CN219696438U - Rotating assembly and wafer notch detection device - Google Patents
Rotating assembly and wafer notch detection device Download PDFInfo
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- CN219696438U CN219696438U CN202320755935.5U CN202320755935U CN219696438U CN 219696438 U CN219696438 U CN 219696438U CN 202320755935 U CN202320755935 U CN 202320755935U CN 219696438 U CN219696438 U CN 219696438U
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- 238000001514 detection method Methods 0.000 title claims abstract description 35
- 238000009434 installation Methods 0.000 claims abstract description 19
- 230000007246 mechanism Effects 0.000 claims description 28
- 238000007689 inspection Methods 0.000 claims description 23
- 239000002699 waste material Substances 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 9
- 238000000605 extraction Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 116
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- 238000007599 discharging Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a rotating assembly and a wafer notch detection device, and relates to the technical field of semiconductors. The rotating assembly comprises a bearing unit and a rotating unit, wherein the top of the bearing unit is used for placing a wafer, and the rotating unit is positioned at the bottom of the bearing unit and used for driving the bearing unit to rotate; the rotary unit comprises a rotary rotor, a rotary stator and an installation part, wherein the rotary rotor and the rotary stator are both arranged in the installation part, the rotary stator is enclosed to be arranged on the rotary rotor, the rotary rotor is rotationally arranged on the inner side of the rotary stator, the rotary stator is fixedly arranged on the installation part, and the rotary rotor is fixedly arranged on the supporting unit. The rotating assembly provided by the utility model has the advantages of simple and small structure and high space utilization rate, is beneficial to saving production space, and the wafer notch detection device provided by the utility model can rapidly detect the wafer notch and stop at a required position, so that the productivity of the whole equipment is greatly improved.
Description
The present utility model claims priority to "2023, 1, 4, and 2023100073001" and "wafer gap detector and detection method" application name.
Technical Field
The present utility model relates to the field of semiconductor technologies, and in particular, to a rotating assembly and a wafer notch detection device.
Background
In electronic semiconductor production processing equipment, a wafer carrying manipulator is responsible for transferring wafers among stations, is a core moving part of a machine table, and the positioning accuracy of the wafer carrying manipulator directly determines the accuracy of the wafer placing position, and determines the yield of chip processing. In the transmission process of the wafer by using the manipulator, the notch on the wafer can interfere with an automatic wafer centering device on the manipulator, so that the manipulator can grasp the wafer to generate certain eccentricity, and the eccentric wafer can influence the normal operation of other process links when the manipulator moves the wafer to the other process links.
The prior art discloses a wafer positioning device and a thinning machine with the same, wherein the wafer positioning device comprises a wafer bearing table, and a bearing area for bearing a wafer to be positioned is formed on one surface of the wafer bearing table; the center positioning assembly is used for carrying out center positioning on the wafer to be positioned, and is connected with one side of the wafer carrying platform far away from the carrying area; the notch detection assembly is used for detecting the position of a notch on the wafer to be positioned, and at least comprises a notch detection sensor which is arranged opposite to the bearing area and has a certain distance with the bearing area; the driving shaft is connected with one surface of the wafer carrying platform far away from the carrying area and is used for driving the wafer carrying platform to rotate; and the control part is connected with the notch detection assembly and the driving shaft and is used for receiving signals of the notch detection assembly and controlling the driving shaft to rotate.
However, in the prior art, the driving shaft is used for driving the wafer carrying table to rotate, so that the whole structure of the wafer positioning device is large, the space utilization rate is low, and more production space can be occupied. It is therefore desirable to provide a solution to the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a rotating assembly and a wafer gap detection device, which have the advantages of simple structure, small size, compactness, high space utilization rate, no occupation of more production space, capability of rapidly detecting the gap of a wafer and stopping the wafer at a required position, capability of greatly improving the wafer gap detection device, capability of preventing the wafer gap from interfering an automatic compensation sensor on a process manipulator, and capability of avoiding the reduction of the wafer placing precision of the manipulator and influencing the normal operation of other process links.
In a first aspect, the present utility model provides a rotating assembly according to the following technical solution:
the wafer supporting device comprises a supporting unit and a rotating unit, wherein the top of the supporting unit is used for placing a wafer, and the rotating unit is positioned at the bottom of the supporting unit and used for driving the supporting unit to rotate;
the rotary unit comprises a rotary rotor, a rotary stator and an installation part, wherein the rotary rotor and the rotary stator are both arranged in the installation part, the rotary stator is enclosed to be arranged on the rotary rotor, the rotary rotor is rotationally arranged on the inner side of the rotary stator, the rotary stator is fixedly arranged on the installation part, and the rotary rotor is fixedly arranged on the supporting unit.
The rotating assembly provided by the utility model has the beneficial effects that: the top of the bearing unit is used for placing the wafer, and the rotating unit is positioned at the bottom of the bearing unit and drives the bearing unit to rotate, so that the whole structure is more compact and small; furthermore, during the use, the installation department is fixed on wafer production assembly line, and the bearing unit rotates and sets up on the installation department, and rotates the stator and fix inside the installation department, rotates the rotor and rotate the setting in rotating the stator, and rotate the rotor and fix on the bearing unit, and then can further reduce the volume of rotary unit for overall structure is more small and exquisite, can save production space.
Optionally, the supporting unit is provided with a communicating portion, and the rotating unit is located in the mounting portion and is provided with a joint portion, the joint portion is mutually communicated with the communicating portion, and the joint portion is used for connecting an air extracting piece to vacuum air extraction between the wafer and the supporting unit. After the wafer is placed on the supporting unit, vacuum suction can be performed between the wafer and the supporting unit, so that the wafer is pressed on the supporting unit by atmospheric pressure, and the position stability of the wafer on the supporting unit is improved.
Optionally, the waste discharging part is communicated with the mounting part, and the waste discharging part is communicated with the inside of the mounting part, and the waste discharging part is used for connecting the air extracting piece to extract and discharge particles in the mounting part. When the particulate impurity on the wafer drops to the installation department in from the intercommunication portion, can be through connecting the exhaust part and bleed the piece for the impurity of installation department inside is taken out from the exhaust part, thereby keeps the inside clean and tidy degree of installation department, avoids influencing the rotation of rotor.
In a second aspect, the present utility model further provides a wafer notch detection device using any one of the above rotating assemblies, which adopts the following technical scheme:
the wafer inspection device comprises a rotating unit, a supporting unit, a detecting unit and a control unit, wherein the detecting unit is arranged on the rotating unit and corresponds to the supporting unit, and the detecting unit is used for detecting the eccentricity degree of the notch position of a wafer and the wafer;
the control unit is in communication connection with the rotating unit and the detecting unit, and after the detecting unit detects the wafer notch, the control unit controls the rotating state of the rotating unit, and the rotating unit drives the bearing unit to rotate and enables the wafer notch to be stagnated at a preset position.
The wafer notch detection device provided by the utility model has the beneficial effects that: the wafer notch can be detected rapidly and stopped at a preset position, so that the productivity of the whole equipment is improved, wherein the preset position is a position which does not influence grabbing of a mechanical arm of a subsequent process.
Optionally, the wafer notch detection device includes two detection units, and two detection units are disposed along the rotation direction of the supporting unit. The two detection units can improve the detection efficiency and the detection accuracy of the wafer notch detection device on the wafer notch, and false alarm of a single detection unit due to environmental factors is avoided.
Optionally, the central angle formed by the rotation centers of the two detection units and the bearing unit is 0-60 degrees.
Optionally, the detecting unit includes two detecting parts, and two detecting parts correspond to be set up the top and the bottom of bearing unit, just detecting part is used for detecting the eccentric degree and the breach position of wafer.
Optionally, the detecting unit, the control unit and the rotating assembly form a notch positioning mechanism, and the wafer notch detecting device comprises a plurality of notch positioning mechanisms.
Optionally, the notch locating mechanisms are sequentially stacked.
Optionally, the control units in the notch locating mechanisms are integrated in the control mechanism.
Optionally, a wafer eccentricity compensation device may be disposed under the rotation unit, and when the eccentricity value of the wafer placed on the support unit is too high, the wafer eccentricity compensation device may compensate the eccentricity value of the wafer, so that the eccentricity value of the wafer on the support unit is in a normal range.
Drawings
FIG. 1 is a schematic cross-sectional view of a rotary component according to an embodiment of the present utility model;
FIG. 2 is a top view of the outer structure of the rotating assembly in an embodiment of the present utility model;
FIG. 3 is a front view of a wafer notch detection apparatus according to an embodiment of the present utility model;
fig. 4 is a top view of an external structure of a wafer gap detection apparatus according to an embodiment of the present utility model.
Reference numerals illustrate:
100. a mounting plate;
200. a notch positioning mechanism;
201. a supporting unit; 202. a rotating unit; 2021. rotating the rotor; 2022. rotating the stator; 2023. a mounting part; 203. a detection unit; 2031. a detection unit; 204. a control unit; 206. a support bearing; 207. a bearing clamp spring; 208. a left seal cover; 209. a right seal cover;
300. a communication section;
400. a joint part;
500. a waste discharge part;
600. a wafer temporary placement mechanism; 601. a connection unit; 602. a supporting unit; 6021. a thimble part.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.
The embodiment of the utility model provides a rotating assembly.
Referring to fig. 1, the rotating assembly includes a supporting unit 201 and a rotating unit 202, the top of the supporting unit 201 is used for placing a wafer, and the rotating unit 202 is located at the bottom of the supporting unit 201 and is in driving connection with the supporting unit 201, and is used for driving the supporting unit 201 to rotate. After the wafer to be inspected is placed at the top position of the supporting unit 201, the rotating unit 202 drives the supporting unit 201 to rotate, so that the wafer to be inspected rotates.
In some embodiments, the overall height of the rotating assembly is 30mm.
In some embodiments, the support unit 201 is a chuck that can absorb the wafer to improve the positional stability of the wafer on the support unit 201.
In some embodiments, a support bearing 206 is provided between the support unit 201 and the rotation unit 202, and the support unit 201 is rotatably provided on the rotation unit 202 through the support bearing 206.
In some embodiments, a bearing snap spring 207 is provided between the back-up bearing 206 and the rotation unit 202.
Referring to fig. 1, the rotation unit 202 includes a rotation rotor 2021, a rotation stator 2022 and a mounting portion 2023, wherein the rotation rotor 2021 and the rotation stator 2022 are both disposed inside the mounting portion 2023, the rotation stator 2022 is fixedly disposed in the mounting portion 2023 and surrounds the rotation rotor 2021, the rotation rotor 2021 is fixedly disposed on the supporting unit 201, and when the rotation assembly drives the supporting unit 201 to rotate, the rotation stator 2022 drives the rotation rotor 2021 to rotate in the mounting portion 2023, thereby driving the supporting unit 201 to rotate. Thus, the rotating assembly can directly drive the bearing unit 201 to rotate, so that the loss of power caused by the middle transmission process is avoided, and the energy utilization efficiency can be improved.
In some embodiments, referring to fig. 1, the supporting unit 201 is provided with a communication portion 300, and the rotating unit 202 is located in the mounting portion 2023 and provided with a joint portion 400, the joint portion 400 is communicated with the communication portion 300, and the joint portion 400 is used for connecting a suction member to perform vacuum suction between the wafer and the supporting unit 201. When placing the wafer on bearing unit 201, connect the piece of bleeding through joint 400 and carry out vacuum pumping, can improve the position stability of wafer on bearing unit 201 to improve the position stability of wafer in the rotation in-process, avoid the wafer to take place the skew at the rotation in-process, joint 400 is located installation department 2023 simultaneously, can avoid having a large amount of epitaxial equipment, can improve the clean and tidy degree and the compact structure of whole equipment.
In some embodiments, referring to fig. 1, the mounting portion 2023 is provided with a waste discharging portion 500 in a communicating manner, and the waste discharging portion 500 is in communication with the interior of the mounting portion 2023, where the waste discharging portion 500 is used to connect to a suction member to extract and discharge particles in the interior of the mounting portion 2023. When the particulate impurities on the wafer drop into the mounting portion 2023 from the curtain, the exhaust portion 500 is connected to the air extraction member, so that the impurities in the mounting portion 2023 can be extracted, and the rotation of the rotating rotor 2021 is prevented from being hindered by the impurities.
In some embodiments, referring to fig. 2, the outer part of the rotating unit 202 is further sleeved with a left sealing cover 208 and a right sealing cover 209, the left sealing cover 208 and the right sealing cover 209 are mutually spliced at the outer part of the rotating unit 202, and play a role in shielding and protecting the outer part of the rotating unit 202, so that the inner cavity of the rotating unit 202 can be sealed, and external impurities are prevented from entering the inner part of the rotating unit 202.
The utility model also discloses a wafer notch detection device applying the rotating assembly in any embodiment.
Referring to fig. 3, the wafer gap inspection apparatus further includes a mounting plate 100, the rotating assembly is fixedly mounted on the mounting plate 100, and when the wafer gap inspection apparatus is in actual use, the mounting plate 100 is mounted in a process line of a wafer, and the wafer is placed at the rotating assembly by a process robot.
Referring to fig. 3, the wafer inspection apparatus further includes an inspection unit 203 and a control unit 204, wherein the inspection unit 203 is disposed on the rotation unit 202, and the inspection unit 203 is disposed corresponding to the support unit 201 and is used for inspecting the wafer gap position and the eccentricity degree of the wafer; the control unit 204 is in communication connection with the rotating unit 202 and the detecting unit 203, and when the detecting unit 203 detects the wafer gap, the control unit 204 controls the rotating state of the rotating unit 202, so that the rotating unit 202 drives the bearing unit 201 to rotate and the wafer gap is stopped at a preset position, and the preset position is a position where the wafer is transported by a subsequent process manipulator.
In some embodiments, the control unit 204, the detecting unit 203 and the rotating assembly form a notch locating mechanism 200, and the wafer notch detecting device includes a plurality of notch locating mechanisms 200.
In some embodiments, a plurality of notch locating mechanisms 200 are stacked in sequence on mounting plate 100.
In some embodiments, the control units 204 in the plurality of notch-positioning mechanisms 200 are all integrated into the control mechanism, and the control mechanism is fixed to the mounting plate 100.
In some embodiments, an adjusting jackscrew is disposed between the notch locating mechanism 200 and the mounting plate 100, and the levelness of the notch locating mechanism 200 on the mounting plate 100 can be adjusted by rotating the adjusting jackscrew, so that the stability and adjustability of the horizontal position of the notch locating mechanism 200 are improved.
In some embodiments, the wafer notch detecting device includes two detecting units 203, and the two detecting units 203 are disposed along the rotation direction of the supporting unit 201, so that when the wafer rotates at the detecting unit 203, the wafer can uniformly pass through the two detecting units 203, and the detecting operation is performed by the two detecting units 203.
In some embodiments, referring to fig. 4, the central angle formed by the rotation centers of the two detecting units 203 and the supporting unit 201 is 0-60 °, when a wafer passes through the first detecting unit 203 and the first detecting unit 203 detects a wafer notch, notch information is recorded, when a wafer passes through the second detecting unit 203, if the second detecting unit 203 detects the same notch information, the notch information is transmitted to the control unit 204, so that accuracy of detecting the wafer notch can be improved, and false alarm caused by environmental factors by the single detecting unit 203 is avoided.
In some embodiments, the detecting unit 203 includes two detecting portions 2031, the two detecting portions 2031 are correspondingly disposed at the top and the bottom of the supporting unit 201, and the detecting portions 2031 are used for detecting the eccentricity degree and the notch position of the wafer, so that when the wafer is placed on the top of the supporting unit 201, the rotation plane of the wafer is located between the two detecting portions 2031, and the upper detecting portion 2031 and the lower detecting portion 2031 perform notch detection and eccentric detection on the surface of the wafer together.
In some embodiments, referring to fig. 3, a wafer temporary placement mechanism 600 is further disposed on the mounting board 100, where the wafer temporary placement mechanism 600 is used for placing a wafer to be transferred, so that the diversity of the usage functions of the wafer notch detection device in the process can be improved.
In some embodiments, a plurality of wafer racking mechanisms 600 are provided on the mounting plate 100.
In some embodiments, a plurality of wafer racking mechanisms 600 are stacked on top of the notch positioning mechanism 200 without interfering with each other.
In some embodiments, the wafer temporary placement mechanism 600 includes a connection unit 601 and a support unit 602, one end of the connection unit 601 is fixed on the mounting board 100, the support unit 602 is located at the other end of the connection unit 601, and the support unit 602 is located at a side of the connection unit 601 relatively far away from the notch positioning mechanism 200, where the support unit 602 is used for supporting a wafer to be transferred, and after the wafer is placed on the support unit 602, the center of the wafer is located in the range of the support unit 602, so as to support the wafer.
In some embodiments, the supporting unit 602 includes a plurality of thimble portions 6021, the plurality of thimble portions 6021 are all located at a top side of the connecting unit 601, and a side of the thimble portions 6021 away from the connecting unit 601 is at the same level and is used for abutting against the wafer, so that the plurality of thimble portions 6021 support the wafer together, and when the wafer is placed on the plurality of thimble portions 6021, a center of the wafer is located between the plurality of thimble portions 6021.
In some embodiments, the thimble portion 6021 is disposed on the connection unit 601 in a lifting manner.
In some embodiments, a wafer eccentricity compensation device may be disposed under the rotation unit 202, and when the eccentricity value of the wafer placed on the support unit 201 is too high, the wafer eccentricity compensation device may compensate the eccentricity value of the wafer, so that the eccentricity value of the wafer on the support unit 201 is in a normal range.
While embodiments of the present utility model have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present utility model as set forth in the following claims. Moreover, the utility model described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (10)
1. A rotating assembly comprising a holding unit and a rotating unit, wherein the top of the holding unit is used for placing a wafer, and the rotating unit is positioned at the bottom of the holding unit and used for driving the holding unit to rotate;
the rotary unit comprises a rotary rotor, a rotary stator and an installation part, wherein the rotary rotor and the rotary stator are both arranged in the installation part, the rotary stator is enclosed to be arranged on the rotary rotor, the rotary rotor is rotationally arranged on the inner side of the rotary stator, the rotary stator is fixedly arranged on the installation part, and the rotary rotor is fixedly arranged on the supporting unit.
2. The rotating assembly according to claim 1, wherein the supporting unit is provided with a communicating portion, and the rotating unit is provided with a joint portion in the mounting portion, the joint portion and the communicating portion are mutually communicated, and the joint portion is used for connecting a suction member to vacuum-suck air between the wafer and the supporting unit.
3. The rotating assembly according to claim 2, wherein the installation portion is provided with a waste discharge portion in communication, and the waste discharge portion is in communication with the installation portion, and the waste discharge portion is used for connecting an air extraction member to extract and discharge particles in the installation portion.
4. A wafer notch detection device using the rotating assembly according to any one of claims 1 to 3, further comprising a detection unit and a control unit, wherein the detection unit is arranged on the rotating unit and is arranged corresponding to the bearing unit, and the detection unit is used for detecting the eccentricity degree of the notch position of the wafer and the wafer;
the control unit is in communication connection with the rotating unit and the detecting unit, and after the detecting unit detects the wafer notch, the control unit controls the rotating state of the rotating unit, and the rotating unit drives the bearing unit to rotate and enables the wafer notch to be stagnated at a preset position.
5. The wafer gap inspection apparatus according to claim 4, wherein the wafer gap inspection apparatus comprises two inspection units, the two inspection units being disposed along a rotation direction of the supporting unit.
6. The wafer gap inspection apparatus according to claim 5, wherein a central angle formed by the rotation centers of the two inspection units and the supporting unit is 0-60 °.
7. The wafer gap inspection apparatus according to claim 4, wherein the inspection unit includes two inspection parts, the two inspection parts are disposed at the top and the bottom of the supporting unit, respectively, and the inspection parts are used for inspecting the eccentricity degree and the gap position of the wafer.
8. The wafer gap inspection apparatus of claim 7, wherein the inspection unit, the control unit and the rotating assembly form a gap positioning mechanism, and wherein the wafer gap inspection apparatus comprises a plurality of gap positioning mechanisms.
9. The wafer gap inspection apparatus according to claim 8, wherein a plurality of the gap positioning mechanisms are stacked in order.
10. The wafer gap inspection apparatus of claim 9, wherein the control units of the plurality of gap positioning mechanisms are integrated into the control mechanism.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310007300 | 2023-01-04 | ||
| CN2023100073001 | 2023-01-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219696438U true CN219696438U (en) | 2023-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320755934.0U Active CN219575609U (en) | 2023-01-04 | 2023-04-07 | Rotating assembly and wafer notch detection device |
| CN202320755935.5U Active CN219696438U (en) | 2023-01-04 | 2023-04-07 | Rotating assembly and wafer notch detection device |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320755934.0U Active CN219575609U (en) | 2023-01-04 | 2023-04-07 | Rotating assembly and wafer notch detection device |
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| Country | Link |
|---|---|
| CN (2) | CN219575609U (en) |
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2023
- 2023-04-07 CN CN202320755934.0U patent/CN219575609U/en active Active
- 2023-04-07 CN CN202320755935.5U patent/CN219696438U/en active Active
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| Publication number | Publication date |
|---|---|
| CN219575609U (en) | 2023-08-22 |
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