CN112736021A - Clamping device of ultra-thin silicon chip - Google Patents
Clamping device of ultra-thin silicon chip Download PDFInfo
- Publication number
- CN112736021A CN112736021A CN202110033994.7A CN202110033994A CN112736021A CN 112736021 A CN112736021 A CN 112736021A CN 202110033994 A CN202110033994 A CN 202110033994A CN 112736021 A CN112736021 A CN 112736021A
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- Prior art keywords
- clamping
- controller
- base
- silicon wafer
- carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a clamping device of an ultrathin silicon wafer, which comprises a main structure body, wherein the main structure body comprises a clamping base and a carrier base, the clamping base is connected with the carrier base, the clamping base and the carrier base are both provided with a slide rail, a servo motor is arranged on one side of the clamping base, the clamping base is also provided with a clamping frame, the base of the object carrier is provided with an arched object carrier, the middle part of the clamping frame is penetrated with a connecting rod, the clamping frame is also provided with a first clamping mechanism and a second clamping mechanism, the first clamping mechanism and the second clamping mechanism are symmetrically arranged at two sides of the clamping frame, just first fixture with second fixture all includes a plurality of holders, and the in-process of centre gripping at this application has high-efficient, stable effect, can also prevent the condition emergence of the silicon chip damage that leads to because the centre gripping dynamics is too big.
Description
Technical Field
The invention relates to the technical field of clamping devices, in particular to a clamping device for an ultrathin silicon wafer.
Background
The chip made of silicon chip is a famous "magic calculator" and has remarkable computing power. No matter how complex mathematical problems, physical problems and engineering problems are, and no matter how large the calculation workload is, a worker can tell the problems to the computer through a computer keyboard and issue thinking and instructions for solving the problems, and the computer can tell the answers to the user in a very short time. Regardless of the thickness of the silicon wafer, the crystalline silicon photovoltaic cell manufacturers have made extremely high requirements on the quality of the silicon wafer. The silicon wafer cannot have surface damage (fine cracks and fretsaw marks), morphology defects (bending, unevenness and uneven thickness) need to be minimized, and the requirements on additional back-end processing such as polishing and the like are also reduced to the minimum;
however, the silicon wafer clamping device in the prior art is poor in stability, the traditional hard clamping piece is adopted to clamp the silicon wafer, the damage to the silicon wafer is large, the clamping quantity is small, and the production and processing efficiency is affected.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a clamping device for an ultrathin silicon wafer.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the clamping device for the ultrathin silicon wafer comprises a structural main body, wherein the structural main body comprises a clamping base and a carrier base, the clamping base is connected with the carrier base, the clamping base and the carrier base are respectively provided with a slide rail, one side of the clamping base is provided with a servo motor, the clamping base is also provided with a clamping frame, the carrier base is provided with an arched carrier, the middle part of the clamping frame is penetrated with a connecting rod, the clamping frame is also provided with a first clamping mechanism and a second clamping mechanism, the first clamping mechanism and the second clamping mechanism are symmetrically arranged on two sides of the clamping frame, and the first clamping mechanism and the second clamping mechanism respectively comprise a plurality of clamping pieces;
a rotating shaft is sleeved in the connecting rod and movably connected with the rotating shaft, the rotating shaft is meshed with the servo motor and connected with the clamping piece, a clamping controller is arranged at the joint of the rotating shaft and the clamping piece, bearings are arranged on two sides of the clamping controller, the clamping piece comprises a clamping jaw, a jacking device and a vacuum generator, positioning sensors are arranged on two sides of the vacuum generator, a hollow sleeve is arranged between the jacking device and the clamping jaw, a pusher is arranged in the jacking device, and the clamping jaw is also provided with a vacuum suction nozzle;
the utility model discloses a positioning sensor, including connecting rod, first controller, control unit chip, CAN interface circuit, clamping controller, second controller, connecting rod bottom is equipped with first controller and second controller respectively, first controller with the both sides of second controller are equipped with the slide, the slide with the connecting rod welding, the first controller embeds there is the control unit chip, the control unit chip is used for receiving positioning sensor's signal to form output servo motor control signal through CAN interface circuit, first controller with clamping controller control connection, the second controller respectively with vacuum generator reaches positioning sensor control connection.
Particularly, the object carrier is connected with the object carrier base, a plurality of silicon wafer containing frames are arranged on the object carrier, bayonet locks for fixing are arranged on the silicon wafer containing frames in a penetrating mode, the silicon wafer containing frames have inclination angles, and the silicon wafer containing frames correspond to the first clamping mechanism and the second clamping mechanism respectively.
In particular, the slide rail is connected with the slide plate, the slide plate is connected with the first controller, the slide plate is annular, the slide plate is used for driving the connecting rod to move to the object carrier in a translation mode, and the slide plate and the slide rail are electrically driven.
Particularly, the rotating shaft is provided with a sliding groove on the inner side, the positioning sensor is arranged in the sliding groove and fixedly connected with the clamping piece, and the positioning sensor slides to a preset position through the sliding groove and drives the clamping piece to translate.
Particularly, the vacuum suction nozzles are arranged on two sides of the clamping jaw and connected with the hollow sleeve, the hollow sleeve is communicated with the vacuum suction nozzles, the hollow sleeve is connected with the vacuum generator, and the vacuum suction nozzles generate negative pressure through the vacuum generator by utilizing a positive pressure gas source to enable the vacuum suction nozzles to generate suction force to clamp.
Particularly, the clamping pieces are annularly distributed on the connecting rod, the clamping pieces rotate through connection between the rotating shaft and the servo motor, and the servo motor is in control connection with the first controller.
Compared with the prior art, the invention has the beneficial effects that:
the invention relates to a clamping device of an ultrathin silicon wafer, wherein in the using process, a clamping base and a carrier base are mutually connected in parallel, a slide rail is arranged on the clamping base and the carrier which slides to the carrier base through a slide plate in a translation way, a servo motor is arranged on one side of the clamping base, a connecting rod is arranged on the clamping frame arranged on the clamping base in a penetrating way, the connecting rod is connected with the slide plate to realize synchronous motion, a first clamping mechanism and a second clamping mechanism are respectively arranged on the connecting rod, a rotating shaft is arranged inside the connecting rod, a clamping controller is arranged on the rotating shaft, the first clamping mechanism and the second clamping mechanism are composed of a plurality of clamping pieces, the clamping pieces are provided with a clamping jaw, a jacking device and a vacuum generator, the clamping controller is connected with the vacuum generator, when the clamping process is needed, the silicon wafer is sucked by the suction force generated by the vacuum generator, the invention has the advantages that the clamping efficiency is high, the sliding type transportation is adopted, the generated vibration is small, in addition, the clamping jaws clamp the silicon wafer by adopting a vacuum adsorption method, and the problem that the silicon wafer is damaged due to the vibration or the overlarge clamping force in the clamping process is effectively prevented, effectively saves the cost, and is safe and reliable.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the holder of the present invention;
FIG. 3 is another schematic structural view of the holder of the present invention;
FIG. 4 is a schematic view of a rotating shaft according to the present invention;
FIG. 5 is a schematic view of the structure of part A of FIG. 2 according to the present invention;
fig. 6 is a schematic diagram of the internal operation of the first controller of the present invention.
Reference numbers in the figures:
1. clamping the base; 2. a carrier base; 3. a carrier; 4. a clamping frame; 5. a servo motor; 6. A silicon wafer containing frame; 7. a slide rail; 8. a first clamping mechanism; 9. a second clamping mechanism; 10. a clamping member; 11. a connecting rod; 12. a rotating shaft; 13. a slide plate; 14. a second controller; 15. a first controller; 16. a clamp controller; 17. a bearing; 18. a clamping jaw; 19. a positioning sensor; 20. a vacuum generator; 21. a jacking device; 22. a hollow sleeve; 23. a vacuum nozzle; 24. a bayonet lock; 25. a chute.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-6, the present invention provides a clamping device for ultra-thin silicon wafers, comprising a main structure body, wherein the main structure body comprises a clamping base 1 and a carrier base 2, the clamping base 1 is connected with the carrier base 2, the clamping base 1 and the carrier base 2 are both provided with a slide rail 7, one side of the clamping base 1 is provided with a servo motor 5, the clamping base 1 is further provided with a clamping frame 4, the carrier base 2 is provided with an arched carrier 3, a connecting rod 11 is arranged in the middle of the clamping frame 4, the clamping frame 4 is further provided with a first clamping mechanism 8 and a second clamping mechanism 9, the first clamping mechanism 8 and the second clamping mechanism 9 are symmetrically arranged on both sides of the clamping frame 4, and the first clamping mechanism 8 and the second clamping mechanism 9 both comprise a plurality of clamping pieces 10, a rotating shaft 12 is sleeved inside the connecting rod 11, the connecting rod 11 and the rotating shaft 12 are movably connected, the rotating shaft 12 is connected with the servo motor 5 in a meshed mode, the rotating shaft 12 is connected with the clamping piece 10, a clamping controller 16 is arranged at the joint of the rotating shaft 12 and the clamping piece 10, bearings 17 are arranged on two sides of the clamping controller 16, the clamping piece 10 is composed of a clamping jaw 18, a jacking device 21 and a vacuum generator 20, positioning sensors 19 are arranged on two sides of the vacuum generator 20, a hollow sleeve 22 is arranged between the jacking device 21 and the clamping jaw 18, a pusher is arranged in the jacking device 21, a vacuum suction nozzle 23 is further arranged on the clamping jaw 18, a first controller 15 and a second controller 14 are respectively arranged at the bottom of the connecting rod 11, sliding plates 13 are arranged on two sides of the first controller 15 and the second controller 14, and the sliding plates 13 are welded with the connecting rod 11, the first controller 15 is internally provided with a control unit chip, the control unit chip is used for receiving the signal of the positioning sensor 19 and outputting a servo motor control signal through a CAN interface circuit, the first controller 15 is in control connection with the clamping controller 16, and the second controller 14 is in control connection with the vacuum generator 20 and the positioning sensor 19 respectively.
It is further described that the object carrier 3 is connected to the object carrier base 2, the object carrier 3 is provided with a plurality of silicon wafer containing frames 6, the silicon wafer containing frames 6 are provided with clamping pins 24 for fixing in a penetrating manner, the silicon wafer containing frames 6 have inclination angles, the silicon wafer containing frames 6 respectively correspond to the first clamping mechanism 8 and the second clamping mechanism 9, the silicon wafer containing frames 6 are arranged along the arc of the object carrier 3, the clamping jaws 18 are pushed out by the pusher of the lifter 21, the silicon wafer containing frames also have a retracting function, the silicon wafer containing frames are fixed and unlocked by the clamping pins 24, and the first clamping mechanism 8 and the second clamping mechanism 9 are enabled to have the same angle as that of the silicon wafer containing frames 6 through the rotating shaft 12 and are sequentially placed from bottom to top.
It is further described that the slide rail 7 is connected to the slide plate 13, the slide plate 13 is connected to the first controller 15, the slide plate 13 is annular, the slide plate 13 is used for driving the connecting rod 11 to move to the object carrier 3 in a translational manner, the slide plate 13 and the slide rail 7 are electrically driven, and the slide plate 13 is controlled to translate left and right on the slide rail 7 by the second controller 14 after being powered on.
It is further described that the vacuum suction nozzles 23 are disposed on two sides of the clamping jaw 18, the vacuum suction nozzles 23 are connected to the hollow sleeve 22, the hollow sleeve 22 is communicated with the vacuum suction nozzles 23, the hollow sleeve 22 is connected to the vacuum generator 20, the vacuum suction nozzles 23 generate negative pressure through the vacuum generator 20 by using a positive pressure air source to enable the vacuum suction nozzles 23 to generate suction force for clamping, the vacuum generator 20 is connected to the positioning sensor 19, and after moving to a preset distance through the positioning sensor 19, the vacuum suction nozzles 23 automatically release air pressure for placing or suck silicon wafers for clamping.
It is further described that the clamping members 10 are annularly distributed on the connecting rod 11, the clamping members 10 rotate through the connection between the rotating shaft 12 and the servo motor 5, the servo motor 5 is in control connection with the first controller 15, a control unit chip is arranged in the first controller 15, the control unit chip is used for receiving the signal of the positioning sensor 19 and forming an output servo motor control signal through a CAN interface circuit, the servo motor 5 stops moving after receiving the control signal, that is, the silicon wafer containing frames 6 on the silicon wafer containing frame 3 stop operating after the silicon wafer containing frames 6 are full, and the operation is started again until the empty silicon wafer containing frames 6 are replaced.
The specific working principle is as follows: in the using process, the clamping base 1 and the carrier base 2 are connected in parallel, a slide rail 7 is arranged on the two, the carrier 3 slides to the carrier base 2 in a translation way through a sliding plate 13, a servo motor 5 is arranged on one side of the clamping base 1, a connecting rod 11 is arranged on the clamping frame 4 arranged on the clamping base 1 in a penetrating way, the connecting rod 11 is connected through the sliding plate 13 to realize synchronous movement, a first clamping mechanism 8 and a second clamping mechanism 9 are respectively arranged on the connecting rod 11, a rotating shaft 12 is arranged inside the connecting rod 11, a clamping controller 16 is arranged on the rotating shaft 12, the first clamping mechanism 8 and the second clamping mechanism 9 are composed of a plurality of clamping pieces 10, the clamping pieces 10 are provided with clamping jaws 18, a jacking device 21 and a vacuum generator 20, the vacuum generator 20 is connected with the clamping controller 16, when the clamping process is needed, the silicon wafer holding device has the advantages that suction force is generated to hold a silicon wafer, the positioning sensors 19 are arranged on two sides of the vacuum generator 20, the positioning sensors 19 are arranged in the sliding grooves 25 and fixedly connected with the clamping controller 16, after the positioning sensors 19 are driven by the first controller 15, the positioning sensors 19 slide on the sliding grooves 25, the clamping piece 10 synchronously moves along with the positioning sensors 19, after the positioning sensors are moved to the preset position, the vacuum generator 20 is released, the silicon wafer is placed on the position corresponding to the silicon wafer holding frame 6, reciprocating clamping and transportation are carried out, until the number of the silicon wafer holding frames 6 is full, the clamping and transportation state is stopped, and an operator can pull out the clamping pins 24 on the silicon wafer holding frame 6 to replace the empty silicon wafer holding frame 6 and then continue to start operation.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The clamping device for the ultrathin silicon wafer is characterized by comprising a main structure body, wherein the main structure body comprises a clamping base and a carrier base, the clamping base is connected with the carrier base, the clamping base and the carrier base are respectively provided with a slide rail, one side of the clamping base is provided with a servo motor, the clamping base is also provided with a clamping frame, the carrier base is provided with an arched carrier, the middle part of the clamping frame is provided with a connecting rod in a penetrating manner, the clamping frame is also provided with a first clamping mechanism and a second clamping mechanism, the first clamping mechanism and the second clamping mechanism are symmetrically arranged on two sides of the clamping frame, and the first clamping mechanism and the second clamping mechanism respectively comprise a plurality of clamping pieces;
a rotating shaft is sleeved in the connecting rod and movably connected with the rotating shaft, the rotating shaft is meshed with the servo motor and connected with the clamping piece, a clamping controller is arranged at the joint of the rotating shaft and the clamping piece, bearings are arranged on two sides of the clamping controller, the clamping piece comprises a clamping jaw, a jacking device and a vacuum generator, positioning sensors are arranged on two sides of the vacuum generator, a hollow sleeve is arranged between the jacking device and the clamping jaw, a pusher is arranged in the jacking device, and the clamping jaw is also provided with a vacuum suction nozzle;
the utility model discloses a positioning sensor, including connecting rod, first controller, control unit chip, CAN interface circuit, clamping controller, second controller, connecting rod bottom is equipped with first controller and second controller respectively, first controller with the both sides of second controller are equipped with the slide, the slide with the connecting rod welding, the first controller embeds there is the control unit chip, the control unit chip is used for receiving positioning sensor's signal to form output servo motor control signal through CAN interface circuit, first controller with clamping controller control connection, the second controller respectively with vacuum generator reaches positioning sensor control connection.
2. The clamping device for ultra-thin silicon wafers as claimed in claim 1, wherein the carrier is connected to the base of the carrier, the carrier is provided with a plurality of silicon wafer containing racks, the silicon wafer containing racks are provided with pins for fixing, the silicon wafer containing racks have an inclination angle, and the silicon wafer containing racks correspond to the first clamping mechanism and the second clamping mechanism respectively.
3. The apparatus as claimed in claim 1, wherein the slide rail is connected to the slide plate, the slide plate is connected to the first controller, the slide plate is ring-shaped, the slide plate is used to move the connecting rod to the carrier frame in a translational manner, and the slide plate and the slide rail are electrically driven.
4. The clamping device for the ultra-thin silicon wafer as claimed in claim 1, wherein a sliding groove is formed inside the rotating shaft, the positioning sensor is disposed in the sliding groove, the positioning sensor is fixedly connected to the clamping member, and the positioning sensor slides to a predetermined position through the sliding groove and drives the clamping member to translate.
5. The clamping device of claim 1, wherein the vacuum suction nozzle is disposed on two sides of the clamping jaw, and is connected to the hollow sleeve, the hollow sleeve is communicated with the vacuum suction nozzle, the hollow sleeve is connected to the vacuum generator, and the vacuum suction nozzle uses a positive pressure gas source to generate a negative pressure through the vacuum generator to enable the vacuum suction nozzle to generate a suction force for clamping.
6. The ultra-thin silicon wafer clamping device as claimed in claim 1, wherein the clamping members are annularly distributed on the connecting rod, the clamping members rotate through connection between a rotating shaft and a servo motor, and the servo motor is in control connection with the first controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110033994.7A CN112736021A (en) | 2021-01-19 | 2021-01-19 | Clamping device of ultra-thin silicon chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110033994.7A CN112736021A (en) | 2021-01-19 | 2021-01-19 | Clamping device of ultra-thin silicon chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112736021A true CN112736021A (en) | 2021-04-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110033994.7A Pending CN112736021A (en) | 2021-01-19 | 2021-01-19 | Clamping device of ultra-thin silicon chip |
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| Country | Link |
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| CN (1) | CN112736021A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808974A (en) * | 2021-09-07 | 2021-12-17 | 江苏芯梦半导体设备有限公司 | Substrate rotary processing equipment and method |
-
2021
- 2021-01-19 CN CN202110033994.7A patent/CN112736021A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808974A (en) * | 2021-09-07 | 2021-12-17 | 江苏芯梦半导体设备有限公司 | Substrate rotary processing equipment and method |
| CN113808974B (en) * | 2021-09-07 | 2024-02-20 | 江苏芯梦半导体设备有限公司 | Substrate rotary processing equipment and method |
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