CN113921437A - Wafer pre-alignment device and pre-alignment method - Google Patents
Wafer pre-alignment device and pre-alignment method Download PDFInfo
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- CN113921437A CN113921437A CN202111176229.7A CN202111176229A CN113921437A CN 113921437 A CN113921437 A CN 113921437A CN 202111176229 A CN202111176229 A CN 202111176229A CN 113921437 A CN113921437 A CN 113921437A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
The invention discloses a wafer pre-alignment device, which comprises a bottom plate, wherein a bearing plate parallel to the bottom plate is arranged above the bottom plate, a rotating base is arranged on the bearing plate, a vacuum adsorption platform synchronously rotating with the rotating base is arranged on the rotating base, and a visual detection unit for accurately aligning a wafer is arranged on one side of the rotating base. The jacking and centering mechanism can jack up or put down the wafer on the vacuum adsorption platform and can push the wafer to horizontally move relative to the vacuum adsorption platform until the center of the wafer coincides with the center line of the vacuum adsorption platform. The alignment method based on the device is further disclosed, the jacking and centering mechanism is additionally arranged, the problem that due to the fact that the wafer is too large in offset, the original vision detection unit cannot detect the abnormality is solved, the downtime is shortened, the overall stability of the equipment is improved, and the risk that the wafer is too large in offset and cannot be identified is reduced; the compensation range of the pre-alignment device can be improved to a certain extent.
Description
Technical Field
The invention relates to the technical field of wafer processing equipment, in particular to a wafer pre-alignment device and a pre-alignment method.
Background
Wafer positioning and identification, which requires reference to a Pre-alignment device (Pre-Aligner), is an important part of the wafer handling and overall IC manufacturing process. The aim of wafer pre-alignment is to calculate the eccentricity of the wafer and find its notch, and then compensate its eccentricity and turn the notch to a certain direction, ready for the next wafer identification and processing. The existing wafer pre-alignment device is shown in the attached figures 7-8, and comprises a rotating base 4 'fixed on a bearing plate 5', a vacuum adsorption platform 3 'fixed on the rotating base 4', a CCD vision sensor 1 'arranged on one side of the rotating base 4' through a vertical frame, a wafer 6 'placed on the vacuum adsorption platform 3' through a mechanical claw, a system started, and vacuum opened to adsorb and fix the wafer; after the vacuum value reaches a set value, the rotary base 4 ' drives the wafer 6 ' on the vacuum adsorption platform 3 ' to rotate together, the backlight source 2 ' on the vertical frame is opened, the CCD vision sensor 1 ' identifies the wafer, the system calculates the position of the circle center of the wafer and the position of the notch or flat opening of the wafer through operation, and the notch or flat opening position is adjusted to a required angle to realize the pre-alignment of the wafer.
However, in the existing pre-alignment system only depending on the recognition of the CCD vision sensor, for example, a 12-inch wafer is used, the recognition range is generally 304mm, the deviation can only be solved within +/-2 mm, and the deviation is larger than 5mm under the actual unexpected situation, if a mechanical claw places the wafer on a vacuum adsorption platform, the deviation is too large, at the moment, the pre-alignment device gives an alarm because the deviation exceeds the recognition range, and the machine is stopped. In such a case, the reason searching time is long, the cost is high, and the reason searching cannot be eliminated fundamentally, but the equipment has high automation degree, the shutdown processing is not timely, and the effective working time of the equipment is influenced by the long processing time.
Disclosure of Invention
In order to overcome the above disadvantages, the present invention provides a wafer pre-alignment apparatus, which reduces the problem that the original vision inspection unit cannot detect the abnormality due to too large wafer offset, shortens the downtime, improves the overall stability of the apparatus, and reduces the risk that the wafer is too large and cannot be identified; the compensation range of the pre-alignment device can be improved to a certain extent.
In order to achieve the above purposes, the invention adopts the technical scheme that: the utility model provides a wafer is aligning device in advance, includes the bottom plate, the bottom plate top is provided with the loading board rather than parallel, be provided with rotating base on the loading board, rotating base is last to be provided with rather than synchronous pivoted vacuum adsorption platform, rotating base one side is provided with the visual detection unit who is used for the accurate alignment of wafer, still including setting up the jacking centering mechanism on the bottom plate, jacking centering mechanism can jack-up or put down the wafer on the vacuum adsorption platform to can promote the relative vacuum adsorption platform horizontal migration of wafer until the centre of a circle of wafer with the central line coincidence of vacuum adsorption platform.
The invention has the beneficial effects that: the jacking centering mechanism is additionally arranged, the jacking centering mechanism can jack the wafer from the vacuum adsorption platform, then the wafer is pushed to move horizontally, complete and primary centering is achieved, and when the jacking centering mechanism moves the wafer downwards to be placed on the vacuum adsorption platform, the circle center is coincided with the center line of the vacuum adsorption platform. And then the vacuum adsorption platform adsorbs and fixes the wafer, the rotary base drives the wafer on the vacuum adsorption platform to rotate together, the visual detection unit calculates the position of the center of the circle of the wafer and the position of the notch or flat opening of the wafer through operation processing, and the notch or flat opening is adjusted to a required angle, so that the pre-alignment of the wafer is realized. The problem of the unusual emergence that original visual detection unit can't detect because of the wafer skew is too big is reduced, has shortened down time, improve equipment overall stability, reduces the wafer skew too big, risk that can't discern, can improve the compensation scope of pre-alignment device to a certain extent.
Further, the jacking centering mechanism comprises a jacking device and a centering device, the centering device comprises a left centering baffle and a right centering baffle which are symmetrically arranged on two sides of the vacuum adsorption platform, the left centering baffle and the right centering baffle move oppositely or oppositely under the action of the centering driving piece, and when the left centering baffle and the right centering baffle are close to each other, the central line of the wafer relative to the vacuum adsorption platform is pushed to be centered. The centering driving piece can be a parallel clamping jaw cylinder, and the left centering baffle and the right centering baffle are respectively fixed on two pneumatic clamping jaws of the parallel clamping jaw cylinder. The parallel clamping jaw air cylinder acts to push the wafer to horizontally move relative to the vacuum adsorption platform when pushing the left centering baffle and the right centering baffle to mutually approach, so that the centering and the guiding of the wafer are realized; when the left centering baffle and the right centering baffle are pushed to be away from each other, the wafer can be loosened.
Further, the left centering baffle is provided with a groove of an arc structure downwards from the upper end face of the left centering baffle, the radian of the groove is consistent with that of the wafer, the side wall of the wafer can be abutted against the side wall of the groove, the lower end face of the wafer can be abutted against the groove bottom of the groove, and when the left centering baffle and the right centering baffle are close to each other, the wafer is centered relative to the central line of the vacuum adsorption platform under the pushing of the two grooves. The wafer is pushed by the side wall of the groove with the arc structure, so that the centering and the guiding of the wafer are realized.
Further, jacking device includes jacking driving piece and left jacking frame and right jacking frame that goes up and down under the jacking driving piece effect in step, the jacking driving piece is fixed on the bottom plate, left side jacking frame and the relative vacuum adsorption platform symmetry of right jacking frame set up and fixedly connected with jacking board between the two, jacking board and the output shaft of jacking driving piece. The jacking driving part is a sliding table cylinder, stretches under the control of the electromagnetic valve, drives the jacking plate connected with the output shaft of the jacking driving part to lift, further drives the left jacking frame and the right jacking frame to ascend and descend, and completes jacking and returning of the wafer.
Furthermore, a plurality of contact salient points capable of abutting against the lower end face of the wafer are arranged on the upper end faces of the left jacking frame and the right jacking frame, and the contact salient points are made of peek materials. When the wafer is jacked up by the jacking device, only the contact convex points are abutted against the lower end face of the wafer, so that the wafer is prevented from being damaged due to large friction force and particle generation caused by large contact area with the left jacking frame and the right jacking frame in the centering process of the centering device.
Further, the jacking device comprises a jacking driving piece and a mounting seat, the mounting seat is fixed on the bottom plate, an output shaft of the jacking driving piece is fixedly connected with the centering driving piece, and the jacking driving piece drives the centering device to lift. The jacking driving piece directly drives the centering device to lift, the wafer is jacked up by the bottoms of the left centering baffle and the right centering baffle of the centering device, and then centering is carried out.
Further, the centering driving piece and the jacking driving piece are located between the bearing plate and the bottom plate. And the space is saved.
The invention also provides a wafer pre-alignment method, which can reduce the risk that the wafer is too large in offset and cannot be identified by twice alignment and can improve the compensation range of the pre-alignment device to a certain extent.
In order to achieve the above purposes, the invention adopts the technical scheme that: a wafer prealignment method comprises the steps that firstly, a wafer is conveyed to a vacuum adsorption platform through a manipulator; then starting a jacking centering mechanism, jacking the wafer on the vacuum adsorption platform through a jacking device, and carrying out primary coarse centering on the wafer relative to the central line of the vacuum adsorption platform by using a groove of the centering device; then the jacking device descends, and the wafer is placed on the adsorption platform again; and finally, adsorbing the wafer by using the vacuum adsorption platform, driving the wafer to rotate by using the rotating base, calculating the circle center position of the wafer and the notch or flat position of the wafer by using the visual detection unit, and adjusting the notch or flat position to a required angle to complete secondary fine pre-centering.
The wafer is roughly centered for the first time through the jacking centering mechanism, the center of the wafer is enabled to be coincident with the center line of the vacuum adsorption platform, the wafer is adsorbed through the vacuum adsorption platform, the rotary base drives the wafer to rotate, the position of the center of the wafer and the position of a notch or a flat opening of the wafer are calculated through the visual detection unit, the position of the notch or the flat opening is adjusted to a required angle, and secondary fine pre-centering is completed.
Further, before the primary coarse centering, primary fine pre-centering can be performed on the wafer, the primary fine pre-centering is communicated with the secondary fine pre-centering method, if the centering precision of the primary fine pre-centering meets the threshold requirement, the primary fine pre-centering is finished, otherwise, the primary coarse centering is performed. The problem of the unusual emergence that original visual detection unit can't detect because of the wafer skew is too big is reduced, has shortened down time, improve equipment overall stability, reduces the wafer skew too big, risk that can't discern, can improve the compensation scope of pre-alignment device to a certain extent.
Drawings
Fig. 1 is a schematic perspective view of embodiment 1 of the present invention;
fig. 2 is a schematic perspective view of a jacking centering mechanism in embodiment 1 of the present invention;
fig. 3 is a schematic structural view of a jacking device in embodiment 1 of the present invention;
FIG. 4 is a cross-sectional view of the left jacking frame in embodiment 1 of the present invention
FIG. 5 is a schematic perspective view of embodiment 2 of the present invention;
fig. 6 is a schematic perspective view of a jacking centering mechanism in embodiment 2 of the present invention;
FIG. 7 is a schematic perspective view of a wafer pre-alignment apparatus in the prior art;
fig. 8 is a schematic perspective view illustrating a detection state of a wafer pre-alignment apparatus in the prior art.
In the figure:
1', a CCD vision sensor; 2', a backlight source; 3/3', a vacuum adsorption platform; 4/4', swivel base; 5/5', a carrier plate; 6/6', wafer; 7. a left jacking frame; 8. a left centering baffle; 9. a left connecting seat; 10. a jacking plate; 11. jacking a driving piece; 12. mounting a plate; 13. a parallel clamping jaw cylinder; 14. a base plate; 15. a right connecting seat; 16. a right centering baffle; 17. a right jacking frame; 18. a visual detection unit; 19. contacting the bumps; 20. and (7) mounting a seat.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Example 1
Referring to fig. 1-2, a wafer 6 pre-alignment apparatus according to the present invention includes a bottom plate 14, a carrier plate 5 disposed above the bottom plate 14 and parallel to the bottom plate, wherein the carrier plate 5 is fixed on the bottom plate 14 by a fixing frame. Be provided with rotating base 4 on the loading board 5, be provided with on the rotating base 4 rather than synchronous pivoted vacuum adsorption platform 3, vacuum adsorption platform 3 can adsorb wafer 6 to drive vacuum adsorption platform 3 and wafer 6 synchronous rotation through rotating base 4. A visual detection unit 18 used for accurately aligning the wafer 6 is arranged on one side of the rotating base 4, the visual detection unit 18 comprises a vertical frame fixed on one side of the rotating base 4, and a CCD visual sensor and a backlight source are arranged on the vertical frame. The vacuum adsorption platform 3 adsorbs and fixes the wafer 6, the rotary base 4 drives the wafer 6 on the vacuum adsorption platform 3 to rotate together, the backlight source on the vertical frame is opened, the CCD vision sensor identifies, the system calculates the position of the circle center of the wafer 6 and the position of the notch or flat opening of the wafer 6 through operation, and the notch or flat opening position is adjusted to a required angle, so that the alignment of the wafer 6 is realized. The rotary base 4, the vacuum adsorption platform 3 and the visual inspection unit 18 are all in the prior art, and the centering method and structure are disclosed in chinese patent with application number CN201510203515.6, and are not described herein again.
The vacuum adsorption platform is characterized by further comprising a jacking centering mechanism arranged on the bottom plate 14, wherein the jacking centering mechanism comprises a jacking device and a centering device, and can jack up or put down the wafer 6 on the vacuum adsorption platform 3 and push the wafer 6 to horizontally move relative to the vacuum adsorption platform 3 so as to push the wafer 6 to a position where the center of a circle coincides with the center line of the vacuum adsorption platform 3.
The centering device comprises a left centering baffle 8 and a right centering baffle 16 which are symmetrically arranged at two sides of the vacuum adsorption platform 3, and the left centering baffle 8 and the right centering baffle 16 move oppositely or oppositely under the action of a centering driving piece. The centering drive may be a parallel jaw cylinder 13 secured to a base plate 14 by a mounting plate 12. The left centering baffle 8 and the right centering baffle 16 are respectively fixed on the two pneumatic clamping jaws of the parallel clamping jaw air cylinder 13 through a left connecting seat 9 and a right connecting seat 15. The parallel clamping jaw air cylinder 13 can also be an electric cylinder for changing a horizontal clamping jaw, and can drive the left centering baffle 8 and the right centering baffle 16 to move. The parallel clamping jaw air cylinder 13 acts to push the wafer 6 to horizontally move relative to the vacuum adsorption platform 3 when the left centering baffle 8 and the right centering baffle 16 are pushed to approach each other, so that the centering and the guiding of the wafer 6 are realized; pushing the left and right centering flaps 8, 16 away from each other releases the wafer 6.
The left centering baffle 8 is provided with a groove of an arc structure downwards from the upper end surface of the left centering baffle 8, the radian of the groove is consistent with that of the wafer 6, the side wall of the wafer 6 can be abutted against the side wall of the groove, the lower end surface of the wafer 6 can be abutted against the groove bottom of the groove, and when the left centering baffle 8 and the right centering baffle 16 are close to each other, the wafer 6 is centered relative to the central line of the vacuum adsorption platform 3 under the pushing of the two grooves. The wafer 6 is pushed by the side wall of the groove with the arc structure, and the centering and the guiding of the wafer 6 are realized.
The jacking device comprises a jacking driving piece 11, and a left jacking frame 7 and a right jacking frame 17 which are synchronously lifted under the action of the jacking driving piece 11. The jacking driving piece 11 is a guide rail sliding table cylinder and is fixed on the bottom plate 14. Left jacking frame 7 and right jacking frame 17 are symmetrical relative to vacuum adsorption platform 3 and set up and fixedly connected with jacking board 10 between the two, jacking board 10 and the output shaft of jacking driving piece 11. The jacking driving part 11 extends and retracts under the control of the electromagnetic valve, drives the jacking plate 10 connected with the output shaft of the jacking driving part to ascend and descend, further drives the left jacking frame 7 and the right jacking frame 17 to ascend and descend, and completes jacking and returning of the wafer 6. The left jacking frame 7 and the right jacking frame 17 are positioned between the left centering baffle 8 and the right centering baffle 16.
Referring to fig. 3-4, the upper end surfaces of the left lifting frame 7 and the right lifting frame 17 are provided with a plurality of contact bumps 19 capable of abutting against the lower end surface of the wafer 6, and the contact bumps 19 are made of a peek material. When the wafer 6 is jacked up by the jacking device, only the contact salient points 19 abut against the lower end face of the wafer 6, so that the phenomenon that the wafer 6 is damaged due to large friction force and particle generation caused by large contact area with the left jacking frame 7 and the right jacking frame 17 in the centering process of the centering device is avoided. The jacking driving piece 11 adopts a clean type guide rail sliding table cylinder and is provided with a suction port for discharging generated particles, so that the operation reliability is improved.
The jacking centering mechanism is additionally arranged, the jacking centering mechanism can jack the wafer 6 from the vacuum adsorption platform 3, then the wafer 6 is pushed to horizontally move, complete and primary centering is achieved, and when the jacking centering mechanism moves the wafer 6 downwards to be placed on the vacuum adsorption platform 3, the center of a circle coincides with the center line of the vacuum adsorption platform 3. And then the vacuum adsorption platform 3 adsorbs and fixes the wafer 6, the rotary base 4 drives the wafer 6 on the vacuum adsorption platform 3 to rotate together, the visual detection unit 18 calculates the position of the circle center of the wafer 6 and the position of the notch or flat opening of the wafer 6 through operation, and the notch or flat opening position is adjusted to a required angle, so that the pre-alignment of the wafer 6 is realized. The problem that the abnormality cannot be detected by the original vision detection unit 18 due to too large deviation of the wafer 6 is solved, the downtime is shortened, the overall stability of the equipment is improved, the risk that the wafer 6 is too large in deviation and cannot be identified is reduced, and the compensation range of the pre-alignment device can be improved to a certain extent.
The centering driving piece and the jacking driving piece 11 are both positioned between the bearing plate 5 and the bottom plate 14, so that the space is greatly saved.
When the wafer 6 is pre-aligned based on the pre-alignment device, the alignment method comprises the following steps:
the wafer 6 is conveyed to the vacuum adsorption platform 3 through a mechanical arm; and then starting the jacking and centering mechanism, jacking the wafer 6 on the vacuum adsorption platform 3 through the jacking device, and carrying out primary coarse centering on the wafer 6 relative to the central line of the vacuum adsorption platform 3 by utilizing the groove of the centering device. The lift-up device is then lowered to place the wafer 6 onto the suction table again. And finally, the vacuum adsorption platform 3 adsorbs the wafer 6, the rotary base 4 drives the wafer 6 to rotate, the circle center position of the wafer 6 and the notch or flat opening position of the wafer 6 are calculated through the visual detection unit 18, the notch or flat opening position is adjusted to a required angle, and secondary fine pre-centering is completed.
The wafer 6 is roughly centered for the first time through the jacking centering mechanism, the center line of the wafer 6 is enabled to be coincident with the center line of the vacuum adsorption platform 3, the wafer 6 is adsorbed through the vacuum adsorption platform 3, the rotary base 4 drives the wafer 6 to rotate, the position of the center of the wafer 6 and the position of a notch or a flat opening of the wafer 6 are calculated through the visual detection unit 18, the position of the notch or the flat opening is adjusted to a required angle, and secondary fine pre-centering is completed. The operation of starting the primary coarse centering in an emergency after the secondary fine pre-alignment and the shutdown accident are avoided.
Before the primary coarse centering, the wafer 6 can be subjected to primary fine pre-centering, the primary fine pre-centering is communicated with the secondary fine pre-centering method, and if the centering precision of the primary fine pre-centering meets the threshold requirement, the method is ended. If the threshold requirement is not met, the visual detection unit 18 is abnormally stopped, and primary coarse centering is performed. The problem that the abnormality cannot be detected by the original vision detection unit 18 due to too large deviation of the wafer 6 is solved, the downtime is shortened, the overall stability of the equipment is improved, the risk that the wafer 6 is too large in deviation and cannot be identified is reduced, and the compensation range of the pre-alignment device can be improved to a certain extent.
Example 2
Referring to fig. 5-6, the present embodiment is different from embodiment 1 only in that the jacking device includes a jacking driving member 11 and a mounting seat 20, the mounting seat 20 is fixed on the bottom plate 14, an output shaft of the jacking driving member 11 is fixedly connected with the centering driving member, and the jacking driving member 11 drives the centering device to ascend and descend. The jacking driving piece 11 directly drives the centering device to lift, and the wafer 6 is jacked up by the bottoms of the left centering baffle 8 and the right centering baffle 16 of the centering device and then centered. The other structures are the same as those in embodiment 1.
The jacking device of the embodiment directly jacks up the centering device, so that the left centering baffle 8 and the right centering baffle 16 of the centering device can jack up the wafer 6 on the vacuum adsorption platform 3 through the bottom of the groove, and can also center the wafer 6. The left jacking frame 7 and the right jacking frame 17 are omitted, and the cost is saved.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (9)
1. The utility model provides a wafer is aligning device in advance, includes the bottom plate, the bottom plate top is provided with the loading board rather than parallel, be provided with rotating base on the loading board, rotating base is last to be provided with rather than synchronous pivoted vacuum adsorption platform, rotating base one side is provided with the visual detection unit who is used for the accurate alignment of wafer, its characterized in that: the jacking and centering mechanism can jack up or put down the wafer on the vacuum adsorption platform and can push the wafer to horizontally move relative to the vacuum adsorption platform until the circle center of the wafer is coincided with the center line of the vacuum adsorption platform.
2. The wafer alignment device of claim 1, wherein: jacking centering mechanism includes jacking device and centering device, centering device sets up left centering baffle and right centering baffle in the vacuum adsorption platform both sides including the symmetry, left side centering baffle and right centering baffle are relative or move in opposite directions under the centering driving piece effect, left side centering baffle and right centering baffle promote when being close to each other the relative vacuum adsorption platform's of wafer central line centering.
3. The wafer alignment device of claim 2, wherein: the left centering baffle is provided with a groove of an arc structure downwards from the upper end surface of the left centering baffle, the radian of the groove is consistent with that of the wafer, the side wall of the wafer can be abutted against the side wall of the groove, the lower end surface of the wafer can be abutted against the groove bottom of the groove, and when the left centering baffle and the right centering baffle are close to each other, the wafer is centered relative to the central line of the vacuum adsorption platform under the pushing of the two grooves.
4. The wafer alignment device of claim 2, wherein: jacking device includes jacking driving piece and left jacking frame and right jacking frame that goes up and down under the jacking driving piece effect in step, the jacking driving piece is fixed on the bottom plate, left side jacking frame and right jacking frame vacuum relatively adsorb the platform symmetry and set up and fixedly connected with jacking board between the two, jacking board and the output shaft of jacking driving piece.
5. The wafer alignment device of claim 4, wherein: the upper end surfaces of the left jacking frame and the right jacking frame are provided with a plurality of contact salient points which can be abutted against the lower end surface of the wafer, and the contact salient points are made of peek materials.
6. The wafer alignment device of claim 2, wherein: the jacking device comprises a jacking driving piece and a mounting seat, the mounting seat is fixed on the bottom plate, an output shaft of the jacking driving piece is fixedly connected with the centering driving piece, and the jacking driving piece drives the centering device to lift.
7. The wafer prealignment device of claim 4 or 6, characterized in that: the centering driving piece and the jacking driving piece are located between the bearing plate and the bottom plate.
8. A wafer prealignment method is characterized in that: firstly, conveying a wafer onto a vacuum adsorption platform through a manipulator; then starting a jacking centering mechanism, jacking the wafer on the vacuum adsorption platform through a jacking device, and carrying out primary coarse centering on the wafer relative to the central line of the vacuum adsorption platform by using a groove of the centering device; then the jacking device descends, and the wafer is placed on the adsorption platform again; and finally, adsorbing the wafer by using the vacuum adsorption platform, driving the wafer to rotate by using the rotating base, calculating the circle center position of the wafer and the notch or flat position of the wafer by using the visual detection unit, and adjusting the notch or flat position to a required angle to complete secondary fine pre-centering.
9. The wafer alignment method of claim 8, wherein: before the primary coarse centering, the wafer can be subjected to primary fine pre-centering, the primary fine pre-centering is communicated with the secondary fine pre-centering method, if the centering precision of the primary fine pre-centering meets the threshold requirement, the process is ended, and otherwise, the primary coarse centering is performed again.
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| CN202111176229.7A CN113921437A (en) | 2021-10-09 | 2021-10-09 | Wafer pre-alignment device and pre-alignment method |
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| CN115632016A (en) * | 2022-10-11 | 2023-01-20 | 深圳技术大学 | Wafer detection system and method |
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| CN114474440A (en) * | 2022-03-16 | 2022-05-13 | 江苏京创先进电子科技有限公司 | Method for controlling adjustment precision of fine adjustment device |
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