KR101422356B1

KR101422356B1 - Die pickup unit and die bonder including the same

Info

Publication number: KR101422356B1
Application number: KR1020120133462A
Authority: KR
Inventors: 정연혁; 김동진
Original assignee: 세메스 주식회사
Priority date: 2012-11-23
Filing date: 2012-11-23
Publication date: 2014-07-23
Also published as: KR20140066877A

Abstract

The die bonding apparatus includes a wafer stage for supporting a wafer divided into a plurality of dies, and a die pick-up unit for picking up the dies selectively and for transferring the die for bonding the pick-up die onto a substrate . The die pick-up unit includes a pick-up head for picking up and transporting the die, and a first collet for mounting the die by using a magnetic force at a lower portion of the pick-up head. Wherein the first collet has a rectangular shape and the pick-up head has a plate shape and includes first protrusions corresponding to a short side of the first collet and first protrusions corresponding to a second side of the first collet, And second projections corresponding to the short side of the second collet.

Description

[0001] The present invention relates to a die pick-up unit and a die bonding apparatus including the die pick-

Embodiments of the present invention relate to a die pick-up unit and a die bonding apparatus including the same. More particularly, the present invention relates to a die pick-up unit for picking up a die from a wafer and transferring the die for bonding on a substrate in a die bonding process, and a die bonding apparatus including the die pick-up unit.

Generally, in the die bonding process, a die pick-up unit for picking up and transferring the dies from a wafer to bond individualized dies to the substrate through a sawing process can be used. The die pick-up unit may include a collet for picking up the die using the vacuum and a pick-up head to which the collet is coupled.

In one example, the pick-up head and the collet may be coupled to each other using a magnetic force. The pick-up head may be provided with a pneumatic pipe for providing vacuum, and the collet may be provided with a plurality of suction holes connected to the pneumatic pipe to pick up the die.

The collet may have a substantially rectangular shape and the pick-up head may have a shape corresponding to the collet. The pick-up head may be provided with a permanent magnet for mounting the collet. The collet may include an upper hard pad made of a magnetic material, and a lower soft pad coupled to the upper hard pad to absorb the dies.

In recent years, as the thickness of the die has become very thin from about several to about a few micrometers, the die may be damaged if it is vacuum-sucked to pick up the die. To prevent this, . That is, the die is entirely brought into close contact with the lower surface of the lower soft pad, thereby preventing damage to the die.

Alternatively, the die may be separately provided on the lower surface of the lower soft pad to absorb the die. In this case, the die adsorption portion may have a substantially rectangular shape corresponding to the shape of the die, and may protrude from the lower surface of the lower soft pad.

When the lower soft pad or the die suction unit is configured to have a rectangular shape corresponding to the shape of the die to be bonded as described above, it may be required to replace the pickup head and the collet depending on the size or shape of the die to be bonded . However, since a considerable amount of time is required to replace the pick-up head and the collet, there is a possibility that the operating rate of the die-bonding apparatus is lowered.

It is an object of the present invention to provide a die pick-up unit capable of improving the operating rate of a die bonding apparatus.

Embodiments of the present invention have another object to provide a die bonding apparatus including the die pick-up unit as described above.

According to an aspect of the present invention, there is provided a die pick-up device including a pick-up head for picking up and transporting a die, and a first collet mounted on a lower portion of the pickup head for vacuum- Wherein the first collet may have a rectangular shape and the pick-up head has a plate shape and includes first protrusions corresponding to a short side of the first collet, And may include second protrusions corresponding to the short side of the second collet for mounting the second collet. At this time, the rectangle formed by the first protrusions and the rectangle formed by the second protrusions may be orthogonal to each other so that the pick-up head has a cross shape as a whole.

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According to embodiments of the present invention, the first and second protrusions may be provided with first and second guide members for guiding the mounting position of the first and second collets, respectively.

According to embodiments of the present invention, the first and second collets may include a plurality of suction holes, and the pickup head may be provided with a pneumatic pipe connected to the suction holes.

According to another aspect of the present invention, there is provided a die bonding apparatus comprising: a wafer stage for supporting a wafer divided into a plurality of dies; And a die transfer unit including a die pick-up unit for transferring the die. In this case, the die pick-up unit may include a pick-up head for picking up and transporting the die, a first collet for mounting the die by using a magnetic force at a lower portion of the pick-up head, Wherein the first collet has a rectangular shape and the pick-up head has a plate shape and includes first protrusions corresponding to the short sides of the first collet and second collets opposite to the first collet, And second projections corresponding to the short side of the second collet. In particular, the rectangle formed by the first projections and the rectangle formed by the second projections may be orthogonal to each other so that the pick-up head has a cross shape as a whole.

According to embodiments of the present invention, a buffer stage disposed on one side of the wafer stage and on which the picked-up die is placed may be further provided.

According to embodiments of the present invention, the buffer stage may include a chuck on which the picked-up die is placed and a panel on which the chuck is disposed. At this time, on the panel, first and second collet receiving grooves for accommodating a plurality of first and second collets may be provided for replacing the first and second collets.

According to embodiments of the present invention, the buffer stage may be provided with an opening formed through the pick-up head and the first or second collet so that the pickup head and the first Or for releasing the first or second collet from the pick-up head while restricting upward movement of the first or second collet while the second collet is moved downwardly through the opening and then moved upward, Respectively.

According to embodiments of the present invention, the first inner faces of the openings facing each other are provided with first engaging members for removing the first collet, and the second inner faces of the openings facing each other And second engaging members for removing the second collet may be provided, respectively.

According to the embodiments of the present invention as described above, the die pick-up unit for picking up the semiconductor die may include a pick-up head configured to be selectively mountable among the first and second collets so as to correspond to different kinds of dies. . &Lt; / RTI >

In particular, when the type of the die to be bonded changes, the first collet is removed from the pick-up head using the engagement members provided in the opening of the buffer stage, and then the second collet prepared on the buffer stage is mounted on the pick- It is possible to greatly shorten the time required for replacement between two collets.

As a result, since the time required for preparing the die-up unit can be greatly shortened in accordance with the change of the die type, the operation rate of the die-bonding apparatus including the die pick-up unit can be greatly improved.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a schematic block diagram illustrating a die bonding apparatus including a die pick-up unit according to an embodiment of the present invention; FIG.
2 is a schematic cross-sectional view for explaining a die-up unit.
3 is a schematic bottom view for explaining the pickup head.
4 is a schematic cross-sectional view for explaining a buffer stage in which a die picked up by a die pick-up unit is placed;
5 is a schematic plan view for explaining the buffer stage shown in FIG.

Hereinafter, a head replacement apparatus and a die bonding system including the head replacement apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

Fig. 1 is a schematic structural view for explaining a die bonding apparatus including a die pick-up unit according to an embodiment of the present invention, Fig. 2 is a schematic sectional view for explaining a die pick-up unit, And FIG.

1 to 3, a die pick-up unit 200 according to an embodiment of the present invention and a die bonding apparatus 100 including the die pick-up unit 200 pick up a die 20 from a wafer 10, ). &Lt; / RTI >

The die bonding apparatus 100 may include a die transfer section 102 for picking up and transferring the die 20 from the wafer 10 divided into a plurality of dies 20. [ The die transfer unit 102 may include a drive unit 104 for moving the die pick-up unit 200 and the die pick-up unit 200.

The wafer 10 may be provided with the plurality of dies 20 attached to the dicing tape 30. For example, the dicing tape 30 may be mounted on a mounting ring 40 of a generally circular ring shape, and the die bonding apparatus 100 may include a wafer stage 110 for supporting the wafer 10, . &Lt; / RTI >

A clamp 112 for holding the mounting frame 40 may be provided on the wafer stage 110 and the dicing tape 30 may be provided on the wafer stage 110. The dicing tape 30 may be provided on the wafer stage 110, Lt; / RTI > Particularly, the extension ring 114 can support the edge portion of the dicing tape 30 between the wafer 10 and the mounting frame 40. The clamp 112 supports the dicing tape 30, The mounting frame 40 can be moved downward to expand the mounting frame 40. [ Although not shown in detail, a clamp driving unit (not shown) for moving the clamp 112 in the vertical direction may be mounted on the wafer stage 110, The distance between the first and second electrodes 20 can be enlarged.

A lower portion of the wafer stage 110 may be provided with a die ejector 120 for selectively lifting the dies 20 to separate the dies 20 from the dicing tape 30, The die 20 lifted by the die ejector 120 can be picked up by the die feeder 102 and then transported. To this end, the wafer stage 110 may have an opening for operation of the die ejector 120, as shown.

4 is a schematic cross-sectional view for explaining a buffer stage in which a die picked up by the die pick-up unit is placed, and Fig. 5 is a schematic plan view for explaining the buffer stage shown in Fig.

4 and 5, a buffer stage 130 on which a die 20 picked up by the die pick-up unit 200 is placed may be disposed on one side of the wafer stage 110. The buffer stage 130 may be used for alignment of the die 20 separated from the wafer 10. In particular, the buffer stage 130 may be moved horizontally by a separate driving unit 132 and may be configured to be rotatable. For example, the die 20 supported on the buffer stage 130 may be imaged through an upper camera (not shown) and the buffer stage 130 may use the image to position the die 20, Can be performed. The buffer stage 130 may be positioned on a side of the wafer stage 110 after the die 20 is placed on the wafer stage 110 for bonding the die 20, And may be moved by the driving unit 132 so as to be adjacent to the area.

The buffer stage 130 may include a chuck 134 on which the die 20 is placed and a panel 136 on which the chuck 134 is disposed. For example, the panel 136 may have a circular disk shape, and the chuck 134 may be disposed at a central portion of the panel 136.

Although not shown, the die bonding apparatus 100 may include a substrate transfer unit (not shown) for transferring the substrate, and the die 20 is bonded onto the substrate transferred by the substrate transfer unit. . The die bonding region may be located on the transport path of the substrate.

1 to 3, the die transfer part 102 can transfer the die 20 from the wafer 10 onto the chuck 134 of the buffer stage 130, The die 20 can be transferred from the die 134 to the substrate. According to another embodiment of the present invention, the die transferring portion 102 includes a first die transferring portion for transferring the die 20 from the wafer 10 onto the chuck 134, And a second die transfer portion for transferring the die 20 onto the substrate.

The die pick-up unit 200 may include a pick-up head 210 and a first collet 230 mounted on the pick-up head 210. The first collet 230 may be mounted to the pick-up head 210 using a magnetic force and a plurality of suction holes 232 for sucking the die 20 may be provided . In response to this, the pick-up head 210 may be provided with a pneumatic piping 212 for providing a vacuum to the suction holes 232. Although not shown, the pneumatic piping 212 is connected to a vacuum system Lt; / RTI >

The first collet 230 may have a substantially rectangular shape and may include a hard top pad 234 and a soft bottom pad 236. The suction holes 232 for sucking the die 20 may be provided through the upper pad 234 and the lower pad 236 and may be connected to the pneumatic piping 212 of the pick- Grooves connecting the suction holes 232 and the pneumatic piping 212 may be formed on the upper surface of the upper pad 234 for connection.

The pick-up head 210 and the first collet 230 may be coupled by a magnetic force. For example, as shown in the figure, the pickup head 210 may include a permanent magnet 214, and the upper pad 234 may be formed of a magnetic material.

According to an embodiment of the present invention, a die suction part 238 may be provided on the lower surface of the lower pad 236. The die adsorption part 238 may be configured to be substantially the same as the size and shape of the die to be picked up, and the adsorption holes 232 may be formed through the lower surface of the die adsorption part 238.

The pick-up head 210 may have a plate shape and may have first protrusions 216 corresponding to the short side of the first collet 230. The first protrusions 216 may have a shape opposite to that of the first protrusions 216. The first protrusions 216 may have a first guide 230 for guiding a mounting position of the first collet 230, Members 218 may be provided.

According to one embodiment of the present invention, the pick-up head 210 may have second protrusions 222 for mounting a second collet 250 (see FIG. 5) different from the first collet 230 . That is, when the type and / or size of the die to be bonded changes, that is, when the type of the die to be bonded changes, it is necessary to replace the first collet 230 with the second collet 250. In this case, The pick-up head 210 can be configured to replace the first collet 230 with the second collet 250 without replacing the head 210.

The second protrusions 222 may be formed to correspond to the short sides of the second collet 250 and the second collets 250 may be formed at the lower edge portions of the second protrusions 222. [ And second guide members 224 for guiding the mounting position of the first guide member 224.

According to an embodiment of the present invention, the direction in which the first collet 230 is mounted and the direction in which the second collet 250 is mounted may be perpendicular to each other. That is, the rectangle formed by the first protrusions 216 and the rectangle formed by the second protrusions 222 may be orthogonal to each other, and the pickup head 210 may have a cross shape as a whole.

4 and 5, a panel 136 of the buffer stage 130 is provided with a collet removing part 140 for removing the first and second collets 230 and 250, First and second collet receiving grooves 150 and 152 for accommodating the plurality of first collets 230 and the second collets 250 may be provided for the replacement of the first and second collets 230 and 250, respectively. In one example, the collet removing part 140 and the first and second collet receiving grooves 150 and 152 may be disposed in the circumferential direction of the panel 136.

The collet removing unit 140 removes the opening 142 and the opening 142 formed in the panel 136 such that the pickup head 210 and the first collet 230 or the second collet 250 can pass therethrough. And first and second engaging members 144 and 146 provided on the inner surfaces of the first and second collets 230 and 250 to remove the first and second collets 230 and 250. The first and second latching members 144 and 146 are positioned in a position where the pickup head 210 and the first collet 230 or the second collet 250 are moved downward through the opening 142, The first collet 230 or the second collet 250 may be removed from the pick-up head 210 by restricting upward movement of the first collet 230 or the second collet 250 during movement.

Although not shown in detail, the first locking members 144 are rotated downward by a spring (not shown), for example, a coil spring or a torsion spring, on the inner surfaces of the openings 142 facing each other As shown in FIG. That is, the first latching members 144 may be rotated downward so that the first collet 230 can be moved downward. However, after the first collet 230 is passed downward, Position of the first collet 230 to limit upward movement of the first collet 230.

The second latching members 146 may be mounted on the other inner side surfaces of the opening 142 facing each other and may be substantially the same as the first latching members 144. Alternatively, the first and second locking members 144 and 146 may be installed to be movable from the inner side surfaces of the opening 142 by using a spring.

3, the first and second protrusions 216 and 222 of the pick-up head 210 may have first and second recesses 220 and 226, respectively, And the first engagement members 144 and the second engagement members 186 are connected to each other by the first and second recesses 220 and 226 in the vertical movement of the pickup head 210 through the opening 142, Interference with the second latching members 146 can be prevented.

Also, unlike the above, the collet removing unit 140 may be configured to remove both the first collet 230 and the second collet 250 using only a pair of latching members, A container 160 for recovering the first collet 230 and / or the second collet 250 removed from the pick-up head 210 may be disposed under the first collet 142. The method of removing and replacing the collet as described above has been described in detail in Korean Patent Application No. 10-2012-0121573 and No. 10-2012-0121592 filed by the present applicant, .

According to the embodiments of the present invention as described above, the die pick-up unit 200 for picking up the semiconductor die 20 may include a first and a second collets 230 and 250 And a pick-up head 210 configured to be selectively mountable.

The first collet 230 is removed from the pick-up head 210 by using the latch members 144 and 146 provided in the opening 142 of the buffer stage 130 when the type of the die to be bonded is changed, The time required for replacing the first and second collets 230 and 250 can be significantly shortened by mounting the second collet 250 on the pickup head 210. [

As a result, since the time required for preparing the die-up unit 200 can be greatly shortened according to the type of die, the operation rate of the die-bonding apparatus 100 including the die pick-up unit 200 is greatly improved .

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

10: wafer 20: die
100: Die bonding device 110: Wafer stage
120: Die ejector 130: Buffer stage
140: Collet removing unit 142: opening
144, 146: engaging members 150, 152: collet storing grooves
200: die pick-up unit 210: pickup head
230: first collet 250: second collet

Claims

A pick-up unit comprising a pick-up head for picking up and transporting a die, and a first collet mounted on a lower portion of the pickup head for picking up the die using vacuum,
The first collet has a rectangular shape,
Wherein the pick-up head has a plate shape and is provided with first projections corresponding to a short side of the first collet and a first projection corresponding to a short side of the second collet in order to mount a second collet of a rectangular shape different from the first collet The second protrusions being formed on the first protrusions,
Wherein a rectangle formed by the first projections and a rectangle formed by the second projections are orthogonal to each other so that the pickup head has a cross shape as a whole.

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[2] The die pick-up unit of claim 1, wherein the first and second protrusions are provided with first and second guide members for guiding the mounting position of the first and second collets, respectively.

The die pick-up unit of claim 1, wherein the first and second collets are provided with a plurality of suction holes, and the pickup head is provided with a pneumatic pipe connected to the suction holes.

A wafer stage for supporting a wafer divided into a plurality of dies; And
A die transfer unit including a die pick-up unit for selectively picking up the dies and transferring the die to bond the picked die onto a substrate,
Wherein the die pick-up unit includes a pick-up head for picking up and transporting the die, and a first collet for mounting the die by using a magnetic force at a lower portion of the pick-up head,
The first collet having a rectangular shape,
Wherein the pick-up head has a plate shape and includes first projections corresponding to a short side of the first collet, and a second collet corresponding to a short side of the second collet for mounting a second collet of a rectangular shape different from the first collet The second protrusions being formed on the first protrusions,
Wherein a rectangle formed by the first projections and a rectangle formed by the second projections are orthogonal to each other so that the pick-up head has a cross shape as a whole.

6. The die bonding apparatus of claim 5, further comprising a buffer stage disposed on one side of the wafer stage and on which the picked-up die is placed.

7. The apparatus of claim 6, wherein the buffer stage includes a chuck on which the picked-up die is placed and a panel on which the chuck is disposed,
Wherein the first and second collet receiving grooves are provided on the panel for accommodating a plurality of first and second collets for replacement of the first and second collets.

[8] The apparatus of claim 7, wherein the buffer stage is provided with an opening through which the pick-up head and the first or second collet can pass, and the inner surface of the opening has the pickup head and the first or second collet And an engaging member for separating the first or second collet from the pick-up head by restricting upward movement of the first or second collet while being moved downward through the opening and then moving upward. .

9. The device of claim 8, wherein the first inner side surfaces of the openings are provided with first engagement members for respectively removing the first collet, And second engaging members for removing the collet are provided, respectively.