KR101471715B1

KR101471715B1 - Die ejecting apparatus

Info

Publication number: KR101471715B1
Application number: KR1020120121458A
Authority: KR
Inventors: 방호천; 이희철; 임석택; 최현옥
Original assignee: 세메스 주식회사
Priority date: 2012-10-30
Filing date: 2012-10-30
Publication date: 2014-12-10
Also published as: TW201430927A; CN103794531B; KR20140055104A; CN103794531A; TWI521586B

Abstract

A die ejecting apparatus comprising: a stage for supporting a dicing tape to which a plurality of dies are attached; an ejecting unit disposed at a lower portion of the stage and selectively pushing up one of the dies upward; A die ejector including a main body including a driving unit for moving the ejecting unit in a vertical direction and a holder having the ejecting member and a lower portion opened to insert an upper portion of the main body; A holder accommodating unit for accommodating holders each containing a plurality of ejecting units and a holder holding unit for holding the holders between the die ejector and the holder holding unit in order to replace the holder with one of the holders accommodated in the holder holding unit. And a holder transfer unit for transferring the wafer. Therefore, it is easy to replace the ejecting unit and the holder, and the time required for the replacement can be greatly shortened.

Description

[0001] DIE EJECTING APPARATUS [0002]

Embodiments of the present invention relate to a die ejecting apparatus. More particularly, the present invention relates to a die ejecting apparatus for separating dies from a wafer for bonding dies on which semiconductor elements are formed on a substrate in a semiconductor manufacturing process.

Generally, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above can be divided through a dicing process, Lt; / RTI >

The apparatus for performing the die bonding process may include a pick-up module for picking up and separating the dies from the wafer divided into dies formed with semiconductor elements, and a bonding module for attaching the picked-up semiconductor elements on the substrate . Wherein the pick-up module comprises: a stage unit for supporting the wafer ring on which the wafer is mounted; an ejecting device provided movably in a vertical direction for selectively separating the semiconductor element from the wafer supported on the stage unit; Up unit for picking up and attaching on a substrate.

Generally, the die ejecting apparatus includes an ejecting unit for vertically pushing up the semiconductor element to separate the semiconductor element from the dicing tape, a holder for receiving the ejecting unit, and a holder for holding the ejecting unit in a vertical direction A main body for accommodating the driving unit, and the like. Examples of such a die ejecting apparatus are disclosed in Korean Patent No. 10-0975500 and Korean Patent Laid-Open No. 10-2009-0108447.

Meanwhile, when replacing the ejecting unit, the holder and the like so as to correspond to the sizes of the dies, considerable time is required for alignment and center alignment of the rotational angle of the ejecting unit and the holder, and so die attaching using the die- There arises a problem that the operation rate of the facility is significantly lowered.

Embodiments of the present invention are intended to provide a die ejecting apparatus capable of extremely simple replacement of a die ejecting unit and a holder in a die ejecting apparatus.

According to embodiments of the present invention, a die ejecting apparatus includes a stage for supporting a dicing tape to which a plurality of dies are attached, and a stage disposed below the stage for selectively pushing one of the dies upward A holder including a main body including an ejecting unit and a driving unit for moving the ejecting unit in a vertical direction, a holder having the ejecting unit built therein and opened to insert an upper portion of the main body, And a support member for supporting the ejecting unit to hold the ejecting unit in a state of being housed in the holder; a die holder disposed at one side of the stage and containing the ejectors, And a holder in which the ejecting unit is housed is inserted into the holder accommodating unit And a holder transfer unit for transferring the holders between the die ejector and the holder receiving unit for replacing the holder.

According to the embodiments of the present invention, the holder accommodating unit includes a base panel having a disk shape, a plurality of holder receivers mounted circumferentially on the base panel for housing the respective holders, And a rotation driving unit for driving the motor.

According to the embodiments of the present invention, the holder accommodating unit can be disposed on the opposite side of the cassette accommodating a plurality of wafers around the stage.

According to embodiments of the present invention, the holder transport unit may include a holder grip section for gripping the outer surface of the holder, and a transport section for moving the holder grip section in the horizontal and vertical directions. At this time, the holder holding part may be coupled to the conveying part together with a gripper which draws one of the wafers from the cassette and moves the wafer onto the stage.

According to the embodiments of the present invention, a groove for coupling with the holder grip portion may be formed on an outer surface of the holder.

According to the embodiments of the present invention, each of the holder housings includes a chuck configured to be inserted into an open lower portion of the holder, and a holder configured to be protruded from a side surface of the chuck and closely contacted with an opened lower inner surface of the holder, And may include a plurality of contact members for gripping.

According to embodiments of the present invention, the chuck is provided with a piston having a vertically inclined upper inclined side surface, which is configured to be movable in a vertical direction, and each of the urging members is disposed on an open lower inner side surface of the holder And has an inner surface which is in close contact with an upper inclined side surface of the piston and which is in close contact with an open lower inner surface of the holder by the vertical movement of the piston.

According to the embodiments of the present invention, the chuck is provided with a moving passage of the contact members, and the moving passage may have a slope that gradually rises from the inside to the outside of the chuck.

According to embodiments of the present invention, the piston includes a permanent magnet, and the contact members can always be brought into close contact with the upper inclined side surface by the magnetic force of the permanent magnet.

According to embodiments of the present invention as described above, in an apparatus for ejecting dies attached to a dicing tape, the apparatus includes a holder having an ejecting unit incorporated therein, and a body detachably coupled to the holder, .

Particularly, when the die size or shape is changed in the die bonding process, the holder and the ejecting unit can be easily replaced with the holder transfer unit in a state in which the holder corresponding to the various dies and the ejecting unit are prepared in advance The time required for replacing the holder and the ejecting unit can be further shortened.

Further, the holder holding unit is positioned on the opposite side of the cassette with respect to the stage, and when the holder holding unit and the holder holding unit are moved by using one horizontal transfer unit, the overall area occupied by the die- And the manufacturing cost of the die ejecting apparatus can be greatly reduced.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram for explaining a die ejecting apparatus according to an embodiment of the present invention; FIG.
2 is a schematic sectional view for explaining the stage shown in Fig.
Fig. 3 is a schematic sectional view for explaining the die ejector shown in Fig. 2. Fig.
Figs. 4 and 5 are schematic cross-sectional views for explaining a method of ejecting a die using the die ejector shown in Fig.
6 is a side view for explaining the holder and the main body shown in FIG.
7 is a schematic cross-sectional view for explaining another example of the holder and the ejecting unit shown in Fig.
8 is a schematic perspective view for explaining a holder grip portion of the holder transport unit shown in Fig.
9 is a schematic cross-sectional view for explaining the holder grip portion shown in Fig.
10 is an enlarged sectional view for explaining the clamping block and the clamping members shown in Fig.
11 is a schematic structural view for explaining the holder housing unit shown in Fig.
Figs. 12 and 13 are schematic enlarged cross-sectional views for explaining the operation of the holder receiving unit shown in Fig.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to schematic illustrations of ideal embodiments of the present invention. Thus, changes from the shapes of the illustrations, e.g., changes in manufacturing methods and / or tolerances, are those that can be reasonably expected. Accordingly, the embodiments of the present invention should not be construed as being limited to the specific shapes of the areas illustrated in the drawings, but include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Is not intended to illustrate the exact shape of the area and is not intended to limit the scope of the invention.

FIG. 1 is a schematic structural view for explaining a die ejecting apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic sectional view for explaining a stage shown in FIG. 3 is a schematic sectional view for explaining the die ejector shown in Fig. 2. Fig.

1 to 3, a die ejecting apparatus 100 according to an embodiment of the present invention includes a plurality of dies 20 separated from a wafer 10 made of dies 20 on which semiconductor elements are formed And can be preferably used in a die bonding process for bonding onto a substrate. In particular, the wafer 10 may be provided attached to the dicing tape 32 and the dicing tape 32 may be mounted on the wafer ring 30 having a larger diameter than the wafer 10 have.

The wafer ring 30 may be held by a clamp 42 disposed on the stage 40 and the edge portion of the dicing tape 32 may be gripped by an extension ring 44 disposed on the stage 40, Lt; / RTI > The clamp 42 may move the wafer ring 30 vertically downward to expand the dicing tape 32 so that the dicing tape 32 is extended by the extension ring 44 . As a result, the distance between the dies 20 attached to the dicing tape 32 can be extended.

A lower die ejecting device 100 for selectively lifting the dies 20 to separate the dies 20 from the dicing tape 32 may be provided at the bottom of the stage 40 And a pickup device 50 for picking up the die 20 lifted by the die ejecting device 100 may be provided on the stage 40. [

1, the apparatus 1 for performing the die bonding process includes a cassette 12 in which a plurality of wafers 10 are housed, and a cassette 12 for holding the wafers 10 from the cassette 12, And a gripper 60 for pulling out one of them and moving it onto the stage 40.

The gripper 60 can be moved in the horizontal direction by the transfer unit 270 and a guide for guiding the wafer 10 transferred by the gripper 60 between the cassette 12 and the stage 40 The rail 70 can be disposed.

On the other hand, although not shown, the clamp 42 may have a substantially circular ring shape. In particular, the clamp 42 may be divided into two clamping members facing each other to provide a path of movement of the gripper 60, and the gripper 60 may be moved between the clamping members .

Referring to FIG. 3, the die ejecting apparatus 100 may be used to eject the dies 20 from the dicing tape 32.

According to an embodiment of the present invention, the die ejecting apparatus 100 includes an ejecting unit 110 for pushing up the dies 20 upward, a holder (not shown) for receiving the ejecting unit 110 And a die ejector 102 including a driving unit 130 for moving the ejecting unit 110 in a vertical direction and a main body 140 for receiving the driving unit 130.

The ejecting unit 110 may push up the selected die 20 to selectively eject one of the dies 20. [ The driving unit 130 may include a head 132 coupled to the ejecting unit 110 and a driving shaft 134 for transmitting a driving force. Although not shown in detail, the driving shaft 134 may be connected to a power providing unit (not shown) for providing the driving force, and the power providing unit may be connected to the power supplying unit 140 by various methods using a motor, a cylinder, Lt; / RTI >

As an example, the ejecting unit 110 may have a substantially rectangular post shape, and may have an air chamber 112 with an open top, as shown. Compressed air may be supplied to the air chamber 112 through the driving shaft 134.

The holder 120 may have an internal space in which the ejecting unit 110 is installed. For example, the holder 120 may include an upper panel 122 having at least one through-hole 122A so that the ejecting unit 110 can be moved in a vertical direction, and a lower panel 122 And may include a housing 124 having an extended and open bottom.

The opened lower portion of the housing 124 can be coupled to the main body 140 and the head 132 and the drive shaft 134 of the driving unit 130 can be moved in the vertical direction within the main body 140 .

As an example, the housing 124 of the holder 120 and the body 140 may have a generally circular tube shape. However, the scope of the present invention is not limited by the shape of the housing 124 and the body 140.

The upper portion of the main body 140 may be inserted into the opened lower portion of the housing 124. For example, as shown in the figure, the outer surface of the upper portion of the main body 140 may be provided with a locking protrusion for restricting the extent to which the main body 140 is inserted.

When the holder 120 and the ejecting unit 110 are detached from the main body 140, the inner side surface of the housing 124 restricts downward movement of the ejecting unit 110, A support member 126 for supporting the ejecting unit 110 may be provided. The ejecting unit 110 accommodated in the holder 120 is limited in the horizontal movement and is movable only in the vertical direction by the through hole 122A provided in the upper panel 122, Is limited by the upper panel 122 and the downward movement can be limited by the support member 126. [ As a result, the ejecting unit 110 may be allowed to move only in a vertical direction within the holder 120 when the ejecting unit 110 is built in the holder 120, And the holder 120 may be replaced together.

According to an embodiment of the present invention, when it is necessary to replace the ejecting unit 110 in order to cope with the size change of the dies 20, the holder 120 and the ejecting unit 110 are simultaneously replaced . Particularly, it is preferable to prepare replacement sets of the ejecting unit 110 and the holder 120 corresponding to the respective dies 20 in advance, and the ejecting unit 110 and the holder 120 ) Can be selectively used.

1, the die ejecting apparatus 100 includes a holder transfer unit 110 for picking up and moving the holder 120 to replace the holder 120 including the ejecting unit 110, And a holder storage unit 300 for storing the holder 120 transferred by the holder transfer unit 200 and the holder storage unit 300. The holder storage unit 300 may store a plurality of holders 120 each having an ejecting unit 110 therein to correspond to a change in size and shape of the dies 20. The holder transfer unit 200 and the holder housing unit 300 will be described later.

The coupling structure between the holder 120 and the main body 140 and the coupling structure between the ejecting unit 110 and the driving unit 130 may be changed between the replacement of the ejecting unit 110 and the holder 120 Can be performed more simply.

For example, although not shown, a ball, a spring, and the like, which are elastically supported in a radial direction, may be provided on the outer surface of the main body 140. The ball, spring, May be provided. As another example, the body 140 and the housing 124 may be combined using magnetic force. That is, the permanent magnet may be attached to the main body 140 or the housing 124 to couple the main body 140 and the housing 124 together. As described above, the method of combining the holder 120 and the main body 140 is described in Japanese Patent Application No. 10-2012-0096305 filed by the present applicant, Utility Model Application No. 20-2012-0007790, 2012-0007791 and the like, so that further detailed description thereof will be omitted.

Figs. 4 and 5 are schematic cross-sectional views for explaining a method of ejecting a die using the die ejector shown in Fig.

4 and 5, the upper panel 122 of the holder 120 is connected to the dicing tape 32 by a separate driving unit (not shown) It can be raised so as to be closely contacted.

The ejecting unit 110 may then be lifted up from the upper surface of the upper panel 122 by the drive 130 to protrude as shown in Figure 4 so that the selected die 20 It can be pushed upward together with the dicing tape 32. [ At this time, the upper panel 122 may be provided with a plurality of vacuum holes 122B (see FIG. 3) for adsorbing a part of the dicing tape 32.

For example, as shown in the drawing, a plurality of vacuum holes 122B may be provided around the through hole 122A in which the ejecting unit 110 is located, A part of the area of the dicing tape 32 can be absorbed. This is to cause the selected die 20 to be easily separated from the dicing tape 32 by sucking a part of the area of the dicing tape 32 located in the periphery of the selected die 20.

4, when the ejecting unit 110 protrudes upward from the upper panel 122, the edge portion of the selected die 20 can be separated from the dicing tape 32 have.

5, when air is injected into the air chamber 112, the upper surface of the ejecting unit 110 is in close contact with the dicing tape 32, so that the ejecting unit 32 The dicing tape 32 located at the top of the dicing tape 32 may be partially swollen so that the selected die 20 can be gradually separated from the dicing tape 32. [

Meanwhile, the air may be supplied through the drive shaft 134 and the head 132, and a vacuum may be provided to the inside of the holder 120 through the body 140. At this time, sealing members 170 and 172 may be interposed between the main body 140 and the housing 124 and between the ejecting unit 110 and the head 132, respectively.

6 is a side view for explaining the holder and the main body shown in FIG.

6, an alignment pin 148 for aligning the rotation angle of the holder 120 with the ejector unit 110 may be provided on the outer surface of the upper portion of the main body 140, 120 may have an alignment groove 129 into which the alignment pins 148 are inserted.

Particularly, according to an embodiment of the present invention, the holder 120 and the ejecting unit 110 are prepared in advance according to the type of the dies 20, and when a replacement operation is required, The replacement operation of the holder 120 and the ejecting unit 110 can be performed. As a result, since the time required for the set replacing operation including the holder 120 and the ejecting unit 110 is reduced, the operating rate of the die bonder apparatus including the die ejecting apparatus 100 can be greatly improved.

7 is a schematic cross-sectional view for explaining another example of the holder and the ejecting unit shown in Fig.

7, an ejecting unit 180 housed in a holder 190 including an upper panel 192 and a housing 194 is coupled to an upper panel (not shown) of the holder 190 Ejecting pins 182 inserted into the through holes 192A formed in the holder 190 and a support panel 184 disposed in the holder 190 and supporting the ejecting pins 182. [

The support panel 184 may include a permanent magnet 186 corresponding to the permanent magnets 136 provided in the head 132 of the driving unit 130. The permanent magnets 136 and 186 The ejecting unit 180 and the head 132 can be coupled to each other by a magnetic force generated by the magnetic force generated by the magnetic field generated by the magnetic field generating unit 180. [ The ejecting pins 182 may also be coupled to the support panel 184 by the magnetic force of the permanent magnet 186 provided on the support panel 184.

FIG. 8 is a schematic perspective view for explaining a holder grip portion of the holder transfer unit shown in FIG. 1, FIG. 9 is a schematic cross-sectional view for explaining the holder grip portion shown in FIG. 8, And is an enlarged cross-sectional view for explaining the clamping block and the clamping members shown.

8 to 10, the holder transfer unit 200 picks up the holder 120 in which the ejecting unit 110 is accommodated for replacement of the ejecting unit 110 and the holder 120, . That is, the holder 120 is picked up from the main body 140 and transferred to the holder storage unit 300, and a new holder 120 is picked up from the holder storage unit 300 and transferred to the main body 140 .

In particular, the holder transfer unit 200 includes a holder grip 210 for gripping the outer surface of the holder, and a transfer unit 270 (see FIG. 1) for moving the holder grip 210 in the horizontal and vertical directions. . &Lt; / RTI > Here, the transfer unit 270 may be used to move the gripper 60. That is, the holder grip 210 may be coupled to the feeder 270 together with the gripper 600.

The transfer unit 270 includes a horizontal transfer unit 280 for horizontally moving the gripper 60 and the holder grip unit 210 and a vertical transfer unit 290 for vertically moving the holder grip unit 210. [ ). Here, the gripper (60) and the holder grip unit (210) can commonly use the horizontal transfer unit (280).

1, the cassette 12, the die ejector 102, the stage 40, and the holder accommodating unit 300 may be arranged in a straight line in the horizontal direction, The horizontal transfer unit 280 may move the gripper 60 and the holder grip 210 in the horizontal direction. That is, the holder storage unit 300 may be disposed on one side of the stage 40 facing the cassette 12 with respect to the stage 40, and the horizontal transfer unit 280 may be disposed on the cassette 12 The gripper 60 and the holder grip unit 210 can be moved in a direction in which the stage 40 and the holder storage unit 300 are arranged. As an example, the horizontal transfer unit 280 may be constructed using a linear guide member such as a motor, a driver such as a ball screw and a ball nut, and a linear motion guide.

Since the holder accommodating unit 300 is disposed on the outer side of the stage 40 as described above, the lower space of the stage 40 on which the die ejector 102 is positioned can be used more widely, It is not necessary to provide a separate drive unit for the holder transfer unit 200 by transferring the grip unit 210 together with the gripper 60. Therefore, the area occupied by the die ejecting apparatus 100 can be greatly reduced, and the cost of manufacturing the die ejecting apparatus 100 can be greatly reduced.

The vertical transfer unit 290 may be coupled to the horizontal transfer unit 280 and may be moved in a horizontal direction to move the holder grip 210 in a vertical direction for picking up and placing the holder 120. [ . As an example, the vertical transfer part 290 may be constructed using a pneumatic or hydraulic cylinder.

8 and 9, the holder grip 210 has a receiving portion for receiving the holder 120 and includes a base block 220 mounted to the vertical transfer portion 290, And a plurality of clamping members 230 for holding the outer surface of the holder 120 accommodated in the accommodating portion. As an example, the base block 212 may have an opening 214 for receiving the holder 120, and the clamping members 230 may be disposed within the opening 214.

The clamping members 230 can be moved forward and backward by clamping drivers 240 provided on both sides of the base block 212. For example, a pneumatic cylinder used as the clamping drivers 240 may be provided on both sides of the base block 212, and on the inner surface of the opening 214 of the base block 212, The clamping members 230 may be provided with recesses connected to the clamping members 240.

According to an embodiment of the present invention, the clamping blocks 250 connected to the clamping driving parts 240 may be disposed in the recesses formed in the inner surface of the opening 214, Members 230 may be mounted to the clamping blocks 250. As an example, each clamping block 250 may be equipped with two clamping members 230.

In particular, the clamping members 230 may be resiliently mounted to the clamping blocks 250, and the directions in which the clamping members 230 are elastically moved may be respectively determined by the outer surfaces of the holders 120 Lt; / RTI > Specifically, the clamping members 230 may be mounted on the clamping blocks 250 so that they can flow in a radial direction with respect to the central axis of the holder 120, When the clamping members 230 are in close contact with the outer surface of the holder 120, the contact surfaces of the clamping members 230 may coincide with the tangential plane of the outer surface of the holder 120.

10, one side of each clamping block 250 facing the holder 120 may include a first side 252 and a second side 254 which form an obtuse angle, The clamping members 230 may be resiliently mounted on the first side surface 252 and the second side surface 254, respectively. In addition, the angle between the clamping members 230 mounted on the first side surface 252 and the second side surface 254 may be an acute angle. This is to allow the elastic restoring force to be sufficiently applied to the clamping members 230 when the holder 120 is gripped.

The clamping member 230 may be elastically supported by a spring 232 as shown. Specifically, the first and second side surfaces 252 and 254 of the clamping block 250 may be provided with a hole 256 through which the spring 232 and the clamping members 230 are inserted, The clamping members 230 may be disposed to protrude a predetermined distance from the first and second side surfaces 252 and 254, respectively. At this time, the clamping block 250 may be provided with stop members 258 for limiting the degree of protrusion of the clamping members 230 as shown in FIG.

However, since the elastic supporting structure of the clamping members 230 can be variously modified, the scope of the present invention is not limited thereto. For example, the clamping block 250 may be equipped with generally known spring plungers.

3, a groove 128 into which the clamping members 230 are inserted may be provided on the outer surface of the holder 120, that is, on the outer surface of the housing 125. Referring to FIG. Specifically, when the holder 120 is picked up, when the holder 120 is lowered, the holder 120 is inserted into the opening 214 of the base block 212, and then the clamping members 230 may be in close contact with the inner surface of the groove 128 by the clamping drivers 240.

Referring again to FIG. 8, the base block 212 may include stop blocks 220 for restricting upward movement of the holder 120 relative to the base block 212. The stop blocks 220 may limit the extent to which the holder 120 is inserted into the opening 214 of the base block 212 when the holder 120 is picked up, When the main body 140 is mounted on the main body 140, the pressing force applied by the vertical transfer unit 290 may be transmitted to the holder 120. However, unlike the above, the base block 212 may have a closed structure with the top of the opening 214, in which case the stop blocks 220 may not be necessary.

The holder holding unit 210 may include a sensor 260 for sensing the holder 120 received in the opening 214. A light sensor 260 for sensing the holder 120 in the opening 214 may be mounted on one side of the base block 212 and the opening 214 and the light sensor 260 may be provided in the through hole 216. That is, the optical sensor 260 can irradiate light through the through hole 216, and can determine the presence or absence of the holder 120 by receiving the light reflected from the holder 120.

Fig. 11 is a schematic structural view for explaining the holder housing unit shown in Fig. 1, and Figs. 12 and 13 are schematic enlarged cross-sectional views for explaining the operation of the holder housing unit shown in Fig.

11 to 13, the holder storage unit 300 may include a plurality of holder storage units 310. [ According to an embodiment of the present invention, the holder storage unit 300 includes a base panel 302 having a disk shape, a plurality of holder storage units 310 mounted on the base panel 302, (Not shown).

The rotation driving unit 304 may be configured to rotate the holder holding unit 310 in order to receive the holder 120 transferred by the holder transfer unit 200 when the holder 120 is to be replaced, One of the holders 120 stored on the base panel 302 may be rotated by the holder grip 210 to rotate the base panel 302 The base panel 302 can be rotated to be picked up.

The holder receiving portions 310 may be mounted on the base panel 302 in a circumferential direction and each of the holder receiving portions 310 may include a chuck 320 configured to be inserted into an open lower portion of the housing 124, And a plurality of contact members 330 configured to protrude from the outer surface of the chuck 320 and to closely contact the inner bottom surface of the opened housing 124 to grip the holder 120. [ have.

The chuck 320 may be mounted on the base panel 302 and may be vertically movable in the chuck 320 and may include a piston 340 for driving the contact members 330 . Particularly, the piston 340 can be moved in a vertical direction by a piston driving unit 360 disposed at a lower portion of the base panel 302, and a driving shaft of the piston driving unit 360 is connected to the base panel 302 Through holes may be provided. For example, the piston driving unit 360 may be configured using a pneumatic or hydraulic cylinder, but the configuration of the piston driving unit 360 may be variously modified, so that the scope of the present invention is not limited thereto .

The piston 340 may have a substantially cylindrical shape and may include a top inclined side surface 342 having a predetermined inclination as shown. In particular, each of the contact members 330 may have an outer side which is in close contact with an opened lower inner side surface of the housing 124 and an inner side which is in close contact with the upper inclined side surface 342 of the piston 340, The inner surfaces of the contact members 330 are slidable on the upper inclined side surface 342 of the piston 340.

In particular, as shown, the contact member 330 can be moved outwardly or inwardly of the chuck 320 by the vertical movement of the piston 340, It is possible to release it.

The chuck 320 may be provided with a passage 322 through which the contact members 330 move, and the movement passage 322 may include a slope that gradually rises from the inside to the outside of the chuck 320, Lt; / RTI > When the piston 340 is lifted as shown in the drawing, the contact members 330 can slide on the upper inclined side surface 342 of the piston 340 and can be slid toward the outside of the chuck 320 Can be protruded.

According to an embodiment of the present invention as described above, after the holder 120 transferred by the holder transfer unit 200 is coupled to the chuck 320, the piston 340 can be elevated The contact members 330 can be brought into close contact with the open lower inner surface of the housing 124. As a result, the holder 120 can be stored in the holder accommodating unit 300 in a state in which the center axis of the holder 120 and the center axis of the chuck 320 are exactly aligned with each other, Pick-up errors due to center-axis misalignment can be prevented when picking up the holder 120 from the chuck 320.

According to an embodiment of the present invention, the permanent magnet 350 may be embedded in the piston 340 so that the cohesive members 330 are separated from each other by the magnetic force of the permanent magnet 350, The piston 340 can be moved to the outer side and the inner side of the chuck 320 by the upward and downward movement of the piston 340. As a result,

8, in the holder 120 supported by the clamping members 230 in the opening 214 of the holder grip 210, the clamping members 230 are elastically supported It is possible to flow in the horizontal direction within the opening 214. Particularly, since the clamping blocks 250 can have fluidity in the moving direction of the clamping blocks 250, the moving direction of the clamping blocks 250 of the holder grip 210, 250 are parallel to the moving direction of the holder grip 210 by the horizontal transfer unit 280. [ This is because there is a slight misalignment between the central axis of the main body 140 or the chuck 320 and the central axis of the holder 120 when the holder 120 is picked up or flashed by using the holder grip 210. [ So that the pick-up or place operation of the holder 120 can be performed stably.

Also, although not shown for stable pick-up and flushing of the holder 120, it is preferable that the open lower inner edge of the housing 124 be chamfered, and that the upper edge of the body 140 and the lower edge The upper edge of the chuck 320 is also preferably chamfered.

According to the embodiments of the present invention as described above, the holder accommodating unit 300 is positioned on the opposite side of the cassette 12 with respect to the stage 40, and the holder transport unit 200 is configured The entire area occupied by the die ejecting apparatus 100 can be largely reduced by moving the holder grip 210 and the gripper 60 using one horizontal transfer unit 280, The manufacturing cost of the ejecting apparatus 100 can be greatly reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

1: die bonding device 10: wafer
12: cassette 20: die
30: Wafer ring 40: Stage
50: pickup device 60: gripper
100: die ejecting apparatus 102: die ejecting apparatus
110: ejecting unit 120: holder
140: Main body 200: Holder feeding unit
210: holder holding portion 300: holder holding unit
302: base panel 310: holder holder

Claims

A stage for supporting a dicing tape to which a plurality of dies are attached;
A main body including an ejecting unit disposed at a lower portion of the stage and selectively pushing up one of the dies upwardly and a driving portion for moving the ejecting unit in a vertical direction, And a support member which is provided on an inner surface of the holder and supports the ejecting unit to hold the ejecting unit in a state where the ejecting unit is embedded in the holder, Ejector;
A holder accommodating unit which is disposed at one side of the stage and accommodates holders each incorporating the ejecting units; And
And a holder transfer unit for transferring the holders between the die ejector and the holder housing unit for replacing the holder with the ejecting unit with one of the holders accommodated in the holder housing unit. The ejecting device.

The holder according to claim 1,
A base panel having a disk shape;
A plurality of holder housings mounted circumferentially on the base panel for housing the housings, respectively; And
And a rotation driving unit for rotating the base panel.

3. The die ejecting apparatus according to claim 2, wherein the holder accommodating unit is disposed on the opposite side of the cassette accommodating a plurality of wafers around the stage.

4. The holder according to claim 3,
A holder grip portion for holding an outer surface of the holder; And
And a conveying unit for moving the holder grip in horizontal and vertical directions,
Wherein the holder grip is coupled to the feeder with a gripper for pulling one of the wafers from the cassette and moving it onto the stage.

5. The die ejecting apparatus according to claim 4, wherein a groove for engaging with the holder grip is formed on the outer surface of the holder.

The holder according to claim 2,
A chuck configured to be inserted into an open lower portion of the holder; And
And a plurality of contact members which are configured to be protruded from the side surface of the chuck and closely contact the inner bottom surface of the opened lower portion of the holder to grip the holder.

[7] The apparatus of claim 6, wherein the chuck is provided with a piston having a vertically inclined upper inclined side surface formed therein and having a predetermined inclination,
Each of the contact members has an outer side surface that is in close contact with the inner bottom surface of the open bottom portion of the holder and an inner surface that is in close contact with the upper inclined side surface of the piston, Wherein the first and second plates are in close contact with each other.

8. The ejecting apparatus according to claim 7, wherein the chuck is provided with a moving passage of the contact members, and the moving passage has a slope gradually rising from the inside to the outside of the chuck.

The die ejecting apparatus according to claim 7, wherein the piston is provided with a permanent magnet, and the contact members are always in close contact with the upper inclined side surface by the magnetic force of the permanent magnet.