CN212946117U - Laser processing wafer transfer precision positioning mechanism - Google Patents
Laser processing wafer transfer precision positioning mechanism Download PDFInfo
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- CN212946117U CN212946117U CN202021701238.4U CN202021701238U CN212946117U CN 212946117 U CN212946117 U CN 212946117U CN 202021701238 U CN202021701238 U CN 202021701238U CN 212946117 U CN212946117 U CN 212946117U
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- 230000007246 mechanism Effects 0.000 title claims abstract description 53
- 238000012545 processing Methods 0.000 title claims abstract description 14
- 238000012546 transfer Methods 0.000 title claims description 13
- 238000000926 separation method Methods 0.000 claims abstract description 38
- 238000001514 detection method Methods 0.000 claims abstract description 9
- 238000006073 displacement reaction Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 84
- 239000000463 material Substances 0.000 description 7
- 238000009423 ventilation Methods 0.000 description 6
- 238000003754 machining Methods 0.000 description 5
- 230000032258 transport Effects 0.000 description 4
- 230000005484 gravity Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a laser processing wafer transferring precision positioning mechanism capable of detecting whether the clamping position is accurate, which comprises a wafer clamping mechanism arranged on a frame in a sliding way, wherein the wafer clamping mechanism comprises an upper clamping plate, a lower clamping plate and a clamping cylinder, and the clamping cylinder is connected with the frame and drives the upper clamping plate or the lower clamping plate to move freely so as to clamp or loosen the wafer; the wafer clamping mechanism is provided with a clamping separation blade which is in contact with one end of the wafer tray, a clamping separation blade pressure sensor is arranged on the clamping separation blade, and the measuring surface of the clamping separation blade pressure sensor is flush with the outer surface of the wafer tray in contact with the clamping separation blade. The clamping separation blade pressure sensor detects whether the wafer tray is in place in the front-back direction. And after the detection is in place, the clamping cylinder starts to act for clamping.
Description
Technical Field
The utility model belongs to wafer laser beam machining field, concretely relates to precision positioning mechanism is transported to laser beam machining wafer.
Background
During wafer laser processing, a wafer tray needs to be taken out of a wafer storage box by using a wafer clamping mechanism and moved to a cutting platform. The wafer clamping mechanism comprises an upper clamping plate and a lower clamping plate; the piston end of the clamping cylinder is connected with the lower clamping plate. The clamping cylinder drives the upper clamping plate and the lower clamping plate to clamp or loosen. In the clamping process, the initial position of the tray wafer and the movement process of the wafer clamping mechanism can have certain displacement errors, and in order to ensure the precision of subsequent processing, the positions of the wafer clamping mechanism and the wafer tray in the clamping state are required to be ensured to be accurate. What is needed is a mechanism for detecting whether the clamping position of a tray wafer in a wafer clamping mechanism is accurate.
SUMMERY OF THE UTILITY MODEL
The utility model provides a can detect whether accurate laser beam machining wafer of clamping position transports precision positioning mechanism.
The purpose of the utility model is realized with the following mode: the laser processing wafer transferring precision positioning mechanism comprises a wafer clamping mechanism arranged on a rack in a sliding mode, wherein the wafer clamping mechanism comprises an upper clamping plate, a lower clamping plate and a clamping cylinder; the wafer clamping mechanism is provided with a clamping separation blade which is in contact with one end of the wafer tray, a clamping separation blade pressure sensor is arranged on the clamping separation blade, and the measuring surface of the clamping separation blade pressure sensor is flush with the outer surface of the wafer tray in contact with the clamping separation blade.
The front end part of the upper clamping plate is provided with a downward clamping baffle, and the corresponding position of the lower clamping plate is provided with a baffle avoiding groove; the lower end of the clamping separation blade extends into the separation blade avoiding groove.
The clamping separation blades are arranged on two sides of the front end part of the upper clamping plate, and the separation blade avoiding grooves on the lower clamping plate are communicated up and down and are provided with openings on the side surfaces.
A clamping plate spring is arranged between the upper clamping plate and the lower clamping plate; when the upper clamping plate and the lower clamping plate are in a hollow state, the lower clamping plate is pulled back to be in contact with the upper clamping plate by the clamping plate spring; the upper clamping plate is provided with a clamping plate displacement sensor, and the lower clamping plate is provided with a clamping plate displacement detection strip matched with the lower clamping plate.
The wafer clamping mechanism comprises a clamping connecting plate which is arranged on the rack in a sliding mode, a cylinder body of a clamping cylinder and an upper clamping plate are fixed on the clamping connecting plate, a clamping cylinder avoiding groove is formed in the rear end of the upper clamping plate, the clamping cylinder is arranged in the clamping cylinder avoiding groove, and a piston head of the clamping cylinder is connected with a clamping cylinder sliding block, a clamping cylinder sliding block and a guide rail on the outer surface of the clamping cylinder to form a guide rail sliding block connecting pair; the lower clamping plate is fixed on the clamping cylinder slide block; the clamping plate displacement sensor is positioned on the side edge of the upper clamping plate, and one end of the clamping plate displacement detection strip is fixed on the clamping cylinder sliding block.
The front end part of the lower clamping plate is upwards provided with a clamping baffle, and a baffle avoiding groove is formed in the corresponding position of the upper clamping plate; the upper end of the clamping separation blade extends into the separation blade avoiding groove.
The utility model has the advantages that: the clamping separation blade can position the front and back positions of the wafer tray in the clamping area of the wafer clamping mechanism, and the clamping separation blade pressure sensor ensures that the clamping position of the wafer is determined, so that the precision machining is ensured. The clamping separation blade pressure sensor detects whether the wafer tray is in place in the front-back direction. After the clamping cylinder is detected to be in place, the clamping cylinder starts to act to clamp, and the clamping plate displacement sensor detects whether the upper position and the lower position of the lower clamping plate are in place or not.
Drawings
Fig. 1 is a schematic view of the position of a linear transfer mechanism of a wafer processing apparatus (hidden housing and partially unrelated components).
FIG. 2 is a schematic view of a wafer clamping mechanism (partially hidden parts).
Fig. 3 is an enlarged view of the upper and lower clamping plates.
Figure 4 is a simplified cross-sectional view of a wafer clamping mechanism (embodiment with clamping plate springs).
FIG. 5 is a front side schematic view of the upper and lower clamping plates.
Wherein, 1 is the frame, 2 is the wafer storage box, 3 is the wafer fixture, 30 is the upper clamping plate, 300 is the centre gripping separation blade, 301 centre gripping plate displacement sensor, 302 centre gripping cylinder dodges the groove, 304 is centre gripping separation blade pressure sensor, 31 is the lower clamping plate, 310 is the separation blade dodges the groove, 311 centre gripping plate displacement detection strip, 32 is the centre gripping cylinder, 320 centre gripping cylinder slider, 33 centre gripping plate spring, 34 is the centre gripping connecting plate, 36 is the straight line transport lead screw mechanism 36, 39 centre gripping straight line transports the slide rail, 4 is the wafer tray.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, either as a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate, unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1-5, the laser processing wafer transferring precision positioning mechanism includes a wafer clamping mechanism 3 slidably disposed on a frame 1, the wafer clamping mechanism 3 includes an upper clamping plate 30, a lower clamping plate 31 and a clamping cylinder 32, and the clamping cylinder 32 is connected to the frame 1 and drives either the upper clamping plate 30 or the lower clamping plate 31 to move so as to clamp or release the wafer. The wafer clamping mechanism 3 is provided with a clamping baffle 300 which is contacted with one end of the wafer tray 4, the clamping baffle 300 is provided with a clamping baffle pressure sensor 304, and the measuring surface of the clamping baffle pressure sensor 304 is flush with the outer surface of the clamping baffle 300 which is contacted with the wafer tray 4.
The front end part of the upper clamping plate 30 is provided with a downward clamping baffle 300, and a baffle avoiding groove 310 is arranged at the corresponding position of the lower clamping plate 31; the lower end of the holding flap 300 extends into the flap escape slot 310. Or the front end part of the lower clamping plate 31 is upwards provided with a clamping baffle, and a baffle avoiding groove is arranged at the corresponding position of the upper clamping plate 30; the upper end of the clamping separation blade extends into the separation blade avoiding groove. The clamping blade 300 may be used to position the clamping position of the wafer tray. The front end portion belongs to the clamping area. The front end face of the holding block piece 300 can contact and press against the rear end face of the wafer tray 4. The grip stoppers are preferably provided on both sides of the front end portion of the upper grip plate 30 or the lower grip plate 31. The blocking piece avoiding groove 310 on the lower holding plate 31 is through from top to bottom and is open at the side surface.
The clamping separation blade can position the front and back positions of the wafer tray 4 in the clamping area of the wafer clamping mechanism 3, the clamping separation blade pressure sensor 304 ensures that the wafer clamping position is determined, the position moved to the cutting platform and put down is also determined, and the precision machining is ensured.
A clamping plate spring 33 is arranged between the upper clamping plate 30 and the lower clamping plate 31; in a state where the upper and lower chucking plates 30 and 31 are sandwiched, the chucking plate spring 33 pulls the lower chucking plate 31 back into contact with the upper chucking plate 30; the upper clamping plate 30 is provided with a clamping plate displacement sensor 301, and the lower clamping plate is provided with a clamping plate displacement detection strip 311 matched with the lower clamping plate. The clamp flap pressure sensor 304 detects whether the wafer tray 4 is in place in the front-rear direction. After the wafer tray is detected to be in place, the clamping cylinder 32 starts to act to clamp, and the clamping plate displacement sensor 301 can detect whether the upper position and the lower position of the lower clamping plate are in place or not and whether the wafer tray 4 is clamped together with the upper clamping plate 30 or not.
The wafer clamping mechanism 3 further comprises a clamping connecting plate 34 arranged on the rack 1 in a sliding mode, the piston end of the clamping cylinder 32 is connected with the lower clamping plate 31, and the cylinder body of the clamping cylinder 32 is fixed on the clamping connecting plate 34; the upper clamping plate 30 is connected to the clamping web 34. The clamping plate spring 33 is arranged between the upper clamping plate 30 and the lower clamping plate 31 and is positioned behind the contact position of the wafer tray and the upper clamping plate 30 and the lower clamping plate 31. The upper and lower chucking plates 30 and 31 have front end portions for chucking the wafer tray 4 and rear end portions for disposing chucking plate springs 33. The distance between the rear ends of the upper and lower clamping plates 30 and 31 may be greater than the distance between the front ends, making it easier to install the clamping plate spring 33.
Furthermore, the rear end of the upper clamping plate 30 is also provided with a clamping cylinder avoiding groove 302, the clamping cylinder 32 is arranged in the clamping cylinder avoiding groove 302, and the piston head of the clamping cylinder 32 is connected with the clamping cylinder slider 320, the clamping cylinder slider 320 and the guide rail on the outer surface of the clamping cylinder 32 to form a guide rail slider connecting pair. The lower clamping plate 31 is fixed to a clamping cylinder slide 32. The clamp cylinder slider 320 may be L-shaped. The clamping plate spring 33 may be disposed between the upper surface of the clamping cylinder slider 320 and the lower surface of the cylinder body of the clamping cylinder 32. The clamping plate displacement sensor 301 is located at the side edge of the upper clamping plate 30, and one end of the clamping plate displacement detection strip 311 is fixed on the clamping cylinder slider 320. When the upper clamping plate 30 and the lower clamping plate 31 are in a hollow state, the clamping plate spring 33 pulls the lower clamping plate 31 back, the elasticity of the clamping plate spring 33 ensures that the upper clamping plate 30 and the lower clamping plate 31 are contacted and have pressure, and at the moment, a clamping plate displacement detection strip 311 is inserted between the transmitting end and the receiving end of the clamping plate displacement sensor 301; when the clamping plate is not empty, the receiving end of the clamping plate displacement sensor 301 can receive the signal sent by the transmitting end. The clamping plate displacement sensor 301 may be a photo sensor.
The clamping plate spring 33 is a tension spring, the clamping cylinder 32 is a double-acting cylinder, one end of the double-acting cylinder is selectively communicated with an air source or atmosphere, and the other end of the double-acting cylinder is directly communicated with the atmosphere. The clamp cylinder 32 is now able to extend for ventilation and requires external force to retract when ventilation is no longer required. During ventilation, the clamping cylinder 32 drives the lower clamping plate 31 to move downwards. When the ventilation is not performed, the tension spring pulls the lower clamping plate 31 back to reset. In a clamping state; the extension amount of the tension spring is larger than that of the lower clamping plate 31 corresponding to the gravity. At this time, the restoring force of the tension spring is greater than the gravity of the lower clamping plate 31, so that the lower clamping plate 31 and the upper clamping plate 30 press the wafer tray 4. A plurality of tension springs or a tension spring having a large elastic force may be provided to increase the elastic force thereof to clamp the wafer tray 4. The tension springs with different elastic forces can provide different clamping forces.
The clamp cylinder 32 may also be a single-acting cylinder. The single-acting cylinder is internally provided with a spring so that the single-acting cylinder can extend when in ventilation and automatically retract when not in ventilation. However, the cylinder is a standard component, the elasticity of the spring in the single-action cylinder is fixed, the restoring force is small and cannot be adjusted, and the clamping force capable of being applied is also fixed. After the standard cylinder with the required telescopic length is selected, the restoring elasticity of the built-in spring cannot accurately meet the requirement of the wafer clamping mechanism 3. And the clamping force required by the different gravity of the wafer trays 4 with different specifications is different, so that a mechanism for conveniently adjusting the elasticity is required. Even with a single-acting cylinder, a clamp plate spring needs to be provided.
The wafer clamping mechanism 3 is driven by the clamping linear driving mechanism to move linearly. The linear transfer mechanism comprises a wafer clamping mechanism 3 and a clamping linear driving mechanism. The clamping linear driving mechanism can be a linear transfer screw mechanism 36, and a clamping linear transfer slide rail 39 is arranged outside the linear transfer clamping screw mechanism 36. The clamping webs 34 slide on clamping linear transport slides 39.
The wafer storage box 2 capable of moving up and down is arranged on the rack 1, a horizontal material supporting groove corresponding to the wafer tray 4 is arranged on two side walls of the wafer storage box 2, which are located in the insertion direction of the wafer tray 4, and the wafer tray can be placed in the horizontal material supporting groove. And limiting rods which can slide along the front and back directions of the horizontal material supporting groove are further arranged on the two side walls of the wafer material storage box 2, and the length of each limiting rod is approximately equal to the height of the wafer material storage box 2. The wafer tray 4 stops moving when moving to contact with the limit rod. The wafer tray 4 stores individual silicon wafers, and the wafer tray 4 is brought into contact with a jig or a chuck during wafer carrying and laser dicing. The wafer tray 4 comprises a circular metal disc, four straight edges are arranged on the circular metal disc, and the four straight edges are respectively located at four end points of the cross. One of the straight edges is a clamping end for clamping the wafer tray, and the other straight edge is arranged on the opposite side of the clamping end. The other two straight edges are contacted with the horizontal material supporting groove. The wafer cassette is generally configured as a rectangular parallelepiped. The center of the metal disc is provided with a center hole, the center hole is covered with a bearing layer, and the wafer is arranged on the bearing layer. The shapes and structures of the wafer tray 4 and the wafer magazine 2 are prior art and will not be described in detail.
In the specific implementation: in specific implementation, when the wafer tray 4 needs to be clamped, the wafer storage box 2 moves up and down to the wafer tray 4 to be processed to reach the clamping position. Wherein the clamping position is the position of the wafer tray 4 clamped by the wafer clamping mechanism 3 when the wafer storage box 2 starts to take the materials. The controller or control system sends a signal to the wafer clamping mechanism 3 to enable the clamping cylinder 32 to ventilate and drive the lower clamping plate 31 to move downwards, and the upper clamping plate 30 and the lower clamping plate 31 are opened. The wafer clamping mechanism 3 moves along the clamping linear transfer slide rail 39 until the clamping block 300 contacts with the end face of the wafer tray 4 and generates pressure, and the clamping block pressure sensor 304 sends a signal. The clamping cylinder 32 drives the lower clamping plate 31 to move upwards to clamp the wafer tray 4.
It should be noted that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper" and "lower," "vertical," "horizontal," "top," "bottom," "inner" and "outer" used in the description refer to the orientation or positional relationship as shown in the drawings, merely for the purpose of slogan to describe the patent, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation. Therefore, should not be construed as limiting the scope of the invention.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. When the technical solutions are contradictory or cannot be combined, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.
Claims (6)
1. The laser processing wafer transferring precision positioning mechanism comprises a wafer clamping mechanism arranged on a rack in a sliding mode, wherein the wafer clamping mechanism comprises an upper clamping plate, a lower clamping plate and a clamping cylinder; the method is characterized in that: the wafer clamping mechanism is provided with a clamping separation blade which is in contact with one end of the wafer tray, a clamping separation blade pressure sensor is arranged on the clamping separation blade, and the measuring surface of the clamping separation blade pressure sensor is flush with the outer surface of the wafer tray in contact with the clamping separation blade.
2. The laser processing wafer transfer precision positioning mechanism of claim 1, wherein: the front end part of the upper clamping plate is provided with a downward clamping baffle, and a baffle avoiding groove is formed in the corresponding position of the lower clamping plate; the lower end of the clamping separation blade extends into the separation blade avoiding groove.
3. The laser processing wafer transfer precision positioning mechanism of claim 2, wherein: the clamping separation blades are arranged on two sides of the front end part of the upper clamping plate, and the separation blades on the lower clamping plate keep the groove to penetrate up and down and are provided with openings on the side faces.
4. The laser processing wafer transfer precision positioning mechanism of claim 2, wherein: a clamping plate spring is arranged between the upper clamping plate and the lower clamping plate; when the upper clamping plate and the lower clamping plate are in a hollow state, the lower clamping plate is pulled back to be in contact with the upper clamping plate by the clamping plate spring; the upper clamping plate is provided with a clamping plate displacement sensor, and the lower clamping plate is provided with a clamping plate displacement detection strip matched with the lower clamping plate.
5. The laser processing wafer transfer precision positioning mechanism of claim 4, wherein: the wafer clamping mechanism comprises a clamping connecting plate which is arranged on the rack in a sliding mode, a cylinder body of a clamping cylinder and an upper clamping plate are fixed on the clamping connecting plate, a clamping cylinder avoiding groove is formed in the rear end of the upper clamping plate, the clamping cylinder is arranged in the clamping cylinder avoiding groove, and a piston head of the clamping cylinder is connected with a clamping cylinder sliding block, a clamping cylinder sliding block and a guide rail on the outer surface of the clamping cylinder to form a guide rail sliding block connecting pair; the lower clamping plate is fixed on the clamping cylinder slide block; the clamping plate displacement sensor is positioned on the side edge of the upper clamping plate, and one end of the clamping plate displacement detection strip is fixed on the clamping cylinder sliding block.
6. The laser processing wafer transfer precision positioning mechanism of claim 1, wherein: the front end part of the lower clamping plate is upwards provided with a clamping baffle, and a baffle avoiding groove is formed in the position corresponding to the upper clamping plate; the upper end of the clamping separation blade extends into the separation blade avoiding groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021701238.4U CN212946117U (en) | 2020-08-16 | 2020-08-16 | Laser processing wafer transfer precision positioning mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021701238.4U CN212946117U (en) | 2020-08-16 | 2020-08-16 | Laser processing wafer transfer precision positioning mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212946117U true CN212946117U (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021701238.4U Active CN212946117U (en) | 2020-08-16 | 2020-08-16 | Laser processing wafer transfer precision positioning mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212946117U (en) |
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2020
- 2020-08-16 CN CN202021701238.4U patent/CN212946117U/en active Active
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| GR01 | Patent grant | ||
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Address after: 214400, 1st to 2nd floors, Building 3, Xiakewan Chuangzhi Park, No. 215 Qingtong Road, Qingyang Town, Jiangyin City, Wuxi City, Jiangsu Province Patentee after: Jiangsu General Semiconductor Co.,Ltd. Country or region after: China Address before: No.a130-10, 1st floor, No.2 entrepreneurship center, No.96 Ruida Road, high tech Industrial Development Zone, Zhengzhou City, Henan Province, 450001 Patentee before: Henan general intelligent equipment Co.,Ltd. Country or region before: China |