CN217361537U - Positioning device for wafer - Google Patents
Positioning device for wafer Download PDFInfo
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- CN217361537U CN217361537U CN202220764442.3U CN202220764442U CN217361537U CN 217361537 U CN217361537 U CN 217361537U CN 202220764442 U CN202220764442 U CN 202220764442U CN 217361537 U CN217361537 U CN 217361537U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The utility model discloses a positioning device for a wafer, which comprises a bearing unit, a negative pressure unit and a rotating unit, wherein the negative pressure unit is connected with external vacuum equipment; the bearing unit comprises a base and a bearing platform which is arranged on the base and provided with a vacuum chuck, and the vacuum chuck is connected with the negative pressure unit and used for adsorbing the wafer; the bearing unit also comprises a jacking mechanism arranged below the bearing platform and in the middle of the turntable bearing, a jacking channel is formed on the bearing platform, and the jacking channel is used for the jacking mechanism to lift and pass through. The utility model provides a positioner for wafer has adsorption function, jacking lift function and rotational positioning correction function, is in the same place the required multiclass function integration of wafer microscope carrier, and compact structure, occupation space are little, can realize the effective utilization in space.
Description
Technical Field
The utility model belongs to the technical field of semiconductor wafer detects, concretely relates to positioner for wafer.
Background
Wafer testing has become an independent production link in the chip packaging industry, and individual chips on a wafer are tested before the wafer is divided into individual chips. The existing wafer detection mechanism for AOI detection and the like comprises a carrying platform for placing a wafer, wherein the wafer carrying platform needs to have an adsorption function for fixing the wafer, a rotary positioning function for correcting the position where the wafer is placed, and a jacking function for stably receiving and taking the wafer is better.
The existing wafer detection mechanism adopts a carrier which generally has only two functions, namely an adsorption function and a rotation positioning function, and the function of the carrier is not complete. The carrying platform with more complete functions is often stacked layer by layer to cause large volume, complex and heavy mechanism and large occupied space, and particularly has obvious defects when being matched with the transplanting mechanism to move.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned deficiencies of the prior art, in whole or in part, it is an object of the present invention to: the positioning device for the wafer has the advantages that the positioning device has the adsorption function, the jacking and lifting function and the rotating and positioning correction function, various functions required by the wafer carrying platform are integrated, the structure is compact, the occupied space is small, and the effective utilization of the space can be realized.
In order to realize the purpose of the utility model, the utility model provides a following technical scheme:
a positioning device for a wafer comprises a bearing unit, a negative pressure unit and a rotating unit, wherein the negative pressure unit is connected with external vacuum equipment; the bearing unit comprises a base and a carrying platform which is arranged on the base and provided with a vacuum chuck, and the vacuum chuck is connected with the negative pressure unit and used for adsorbing a wafer; the bearing unit also comprises a jacking mechanism which is arranged below the bearing platform and in the middle of the turntable bearing, a jacking channel is formed on the bearing platform, and the jacking channel is used for the jacking mechanism to lift and pass through. The utility model provides a positioner for wafer utilizes vacuum chuck to realize fixed to the absorption of wafer, utilizes the rotation of rotary unit drive microscope carrier, makes the rotatable certain angle of wafer that adsorbs on vacuum chuck, realizes that the wafer places the location of position and corrects. Meanwhile, the device is also provided with a jacking mechanism, the jacking mechanism is lifted in the jacking channel, and in the wafer transferring process, the jacking mechanism can move to the upper part of the carrier platform, so that the jacking and lifting effects are achieved, the wafer can be pre-fixed by the jacking mechanism in advance, and after the jacking mechanism is lowered, the wafer is transferred to the vacuum chuck, and finally, the fixing is achieved, and the follow-up detection can be facilitated. In the subsequent detection, the wafer can be lifted to the detection position by the lifting mechanism. The device provided by the utility model have the function of adsorbing, the function is lifted in the jacking and the function is corrected to rotational positioning, with the required multiclass function integration of wafer microscope carrier together, compact structure, occupation space are little, can realize the effective utilization in space.
The jacking mechanism comprises a first driving mechanism, a fixed plate and a plurality of adsorption guide rods; the first driving mechanism is arranged on the carrying platform, the fixing plate is sleeved on the first driving mechanism, and the adsorption guide rod is arranged on the fixing plate; the adsorption guide rod comprises a suction nozzle, a hollow rod body and a guide rod joint which are sequentially connected, and the guide rod joint is connected with the negative pressure unit; the first driving mechanism drives the adsorption guide rod to lift and pass through the jacking channel. The first driving mechanism such as a jacking cylinder can drive a fixing plate sleeved on the cylinder to move up and down, and when the fixing plate moves up, the adsorption guide rod rises to the position above the vacuum suction disc along the jacking channel to form a height difference, so that the position avoiding function is realized. And transferring the wafer to the adsorption guide rod, and starting negative pressure to enable the suction nozzle of the adsorption guide rod to adsorb the wafer above the vacuum chuck. When the cylinder drives the fixing plate to move downwards, the adsorption guide rod descends along the jacking channel to be away from the surface of the vacuum chuck, the wafer is transferred onto the vacuum chuck, and the negative pressure is closed. The plurality of adsorption guide rods preferably ascend simultaneously and descend simultaneously.
The number of the adsorption guide rods is three, and the centers of the three adsorption guide rods are superposed with the center of the carrying platform; the jacking channels are three in number and are arranged corresponding to the adsorption guide rods. The three adsorption guide rods comprise three suction nozzles, when the suction nozzles are located above the vacuum chuck, the three suction nozzles form an adsorption plane, and a space for avoiding the wafer clamping jaw to take and place is formed between the three adsorption guide rods, so that the wafer is convenient to transfer. The central positions of the three adsorption guide rods and the central position of the carrying platform coincide to enable the transfer to be more stable, and the wafer is located at the proper position of the vacuum chuck after the transfer.
The interlude of jacking passageway is formed with outside convex spacing space, the interlude of adsorbing the guide arm is formed with outside convex locating part, when climbing mechanism goes up and down the locating part is in reciprocate in the spacing space. Spacing space has spacing effect, and when adsorbing the guide arm and descend, descend to spacing space's bottom at most, when adsorbing the guide arm and rise, rise to spacing space's top at most, limited the distance scope that adsorbs the guide arm and reciprocate.
The inner side of the turntable bearing is provided with a plurality of guide grooves, and the bottom of the adsorption guide rod is positioned in the guide grooves and ascends and descends along the guide grooves. Can ensure the vertical lifting of the suction nozzle on the adsorption guide rod, and the lifting process can not cause the phenomenon of the eastern turning and the western turning. When the number of the adsorption guide rods is three, the fixed plate can be a regular triangle fixed plate, the adsorption guide rods are respectively positioned on three corners of the regular triangle, and the three corners of the regular triangle are respectively positioned in the guide grooves.
The negative pressure unit comprises a first negative pressure component and a second negative pressure component; the first negative pressure assembly is communicated with a vacuum cavity on the vacuum chuck to provide negative pressure, and the second negative pressure assembly is communicated with the guide rod joint to provide negative pressure. The first negative pressure assembly and the second negative pressure assembly can respectively adjust negative pressure to respectively provide negative pressure for the vacuum cavity and the adsorption guide rod of the vacuum chuck.
The vacuum sucker is a porous ceramic sucker, a through hole is formed in the porous ceramic sucker, and the through hole serves as the upper section of the jacking channel. The porous ceramic sucker can be conveniently processed to form a through hole, so that a jacking channel is finally formed on the carrying platform.
The rotating unit comprises a closed-loop stepping motor, a ball screw pair and a transmission connecting piece, wherein a screw of the ball screw pair is connected with the closed-loop stepping motor; the first end of the transmission connecting piece is movably connected with the nut of the ball screw pair, and the second end of the transmission connecting piece is fixedly connected with the carrying platform. The closed-loop stepping motor can improve the motion precision, and compared with the rotation realized by utilizing a synchronous belt matched with a motor, the rotary positioning correction precision can be greatly improved by adopting the closed-loop stepping motor, the ball screw pair and the transmission connecting piece.
The carrying platform comprises a circular rotating platform and an installation platform which are fixedly connected, the rotating platform is connected with the base, and the installation platform is used for installing the vacuum chuck; the second end of the transmission connecting piece is fixed on the rotating platform. The linear motion of the screw rod can be converted into the rotary motion of the circular rotary platform by utilizing the closed-loop stepping motor, the ball screw pair and the transmission connecting piece, so that the accurate positioning and correction of the wafer position are realized.
And a nut of the ball screw pair is provided with a transmission bearing, and the first end of the transmission connecting piece is connected with the transmission bearing. The freedom degree of the transmission connecting piece in the vertical direction of the linear motion of the nut can be widened, so that the carrier can rotate conveniently.
Compared with the prior art, the utility model discloses following beneficial effect has at least:
the utility model discloses utilize vacuum chuck to realize fixed to the absorption of wafer, utilize the rotation of rotary unit drive microscope carrier, make the rotatable certain angle of wafer that adsorbs on vacuum chuck, realize that the wafer places the location of position and corrects. The jacking mechanism is lifted in the jacking channel, and can move to the position above the loading platform in the wafer transferring process, so that the jacking and lifting effects are achieved, the wafer can be pre-fixed by the jacking mechanism, and after the jacking mechanism descends, the wafer is transferred to the vacuum chuck, and finally, the wafer is fixed, and subsequent detection can be facilitated. In the subsequent detection, the product can be lifted to the detection position by utilizing the jacking mechanism. The utility model provides a positioner for wafer has adsorption function, jacking lift function and rotational positioning correction function, is in the same place the required multiclass function integration of wafer microscope carrier, and compact structure, occupation space are little, can realize the effective utilization in space.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a positioning apparatus for a wafer.
Fig. 2 is a partial structural view of a positioning apparatus for a wafer.
Fig. 3 is an enlarged view of region a in fig. 1.
Fig. 4 is a top view of a positioning apparatus for a wafer.
Fig. 5 is a cross-sectional view taken along line AA in fig. 4.
Fig. 6 is a schematic structural diagram of a lift mechanism of a positioning apparatus for a wafer.
Reference numerals: 1-a load-bearing unit; 10-a base; 110-jacking passages; 1100-limit space; 1101-a through hole; 111-a rotating platform; 112-a mounting platform; 113-a boss; 12-vacuum chuck; 13-a turntable bearing; 131-a guide groove; 132-vacuum suction holes; 14-a jacking mechanism; 141-a first drive mechanism; 142-a fixed plate; 143-adsorption guide bar; 1430-a stop; 143 a-a suction nozzle; 143 b-a hollow rod body; 143 c-guide bar joint; 144-a spring; 2-a rotation unit; 21-closed loop stepper motor; 221-a screw rod; 222-a connection block; 223-a drive bearing; 23-drive connection.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below, and all other embodiments obtained by those skilled in the art without creative work belong to the scope of the protection of the present invention based on the embodiments of the present invention.
The utility model provides a positioner for wafer, as shown in fig. 1 and 2, including load-bearing unit 1, negative pressure unit (not shown) and rotary unit 2, the negative pressure unit links to each other with outside vacuum apparatus.
The bearing unit 1 comprises a base 10 and a carrying platform with a vacuum chuck 12, which is arranged on the base 10, wherein the vacuum chuck 12 is connected with a negative pressure unit for adsorbing a wafer. The stage is connected to a turntable bearing 13 inside the base 10, the turntable bearing 13 in this embodiment being a cross roller bearing. The stage comprises a circular rotary platform 111 and a mounting platform 112 which are fixedly connected, the rotary platform 111 is connected with the base 10, and the mounting platform 112 is used for mounting the vacuum chuck 12.
The vacuum chuck 12 is a circular porous ceramic chuck, a vacuum cavity (not shown in the figure) is formed inside the porous ceramic chuck, a microporous layer (not shown in the figure) communicated with the vacuum cavity is formed on the surface of the porous ceramic chuck, the vacuum cavity is connected with a negative pressure unit (a vacuum gas path connecting pipe), external gas is introduced into the vacuum cavity of the vacuum chuck 12 by using a gas path, and negative pressure is transmitted to the surface of the vacuum chuck 12 through the microporous layer of the vacuum chuck 12, so that stable and uniform adsorption of a product is realized. The large area of the vacuum cavity can ensure that the adsorbed surface is larger and more uniform, and in other embodiments, porous vacuum chucks of other shapes or materials can be selected. The product in this example is a wafer.
As shown in fig. 2 to 4, the rotary unit 2 includes a closed-loop stepping motor 21, a ball screw pair, and a transmission link 23, and a screw 221 of the ball screw pair is connected to the closed-loop stepping motor 21. The output end of the rotating shaft of the closed-loop stepping motor 21 is connected with the screw rod 221 through a coupler. The nut of the ball screw pair is mounted on a connecting block 222, namely a nut seat, the connecting block 222 can also be used for mounting a slide block on a guide line rail, and the connecting block 222 is used as one of transmission parts for converting linear motion into arc motion. The connecting block 222 is provided with a transmission bearing 223, namely a tightening mechanism, so that no back clearance is generated during transmission. The connecting block 222 is further provided with a sensor sensing piece for setting the range of the linear motion of the connecting block 222, so as to determine the positive and negative limits and the origin of the positioning correction of the wafer by the rotation of the carrier.
The first end of the transmission connecting piece 23 is connected with the transmission bearing 223, so that the first end of the transmission connecting piece 23 is movably connected with the nut of the ball screw pair. The second end of the transmission connecting piece 23 is fixed on the rotary platform 111 through screw locking. The transmission connecting piece 23 is not constrained in the direction perpendicular to the moving direction of the nut, and the freedom degree is released, so that the carrier is driven to rotate, and the second end of the transmission connecting piece 23 moves in an arc shape. The rotary platform 111 and the mounting platform 112 are connected by screw locking, and bosses 113 are provided on the rotary platform 111 and the mounting platform 112 on one side of the rotary unit 2. In the compact wafer fixing device of the present embodiment, since the screw rod 221 of the rotary unit 2 is closely attached to the stage, and no escape space can be formed, the mounting space for the screws is removed by the boss 113, so that the rotary stage 111 and the mounting stage 112 can be tightly connected by the screws.
In this embodiment, the transmission connector 23 is fixedly connected to the rotary platform 111 by screws, and in other embodiments, the transmission connector may be fixedly connected by bolts or other fastening structures. The rotating unit 2 is in transmission connection with the stage through a transmission connecting piece 23, and the rotating unit 2 drives the stage to rotate so as to correct the position of the wafer adsorbed on the stage. The closed-loop stepping motor 21 has the characteristic of precisely controlling the rotation angle, so that the axial displacement of the nut can be precisely controlled by precisely controlling the rotation angle of the screw rod 221, and the linear motion of a load can be precisely controlled.
The wafer needs to be placed in the proper position before inspection, and therefore the angle of the wafer needs to be adjusted. The rotating unit 2 drives the carrying platform to rotate, so that the angle of the wafer can be accurately positioned, adjusted and corrected. Present adoption motor drive gear is rotatory, drives the correction precision of the rotatory scheme in order to realize the microscope carrier of hold-in range about 0.07 degree, and the utility model discloses a closed loop step motor 21 side push away lead screw 221 and drive lead screw 221 and rotate, and linear motion is made to the nut, through the rotary motion that the drive of transmission connecting piece 23 converted ball screw pair's linear motion into the microscope carrier. In the embodiment, the movement distance of the nut on the screw rod is within 30mm, the carrying platform can rotate by about +/-5 degrees, the correction precision can reach about 0.0058 degree, and the correction precision is high.
As shown in fig. 5, the carrying unit 1 further includes a jacking mechanism 14 installed below the stage and in the middle of the turntable bearing 13, three jacking channels 110 are formed on the stage, a through hole 1101 is formed on the porous ceramic chuck, the through hole 1101 is used as an upper section of the jacking channel 110, and the jacking channel 110 is used for the jacking mechanism 14 to go up and down. The jacking mechanism 14 includes a first driving mechanism 141, a fixing plate 142, and three adsorption guides 143. The first driving mechanism 141 is installed on the carrier, the fixing plate 142 is sleeved on the first driving mechanism 141, and the absorption guide rod 143 is installed on the fixing plate 142. The first driving mechanism 141 drives the adsorption guide rods 143 to move up and down in the lift-up channel 110, the adsorption guide rods 143 can move up and down vertically relative to the stage, and the first driving mechanism 141 drives the three adsorption guide rods 143 to move up and down vertically at a certain speed. The middle section of the jacking channel 110 is formed with a limiting space 1100 protruding outwards, the middle section of the adsorption guide rod 143 is formed with a limiting piece 1430 protruding outwards, and the limiting piece 1430 moves up and down in the limiting space 1100 when the jacking mechanism 14 lifts.
As shown in fig. 6, the fixing plate 142 has a regular triangle shape, and three suction guides 143 are installed at three corners of the regular triangle fixing plate 142, respectively. The centers of the three adsorption guide rods 143 coincide with the center of the carrier; the number of the jacking passages 110 is three, and the jacking passages are arranged corresponding to the adsorption guide rods 143. In other embodiments, the number of the suction guides 143 may be greater, and the installation position thereof may be adjusted accordingly. The first driving mechanism 141 in this embodiment is a jacking cylinder, and other linear driving mechanisms such as a motor may be used. Three sections of springs 144 are mounted on the fixing plate 142, and one end of each section of spring 144 is fixed on the fixing plate 142, and the other end is fixed on the bearing unit 1, so that the jacking mechanism 14 can be reset.
The adsorption guide 143 includes a suction nozzle 143a, a hollow rod 143b, and a guide joint 143c, which are connected in sequence, and the guide joint 143c is connected to the negative pressure unit. The inner side of the turntable bearing 13 is provided with a plurality of guide grooves 131, and the bottoms of the adsorption guide rods 143 are positioned in the guide grooves 131 and ascend and descend along the guide grooves 131. When all three suction guides 143 are raised above the vacuum chuck 12, the contact surfaces of the suction nozzles 143a of the three suction guides 143 and the wafer are parallel to the surface of the vacuum chuck 12.
The negative pressure unit comprises a first negative pressure component and a second negative pressure component; the first negative pressure assembly includes a guide rod negative pressure conduit in communication with the guide rod coupling 143c and the second negative pressure assembly includes a suction cup negative pressure conduit in communication with the vacuum suction cup 12. The first negative pressure component communicates with the vacuum chamber on the vacuum chuck 12 to provide negative pressure, and the second negative pressure component communicates with the guide bar connector 143c to provide negative pressure. The first negative pressure assembly and the second negative pressure assembly can respectively perform negative pressure adjustment to respectively provide negative pressure for the vacuum cavity of the vacuum chuck 12 and the adsorption guide rod 143. The rotary table 111 and the mounting table 112 are formed with passages (not shown) therein for connecting air passages to the vacuum chamber. The inner side of the turntable bearing 13 is further provided with a vacuum pumping hole 132 for arranging a guide rod negative pressure pipeline and a sucker negative pressure pipeline so as to be connected with an external vacuum device.
The working principle of the embodiment is as follows:
the wafer transferring process comprises the following steps: a wafer clamping jaw such as an electric flat jaw clamps a wafer (the wafer is adsorbed on the flat jaw) to the upper part of the carrying platform, the jacking cylinder retracts, the adsorption guide rod 143 rises, the suction nozzle 143a leaves the surface of the vacuum chuck 12 to form a height difference so as to avoid a wafer clamping jaw taking and placing space, and in order to enable the wafer to be smoothly transported, the wafer clamping jaw is required to have adsorption capacity in the transporting process. The wafer clamping jaw places the wafer on the three suction nozzles 143a, the first negative pressure assembly is started, the negative pressure gas is led to the suction nozzles 143a, and the wafer is stably sucked by the suction guide rod 143. And closing the adsorption gas circuit of the flat claw and removing the clamping jaw. The jacking cylinder extends out, the adsorption guide rod 143 descends and is recovered, the wafer is transferred to the surface of the vacuum chuck 12 along the trend, the second negative pressure assembly is started, and the wafer is stably adsorbed by the vacuum chuck 12. The product is smoothly placed on the vacuum chuck 12 through the processes of jacking, lifting, avoiding and adsorbing of the jacking mechanism 14. In the subsequent detection of the wafer, the lifting mechanism 14 may be further utilized to lift the wafer on the vacuum chuck 12 to the detection position, that is, the second negative pressure component is closed, the first negative pressure component is opened, and the adsorption guide rod 143 drives the wafer to leave the surface of the vacuum chuck 12 to the detection position under the action of the lifting cylinder, and the specific process is not described in detail.
The wafer correction process: before correction, image capture judgment needs to be performed on the wafer adsorbed on the vacuum chuck 12, and the wafer can be processed in a front station of the function, or during AOI detection, depending on actual working conditions. And judging according to the image capturing result so as to correct the position of the wafer according to the requirement. The closed-loop stepping motor 21 drives the nut on the lead screw 221 to make linear motion, so that the transmission connecting piece 23 makes arc motion, and the rotary platform 111 on the carrier is driven to make rotary motion, that is, the linear motion of the lead screw 221 is converted into the rotary motion of the carrier 11, thereby realizing the function of positioning and correcting the position of the wafer.
The positioning device for the wafer provided by the embodiment can be used for AOI detection and the like, has an adsorption function, can stably adsorb a wafer, and does not move so as to ensure that the position of a product is not influenced when the wafer is lifted and moved. Meanwhile, the device has the functions of jacking, lifting and avoiding, is convenient for stably receiving and taking the wafer, and smoothly transfers the wafer to the surface of the vacuum chuck. The device also has a high-precision rotation positioning function, and the wafer placement position is corrected before AOI detection. The jacking mechanism 14 is arranged in the device in an embedded mode, the whole device is compact in structure and small in mass, inertia and resistance during movement are reduced, various functions are integrated together, and effective utilization of space is achieved. The device can be generally applied to the design of a stage which needs to have the functions of rotation positioning correction, adsorption and jacking lifting, especially has requirements on the space of the stage and the running speed, and has obvious advantages.
The above description of the embodiments is only intended to facilitate the understanding of the method and the core idea of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the scope of the appended claims.
Claims (10)
1. A positioning device for a wafer comprises a bearing unit (1), a negative pressure unit and a rotating unit (2), wherein the negative pressure unit is connected with external vacuum equipment; the bearing unit (1) comprises a base (10) and a carrying platform which is arranged on the base (10) and provided with a vacuum chuck (12), and the vacuum chuck (12) is connected with the negative pressure unit and used for adsorbing a wafer; the carrying platform is connected with a turntable bearing (13) in the base (10), the rotating unit (2) drives the carrying platform to rotate, and the device is characterized in that: the bearing unit (1) further comprises a jacking mechanism (14) arranged below the carrier and in the middle of the turntable bearing (13), a jacking channel (110) is formed on the carrier, and the jacking channel (110) is used for the jacking mechanism (14) to lift and pass through.
2. The positioning apparatus of claim 1, wherein: the jacking mechanism (14) comprises a first driving mechanism (141), a fixed plate (142) and a plurality of adsorption guide rods (143); the first driving mechanism (141) is installed on the carrier, the fixing plate (142) is sleeved on the first driving mechanism (141), and the adsorption guide rod (143) is installed on the fixing plate (142); the adsorption guide rod (143) comprises a suction nozzle (143 a), a hollow rod body (143 b) and a guide rod joint (143 c) which are sequentially connected, and the guide rod joint (143 c) is connected with the negative pressure unit; the first driving mechanism (141) drives the adsorption guide rod (143) to lift and pass through the jacking channel (110).
3. The positioning apparatus for wafer as set forth in claim 2, wherein: the number of the adsorption guide rods (143) is three, and the centers of the three adsorption guide rods (143) are superposed with the center of the carrier; the number of the jacking channels (110) is three, and the jacking channels are arranged corresponding to the adsorption guide rods (143).
4. A positioning apparatus for a wafer as set forth in claim 2 or 3, wherein: the middle section of jacking passageway (110) is formed with outside convex spacing space (1100), the middle section of adsorbing guide rod (143) is formed with outside convex locating part (1430), when climbing mechanism (14) go up and down locating part (1430) reciprocate in spacing space (1100).
5. A positioning apparatus for a wafer as defined in claim 2 or 3, wherein: the inner side of the turntable bearing (13) is provided with a plurality of guide grooves (131), and the bottom of the adsorption guide rod (143) is positioned in the guide grooves (131) and ascends and descends along the guide grooves (131).
6. A positioning apparatus for a wafer as set forth in claim 2 or 3, wherein: the negative pressure unit comprises a first negative pressure component and a second negative pressure component; the first negative pressure component is communicated with a vacuum cavity on the vacuum sucker (12) to provide negative pressure, and the second negative pressure component is communicated with the guide rod joint (143 c) to provide negative pressure.
7. The positioning apparatus of claim 1, wherein: the vacuum chuck (12) is a porous ceramic chuck, a through hole (1101) is formed in the porous ceramic chuck, and the through hole (1101) is used as the upper section of the jacking channel (110).
8. The positioning apparatus of claim 1, wherein: the rotating unit (2) comprises a closed-loop stepping motor (21), a ball screw pair and a transmission connecting piece (23), wherein a screw (221) of the ball screw pair is connected with the closed-loop stepping motor (21); the first end of the transmission connecting piece (23) is movably connected with the nut of the ball screw pair, and the second end of the transmission connecting piece is fixedly connected with the carrier.
9. The positioning apparatus as claimed in claim 8, wherein: the carrying platform comprises a circular rotating platform (111) and a mounting platform (112), the circular rotating platform (111) and the mounting platform (112) are fixedly connected, the rotating platform (111) is connected with the base (10), and the mounting platform (112) is used for mounting the vacuum chuck (12); the second end of the transmission connecting piece (23) is fixed on the rotating platform (111).
10. The positioning apparatus for wafer as claimed in claim 8 or 9, wherein: and a transmission bearing (223) is arranged on a nut of the ball screw pair, and the first end of the transmission connecting piece (23) is connected with the transmission bearing (223).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202220764442.3U CN217361537U (en) | 2022-04-02 | 2022-04-02 | Positioning device for wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220764442.3U CN217361537U (en) | 2022-04-02 | 2022-04-02 | Positioning device for wafer |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130400A (en) * | 2023-01-10 | 2023-05-16 | 上海御微半导体技术有限公司 | Precise movement table |
| CN117080156A (en) * | 2023-10-18 | 2023-11-17 | 盛吉盛(宁波)半导体科技有限公司 | Carrier device for wafer detection |
| CN117116831A (en) * | 2023-07-26 | 2023-11-24 | 柯尔微电子装备(厦门)有限公司 | Ultrathin correction device for wafer detection and operation method |
| CN117226319A (en) * | 2023-11-16 | 2023-12-15 | 镭神泰克科技(苏州)有限公司 | Material carrying device, precise marking equipment and marking method |
| CN117995749A (en) * | 2024-04-03 | 2024-05-07 | 迈为技术(珠海)有限公司 | Wafer processing platform and feeding method thereof |
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- 2022-04-02 CN CN202220764442.3U patent/CN217361537U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116130400A (en) * | 2023-01-10 | 2023-05-16 | 上海御微半导体技术有限公司 | Precise movement table |
| CN117116831A (en) * | 2023-07-26 | 2023-11-24 | 柯尔微电子装备(厦门)有限公司 | Ultrathin correction device for wafer detection and operation method |
| CN117116831B (en) * | 2023-07-26 | 2024-10-15 | 柯尔微电子装备(厦门)有限公司 | Ultrathin correction device for wafer detection and operation method |
| CN117080156A (en) * | 2023-10-18 | 2023-11-17 | 盛吉盛(宁波)半导体科技有限公司 | Carrier device for wafer detection |
| CN117080156B (en) * | 2023-10-18 | 2024-01-30 | 盛吉盛(宁波)半导体科技有限公司 | Carrier device for wafer detection |
| CN117226319A (en) * | 2023-11-16 | 2023-12-15 | 镭神泰克科技(苏州)有限公司 | Material carrying device, precise marking equipment and marking method |
| CN117226319B (en) * | 2023-11-16 | 2024-01-23 | 镭神泰克科技(苏州)有限公司 | Material carrying device, precise marking equipment and marking method |
| CN117995749A (en) * | 2024-04-03 | 2024-05-07 | 迈为技术(珠海)有限公司 | Wafer processing platform and feeding method thereof |
| CN117995749B (en) * | 2024-04-03 | 2024-06-07 | 迈为技术(珠海)有限公司 | Wafer processing platform and feeding method thereof |
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