KR101271291B1 - Die ejecting apparatus - Google Patents

Abstract

PURPOSE: A die ejecting apparatus is provided to reduce replacement time by using a ring-type coil spring for combining a holder with a main body. CONSTITUTION: An ejecting unit(110) selectively ejects one die among dies. The ejecting unit pushes the die upwardly. A holder(120) includes an upper panel, a lower part, and a housing. A driving unit(130) moves the ejecting unit vertically. A main body accommodates the driving unit.

Description

Die Ejecting Device {DIE EJECTING APPARATUS}

Embodiments of the present invention relate to a die ejecting apparatus. More particularly, the invention relates to a die ejecting apparatus for separating dies from a wafer to bond dies having semiconductor elements formed thereon on a substrate in a semiconductor manufacturing process.

In general, semiconductor devices may be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above may be divided through a dicing process and bonded on a substrate through a bonding process. Can be bonded to.

The apparatus for performing the die bonding process may include a pick-up module for picking up and separating the dies from a wafer divided into dies in which a semiconductor element is formed, and a bonding module for attaching the picked-up semiconductor element to a substrate. . The pickup module includes a stage unit for supporting a wafer ring to which the wafer is attached and an ejecting device installed to be movable in a vertical direction to selectively separate a semiconductor element from a wafer supported on the stage unit, and the semiconductor element from the wafer. Pick-up unit for picking up and attach to the substrate.

In general, the die ejecting apparatus includes an ejecting unit for pushing up the semiconductor element in a vertical direction, a holder for receiving the ejecting unit, and the ejecting unit in a vertical direction to separate the semiconductor element from a dicing tape. It may include a driving unit for moving and a main body for receiving the driving unit. Examples of such a die ejecting apparatus are disclosed in Korean Patent No. 10-0975500 and Korean Patent Laid-Open No. 10-2009-0108447.

On the other hand, when replacing the ejecting unit and the holder so as to correspond to the size of the die, it takes a lot of time to align the rotation angle and center alignment of the ejecting unit and holder die bonding using the die ejecting device There is a problem that the operation rate of the equipment is significantly reduced.

It is an object of the present invention to provide a die ejecting apparatus which can very easily perform replacement of a die ejecting unit and a holder in a die ejecting apparatus.

According to embodiments of the present invention,

According to the embodiments of the present invention as described above, in the apparatus for ejecting the dies attached to the dicing tape, the apparatus is coupled to the holder and the ejecting unit and the holder is built in each ejecting unit It may include a driving unit and the main body.

The main body may be inserted into the lower part of the holder, and the upper outer surface of the main body may protrude from the upper outer surface of the upper part of the coil spring having a circular ring shape, the outer diameter of which may be elastically changed, for engagement with the holder. It may be provided. In addition, an alignment groove and an alignment pin may be provided at the lower portion of the holder and the upper portion of the main body, respectively, and the ejecting unit and the driving unit may be coupled by a magnetic force.

As described above, the holder and the main body are coupled by a coil spring having a ring shape in which the outer diameter is changed elastically, and the ejecting unit and the driving unit are coupled by a magnetic force, thereby making it very easy to replace the ejecting unit and the holder. Can be done. In addition, since the rotation angle alignment of the ejecting unit and the holder may be performed using the alignment groove and the alignment pin, the time required for replacing the ejecting unit and the holder may be greatly shortened.

1 is a schematic diagram illustrating a die bonding apparatus in which a die ejecting apparatus according to an embodiment of the present invention is used.
2 and 3 are schematic cross-sectional views for explaining the die ejecting apparatus shown in FIG.
4 is a schematic diagram illustrating a coil spring in a ring form shown in FIG. 2.
5 and 6 are schematic cross-sectional views illustrating a method of ejecting a die by using the die ejecting apparatus shown in FIG. 2.
FIG. 7 is a perspective view illustrating the holder and the ejecting unit illustrated in FIG. 2.
8 is a perspective view for explaining a state in which the ejecting unit is lifted upward from the holder shown in FIG. 2.
9 is a side view for explaining the holder and the main body shown in FIG.
FIG. 10 is a schematic cross-sectional view for describing another example of the ejecting unit shown in FIG. 2.
FIG. 11 is a perspective view illustrating the holder and the ejecting unit illustrated in FIG. 10.
FIG. 12 is a perspective view for explaining a state in which ejecting pins are raised from the holder illustrated in FIG. 10.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected sufficiently. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

1 is a schematic configuration diagram illustrating a die bonding apparatus using a die ejecting apparatus according to an embodiment of the present invention, Figures 2 and 3 are for explaining the die ejecting apparatus shown in FIG. Schematic cross-sectional views.

1 to 3, the die ejecting apparatus 100 according to an embodiment of the present invention separates the dies 20 from the wafer 10 formed of the dies 20 on which semiconductor elements are formed. It can preferably be used in a die bonding process for bonding on a substrate. In particular, the wafer 10 may be provided attached to the dicing tape 32 and the dicing tape 32 may be mounted to the wafer ring 30 having a larger diameter than the wafer 10. have.

The wafer ring 30 may be gripped by a clamp 42 disposed on the stage 40 and the edge portion of the dicing tape 32 may be extended ring 44 disposed on the stage 40. Can be supported by. The clamp 42 can move the wafer ring 30 vertically downward to expand the dicing tape 32 whereby the dicing tape 32 is extended by the expansion ring 44. Can be. As a result, the distance between the dies 20 attached to the dicing tape 32 can be extended.

A lower die ejecting device 100 for selectively lifting the dies 20 to separate the dies 20 from the dicing tape 32 may be provided at the bottom of the stage 40 And a pickup device 50 for picking up the die 20 lifted by the die ejecting device 100 may be provided on the stage 40. [

2 and 3, the die ejecting apparatus 100 may be used to eject the dies 20 from the dicing tape 32.

According to an embodiment of the present invention, the die ejecting apparatus 100 includes an ejecting unit 110 for pushing up the dies 20 upwardly, and a holder accommodating the ejecting unit 110. 120, a driving unit 130 for moving the ejecting unit 110 in a vertical direction, and a main body 140 accommodating the driving unit 130.

The ejecting unit 110 may push up the selected die 20 to selectively eject one of the dies 20. The driving unit 130 may include a head 132 coupled to the ejecting unit 110 and a driving shaft 134 for transmitting a driving force. Although not shown in detail, the drive shaft 134 may be connected to a power supply unit (not shown) for providing the driving force, and the power supply unit may be used in various ways using a motor, a cylinder, power transmission elements, and the like. Can be configured.

The holder 120 may have an inner space for accommodating the ejecting unit 110. For example, the holder 120 is downward from the upper panel 122 and the upper panel 122 having at least one through hole 122A so that the ejecting unit 110 can be moved in the vertical direction. It may include a housing 124 extending and having an open bottom.

An open lower portion of the housing 124 may be combined with the main body 140, and the head 132 and the driving shaft 134 of the driving unit 130 may move in the vertical direction in the main body 140. .

As an example, the housing 124 and the body 140 of the holder 120 may have a substantially circular tube shape. However, the scope of the present invention will not be limited by the shapes of the housing 124 and the main body 140.

An upper portion of the main body 140 may be inserted into an open lower portion of the housing 124. As an example, as shown in the upper outer surface of the main body 140 may be provided with a locking step 142 for limiting the degree of insertion of the main body 140.

On the other hand, the inner surface of the housing 124 may be provided with a stopper 126 for limiting the downward movement of the ejecting unit 110. The ejecting unit 110 accommodated in the holder 120 is limited in the horizontal direction by the through-hole 122A provided in the upper panel 122 and is movable only in the vertical direction, in particular upward. Movement is limited by the top panel 122 and downward movement may be limited by the stopper 126. As a result, the ejecting unit 110 may be allowed to move only in the vertical direction at a predetermined distance within the holder 120, and if necessary, the ejecting unit 110 and the holder 120 may be replaced together. Can be.

According to an embodiment of the present invention, when the ejecting unit 110 needs to be replaced in order to correspond to the size change of the dies 20, both the holder 120 and the ejecting unit 110 may be replaced. Can be. In particular, replacement sets made of the ejecting unit 110 and the holder 120 are prepared in advance so as to correspond to the respective dies 20, and the ejecting unit 110 and the holder 120 are prepared according to the size of the die. Optionally available.

In addition, the coupling structure between the holder 120 and the main body 140 and the coupling structure between the ejecting unit 110 and the driving unit 130 may be replaced by the ejecting unit 110 and the holder 120. It can be configured to be more simple to perform.

According to an embodiment of the present invention, a coil spring 150 for coupling the holder 120 to the main body 140 may be mounted on an upper outer surface of the main body 140.

FIG. 4 is a schematic diagram for describing the coil spring shown in FIG. 2.

Referring to FIG. 4, the coil spring 150 may have a circular ring shape as a whole, and a groove on which the coil spring 150 is mounted may be provided on an upper outer surface of the main body 140. The coil spring 150 may be disposed in the groove to be mounted to partially protrude from the upper outer surface of the main body 140, and may be in close contact with the open lower inner surface of the housing 124.

An outer diameter of the coil spring 150 may be elastically changed to replace the holder 120. For example, the coil spring 150 may have a shape wound so as to be inclined in the same direction with respect to the central axis as shown, whereby the outer diameter of the coil spring 150 may be elastically changed. . That is, the outer diameter of the coil spring 150 may be changed by an external force, whereby the holder 120 may be replaced very easily. Meanwhile, in order to stably maintain the coupled state of the holder 120, a concave portion 128 (see FIG. 3) in which the protruding balls 150 are inserted is provided at an open lower inner side surface of the housing 124. Can be.

The concave portion 128 may maintain a constant position where the coil spring 150 is in close contact with the open lower inner surface of the housing 124, whereby the gap between the holder 120 and the main body 140 may be maintained. The bonding state can be kept stable. In addition, since the surface adhesion and parallelism between the lower surface of the housing 124 and the upper surface of the locking projection of the main body 140 can be greatly improved, the die 20 is stably ejected in a subsequent die ejecting process. can do.

2 and 3, according to an embodiment of the present invention, the ejecting unit 110 and the driving unit 130 may be coupled to each other by a magnetic force. For example, the head 132 of the driving unit 130 may be provided with a plurality of permanent magnets 136 for holding the ejecting unit 110 by using a magnetic force, the ejecting unit 110 ) May be made of magnetic material. In addition, unlike the above, the ejecting unit 110 may be provided with permanent magnets (not shown) corresponding to the permanent magnets 136 of the head 132.

On the other hand, the ejecting unit 110 may have an air chamber 112 of which the top is open. The air chamber 112 may be provided with air to facilitate ejection of the selected die 20.

5 and 6 are schematic cross-sectional views for explaining a method of ejecting a die by using the die ejecting apparatus shown in FIG. 2, and FIG. 7 is a view for explaining the holder and ejecting unit shown in FIG. 8 is a perspective view illustrating a state in which the ejecting unit is lifted upward from the holder shown in FIG. 2.

5 to 8, although not shown, the die ejecting apparatus 100 may include a separate driving unit (not shown) so that the upper panel 122 of the holder 120 may be disposed on the dicing tape 32. It may be raised to be in close contact with).

Subsequently, the ejecting unit 110 may be raised by the driving unit 130 to protrude from the upper surface of the upper panel 122 as shown in FIG. 5, whereby the selected die 20 is raised. It can be pushed upward with the dicing tape 32. In this case, the upper panel 122 may be provided with a plurality of vacuum holes 122B for adsorbing a portion of the dicing tape 32.

For example, as illustrated, a plurality of vacuum holes 122B may be provided around the through hole 122A in which the ejecting unit 110 is located, and located around the selected die 20. A portion of the dicing tape 32 can be adsorbed. This is to allow the selected die 20 to be easily separated from the dicing tape 32 by adsorbing a portion of the dicing tape 32 located around the selected die 20.

In particular, as shown in FIG. 5, when the ejecting unit 110 protrudes upward from the upper panel 122, an edge portion of the selected die 20 may be separated from the dicing tape 32. have.

Subsequently, as shown in FIG. 6, when air is injected into the air chamber 112, the upper surface of the ejecting unit 110 is in close contact with the dicing tape 32. The dicing tape 32 located on top of the can be partially swollen, thereby allowing the selected die 20 to be gradually separated from the dicing tape 32.

The air may be provided through the driving shaft 134 and the head 132, and a vacuum may be provided into the holder 120 through the main body 140. In this case, as illustrated, sealing members 170 and 172 may be interposed between the main body 140 and the housing 124 and between the ejecting unit 110 and the head 132.

On the other hand, as shown in Figure 7 and 8, the upper surface of the holder 120 may be provided with an identification line of the date or cross form, the identification line is the holder 120 and the ejection unit ( 110 may be used for centering alignment using a vision module during replacement.

9 is a side view for explaining the holder and the main body shown in FIG.

9, an alignment pin 144 for rotating alignment of the holder 120 and the ejecting unit 110 may be provided on an upper outer surface of the main body 140, and correspondingly, the holder 120 may be provided. An open lower portion of) may be provided with an alignment groove 129 into which the alignment pin 144 is inserted.

According to an embodiment of the present invention as described above, since the coupling between the holder 120 and the main body 140 uses a coil spring 150 in the form of a ring that partially protrudes to the upper outer surface of the main body 140. Replacement of the holder 120 can be performed very easily. In addition, by using the alignment pin 144 and the alignment groove 129, the rotation angle alignment can be made very simple when the holder 120 and the ejecting unit 110 is replaced, whereby the holder 120 The time required for replacing the ejecting unit 110 can be greatly shortened.

In particular, according to an embodiment of the present invention, the holder 120 and the ejecting unit 110 is prepared in advance a plurality of sets in accordance with the type of the dies 20, and if a replacement operation is required in a short time Replacement of the holder 120 and the ejecting unit 110 may be performed. As a result, since the time required for the set replacement operation consisting of the holder 120 and the ejecting unit 110 is reduced, the operation rate of the die bonder facility including the die ejecting apparatus 100 can be greatly improved.

FIG. 10 is a schematic cross-sectional view for describing another example of the ejecting unit illustrated in FIG. 2, FIG. 11 is a perspective view illustrating the holder and the ejecting unit illustrated in FIG. 10, and FIG. 12 is illustrated in FIG. 10. A perspective view for explaining a state in which the ejecting pins are raised from the holder.

10 to 12, according to another embodiment of the present invention, the ejecting unit 180 accommodated in the holder 190 including the upper panel 192 and the housing 194 may be formed of the holder 190. Ejecting pins 182 inserted into the through holes 192A formed in the upper panel 192 and a support panel 184 disposed in the holder 190 to support the ejecting pins 182. have.

The support panel 184 may be provided with permanent magnets 186 corresponding to the permanent magnets 136 provided on the head 132 of the driving unit 130, as shown in the permanent magnets 136, 186 The ejecting unit 180 and the head 132 may be coupled to each other by a magnetic force generated by). In addition, the ejecting pins 182 may also be coupled to the support panel 184 by the magnetic force of the permanent magnet 186 provided on the support panel 184.

On the other hand, as shown in Figure 11, the upper surface of the holder 190 may be provided with an identification line of the date or cross form, the identification line is the replacement of the holder 190 and the ejection unit 180 It can be used for centering alignment using vision modules at work. In particular, in the process of preparing a plurality of sets according to the type of the dies 20, the identification line may be used to set the position at which the ejecting pins 182 are inserted. That is, in the preparation of the sets, the ejecting unit 180 may be prepared in a state in which the ejecting unit 180 is disposed in the holder 190. In this process, the identification line may include the ejecting pins 182 in the through holes. It can be used to set the position to be inserted into 192A.

As described above, since the ejecting pins 182 are prepared in a state of being inserted into the holder 190 in advance, the time required for replacing the holder 190 and the ejecting unit 180 may be further reduced. .

According to the embodiments of the present invention as described above, in the apparatus 100 for ejecting the dies 20 attached to the dicing tape 32, the apparatus 100 is an ejecting unit 110. The built-in holder 120 may include a driving unit 130 and a main body 140 coupled to the ejecting unit 110 and the holder 120, respectively.

The main body 140 may be inserted into the lower part of the holder 120, the upper outer surface of the main body 140, the outer diameter of the coil spring of the circular ring shape that can be changed elastically for coupling with the holder 120 150 may be provided to partially protrude from the upper outer surface of the main body 140. In addition, an alignment groove 129 and an alignment pin 144 may be provided at a lower portion of the holder 120 and an upper portion of the main body 140, respectively, and the ejecting unit 110 and the driving unit 130 may be provided. Can be coupled by magnetic force.

As described above, the holder 120 and the main body 140 are coupled by a coil spring 150 having a ring shape in which the outer diameter thereof is changed elastically, and the ejecting unit 110 and the driving unit 130 are applied to a magnetic force. Since the coupling by the ejecting unit 110 and the holder 120 can be made very simple. In addition, since the rotation angle alignment of the ejecting unit 110 and the holder 120 may be performed using the alignment groove 129 and the alignment pin 144, the ejection unit 110 and the holder 120 may be aligned. The time required for replacement can be greatly shortened.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

10: wafer 20: die
100: die ejecting device 110: ejecting unit
112: air chamber 120: holder
122: upper panel 124: housing
126: stopper 128: recess
129: alignment groove 130: drive unit
132 head 134 drive shaft
136: permanent magnet 140: main body
142: locking jaw 144: alignment pin
150: coil spring 170, 172: sealing member
180: ejecting unit 182: ejecting pin
184: support panel 186: permanent magnet
190: holder 192: top panel
194: housing

Claims (10)

An apparatus for ejecting the dies from a dicing tape to which a plurality of dies are attached, the apparatus comprising:
An ejecting unit for pushing up the selected die upwards to selectively eject one of the dies;
An upper panel having an inner space for accommodating the ejecting unit, the upper panel having at least one through hole so that the ejecting unit is movable in a vertical direction, and an open lower portion and the inner space extending downward from the upper panel; A holder including a housing having an inner side having a stopper for limiting downward movement of the ejecting unit housed in the housing;
A driving unit coupled to the ejecting unit to move the ejecting unit in a vertical direction;
A main body inserted into the open lower part of the holder to receive the driving part; And
And a coil spring having a ring shape and mounted so as to be partially exposed from an upper outer surface of the main body and in close contact with an open lower inner surface of the housing to couple the holder to the main body. delete The die ejecting apparatus of claim 1, wherein a concave portion into which the coil spring is inserted is provided at an open lower inner surface of the housing. The die ejecting apparatus according to claim 1, wherein the coil of the coil spring is wound to have a shape inclined in the same direction with respect to the central axis so that the outer diameter thereof is elastically changed. The die ejecting apparatus of claim 1, wherein the ejecting unit and the driving unit are coupled to each other by a magnetic force. The die ejecting apparatus of claim 5, wherein the driving unit includes a head coupled to the ejecting unit, and the head includes a permanent magnet for coupling with the ejecting unit. The air discharging unit of claim 1, wherein the ejecting unit has an air chamber open at an upper portion thereof, and adheres to the lower portion of the dicing tape by the driving unit, and then to the air chamber to partially push up the closely adhered dicing tape. Die ejecting device, characterized in that the air is injected. 8. The die ejecting apparatus according to claim 7, wherein the ejecting unit is lifted by the drive unit to protrude from the upper panel of the holder to push up the selected die. The apparatus of claim 7, wherein the upper panel includes a plurality of vacuum holes positioned around the at least one through hole and configured to adsorb the dicing tape. The apparatus of claim 1, wherein the ejecting unit comprises an ejecting pin inserted into the at least one through hole and a support panel disposed in the holder to support the ejecting pin.

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