CN212848347U

CN212848347U - Supporting structure on rotatory material loading of wafer

Info

Publication number: CN212848347U
Application number: CN202021701259.6U
Authority: CN
Inventors: 时文飞; 余健; 田耕
Original assignee: Zhengzhou Rtit Research Institute
Current assignee: Zhengzhou Rtit Research Institute
Priority date: 2020-08-16
Filing date: 2020-08-16
Publication date: 2021-03-30
Anticipated expiration: 2030-08-16

Abstract

The utility model provides a wafer rotary feeding upper supporting structure, which comprises a rotating frame, a transferring connector, a transferring sucker, a sucker rack mounting plate, a connecting rod and a sucker rack, wherein the transferring connector is arranged on the frame and connected with the transferring sucker; the central position of the sucker frame is provided with an avoiding round hole, an adjusting cam is arranged in the avoiding round hole, a cam shaft of the adjusting cam is rotatably arranged on a sucker frame mounting plate, at least two sucker adjusting rods which can only move along the radial direction of the sucker frame are arranged on the sucker frame along the circumferential direction, a spring reset mechanism is arranged between the sucker adjusting rods and the sucker frame to enable one end of each sucker adjusting rod to be in contact with the outer surface of the adjusting cam all the time, and the tail ends of the sucker adjusting rods are provided with negative pressure suction nozzles. The cam is rotated, and the plurality of sucker adjusting rods simultaneously move the same distance along the radial direction.

Description

Supporting structure on rotatory material loading of wafer

Technical Field

The utility model belongs to silicon wafer laser beam machining field, concretely relates to supporting structure on rotatory material loading of wafer.

Background

When silicon wafers are subjected to laser processing, a wafer tray needs to be taken out of a wafer storage box by using a wafer clamping mechanism and is linearly moved to a transfer position. The wafer tray is adsorbed by the transfer sucker and rotates to be moved to the position above the processing transfer position, and the wafer vacuum sucker of the cutting platform is also moved to the processing transfer position and receives the wafer tray. The transfer sucker comprises a sucker frame body, a downward sucker rod is circumferentially arranged on the sucker frame body, and a negative pressure sucker is arranged on the sucker rod; the suction head rod is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe. Different specifications are different sizes of silicon wafers; in addition, in the actual installation process, certain errors exist, and the position of the sucker rod on the sucker frame body needs to be adjusted in the actual process according to needs. The existing adjusting mechanism needs to adjust the position of each sucker rod respectively. When the wafer rotates for feeding, the transfer sucker needs to operate stably and needs a stable supporting structure.

SUMMERY OF THE UTILITY MODEL

The utility model provides a supporting structure on rotatory material loading of wafer.

The purpose of the utility model is realized with the following mode: a wafer rotary feeding upper supporting structure comprises a transfer connecting body which is rotatably arranged on a rack, wherein the transfer connecting body is downwards connected with a transfer sucker which can be lifted, the transfer sucker comprises a sucker frame, a sucker frame mounting plate which is fixed with the transfer connecting body is arranged above the sucker frame, and a connecting rod is arranged between the sucker frame mounting plate and the sucker frame to fix the sucker frame mounting plate and the sucker frame; the sucking disc frame central point puts and sets up and dodges the round hole, dodges and sets up in the round hole and can pivoted regulation cam, and the camshaft of adjusting the cam rotates and sets up on sucking disc frame mounting panel, sets up two at least sucking disc regulation poles that can only radially move along sucking disc frame along circumference on the sucking disc frame, sets up spring return mechanism between sucking disc regulation pole and the sucking disc frame and makes sucking disc regulation pole one end and regulation cam surface contact all the time, and the sucking disc regulation pole end sets up the negative pressure suction nozzle who communicates with the negative pressure air supply.

The outer surface of the adjusting cam is provided with rotating curved surfaces, the number of the rotating curved surfaces corresponds to the number of the sucker adjusting rods, the adjusting cam rotates for a preset angle, and each sucker adjusting rod moves for the same distance along the radial direction.

The sucker frame is provided with at least two adjusting rod moving grooves along the circumferential direction, and the sucker adjusting rods are arranged in the adjusting rod moving grooves in a sliding manner; the sucker adjusting rod extends out of the adjusting rod resetting part towards the side surface; the spring reset mechanism comprises a spring fixed on the sucker frame, and the other end of the spring is connected with the reset part of the adjusting rod to enable one end of the sucker adjusting rod to be in contact with the adjusting cam.

The two ends of the transferring connector are respectively provided with a transferring lifting cylinder, the outer side surface of the transferring lifting cylinder is provided with a transferring lifting cylinder guide rail, the piston head of the transferring lifting cylinder fixes a transferring connecting plate, and the transferring connecting plate fixes a transferring lifting cylinder sliding block; the transfer lifting cylinder sliding block and the transfer lifting cylinder guide rail form a guide rail pair; the outer side of the transfer lifting cylinder sliding block extends out of a cantilever, and a sucker frame mounting plate of a transfer sucker is fixed on the cantilever.

The utility model has the advantages that: the cam is rotated, the plurality of sucker adjusting rods simultaneously move the same distance along the radial direction, and therefore the distance between each sucker rod and the center of the sucker frame body is adjusted simultaneously.

Drawings

Fig. 1 is a schematic front view of a wafer processing apparatus (with portions of extraneous components hidden).

Fig. 2 is a top cross-sectional view of fig. 1 (hiding portions of the frame and portions of the non-moving parts).

Fig. 3 is a top cross-sectional view (hiding portions of the frame and portions of the non-moving parts) of fig. 1 at another elevational plane.

Fig. 4 is an enlarged view of a portion of the holder.

Fig. 5 is an enlarged view of the rotating transfer mechanism.

Fig. 6 is an enlarged view of a portion of the transfer chuck.

Fig. 7 is a schematic structural view of another embodiment of the transfer chuck.

Fig. 8 is a view from B-B of fig. 7.

Wherein, 1 is a frame, 2 is a wafer storage box, 3 is a wafer clamping mechanism, 4 is a wafer tray, 5 is a material supporting frame, 51 is a material supporting guide rail, 52 is a proximity switch, 53 is a material supporting bottom plate, 54 is a synchronous belt, 55 is a synchronous belt connecting plate, 56 is a material supporting bottom plate displacement sensor, 57 is a material supporting guide rail connecting plate, 58 is a material supporting bottom plate displacement detecting strip, 59 is a material supporting bottom plate guide rail, and 6 is a rotating and transferring mechanism; 60 is a transferring connector, 61 is a transferring lifting cylinder, 62 is a transferring cylinder connecting plate, and 63 is a cantilever; 64 transfer suction cups; 640 is a cross frame body, 641 is a frame body connecting plate, 642 is a suction head rod, 643 is a negative pressure suction nozzle, 645 is an adjusting groove, 644 is a suction disc frame, 646 suction disc adjusting rods, 647 suction disc frame mounting plates, 648 connecting rods, 649 avoiding round holes, 653 adjusting rod moving grooves, 654 adjusting rod resetting parts, 655 springs, 656 is an adjusting cam, 657 is a cam shaft and 65 transfers the lifting cylinder slide block; 66 transfer lifting cylinder guide rails and 67 are transfer displacement detection strips; 68 a transport displacement sensor; 69 is a transfer limit post, 7 is a cutting platform, 75 is a wafer vacuum chuck.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, either as a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate, unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Relational terms such as first, second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

As shown in fig. 1-8, a wafer rotary feeding upper supporting structure comprises a transferring connector 60 rotatably disposed on a frame 1, wherein the transferring connector 60 is connected with a transferring suction cup 64 capable of lifting downwards. The transfer sucker has various mechanisms.

Referring to fig. 7-8, an adjustable transfer chuck 64 includes a chuck holder 644, a chuck holder mounting plate 647 disposed above the chuck holder 644, and a connecting rod 648 disposed between the chuck holder mounting plate 647 and the chuck holder 644 to fix the chuck holder mounting plate 647 and the chuck holder 644. An avoiding round hole 649 is arranged at the center of the suction cup frame 644, a rotatable adjusting cam 656 is arranged in the avoiding round hole 649, and a cam shaft 657 of the adjusting cam 656 is rotatably arranged on the suction cup frame mounting plate 647. At least two sucking disc adjusting rods 646 which can only move along the radial direction of the sucking disc frame 644 are arranged on the sucking disc frame 644 along the circumferential direction, a spring reset mechanism is arranged between the sucking disc adjusting rods 646 and the sucking disc frame 644 to enable one end of each sucking disc adjusting rod 646 to be in constant contact with the outer surface of an adjusting cam 656, and a negative pressure suction nozzle 643 connected with a negative pressure air source is arranged at the tail end of each sucking disc adjusting rod 646 downwards.

A downward suction head rod 642 is arranged at the tail end of the suction cup adjusting rod 646, and a negative pressure suction nozzle 643 is arranged on the suction head rod 642; the suction nozzle rod 643 is provided with a gas connector communicated with the negative pressure suction nozzle 643, and the gas connector is connected with a negative pressure source through a negative pressure pipe. By rotating the adjustment cam 656, the plurality of sucker adjustment rods 646 move the same distance in the radial direction simultaneously, facilitating adjustment. The end of the suction cup adjustment lever 646 that contacts the adjustment cam 656 is provided with a rotating roller that is in rolling contact with the adjustment cam 656.

The adjusting cam 656 is provided with a number of rotating curved surfaces corresponding to the number of the suction cup adjusting levers 646 on the outer surface thereof, and the adjusting cam 656 rotates by a predetermined angle, and each suction cup adjusting lever 646 moves by the same distance in a radial direction. The specific rotating curved surface can be various as long as the function can be ensured.

The suction cup frame 644 is provided with at least two adjusting rod moving grooves 653 along the circumferential direction, and the suction cup adjusting rod 646 is arranged in the adjusting rod moving grooves 653 in a sliding manner; the suction cup adjustment lever 646 extends laterally beyond the adjustment lever reset portion 654. The spring return mechanism includes a spring 655 fixed to the suction cup holder 644, and the other end of the spring 655 is connected to the adjustment lever return 654 such that one end of the suction cup adjustment lever 646 contacts the adjustment cam 656. The axis of the spring 655 is parallel to the length of the corresponding suction cup adjustment lever 646. When the adjustment lever resetting part 654 is provided near one end of the adjustment cam 656, the spring 655 fixed to the suction cup holder 644 is provided near one end of the negative pressure suction nozzle 643, and the spring 655 should be a compression spring. On the contrary, if the adjustment lever resetting part 654 is disposed at an end near the negative pressure suction nozzle 643 and the spring 655 fixed to the suction cup holder 644 is disposed at an end near the adjustment cam 656, the spring 655 should be a tension spring. At least two connecting rods 648 are arranged between the suction cup holder mounting plate 647 and the suction cup holder 644, and the connecting rods 648 avoid the position of the suction cup adjusting rod 646. The connecting rods 648 are preferably uniformly arranged on the suction cup frame 644.

Further, the method comprises the following steps: as shown in fig. 1 to 6, the transfer connector 60 is provided with transfer lifting cylinders 61 at two ends thereof, transfer lifting cylinder guide rails 66 are provided on the outer side surfaces of the transfer lifting cylinders 61, and the transfer cylinder connecting plates 62 are fixed by piston heads of the transfer lifting cylinders 61. The transfer cylinder connecting plate 62 fixes the transfer lifting cylinder slide block 65; the transfer lifting cylinder slide block 65 and the transfer lifting cylinder guide rail 66 form a guide rail pair. A cantilever 63 extends out of the outer side of the transfer lifting cylinder slide block 65, and a transfer sucker 64 is fixed on the cantilever 63 to form the rotary transfer mechanism 6. The transfer lifting cylinder 61 drives the transfer sucker 64 to lift, and the position where the piston head moves has certain deviation, so that the position of the transfer sucker 64 has certain error, and subsequent processing procedures are influenced. A transfer lifting cylinder guide rail 66 is arranged on the outer side surface of the transfer lifting cylinder 61, and a transfer sucker 64 is fixed together with a transfer lifting cylinder slide block 65 through a cantilever 63; the position of the transfer sucker in the lifting process is accurate through the guide rail pair structure. And two transfer lifting cylinders can make wafer tray 4 transport the position and transport the position with processing and exchange between, and wafer tray 4 after the processing is accomplished need not to remove from other route, can return to wafer storage box 2 on the original way, compact structure.

The transfer connector 60 is provided with a transfer displacement detection strip 67; two transfer displacement sensors 68 are disposed on the frame 1 along the rotation locus of the transfer displacement detection bar 67. When the transfer displacement detection strip 67 is moved from one transfer displacement sensor 68 to the other transfer displacement sensor 68, one of the transfer suction cups 64 moves from the transfer position to the processing transfer position, and the other transfer suction cup moves from the processing transfer position to the transfer position. The transfer displacement sensor 68 ensures that the transfer chuck 64 is accurately stopped at the transfer position and the processing transfer position. As for the middle obstacle avoidance position, the precision is not required, the operation can be realized only by rotating a certain angle from the transfer position or the machining transfer position, and the operation can be realized through a servo motor.

The transfer connector 60 is connected to the output of a transfer motor provided on the frame 1. Set up annular transportation spacing groove around the axis of transporting the motor output shaft in frame 1, set up the lower extreme in the transportation spacing groove and fixed with the transportation connector 60, the upper end passes the transportation spacing post 69 of transporting the spacing groove, and the angle of transporting the spacing groove is guaranteed to transport spacing post 69 and is rotated 180 degrees. The transfer limiting groove can be slightly larger than 180 degrees. When the transfer limiting column 69 is positioned at two ends of the transfer limiting groove, one of the two transfer suckers is positioned at the transfer position.

As with the transfer chuck 64 of fig. 7-8, the chuck table mounting plate 647 is secured to the cantilever 63. Referring to fig. 5-6, in another embodiment of the transfer chuck, the transfer chuck 64 includes a chuck frame body, at least 3 downward suction head rods 642 are circumferentially disposed on the chuck frame body, and a negative pressure suction nozzle 643 is disposed on each suction head rod 642; the suction head rod 642 is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe. How the negative pressure is achieved in the transfer cup 64 is known in the art and will not be described in detail. Specifically speaking: the sucking disc frame body comprises a cross frame body 640, a frame body connecting plate 641 is arranged at the tail end of the cross frame body 640, and the upper end of the sucking head rod 642 is fixed on the frame body connecting plate 641; the frame connecting plate 641 is provided with an adjusting groove 645, the cross frame 640 is provided with a fixing hole, and the length of the frame connecting plate 641 extending out of the cross frame 640 is adjusted by adjusting the position of the fixing hole in the length direction of the adjusting groove 645. The fixing hole may be a screw hole, a bolt is disposed in the fixing hole, and the frame body connecting plate 641 and the cross frame body 640 are fixed by pressing the upper surface of the connecting plate with a nut of the bolt. The cross frame 640 is fixed to the cantilever 63.

The frame 1 is also provided with a wafer storage box 2, a linear transfer mechanism and a material supporting frame 5. The linear transfer mechanism comprises a wafer clamping mechanism 3 and a clamping linear driving mechanism for driving the wafer clamping mechanism 3 to move linearly. The clamping linear driving mechanism is a linear transfer screw rod mechanism 36, and a clamping linear transfer slide rail 39 is arranged outside the linear transfer clamping screw rod mechanism 36.

The position is transported to straight line transport mechanism below on frame 1 and is set up and hold in the palm work or material rest 5, hold in the palm the work or material rest including holding in the palm material bottom plate 53, hold in the palm the material guide rail 51 that sets up two parallels on the material bottom plate 53, hold in the palm material guide rail 51 under guide driving mechanism's drive along holding in the palm the relative or synchronous belt transport mechanism for setting up on holding in the palm material bottom plate 53 of material bottom plate 53, hold in the palm a fixed hold in range connecting plate 55 on synchronous belt transport mechanism's the both sides hold in range 54 respectively, two hold in range connecting plates 55 are relative or move in opposite directions, every hold in. The synchronous belt conveying mechanism comprises a synchronous belt motor arranged on the material supporting bottom plate 53, a chain wheel is arranged on an output shaft of the synchronous belt motor, a rotating chain wheel is also arranged on one side, far away from the synchronous belt motor, of the material supporting bottom plate 53, and a synchronous belt 54 is arranged on the chain wheel.

Two parallel material supporting bottom plate guide rails 59 are arranged on the material supporting bottom plate 53, and the length direction of the material supporting bottom plate guide rails 59 is vertical to the length direction of the material supporting guide rails 51; the bottom of the material supporting guide rail 51 is connected with a material supporting guide rail connecting plate 57, a connecting plate sliding block is arranged on the material supporting guide rail connecting plate 57, and the connecting plate sliding block and the material supporting bottom plate guide rail 59 form a guide rail pair; and the material supporting guide rail connecting plate 57 is fixed with the synchronous belt connecting plate 55.

Furthermore, at least one material supporting bottom plate displacement sensor 56 is arranged on the material supporting bottom plate 53, and a connecting plate displacement detection strip 58 corresponding to the material supporting bottom plate displacement sensor 56 is arranged on the synchronous belt connecting plate 55. When the connecting plate displacement detecting strip 58 moves to the position of each material supporting base plate displacement sensor 56, the distance between the two corresponding material supporting guide rails 51 corresponds to the size of one type of wafer tray 4. Web displacement sensing strips 58 may also be provided on the carrier rail web 57.

The material supporting guide rail 51 is provided with a proximity switch 52. A groove is arranged on the material supporting guide rail 51, the proximity switch 52 is arranged in the groove, and the upper surface of the proximity switch 52 is not higher than the upper surface of the material supporting guide rail 51. Thus, when the wafer tray 4 held by the wafer holding mechanism 3 reaches the position of the proximity switch 52, the proximity switch is turned on so that the wafer holding mechanism 3 does not move forward any more, and the wafer tray 4 is released to be placed on the two material holding rails 51. The wafer chuck 3 is then removed.

One end of the material supporting guide rail 51 can extend to a position close to the wafer storage box 2, and the length direction of the material supporting guide rail 51 is parallel to the linear moving direction of the wafer clamping mechanism 3 along the clamping linear transfer slide rail 39. Of course, the carrier rail 51 may be provided in another direction as long as it can support the wafer tray 4, but a mechanism capable of vertical adjustment is required in order to avoid interference with the wafer chucking mechanism 3.

In the specific implementation: when the unprocessed wafer tray 4 needs to be clamped, the wafer storage box 2 arranged on the machine frame moves up and down to enable the wafer tray 4 needing to be processed to reach a clamping position. The controller or control system sends a signal to the wafer clamping mechanism 3 to clamp the wafer tray 4. When the wafer tray 4 held by the wafer holding mechanism 3 reaches the position of the proximity switch 52, the proximity switch 52 is turned on to prevent the wafer holding mechanism 3 from moving forward, and the unprocessed wafer tray 4 is released to be placed on the two material supporting rails 51. The wafer chuck 3 is then removed. And simultaneously the processed wafer tray on the wafer vacuum chuck 75 of the cutting platform moves to the processing transfer position. The transfer motor rotates to rotate the two transfer chucks 64 from the middle obstacle avoidance position to the positions above the wafer trays 64 at the transfer position and the processing transfer position, respectively. The transfer lift cylinder 61 is activated to move the transfer chuck downward until it contacts and adsorbs two wafer trays 64. The transfer chuck 64 is raised to the initial height and rotated by a predetermined angle to exchange the positions of its two wafer trays 4. The two transfer chucks 64 are lowered and lowered to place the corresponding wafer trays 4 on the carrier rails 51 and the wafer vacuum chucks 75, respectively. The transfer motor rotates to move the transfer chuck 64 to the middle obstacle avoidance position. The wafer holding mechanism 3 holds and moves the processed wafer tray 4 into the wafer stocker 2. The wafer vacuum chuck 75 moves the unprocessed wafer chuck 4 under the laser mechanism for dicing.

When the wafer tray 4 with different specifications is replaced, the adjusting cam 656 is rotated to enable the suction cup adjusting rod 647 to drive the negative pressure suction nozzle 643 to move, so that the distance between the negative pressure suction nozzle 643 and the central position of the suction cup rack 644 is adjusted.

In the above description: the clamping position is the position of the wafer tray 4 clamped by the wafer clamping mechanism 3 when the wafer storage box 2 starts to take the materials. The transfer position is a position where the wafer holding mechanism 3 holds the wafer tray 4 and waits for the transfer chuck 64 to suck after moving for a certain distance. The processing transfer position is a position where the wafer vacuum chuck 75 on the cutting table 7 receives the wafer tray 4 from the transfer chuck 64. Avoiding an obstacle in the middle: at a position between the transfer station and the processing transfer station, typically the intermediate position. In the attached drawing, A is a clamping position, B is a quasi-transport position, and C is a processing transport position.

It should be noted that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper" and "lower," "vertical," "horizontal," "top," "bottom," "inner" and "outer" used in the description refer to the orientation or positional relationship as shown in the drawings, merely for the purpose of slogan to describe the patent, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation. Therefore, should not be construed as limiting the scope of the invention.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. When the technical solutions are contradictory or cannot be combined, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.

Claims

1. The utility model provides a bearing structure on rotatory material loading of wafer, sets up the transportation connector in the frame including rotating, transports the transportation sucking disc that the connector downwardly connecting can go up and down, its characterized in that: the transfer sucker comprises a sucker frame, a sucker frame mounting plate fixed with the transfer connecting body is arranged above the sucker frame, and a connecting rod is arranged between the sucker frame mounting plate and the sucker frame to fix the sucker frame mounting plate and the sucker frame; the sucking disc frame central point puts and sets up and dodges the round hole, dodges and sets up in the round hole and can pivoted regulation cam, and the camshaft of adjusting the cam rotates and sets up on sucking disc frame mounting panel, sets up two at least sucking disc regulation poles that can only radially move along sucking disc frame along circumference on the sucking disc frame, sets up spring return mechanism between sucking disc regulation pole and the sucking disc frame and makes sucking disc regulation pole one end and regulation cam surface contact all the time, and the sucking disc regulation pole end sets up the negative pressure suction nozzle who communicates with the negative pressure air supply.

2. The wafer rotating and feeding upper support structure according to claim 1, wherein: the outer surface of the adjusting cam is provided with rotating curved surfaces, the number of the rotating curved surfaces corresponds to the number of the sucker adjusting rods, the adjusting cam rotates for a preset angle, and each sucker adjusting rod moves for the same distance along the radial direction.

3. The wafer rotating and feeding upper support structure according to claim 1, wherein: the sucker frame is provided with at least two adjusting rod moving grooves along the circumferential direction, and the sucker adjusting rods are arranged in the adjusting rod moving grooves in a sliding manner; the sucker adjusting rod extends out of the adjusting rod resetting part towards the side surface; the spring reset mechanism comprises a spring fixed on the sucker frame, and the other end of the spring is connected with the reset part of the adjusting rod to enable one end of the sucker adjusting rod to be in contact with the adjusting cam.

4. The wafer rotating and feeding upper support structure according to claim 1, wherein: the two ends of the transferring connector are respectively provided with a transferring lifting cylinder, the outer side surface of the transferring lifting cylinder is provided with a transferring lifting cylinder guide rail, a piston head of the transferring lifting cylinder fixes a transferring connecting plate, and the transferring connecting plate fixes a transferring lifting cylinder sliding block; the transfer lifting cylinder sliding block and the transfer lifting cylinder guide rail form a guide rail pair; the outer side of the transfer lifting cylinder sliding block extends out of a cantilever, and a sucker frame mounting plate of a transfer sucker is fixed on the cantilever.