CN113808974A - Substrate rotary processing equipment and method - Google Patents
Substrate rotary processing equipment and method Download PDFInfo
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- CN113808974A CN113808974A CN202111042884.3A CN202111042884A CN113808974A CN 113808974 A CN113808974 A CN 113808974A CN 202111042884 A CN202111042884 A CN 202111042884A CN 113808974 A CN113808974 A CN 113808974A
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- 239000000758 substrate Substances 0.000 title claims abstract description 142
- 238000000034 method Methods 0.000 title abstract description 22
- 238000001514 detection method Methods 0.000 claims abstract description 19
- 238000004458 analytical method Methods 0.000 claims abstract description 9
- 238000003672 processing method Methods 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 49
- 238000007789 sealing Methods 0.000 claims description 11
- 230000008569 process Effects 0.000 abstract description 14
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000012530 fluid Substances 0.000 description 13
- 238000004140 cleaning Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 239000007921 spray Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003814 drug Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000010223 real-time analysis Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a substrate rotary processing device and a substrate rotary processing method. Wherein equipment includes revolving stage, multiunit fixture, and every fixture of group all includes: a chuck pin provided to be relatively slidable in a radial direction of the rotary table; the sensor is fixedly arranged on the chuck pin; the driving assembly is used for driving the chuck pin to move; the equipment also comprises a processor which is respectively electrically connected or in signal connection with the sensor and the driving component. The method comprises the following steps: (1) placing a substrate on a turntable; (2) the driving component drives the chuck pin to slide inwards, and the sensor abuts against the substrate; (3) the rotating platform drives the substrate to rotate, the sensor detects pressure in real time and sends a detection signal F, and the processor analyzes the analysis result to control the driving assembly to drive the chuck pin to move. The invention can realize real-time adjustment of clamping pressure, better protect the substrate from being damaged in the rotation processing process, improve the yield of products and improve the production safety.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a rotary type substrate processing device and a rotary type substrate processing method.
Background
In the manufacturing process of semiconductor products, multiple processes such as photolithography, film deposition, etching, bonding, polishing and the like are involved, and these processes generate impurity particles to pollute the substrate, and if the impurity particles are not removed in time, the next process is carried out, which may result in substrate failure. It is now common to remove contaminant particles from a substrate by chemical or physical means. The chemical method adopts a rotating device to relatively fix a substrate to be cleaned, then drives the substrate to rotate at a high speed, and simultaneously sprays chemical liquid medicine to the surface of the substrate through a nozzle to remove surface impurities. The method is also applicable to the processes of etching the substrate and the like.
In the prior art, a plurality of sets of chuck pins are usually provided on the rotating device to support and hold the substrate from the radial direction, so as to prevent the substrate from moving in the radial direction during the rotation. The chuck pins are movable between a clamping position and a waiting position to provide space for substrates to be placed onto or removed from the rotating device.
However, the conventional chuck pin has the following problems: the chuck pin can only perform initial position adjustment once when the substrate is just put on the rotating device and does not start rotating, and the substrate is clamped by proper clamping force; however, in practice, the rotating device rotates at a high speed during operation, generates a large centrifugal force, and the substrate tends to move radially outward and is easily deviated, so that the pressure at the contact position of the substrate and the chuck pins is large, which may exceed the limit bearing capacity of the substrate material, and may cause damage to the substrate, decrease in yield, even generate fragments, and cause safety accidents.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a substrate rotary processing device which can reduce the damage of a substrate in the rotary processing process and improve the product yield.
In order to achieve the purpose, the invention adopts the technical scheme that:
a substrate rotary processing apparatus, comprising a rotary table for carrying a substrate, a plurality of groups of chucking mechanisms provided at intervals in a circumferential direction of the rotary table, each group of the chucking mechanisms comprising:
a chuck pin provided on the rotary table to be relatively slidable in a radial direction of the rotary table;
the sensor is fixedly arranged on the chuck pin and is arranged on the inner side of the chuck pin along the radial direction of the rotating table;
the driving assembly is used for driving the chuck pin to move along the radial direction of the rotating table;
the substrate rotary processing equipment further comprises a processor, and the processor is electrically connected or in signal connection with the sensor and the processor and the driving assembly respectively.
Preferably, the driving assembly includes a sliding member, the sliding member is disposed on the rotating table in a manner of relatively sliding along a radial direction of the rotating table, the chuck pin is fixedly disposed on the sliding member, the driving assembly further includes a driving mechanism for driving the sliding member to slide along a straight line, and the driving mechanism is electrically connected or signal-connected to the processor.
Further preferably, the guide shaft is provided integrally with the chuck pin, and the guide shaft extends from a lower end portion of the chuck pin inward in a radial direction of the rotary table.
Further preferably, the driving assembly further comprises a fixing member, the fixing member is fixedly arranged on the rotating table, and the driving mechanism is fixedly arranged on the fixing member.
Further preferably, the driving assembly further comprises a guiding mechanism, the guiding mechanism comprises a guiding shaft fixedly arranged on the chuck pin, and a guiding member fixedly arranged on the rotating table, a sliding groove extending along the radial direction of the rotating table is formed in the guiding member, the sliding member is fixedly connected with the guiding shaft, and the sliding member and/or the guiding shaft can be relatively slidably inserted in the sliding groove.
Preferably, the chuck pin has a hollow interior cavity, and the sensor has a cable attached thereto, the cable being at least partially received in the interior cavity.
Preferably, the revolving stage is provided with an accommodating cavity, the driving assembly is arranged in the accommodating cavity, the chuck pin is at least partially located outside the accommodating cavity, and the clamping mechanism further comprises a sealing member for sealing the accommodating cavity and the outside.
Preferably, the chuck pin extends along the height direction of the rotating table, the upper end portion of the chuck pin is provided with a limiting boss protruding inwards along the radial direction of the rotating table, and the sensor is arranged below the limiting boss.
Preferably, the rotary table is relatively rotatably disposed about a rotation center line, and at least one plane perpendicular to the rotation center line exists, the plane intersecting all the sensors.
Preferably, the outer surface of the sensor is a cylindrical surface protruding inwards in the radial direction of the rotating table, and the axis of the cylindrical surface is parallel to the rotating center line.
Preferably, the clamping means have at least three sets.
Preferably, the substrate rotary processing apparatus further includes a support pin fixedly disposed on the rotary table, the support pin having at least three spaced apart positions, upper end portions of all the support pins being flush, and an upper end portion of the chuck pin being higher than an upper end portion of the support pin, the chuck pin being located outside the support pin in a radial direction of the rotary table.
Another object of the present invention is to provide a substrate rotary processing method using the above substrate rotary processing apparatus. The method comprises the following steps:
(1) placing a substrate on the turntable;
(2) the driving assembly in each group of the clamping mechanisms drives the chuck pins to slide towards the substrate, and the sensor abuts against the substrate;
(3) the rotating table drives the substrate to rotate, the sensor detects the pressure between the chuck pin and the substrate in real time and sends a detection signal F, the processor receives the detection signal F and analyzes the detection signal F to obtain an analysis result, and then the driving assembly is controlled to drive the chuck pin to move along the radial direction of the rotating table according to the analysis result.
Preferably, in the step (3), a preset range { F ] is set in the processor1，F2Comparing the detection signal F with the preset range by the processor, and if F is detected, judging whether the detection signal F is within the preset range or not>F2Controlling the chuck pins to move away from the substrate; if F<F1The chuck pins are controlled to move toward the substrate.
Preferably, in the step (2), the sensor detects the pressure between the chuck pins and the substrate in real time and sends out a detection signal F, and the processor receives and analyzes the detection signal F to obtain an analysis result, and controls the driving assembly to drive the chuck pins to move along the radial direction of the rotating table according to the analysis result.
Preferably, the method further comprises step (4): after the substrate is processed, the driving assembly drives the chuck pins to slide away from the substrate, so that the substrate can be taken away.
Due to the application of the technical scheme, the substrate rotary processing equipment and the substrate rotary processing method can monitor the pressure between the substrate and the chuck pins in real time when the substrate is placed on the rotary table and in the rotary process of the rotary table, and automatically control the chuck pins to slide inwards to clamp the substrate when the clamping pressure is detected to be lower; when the clamping pressure is detected to be too high, the chuck pin is automatically controlled to slide outwards to properly release the substrate, so that the real-time adjustment of the clamping pressure is realized, the clamping pressure is always controlled within a reasonable range, the substrate can be well protected from being damaged in the rotating process, the product yield is improved, and the production safety is improved.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a partial perspective view of a substrate rotating processing apparatus in accordance with an embodiment of the present invention;
FIG. 2 is a partial perspective view of the housing and the fluid recovery mechanism of the present embodiment;
FIG. 3 is a partial perspective view of the turntable and the rotary driving motor in this embodiment, which includes a substrate;
FIG. 4 is a schematic top view of the turntable of this embodiment, without the substrate;
FIG. 5 is a schematic top view of the internal structure of the rotary table in this embodiment;
FIG. 6 is a schematic cross-sectional view A-A of FIG. 4, including a substrate;
FIG. 7 is an enlarged view of B of FIG. 6;
FIG. 8 is an enlarged partial view of the chuck pin and guide shaft of FIG. 7;
FIG. 9 is a partial perspective view of the chuck pin and the guide shaft in this embodiment;
FIG. 10 is an enlarged view of FIG. 9 at C;
wherein: 100. a substrate; 200. a housing; 300. a rotating table; 301. a rotating shaft; 302. an accommodating chamber; 400. a clamping mechanism; 500. a rotary drive motor; 600. a first fluid supply mechanism; 700. a second fluid supply mechanism; 800. a fluid recovery mechanism;
1. a chuck pin; 11. a limiting boss; 12. an inner cavity; 2. a sensor; 21. a cable; 3. a guide shaft; 31. a fixing hole; 32. a sealing surface; 4. a slider; 5. a guide member; 51. a chute; 6. a drive mechanism; 7. a fixing member; 8. a seal member; 9. a support pin; x, a rotation center line; y, radial direction.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the invention may be more readily understood by those skilled in the art.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "left-right direction", "height direction", "front-back direction", etc. indicate the orientation or positional relationship based on fig. 1 only for the convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, only have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly fixed or connected to the other feature or indirectly fixed or connected to the other feature. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. Further, the description of the upper, lower, left, right, etc. used in the present invention is only with respect to the positional relationship of the respective components of the present invention with respect to each other in the drawings.
Referring to fig. 1 to fig. 3, a substrate rotation processing apparatus is mainly used for processing a disc-shaped substrate 100 in a semiconductor process, such as cleaning and etching, and the function of the apparatus is described in this embodiment by taking the cleaning as an example.
The substrate rotary processing apparatus includes a housing 200, a rotary table 300 disposed on the housing 200 to be relatively rotatable about a rotation center line X, an output shaft of the rotary drive motor 500 being connected to a rotation shaft 301 of the rotary table 300, a rotary drive motor 500 for driving the rotary table 300 to rotate, and a cleaning device. When the substrate rotary processing apparatus is used, the substrate 100 is relatively fixedly disposed on the rotary table 300, and then the rotary driving motor 500 is started to drive the rotary table 300 to rotate at a high speed, so that the rotary table 300 drives the substrate 100 to rotate together, and the cleaning device sprays the liquid medicine or the gas to the surface of the substrate 100 to realize cleaning.
Referring to fig. 1 and 2, in the present embodiment, the cleaning apparatus specifically includes a first fluid supply mechanism 600, a second fluid supply mechanism 700, a fluid recovery mechanism 800, and the like. In order to thoroughly clean both the upper and lower surfaces of the substrate 100, the first and second fluid supply mechanisms 600 and 700 respectively have two sets of nozzles disposed on the upper and lower sides of the substrate 100. During the rotation of the substrate 100, the first fluid supply mechanism 600 sprays chemical solutions to the upper and lower surfaces of the substrate 100 simultaneously or sequentially to remove various foreign particles on the surface of the substrate 100; after the cleaning process is completed, the second fluid supply mechanism 700 again sprays gas to the upper and lower surfaces of the substrate 100 to dry the surface of the substrate 100. In the cleaning process, the used liquid can be collected and recovered under the flow guiding effect of the fluid recovery mechanism 800, so that the repeatable use of the chemical liquid is realized, and the production cost is reduced.
Referring to fig. 3 to 5, in order to fix the substrate 100 and the turntable 300 relative to each other, a plurality of sets of support pins 9 and a plurality of sets of clamping mechanisms 400 are disposed on the turntable 300. Wherein, the support pins 9 are fixedly arranged on the rotating platform 300, the number of the support pins 9 is 4, the support pins 9 are evenly arranged along the circumferential direction of the rotating platform 300, each support pin 9 extends upwards from the rotating platform 300 along the extending direction of the rotating central line X, and the upper end parts of all the support pins 9 are flush. In use of the substrate rotation type processing apparatus, all the support pins 9 are simultaneously supported below the substrate 100. Preferably, the upper end portions of the support pins 9 are tapered, so that the contact area between the support pins 9 and the substrate 100 can be reduced as much as possible, and the influence on the cleaning of the lower surface of the substrate 100 can be reduced.
The plurality of sets of clamping mechanisms 400 are also arranged along the circumferential direction of the rotating table 300 at regular intervals, and specifically, 4 sets are provided in this embodiment. Each set of the chucking mechanisms 400 includes chuck pins 1, the chuck pins 1 also extend upward from the rotating table 300 along the extending direction of the rotation center line X, and the upper end of each chuck pin 1 is higher than the upper end of the support pin 9; the chuck pins 1 are located outside the support pins 9 in the radial direction Y of the turntable 300. In use of the substrate rotary processing apparatus, each chuck pin 1 abuts against the outer circumferential wall of the substrate 100 in the circumferential direction of the substrate 100, so that the substrate 100 can be restricted from moving outward in the radial direction Y. The substrate 100 can be relatively fixed to the turntable 300 by the supporting pins 9 and the chuck pins 1 being engaged with each other, and rotated together with the turntable 300.
Referring to fig. 6 to 10, in the present embodiment, each set of clamping mechanisms 400 further includes a sensor 2 and a driving assembly. The upper end of the chuck pin 1 has a limit boss 11 protruding inward along the radial direction Y of the turntable 300 to limit the substrate 100 from moving upward along the rotation center line X and separating from the turntable 300 during high-speed rotation. The sensor 2 is fixedly arranged on the chuck pin 1, specifically arranged on the inner side of the chuck pin 1 along the radial direction Y, and the sensor 2 is arranged below the limiting boss 11. The chuck pin 1 is provided with a hollow inner cavity 12, the inner cavity 12 extends along the axial direction of the chuck pin 1, a cable 21 is connected to the sensor 2, and the cable 21 is at least partially accommodated in the inner cavity 12. Further, the outer surface of the sensor 2 is a cylindrical surface that is convex inward in the radial direction Y, and the axis of the cylindrical surface is parallel to the rotation center line X. In this way, the sensor 2 can be ensured to be always kept in contact with and abutted against the disc-shaped substrate 100 in the using process, each chuck pin 1 can be uniformly applied with force, and the sensor 2 can accurately acquire the contact pressure between the substrate 100 and the chuck pin 1.
Of course, the height of the individual sensors 2 should also be kept uniform, so that all sensors 2 can rest on the substrate 100 simultaneously. There is at least one plane (here, the horizontal plane) perpendicular to the rotation center line X, which plane intersects all the sensors 2. Preferably, the projection of each sensor 2 on the outer peripheral wall of the substrate 100 in the horizontal direction should completely cover the substrate 100 in the vertical direction, so that the substrate 100 can completely abut on the sensor 2, increasing the supporting area while improving the accuracy of the sensor 2 in detecting the pressure.
In this embodiment, the chuck pins 1 are linearly slidably disposed on the rotary stage 300 along the radial direction Y of the rotary stage 300, and the driving assembly is used for driving the chuck pins 1 to slide, so as to achieve the picking, placing, clamping and adjusting of the clamping force of the substrate 100. The driving assembly specifically comprises a slide 4, a guide 5, a driving mechanism 6, a fixing member 7, a sealing member 8, and the like.
Wherein, the lower tip of chuck pin 1 is provided with the guide shaft 3 that inwards extends along radial Y as an organic whole, and slider 4 also extends along radial Y, and the fixed orifices 31 has been seted up to one end of guide shaft 3, and slider 4 can fix and insert in this fixed orifices 31, with guide shaft 3 and chuck pin 1 fixed connection. So that the chuck pin 1 can be indirectly slid in the radial direction Y by driving the slider 4 to slide in the radial direction Y.
The driving mechanism 6 is used for driving the sliding member 4 to slide along a straight line, and in this embodiment, the driving mechanism 6 specifically adopts a motor, and an output shaft of the motor is connected with the sliding member 4.
The guide 5 and the fixing member 7 are fixed to the rotary table 300. The fixing member 7 is fixedly connected to the driving mechanism 6, and is used for ensuring that the driving mechanism 6 and the rotating platform 300 do not move relatively in the process of high-speed rotation, so as to reduce the influence of centrifugal force on the driving mechanism 6 as much as possible and improve the stability of the whole clamping mechanism 400.
The guide 5 is provided with a sliding groove 51 extending along the radial direction Y, and the joint of the sliding member 4 and the guide shaft 3 is inserted into the sliding groove 51 in a relatively slidable manner. In this way, the guide 5 and the guide shaft 3 constitute a guide mechanism so that the chuck pin 1 can stably move linearly in the radial direction Y without being displaced.
In this embodiment, since the substrate rotation type processing apparatus sprays the chemical liquid when in use, the driving assembly needs to be sealed in order to protect the electrical equipment such as the motor from being damaged. Specifically, the turntable 300 is provided with an accommodating cavity 302, the driving components are all disposed in the accommodating cavity 302, and the chuck pin 1 is partially located outside the accommodating cavity 302 and extends out of the upper surface of the turntable 300. The clamping mechanism 400 further includes a sealing member 8 for sealing the accommodating chamber 302 from the outside, where the sealing member 8 is an elastic sealing ring sleeved on the sealing surface 32 of the guide shaft 3, so as to isolate the space in the accommodating chamber 302 from the chemical liquid outside the rotary table 300 and prevent the chemical liquid from permeating.
On the other hand, the substrate rotation type processing apparatus in this embodiment further includes a processor (not shown), the processor is electrically connected or signal-connected with the sensor 2 and the processor and the driving mechanism 6 respectively,the processor is provided with a preset range { F }1，F2And the processor can receive and analyze the detection signal F sent by the sensor 2, so as to control the driving mechanism 6 to make a response action, and realize the real-time monitoring and real-time adjustment of the clamping force of the chuck pin 1.
The substrate rotation processing method in this embodiment is specifically described below:
(1) a robot (not shown in the drawing) places the substrate 100 to be cleaned on the rotary table 300 from the outside such that the 4 support pins 9 are each supported below the substrate 100 and the 4 chuck pins 1 are respectively located at the circumferential outer sides of the substrate 100;
(2) the processor sends instructions to each driving mechanism 6, so that each chuck pin 1 slides towards the substrate 100 under the driving of the driving assembly until the sensor 2 is contacted and abutted against the peripheral wall of the substrate 100, the sensor 2 detects the pressure between the chuck pin 1 and the substrate 100 and sends a detection signal F, the processor receives and analyzes the detection signal F to obtain an analysis result, and then controls the driving assembly to drive the chuck pin 1 to move along the radial direction Y of the rotating table 300 according to the analysis result, specifically, the processor compares the detection signal F with a preset range, and if F is detected, the processor drives the chuck pin 1 to slide towards the substrate 100 until the sensor 2 is contacted and abutted against the peripheral wall of the substrate 100>F2Then the chuck pins 1 are controlled to move away from the substrate 100; if F<F1Then the chuck pins 1 are controlled to move toward the substrate 100; when F is present2≤F≤F1When the chuck pins 1 have proper clamping force, the chuck pins 1 do not move any more, and the rotation driving motor 500 can be started and drive the rotation platform 300 to rotate;
(3) the rotating table 300 drives the substrate 100 to rotate at a high speed, and the first fluid supply mechanism 600 and the second fluid supply mechanism 700 sequentially spray liquid and gas onto the surface of the substrate 100 to clean the substrate 100; during the rotation of the substrate 100, the sensor 2 detects the pressure between the chuck pin 1 and the substrate 100 in real time and sends out a detection signal F, the processor receives the detection signal F and performs a real-time analysis if F>F2Then the chuck pins 1 are controlled to move away from the substrate 100; if F<F1Then the chuck pins 1 are controlled to move toward the substrate 100; when F is present2≤F≤F1Indicating that the chuck pins 1 have a proper clamping force, the chuck pins 1 are alongThe radial direction Y of the rotary table 300 remains stationary;
(4) after the substrate 100 is cleaned, the processor controls the drive assembly to drive the chuck pins 1 to slide away from the substrate 100, creating sufficient clearance between the chuck pins 1 and the substrate 100 to enable the robot to remove the substrate 100.
In the present embodiment, each set of chucking mechanisms 400 is relatively independent, 4 chuck pins 1 are slidable without interfering with each other, and the sliding operation of each chuck pin 1 is controlled by the processor. Thus, during the rotation of the substrate 100, the substrate 100 may be shifted toward any one or more chuck pins 1, and it is necessary to control a portion of the chuck pins 1 to move away from the substrate 100 and another portion to move closer to the substrate 100, so that the adjustment of the clamping force can be more reasonably realized.
In summary, the substrate rotation-type processing apparatus and method of the present embodiment can read the clamping force applied to the substrate 100 in real time during the whole processing process, especially when the turntable 300 drives the substrate 100 to rotate at a high speed, and can adjust the clamping force in real time according to the read data, thereby improving the yield of the substrate 100 processing.
The above-mentioned embodiments are merely illustrative of the technical idea and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the scope of the present invention.
Claims (10)
1. The utility model provides a substrate rotation type treatment facility, is including being used for bearing the revolving stage of substrate, following the interval sets up's in the circumference of revolving stage multiunit fixture, its characterized in that, every group fixture all includes:
a chuck pin provided on the rotary table to be relatively slidable in a radial direction of the rotary table;
the sensor is fixedly arranged on the chuck pin, and is arranged on the inner side of the chuck pin along the radial direction of the rotating table;
the driving assembly is used for driving the chuck pin to move along the radial direction of the rotating table;
the substrate rotary processing equipment further comprises a processor, and the processor is electrically connected or in signal connection with the sensor and the processor and the driving assembly respectively.
2. The substrate rotary processing apparatus of claim 1, wherein: the drive assembly comprises a sliding part, the sliding part can be arranged on the rotating table in a manner of relatively sliding along the radial direction of the rotating table, the chuck pin is fixedly arranged on the sliding part, the drive assembly further comprises a drive mechanism used for driving the sliding part to slide along a straight line, and the drive mechanism is electrically connected with or in signal connection with the processor.
3. The substrate rotary processing apparatus of claim 2, wherein: the drive assembly still includes guiding mechanism, guiding mechanism including set firmly in guiding axle on the chuck round pin, set firmly in guide on the revolving stage, set up the edge on the guide the spout of the radial extension of revolving stage, the slider with guiding axle fixed connection, the slider and/or the guiding axle can insert with sliding relatively and establish in the spout, drive assembly still includes the mounting, the mounting set firmly in on the revolving stage, drive mechanism set firmly in on the mounting.
4. The substrate rotary processing apparatus of claim 3, wherein: the guide shaft with chuck pin is integrative to be set up, the guide shaft certainly the lower tip of chuck pin is followed the radial inward extension of revolving stage.
5. The substrate rotary processing apparatus of claim 1, wherein: the chuck pin is provided with a hollow inner cavity, a cable is connected to the sensor, and at least part of the cable is accommodated in the inner cavity; and/or the presence of a gas in the gas,
the rotary table is provided with an accommodating cavity, the driving assembly is arranged in the accommodating cavity, the chuck pin is at least partially positioned outside the accommodating cavity, and the clamping mechanism further comprises a sealing element used for sealing the accommodating cavity and the outside.
6. The substrate rotary processing apparatus of claim 1, wherein: the chuck pin is followed the direction of height of revolving stage extends, the upper end of chuck pin has the edge the radial inside bellied spacing boss of revolving stage, the sensor sets up the below of spacing boss.
7. The substrate rotary processing apparatus of claim 1, wherein: the rotary table is capable of being relatively rotatably arranged around a rotation center line, and at least one plane perpendicular to the rotation center line is present and intersects with all the sensors; and/or the outer surface of the sensor is a cylindrical surface which is protruded inwards along the radial direction of the rotating table, and the axis of the cylindrical surface is parallel to the rotating center line.
8. The substrate rotary processing apparatus according to any one of claims 1 to 7, wherein: the clamping mechanisms are at least provided with three groups; and/or the presence of a gas in the gas,
the substrate rotary processing equipment further comprises a supporting pin, wherein the supporting pin is fixedly arranged on the rotary table, the supporting pin is at least three and is arranged at intervals, the upper end part of the supporting pin is flush, the upper end part of the chuck pin is higher than the upper end part of the supporting pin, and the chuck pin is located on the outer side of the supporting pin in the radial direction of the rotary table.
9. A substrate rotary processing method using the substrate rotary processing apparatus according to any one of claims 1 to 8, characterized by comprising the steps of:
(1) placing the substrate on the turntable;
(2) the driving assembly in each group of the clamping mechanisms drives the chuck pins to slide towards the substrate, and the sensor abuts against the substrate;
(3) the rotating table drives the substrate to rotate, the sensor detects the pressure between the chuck pin and the substrate in real time and sends a detection signal F, the processor receives the detection signal F and analyzes the detection signal F to obtain an analysis result, and then the driving assembly is controlled to drive the chuck pin to move along the radial direction of the rotating table according to the analysis result.
10. The substrate rotation processing method of claim 9, wherein: in the step (3), a preset range { F ] is set in the processor1，F2Comparing the detection signal F with the preset range by the processor, and if F is detected, judging whether the detection signal F is within the preset range or not>F2Controlling the chuck pins to move away from the substrate; if F<F1The chuck pins are controlled to move toward the substrate.
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| CN113808974B (en) | 2024-02-20 |
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