CN212848340U

CN212848340U - Wafer continuous feeding sucking disc elevation structure

Info

Publication number: CN212848340U
Application number: CN202021701239.9U
Authority: CN
Inventors: 陶为银; 巩铁建
Original assignee: Henan General Intelligent Equipment Co Ltd
Current assignee: Henan General Intelligent Equipment Co Ltd
Priority date: 2020-08-16
Filing date: 2020-08-16
Publication date: 2021-03-30
Anticipated expiration: 2030-08-16

Abstract

The utility model provides a wafer continuous feed sucking disc elevation structure, set up the transportation connector in the frame including rotating, transport the transportation sucking disc that the connector connects down can go up and down, transport the connector both ends and set up respectively and transport lift cylinder, transport the lateral surface of lift cylinder and set up and transport lift cylinder guide rail, transport the fixed transportation cylinder connecting plate of piston head of lift cylinder, transport the fixed transportation lift cylinder slider of cylinder connecting plate; the transfer lifting cylinder sliding block and the transfer lifting cylinder guide rail form a guide rail pair; the outer side of the transfer lifting cylinder slide block extends out of a cantilever, and a transfer sucker is fixed on the cantilever. The rotating structure of the transfer sucker, the two positions of which can be changed mutually, can enable the processed wafer tray to return to the transfer position and finally return to the wafer storage box.

Description

Wafer continuous feeding sucking disc elevation structure

Technical Field

The utility model belongs to silicon wafer processing field, concretely relates to wafer continuous feed sucking disc elevation structure.

Background

When silicon wafers are subjected to laser processing, a wafer tray needs to be taken out of a wafer storage box by using a wafer clamping mechanism and is linearly moved to a transfer position. The wafer tray is adsorbed by the transfer sucker and rotates to enable the wafer tray to move to the position above the processing transfer position, and the wafer vacuum sucker of the cutting platform also moves to the processing transfer position and receives the wafer tray. The transfer sucker needs a rotating mechanism and a lifting mechanism to enable the transfer sucker to be converted at a processing transfer position, a transfer position and a middle obstacle avoidance position. In this process, it is necessary to ensure that the wafer tray is accurately positioned.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer continuous feed sucking disc elevation structure.

The purpose of the utility model is realized with the following mode: a wafer continuous feeding sucker lifting structure comprises a transferring connector which is rotatably arranged on a rack, wherein the transferring connector is downwards connected with a transferring sucker which can be lifted, two ends of the transferring connector are respectively provided with a transferring lifting cylinder, the outer side surface of the transferring lifting cylinder is provided with a transferring lifting cylinder guide rail, a piston head of the transferring lifting cylinder fixes a transferring cylinder connecting plate, and a transferring lifting cylinder sliding block is fixed by the transferring cylinder connecting plate; the transfer lifting cylinder sliding block and the transfer lifting cylinder guide rail form a guide rail pair; the outer side of the transfer lifting cylinder slide block extends out of a cantilever, and a transfer sucker is fixed on the cantilever.

A transfer displacement detection strip is arranged on the transfer connector; two transfer displacement sensors are arranged on the rack along the rotation track of the transfer displacement detection strip; when the transferring displacement detection strip moves from one transferring displacement sensor to another transferring displacement sensor, one of the transferring suckers moves the processing transferring position from the transferring displacement, and the other transferring sucker moves to the transferring position from the processing transferring position.

The transfer connector is connected with the output end of a transfer motor arranged on the frame.

Set up annular transportation spacing groove around the axis of transporting motor output shaft in the frame, set up the lower extreme in the transportation spacing groove and transport the spacing post of transportation of spacing groove fixed, the upper end is passed to the transportation connector, and the angle assurance of transportation spacing groove is transported the spacing post and is rotated 180 degrees.

The transfer sucker comprises a sucker frame body, at least 3 downward sucker rods are circumferentially arranged on the sucker frame body, and negative pressure suction nozzles are arranged on the sucker rods; the suction head rod is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe.

The sucker frame body comprises a cross frame body, the tail end of the cross frame body is provided with a frame body connecting plate, and the upper end of the sucker rod is fixed on the frame body connecting plate; the support body connecting plate is provided with an adjusting groove, the cross support body is provided with a fixing hole, and the length of the cross support body extending out of the support body connecting plate is adjusted by adjusting the position of the fixing hole in the length direction in the fixing groove.

The utility model has the advantages that: the transfer lifting cylinder drives the transfer sucker to lift, the position where the piston head moves has certain deviation, the position where the transfer sucker is moved has certain error, and the subsequent processing procedure is influenced. A transfer lifting cylinder guide rail is arranged on the outer side surface of the cylinder, and a transfer sucker is fixed with a transfer lifting cylinder sliding block through a cantilever; the position of the transfer sucker in the lifting process is accurate through the guide rail pair structure. The two rotating structures of the transfer suckers can enable the processed wafer tray to return to the transfer position and finally return to the wafer storage box.

Drawings

Fig. 1 is a schematic front view of a wafer processing apparatus (with portions of extraneous components hidden).

Fig. 2 is a top cross-sectional view of fig. 1 (hiding portions of the frame and portions of the non-moving parts).

Fig. 3 is a top cross-sectional view (hiding portions of the frame and portions of the non-moving parts) of fig. 1 at another elevational plane.

Fig. 4 is an enlarged view of a portion of the holder.

Fig. 5 is an enlarged view of the rotating transfer mechanism.

Fig. 6 is an enlarged view of a portion of the transfer chuck.

Wherein, 1 is a frame, 2 is a wafer storage box, 3 is a wafer clamping mechanism, 4 is a wafer tray, 5 is a material supporting frame, 51 is a material supporting guide rail, 52 is a proximity switch, 53 is a material supporting bottom plate, 54 is a synchronous belt, 55 is a synchronous belt connecting plate, 56 is a material supporting bottom plate displacement sensor, 57 is a material supporting guide rail connecting plate, 58 is a material supporting bottom plate displacement detecting strip, 59 is a material supporting bottom plate guide rail, and 6 is a rotating and transferring mechanism; 60 is a transferring connector, 61 is a transferring lifting cylinder, 62 is a transferring cylinder connecting plate, and 63 is a cantilever; 64 transfer suction cups; 640 is a cross frame body, 641 is a frame body connecting plate, 642 is a suction head rod, 643 is a negative pressure suction nozzle, 645 is an adjusting groove, and 65 is a transferring lifting cylinder sliding block; 66 transfer lifting cylinder guide rails and 67 are transfer displacement detection strips; 68 a transport displacement sensor; 69 is a transfer limit post, 7 is a cutting platform, 75 is a wafer vacuum chuck.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, either as a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate, unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Relational terms such as first, second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

As shown in fig. 1 to 6, a wafer continuous feeding suction cup lifting structure comprises a transferring connector 60 rotatably disposed on a frame 1, wherein the transferring connector 60 is downwardly connected to a transferring suction cup 64 capable of lifting. Transport connector 60 both ends and set up respectively and transport lift cylinder 61, transport lift cylinder 61's lateral surface setting and transport lift cylinder guide rail 66, transport lift cylinder 61's fixed cylinder connecting plate 62 of transporting of piston head. The transfer cylinder connecting plate 62 fixes the transfer lifting cylinder slide block 65; the transfer lifting cylinder slide block 65 and the transfer lifting cylinder guide rail 66 form a guide rail pair. A cantilever 63 extends out of the outer side of the transfer lifting cylinder slide block 65, and a transfer sucker 64 is fixed on the cantilever 63. The transfer lifting cylinder 61 drives the transfer sucker 64 to lift, and the position where the piston head moves has certain deviation, so that the position of the transfer sucker 64 has certain error, and subsequent processing procedures are influenced. A transfer lifting cylinder guide rail 66 is arranged on the outer side surface of the transfer lifting cylinder 61, and a transfer sucker 64 is fixed together with a transfer lifting cylinder slide block 65 through a cantilever 63; the position of the transfer sucker in the lifting process is accurate through the guide rail pair structure. And two transfer lifting cylinders can make wafer tray 4 transport the position and transport the position with processing and exchange between, and wafer tray 4 after the processing is accomplished need not to remove from other route, can return to wafer storage box 2 on the original way, compact structure.

The transfer connector 60 is provided with a transfer displacement detection strip 67; two transfer displacement sensors 68 are disposed on the frame 1 along the rotation locus of the transfer displacement detection bar 67. When the transfer displacement detection strip 67 is moved from one transfer displacement sensor 68 to the other transfer displacement sensor 68, one of the transfer suction cups 64 moves from the transfer position to the processing transfer position, and the other transfer suction cup moves from the processing transfer position to the transfer position. The transfer displacement sensor 68 ensures that the transfer chuck 64 is accurately stopped at the transfer position and the processing transfer position. As for the middle obstacle avoidance position, the precision is not required, the operation can be realized only by rotating a certain angle from the transfer position or the machining transfer position, and the operation can be realized through a servo motor.

The transfer connector 60 is connected to the output of a transfer motor provided on the frame 1. Set up annular transportation spacing groove around the axis of transporting the motor output shaft in frame 1, set up the lower extreme in the transportation spacing groove and fixed with the transportation connector 60, the upper end passes the transportation spacing post 69 of transporting the spacing groove, and the angle of transporting the spacing groove is guaranteed to transport spacing post 69 and is rotated 180 degrees. The transfer limiting groove can be slightly larger than 180 degrees. When the transfer limiting column 69 is positioned at two ends of the transfer limiting groove, one of the two transfer suckers is positioned at the transfer position.

The transfer sucker 64 comprises a sucker frame body, at least 3 downward sucker rods 642 are circumferentially arranged on the sucker frame body, and a negative pressure sucker 643 is arranged on each sucker rod 642; the suction head rod 642 is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe. How the negative pressure is achieved in the transfer cup 64 is known in the art and will not be described in detail.

The sucking disc frame body comprises a cross frame body 640, a frame body connecting plate 641 is arranged at the tail end of the cross frame body 640, and the upper end of the sucking head rod 642 is fixed on the frame body connecting plate 641; the frame connecting plate 641 is provided with an adjusting groove 645, the cross frame 640 is provided with a fixing hole, and the length of the frame connecting plate 641 extending out of the cross frame 640 is adjusted by adjusting the position of the fixing hole in the length direction of the adjusting groove 645. The fixing hole may be a screw hole, a bolt is disposed in the fixing hole, and the frame body connecting plate 641 and the cross frame body 640 are fixed by pressing the upper surface of the connecting plate with a nut of the bolt.

The structure belongs to a rotary transfer mechanism 6, a linear transfer mechanism is further arranged on the rack 1, and the linear transfer mechanism comprises a wafer clamping mechanism 3 and a clamping linear driving mechanism for driving the wafer clamping mechanism 3 to move linearly. The clamping linear driving mechanism is a linear transfer screw rod mechanism 36, and a clamping linear transfer slide rail 39 is arranged outside the linear transfer clamping screw rod mechanism 36.

The position is transported to straight line transport mechanism below on frame 1 and is set up and hold in the palm work or material rest 5, hold in the palm work or material rest 5 including holding in the palm material bottom plate 53, hold in the palm and set up the hold in the palm material guide rail 51 of two parallels on material bottom plate 53, hold in the palm material guide rail 51 under guide driving mechanism's drive along holding in the palm material bottom plate 53 relative or guide driving mechanism in opposite directions is for setting up the hold in range transport mechanism on holding in the palm material bottom plate 53, hold in the same place the hold in range connecting plate 55 of fixing respectively on hold in range transport mechanism's the both sides hold in range 54, two hold in the same. The synchronous belt conveying mechanism comprises a synchronous belt motor arranged on the material supporting bottom plate 53, a chain wheel is arranged on an output shaft of the synchronous belt motor, a rotating chain wheel is also arranged on one side, far away from the synchronous belt motor, of the material supporting bottom plate 53, and a synchronous belt 54 is arranged on the chain wheel.

Two parallel material supporting bottom plate guide rails 59 are arranged on the material supporting bottom plate 53, and the length direction of the material supporting bottom plate guide rails 59 is vertical to the length direction of the material supporting guide rails 51; the bottom of the material supporting guide rail 51 is connected with a material supporting guide rail connecting plate 57, a connecting plate sliding block is arranged on the material supporting guide rail connecting plate 57, and the connecting plate sliding block and the material supporting bottom plate guide rail 59 form a guide rail pair; and the material supporting guide rail connecting plate 57 is fixed with the synchronous belt connecting plate 55.

Furthermore, at least one material supporting bottom plate displacement sensor 56 is arranged on the material supporting bottom plate 53, and a connecting plate displacement detection strip 58 corresponding to the material supporting bottom plate displacement sensor 56 is arranged on the synchronous belt connecting plate 55. When the connecting plate displacement detecting strip 58 moves to the position of each material supporting base plate displacement sensor 56, the distance between the two corresponding material supporting guide rails 51 corresponds to the size of one type of wafer tray 4. Web displacement sensing strips 58 may also be provided on the carrier rail web 57.

The material supporting guide rail 51 is provided with a proximity switch 52. A groove is arranged on the material supporting guide rail 51, the proximity switch 52 is arranged in the groove, and the upper surface of the proximity switch 52 is not higher than the upper surface of the material supporting guide rail 51. Thus, when the wafer tray 4 held by the wafer holding mechanism 3 reaches the position of the proximity switch 52, the proximity switch is turned on so that the wafer holding mechanism 3 does not move forward any more, and the wafer tray 4 is released to be placed on the two material holding rails 51. The wafer chuck 3 is then removed.

One end of the material supporting guide rail 51 can extend to a position close to the wafer storage box 2, and the length direction of the material supporting guide rail 51 is parallel to the linear moving direction of the wafer clamping mechanism 3 along the clamping linear transfer slide rail 39. Of course, the carrier rail 51 may be provided in another direction as long as it can support the wafer tray 4, but a mechanism capable of vertical adjustment is required in order to avoid interference with the wafer chucking mechanism 3.

In the specific implementation: when the unprocessed wafer tray 4 needs to be clamped, the wafer storage box 2 arranged on the machine frame moves up and down to enable the wafer tray 4 needing to be processed to reach a clamping position. The controller or control system sends a signal to the wafer clamping mechanism 3 to clamp the wafer tray 4. When the wafer tray 4 held by the wafer holding mechanism 3 reaches the position of the proximity switch 52, the proximity switch 52 is turned on to prevent the wafer holding mechanism 3 from moving forward, and the unprocessed wafer tray 4 is released to be placed on the two material supporting rails 51. The wafer chuck 3 is then removed. And simultaneously the processed wafer tray on the wafer vacuum chuck 75 of the cutting platform moves to the processing transfer position. The transfer motor rotates to rotate the two transfer chucks 64 from the middle obstacle avoidance position to the positions above the wafer trays 64 at the transfer position and the processing transfer position, respectively. The transfer lift cylinder 61 is activated to move the transfer chuck downward until it contacts and adsorbs two wafer trays 64. The transfer chuck 64 is raised to the initial height and rotated by a predetermined angle to exchange the positions of its two wafer trays 4. The two transfer chucks 64 are lowered and lowered to place the corresponding wafer trays 4 on the carrier rails 51 and the wafer vacuum chucks 75, respectively. The transfer motor rotates to move the transfer chuck 64 to the middle obstacle avoidance position. The wafer holding mechanism 3 holds and moves the processed wafer tray 4 into the wafer stocker 2. The wafer vacuum chuck 75 moves the unprocessed wafer chuck 4 under the laser mechanism for dicing.

In the above description: the clamping position is the position of the wafer tray 4 clamped by the wafer clamping mechanism 3 when the wafer storage box 2 starts to take the materials. The transfer position is a position where the wafer holding mechanism 3 holds the wafer tray 4 and waits for the transfer chuck 64 to suck after moving for a certain distance. The processing transfer position is a position where the wafer vacuum chuck 75 on the cutting table 7 receives the wafer tray 4 from the transfer chuck 64. Avoiding an obstacle in the middle: at a position between the transfer station and the processing transfer station, typically the intermediate position. In the attached drawing, A is a clamping position, B is a quasi-transport position, and C is a processing transport position.

It should be noted that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper" and "lower," "vertical," "horizontal," "top," "bottom," "inner" and "outer" used in the description refer to the orientation or positional relationship as shown in the drawings, merely for the purpose of slogan to describe the patent, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation. Therefore, should not be construed as limiting the scope of the invention.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. When the technical solutions are contradictory or cannot be combined, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.

Claims

1. The utility model provides a wafer continuous feed sucking disc elevation structure, sets up the transportation connector including rotating in the frame, transports the transportation sucking disc that the connector downwardly connecting can go up and down, its characterized in that: the two ends of the transferring connector are respectively provided with a transferring lifting cylinder, the outer side surface of the transferring lifting cylinder is provided with a transferring lifting cylinder guide rail, a piston head of the transferring lifting cylinder fixes a transferring cylinder connecting plate, and a transferring lifting cylinder sliding block is fixed by the transferring cylinder connecting plate; the transfer lifting cylinder sliding block and the transfer lifting cylinder guide rail form a guide rail pair; the outer side of the transfer lifting cylinder slide block extends out of a cantilever, and a transfer sucker is fixed on the cantilever.

2. The wafer continuous feed chuck lifting structure of claim 1, wherein: a transfer displacement detection strip is arranged on the transfer connector; two transfer displacement sensors are arranged on the rack along the rotation track of the transfer displacement detection strip; when the transfer displacement detection strip moves from one transfer displacement sensor to the other transfer displacement sensor, one of the transfer suckers moves from the transfer position to the processing transfer position, and the other transfer sucker moves from the processing transfer position to the transfer position.

3. The wafer continuous feed chuck lifting structure of claim 1, wherein: the transportation connecting body is connected with the output end of a transportation motor arranged on the rack.

4. The wafer continuous feed chuck lifting structure of claim 3, wherein: set up annular transportation spacing groove around the axis of transporting the motor output shaft in the frame, set up the lower extreme in the transportation spacing groove and transport the spacing post of transportation that the spacing groove was passed to fixed, the upper end of connector, the angle assurance of transportation spacing groove is transported the spacing post and is rotated 180 degrees.

5. The wafer continuous feed chuck lifting structure of any one of claims 1 to 4, wherein: the transfer sucker comprises a sucker frame body, at least 3 downward sucker rods are circumferentially arranged on the sucker frame body, and negative pressure suction nozzles are arranged on the sucker rods; the suction head rod is provided with a gas connector communicated with the negative pressure suction nozzle, and the gas connector is connected with a negative pressure source through a negative pressure pipe.

6. The wafer continuous feed chuck lifting structure of claim 5, wherein: the sucker frame body comprises a cross frame body, the tail end of the cross frame body is provided with a frame body connecting plate, and the upper end of the sucker rod is fixed on the frame body connecting plate; the support body connecting plate is provided with an adjusting groove, the cross support body is provided with a fixing hole, and the length of the cross support body extending out of the support body connecting plate is adjusted by adjusting the position of the fixing hole in the length direction in the fixing groove.