device and a chip mounting device, wherein the glue drawing device and the chip mounting device are sequentially arranged on the fixing frame along the transverse direction and are positioned above the substrate conveying device, the glue drawing device is used for drawing glue to a substrate on the substrate conveying device, and the chip mounting device is used for pressing a chip separated by jacking to the glue drawing position of the substrate.
In a certain embodiment, the substrate conveying device comprises a plurality of first linear motors, the plurality of first linear motors are sequentially arranged along the transverse direction, each first linear motor is provided with a preset stroke, and the first linear motors drive the substrates to move in the corresponding preset strokes.
In a certain embodiment, the substrate feeding device comprises a substrate box, a substrate longitudinal moving device, a substrate vertical moving device and a substrate transverse driving device, wherein the substrate longitudinal moving device is installed on the base and used for driving the substrate vertical moving device to move in the longitudinal direction, the substrate vertical moving device is used for driving a substrate in the substrate box to move in the vertical direction, and the substrate transverse driving device is used for pushing the substrate onto the substrate conveying device.
In a certain embodiment, the substrate feeding device comprises a substrate bin, a second substrate longitudinal moving device, a second substrate vertical moving device and a grabbing frame, wherein the grabbing frame is provided with a grabbing suction head, the second substrate longitudinal moving device is arranged on the fixing seat and used for driving the second substrate vertical moving device to move along the longitudinal direction, and the second substrate vertical moving device is used for driving the grabbing frame to move up and down so that the grabbing frame can take out the substrate from the substrate bin.
In a certain embodiment, the silicon wafer feeding device comprises a silicon wafer material box, a silicon wafer vertical moving device, a silicon wafer grabbing device and a silicon wafer transverse moving device, wherein the silicon wafer material box is installed on the silicon wafer vertical moving device, the silicon wafer moving and cutting device is arranged on the right side of the silicon wafer material box, the silicon wafer vertical moving device is used for driving the silicon wafer material box to move in the vertical direction, and the silicon wafer transverse moving device is installed on the base and used for driving the silicon wafer grabbing device to transversely move, so that the silicon wafer grabbing device clamps the silicon wafer in the silicon wafer material box and moves the silicon wafer onto the silicon wafer moving and cutting device.
In a certain embodiment, the silicon wafer moving and cutting device comprises a silicon wafer placing seat and a first double-shaft moving platform, wherein the first double-shaft moving platform is connected with the silicon wafer placing seat and used for driving the silicon wafer placing seat to move in a horizontal plane.
In a certain embodiment, the chip separation device comprises a second double-shaft moving platform, a first chip separation vertical moving device, a second chip separation vertical moving device and a separation rod, wherein the second double-shaft moving platform is used for driving the first chip separation vertical moving device to move on a horizontal plane, the first chip separation vertical moving device is used for driving the second chip separation vertical moving device to move in a vertical direction, and the second chip separation vertical moving device is used for driving the separation rod to move in the vertical direction.
In a certain embodiment, the glue drawing device comprises two glue heads and two glue drawing triaxial moving platforms, and one glue drawing triaxial moving platform drives one glue head to move in space.
In a certain embodiment, the invention further comprises a transfer platform and a chip transfer device, wherein the chip transfer device is used for grabbing the chips which are separated by jacking onto the transfer platform, and the chip loading device is used for grabbing the chips on the transfer platform and pressing the grabbed chips onto the glue drawing positions of the substrate.
In one embodiment, the chip loading device comprises a mounting plate, a chip loading transverse moving device, a chip loading longitudinal moving device, a chip loading vertical moving device and a suction device;
the mounting plate is fixed on the fixing frame, the chip loading transverse moving device and the chip loading longitudinal moving device are both arranged on the mounting plate, and the chip loading transverse moving device is used for driving the chip loading longitudinal moving device to move in the transverse direction;
the loading longitudinal moving device comprises a loading fixing seat, two second linear motors, a stator connecting plate, a rotor connecting plate, a magnetic damping sheet, a magnetic damping block, a first elastic component and a second elastic component; the mounting fixing seat is arranged on the mounting plate, the stators of the two second linear motors are parallel and are glidingly arranged on the mounting plate, the stators of the two second linear motors are connected with the stator connecting plate, two magnetic damping sheets are arranged on the top surface of the stator connecting plate, two magnetic damping blocks are arranged on the sheet loading fixing seat, and damping channels are provided for the two magnetic damping sheets by the two magnetic damping blocks; the bottom surface of the mounting fixing seat is also provided with a first fixing rod and a second fixing rod, the top surface of the stator connecting plate is also provided with a third fixing rod and a fourth fixing rod, two ends of the first elastic part are connected with the first fixing rod and the third fixing rod, two ends of the second elastic part are connected with the second fixing rod and the fourth fixing rod, the component force of the first elastic part acting on the stator connecting plate in the vertical direction in a stretching state and the component force of the second elastic part acting on the stator connecting plate in the vertical direction in the stretching state are mutually offset, and the first elastic part and the second elastic part are simultaneously deformed and have the same deformation quantity; the rotors of the two second linear motors are connected with a rotor connecting plate, and the rotor connecting plate is slidably arranged on the mounting fixing seat;
the chip loading vertical moving device is arranged on the rotor connecting plate and is used for driving the suction device to move up and down;
the suction device comprises a suction mounting seat, a rotary driving device, a main shaft and a gas transmission pipeline, wherein a pressure cavity and a main shaft mounting cavity are communicated with each other from top to bottom on the suction mounting seat, a bearing seat is arranged in the main shaft mounting cavity, the main shaft moves up and down and is arranged on the bearing seat, a piston is arranged at the upper end of the main shaft, the piston is positioned in the pressure cavity, the lower end of the main shaft is connected with a suction nozzle fixing seat, a suction nozzle is arranged on the suction nozzle fixing seat, the rotary driving device is connected with the main shaft and is used for driving the main shaft to rotate, an annular air cavity is formed in the inner wall of the bearing seat, and the gas transmission pipeline is respectively used for supplying gas to the pressure cavity, the annular air cavity and the suction nozzle.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the glue drawing device and the chip mounting device are arranged above the substrate conveying device, but not in the plane with the substrate conveying device, so that the plane area occupied by the whole chip mounting device can be reduced, and the area required by the chip mounting device is further reduced.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic structural view of a substrate transport apparatus;
FIG. 3 is a schematic diagram of a substrate loading apparatus;
fig. 4 is a schematic structural diagram of a second substrate feeding device;
FIG. 5 is a schematic structural view of a silicon wafer material box and a silicon wafer vertical movement device of the silicon wafer loading device;
FIG. 6 is a schematic structural view of a silicon wafer lateral movement device and a silicon wafer grabbing device of the silicon wafer loading device;
FIG. 7 is a schematic diagram of a silicon wafer transfer and cutting device;
FIG. 8 is a schematic structural view of a silicon wafer separating device;
FIG. 9 is a schematic structural view of a glue drawing device;
FIG. 10 is a schematic view of a transfer platform;
FIG. 11 is a schematic diagram of a chip switching device;
FIG. 12 is a schematic view of a chip mounting apparatus;
FIG. 13 is a schematic view of a structure of the loading longitudinal moving apparatus;
fig. 14 is a schematic view showing the mounting positions of the first to fourth fixing bars of the loading longitudinal moving device;
FIG. 15 is a schematic view of the structure of the suction device;
fig. 16 is a schematic view of the transfer platform and the chip transfer device on the base.
In the figure: 10. the device comprises a base, 11, a fixing frame, 12, a substrate conveying device, 13, a substrate feeding device, 14, a glue drawing device, 15, a second substrate feeding device, 16, a silicon wafer feeding device, 17, a chip loading device, 18, a silicon wafer moving and cutting device, 19, a substrate discharging device, 20, a silicon wafer separating device, 21, a switching platform, 22 and a chip switching device;
120. a first linear motor;
130. a substrate longitudinal moving device 131, a substrate vertical moving device 132, a substrate carrying claw 133, a substrate transverse driving device 134 and a substrate material box;
140. the glue head, 141, drawing the fixed seat of glue;
150. the second base plate longitudinal moving device 151, the second base plate vertical moving device 152, the grabbing frame 153, the grabbing hair washing device 154 and the base plate storage bin;
160. the device comprises a silicon wafer vertical moving device 161, a silicon wafer material box 162, a silicon wafer transverse moving device 163 and a silicon wafer grabbing device;
170. mounting plate, 171, horizontal moving device of chip, 172, vertical moving device of chip, 173, vertical moving device of chip, 174, suction device, 175, positioning camera of chip, 176, second vertical moving device of chip;
1720. the device comprises a mounting fixing seat 1721, a second linear motor stator, a 1722, a second linear motor rotor, a 1723, a stator connecting plate, a 1724, a magnetic damping block, a 1725, a magnetic damping sheet, a 1726, a rotor connecting plate, a 1727, a grating ruler reading head, a 1728, a grating ruler, a 1770, a first fixing rod, a 1771, a second fixing rod, a 1772, a third fixing rod, a 1773 and a fourth fixing rod;
1740. suction mounting seat 1741, pressure cavity 1742, bearing seat 1743, main shaft 1744, piston 1745, annular air cavity 1746, suction nozzle fixing seat 1747, suction nozzle 1748, rotary motor 1749, driving gear 1780, driven gear 1781 and air pipeline;
180. a silicon wafer placing seat 181 and a first double-shaft moving platform;
200. the device comprises a second double-shaft moving platform 201, a first chip separation vertical moving device 202, a second chip separation vertical moving device 203 and a separation rod;
210. a transfer base 211, a transfer support table 212 and an air port;
220. and the suction nozzle is connected in a 221-way manner, and the triaxial mobile platform is connected in a way of being connected in a way.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only the structures which are relevant to the invention.
As shown in fig. 1, a chip mounting apparatus includes:
a silicon wafer moving and cutting device 18;
the base 10, the top of the base 10 is provided with a fixing frame 11;
a substrate transfer device 12 mounted on top of the base 10 in a lateral direction;
a substrate loading device 13 disposed at the left end of the substrate conveying device 12, for providing the substrate conveying device 12 with the substrate, and conveying the substrate along the lateral direction by the substrate conveying device 12;
the silicon wafer feeding device 16, the silicon wafer feeding device 16 and the silicon wafer moving and cutting device 18 are both arranged on the base 10 and are positioned on the same side of the substrate conveying device 12, the silicon wafer feeding device 16 is used for providing silicon wafers for the silicon wafer moving and cutting device 18, and the silicon wafer moving and cutting device 18 is used for driving the silicon wafers to move in a plane;
the chip separating device 20 is used for jacking and separating the chip of the silicon chip on the silicon chip moving and cutting device 18/respectively;
the device comprises a glue drawing device 14 and a chip mounting device 17, wherein the glue drawing device 14 and the chip mounting device 17 are sequentially arranged on a fixed frame 11 along the transverse direction and are positioned above a substrate conveying device 12, the glue drawing device 14 is used for drawing glue on a substrate on the substrate conveying device 12, and the chip mounting device 17 is used for pressing and mounting a chip which is separated by jacking to a glue drawing position of the substrate;
the substrate blanking device 19 is located at the right end of the substrate conveying device 12, and is used for receiving the substrate with the chips attached on the substrate conveying device 12.
In actual use, the invention can reduce the planar area occupied by the whole chip mounting equipment and further reduce the area required by the chip mounting equipment by arranging the glue drawing device 14 and the chip mounting device 17 above the substrate conveying device 12 instead of arranging the glue drawing device and the chip mounting device in the plane with the substrate conveying device 12.
In this embodiment, as shown in fig. 2, unlike the conventional substrate conveying device 12, the substrate conveying device 12 of the present invention is provided with a plurality of first linear motors 120, and the plurality of first linear motors 120 are sequentially arranged along the transverse direction, each first linear motor 120 is provided with a preset stroke, and the first linear motor 120 drives the substrate to move in the corresponding preset stroke.
When in actual use, through setting up a plurality of first linear motors 120 and letting every first linear motor 120 move in predetermineeing the stroke, under the condition that satisfies the substrate transportation demand, can reduce the operation route of single first linear motor 120 to can improve the substrate turnover speed on the substrate conveyor 12, can improve chip mounting speed.
In this embodiment, the substrate feeding device 13 of the present invention has two structures, namely a first substrate feeding device and a second substrate feeding device 15. The first substrate feeding device is shown in fig. 3, and includes a substrate box 134, a substrate longitudinal moving device 130, a substrate vertical moving device 131 and a substrate transverse driving device 133, wherein the substrate longitudinal moving device 130 is mounted on the base 10 and is used for driving the substrate vertical moving device 131 to move in the longitudinal direction, the substrate vertical moving device 131 is used for driving the substrate in the substrate box 134 to move in the vertical direction, and the substrate transverse driving device 133 is used for pushing the substrate onto the substrate conveying device 12.
Wherein, the substrate vertical moving device 131 is provided with a substrate carrying claw 132, so that the substrate carrying claw 132 holds the substrate in the substrate material box 134, and then the substrate vertical moving device 131 drives the substrate carrying claw 132 to rise, thereby driving the substrate in the substrate material box 134 to rise; in addition, a substrate discharging hole is formed in the substrate material box 134, and when a substrate needs to be provided on the substrate conveying device 12, the substrate transverse driving device 133 acts to push the substrate from the discharging hole to the substrate conveying device 12; in addition, when no substrate is detected by the sensor to be pushed out from the substrate discharge port, the substrate vertical moving device 131 drives the substrate to move upwards, so that the substrate moves to the substrate discharge port to be pushed out next time.
After the chips are attached to the substrate on the substrate conveying device 12, the substrate attached with the chips can be removed from the substrate conveying device 12 by the substrate blanking device 19 on the right side of the substrate conveying device 12, wherein the substrate blanking device 19 has the same structure as the first substrate feeding device, and the difference is that in actual use, the substrate transverse driving device 133 of the substrate blanking device 19 places the substrate on the substrate conveying device 12 into the substrate material box 134 from the substrate material outlet, and when the substrate is placed into the substrate material box 134, the substrate vertical moving device 131 of the substrate blanking device 19 drives the substrate to descend, so that the next substrate placing station in the substrate material box 134 reaches the substrate material outlet for placing the next substrate attached with the chips.
The second substrate feeding device 15 is shown in fig. 4, and includes a substrate bin 154, a second substrate longitudinal moving device 150, a second substrate vertical moving device 151 and a gripping frame 152, the gripping frame is provided with a gripping suction head 153, the second substrate longitudinal moving device 150 is installed on the fixing frame 11 and is used for driving the second substrate vertical moving device 151 to move along the longitudinal direction, the second substrate vertical moving device 151 is used for driving the gripping frame 152 to move up and down, the gripping suction head 153 can suck the substrate, the gripping frame 152 can take out the substrate from the substrate bin 154, and after the substrate is taken out, the substrate can be placed on the substrate conveying device 12 through the second substrate vertical moving device 151 and the second substrate longitudinal moving device 150; in addition, a sensor for detecting the substrate may be disposed on the gripping frame 152, so that after the uppermost substrate in the substrate bin 154 is removed, the second substrate vertical moving device 151 still can hold the uppermost substrate when the gripping tip 153 is driven to take the substrate from the substrate bin 154 next time.
In this embodiment, the structural schematic diagram of the glue device 14 is shown in fig. 9, which includes two glue heads 140 and two glue triaxial moving platforms, wherein one glue triaxial moving platform drives one glue head 140 to move in space, wherein the two glue triaxial moving platforms are mounted on the glue fixing seat 141, and it should be noted that the specific structure of the glue triaxial moving platform is not shown in fig. 9, but it is a prior art means for those skilled in the art to drive an object to move in space through the triaxial moving platform.
In this embodiment, the structure of the silicon wafer loading device 16 is schematically shown in fig. 5 and 6, and the silicon wafer loading device comprises a silicon wafer material box 161, a silicon wafer vertical movement device 160, a silicon wafer grabbing device 163 and a silicon wafer transverse movement device 162, wherein the silicon wafer material box is installed on the silicon wafer vertical movement device 160, the silicon wafer moving and cutting device 18 is arranged on the right side of the silicon wafer material box 161, the silicon wafer vertical movement device 160 is used for driving the silicon wafer material box 161 to move in the vertical direction, and the silicon wafer transverse movement device 162 is installed on the base 10 and used for driving the silicon wafer grabbing device 163 to move transversely, so that the silicon wafer grabbing device 163 clamps the silicon wafer in the silicon wafer material box and moves the silicon wafer onto the silicon wafer moving and cutting device 18.
In this embodiment, a gripping jaw is disposed on the silicon wafer gripping device 163, the silicon wafer gripping device 163 is driven by the silicon wafer lateral movement device 162 to move to the silicon wafer taking position, then the gripping jaw acts to clamp the substrate, then the silicon wafer lateral movement device 162 drives the silicon wafer gripping device 163 to move rightward, so that the silicon wafer gripped by the gripping jaw is placed on the silicon wafer moving and cutting device 18, and after the silicon wafer at the silicon wafer taking position is taken away, the silicon wafer vertical movement device 160 drives the silicon wafer material box 161 to move upward, so that the silicon wafer can be taken away by the gripping jaw.
In this embodiment, the structure of the silicon wafer moving and cutting device 18 is shown in fig. 7, and is a conventional structure, and includes a silicon wafer placing seat 180 and a first dual-axis moving platform 181, when the silicon wafer feeding device 16 places a silicon wafer on the silicon wafer placing seat 180, the silicon wafer placing seat 180 processes the silicon wafer, and the first dual-axis moving platform 181 is used for driving the silicon wafer placing seat 180 to move in a plane, i.e. the silicon wafer on the silicon wafer placing seat 180 is sequentially sent to the silicon wafer separating device 20 for separation.
The schematic structural diagram of the silicon wafer separating device 20 is shown in fig. 8, and includes a second dual-axis moving platform 200, a first chip separating vertical moving device 201, a second chip separating vertical moving device 202 and a separating rod 203, where the second dual-axis moving platform 200 is used for driving the first chip separating vertical moving device 201 to move in a horizontal plane, the first chip separating vertical moving device 201 is used for driving the second chip separating vertical moving device 202 to move in a vertical direction, and the second chip separating vertical moving device 203 is used for driving the separating rod 203 to move in a vertical direction.
During practical use, the second dual-axis moving platform 200 is used for fine-tuning the position of the separating rod 203 in the plane, the first chip separating vertical moving device 201 is used for lifting the second chip separating vertical moving device 202 and the separating rod 203, and the second chip separating vertical moving device 202 is used for driving the separating rod 203 to move in the vertical direction, so that the separating rod 203 jacks up and separates the chip on the silicon chip placing seat 180.
In actual use, after the silicon chip separating device 20 separates the chips of the silicon chip mountain, the chip loading device 17 presses the separated chips onto the substrate with the drawn glue, wherein the chip loading device 17 has a structure schematically shown in fig. 12 and comprises a mounting plate 170, a chip loading transverse moving device 171, a chip loading longitudinal moving device 172, a chip loading vertical moving device 173 and a suction device 174;
the mounting plate 170 is fixed on the fixing frame 11, and the chip loading transverse moving device 171 and the chip loading longitudinal moving device 172 are both mounted on the mounting plate 170, and the chip loading transverse moving device 171 is used for driving the chip loading longitudinal moving device 172 to move in the transverse direction;
the schematic structural diagrams of the loading longitudinal moving device are shown in fig. 13 and 14, and the loading longitudinal moving device comprises a loading fixed seat 1720, two second linear motors, a stator connecting plate 1723, a rotor connecting plate 1726, a magnetic damping sheet 1725, a magnetic damping block 1724, a first elastic component and a second elastic component; the mounting fixed seat 1720 is mounted on the mounting plate 170, two second linear motor stators 1721 are mounted on the mounting fixed seat 1720 in parallel and in a sliding manner, the two second linear motor stators are connected with the stator connecting plate 1723, two magnetic damping sheets 1725 are mounted on the top surface of the stator connecting plate 1723, two magnetic damping blocks 1724 are mounted on the mounting fixed seat 1720, and the two magnetic damping blocks 1724 provide damping channels for the two magnetic damping sheets 1725; the bottom surface of the die-filling fixed seat 1720 is also provided with a first fixed rod 1770 and a second fixed rod 1771, the top surface of the stator connecting plate 1723 is also provided with a third fixed rod 1772 and a fourth fixed rod 1773, two ends of a first elastic component are connected with the first fixed rod 1770 and the third fixed rod 1771, two ends of a second elastic component are connected with the second fixed rod 1772 and the fourth fixed rod 1773, the component force of the first elastic component acting on the stator connecting plate 1723 in the vertical direction in the stretching state and the component force of the second elastic component acting on the stator connecting plate 1723 in the vertical direction in the stretching state are mutually offset, and the first elastic component and the second elastic component are simultaneously deformed and have the same deformation quantity; two second linear motor rotors 1722 are connected with a rotor connecting plate 1726, and the rotor connecting plate 1726 is slidably arranged on the chip mounting fixing base 1720;
in this embodiment, the magnetic damping block 1724 is provided with an alternating magnetic field along the damping channel, and according to the eddy current principle, kinetic energy is converted into heat energy to be dissipated when the magnetic damping fin moves in the damping channel; in addition, the second linear motor stator 1721 is slidably mounted on the die-attach mount 1720 via cross roller guides;
for the existing chip mounting longitudinal moving device 172, a linear motor is used for driving, except that a stator of the linear motor is fixed, so that vibration is generated when a rotor of the linear motor moves, and even resonance is formed between the rotor and other functional modules of the chip mounting equipment, so that the use of other modules is affected; in the invention, by slidably mounting the second linear motor stator 1721 on the mounting fixing seat 1720 and providing the magnetic damping block 1724 and the magnetic damping sheet 1725 with alternating magnetic fields, when the second linear motor rotor 1722 moves, the second linear motor stator 1721 also moves in the opposite direction, and the kinetic energy of the second linear motor stator 1721 can be released by the magnetic damping sheet 1725 and the magnetic damping block 1724, thereby avoiding vibration generated when the mounting longitudinal moving device 172 moves; in addition, the energy conversion can be performed through the first elastic component and the second elastic component, so that the kinetic energy generated when the second linear motor stator 1721 moves is reduced, wherein the first elastic component and the second elastic component can be springs;
in addition, in order to facilitate understanding of the movement distance of the second linear motor rotor 1722, a grating ruler 1728 is further installed on the die-mounting fixing seat 1720, a grating ruler reading head 1727 is installed on the rotor connecting plate 1726, when the second linear motor rotor 1722 drives the grating ruler reading head 1727 to move, the movement distance of the second linear motor rotor 1722 can be known according to the output data of the grating ruler reading head 1727, so that feedback control of movement of the second linear motor rotor 1722 can be achieved;
the vertical chip-loading moving device 173 is arranged on the rotor connecting plate 1726 and is used for driving the suction device 174 to move up and down;
the schematic structure of the suction device 174 is shown in fig. 15, and the suction device comprises a suction mounting seat 1740, a rotary driving device, a main shaft 1743 and a gas transmission pipeline 1781, wherein a pressure cavity 1741 and a main shaft mounting cavity are communicated with each other from top to bottom on the suction mounting seat 1740, a bearing seat 1742 is arranged in the main shaft mounting cavity, the main shaft 1743 is arranged on the bearing seat 1742 in a vertically moving mode, a piston 1744 is arranged at the upper end of the main shaft 1743, the piston 1744 is positioned in the pressure cavity 1741, the lower end of the main shaft 1743 is connected with a suction nozzle fixing seat 1746, a suction nozzle 1747 is arranged on the suction nozzle fixing seat 1746, the rotary driving device is connected with the main shaft 1743 and used for driving the main shaft 1743 to rotate, two annular air cavities 1745 are formed in the inner wall of the bearing seat 1742, and the gas transmission pipeline 1781 is respectively used for supplying gas to the pressure cavity 1741, the annular air cavities 1745 and the suction nozzle 1747.
In addition, in order to facilitate the suction nozzle 1747 to be capable of more accurate suction nozzle chips, a second chip loading longitudinal moving device 176 is further installed on the mounting plate 170, a chip loading positioning camera 175 is installed on the second chip loading longitudinal moving device 176, and the second chip loading longitudinal moving device 176 drives the chip loading positioning camera 175 to move in the longitudinal direction for positioning the separated chips;
in actual use, when air is supplied to the pressure cavity 1741, the piston 1744 is pressed down, so that the main shaft 1743, the suction nozzle fixing seat 1746 and the suction nozzle 1747 are sequentially driven to move downwards, the suction nozzle 1747 is close to a separated chip, and finally the chip is sucked by supplying air to the suction nozzle 1747, in addition, the main shaft 1743 is in a suspension state by supplying air to the annular air cavity 1745, and the resistance of the main shaft 1743 in rotation is reduced; in addition, when the suction nozzle 1747 is moved to the fixed position to suck the chip each time, the main shaft 1743 is driven by air pressure and the main shaft 1743 is in a floating state, so that when the heights of the top surfaces of the chips are different, the main shaft 1743 can be moved upwards by the force applied by the chip to the main shaft 1743, and the chip is prevented from being damaged due to extrusion of the main shaft 1743.
In fig. 15, the rotary power unit includes a rotary motor 1748, a driving gear 1749 and a driven gear 1780, the rotary motor 1748 is mounted on the suction mount 1740, the rotary shaft of the rotary motor 1748 is connected to the driving gear 1749, the driven gear 1780 is connected to the main shaft, and the driving gear 1749 is meshed with the driven gear 1780. In actual use, the position of the suction nozzle 1747 can be adjusted by rotating the rotary motor 1748 to drive the spindle 1743 to rotate, so that the suction nozzle 1747 can more accurately suck chips.
In addition, as shown in fig. 10, 11 and 16, the base of the present invention is further provided with a transfer platform 21 and a chip transfer device 22, the chip transfer device 22 grabs the chip separated by jacking onto the transfer platform 21, and the chip mounting device 17 is used for grabbing the chip on the transfer platform 21 and press-mounting the grabbed chip onto the glue drawing position of the substrate; in fig. 11, the chip transferring device 22 includes a transferring nozzle 220 and a transferring three-axis moving platform 221, the transferring three-axis moving platform 221 drives the transferring nozzle 220 to move to a chip sucking position, the chip can be sucked by supplying air to the transferring nozzle 220, and after the transferring nozzle 220 sucks the chip, the transferring three-axis moving platform 221 moves the chip to the transferring platform 21; in fig. 10, the transfer platform 21 includes a transfer base 210, a transfer support 211, and an air port 212, the transfer support 211 being located on the transfer base 210, the air port 212 being used to blow air to the transfer support 211, so that the transfer support can be cleaned. In addition, in the present embodiment, the shape of the fixing frame 11 is not fixed and can be adjusted according to actual requirements.
For thin chip (thickness <50 um), when the film is positioned, the film is an elastomer, and the film is deformed to a certain extent under the action of vacuum and pressure, so that the positioning identification of the chip is affected, through adding the transfer platform 21, the transfer platform 21 is not deformed under the actual process pressure (suction pressure < 1N) because the surface of the transfer platform 21 is made of metal, so that the chip can be completely attached to the positioning platform under the action of vacuum, and the positioning accuracy of the chip can be increased through visual secondary identification under the condition, so that the chip loading accuracy is improved.
The present invention has been made in view of the above-described circumstances, and it is an object of the present invention to provide a portable electronic device capable of performing various changes and modifications without departing from the scope of the technical spirit of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (9)
1. The chip mounting equipment comprises a silicon chip moving and cutting device and a substrate conveying device, and is characterized by further comprising
The base is provided with a fixing frame at the top; the substrate conveying device is arranged at the top of the base along the transverse direction;
the substrate feeding device is arranged at the left end of the substrate conveying device and is used for providing a substrate for the substrate conveying device, and the substrate conveying device conveys the substrate along the transverse direction; the substrate conveying device comprises a plurality of first linear motors, the plurality of first linear motors are sequentially arranged along the transverse direction, each first linear motor is provided with a preset stroke, and the first linear motors drive the substrates to move in the corresponding preset strokes
The silicon wafer feeding device and the silicon wafer moving and cutting device are both arranged on the base and are positioned on the same side of the substrate conveying device, the silicon wafer feeding device is used for providing silicon wafers for the silicon wafer moving and cutting device, and the silicon wafer moving and cutting device is used for driving the silicon wafers to move in a plane;
the chip separating device is used for jacking and separating the chip of the silicon chip on the silicon chip moving and cutting device;
the device comprises a fixing frame, a substrate conveying device, a glue drawing device and a chip mounting device, wherein the glue drawing device and the chip mounting device are sequentially arranged on the fixing frame along the transverse direction and are positioned above the substrate conveying device, the glue drawing device is used for drawing glue to a substrate on the substrate conveying device, and the chip mounting device is used for pressing a chip separated by jacking to the glue drawing position of the substrate.
2. The die attach apparatus of claim 1, wherein the substrate loading device comprises a substrate cassette, a substrate longitudinal moving device, a substrate vertical moving device and a substrate transverse driving device, the substrate longitudinal moving device is mounted on the base and is used for driving the substrate vertical moving device to move in a longitudinal direction, the substrate vertical moving device is used for driving a substrate in the substrate cassette to move in a vertical direction, and the substrate transverse driving device is used for pushing the substrate onto the substrate conveying device.
3. The chip mounting apparatus according to claim 1, wherein the substrate loading device comprises a substrate bin, a second substrate longitudinal moving device, a second substrate vertical moving device and a grabbing frame, the grabbing frame is provided with a grabbing suction head, the second substrate longitudinal moving device is arranged on the fixing seat and is used for driving the second substrate vertical moving device to move along a longitudinal direction, and the second substrate vertical moving device is used for driving the grabbing frame to move up and down so that the grabbing frame takes out the substrate from the substrate bin.
4. The chip mounting apparatus according to claim 1, wherein the silicon wafer loading device comprises a silicon wafer material box, a silicon wafer vertical moving device, a silicon wafer grabbing device and a silicon wafer transverse moving device, the silicon wafer material box is mounted on the silicon wafer vertical moving device, the silicon wafer moving and cutting device is arranged on the right side of the silicon wafer material box, the silicon wafer vertical moving device is used for driving the silicon wafer material box to move in the vertical direction, and the silicon wafer transverse moving device is mounted on the base and used for driving the silicon wafer grabbing device to move transversely, so that the silicon wafer grabbing device clamps the silicon wafer in the silicon wafer material box and moves the silicon wafer onto the silicon wafer moving and cutting device.
5. The die attach apparatus of claim 1 wherein the die transfer apparatus comprises a die placement base and a first dual-axis translation stage, the first dual-axis translation stage coupled to the die placement base for driving the die placement base to translate in a horizontal plane.
6. The die attach apparatus of claim 1, wherein the die separating device includes a second dual-axis moving platform, a first die separating vertical moving device, a second die separating vertical moving device, and a separating rod, the second dual-axis moving platform is configured to drive the first die separating vertical moving device to move in a horizontal plane, the first die separating vertical moving device is configured to drive the second die separating vertical moving device to move in a vertical direction, and the second die separating vertical moving device is configured to drive the separating rod to move in a vertical direction.
7. The die attach apparatus of claim 1 wherein said glue device comprises two glue heads and two glue tri-axis moving platforms, one glue tri-axis moving platform driving one glue head to move in space.
8. The die attach apparatus of claim 1 further comprising a transfer platform and a die transfer device, the die transfer device capturing the lifted and separated die onto the transfer platform, the die attach device being configured to capture the die on the transfer platform and press-fit the captured die onto the glue of the substrate.
9. The die mounting apparatus as claimed in claim 1, wherein the die mounting means comprises a mounting plate, a die mounting lateral movement means, a die mounting longitudinal movement means, a die mounting vertical movement means, and suction means;
the mounting plate is fixed on the fixing frame, the chip loading transverse moving device and the chip loading longitudinal moving device are both arranged on the mounting plate, and the chip loading transverse moving device is used for driving the chip loading longitudinal moving device to move in the transverse direction;
the loading longitudinal moving device comprises a loading fixing seat, two second linear motors, a stator connecting plate, a rotor connecting plate, a magnetic damping sheet, a magnetic damping block, a first elastic component and a second elastic component; the mounting fixing seat is arranged on the mounting plate, the stators of the two second linear motors are parallel and are glidingly arranged on the mounting plate, the stators of the two second linear motors are connected with the stator connecting plate, two magnetic damping sheets are arranged on the top surface of the stator connecting plate, two magnetic damping blocks are arranged on the sheet loading fixing seat, and damping channels are provided for the two magnetic damping sheets by the two magnetic damping blocks; the bottom surface of the mounting fixing seat is also provided with a first fixing rod and a second fixing rod, the top surface of the stator connecting plate is also provided with a third fixing rod and a fourth fixing rod, two ends of the first elastic part are connected with the first fixing rod and the third fixing rod, two ends of the second elastic part are connected with the second fixing rod and the fourth fixing rod, the component force of the first elastic part acting on the stator connecting plate in the vertical direction in a stretching state and the component force of the second elastic part acting on the stator connecting plate in the vertical direction in the stretching state are mutually offset, and the first elastic part and the second elastic part are simultaneously deformed and have the same deformation quantity; the rotors of the two second linear motors are connected with a rotor connecting plate, and the rotor connecting plate is slidably arranged on the mounting fixing seat;
the chip loading vertical moving device is arranged on the rotor connecting plate and is used for driving the suction device to move up and down;
the suction device comprises a suction mounting seat, a rotary driving device, a main shaft and a gas transmission pipeline, wherein a pressure cavity and a main shaft mounting cavity are communicated with each other from top to bottom on the suction mounting seat, a bearing seat is arranged in the main shaft mounting cavity, the main shaft moves up and down and is arranged on the bearing seat, a piston is arranged at the upper end of the main shaft, the piston is positioned in the pressure cavity, the lower end of the main shaft is connected with a suction nozzle fixing seat, a suction nozzle is arranged on the suction nozzle fixing seat, the rotary driving device is connected with the main shaft and is used for driving the main shaft to rotate, an annular air cavity is formed in the inner wall of the bearing seat, and the gas transmission pipeline is respectively used for supplying gas to the pressure cavity, the annular air cavity and the suction nozzle.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310641809.1A CN116759334B (en) | 2023-06-01 | 2023-06-01 | Chip mounting equipment |
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| CN202310641809.1A CN116759334B (en) | 2023-06-01 | 2023-06-01 | Chip mounting equipment |
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| CN116759334A CN116759334A (en) | 2023-09-15 |
| CN116759334B true CN116759334B (en) | 2024-02-20 |
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| CN116759334A (en) | 2023-09-15 |
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