CN112490168A - Device and method for automatically positioning and calibrating wafer center - Google Patents
Device and method for automatically positioning and calibrating wafer center Download PDFInfo
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- CN112490168A CN112490168A CN202011494210.2A CN202011494210A CN112490168A CN 112490168 A CN112490168 A CN 112490168A CN 202011494210 A CN202011494210 A CN 202011494210A CN 112490168 A CN112490168 A CN 112490168A
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- 230000007246 mechanism Effects 0.000 claims abstract description 153
- 239000013307 optical fiber Substances 0.000 claims abstract description 21
- 235000012431 wafers Nutrition 0.000 claims description 187
- 230000008569 process Effects 0.000 claims description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000009471 action Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The invention relates to a device and a method for automatically positioning and calibrating the center of a wafer, the device comprises a base, a linear sensor, an optical fiber, a sensor fixing seat, a wafer sucker device, a wafer jacking mechanism, a sucker rotating mechanism, a first linear motion mechanism and a second linear motion mechanism, wherein the sucker rotating mechanism is arranged on the first linear motion mechanism, so as to move back and forth under the driving of the wafer chuck device, the wafer chuck device is arranged on the chuck rotating mechanism and rotates under the driving of the chuck rotating mechanism, a wafer is placed on the wafer chuck device, so as to support and vacuum-suck the wafer, the wafer jacking mechanism is installed on the base beside the wafer chuck device, the wafer is jacked up from the wafer sucker device during error calibration, the linear sensor and the optical fiber are installed on the sensor fixing seat, and the sensor fixing seat is located beside the wafer and installed on the second linear motion mechanism to move back and forth under the driving of the sensor fixing seat. The device and the method are beneficial to quickly and accurately positioning and calibrating the center of the wafer.
Description
Technical Field
The invention belongs to the technical field of wafer production, and particularly relates to a device and a method for automatically positioning and calibrating a wafer center.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and the shape is circular, and the current domestic wafer production line mainly takes 8 inches and 12 inches. At present, a plurality of wafer manufacturers have higher and higher requirements on the automation degree of equipment, very high requirements are provided for the feeding speed and the position precision of wafers during feeding, the inclination correction and positioning work of the wafers is still finished by amplifying and then manually adjusting a motor, and the manual alignment work has many defects, such as complex operation, low precision and easy error and the like.
In the prior art, most of the conventional mechanical positioning methods are adopted, and when the workpiece positioning scheme is analyzed, the concept of positioning supporting points, namely a six-point rule, is generally utilized. When a workpiece is actually positioned in the fixture, the theoretical 'point' is not adopted to be contacted with a positioning reference surface of the workpiece, but the positioning support 'point' is converted into a specific positioning element, namely positioning is realized through various types of positioning elements, namely different positioning forms such as a plane, an outer cylindrical surface, a round hole, a molded surface, a combined surface and the like are selected according to the specific structural characteristics and the process machining precision requirement of the workpiece. The traditional mechanical positioning mode has the advantages of low positioning precision, low efficiency and low speed, and damages to the wafer in the clamping and calibrating process, so that the wafer is very lagged behind. In the prior art, a wafer visual detection positioning system based on machine visual positioning is also arranged, so that the positioning and alignment work of the wafer before the wafer is cut is realized, the scheme designs the wafer online positioning and alignment visual detection system integrating image acquisition, data processing, mechanical movement and information display, the scheme greatly improves the running speed and the positioning accuracy, but the requirement on the working environment is higher, a camera must run in a stable working environment, the running speed and the positioning accuracy are not enough, the cost of equipment is greatly improved, the algorithm is complex, and the practical application is difficult.
Disclosure of Invention
The invention aims to provide a device and a method for automatically positioning and calibrating a wafer center, which are beneficial to quickly and accurately positioning and calibrating the wafer center.
In order to achieve the purpose, the invention adopts the technical scheme that: a device for automatically positioning and calibrating the center of a wafer comprises a base, a linear sensor, an optical fiber, a sensor fixing seat, a wafer sucker device, a wafer jacking mechanism, a sucker rotating mechanism, a first linear moving mechanism and a second linear moving mechanism, wherein the first linear moving mechanism is arranged in the base, the sucker rotating mechanism is arranged on the first linear moving mechanism and is driven by the first linear moving mechanism to move back and forth, the wafer sucker device is arranged on the sucker rotating mechanism and is driven by the sucker rotating mechanism to rotate, the wafer is placed on the wafer sucker device to support and vacuum-suck the wafer, the wafer jacking mechanism is arranged on the base beside the wafer sucker device to jack the wafer from the wafer sucker device when in calibration error, the linear sensor and the optical fiber are arranged on the sensor fixing seat, and the second linear moving mechanism is arranged in the base, the sensor fixing seat is located beside the wafer and is arranged on the second linear motion mechanism so as to move back and forth under the driving of the second linear motion mechanism.
Furthermore, the sensor fixing seat is of an Contraband-shaped structure with a lateral notch for the wafer to extend into, the linear sensor adopts a laser sensor and mainly comprises a light projector and a light receiver, the light projector is arranged at the upper part of the sensor fixing seat, and the light receiver is correspondingly arranged at the lower part of the sensor fixing seat, so that the center deviation of the wafer is calculated through the change of the output quantity of the linear sensor in the wafer rotating process; the optical fiber is arranged at the upper part of the sensor fixing seat, and the light beam of the optical fiber downwards and vertically irradiates on the wafer so as to find the position of the notch of the wafer in the rotation process of the wafer.
Furthermore, the first linear motion mechanism is a first electric cylinder mechanism driven by a first motor, and the sucker rotating mechanism is arranged on a sliding seat of the first electric cylinder mechanism and driven by the first electric cylinder mechanism to move back and forth so as to adjust the positions of the sucker rotating mechanism and the center of the wafer sucker device; the second linear motion mechanism is a second electric cylinder mechanism driven by a second motor, and the sensor fixing seat is arranged on a sliding seat of the second electric cylinder mechanism and driven by the second electric cylinder mechanism to move back and forth, so that the distance between the sensor fixing seat and the wafer sucker device is adjusted, and the sensor fixing seat is adapted to wafers of different sizes.
Furthermore, photoelectric sensors are respectively arranged on the first linear motion mechanism and the second linear motion mechanism to detect the stroke of the upper sliding seat of the first linear motion mechanism and the second linear motion mechanism, so that the sliding seat is prevented from moving beyond the stroke to cause collision.
Furthermore, the sucking disc rotating mechanism mainly comprises a third motor and a rotating seat driven by the third motor to rotate, and the wafer sucking disc device is arranged on the rotating seat.
Furthermore, the wafer jacking mechanism mainly comprises a fourth motor, a cam mechanism and a lifting ejector rod, wherein the fourth motor drives the cam mechanism to rotate, and the lower part of the lifting ejector rod which can only vertically move under the guiding action is contacted with the cam mechanism so as to move up and down under the driving action of the lifting ejector rod.
Further, the wafer chuck device generates vacuum through a vacuum pump, and firmly sucks the wafer.
The wafer chuck device is characterized by further comprising a control device, the control device is arranged in the base, the input end of the control device is respectively connected with the linear sensor and the optical fiber, and the output end of the control device is respectively connected with the wafer chuck device, the wafer jacking mechanism, the chuck rotating mechanism, the first linear motion mechanism and the driving unit of the second linear motion mechanism, so that all parts of the control device work.
The invention also provides a method for automatically positioning and calibrating the center of the wafer by adopting the device, which comprises the following steps:
placing the wafer on a wafer sucker device, controlling the wafer sucker device to work, and sucking the wafer in vacuum;
controlling the sucking disc rotating mechanism to work, driving the wafer sucking disc device and a wafer on the wafer sucking disc device to rotate for a circle, outputting acquired data to a control device by a linear sensor on a sensor fixing seat, and processing the acquired data by the control device to obtain wafer center deviation data;
finding the center position of the wafer according to the wafer center deviation data, then controlling the sucker rotating mechanism to work, and rotating the wafer center to a position where the connecting line of the wafer center and the center of the wafer sucker device is superposed with the front-back moving direction of the wafer sucker device;
controlling the wafer sucker device to close vacuum, then controlling the wafer jacking mechanism to ascend to jack the wafer to separate the wafer from the wafer sucker device, then controlling the first linear motion mechanism to work to drive the sucker rotating mechanism and the wafer sucker device thereon to move to the center of the wafer, and then controlling the wafer jacking mechanism to descend to enable the wafer to descend to the wafer sucker device;
controlling the wafer sucker device to work, sucking the wafer in vacuum, and then controlling the first linear motion mechanism to move reversely to drive the sucker rotating mechanism and the wafer sucker device thereon to move to the original position, so that the error correction of the wafer center is completed;
the wafer can be rotated to any angle by controlling the operation of the sucker rotating mechanism to drive the wafer sucker device and the wafer thereon to rotate, and finding the wafer gap through the optical fiber on the sensor fixing seat, so that the positioning and the correction of the wafer center are completed.
Compared with the prior art, the invention has the following beneficial effects: the device and the method overcome the problems of low positioning precision, low speed, poor stability and possible damage to the wafer in the prior art, not only greatly improve the positioning precision of the wafer center, but also have high automation degree, stable and reliable work, low realization cost, high positioning and correcting speed and no damage to the wafer, and can be suitable for wafers of different sizes. The device is suitable for any equipment for processing wafers, and can complete the positioning and correction of the wafer center before and at the processing completion stage, thereby meeting the requirements of wafer production.
Drawings
FIG. 1 is a side view of the device structure of an embodiment of the present invention.
FIG. 2 is a top view of a device configuration according to an embodiment of the present invention.
In the figure: the method comprises the following steps of 1-base, 2-linear sensor, 3-optical fiber, 4-sensor fixing seat, 5-wafer chuck device, 6-wafer jacking mechanism, 7-chuck rotating mechanism, 8-first linear motion mechanism, 9-second linear motion mechanism and 10-wafer.
Detailed Description
The invention is described in further detail below with reference to the figures and the embodiments.
As shown in fig. 1-2, the present invention provides a device for automatically positioning and calibrating the center of a wafer, which comprises a base 1, a linear sensor 2, an optical fiber 3, a sensor holder 4, a wafer chuck device 5, a wafer jacking mechanism 6, a chuck rotating mechanism 7, a first linear motion mechanism 8 and a second linear motion mechanism 9, wherein the first linear motion mechanism 8 is installed in the base 1, the chuck rotating mechanism 7 is installed on the first linear motion mechanism 8 to move back and forth under the driving of the first linear motion mechanism, the wafer chuck device 5 is installed on the chuck rotating mechanism 7 to rotate under the driving of the chuck rotating mechanism, a wafer 10 is placed on the wafer chuck device 5 to support and vacuum-suck the wafer 10, the wafer jacking mechanism 6 is installed on the base 1 beside the wafer chuck device 5 to jack the wafer 10 from the wafer chuck device 5 during calibration error, the linear sensor 2 and the optical fiber 3 are arranged on the sensor fixing seat 4, the second linear motion mechanism 9 is arranged in the base 1, and the sensor fixing seat 4 is located beside the wafer and arranged on the second linear motion mechanism 9 so as to move back and forth under the driving of the second linear motion mechanism.
In this embodiment, the sensor holder 4 has an Contraband-shaped structure with a lateral notch for the wafer to extend into, and the linear sensor 2 is a laser sensor, which mainly includes a light projector and a light receiver, wherein the light projector is installed on the upper portion of the sensor holder, and the light receiver is correspondingly installed on the lower portion of the sensor holder. During the rotation of the wafer, the voltage or current analog quantity output by the linear laser sensor changes, and the control device can calculate the center error of the wafer according to the change. The optical fiber 3 is installed on the upper part of the sensor fixing seat 4, and the light beam of the optical fiber downwards and vertically irradiates on the wafer so as to find the position of the wafer gap in the wafer rotating process.
In this embodiment, the first linear motion mechanism 8 is a first electric cylinder mechanism driven by a first motor, and the chuck rotation mechanism is mounted on a slide seat of the first electric cylinder mechanism to move back and forth under the driving of the first electric cylinder mechanism, so as to adjust the positions of the chuck rotation mechanism and the center of the wafer chuck device. The second linear motion mechanism 9 is a second electric cylinder mechanism driven by a second motor, and the sensor fixing seat is mounted on a sliding seat of the second electric cylinder mechanism to move back and forth under the driving of the second electric cylinder mechanism, so that the distance between the sensor fixing seat and the wafer chuck device is adjusted, and the sensor fixing seat is adapted to wafers of different sizes. Photoelectric sensors are respectively arranged on the first linear motion mechanism 8 and the second linear motion mechanism 9 to detect the stroke of the upper sliding seat of the first linear motion mechanism and the second linear motion mechanism, so that the sliding seat is prevented from moving beyond the stroke to cause collision.
The sucking disc rotating mechanism 7 mainly comprises a third motor and a rotating seat driven to rotate by the third motor, and the wafer sucking disc device is arranged on the rotating seat.
The wafer jacking mechanism 6 mainly comprises a fourth motor, a cam mechanism and a lifting ejector rod, wherein the fourth motor drives the cam mechanism to rotate, and the lower part of the lifting ejector rod which can only vertically move under the guiding action is in contact with the cam mechanism so as to move up and down under the driving action of the lifting ejector rod. The cam mechanism can greatly reduce the noise when the wafer jacking mechanism jacks up and lowers the wafer, and the structure is more stable and reliable and saves space.
The wafer chuck device 5 generates vacuum through a vacuum pump to firmly suck the wafer.
In order to realize the automatic control of the device, the device is also provided with a control device, the control device is arranged in the base, the input end of the control device is respectively connected with the linear sensor and the optical fiber, and the output end of the control device is respectively connected with the wafer sucker device, the wafer jacking mechanism, the sucker rotating mechanism, the first linear motion mechanism and the driving unit of the second linear motion mechanism, so that all parts of the control device work.
Based on the device, the invention also correspondingly provides a method for automatically positioning and calibrating the center of the wafer, which comprises the following steps:
1) and placing the wafer on the wafer sucking disc device, controlling the wafer sucking disc device to work, and sucking the wafer in vacuum.
2) And controlling the sucker rotating mechanism to work, driving the wafer sucker device and the wafer on the wafer sucker device to rotate for a circle, outputting the acquired data to the control device by the linear sensor on the sensor fixing seat, and processing the acquired data by the control device to obtain the wafer center deviation data. The linear sensor obtains a voltage or current analog quantity, and the control device can calculate and obtain wafer center deviation data according to the change of the analog quantity data after the wafer rotates for one circle.
3) And finding the center position of the wafer according to the wafer center deviation data, and then controlling the sucker rotating mechanism to work to rotate the wafer center to a position where the connecting line of the wafer center and the center of the wafer sucker device coincides with the front-back moving direction of the wafer sucker device.
4) Controlling the wafer sucker device to close vacuum, then controlling the wafer jacking mechanism to ascend to jack the wafer to separate the wafer from the wafer sucker device, then controlling the first linear motion mechanism to work to drive the sucker rotating mechanism and the wafer sucker device thereon to move to the center of the wafer, and then controlling the wafer jacking mechanism to descend to enable the wafer to descend to the wafer sucker device.
5) And controlling the wafer sucker device to work, sucking the wafer in vacuum, and then controlling the first linear motion mechanism to move in the reverse direction to drive the sucker rotating mechanism and the wafer sucker device on the sucker rotating mechanism to move to the original position, so that the error correction of the center of the wafer is finished.
6) The wafer can be rotated to any angle by controlling the operation of the sucker rotating mechanism to drive the wafer sucker device and the wafer thereon to rotate, and finding the wafer gap through the optical fiber on the sensor fixing seat, so that the positioning and the correction of the wafer center are completed.
The above are preferred embodiments of the present invention, and all changes made according to the technical scheme of the present invention that produce functional effects do not exceed the scope of the technical scheme of the present invention belong to the protection scope of the present invention.
Claims (9)
1. A device for automatically positioning and calibrating the center of a wafer is characterized by comprising a base, a linear sensor, an optical fiber, a sensor fixing seat, a wafer sucker device, a wafer jacking mechanism, a sucker rotating mechanism, a first linear moving mechanism and a second linear moving mechanism, wherein the first linear moving mechanism is arranged in the base, the sucker rotating mechanism is arranged on the first linear moving mechanism and moves back and forth under the driving of the sucker rotating mechanism, the wafer sucker device is arranged on the sucker rotating mechanism and rotates under the driving of the sucker rotating mechanism, the wafer is placed on the wafer sucker device to support and suck the wafer in vacuum, the wafer jacking mechanism is arranged on the base beside the wafer sucker device to jack the wafer from the wafer sucker device when in calibration error, the linear sensor and the optical fiber are arranged on the sensor fixing seat, the second linear moving mechanism is arranged in the base, the sensor fixing seat is located beside the wafer and is arranged on the second linear motion mechanism so as to move back and forth under the driving of the second linear motion mechanism.
2. The apparatus as claimed in claim 1, wherein the sensor holder has an Contraband-shaped structure with a lateral notch for inserting the wafer therebetween, the linear sensor is a laser sensor, which mainly comprises a light projector and a light receiver, the light projector is installed on the upper portion of the sensor holder, the light receiver is correspondingly installed on the lower portion of the sensor holder, so as to calculate the wafer center deviation through the variation of the output of the linear sensor during the wafer rotation process; the optical fiber is arranged at the upper part of the sensor fixing seat, and the light beam of the optical fiber downwards and vertically irradiates on the wafer so as to find the position of the notch of the wafer in the rotation process of the wafer.
3. The apparatus as claimed in claim 1, wherein the first linear motion mechanism is a first cylinder mechanism driven by a first motor, and the chuck rotation mechanism is mounted on a slide of the first cylinder mechanism to move back and forth under the driving of the first cylinder mechanism, so as to adjust the positions of the chuck rotation mechanism and the center of the wafer chuck device; the second linear motion mechanism is a second electric cylinder mechanism driven by a second motor, and the sensor fixing seat is arranged on a sliding seat of the second electric cylinder mechanism and driven by the second electric cylinder mechanism to move back and forth, so that the distance between the sensor fixing seat and the wafer sucker device is adjusted, and the sensor fixing seat is adapted to wafers of different sizes.
4. An apparatus as claimed in claim 3, wherein the first linear motion mechanism and the second linear motion mechanism are respectively provided with a photo sensor for detecting the stroke of the upper slide to prevent the slide from moving beyond the stroke and colliding.
5. The apparatus as claimed in claim 1, wherein the chuck rotation mechanism is mainly composed of a third motor and a rotary base driven to rotate by the third motor, and the wafer chuck device is mounted on the rotary base.
6. The apparatus as claimed in claim 1, wherein the wafer lift mechanism comprises a fourth motor, a cam mechanism and a lift pin, the fourth motor drives the cam mechanism to rotate, and the lower part of the lift pin, which is guided to move only vertically, contacts the cam mechanism to move up and down.
7. The apparatus of claim 1, wherein the wafer chuck device is used to generate vacuum to firmly hold the wafer.
8. The apparatus as claimed in claim 1, further comprising a control device, wherein the control device is disposed in the base, the input end of the control device is connected to the linear sensor and the optical fiber, and the output end of the control device is connected to the driving units of the wafer chuck device, the wafer jacking mechanism, the chuck rotating mechanism, the first linear motion mechanism and the second linear motion mechanism, respectively, so as to control the operation of each part of the apparatus.
9. A method for automatically locating and calibrating the center of a wafer using the apparatus of any of claims 1-8, comprising the steps of:
placing the wafer on a wafer sucker device, controlling the wafer sucker device to work, and sucking the wafer in vacuum;
controlling the sucking disc rotating mechanism to work, driving the wafer sucking disc device and a wafer on the wafer sucking disc device to rotate for a circle, outputting acquired data to a control device by a linear sensor on a sensor fixing seat, and processing the acquired data by the control device to obtain wafer center deviation data;
finding the center position of the wafer according to the wafer center deviation data, then controlling the sucker rotating mechanism to work, and rotating the wafer center to a position where the connecting line of the wafer center and the center of the wafer sucker device is superposed with the front-back moving direction of the wafer sucker device;
controlling the wafer sucker device to close vacuum, then controlling the wafer jacking mechanism to ascend to jack the wafer to separate the wafer from the wafer sucker device, then controlling the first linear motion mechanism to work to drive the sucker rotating mechanism and the wafer sucker device thereon to move to the center of the wafer, and then controlling the wafer jacking mechanism to descend to enable the wafer to descend to the wafer sucker device;
controlling the wafer sucker device to work, sucking the wafer in vacuum, and then controlling the first linear motion mechanism to move reversely to drive the sucker rotating mechanism and the wafer sucker device thereon to move to the original position, so that the error correction of the wafer center is completed;
the wafer can be rotated to any angle by controlling the operation of the sucker rotating mechanism to drive the wafer sucker device and the wafer thereon to rotate, and finding the wafer gap through the optical fiber on the sensor fixing seat, so that the positioning and the correction of the wafer center are completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011494210.2A CN112490168A (en) | 2020-12-16 | 2020-12-16 | Device and method for automatically positioning and calibrating wafer center |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011494210.2A CN112490168A (en) | 2020-12-16 | 2020-12-16 | Device and method for automatically positioning and calibrating wafer center |
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| CN112490168A true CN112490168A (en) | 2021-03-12 |
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| CN202011494210.2A Pending CN112490168A (en) | 2020-12-16 | 2020-12-16 | Device and method for automatically positioning and calibrating wafer center |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114121733A (en) * | 2021-11-26 | 2022-03-01 | 上海华虹宏力半导体制造有限公司 | Method for monitoring position of wafer fixing unit and wafer cleaning machine platform |
| CN116798927A (en) * | 2023-08-28 | 2023-09-22 | 宇弘研科技(苏州)有限公司 | Automatic correction type wafer material box feeding carrier |
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