CN214526794U

CN214526794U - Wafer taking chuck

Info

Publication number: CN214526794U
Application number: CN202120328822.8U
Authority: CN
Inventors: 颜博
Original assignee: Suzhou Xinshangsi Automation Equipment Co Ltd
Current assignee: Suzhou Xinshangsi Automation Equipment Co Ltd
Priority date: 2021-02-05
Filing date: 2021-02-05
Publication date: 2021-10-29
Anticipated expiration: 2031-02-05

Abstract

The utility model relates to a wafer taking chuck, which comprises a fixed clamping arm, wherein the fixed clamping arm comprises an arm body, a first supporting seat and a second supporting seat, the first supporting seat and the second supporting seat are arranged at two ends of the arm body, the first supporting seat and the second supporting seat form a wafer placing area, and the wafer placing area is positioned above the arm body; the wafer taking chuck further comprises a movable clamping arm moving relative to the first supporting seat or the second supporting seat, and the wafer placed in the wafer placing area is clamped between the movable clamping arm and the first supporting seat or between the movable clamping arm and the second supporting seat from the side edge along with the movement of the movable clamping arm. The utility model separates the wafer from the arm body by the first supporting seat and the second supporting seat which are arranged at the two ends of the arm body and are provided with the inclined planes, thereby reducing the contact area between the wafer and the arm body, reducing the friction and avoiding the wafer damage; simultaneously, the movable clamping arms are movably arranged at one end of the arm body, so that the wafer is guaranteed to be clamped tightly, shaking or falling is prevented, normal operation of production is guaranteed, and efficiency is improved.

Description

Wafer taking chuck

Technical Field

The utility model belongs to centre gripping equipment field, concretely relates to material chuck is got to wafer.

Background

As is well known, a wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and is a silicon wafer sheet, i.e. a wafer, formed by grinding, polishing and slicing a silicon ingot, and a wafer guide is used to transport and align the wafer in a chip production line.

However, due to the very fragile characteristic of the wafer, the wafer pickup chuck inside the wafer guide machine is easily contacted with the surface of the wafer and generates friction, which causes the wafer to be damaged; meanwhile, the wafer can not be accurately and stably taken and placed and even fall off from the equipment, so that the rejection rate of the wafer is high, the follow-up procedures are affected, and the production efficiency is reduced.

Disclosure of Invention

The utility model aims to solve the technical problem that overcome prior art not enough, provide a modified wafer and get material chuck.

For solving the technical problem, the utility model discloses a following technical scheme:

a wafer taking chuck comprises a fixed clamping arm, wherein the fixed clamping arm comprises an arm body, a first supporting seat and a second supporting seat, the first supporting seat and the second supporting seat are arranged at two ends of the arm body, a wafer placing area is formed by the first supporting seat and the second supporting seat, and the wafer placing area is positioned above the arm body; the wafer taking chuck further comprises a movable clamping arm moving relative to the first supporting seat or the second supporting seat, and the wafer placed in the wafer placing area is clamped between the movable clamping arm and the first supporting seat or between the movable clamping arm and the second supporting seat from the side edge along with the movement of the movable clamping arm.

Preferably, a first inclined plane inclined downwards towards the second supporting seat is formed on the first supporting seat; the second support seat is formed with a second inclined surface inclined downwards towards the first support seat, wherein a wafer placing area is formed between the first inclined surface and the second inclined surface.

Specifically, the included angle between the first inclined surface and the arm body is a1, the included angle between the second inclined surface and the arm body is a2, and a1= a 2. Set up like this, when reducing wafer bottom surface and first supporting seat and second supporting seat area of contact, guarantee that the wafer can the level place on first supporting seat and second supporting seat.

According to a specific implementation and preferred aspect of the present invention, the first inclined plane and the second inclined plane respectively extend from the lower end vertically downward and form an arc surface tangent to the wafer side. The arrangement is convenient for positioning the wafer when the wafer is placed in the placing area.

Preferably, a fixed stop block extending vertically upwards is formed at the top end of the first inclined surface of the first supporting seat, and an arc surface tangent to the side edge of the wafer is formed at one side of the fixed stop block close to the second supporting seat. By the arrangement, the contact area between the side edge of the wafer and the fixed stop block is reduced during clamping.

Specifically, the arm body is fork-shaped, and two first supporting seats are arranged on two end parts of a fork-shaped opening respectively; the second supporting seat has two, and sets up side by side in forked closed end's both sides. And the clamping is stable through multi-point clamping, and the wafer is prevented from shaking.

Preferably, the movable clamping arm comprises a moving arm arranged above the second supporting seat and a movable stop block connected to the moving arm, and the wafer is clamped between the movable stop block and the fixed stop block from the side edge.

Specifically, the movable arm is long and is horizontally arranged along the arrangement direction of the two second supporting seats, extending parts horizontally extending towards the direction of the first supporting seat are respectively formed at the two end parts of the movable arm, and the two movable check blocks are respectively connected to the two extending parts.

Preferably, one side of the movable stop block, which is close to the first support seat, is formed with an arc surface tangent to the side edge of the wafer. When clamping, the contact area between the side edge of the wafer and the movable stop block is reduced.

In addition, the wafer picking chuck further comprises a driving part, the driving part comprises a sensor and a driving arm connected to the movable clamping arm, and the driving arm drives the movable clamping arm to move along the direction close to or far away from the first supporting seat. By the arrangement, the sensor can record the wafer position information in real time.

Due to the implementation of the above technical scheme, compared with the prior art, the utility model have the following advantage:

the utility model separates the wafer from the arm body by the first supporting seat and the second supporting seat which are arranged at the two ends of the arm body and are provided with the inclined planes, thereby reducing the contact area between the wafer and the arm body, reducing the friction and avoiding the wafer damage; simultaneously, the movable clamping arms are movably arranged at one end of the arm body, so that the wafer is guaranteed to be clamped tightly, shaking or falling is prevented, normal operation of production is guaranteed, and efficiency is improved.

Drawings

FIG. 1 is a schematic view of a wafer picking chuck structure according to the present invention;

FIG. 2 is a schematic front view of FIG. 1;

FIG. 3 is a top view of FIG. 2;

wherein: 1. fixing the clamping arm; 10. an arm body; 11. a first support base; a1, a first inclined surface; 12. a second support seat; a2, a second inclined surface; 13. fixing a stop block; 14. an extension arm;

2. a movable clamping arm; 20. a moving arm; b. an extension portion; 21. a movable stop block;

3. a drive unit; 30. a machine base; 31. a sensor; 32. a driving arm.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and that modifications may be made by one skilled in the art without departing from the spirit and scope of the application and it is therefore not intended to be limited to the specific embodiments disclosed below.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature. It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

As shown in fig. 1, the wafer chuck of this embodiment includes a fixed arm 1, a movable arm 2, and a driving unit 3.

Referring to fig. 2, the fixed clamp arm 1 includes an arm body 10, a first support seat 11, a second support seat 12, a stop 13, and an extension arm 14 disposed at one end of the arm body 10, wherein the first support seat 11 and the second support seat 12 form a wafer placing region, and the wafer placing region is located above the arm body 10.

The arm body 10 is in a fork shape and is horizontally arranged, one end of the arm body is closed, the other end of the arm body forms an opening, and two first supporting seats 11 are arranged on two ends of the fork-shaped opening respectively; the second support seats 12 are two and are arranged side by side on either side of the fork-shaped closed end. And the clamping is stable through multi-point clamping, and the wafer is prevented from shaking.

In this embodiment, the first support 11 has a first inclined surface a1 inclined downward toward the second support 12, the second support 12 has a second inclined surface a2 inclined downward toward the first support 11, and when a wafer is placed on the first support, the wafer is respectively pressed against the first inclined surface a1 and the second inclined surface a2 from opposite sides. By the arrangement, the contact area between the wafer and the first supporting seat and the contact area between the wafer and the second supporting seat are reduced.

Meanwhile, the included angle between the first inclined surface a1 and the arm body 10 is a1, the included angle between the second inclined surface a2 and the arm body 10 is a2, and a1= a 2. Guarantee that the wafer can the level place on first supporting seat and second supporting seat.

As shown in fig. 3, the first inclined surface a1 and the second inclined surface a2 respectively extend vertically downward from the lower end and form arc surfaces tangential to the side edges of the wafer. The arrangement is convenient for positioning the wafer when the wafer is placed in the placing area.

The number of the fixed stop blocks 13 is four, the fixed stop blocks are respectively fixedly arranged at the top ends of the two first supporting seats 11 and the two second supporting seats 12, an arc surface tangent to the side edge of the wafer is formed on one side of the fixed stop blocks 13 located in the wafer placing area, and the arc surface is respectively intersected with the first inclined surface a1 and the second inclined surface a 2. By the arrangement, when the wafer is clamped by the wafer taking chuck, the contact area between the side edge of the wafer and the fixed stop block is reduced.

Extension arm 14 extends horizontally outward from the closed end of the fork in arm body 10.

Specifically, the movable clamping arm 2 comprises a moving arm 20 and a movable stop 21.

The moving arm 20 is elongated and horizontally disposed along the arrangement direction of the two second supporting seats 12, and the moving arm 20 is formed with extending portions b extending horizontally toward the first supporting seat 11 from both end portions thereof, respectively.

The two movable stoppers 21 are respectively connected to the two extending portions b, the two movable stoppers 21 are respectively located at the outer sides of the two second supporting seats 12, and the movable stoppers 21 and the second supporting seats 12 are arranged in a crossing manner along the horizontal projection. The wafer is placed on the second supporting seat from the side edge, and the stop block can push and touch the side edge of the wafer.

In this embodiment, the movable stopper 21 has an arc surface formed on a side thereof close to the first support base 11 and tangent to a side edge of the wafer. When clamping, the contact area between the side edge of the wafer and the movable stop block is reduced.

Specifically, the driving unit 3 includes a base 30, a sensor 31, and a driving arm 32 connected to the moving arm 20 and passing through the base 30.

The housing 30 is fixedly disposed on the extension arm 14.

The sensor 31 records the position information of the wafer in real time.

The driving arm 32 drives the moving arm 20 to move toward or away from the first supporting seat 11.

Therefore, the present embodiment has the following advantages:

1. the wafer is separated from the arm body through the supporting seats which are arranged at the two ends of the arm body and are provided with the inclined planes, so that the contact area between the wafer and the arm body is reduced, the friction is reduced, and the wafer is prevented from being damaged;

2. the wafer is ensured to be clamped through the fixed stop block fixedly arranged at one end of the arm body and the movable clamping arm movably arranged at the other end of the arm body, so that the wafer is prevented from shaking or falling off, the normal operation of production is ensured, and the efficiency is improved;

3. simple and reliable structure, low processing and manufacturing cost and convenient use.

The present invention has been described in detail, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the same, and the protection scope of the present invention should not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. The utility model provides a wafer picking chuck, its includes fixed arm lock, its characterized in that:

the fixed clamping arm comprises an arm body, a first supporting seat and a second supporting seat, wherein the first supporting seat and the second supporting seat are arranged at two ends of the arm body, a wafer placing area is formed by the first supporting seat and the second supporting seat, and the wafer placing area is positioned above the arm body;

the wafer material taking chuck further comprises a movable clamping arm moving relative to the first supporting seat or the second supporting seat, and wafers placed in the wafer placing area are clamped between the movable clamping arm and the first supporting seat or between the movable clamping arm and the second supporting seat from the side edge along with the movement of the movable clamping arm.

2. The wafer retrieval chuck of claim 1, wherein: a first inclined plane which is inclined downwards towards the second supporting seat is formed on the first supporting seat; and a second inclined plane which is inclined downwards towards the first supporting seat is formed on the second supporting seat, wherein the wafer placing area is formed between the first inclined plane and the second inclined plane.

3. The wafer retrieval chuck of claim 2, wherein: the included angle between the first inclined plane and the arm body is A1, the included angle between the second inclined plane and the arm body is A2, and A1= A2.

4. The wafer retrieval chuck of claim 3, wherein: the first inclined plane and the second inclined plane respectively extend downwards from the lower end vertically and form an arc surface tangent to the side edge of the wafer.

5. The wafer retrieval chuck of claim 2, wherein: the first supporting seat is formed with a vertical stop block extending upwards from the top end of the first inclined plane, and the stop block is close to one side of the second supporting seat and is formed with an arc surface tangent to the side edge of the wafer.

6. The wafer retrieval chuck of claim 5, wherein: the arm body is fork-shaped, and the two first supporting seats are respectively arranged at two end parts of the fork-shaped opening; the second supporting seats are arranged on two sides of the fork-shaped closed end in parallel.

7. The wafer retrieval chuck of claim 6, wherein: the movable clamping arm comprises a moving arm arranged above the second supporting seat and a movable stop block connected to the moving arm, and the wafer is clamped between the movable stop block and the fixed stop block from the side edge.

8. The wafer retrieval chuck of claim 7, wherein: the movable arm is in a long strip shape and is horizontally arranged along the arrangement direction of the two second supporting seats, extending parts which horizontally extend towards the direction of the first supporting seat are respectively formed at two ends of the movable arm, and the two movable check blocks are respectively connected onto the two extending parts.

9. The wafer retrieval chuck of claim 8, wherein: and an arc surface tangent to the side edge of the wafer is formed on one side of the movable stop block close to the first supporting seat.

10. The wafer retrieval chuck of claim 1, wherein: the wafer material taking chuck further comprises a driving part, the driving part comprises a sensor and a driving arm connected to the movable clamping arm, and the driving arm drives the movable clamping arm to move in the direction close to or far away from the first supporting seat.