CN212570937U - Wafer clamping anti-pinch mechanism - Google Patents
Wafer clamping anti-pinch mechanism Download PDFInfo
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- CN212570937U CN212570937U CN202021701244.XU CN202021701244U CN212570937U CN 212570937 U CN212570937 U CN 212570937U CN 202021701244 U CN202021701244 U CN 202021701244U CN 212570937 U CN212570937 U CN 212570937U
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- clamping plate
- clamping
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- pressure sensor
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Abstract
The utility model provides a wafer clamping anti-pinch mechanism, which comprises a wafer clamping mechanism arranged on a frame in a sliding way, wherein the wafer clamping mechanism comprises an upper clamping plate, a lower clamping plate and a clamping cylinder, and the clamping cylinder is connected with the frame and drives either the upper clamping plate or the lower clamping plate to move so as to clamp or loosen the wafer; a clamping plate pressure sensor for detecting the clamping pressure of the upper clamping plate and the lower clamping plate is arranged between the upper clamping plate and the lower clamping plate, so that whether a wafer tray is clamped or not can be detected, and the phenomenon of clamping empty is prevented.
Description
Technical Field
The utility model belongs to wafer processing field, concretely relates to empty mechanism is prevented pressing from both sides by wafer centre gripping.
Background
During wafer laser processing, a wafer tray needs to be taken out of a wafer storage box by using a wafer clamping mechanism and transferred to a cutting platform for processing. The wafer clamping mechanism comprises an upper clamping plate and a lower clamping plate; the piston end of the clamping cylinder is connected with the lower clamping plate. The clamping cylinder drives the upper clamping plate and the lower clamping plate to clamp or loosen. During the clamping process, there may be a situation of being empty, such as a situation where no wafer tray is placed on the corresponding layer of the wafer storage box. A structure for determining whether the wafer chuck clamps the wafer tray is needed.
SUMMERY OF THE UTILITY MODEL
The utility model provides a vacant mechanism is prevented pressing from both sides by wafer centre gripping.
The purpose of the utility model is realized with the following mode: the wafer clamping and air-pinch preventing mechanism comprises a wafer clamping mechanism which is arranged on a rack in a sliding mode, wherein the wafer clamping mechanism comprises an upper clamping plate, a lower clamping plate and a clamping cylinder; a clamping plate pressure sensor for detecting the clamping pressure of the clamping plate is arranged between the upper clamping plate and the lower clamping plate.
When the upper clamping plate is clamped, the front end part pressed with the wafer tray is provided with a clamping plate pressure sensor, and the outer surface of the clamping plate pressure sensor is flush with the lower surface of the upper clamping plate at the peripheral part; or when the lower clamping plate is clamped, the front end part pressed with the wafer tray is provided with a clamping plate pressure sensor, and the outer surface of the clamping plate pressure sensor is flush with the upper surface of the lower clamping plate at the peripheral part.
The lower clamping plate is connected with the piston head of the clamping cylinder and moves up and down; a clamping plate spring is arranged between the upper clamping plate and the lower clamping plate, the clamping plate spring is a tension spring, the clamping cylinder is a single-action cylinder, when the clamping cylinder is in an extension state during ventilation and is not in ventilation, the clamping plate spring pulls back the lower clamping plate, and in a clamping empty state, the clamping plate spring pulls the lower clamping plate back to be in contact with the upper clamping plate and generates pressure; the clamping plate pressure sensor is arranged outside the clamping position of the upper clamping plate or the lower clamping plate, and the distance between the clamping position of the upper clamping plate and the clamping position of the lower clamping plate is equal to the distance between the clamping positions of the upper clamping plate and the lower clamping plate.
The lower clamping plate is connected with the piston head of the clamping cylinder and moves up and down; the clamping plate spring is arranged between the upper clamping plate and the lower clamping plate and is a tension spring, the clamping cylinder is a single-action cylinder, and when the clamping cylinder is in an extension state and is not ventilated, the clamping plate spring pulls the lower clamping plate back.
The utility model has the advantages that: a clamping plate pressure sensor of clamping pressure is arranged between the upper clamping plate and the lower clamping plate, so that whether the wafer tray is clamped or not can be detected, and the phenomenon of clamping empty can be prevented.
Drawings
FIG. 1 is a schematic diagram of the position of a wafer clamping mechanism in a wafer processing apparatus.
FIG. 2 is a schematic view of the wafer holding mechanism in a holding state according to embodiment 1.
Fig. 3 is a schematic view of the wafer clamping mechanism of fig. 2 in a clamped-down state.
Fig. 4 is a schematic view of the wafer clamping mechanism of fig. 2 in a clamping cylinder vent state.
FIG. 5 is a schematic view of the wafer holding mechanism in the holding state of embodiment 2.
Fig. 6 is a schematic view of fig. 5 in a collapsed state.
FIG. 7 is a top view of the wafer clamping mechanism.
Wherein, 1 is a frame, 2 is a wafer storage box, 3 is a wafer clamping mechanism, 30 is an upper clamping plate, 302 is a clamping cylinder avoiding groove, 303 is a clamping plate pressure sensor, 31 is a lower clamping plate, 32 is a clamping cylinder, 320 is a clamping cylinder sliding block, 33 is a clamping plate spring, 34 is a clamping connecting plate, and 4 is a wafer tray.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and specific embodiments. In the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "disposed," and the like are to be construed broadly, either as a fixed connection, a detachable connection, or an integral part; may be directly connected or indirectly connected through an intermediate, unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features, or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Relational terms such as first, second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
As shown in fig. 1-7, a wafer clamping anti-pinch mechanism includes a wafer clamping mechanism 3 slidably disposed on a frame 1, the wafer clamping mechanism 3 includes an upper clamping plate 30, a lower clamping plate 31 and a clamping cylinder 32, and the clamping cylinder 32 is connected to the frame 1 and drives either the upper clamping plate 30 or the lower clamping plate 31 to move so as to clamp or release the wafer. A clamping plate pressure sensor 303 for detecting the clamping pressure thereof is provided between the upper clamping plate 30 and the lower clamping plate 31.
Specifically speaking: the clamping cylinder 32 is a common double-acting cylinder, and a clamping plate pressure sensor 303 may be disposed at a front end portion of the upper clamping plate 30 that can be pressed against the wafer tray 4 when clamping, and an outer surface of the clamping plate pressure sensor 303 is flush with a lower surface of the upper clamping plate 30 at a peripheral portion. Or a clamping plate pressure sensor 303 is arranged at the front end part pressed with the wafer tray 4 when the lower clamping plate 31 is clamped, and the outer surface of the clamping plate pressure sensor 303 is flush with the upper surface of the lower clamping plate 31 at the peripheral part. In both cases, the distance between the upper and lower clamping plates 30 and 31 is equal to the thickness of the wafer tray 4 in the clamped state. If the upper clamping plate 30 and the lower clamping plate 31 are clamped empty, the clamping plate pressure sensor 303 has zero pressure; if the clamp is normal, the pressure sensor indicates pressure.
Or the lower clamping plate 31 is connected with the piston head of the clamping cylinder 32 and moves up and down. The clamping cylinder 32 is a double-acting cylinder with one end selectively communicated with an air source or atmosphere and the other end directly communicated with the atmosphere. The clamp cylinder 32 is now able to extend for ventilation and requires external force to retract when ventilation is no longer required. A clamping plate spring 33 is provided between the upper clamping plate 30 and the lower clamping plate 31. The clamping plate spring 33 has one end fixed to the upper clamping plate 30 and the other end fixed to the lower clamping plate 31. The clamping force of the upper and lower clamping plates 30 and 31 is adjusted by adjusting the elastic force of the clamping plate spring 33. The clamping plate spring 33 is a tension spring, and when the air is ventilated, the clamping cylinder 32 drives the lower clamping plate 31 to move downwards. When the ventilation is not performed, the tension spring pulls the lower clamping plate 31 back to reset. In a clamping state; the extension amount of the tension spring is larger than that of the lower clamping plate 31 corresponding to the gravity. At this time, the restoring force of the tension spring is greater than the gravity of the lower clamping plate 31, so that the lower clamping plate 31 and the upper clamping plate 30 press the wafer tray 4. In the clamped empty state, the clamping plate spring 33 pulls the lower clamping plate 31 back into contact with the upper clamping plate 30 and generates a pressure. Of course, the clamping cylinder 32 may be a single-acting cylinder having a spring inside to extend when the cylinder is ventilated and to retract when the cylinder is not ventilated. However, the cylinder is a standard component, the elasticity of the spring in the single-action cylinder is fixed, the restoring force is small and cannot be adjusted, and the clamping force capable of being applied is also fixed. After the standard cylinder with the required telescopic length is selected, the restoring elasticity of the built-in spring cannot accurately meet the requirement of the wafer clamping mechanism 3. And the clamping force required by different gravity of the wafer trays 4 with different specifications is different. The single-acting cylinder also requires the provision of the clamping plate spring 33.
The clamping plate pressure sensor 303 may be disposed outside the clamping position on the upper clamping plate 30 or the lower clamping plate 31 with an interval equal to an interval between the clamping portions of the upper clamping plate 30 and the lower clamping plate 31. When the clamping state is normal, the clamping plate pressure sensor 303 is not under pressure, and when the clamping state is empty, the clamping plate pressure sensor 303 is under pressure.
Of course, the clamping plate pressure sensor can also be arranged in the clamping position area of the clamping position of the upper clamping plate or the lower clamping plate, and in the structure, the pressure sensor has pressure in the normal clamping state and the empty clamping state, but the pressure is different. However, the amount of change in the pressure is related to the thickness of the wafer tray 4 and the elastic coefficient of the tension spring, and the value is small.
In addition, the wafer clamping mechanism 3 further comprises a clamping connecting plate 34 arranged on the rack 1 in a sliding mode, the piston end of the clamping cylinder 32 is connected with the lower clamping plate 31, and the cylinder body of the clamping cylinder 32 is fixed on the clamping connecting plate 34; the upper clamping plate 30 is connected to the clamping web 34.
The rear end of the clamping plate 30 is provided with a clamping cylinder avoiding groove 302, the clamping cylinder 32 is arranged in the clamping cylinder avoiding groove 302, and the piston head of the clamping cylinder 32 is connected with the clamping cylinder sliding block 320, the clamping cylinder sliding block 320 and a guide rail on the outer surface of the clamping cylinder 32 to form a guide rail sliding block connecting pair. The lower clamping plate 31 is fixed to a clamping cylinder slide 32. The clamp cylinder slider 320 may be L-shaped. The clamping plate spring 33 may be disposed between the upper surface of the clamping cylinder slider 320 and the lower surface of the cylinder body of the clamping cylinder 32. Or between the upper and lower clamping plates 30 and 31 on both sides of the clamping cylinder escape groove 302.
The wafer storage box 2 capable of moving up and down is arranged on the rack 1, a horizontal material supporting groove corresponding to the wafer tray 4 is arranged on two side walls of the wafer storage box 2, which are located in the insertion direction of the wafer tray 4, and the wafer tray can be placed in the horizontal material supporting groove. And limiting rods which can slide along the front and back directions of the horizontal material supporting groove are further arranged on the two side walls of the wafer material storage box 2, and the length of each limiting rod is approximately equal to the height of the wafer material storage box 2. The wafer tray 4 stops moving when moving to contact with the limit rod. The wafer tray 4 stores individual silicon wafers, and the wafer tray 4 is brought into contact with a jig or a chuck during wafer carrying and laser dicing. The wafer tray 4 comprises a circular metal disc, four straight edges are arranged on the circular metal disc, and the four straight edges are respectively located at four end points of the cross. One of the straight edges is a clamping end for clamping the wafer tray, and the other straight edge is arranged on the opposite side of the clamping end. The other two straight edges are contacted with the horizontal material supporting groove. The wafer cassette is generally configured as a rectangular parallelepiped. The center of the metal disc is provided with a center hole, the center hole is covered with a bearing layer, and the wafer is arranged on the bearing layer. The shapes and structures of the wafer tray 4 and the wafer magazine 2 are prior art and will not be described in detail.
In specific implementation, when the clamping plate spring 33 is arranged and the wafer tray 4 needs to be clamped, the wafer storage box 2 moves up and down to the wafer tray 4 to be processed to reach the clamping position. The clamping position is the position of the wafer tray 4 clamped by the wafer clamping mechanism 3 when the wafer storage box 2 starts to take the materials. The controller or control system sends a signal to the wafer clamping mechanism 3 to enable the clamping cylinder 32 to ventilate and drive the lower clamping plate 31 to move downwards, and the upper clamping plate 30 and the lower clamping plate 31 are opened. The wafer clamping mechanism 3 moves to a clamping position near the wafer storage box 2 on the frame 1 and stops moving. The clamping cylinder 32 is not vented any more, and the clamping plate spring 33 drives the lower clamping plate 31 to move upwards to clamp the wafer tray. In this process, the value of the clamp plate pressure sensor 303 in the clamp cylinder ventilation state is 0. The clamping plate pressure sensors 303 are disposed outside the clamping positions on the upper clamping plate 30 or the lower clamping plate 31 at intervals equal to the intervals between the clamping positions of the upper clamping plate 30 and the lower clamping plate 31. When the wafer tray 4 is clamped, the value of the clamping plate pressure sensor 303 is 0; in the empty state, the clamping plate pressure sensor 303 has pressure.
In the case where the chucking plate spring 33 is not provided, the chucking plate pressure sensor 303 has pressure when the wafer tray is chucked, and the value of the chucking plate pressure sensor 303 is 0 in the chucking empty state.
It should be noted that the terms "central," "lateral," "longitudinal," "front," "rear," "left," "right," "upper" and "lower," "vertical," "horizontal," "top," "bottom," "inner" and "outer" used in the description refer to the orientation or positional relationship as shown in the drawings, merely for the purpose of slogan to describe the patent, and do not indicate or imply that the referenced device or element must have a particular orientation, configuration, and operation in a particular orientation. Therefore, should not be construed as limiting the scope of the invention.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features. When the technical solutions are contradictory or cannot be combined, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention. Also, it will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the spirit of the principles of the invention.
Claims (4)
1. The wafer clamping and air-pinch preventing mechanism comprises a wafer clamping mechanism which is arranged on a rack in a sliding mode, wherein the wafer clamping mechanism comprises an upper clamping plate, a lower clamping plate and a clamping cylinder; the method is characterized in that: and a clamping plate pressure sensor for detecting the clamping pressure of the clamping plate is arranged between the upper clamping plate and the lower clamping plate.
2. The wafer clamping anti-pinch mechanism of claim 1, wherein: when the upper clamping plate is clamped, the front end part pressed with the wafer tray is provided with a clamping plate pressure sensor, and the outer surface of the clamping plate pressure sensor is flush with the lower surface of the upper clamping plate at the peripheral part; or when the lower clamping plate is clamped, the front end part pressed with the wafer tray is provided with a clamping plate pressure sensor, and the outer surface of the clamping plate pressure sensor is flush with the upper surface of the lower clamping plate at the peripheral part.
3. The wafer clamping anti-pinch mechanism of claim 1, wherein: the lower clamping plate is connected with the piston head of the clamping cylinder and moves up and down; a clamping plate spring is arranged between the upper clamping plate and the lower clamping plate, the clamping plate spring is a tension spring, the clamping cylinder is a single-action cylinder and is in an extension state when the clamping cylinder is ventilated, the clamping plate spring pulls the lower clamping plate back when the clamping cylinder is not ventilated, and the clamping plate spring pulls the lower clamping plate back to be in contact with the upper clamping plate and generates pressure when the clamping cylinder is empty; the clamping plate pressure sensor is arranged outside the clamping position of the upper clamping plate or the lower clamping plate, and the distance between the clamping position of the upper clamping plate and the clamping position of the lower clamping plate is equal to the distance between the clamping positions of the upper clamping plate and the lower clamping plate.
4. The wafer clamping anti-pinch mechanism of claim 2, wherein: the lower clamping plate is connected with the piston head of the clamping cylinder and moves up and down; the clamping plate spring is arranged between the upper clamping plate and the lower clamping plate and is a tension spring, the clamping cylinder is a single-action cylinder and is in an extension state when being ventilated, and the clamping plate spring pulls the lower clamping plate back when not being ventilated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021701244.XU CN212570937U (en) | 2020-08-16 | 2020-08-16 | Wafer clamping anti-pinch mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021701244.XU CN212570937U (en) | 2020-08-16 | 2020-08-16 | Wafer clamping anti-pinch mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN212570937U true CN212570937U (en) | 2021-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021701244.XU Active CN212570937U (en) | 2020-08-16 | 2020-08-16 | Wafer clamping anti-pinch mechanism |
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| CN (1) | CN212570937U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808974A (en) * | 2021-09-07 | 2021-12-17 | 江苏芯梦半导体设备有限公司 | Substrate rotary processing equipment and method |
-
2020
- 2020-08-16 CN CN202021701244.XU patent/CN212570937U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808974A (en) * | 2021-09-07 | 2021-12-17 | 江苏芯梦半导体设备有限公司 | Substrate rotary processing equipment and method |
| CN113808974B (en) * | 2021-09-07 | 2024-02-20 | 江苏芯梦半导体设备有限公司 | Substrate rotary processing equipment and method |
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