KR102284149B1 - Apparatus for ejecting a die - Google Patents

Abstract

A die ejecting apparatus is disclosed. The apparatus comprises: a first ejector having a first chamber having an upper area smaller than a die attached to a dicing tape and an open top; and a second ejector disposed in the first chamber and having a plurality of air holes. a unit; an opening into which the ejecting unit is vertically inserted; a hood provided around the opening and having a plurality of vacuum holes for adsorbing the dicing tape; 2 A main body including a driving unit for raising the ejecting unit so that the second ejector is raised higher than the first ejector, and the die through a gap between the air holes and the vacuum holes and the first ejector and the second ejector and a pressure adjusting unit for providing negative pressure to the lower surface of the dicing tape and then providing positive pressure to the lower surface of the dicing tape through the air holes.

Description

Die ejecting device {Apparatus for ejecting a die}

Embodiments of the present invention relate to a die ejecting apparatus. More particularly, it relates to a die ejecting apparatus for separating dies from a dicing tape in order to bond the dies onto a substrate in a semiconductor manufacturing process.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes. A wafer on which the semiconductor devices are formed may be divided into a plurality of dies through a dicing process, and the dies may be bonded to a substrate through a bonding process.

The apparatus for performing the die bonding process may include a pickup module for picking up and separating the dies from the wafer divided into the dies, and a bonding module for attaching the picked up die to a substrate. The pickup module includes a stage unit supporting the wafer ring to which the wafer is attached, an ejecting device movably installed in a vertical direction to selectively separate a die from a wafer supported on the stage unit, and pick up the die from the wafer It may include a pickup unit for attaching to the substrate.

In general, the die ejecting device includes an ejecting unit for pushing up the die in a vertical direction to separate the die from a dicing tape, a hood accommodating the ejecting unit, and a hood for vertically moving the ejecting unit It may include a driving unit and a main body accommodating the driving unit. Examples of the die ejecting device as described above are disclosed in Korean Patent No. 10-0975500 and Korean Patent Application Laid-Open No. 10-2009-0108447.

However, as the size of the die formed on the wafer has recently become very diverse and the thickness has gradually decreased, a new type of die ejecting method and apparatus is required in order to cope with this. For example, in the case of a large die having a thickness of several tens of μm and a size of about 7×7 mm or more, the die may be damaged or the pickup may be damaged in the die ejecting process because the adhesive force between the die and the dicing tape is relatively large. A pickup failure that is not picked up by the unit may occur.

SUMMARY Embodiments of the present invention have an object to provide a new type of die ejecting apparatus capable of solving problems such as damage to the die and defective pickup in a die ejecting process for a large die.

According to embodiments of the present invention for achieving the above object, a die ejecting apparatus includes a first ejector having a smaller upper area than a die attached to a dicing tape and a first chamber with an open upper portion, and the first chamber An ejecting unit disposed therein and including a second ejector having a plurality of air holes, an opening into which the ejecting unit is inserted in a vertical direction and a plurality of vacuum holes provided around the opening for adsorbing the dicing tape a body including a hood having a hood, a driving unit coupled to the hood and the ejecting unit and raising the ejecting unit so that the second ejector is raised higher than the first ejector, the air holes and the vacuum hole and a pressure adjusting unit that provides negative pressure to the lower surface of the dicing tape through the gap between the first ejector and the second ejector and then provides positive pressure to the lower surface of the dicing tape through the air holes. can

According to embodiments of the present disclosure, the first ejector includes a first ejecting member having the first chamber, a through hole connected to a lower portion of the first ejecting member and communicating in a vertical direction with the first chamber may include a first support member having a hole formed therein, wherein the second ejector includes a second ejecting member having the air holes and a second chamber communicating with the air holes, and below the first support member It may include a second support member disposed and connected to the lower portion of the second ejecting member. In this case, the second ejecting member may be disposed in the first chamber of the first ejecting member and the through hole of the first support member.

According to embodiments of the present invention, the first ejecting member may have a shape of a square tube with an open top, and the second ejecting member may have a shape of a square tube with a closed top. The air holes may be formed in a closed upper portion of the second ejecting member.

According to embodiments of the present invention, the first and second ejecting members may be inserted into the opening of the hood, and outer edge portions of the first and second ejecting members may be chamfered in a round shape. .

According to embodiments of the present invention, a plurality of vacuum slots may be provided on the inner surface of the first ejecting member or the outer surface of the second ejecting member to provide the negative pressure.

According to embodiments of the present invention, a plurality of vacuum slots may be provided on the outer surface of the first ejecting member to provide the negative pressure.

According to embodiments of the present invention, each of the first support member and the second support member may have a disk shape, and an elastic member may be disposed between the first support member and the second support member.

According to embodiments of the present invention, the air holes may be formed to be inclined upward and outward with respect to the central axis of the ejecting unit.

According to embodiments of the present invention, the hood may include an upper panel having the opening and vacuum holes, and a housing extending downward from an edge of the upper panel and coupled to the main body, and the vacuum hole The chamber may communicate with a third chamber defined by the upper panel and the housing, and the ejecting unit may be disposed inside the hood.

According to embodiments of the present invention, at least one vacuum channel connecting some of the vacuum holes adjacent to the opening may be provided on the upper surface of the upper panel.

According to the embodiments of the present invention as described above, the die ejecting apparatus may include a hood having vacuum holes and openings, and an ejecting unit disposed in the hood. The ejecting unit may include a first ejector inserted into the opening and having a first chamber with an open top, and a second ejector disposed in the first chamber and having an upper structure in which air holes are formed. The first ejector and the second ejector may be raised together, and then the second ejector may be raised higher than the first ejector.

In particular, by providing a negative pressure through a first gap between the vacuum holes and the first and second ejectors and a second gap between the opening and the first ejector, the dicing tape can be firmly adsorbed. , thus, the edge portion of the die may be more easily separated from the dicing tape by raising the first and second ejectors.

In addition, the steps of providing the negative pressure, raising the first ejector and the second ejector, raising the second ejector higher than the first ejector, and providing positive pressure through the air holes By doing so, it is possible to sequentially separate between the die and the dicing tape from the edge portion of the die toward the center portion.

Accordingly, the die may be easily picked up in the subsequent die pick-up step, and as a result, the pick-up defect of the die may be greatly reduced.

1 is a schematic configuration diagram for explaining a die ejecting apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view illustrating the die ejecting apparatus shown in FIG. 1 .
FIG. 3 is a schematic plan view for explaining the hood shown in FIG. 2 .
FIG. 4 is a schematic plan view for explaining the ejecting unit and the hood shown in FIG. 2 .
5 is a schematic cross-sectional view for explaining the ejecting unit shown in FIG.
FIG. 6 is a schematic plan view for explaining the first ejecting member and the second ejecting member shown in FIG. 2 .
7 is a schematic plan view for explaining another example of the first ejecting member and the second ejecting member shown in FIG. 2 .
8 to 12 are schematic cross-sectional views for explaining a method of ejecting a die using the die ejecting apparatus shown in FIG. 2 .

Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings showing embodiments of the present invention. However, the present invention should not be construed as being limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the present invention to those skilled in the art, rather than to enable the present invention to be fully completed.

Where an element is described as disposed or connected to another element or layer, the element may be directly disposed or connected to the other element, with other elements or layers interposed therebetween. may be Alternatively, when one element is described as being directly disposed on or connected to another element, there cannot be another element between them. Although the terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and/or portions, the items are not limited by these terms. will not

The terminology used below is only used for the purpose of describing specific embodiments, and is not intended to limit the present invention. In addition, unless otherwise limited, all terms including technical and scientific terms have the same meaning as understood by one of ordinary skill in the art of the present invention. The above terms, such as those defined in conventional dictionaries, shall be interpreted as having meanings consistent with their meanings in the context of the relevant art and description of the present invention, ideally or excessively outwardly intuitive, unless clearly defined. will not be interpreted.

Embodiments of the present invention are described with reference to schematic diagrams of ideal embodiments of the present invention. Accordingly, changes from the shapes of the diagrams, eg, changes in manufacturing methods and/or tolerances, are those that can be fully expected. Accordingly, the embodiments of the present invention are not to be described as being limited to the specific shapes of the areas illustrated as diagrams, but rather to include deviations in the shapes, and the areas described in the drawings are entirely schematic and their shapes It is not intended to describe the precise shape of the silver region, nor is it intended to limit the scope of the present invention.

1 is a schematic configuration diagram for explaining a die ejecting apparatus according to an embodiment of the present invention.

Referring to FIG. 1 , a die ejecting apparatus 100 according to an embodiment of the present invention separates the dies 20 from a wafer 10 including a plurality of dies 20 to form a lead frame or a printed circuit. It can be preferably used in a die bonding process for bonding on a substrate such as a substrate. The wafer 10 may be divided into a plurality of dies 20 through a dicing process, and may be provided while being attached to a dicing tape 32 . In this case, the dicing tape 32 may be mounted on a mount frame 30 having a larger diameter than the wafer 10 .

The mount frame 30 may be gripped by a clamp 42 disposed on the stage 40 , and the edge portion of the dicing tape 32 is an expansion ring 44 disposed on the stage 40 . can be supported by The clamp 42 may move the mount frame 30 vertically downward to expand the dicing tape 32 , whereby the dicing tape 32 is expanded by the expansion ring 44 . can be As a result, the gap between the dies 20 attached to the dicing tape 32 may be extended.

A die ejecting device 100 for selectively raising the dies 20 in order to separate the dies 20 from the dicing tape 32 may be provided at a lower portion of the stage 40 , , a pickup device 50 for picking up the die 20 raised by the die ejecting device 100 may be provided on an upper portion of the stage 40 .

The die ejecting apparatus 100 may be used to eject the dies 20 from the dicing tape 32 .

FIG. 2 is a schematic cross-sectional view for explaining the die ejecting apparatus shown in FIG. 1 , and FIG. 3 is a schematic plan view for explaining the hood shown in FIG. 2 . FIG. 4 is a schematic plan view for explaining the ejecting unit and the hood shown in FIG. 2 , and FIG. 5 is a schematic cross-sectional view for explaining the ejecting unit shown in FIG. 2 .

2 to 5 , the die ejecting apparatus 100 according to an embodiment of the present invention includes an ejecting unit 110 for pushing up the dies 20 upward, and the ejecting unit ( It may include a hood 120 accommodating the 110 , and a body 140 including a first driving unit 130 for vertically moving the ejecting unit 110 .

The hood 120 may have an opening 126 into which the ejecting unit 120 is vertically inserted and a plurality of vacuum holes 128 formed around the opening 126 .

The ejecting unit 110 is movable in the vertical direction by the first driving unit 130 , and for this purpose, the first driving unit 130 is disposed inside the main body 140 and the ejecting unit 110 . It is coupled to and may include a driving shaft 134 for transmitting a driving force. In this case, a head 132 coupled to the ejecting unit 110 may be provided at an upper portion of the driving shaft 134 .

Although not shown, the first driving unit 130 may include a power supply unit (not shown) for providing the driving force, and the power supply unit may include a motor, a cylinder, a power transmission element, etc. can be configured in this way. As an example, the power providing unit may be configured using a motor providing a rotational force, a cam plate mounted on a rotation shaft of the motor, and a roller coupled to a lower portion of the drive shaft so as to be in close contact with the cam plate.

The ejecting unit 110 may include a first ejector 112 and a second ejector 114 . The first ejector 112 may have a smaller upper area than that of the die 20 attached to the dicing tape 32 and a first chamber 112A having an open upper portion, and the second ejector 114 may include It may have a second chamber 114A disposed in the first chamber 112A and having an upper portion closed.

The ejecting unit 110 may push up one of the dies 20 upward in order to selectively eject one of the dies 20 . According to an embodiment of the present invention, the first ejector 112 is connected to a first ejecting member 112B having the first chamber 112A and a lower portion of the first ejecting member 112B. A first support member 112C may be included, and the second ejector 114 may include a second ejecting member 114B having the second chamber 114A, and the second ejecting member 114B. It may include a second support member 114C connected to the lower portion.

As an example, the first ejecting member 112B may have a tube shape, for example, a square tube shape with an open top, and the second ejecting member 114B may be formed in the first chamber 112A. It may have a tube shape disposed therein, for example, a rectangular tube shape with a closed top. Also, a first through hole 112D communicating with the first chamber 112A may be provided in the first support member 112C, and the second chamber 114A in the second support member 114C. A second through-hole 114D communicating with the .

The second ejecting member 114B may be disposed in the first through hole 112D of the first chamber 112A and the first support member 112C, and the second support member 114C may be The first support member 112C may be disposed to be spaced apart from each other by a predetermined distance. As an example, each of the first and second support members 112C and 114C may have a disk shape.

The second support member 114C may be coupled to the head 132 of the first driving unit 130 . In this case, a permanent magnet 136 may be provided on the head 132 of the first driving unit 130 , and the second support member 114C may be provided with the head 132 by the magnetic force of the permanent magnet 136 . ) is preferably made of a magnetic material so that it can be mounted on.

The first ejecting member 112B and the second ejecting member 114B may be positioned in the opening 126 of the hood 120 and upwardly from the hood 120 by the first driving unit 130 . can be moved to protrude. In this case, the opening 126 may have a rectangular shape, and an upper area of the first ejector 112 , that is, an upper area of the first ejecting member 112B may be smaller than the die 20 . .

In particular, according to an embodiment of the present invention, the second ejecting member 114B may have a rectangular tube shape with a closed upper portion, and negative pressure and positive pressure on the lower surface of the dicing tape 32 at the closed upper portion. Air holes 116 communicating with the second chamber 114A may be provided to provide

The air holes 116 are preferably formed to be inclined upward and outward with respect to the central axis of the ejecting unit 110 so that separation can proceed from the edge portion of the die 20 toward the center portion.

Meanwhile, the first driving unit 130 may lift the ejecting unit 110 so that the second ejector 114 is raised higher than the first ejector 112 . In particular, the first and second ejectors 112 and 114 may be simultaneously raised by the first driving unit 130 , and then the first ejector 112 may be stopped and the second ejector 114 . It can only be raised alone.

According to an embodiment of the present invention, elastic members 118 such as coil springs may be disposed between the first support member 112C and the second support member 114C. That is, the first ejector 112 may be elastically supported on the second support member 114C of the second ejector 114 by the elastic members 118 .

Also, although not shown, a first stopper (not shown) for limiting the elevation of the first ejector 112 may be disposed between the hood 120 and the first ejector 112 . A second stopper (not shown) for limiting the elevation height of the second ejector 114 may be disposed between the first ejector 112 and the second ejector 114 . For example, the first stopper may be disposed between the upper panel 122 of the hood 120 and the first support member 112C, and the second stopper may be disposed between the first support member 112C and the first support member 112C. It may be disposed between the second support members 114C.

The hood 120 includes an upper panel 122 provided with the opening 126 and vacuum holes 128 , and a housing that extends downward from an edge of the upper panel 122 and is coupled to the body 140 . 124) may be included. As an example, the upper panel 122 may have a circular disk shape, and the housing 124 may have a circular tube shape with an open bottom.

That is, the hood 120 may include a third chamber 121 defined by the upper panel 122 and the housing 124 . 120) may be disposed inside.

In particular, as described above, the first ejecting member 112B and the second ejecting member 112B may be disposed in the opening 126 , and the first support member 112C and the second support member 114C may be disposed in the opening 126 . ) may be disposed in the third chamber 121 . In addition, the open lower portion of the housing 124 may be coupled to the main body 140 , and the head 132 and the driving shaft 134 of the driving unit 130 may be vertically moved inside the main body 140 . can In particular, the main body 140 may have a circular tube shape, and an upper portion of the main body 140 may be inserted into a lower portion of the housing 124 .

According to an embodiment of the present invention, although not shown, the die ejecting apparatus 100 is for adhering the hood 120 and the ejecting unit 110 to the lower surface of the dicing tape 32 . A second driving unit (not shown) may be included. The second driving unit may have an approximately Cartesian coordinate robot shape, and horizontally moves the ejecting unit 110 , the hood 120 , and the main body 140 to select one of the dies 20 . Also, in order to eject the selected die 20, the ejecting unit 110, the hood 120, and the main body 140 are raised to cover the upper surface of the hood 120 with the dicing tape. (32) can be adhered to the lower surface.

In addition, according to an embodiment of the present invention, the die ejecting apparatus 100 is disposed between the air holes 116 and the vacuum holes 128 and the first ejector 112 and the second ejector 114 . A pressure adjusting unit 150 for providing negative pressure to the lower surface of the dicing tape 32 through the first gap of ) may be included.

In particular, the pressure adjusting unit 150 may provide a negative pressure to the lower surface of the dicing tape 32 positioned on the ejecting unit 110 through the air holes 116 . In addition, the vacuum holes 128 of the hood 120 , a first gap between the first ejector 112 and the second ejector 114 , and between the first ejector 112 and the opening 126 . A negative pressure may be provided to the lower surface of the dicing tape 32 through the second gap of .

The pressure adjusting unit 150 is connected to a vacuum source 164 such as a vacuum pump and is connected to a first pipe 152 for providing a negative pressure inside the second chamber 114A, and to the first pipe 152 . The dicing tape 32 is connected to the provided first valve 154 , the vacuum source 164 , and through the third chamber 121 , the vacuum holes 128 , and the first and second gaps. a second pipe 156 for applying a negative pressure to the lower surface of the A third pipe 160 connected to the first pipe 152 and a third valve 162 provided in the third pipe 160 may be included in order to provide a positive pressure thereto.

Although not shown in detail, the first pipe 152 may be connected to the driving shaft 134 , and the second pipe 156 may be connected to the main body 140 . In addition, although not shown, the operation of the first, second, and third valves 154, 158, and 162 may be controlled by a controller (not shown), and the compressed air source 166 is an air pump and a compressed air tank. and so on.

Meanwhile, negative pressure and positive pressure may be provided to the inside of the second chamber 114A through the driving shaft 134 and the second through hole 114D. To this end, the driving shaft 134 may have a hollow, and the head 132 may be provided with a third through hole connecting the hollow of the driving shaft 134 and the second through hole 114D.

According to one embodiment of the present invention, the first ejecting member 112B is smaller than the die 20 in order to eject the large die 20 having a relatively large size from the dicing tape 32 . It may have the form of a square tube with an upper area. For example, when the first ejecting member 112B is in close contact with the lower surface of the dicing tape 32 , an edge portion of the die 20 positioned outside the first ejecting member 112B It is preferable that the width is about 0.5 to 1.5 mm.

As a result, in the ejection process of the die 20, the die 20 is moved upward by the first ejecting member 112B and the second ejecting member 114B having a rectangular ring-shaped upper surface. Damage to the die 20 by the ejecting unit 110 may be prevented.

FIG. 6 is a schematic plan view for explaining the first ejecting member and the second ejecting member shown in FIG. 2 , and FIG. 7 is another example of the first ejecting member and the second ejecting member shown in FIG. 2 . It is a schematic plan view for explaining.

According to an embodiment of the present invention, as shown in FIG. 6 , the first ejecting member ( The first and second corner portions 112E and 114E of the outer surfaces of the 112B and the second ejecting member 114B may be chamfered. In particular, in order to prevent damage to the dicing tape 32 , the first and second edge portions 112E and 114E of the outer surfaces of the first ejecting member 112B and the second ejecting member 114B are It is preferable to be chamfered in a round shape.

In addition, as shown in FIG. 7 , first and second vacuum slots 112F and 114F extending in a vertical direction are provided on outer surfaces of the first ejecting member 112B and the second ejecting member 114B. ) may be provided. Unlike the above, second vacuum slots may be provided on the inner surface of the first ejecting member 112B.

Thus, the die through the first gap between the first ejecting member 112B and the second ejecting member 114B and the second gap between the opening 126 and the first ejecting member 112B A vacuum can be easily provided on the lower surface of the dicing tape 32 , and thus the dicing tape 32 can be easily separated from the edge of the die 20 .

8 to 12 are schematic cross-sectional views for explaining a method of ejecting a die using the die ejecting apparatus shown in FIG. 2 .

Hereinafter, a method of selectively ejecting the die 20 using the die ejecting apparatus 100 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, as shown in FIGS. 8 and 9 , the upper surface of the hood 120 and the upper surface of the ejecting unit 110 are in close contact with the lower surface of the dicing tape 32 . In this case, the upper surface of the hood 120 may be in close contact with the lower surface of the dicing tape 32 by the second driving unit, and the upper surface of the ejecting unit 110 may be connected to the first driving unit 130 . by the dicing tape 32 may be in close contact with the lower surface of the dicing tape 32 . However, both the upper surface of the hood 120 and the upper surface of the ejecting unit 110 are in close contact with the lower surface of the dicing tape 32 by the second driving unit. The height may be pre-adjusted.

Subsequently, a negative pressure may be applied to the inside of the second chamber 114A and the third chamber 121 . In particular, the hood 120 through the air holes 116 communicating with the second chamber 114A, the vacuum holes 128 communicating with the third chamber 121 and the first and second gaps. A dicing tape 32 positioned on the upper portion of the hood may be vacuum-adsorbed to the hood 32 and upper surfaces of the first and second ejecting members 112B and 114B.

Specifically, the first valve 154 and the second valve 158 may be opened, and accordingly, the negative pressure may be provided to the second chamber 114A and the third chamber 121 . As a result, the negative pressure may be applied to the lower surface of the dicing tape 32 through the air holes 116 , the vacuum holes 128 , and the first and second gaps.

10 and 11 , the ejecting unit 110 may be raised by the first driving unit 130 , whereby the first ejecting member 112B and the second ejecting member 114B may be raised. ) may protrude from the hood 120 to a predetermined height. Subsequently, the raising of the first ejecting member 112B may be stopped by the first stopper, and the second ejecting member 114B may be raised until limited by the second stopper.

As a result, an edge portion of the die 20 may be sequentially separated from the dicing tape 32 by the first ejecting member 112B and the second ejecting member 114B. At this time, the dicing tape 32 around the die 20 is applied to the hood 120 by the negative pressure provided through the air holes 116 and the vacuum holes 128 and the first and second gaps. ) and the first ejecting member 112B and the second ejecting member 114B, the edge portion of the die 20 may be easily separated from the dicing tape 32 .

Subsequently, as shown in FIG. 12 , positive pressure is provided through the second chamber 114A and the air holes 116 to inflate the dicing tape 32 upward to lift the die 20 . It can be sufficiently separated from the dicing tape 32 . In this case, the controller may close the first valve 154 and open the third valve 162 to provide compressed air into the second chamber 114A.

As described above, after the die 20 is sufficiently separated from the dicing tape 32 , the pickup device 50 can easily pick up the die 20 by a vacuum suction method. That is, through the steps of providing negative pressure through the second chamber 114A and the third chamber 121 , raising the ejecting unit 110 , and providing positive pressure through the second chamber 114A, the Since only the central portion of the die 20 is partially attached to the dicing tape 32 , the pickup of the die 20 by the pickup device 50 may be more stably performed.

In particular, since the die 20 can be sufficiently raised by providing a positive pressure in the second chamber 114A, a sufficient distance between the pickup device 50 and the die ejecting device 100 can be secured. . As a result, damage to the die 20 by the pickup device 50 in the process of ejecting the die 20 can be sufficiently prevented.

Meanwhile, in order to improve the adsorption force for the dicing tape 32 , as shown in FIG. 3 , the upper panel 122 has a partial vacuum adjacent to the opening 126 among the vacuum holes 128 . Vacuum channels 129 connecting the holes 128 to each other may be provided.

According to the embodiments of the present invention as described above, the die ejecting apparatus 100 includes a hood 120 having vacuum holes 128 and an opening 126 , and an ejecting device disposed in the hood 120 . It may include a unit 110 . The ejecting unit 110 is inserted into the opening 126 and is disposed in a first ejector 112 having a first chamber 112A having an open top and air holes 116 in the first chamber 112A. ) may include a second ejector 114 having an upper structure formed therein. The first ejector 112 and the second ejector 114 may be raised together, and then the second ejector 114 may be raised higher than the first ejector 112 .

In particular, the negative pressure through the first gap between the vacuum holes 128 and the first and second ejectors 112 and 114 and the second gap between the opening 126 and the first ejector 112 , etc. The dicing tape 32 can be firmly adsorbed by providing (32) can be more easily separated.

In addition, the steps of providing the negative pressure, raising the first ejector 112 and the second ejector 114 , and raising the second ejector 114 higher than the first ejector 112 . and providing positive pressure through the air holes 116 to sequentially separate between the die 20 and the dicing tape 32 from the edge portion of the die 20 toward the center portion. can do.

Accordingly, in the subsequent die pickup step, the die 20 can be easily picked up, and as a result, pickup failure of the die 20 can be greatly reduced.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that it can be done.

10: wafer 20: die
32: dicing tape 100: die ejecting device
110: ejecting unit 112: first ejector
112A: first chamber 112B: first ejecting member
112C: first support member 112D: first through hole
112E: first edge 112F: first vacuum slot
114: second ejector 114A: second chamber
114B: second ejecting member 114C: second support member
114D: second through hole 114E: second edge
114F: second vacuum slot 116: air hole
118: elastic member 120: hood
122: upper panel 124: housing
126: opening 128: vacuum hole
130: driving unit 140: body
150: pressure control unit 164: vacuum source
166: compressed air source

Claims (10)

A first ejector having an upper area smaller than that of a die attached to a dicing tape and a first chamber having an open upper portion, a second chamber disposed in the first chamber and having a closed upper portion, and a plurality of air holes communicating with the second chamber an ejecting unit comprising a second ejector having
a hood having an opening into which the ejecting unit is vertically inserted and a hood provided around the opening and having a plurality of vacuum holes for adsorbing the dicing tape;
a body coupled to the hood and the ejecting unit and including a driving unit for raising the ejecting unit so that the second ejector is raised higher than the first ejector; and
A negative pressure is applied to the lower surface of the dicing tape through the air holes and the vacuum holes and a gap between the first ejector and the second ejector, and then positive pressure is applied to the lower surface of the dicing tape through the air holes. Including a pressure control unit to provide,
The first ejector includes a first ejecting member having a square tube shape with an open top to provide the first chamber, and the second ejector includes a square tube shape with a closed top to provide the second chamber. and a second ejecting member having The method of claim 1, wherein the first ejector further comprises a first support member connected to a lower portion of the first ejecting member and having a through hole communicating with the first chamber in a vertical direction,
The second ejector further includes a second support member disposed under the first support member and connected to a lower portion of the second ejecting member,
The second ejecting member is disposed in the first chamber of the first ejecting member and the through hole of the first support member. delete The die according to claim 2, wherein the first and second ejecting members are inserted into the opening of the hood, and outer edge portions of the first and second ejecting members are chamfered in a round shape. ejection device. The die ejecting apparatus according to claim 2, wherein a plurality of vacuum slots are provided on an inner surface of the first ejecting member or an outer surface of the second ejecting member to provide the negative pressure. The die ejecting apparatus according to claim 2, wherein a plurality of vacuum slots are provided on an outer surface of the first ejecting member to provide the negative pressure. The die ejecting apparatus according to claim 2, wherein the first support member and the second support member each have a disk shape, and an elastic member is disposed between the first support member and the second support member. The die ejecting apparatus according to claim 1, wherein the air holes are inclined upward and outward with respect to a central axis of the ejecting unit. According to claim 1, wherein the hood,
an upper panel provided with the opening and vacuum holes; and
and a housing extending downwardly from an edge of the upper panel and coupled to the main body;
The vacuum holes communicate with a third chamber defined by the upper panel and the housing, and the ejecting unit is disposed inside the hood. The die ejecting apparatus of claim 9 , wherein at least one vacuum channel connecting some of the vacuum holes adjacent to the opening is provided on the upper surface of the upper panel.

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