CN212952992U

CN212952992U - Material supporting guide rail width adjusting structure for wafer continuous production

Info

Publication number: CN212952992U
Application number: CN202021701248.8U
Authority: CN
Inventors: 巩铁建; 陶为银
Original assignee: Henan General Intelligent Equipment Co Ltd
Current assignee: Henan General Intelligent Equipment Co Ltd
Priority date: 2020-08-16
Filing date: 2020-08-16
Publication date: 2021-04-13
Anticipated expiration: 2030-08-16

Abstract

The utility model provides a wafer continuous production is with holding in palm material guide rail width regulation structure, including setting up the support work or material rest of transporting the position in wafer fixture below, hold in the palm the work or material rest including holding in the palm the material bottom plate, holding in the palm the material guide rail that sets up two parallels on the material bottom plate, holding in the palm the material guide rail and moving relatively or in opposite directions along holding in the palm the material bottom plate under guide rail actuating mechanism's drive. The guide rail driving mechanism is a synchronous belt conveying mechanism arranged on the material supporting bottom plate, a synchronous belt connecting plate and two synchronous belt connecting plates are respectively fixed on synchronous belts on two sides of the synchronous belt conveying mechanism and move oppositely or oppositely, and each synchronous belt connecting plate is connected with one material supporting guide rail. And a proximity switch is arranged on the material supporting guide rail. The utility model discloses a distance between two support material guide rails can be adjusted to the needs of adaptation different specification wafer trays.

Description

Material supporting guide rail width adjusting structure for wafer continuous production

Technical Field

The utility model belongs to the wafer processing field, concretely relates to wafer continuous production is with holding in palm material guide rail width adjustment structure.

Background

During wafer laser processing, a wafer tray needs to be taken out of a wafer storage box by using a wafer clamping mechanism and moved to a position above a transfer position. The material supporting frame is arranged below the transferring position, the wafer tray is loosened by the clamping mechanism to be placed on the material supporting frame of the transferring position, and the clamping mechanism continues to move to a position far away from the transferring position. And the wafer tray waits for next time to move to the cutting platform on the material supporting frame for processing. Wafer trays have different specifications, and each specification of wafer tray requires a material supporting frame and a mechanism suitable for various wafer trays.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer continuous production is with holding in palm material guide rail width adjustment structure.

The purpose of the utility model is realized with the following mode: the utility model provides a wafer continuous production is with holding in palm material guide rail width adjustment structure, including setting up the support work or material rest of transporting the position in wafer fixture below, hold in the palm the work or material rest and include hold in the palm the material bottom plate, hold in the palm the material bottom plate and set up two parallel support material guide rails, hold in the palm the material guide rail and move along holding in the palm the relative or in opposite directions of material bottom plate under the drive of guide rail actuating mechanism.

The guide rail driving mechanism is a synchronous belt conveying mechanism arranged on the material supporting bottom plate, a synchronous belt connecting plate and two synchronous belt connecting plates are respectively fixed on synchronous belts on two sides of the synchronous belt conveying mechanism and move oppositely or oppositely, and each synchronous belt connecting plate is connected with one material supporting guide rail.

The material supporting bottom plate is provided with two parallel material supporting bottom plate guide rails, and the length direction of the material supporting bottom plate guide rails is vertical to the length direction of the material supporting guide rails; the bottom of the material supporting guide rail is connected with a material supporting guide rail connecting plate, a connecting plate sliding block is arranged on the material supporting guide rail connecting plate, and the connecting plate sliding block and the material supporting bottom plate guide rail form a guide rail pair; the material supporting guide rail connecting plate is fixed with the synchronous belt connecting plate.

The material supporting bottom plate is provided with at least one material supporting bottom plate displacement sensor, and the synchronous belt connecting plate is provided with a connecting plate displacement detection strip corresponding to the material supporting bottom plate displacement sensor.

And a proximity switch is arranged on the material supporting guide rail.

The utility model has the advantages that: the material supporting guide rails are used for supporting the wafer trays, and the distance between the two material supporting guide rails can be adjusted, so that the requirements of the wafer trays with different specifications are met.

Drawings

Fig. 1 is a schematic view of the position of a linear transfer mechanism of a wafer processing apparatus (hidden housing and partially unrelated components).

FIG. 2 is a schematic view of a wafer clamping mechanism (partially hidden parts).

Fig. 3 is an enlarged view of the upper and lower clamping plates.

FIG. 4 is a front side schematic view of the upper and lower clamping plates.

Fig. 5 is an enlarged schematic view of the holder.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, either as a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate, unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Relational terms such as first, second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

As shown in fig. 1-5, a width adjusting structure for a material supporting guide rail for continuous wafer production comprises a material supporting frame 5 arranged below a linear transfer mechanism on a frame 1, wherein the material supporting frame comprises a material supporting bottom plate 53, two parallel material supporting guide rails 51 are arranged on the material supporting bottom plate 53, and the material supporting guide rails 51 are driven by a guide rail driving mechanism to move relatively or oppositely along the material supporting bottom plate 53. The distance between the two material supporting guide rails 51 can be adjusted, so that the requirements of wafer trays 4 with different specifications can be met. Wherein the linear transfer mechanism comprises a wafer clamping mechanism 3 and a clamping linear driving mechanism for driving the wafer clamping mechanism 3 to move linearly. The clamping linear driving mechanism is a linear transfer screw rod mechanism 36, and a clamping linear transfer slide rail 39 is arranged outside the linear transfer clamping screw rod mechanism 36. The transfer position is a position where the wafer holding mechanism 3 holds the wafer tray 4 and places the wafer tray 4 after moving for a certain distance.

The guide rail driving mechanism is a synchronous belt conveying mechanism arranged on the material supporting bottom plate 53, a synchronous belt connecting plate 55 and two synchronous belt connecting plates 55 are respectively fixed on synchronous belts 54 on two sides of the synchronous belt conveying mechanism and move relatively or oppositely, and each synchronous belt connecting plate 55 is connected with one material supporting guide rail 51. The synchronous belt conveying mechanism comprises a synchronous belt motor arranged on the material supporting bottom plate 53, a chain wheel is arranged on an output shaft of the synchronous belt motor, a rotating chain wheel is also arranged on one side, far away from the synchronous belt motor, of the material supporting bottom plate 53, and a synchronous belt 54 is arranged on the chain wheel.

Two parallel material supporting bottom plate guide rails 59 are arranged on the material supporting bottom plate 53, and the length direction of the material supporting bottom plate guide rails 59 is vertical to the length direction of the material supporting guide rails 51; the bottom of the material supporting guide rail 51 is connected with a material supporting guide rail connecting plate 57, a connecting plate sliding block is arranged on the material supporting guide rail connecting plate 57, and the connecting plate sliding block and the material supporting bottom plate guide rail 59 form a guide rail pair; and the material supporting guide rail connecting plate 57 is fixed with the synchronous belt connecting plate 55.

Furthermore, at least one material supporting bottom plate displacement sensor 56 is arranged on the material supporting bottom plate 53, and a connecting plate displacement detection strip 58 corresponding to the material supporting bottom plate displacement sensor 56 is arranged on the synchronous belt connecting plate 55. When the connecting plate displacement detecting strip 58 moves to the position of each material supporting base plate displacement sensor 56, the distance between the two corresponding material supporting guide rails 51 corresponds to the size of one type of wafer tray 4. Web displacement sensing strips 58 may also be provided on the carrier rail web 57.

The material supporting guide rail 51 is provided with a proximity switch 52. A groove is arranged on the material supporting guide rail 51, the proximity switch 52 is arranged in the groove, and the upper surface of the proximity switch 52 is not higher than the upper surface of the material supporting guide rail 51. Thus, when the wafer tray 4 held by the wafer holding mechanism 3 reaches the position of the proximity switch 52, the proximity switch is turned on so that the wafer holding mechanism 3 does not move forward any more, and the wafer tray 4 is released to be placed on the two material holding rails 51. The wafer chuck 3 is then removed.

One end of the material supporting guide rail 51 can extend to a position close to the wafer storage box 2, and the length direction of the material supporting guide rail 51 is parallel to the linear moving direction of the wafer clamping mechanism 3 along the clamping linear transfer slide rail 39. Of course, the carrier rail 51 may be provided in another direction as long as it can support the wafer tray 4, but a mechanism capable of vertical adjustment is required in order to avoid interference with the wafer chucking mechanism 3.

The wafer clamping mechanism 3 comprises an upper clamping plate 30, a lower clamping plate 31 and a clamping cylinder 32, wherein the clamping cylinder 32 is connected with the frame 1 and drives the upper clamping plate 30 or the lower clamping plate 31 to move to clamp or release the wafer. Furthermore, the wafer clamping mechanism 3 comprises a clamping connecting plate 34 arranged on the frame 1 in a sliding manner, the piston end of the clamping cylinder 32 is connected with the lower clamping plate 31, and the cylinder body of the clamping cylinder 32 is fixed on the clamping connecting plate 34; the upper clamping plate 30 is connected to the clamping web 34. In a more specific embodiment, the rear end of the upper clamping plate 30 is provided with a clamping cylinder avoiding groove 302, the clamping cylinder 32 is arranged in the clamping cylinder avoiding groove 302, and the piston head of the clamping cylinder 32 is connected with the clamping cylinder slider 320, the clamping cylinder slider 320 and a guide rail on the outer surface of the clamping cylinder 32 to form a guide rail slider connection pair. The lower clamping plate 31 is fixed to a clamping cylinder slide 32. The clamp cylinder slider 320 may be L-shaped. The front end part of the upper clamping plate 30 is provided with a downward clamping baffle 300, and a baffle avoiding groove 310 is arranged at the corresponding position of the lower clamping plate 31; the lower end of the holding flap 300 extends into the flap escape slot 310. Or the front end part of the lower clamping plate 31 is upwards provided with a clamping baffle, and a baffle avoiding groove is arranged at the corresponding position of the upper clamping plate 30; the upper end of the clamping separation blade extends into the separation blade avoiding groove. The grip stoppers are preferably provided on both sides of the front end portion of the upper grip plate 30 or the lower grip plate 31. The clamping blade 300 may be used to position the clamping position of the wafer tray.

In order to detect whether there is a clamping action between the upper clamping plate 30 and the lower clamping plate 31, a clamping cylinder is placed in error. The upper clamping plate 30 may also be provided with a clamping plate displacement sensor 301, and the lower clamping plate 31 may be provided with a clamping plate displacement detection strip 311 engaged therewith. Further, the method comprises the following steps: the clamping plate displacement sensor 301 is located at the side edge of the upper clamping plate 30, and one end of the clamping plate displacement detection strip 311 is fixed on the clamping cylinder slider 320.

The wafer storage box 2 capable of moving up and down is arranged on the rack 1, a horizontal material supporting groove corresponding to the wafer tray 4 is arranged on two side walls of the wafer storage box 2, which are located in the insertion direction of the wafer tray 4, and the wafer tray can be placed in the horizontal material supporting groove. And limiting rods which can slide along the front and back directions of the horizontal material supporting groove are further arranged on the two side walls of the wafer material storage box 2, and the length of each limiting rod is approximately equal to the height of the wafer material storage box 2. The wafer tray 4 stops moving when moving to contact with the limit rod. The wafer tray 4 stores individual silicon wafers, and the wafer tray 4 is brought into contact with a jig or a chuck during wafer carrying and laser dicing. The wafer tray 4 comprises a circular metal disc, four straight edges are arranged on the circular metal disc, and the four straight edges are respectively located at four end points of the cross. One of the straight edges is a clamping end for clamping the wafer tray, and the other straight edge is arranged on the opposite side of the clamping end. The other two straight edges are contacted with the horizontal material supporting groove. The wafer cassette is generally configured as a rectangular parallelepiped. The center of the metal disc is provided with a center hole, the center hole is covered with a bearing layer, and the wafer is arranged on the bearing layer. The shapes and structures of the wafer tray 4 and the wafer magazine 2 are prior art and will not be described in detail.

In the specific implementation: and starting the synchronous belt transmission mechanism, and enabling the connecting plate displacement detection strip 58 on the synchronous belt connecting plate 55 to reach the material supporting bottom plate displacement sensor 56 at a preset position according to the specification and the size of the wafer tray 4. The distance between the two material holding rails 51 reaches a predetermined position. When the wafer holding mechanism 3 holds the wafer tray 4 and moves to the proximity switch position, the proximity switch is started, the wafer holding mechanism 3 stops moving, the lower holding plate 31 moves downwards, and the wafer tray 4 is placed on the two material supporting guide rails 51. The wafer chuck 3 is then moved linearly away from the transfer station.

It should be noted that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper" and "lower," "vertical," "horizontal," "top," "bottom," "inner" and "outer" used in the description refer to the orientation or positional relationship as shown in the drawings, merely for the purpose of slogan to describe the patent, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation. Therefore, should not be construed as limiting the scope of the invention.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. When the technical solutions are contradictory or cannot be combined, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.

Claims

1. The utility model provides a wafer continuous production is with holding in palm material guide rail width regulation structure which characterized in that: the material supporting frame comprises a material supporting bottom plate, two parallel material supporting guide rails are arranged on the material supporting bottom plate, and the material supporting guide rails are driven by a guide rail driving mechanism to move relatively or oppositely along the material supporting bottom plate.

2. The width adjusting structure of the supporting guide rail for the continuous production of wafers as claimed in claim 1, wherein: the guide rail driving mechanism is a synchronous belt conveying mechanism arranged on the material supporting bottom plate, a synchronous belt connecting plate and two synchronous belt connecting plates are respectively fixed on synchronous belts on two sides of the synchronous belt conveying mechanism and move oppositely or oppositely, and each synchronous belt connecting plate is connected with one material supporting guide rail.

3. The width adjusting structure of the supporting guide rail for the continuous production of wafers as claimed in claim 2, wherein: the material supporting bottom plate is provided with two parallel material supporting bottom plate guide rails, and the length direction of the material supporting bottom plate guide rails is vertical to the length direction of the material supporting guide rails; the bottom of the material supporting guide rail is connected with a material supporting guide rail connecting plate, a connecting plate sliding block is arranged on the material supporting guide rail connecting plate, and the connecting plate sliding block and the material supporting bottom plate guide rail form a guide rail pair; the material supporting guide rail connecting plate is fixed with the synchronous belt connecting plate.

4. The width adjusting structure of the supporting guide rail for the continuous production of wafers as claimed in claim 2, wherein: the material supporting bottom plate is provided with at least one material supporting bottom plate displacement sensor, and the synchronous belt connecting plate is provided with a connecting plate displacement detection strip corresponding to the material supporting bottom plate displacement sensor.

5. The width adjusting structure of the supporting guide rail for the continuous production of wafers as claimed in any one of claims 1 to 4, wherein: and a proximity switch is arranged on the material supporting guide rail.