CN111211064A - Low-contact wafer centering and overturning system - Google Patents
Low-contact wafer centering and overturning system Download PDFInfo
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- CN111211064A CN111211064A CN201811387884.5A CN201811387884A CN111211064A CN 111211064 A CN111211064 A CN 111211064A CN 201811387884 A CN201811387884 A CN 201811387884A CN 111211064 A CN111211064 A CN 111211064A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
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Abstract
The invention belongs to the field of wafer cleaning in the semiconductor industry, in particular to a low-contact wafer centering and overturning system.A overturning actuating mechanism is arranged on a support frame, the output end of the overturning actuating mechanism is connected with a turntable, a clamping actuating mechanism is arranged on the turntable, one end of a movable clamping device is connected with the output end of the clamping actuating mechanism, one end of a fixed clamping device is arranged on the turntable, the other ends of the movable clamping device and the fixed clamping device are clamping ends, and one side of a wafer is provided with a low-contact centering mechanism for centering the wafer; the movable clamping device moves relative to the turntable through the driving of the clamping actuating mechanism, and clamps the wafer with the fixed clamping device, and the clamping actuating mechanism, the movable clamping device, the fixed clamping device and the clamped wafer are driven to rotate by the overturning actuating mechanism along with the turntable. The invention can center, clamp and turn the wafer, can realize the control of the contact area of the wafer and the calibration of the center of the wafer, and ensures that the wafer can be turned cleanly, accurately and safely.
Description
Technical Field
The invention belongs to the field of wafer cleaning in the semiconductor industry, and particularly relates to a low-contact wafer centering and overturning system.
Background
With the increase of the demand of the domestic market for high-end chip products, the production and production of high-end chips in China are also developed to a brand new height. Therefore, there is a high demand for cleaning wafers and cleanliness of wafers in the industry, and the demand is also a new subject of research by semiconductor equipment manufacturers. In the research process, the contamination of the back surface of the wafer has an important influence on the cleanliness of the surface, the contamination of the back surface of the wafer is also attracting more attention in the industry, and the need for cleaning the back surface of the wafer is increasing. Basically, a back side cleaning is performed every two steps throughout the entire process of wafer processing, and the cleaning is almost never performed every step if a higher yield is desired. Low contact semiconductor wafer flipping systems have been in line with the growth of the times.
Disclosure of Invention
In order to meet the process requirement of cleaning the back of the wafer in the prior art and ensure the stability and smoothness of the wafer overturning process by quickly adjusting an overturning system, the invention aims to provide a low-contact wafer centering and overturning system.
The purpose of the invention is realized by the following technical scheme:
the wafer turnover mechanism comprises a turnover executing mechanism and a clamping executing mechanism, wherein the turnover executing mechanism is arranged on the supporting frame, the output end of the turnover executing mechanism is connected with a turntable, the clamping executing mechanism is arranged on the turntable, one end of the movable clamping device is connected with the output end of the clamping executing mechanism, one end of the fixed clamping device is arranged on the turntable, the other ends of the movable clamping device and the fixed clamping device are clamping ends, and one side of the wafer is provided with the low-contact centering mechanism for centering the wafer; the movable clamping device moves relative to the turntable through the driving of the clamping actuating mechanism and clamps the wafer with the fixed clamping device, and the clamping actuating mechanism, the movable clamping device, the fixed clamping device and the clamped wafer are driven to rotate by the overturning actuating mechanism along with the turntable;
wherein: the low-contact centering mechanism comprises a centering lifting structure, a centering motion executing mechanism, a centering support PIN, a centering terminal contactor, a bearing table and clamping arms, the bearing table is mounted on the centering lifting structure, the centering motion executing mechanism is arranged on the bearing table, two output ends of the centering motion executing mechanism are respectively connected with the clamping arms, and a centering terminal contactor which is in contact with the wafer is mounted at a clamping end of each clamping arm; the bearing table is provided with a centering support PIN for supporting the wafer;
the movable clamping device comprises an upper low-contact supporting column, an upper tray connecting piece, an upper arm and an upper tray, one end of the upper arm is connected with the output end of the clamping executing mechanism, the other end of the upper arm is provided with the upper tray connecting piece, the upper tray is installed on the upper tray connecting piece, and the upper low-contact supporting column used for clamping a wafer is arranged on the upper tray;
one side of the upper tray connecting piece is connected with the other end of the upper arm, and a height adjusting gap is reserved between one side of the upper tray connecting piece and the other end of the upper arm; side adjusting gaps are arranged between the front end and the rear end of the upper tray and the upper tray connecting piece;
the fixed clamping device comprises a lower low-contact supporting column, a fixed tray connecting piece and a fixed arm, one end of the fixed arm is fixedly connected with the turntable, the other end of the fixed arm is provided with a fixed tray connecting body, the fixed tray is arranged on the fixed tray connecting body, and the fixed tray is provided with the lower low-contact supporting column for clamping a wafer;
the movable clamping device is provided with a movable clamping device centering guide pillar, the fixed clamping device is provided with a fixed clamping device centering guide pillar, the fixed clamping device centering guide pillar is provided with a turning unit jig guide seat, and the movable clamping device centering guide pillar is inserted into a positioning groove of the turning unit jig guide seat when in a calibration position;
a strip-shaped groove is formed in the rotary table in the radial direction, and one end of the movable clamping device penetrates through the strip-shaped groove and is connected with the output end of the clamping execution mechanism;
one end of the movable clamping device penetrates through the rotary table and is provided with a connecting plate, the rotary table is provided with a slide rail, and the connecting plate is connected with the slide rail in a sliding manner through a slide block; the output end of the clamping actuating mechanism is connected with the connecting plate;
the wafer detection system is arranged on the support frame and comprises a presence detection sensor, a horizontal detection sensor, an overturning position sensor and a clamping position sensor, and the presence detection sensor for detecting whether the wafer is present or not and the horizontal detection sensor for detecting whether the wafer is inclined or not are respectively arranged on one side of the support frame, which faces the wafer; a clamping position sensor for detecting the movement of the movable clamping device and an overturning position sensor for detecting the rotation angle of the turntable are respectively arranged on one side of the supporting frame, which is far away from the wafer;
the pneumatic particle control system is characterized in that an airflow particle control system arranged on the support frame is arranged below the fixed clamping device, the airflow particle control system comprises a particle collecting box and a control pipeline, the particle collecting box is fixedly connected onto the support frame, and the particle collecting box is externally connected with the control pipeline with negative pressure.
The invention has the advantages and positive effects that:
1. the invention can center, clamp and turn the wafer, can realize the control of the contact area of the wafer and the calibration of the center of the wafer, and ensures that the wafer can be turned cleanly, accurately and safely.
2. The invention is provided with a wafer detection system and an airflow particle control system, and can detect the state of the wafer and collect the airflow in a suspension manner.
3. According to the low-contact centering mechanism, the bearing table adopts a point contact PIN supporting mode, so that the contact area of PIN and a wafer is reduced, and the cross contamination of the wafer is avoided.
4. The movable clamping device and the fixed clamping device can ensure that the wafer is not impacted in the clamping process, and simultaneously reduce the contact area of the wafer.
5. The wafer overturning mechanism provided by the invention can realize stable overturning of the wafer, can judge whether the overturning action of the wafer is finished or not, and feeds back the overturning action to the control system for monitoring and detection.
6. All sensors in the wafer detection system are mutually related and inseparable, and the purpose of monitoring the stability of the wafer in the whole process is realized.
7. The contact part of the clamping and centering terminal and the wafer is low-contact clamping, the contact point is made of nonmetal, the number of the contact points is controlled to be at least four, and the clamping and centering terminal is stable and reliable.
8. The position adjustment of the contact part of the invention and the wafer is divided into X/Y plane adjustment and Z plane adjustment, and the adjustment is not interfered mutually and is independent.
9. The invention designs a quick special adjusting jig for clamping upper and lower contact points concentrically, and the invention is coaxial with the teaching of mechanical limit and adjusts the initial value of the height of the mechanical limit.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a second schematic perspective view of the present invention;
FIG. 3 is a schematic perspective view of the low contact centering mechanism of the present invention;
FIG. 4 is a schematic structural view of a movable clamping device and a fixed clamping device according to the present invention;
FIG. 5 is a schematic structural diagram of the wafer turning mechanism according to the present invention;
FIG. 6 is a schematic structural view of a positioning fixture of the turnover device of the present invention;
FIG. 7 is a schematic diagram of the configuration of the air flow particle control system of the present invention;
wherein: 1 is a low-contact centering mechanism, 101 is a centering lifting structure, 102 is a centering motion executing mechanism, 103 is a centering support PIN (support), 104 is a centering terminal contactor, 105 is a bearing table, and 106 is a clamping arm;
2, a movable clamping device, 201, an upper and lower contact supporting column, 202, a movable clamping device centering guide column, 203, an upper tray connecting piece, 204, an upper arm, 205, an upper tray and 206, a height adjusting gap;
3 is a fixed clamping device, 301 is a lower low contact support column, 302 is a fixed tray, 303 is a fixed tray connector, 304 is a fixed arm, 305 is a fixed clamping device centering guide column;
4, a wafer detection system, 401, 402, a horizontal detection sensor, 403, an overturning position sensor, and 404, a clamping position sensor;
5 is an airflow particle control system, 501 is a control pipeline, and 502 is a particle collecting box;
6 is a wafer;
7, a wafer turnover mechanism, 701, a clamping execution mechanism, 702, 703, a turnover mechanism angle adjustment jig, 704, a fixed adjustment plate, 705, a connecting plate, 706, a slide rail and 707, a coupler;
8 is a turning unit jig guide seat;
9 is a supporting frame, 901 is a rotating disc, 902 is a front plate, 903 is a rear plate.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 7, the invention includes a low-contact centering mechanism 1, a movable clamping device 2, a fixed clamping device 3, a wafer detection system 4, an airflow particle control system 5, a wafer turning mechanism 7 and a support frame 9, wherein the wafer turning mechanism 7 includes a turning actuator 701 and a clamping actuator 702, the turning actuator 701 is installed on the support frame 9, the output end of the turning actuator 701 is connected with a turntable 901, the clamping actuator 702 is arranged on the turntable 901, one end of the movable clamping device 2 is connected with the output end of the clamping actuator 702, one end of the fixed clamping device 3 is fixedly connected to the turntable 901, the other ends of the movable clamping device 2 and the fixed clamping device 3 are clamping ends, and one side of the wafer 6 is provided with the low-contact centering mechanism 1 for centering the wafer. The movable clamping device 2 moves relative to the turntable 901 by the driving of the clamping actuator 702, and clamps the wafer 6 with the fixed clamping device 3, and the clamping actuator 702, the movable clamping device 2, the fixed clamping device 3 and the clamped wafer 6 are driven to rotate by the overturning actuator 701 along with the turntable 901. An airflow particle control system 5 fixedly connected on the support frame 9 is arranged below the fixed clamping device 3. The supporting frame 9 is also provided with a wafer detection system 4.
As shown in fig. 1, fig. 2 and fig. 3, the low-contact centering mechanism 1 of the present embodiment is located below the fixed clamping device 3, the low-contact centering mechanism 1 includes a centering lifting structure 101, a centering motion executing mechanism 102, a centering support PIN103, a centering terminal contactor 104, a bearing platform 105 and a clamping arm 106, the centering lifting structure 101 includes a lifting power source and a lifting rod, one end of the lifting rod is connected to an output end of the lifting power source, the other end of the lifting rod is fixedly connected to the bearing platform 105, and the bearing platform 105 is driven by the lifting power source to lift. A centering actuator 102 is arranged on the bearing platform 105, and the centering actuator 102 may be an air cylinder, an electric cylinder or a hydraulic cylinder, and in this embodiment, is a bidirectional air cylinder; two output ends of the centering motion executing mechanism 102 are respectively connected with an "L" shaped clamping arm 106, one end of each clamping arm 106 is connected with one output end of the bidirectional cylinder, the other end is a clamping end, a centering terminal contactor 104 in point contact with the wafer 6 is installed on the clamping end, and the centering terminal contactor 104 can be a roller or a bearing. A plurality of centering support PINs 103 for supporting the wafer 6 are uniformly distributed on the susceptor 105 along the circumferential direction.
As shown in fig. 1, 2 and 5, the supporting frame 9 includes a front plate 902 and a rear plate 903 connected to each other, and a space is formed between the front plate 902 and the rear plate 903. The turntable 901 is arranged in the middle of the front plate 902, a strip-shaped groove is radially formed in the turntable 901, one end of the movable clamping device 2 penetrates through the strip-shaped groove, a connecting plate 705 is arranged, a sliding rail 706 is arranged on the turntable 901, and the connecting plate 705 is connected with the sliding rail 706 in a sliding manner through a sliding block; the clamping actuator 702 is fixed on the turntable 901, and the output end is connected with the connecting plate 705. The turnover actuator 701 is fixed on the back plate 903, and the output shaft is fixedly connected with the middle part of the turntable 901 through a coupling 707. In this embodiment, the flipping actuator 701 is a rotary motor, and the clamping actuator 702 is a cylinder.
As shown in fig. 1, 2 and 4, the movable clamping device 2 includes an upper-lower contact support column 201, an upper tray connector 203, an upper arm 204 and an upper tray 205, one end of the upper arm 204 is connected to the output end of the clamping actuator 702 after passing through a strip-shaped groove on the turntable 901, the other end of the upper arm 204 is provided with the upper tray connector 203, one side (upper side) of the upper tray connector 203 is connected to the other end of the upper arm 204, a height adjustment gap 206 is left between one side of the upper tray connector 203 and the other end of the upper arm 204, the upper tray 205 is installed on the other side (lower side) of the upper tray connector 203, and side adjustment gaps are provided between the front and rear ends of the upper tray 205 and the upper tray connector 203. On the side of the upper tray 205 facing the wafer 6, upper and lower contact support columns 201 for holding the wafer 6 are provided at the edge corner ends. The fixed clamping device 3 comprises a lower low-contact supporting column 301, a fixed tray 302, a fixed tray connecting piece 303 and a fixed arm 304, one end of the fixed arm 304 is fixedly connected with the turntable 901, the other end of the fixed arm is provided with a fixed tray connecting body 303, the fixed tray 302 is installed on the fixed tray connecting body 303, the fixed tray 302 faces one surface of the wafer 6, and the lower low-contact supporting column 301 used for clamping the wafer 6 is arranged at the edge corner end. The middle part of the upper tray 205 facing the wafer 6 is provided with a movable clamping device centering guide pillar 202, the middle part of the fixed tray 302 facing the wafer 6 is provided with a fixed clamping device centering guide pillar 305, the fixed clamping device centering guide pillar 305 is provided with an overturning unit jig guide seat 8, and the movable clamping device centering guide pillar 202 is inserted into a positioning groove of the overturning unit jig guide seat 8 when in a calibration position; if the center of the upper tray 205 is not concentric with the center of the fixed tray 302, the side adjustment gap between the upper tray 205 and the upper tray connector 203 needs to be adjusted until the centering guide post 202 of the movable clamping device can be inserted into the positioning groove of the jig guide seat 8 of the turnover unit. When the mechanism is operated, when the wafer 6 is held, the upper surface abuts against the upper low-contact supporting column 201, and the lower surface abuts against the lower low-contact supporting column 301.
As shown in fig. 2 and 5, the wafer detecting system 4 is mounted on the supporting frame 9, the wafer detecting system 4 includes a presence detecting sensor 401, a horizontal detecting sensor 402, a turning position sensor 403 and a clamping position sensor 404, and the supporting frame 9 is mounted with a presence detecting sensor 401 for detecting whether the wafer 6 is present between the movable clamping device 2 and the fixed clamping device 3 and a horizontal detecting sensor 402 for detecting whether the wafer 6 is inclined or not on one side (i.e. on the front plate 902) facing the wafer 6; the two level detection sensors 402 of this embodiment may be laser sensors, and the two level detection sensors 402 are respectively disposed on two sides of the supporting frame 9. A clamping position sensor 404 for detecting the movement of the movable clamping device 2 and a turning position sensor 403 for detecting the rotation angle of the turntable 901 are respectively installed on one side (namely, on the back plate 903) of the supporting frame 9 far away from the wafer 6. The two clamp position sensors 404 of this embodiment are located on one side of the slide rail 706. Each sensor of the present invention is prior art. The damper with the buffering function is arranged at the movement limiting point at one end of the movable clamping device 2 and the rotating limiting point of the turntable 901, and the damper is also the prior art.
As shown in fig. 1, fig. 2 and fig. 7, the air flow particle control system 5 includes a particle collecting box 502 and a control pipeline 501, the particle collecting box 502 is fixedly connected to the supporting frame 9 and located below the fixing and clamping device 3, and the particle collecting box 502 is externally connected to the control pipeline 501 with negative pressure. In the continuous movement process of the movable clamping device 2, the fixed clamping device 3 and the wafer overturning device 7, impurities such as dust are likely to be generated, the particle collecting box 502 is used for collecting particle pollutants, dust and the like falling off from the wafer 6, and then the pollutants in the particle collecting box 502 are intensively discharged by the external control pipeline 501 with negative pressure, so that other modules are prevented from being influenced.
As shown in fig. 6, the rotation adjustment of the wafer turnover mechanism 7 requires the use of a fixed adjustment plate 704 with a groove and a turnover mechanism angle adjustment jig 703 with a positioning groove, and the fixed adjustment plate 704 is placed in the positioning groove of the turnover mechanism angle adjustment jig 703; when adjusting, firstly, the level ruler is placed on the fixed tray 302 to ensure that the fixed tray 302 is horizontal; then, the fixed adjusting plate 704 is placed on the fixed tray 302, the output shaft of the turnover actuator 701 is made to pass through the groove on the fixed adjusting plate 704, then the angle adjusting screw on the turnover actuator 701 is screwed, and the turnover mechanism angle adjusting jig 703 is moved to make the positioning groove on the turnover mechanism angle adjusting jig 703 clamp the output shaft of the turnover actuator 701, so as to determine the initial position and the end position of the output shaft of the turnover actuator 701, and ensure that the turnover actuator 701 drives the rotary table 901 to rotate 180 ° from the initial position to the end position. When the wafer turnover mechanism 7 works, it needs to be ensured that the turntable 901 drives the movable clamping device 2 and the fixed clamping device 3 to rotate 180 degrees accurately, and the above adjustment needs to be performed.
When the movable clamping device 2 and the fixed clamping device 3 need to be re-aligned after clamping the wafer 6 for the first time or being used for multiple times, the unit jig guide seat 8 needs to be turned over for adjustment. In the adjustment, the fixing clamp 3 is first held at the lower position while the fixing arm 304 is kept still, and then the fixing tray 302 and the fixing tray connector 303 are positioned and locked by the connecting screw. Meanwhile, the fixed clamping device is used for locking the centering guide pillar 305 after positioning by using a connecting screw, and the overturning unit jig guide seat 8 is sleeved on the centering guide pillar 305 of the fixed clamping device. The movable clamping device 2 is lowered until the lower end of the centering guide pillar 202 of the movable clamping device can be sleeved into the positioning groove of the turning unit jig guide seat 8, so that the central position is adjusted. After the movable holding device 2 and the fixed holding device 3 are adjusted in the center position, the wafer 6 is placed in the lower contact support column 301 of the fixed holding device 3 to adjust the holding height, and then the movable holding device 2 is lowered until the upper contact support column 201 contacts the upper surface of the wafer 6, and then the mounting position before and after the adjustment is adjusted by the height adjustment gap 206 between the upper arm 204 and the upper tray connector 203 and by the side adjustment gap between the upper tray 205 and the upper tray connector 203. After all the positions are adjusted, the positions are fastened by screws.
The working principle of the invention is as follows:
in the process of turning the wafer 6, firstly starting the equipment and initializing, enabling each unit to reach an initial working position, sending the wafer 6 into the low-contact centering mechanism 1 by the external transmission mechanism, carrying out the center calibration action of the center of the wafer 6, the center of the movable clamping device 2 and the center of the fixed clamping device 3, then sending the wafer 6 into the movable clamping device 2 and the fixed clamping device 3 by the low-contact centering mechanism 1, judging by the wafer detection system 4, feeding back the detection result to the external control system (the external control system of the invention is the prior art), then carrying out the turning action of the wafer 6 by the external control system according to the feedback result, and taking away the wafer 6 by the external transmission mechanism to carry out the next process after the wafer 6 is turned over for 108 degrees. The method specifically comprises the following steps:
in the process of centering, firstly, the centering lifting structure 101 is lifted to enable the centering support PIN103 to bear the wafer 6, then the centering motion executing mechanism 102 drives the clamping arms 106 at the two ends to move towards the direction of the wafer 6, and the centering terminal contactor 104 is utilized to calibrate the center of the wafer 6, so that the center of the wafer 6 is the same as the centers of the movable clamping device 2 and the fixed clamping device 3, and accuracy in clamping is guaranteed. And then lowered by the centering lift mechanism 101 to transfer the wafer 6 into the low contact support columns of the movable clamp 2 or the fixed clamp 3.
After the wafer 6 falls on the low-contact support column, the presence detection sensor 401 of the wafer detection system 4 detects whether the wafer 6 has been transferred into the holding device, and the level detection sensor 402 detects whether the wafer 6 is tilted; and meanwhile, feeding the detection result back to an external control system to judge whether to alarm or execute the next action. When all the detection results are correct, the external control system controls the clamping execution mechanism 702 to act, and the movable clamping device 2 is driven by the clamping execution mechanism 702 to smoothly and smoothly approach the fixed clamping device 3; under the limiting action of the clamping executing mechanism 702, the upper low-contact supporting column 201 and the lower low-contact supporting column 301 of the movable clamping device 2 and the fixed clamping device 3 are in low contact with the wafer 6 and compress the wafer 6, and simultaneously, the clamping position sensor 404 is triggered and fed back to an external control system, the external control system controls the overturning executing mechanism 701 to work, the turntable 901 is driven to overturn, and then the wafer 6 is driven to safely overturn by 180 degrees. After the turning action is completed, the turning position sensor 403 is triggered and sends a signal to the external control system, so as to control the action of the clamping actuator 702, the clamping actuator 702 drives the movable clamping device 2 to smoothly and smoothly open, and simultaneously, the clamping position sensor 404 is triggered and fed back to the external control system to judge and execute the next action.
The invention provides a low-contact wafer centering and overturning system used in a wafer cleaning process, which ensures the cleaning degree of a safety machine in the wafer overturning process by using a wafer detection system 4 and an airflow particle control system 5, solves the problems of a tuning method for quickly adjusting the wafer overturning system in the wafer process and ensures the safety and the cleanness in the wafer overturning process.
Claims (10)
1. A low contact wafer centering, upset system which characterized in that: the wafer overturning mechanism comprises a low-contact centering mechanism (1), a movable clamping device (2), a fixed clamping device (3), a wafer overturning mechanism (7) and a support frame (9), wherein the wafer overturning mechanism (7) comprises an overturning actuating mechanism (701) and a clamping actuating mechanism (702), the overturning actuating mechanism (701) is installed on the support frame (9), the output end of the overturning actuating mechanism is connected with a turntable (901), the clamping actuating mechanism (702) is arranged on the turntable (901), one end of the movable clamping device (2) is connected with the output end of the clamping actuating mechanism (702), one end of the fixed clamping device (3) is installed on the turntable (901), the other ends of the movable clamping device (2) and the fixed clamping device (3) are clamping ends, and one side of a wafer (6) is provided with the low-contact centering mechanism (1) for centering the wafer (6); the movable clamping device (2) moves relative to the rotary table (901) through the driving of the clamping execution mechanism (702), and clamps the wafer (6) with the fixed clamping device (3), wherein the clamping execution mechanism (702), the movable clamping device (2), the fixed clamping device (3) and the clamped wafer (6) are driven to rotate by the overturning execution mechanism (701) along with the rotary table (901).
2. The low contact wafer centering, flipping system of claim 1, wherein: the low-contact centering mechanism (1) comprises a centering lifting structure (101), a centering motion executing mechanism (102), a centering support PIN (103), a centering terminal contactor (104), a bearing platform (105) and clamping arms (106), wherein the bearing platform (105) is installed on the centering lifting structure (101), the centering motion executing mechanism (102) is arranged on the bearing platform (105), two output ends of the centering motion executing mechanism (102) are respectively connected with the clamping arms (106), and a clamping end of each clamping arm (106) is provided with the centering terminal contactor (104) which is in contact with a wafer (6); and the bearing table (105) is provided with a centering support PIN (103) for supporting the wafer (6).
3. The low contact wafer centering, flipping system of claim 1, wherein: the movable clamping device (2) comprises an upper low-contact supporting column (201), an upper tray connecting piece (203), an upper arm (204) and an upper tray (205), one end of the upper arm (204) is connected with the output end of the clamping executing mechanism (702), the other end of the upper arm is provided with the upper tray connecting piece (203), the upper tray (205) is installed on the upper tray connecting piece (203), and the upper low-contact supporting column (201) used for clamping the wafer (6) is arranged on the upper tray (205).
4. The low contact wafer centering, flipping system of claim 3, wherein: one side of the upper tray connecting piece (203) is connected with the other end of the upper arm (204), and a height adjusting gap (206) is reserved between one side of the upper tray connecting piece (203) and the other end of the upper arm (204); side adjusting gaps are arranged between the front end and the rear end of the upper tray (205) and the upper tray connecting piece (203).
5. The low contact wafer centering, flipping system of claim 1, wherein: the fixed clamping device (3) comprises a lower low-contact supporting column (301), a fixed tray (302), a fixed tray connecting piece (303) and a fixed arm (304), one end of the fixed arm (304) is fixedly connected with the turntable (901), the other end of the fixed arm is provided with a fixed tray connecting body (303), the fixed tray (302) is installed on the fixed tray connecting body (303), and the lower low-contact supporting column (301) used for clamping the wafer (6) is arranged on the fixed tray (302).
6. The low contact wafer centering, flipping system of claim 1, wherein: the fixture is characterized in that a movable clamping device centering guide pillar (202) is arranged on the movable clamping device (2), a fixed clamping device centering guide pillar (305) is arranged on the fixed clamping device (3), a turning unit fixture guide seat (8) is installed on the fixed clamping device centering guide pillar (305), and the movable clamping device centering guide pillar (202) is inserted into a positioning groove of the turning unit fixture guide seat (8) when in a calibration position.
7. The low contact wafer centering, flipping system of claim 1, wherein: a strip-shaped groove is formed in the turntable (901) in the radial direction, and one end of the movable clamping device (2) penetrates through the strip-shaped groove and is connected with the output end of the clamping execution mechanism (702).
8. The low contact wafer centering, flipping system of claim 1, wherein: one end of the movable clamping device (2) penetrates through the rotary table (901) and is provided with a connecting plate (705), a sliding rail (706) is arranged on the rotary table (901), and the connecting plate (705) is connected with the sliding rail (706) in a sliding mode through a sliding block; the output end of the clamping actuator (702) is connected with a connecting plate (705).
9. The low contact wafer centering, flipping system of claim 1, wherein: the wafer detection system (4) is installed on the support frame (9), the wafer detection system (4) comprises a presence detection sensor (401), a horizontal detection sensor (402), a turning position sensor (403) and a clamping position sensor (404), and the presence detection sensor (401) for detecting whether the wafer (6) is present and the horizontal detection sensor (402) for detecting whether the wafer (6) is inclined are installed on one side, facing the wafer (6), of the support frame (9) respectively; and a clamping position sensor (404) for detecting the movement of the movable clamping device (2) and an overturning position sensor (403) for detecting the rotation angle of the turntable (901) are respectively arranged on one side of the support frame (9) far away from the wafer (6).
10. The low contact wafer centering, flipping system of claim 1, wherein: the pneumatic particle control system (5) installed on the support frame (9) is arranged below the fixed clamping device (3), the pneumatic particle control system (5) comprises a particle collection box (502) and a control pipeline (501), the particle collection box (502) is fixedly connected onto the support frame (9), and the particle collection box (502) is externally connected with the control pipeline (501) with negative pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811387884.5A CN111211064A (en) | 2018-11-21 | 2018-11-21 | Low-contact wafer centering and overturning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811387884.5A CN111211064A (en) | 2018-11-21 | 2018-11-21 | Low-contact wafer centering and overturning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111211064A true CN111211064A (en) | 2020-05-29 |
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| CN201811387884.5A Pending CN111211064A (en) | 2018-11-21 | 2018-11-21 | Low-contact wafer centering and overturning system |
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Cited By (9)
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| CN112060112A (en) * | 2020-07-21 | 2020-12-11 | 中国科学院微电子研究所 | Manipulator and robot for wafer overturning |
| CN113539877A (en) * | 2021-07-22 | 2021-10-22 | 长鑫存储技术有限公司 | Measuring device and measuring method for semiconductor structure |
| CN114236337A (en) * | 2021-12-13 | 2022-03-25 | 江苏威森美微电子有限公司 | Wafer test equipment |
| CN114388368A (en) * | 2022-01-12 | 2022-04-22 | 杭州承扬自动化科技有限公司 | Wafer wax pasting implementation method |
| CN115121550A (en) * | 2022-06-27 | 2022-09-30 | 江苏大学 | Wafer cleaning device and method thereof |
| CN116454015A (en) * | 2023-06-19 | 2023-07-18 | 北京芯士联半导体科技有限公司 | Edge clamping type wafer chuck device |
| CN117293077A (en) * | 2023-11-22 | 2023-12-26 | 北京锐洁机器人科技有限公司 | Graphite disc positioning device for loading wafer |
| CN117650095A (en) * | 2023-11-30 | 2024-03-05 | 魅杰光电科技(上海)有限公司 | Wafer overturning device |
| US11984366B2 (en) | 2021-07-22 | 2024-05-14 | Changxin Memory Technologies, Inc. | Measurement device and method for semiconductor structure |
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2018
- 2018-11-21 CN CN201811387884.5A patent/CN111211064A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112060112A (en) * | 2020-07-21 | 2020-12-11 | 中国科学院微电子研究所 | Manipulator and robot for wafer overturning |
| CN113539877A (en) * | 2021-07-22 | 2021-10-22 | 长鑫存储技术有限公司 | Measuring device and measuring method for semiconductor structure |
| WO2023000460A1 (en) * | 2021-07-22 | 2023-01-26 | 长鑫存储技术有限公司 | Semiconductor structure measuring apparatus and measuring method |
| CN113539877B (en) * | 2021-07-22 | 2023-10-17 | 长鑫存储技术有限公司 | Measuring device and measuring method for semiconductor structure |
| US11984366B2 (en) | 2021-07-22 | 2024-05-14 | Changxin Memory Technologies, Inc. | Measurement device and method for semiconductor structure |
| CN114236337A (en) * | 2021-12-13 | 2022-03-25 | 江苏威森美微电子有限公司 | Wafer test equipment |
| CN114388368A (en) * | 2022-01-12 | 2022-04-22 | 杭州承扬自动化科技有限公司 | Wafer wax pasting implementation method |
| CN115121550A (en) * | 2022-06-27 | 2022-09-30 | 江苏大学 | Wafer cleaning device and method thereof |
| CN116454015A (en) * | 2023-06-19 | 2023-07-18 | 北京芯士联半导体科技有限公司 | Edge clamping type wafer chuck device |
| CN116454015B (en) * | 2023-06-19 | 2023-08-11 | 北京芯士联半导体科技有限公司 | Edge clamping type wafer chuck device |
| CN117293077A (en) * | 2023-11-22 | 2023-12-26 | 北京锐洁机器人科技有限公司 | Graphite disc positioning device for loading wafer |
| CN117650095A (en) * | 2023-11-30 | 2024-03-05 | 魅杰光电科技(上海)有限公司 | Wafer overturning device |
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