TW201430927A - Die ejecting apparatus - Google Patents

Abstract

Provided is a die ejecting apparatus. The apparatus includes a stage configured to support a dicing tape on which a plurality of dies is attached; a die ejector comprising an ejecting unit disposed under the stage and configured to selectively pushing up one of the dies upwardly, a body comprising a driving unit configured to vertically move the ejecting unit, and a holder, in which the ejecting unit is built, the holder having an open bottom to allow a top of the body to be inserted thereinto; a holder containing unit disposed on one side of the stage, in which holders with a plurality of ejecting units built-in, respectively, are contained; and a holder transfer unit configured to transfer the holders between the die ejector and the holder containing unit to replace the holder by one of the holders contained in the holder containing unit.

Description

Die exit device

Embodiments of the present invention relate to a die exit device, and more particularly to a die exiting a die including a die of a semiconductor device from a wafer in a semiconductor fabrication process to adhere the die to a substrate. Device.

Generally, a semiconductor device can be formed on a semiconductor wafer by repeating a series of semiconductor fabrication processes as a semiconductor substrate. The semiconductor device forming manner as described above can be separated by a cutting process and can be adhered to the substrate via a bonding process.

The apparatus for performing a die attach process may include a pickup module for clamping, separating a die on a wafer into a die including a semiconductor device, and clamping the die The attached module is placed on the substrate. The clamping module may include a base unit for supporting a wafer ring to a place where the wafer is attached, and a vertical separation for selectively moving the wafer to be supported by the base unit. The granules and the gripping module for picking up the dies from the wafer and attaching the dies to the substrate.

Generally, the die exit device includes an exit unit for vertically lifting the die to separate the die from the dicing tape, a support for supporting the exit unit, a drive unit for vertically moving the exit unit, and a support drive unit body. The die exit device as described above is disclosed in Korean Patent Registration No. 10-090750 and Korean Patent Publication No. 10-2009-0108447.

On the other hand, when exchanging the exit unit and the bracket to correspond to the size of the die, since a considerable amount of time is used to align the angle of rotation and exit the center of the unit and the bracket, the use of the die attach device using the die exit device will Significantly lower.

One embodiment of the present invention provides a die exit device that is capable of very simple exchange of die exit units and brackets.

According to an embodiment of the present invention, a die exit device includes: a pedestal for supporting a dicing tape attached to a plurality of dies; and a die ejector disposed under the pedestal for selectively Pushing one of the above-mentioned dies up one of the exiting units, including a body for vertically moving the ejecting unit and a first bracket, wherein the ejecting unit is built in the first bracket and the first bracket has a lower opening To allow insertion of one of the top ends of the body; a bracket carrying unit disposed on one side of the base, the bracket carrying unit having a plurality of second brackets and a plurality of exit units; and a bracket transport unit for transporting the crystal And replacing the second bracket between the granular ejector and the bracket carrying unit, and replacing the first bracket with one of the second brackets in the bracket carrying unit.

According to an embodiment of the present invention, the bracket carrying unit comprises: a base panel having a disc shape; and a plurality of bracket carrying members disposed on the base panel along a circumferential direction to respectively carry the second bracket And a rotary drive for rotating the base panel.

According to an embodiment of the present invention, the bracket carrying unit is placed on the opposite side of a card holder carrying a plurality of wafers, and the base is placed on the above A bracket carrying unit and the above clip.

According to an embodiment of the present invention, the bracket transport unit includes: a bracket grabber for grasping an outer surface of one of the first brackets; and a transmitting member for transmitting the bracket grab horizontally or vertically And the above-mentioned bracket grabber is coupled with the above-mentioned transporting member and one of the clips that are ejected from the clip and transporting one of the tantalum wafers to one of the grippers on the base.

According to an embodiment of the invention, a groove for coupling with the bracket grabber is formed on the outer surface of the bracket.

According to an embodiment of the present invention, the bracket bearing member includes: a chuck for inserting the lower opening of the first bracket; and a plurality of contact elements for protruding from one side of the chuck, and One of the inner surfaces of the lower opening of the bracket is tightly coupled to grasp the first bracket.

According to an embodiment of the present invention, wherein the piston for vertically moving comprises an upper slope having a predetermined gradient, the piston is placed in the chuck, and the contact elements respectively comprise the upper portion and the bracket The inner surface of the opening is closely connected to an outer surface and an inner surface for tightly connecting to the upper slope of the piston, and the vertical movement of the piston is close to the inner surface of the lower opening of the first bracket connection.

According to an embodiment of the invention, the plurality of moving paths of the contact elements are provided in the chuck, and the moving path has a gradient gradually increasing from the inside of the chuck to the outside of the chuck.

According to an embodiment of the present invention, a permanent magnet is built in the piston, and the contact member is in close contact with the upper slope due to the relationship of the permanent magnet.

1‧‧‧ device

10‧‧‧矽 wafer

12‧‧‧Card holder

20‧‧‧ grain

30‧‧‧矽 wafer ring

32‧‧‧Cut tape

40‧‧‧Base

42‧‧‧ Grabber

44‧‧‧Extension ring

50‧‧‧Clamping device

60‧‧‧Clipper

70‧‧‧rails

100‧‧‧ die exit device

102‧‧‧ die exitor

110‧‧‧Support exit unit

112‧‧‧ air chamber

120‧‧‧ bracket

122‧‧‧Upper panel

122A‧‧‧Perforation

122B‧‧‧vacuum holes

124‧‧‧Shell

126‧‧‧Support parts

128‧‧‧ trench

129‧‧‧ alignment notches

130‧‧‧Support drive unit

132‧‧‧ head

134‧‧‧ drive shaft

136, 186, 350‧‧‧ permanent magnets

140‧‧‧ Ontology

148‧‧‧ Positioning tips

170‧‧‧First sealing element

172‧‧‧Second sealing element

180‧‧‧Exit device

182‧‧‧Exit the tip

184‧‧‧Support panel

190‧‧‧ bracket

192‧‧‧Upper panel

192A, 216‧‧‧ perforation

194‧‧‧ Shell

200‧‧‧Bracket transfer unit

210‧‧‧ bracket grabber

212‧‧‧Base block

214‧‧‧ openings

220‧‧‧Stop block

230‧‧‧Capture parts

232‧‧ ‧ spring

240‧‧‧Clip drive

250‧‧‧Catch block

252‧‧‧ first side

254‧‧‧ second side

256‧‧‧ holes

258‧‧‧stop components

260‧‧‧ optical sensor

270‧‧‧Transfer parts

280‧‧‧ horizontal transfer parts

290‧‧‧Vertical transmission parts

300‧‧‧ bracket bearing unit

302‧‧‧Base panel

304‧‧‧Rotary drive

310‧‧‧Bear bearing parts

320‧‧‧ chuck

322‧‧‧Moving path

330‧‧‧Drive contact elements

340‧‧‧Piston

342‧‧‧Upper slope

360‧‧‧Piston drive

The embodiments of the present invention are further understood by the following description in conjunction with the accompanying drawings in which: FIG. 1 is a schematic diagram showing a die exit device according to an embodiment of the present invention; Figure 1 is a cross-sectional view of the susceptor; Figure 3 is a cross-sectional view of the die ejector shown in Figure 2; and Figures 4 and 5 show the exit using the die ejector shown in Figure 3. FIG. 6 is a cross-sectional view showing the stent and the body shown in FIG. 3; and FIG. 7 is a cross-sectional view showing another embodiment of the stent and the exit unit shown in FIG. 3; Figure 8 is a schematic perspective view showing the stent grasper of the stent delivery unit shown in Figure 1; Figure 9 is a schematic sectional view showing the stent grasper shown in Figure 8; The clipping block and the gripping member are shown; Fig. 11 is an enlarged schematic cross-sectional view showing the rack carrying unit shown in Fig. 1; and Figs. 12 and 13 are enlarged views showing the action of the rack carrying unit shown in Fig. 11. Schematic diagram of the section.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described below, and may be embodied in different forms derived therefrom. The examples provided below allow the field to be technically The inventors fully understand the scope of the invention and do not complete the invention.

When an element is referred to or connected to another element or another layer, the element can be placed directly or directly connected to the other element or other element, or other layers can be placed therebetween. Differently, when a component is placed directly or directly connected to another component, no other component is in between. Differently, when an element is placed directly or directly connected to another element, no other element is in between. The first, second, third, and similar terms are used when describing different components, components, areas, layers, and/or components. However, elements, components, areas, layers, and/or components are not limited thereto.

The following technical terms used to describe the exemplary embodiments are not intended to limit the invention. In addition, all terms, including technology or science, have the same meaning and are understood by those skilled in the art without a different definition. The terms defined in the general dictionary can be understood to have the same meaning as the context of the related art description and the embodiments of the present invention. If it is not clearly defined, it will not be understood as an ideal or excessive external intuition.

The embodiments of the present invention will be described with reference to the schematic drawings of the exemplary embodiments. Accordingly, for example, variations in the shape of the drawings may vary depending on the method of manufacture, and/or the permissible errors may be fully predicted. Therefore, the embodiments of the present invention are not limited to the specific shapes shown in the drawings, but include deformations of the shapes, and the areas shown in the drawings are schematic views, and the shapes thereof are neither described as specific shapes nor limited. The scope of the invention.

1 is a schematic view showing a die exit device 100 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view showing the susceptor 40 shown in FIG. 1. Fig. 3 is a cross-sectional view showing the die ejector 102 shown in Fig. 2.

Referring to Figures 1 through 3, the die exit device 100 can be used to attach a die 20 to a substrate by a die attach process that separates the die 20 of the semiconductor component from the germanium wafer 10. In particular, the tantalum wafer 10 can be used to adhere to the dicing tape 32 and the dicing tape 32 can be disposed on the tantalum wafer ring 30 having a larger diameter than the tantalum wafer 10.

The crucible wafer ring 30 can be grasped by the gripper 42 placed on the base 40, and the edge portion of the dicing tape 32 can be supported by the extension ring 44 placed on the base 40. The gripper 42 can move the crucible ring 30 downward vertically to extend the cutting strip 32. Due to the above, the spacing between the dies 20 attached to the dicing tape 32 will increase.

The die exit device 100 can be placed under the susceptor 40 to selectively push the die 20 up to separate the die 20 from the dicing tape 32, and the gripping device 50 can be placed over the pedestal 40 so that The die 20 lifted by the die exit device 100 is gripped.

In addition, as shown in FIG. 1, the apparatus 1 for performing a die attach process includes a clip 12 for accommodating a plurality of wafers 10 and a person for exiting and transferring one of the wafers 10 from the clip 12 to the pedestal The gripper 60 on the 40.

The gripper 60 can be transported horizontally by the transfer member 270, and the guide rail 70 for guiding the crucible wafer 10 to be transported by the gripper 60 can be placed between the clip 12 and the base 40.

On the other hand, not shown in the drawings, the gripper 42 may have an approximately circular shape. In particular, the gripper 42 can be divided into two gripping members that face each other to provide a transport path for the gripper 60, and the gripper 60 can be transferred via the gap between the two gripping members.

Referring to FIG. 3, the die exit device 100 can be used to self-cut the tape 32. Exit the die 20.

According to an embodiment of the present invention, the die exit device 100 may include a die exiter 102 for pushing the die 20 up to the exit unit 110, a support 120 supporting the exit unit 110, and a vertical movement exit unit 110. The driving unit 130 and the body 140 supporting the driving unit 130.

The exit unit 110 for selectively exiting one of the dies 20 can push the selected die 20 up. The driving unit 130 may include a head 132 coupled to the exit unit 110 and a drive shaft 134 for transmitting a driving force. Although not shown in detail, the drive shaft 134 can be coupled to a power supply unit (not shown) to provide zone operating rates, and the power supply unit can be an electric motor, a cylinder, a power transfer element, and the like that utilizes different methods.

For example, the exit unit 110 can be approximately square-shaped and, as shown, can be a plenum 112 having an upper opening. For example, the exit unit 110 includes a support portion having a disk shape and an exit portion placed on the support portion and having a square column shape. Compressed air may be provided to the plenum 112 via a drive shaft 134.

The bracket 120 has an internal space that accommodates the exit unit 110. For example, the bracket 120 includes a top panel 122 having at least one perforation 122A to allow vertical movement of the exit unit 110, and a housing 124 extending downwardly from the upper panel 122 and having a bottom opening.

The outer casing 124 having a bottom opening can be coupled to the body 140, and the head 132 and the drive shaft 134 of the drive unit 130 can be vertically moved in the body 140.

For example, the outer casing 124 and the body 140 of the bracket 120 are each an approximately circular tubular shape. However, the scope of the present invention is not limited to the outer casing 124 and the present The shape of the body 140.

The top of the body 140 can be inserted into the opening below the outer casing 124. For example, as shown, the threshold of the restriction angle of the insertion body 140 can be determined by the outer surface above the body 140.

On the other hand, the support member 126 is the inner surface of the outer casing 124. The support member 126 can be used to limit the downward movement of the exit unit 110, and can also be used to carry the exit unit 110 when the bracket 120 and the exit unit 110 are separated from the body 140.

The horizontal movement of the exit unit 110 within the bracket 120 is limited by the perforations 122A formed in the upper panel 122 and is only allowed to move vertically. In particular, the upward movement of the exit unit 110 can be limited by the upper panel 122, with its downward movement being limited by the support member 126. Based on the above, the exit unit 110 is only allowed to move vertically within the bracket 120 by a predetermined distance. The exit unit 110 and the bracket 120 can be replaced at the same time if necessary.

According to an embodiment of the present invention, when the replacement of the exit unit 110 is required to change the size of the corresponding die 20, the bracket 120 and the exit unit 110 can be replaced at the same time. In particular, the replaceable seats constituting the exit unit 110 and the bracket 120, respectively, may be prepared in advance for the die 20, and the exit unit 110 and the bracket 120 may be selectively used depending on the size of the corresponding die 20.

In particular, as shown in FIG. 1, the die exit device 100 includes a bracket transfer unit 200 that picks up and transports the bracket 120 including the exit unit 110 to transport the exit unit 110, the bracket 120, and the bracket for carrying the transport by the bracket transport unit 200. The bracket carrier unit 300 of 120. A plurality of brackets 120 having built-in exit units corresponding to different die sizes and shapes, which can be carried on the carrier carrier Yuan 300. The rack transport unit 200 and the rack load unit 300 will be described below.

In addition, the structure of the coupling bracket 120 and the body 140 and the structure of the coupling exit unit 110 and the driving unit 130 can be configured to more easily replace the exit unit 110 and the bracket 120.

For example, not shown in the drawings, the body 140 and the outer casing 124 may be coupled to each other by magnetic force. That is, a permanent magnet (not shown) can be placed on one of the body 140 and the outer casing 124, and the body 140 and the outer casing 124 are coupled to each other.

Moreover, the exit unit 110 can be coupled to the head 132 of the drive unit 130 by a magnetic force. For example, the permanent magnet 136 can be placed within the head 132 and the support portion of the exit unit 110 can be made of a magnetic material.

4 and 5 are schematic cross-sectional views showing a method of exiting the die 20 using the die exiter 102 shown in Fig. 3.

Referring to Figures 4 and 5, which are not shown in the drawings, the die ejector 102 can be moved upward by an additional drive unit (not shown) so that the upper panel 122 of the bracket 120 can be closely coupled to the dicing tape 32. .

Next, the exit unit 110 can be moved upward by the driving unit 130 so as to protrude from the upper surface of the upper panel 122 shown in FIG. 4, so that the associated cutting tape 32 together pushes up the selected die 20. In this embodiment, the upper panel 122 has a plurality of vacuum holes 122B (refer to FIG. 3) to absorb a portion of the dicing tape 32.

For example, as shown, a plurality of vacuum holes 122B can be placed around the perforations 122A and the exit unit 110 to absorb the selected crystal grains. A portion of the peripheral portion 20 is cut 32. By absorbing a portion of the dicing tape 32 at the periphery of the selected die 20, the selected die 20 is allowed to easily detach from the dicing tape 32.

In particular, as shown in FIG. 4, when the ejecting unit 110 protrudes upward from the upper panel 122, the edge portion of the selected die 20 can be separated from the dicing tape 32.

Next, as shown in FIG. 5, compressed air may be injected into the plenum 112. In this embodiment, since the upper surface of the exit unit 110 is tightly coupled to the dicing tape 32, a portion of the dicing tape 32 located at the exit unit 110 can be partially inflated, thereby allowing the selected die 20 to be gradually separated from the dicing tape 32. .

Compressed air, on the other hand, may be provided by the drive shaft 134 and the head 132, and vacuum may be provided to the bracket 120 via the body 140. In this case, as shown, the first sealing element 170 and the second sealing element 172 can be placed between the body 140 and the outer casing 124 and between the exit unit 110 and the head 132, respectively.

Fig. 6 is a side view showing the holder 120 and the body 140 shown in Fig. 3.

Referring to Fig. 6, a positioning tip 148 for aligning the rotation angle of the bracket 120 and the exit unit 110 can be placed on the outer surface of the body 140, and the positioning tip 148 is inserted into a corresponding alignment recess 129, the alignment notch. 129 is located at the opening below the bracket 120.

In particular, according to an embodiment of the present invention, the plurality of brackets 120 and the exit unit 110 are prepared according to the type of the die 20, and when the replacement is required, the completed bracket 120 and the exit unit 110 can be replaced in a short time. Due to the above matters, since the time for replacing the bracket 120 and the exit unit 110 is reduced, the usage rate of the die attaching device including the die exit device 100 is also followed. Rise.

Fig. 7 is a schematic cross-sectional view showing another embodiment of the holder 120 and the exit unit 110 shown in Fig. 3.

Referring to Figure 7, in accordance with another embodiment of the present invention, an exit device 180 disposed within a bracket 190 including an upper panel 192 and a housing 194 includes an exit tab 182 that is inserted into a perforation 192A formed in the upper panel 192 of the bracket 190 and The support panel 184 is placed on the bracket 190 and supports the exit tip 182.

As shown, the support panel 184 includes a permanent magnet 186 corresponding to a permanent magnet 136 placed on the head 132 of the drive unit 130. The exit unit 180 and the head 132 are due to the magnetic force generated by the permanent magnets 136, 186. Coupled to each other. Also, due to the magnetic force of the permanent magnet 186 of the support panel 184, the exit tip 182 can also be coupled to the support panel 184.

Fig. 8 is a schematic perspective view showing the holder gripper 210 of the stent transport unit shown in Fig. 1. Fig. 9 is a schematic cross-sectional view showing the stent grasper 210 shown in Fig. 8. Fig. 10 shows the gripping block and the gripping member shown in Fig. 9.

Referring to Figures 8 to 10, the carriage transport unit 200 can grasp and transport the load exit unit 110, and replace the exit unit 110 and the bracket 120. That is, the bracket 120 can be grasped from the body 140 and can be transferred to the bracket carrying unit 300, and the new bracket 120 can be grasped from the bracket carrying unit 300 to be coupled to the body 140.

In particular, the carriage transport unit 200 includes a stent gripper 210 for grasping the outer surface of the stent 120 and a transporting member 270 for transporting the stent grasper 210 horizontally and vertically (refer to FIG. 1). In this embodiment, the transmission unit The member 270 can be used to transfer the gripper 60, that is, the bracket grabber 210 can be coupled to the transfer member 270 and the gripper 60.

The transporting member 270 includes a horizontal transporting member 280 for horizontally transporting the gripper 60 and the rack grabber 210, and a vertical transporting member 290 for vertically transporting the stent gripper 210. In this embodiment, the horizontal transfer members 280 can be used in common with the gripper 60 and the stent gripper 210.

For example, as shown in FIG. 1, the clip 12, the die exiter 102, the base 40, and the carrier carrying unit 300 may be placed on one of the horizontal directions, and the horizontal transfer member 280 may be transported in the horizontal direction. The picker 60 and the bracket grabber 210.

That is, the rack carrying unit 300 can be placed on one side of the base 40, and the base 40 can be placed between the clip 12 and the rack carrying unit 300. The horizontal transfer member 280 can transport the gripper 60 and the stent gripper 210 in the direction in which the clip 12, the base 40, and the rack carrying unit 300 are placed. For example, the horizontal transfer member 280 can be controlled using a drive portion including an engine, a ball screw, and a ball nut, and a linear guide member such as a linear motion guide.

As described above, since the rack carrying unit 300 is placed on one side of the base 40 on which the die ejector 102 is placed (lower space of the susceptor 40), a wide range can be used. Also, since the rack grabber 210 is conveyed together with the gripper 60, it is necessary to provide additional driving force to the rack transport unit 200. Therefore, the area occupied by the die exit device 100 can be reduced, and the cost of manufacturing the die exit device 100 can be further reduced.

On the other hand, the vertical transfer member 290 can be combined with the horizontal transfer member The 280 is coupled and can be transmitted in a horizontal direction. Furthermore, the vertical transport member 290 can transport the stent gripper 210 in a vertical direction to grasp and place the stent 120. For example, the vertical transfer member 290 can be constructed using a pneumatic or hydraulic cylinder.

According to an embodiment of the present invention, as shown in FIGS. 8 and 9, the stent gripper 210 includes a base block 212 placed on the vertical transfer member 290 and a plurality of gripping members 230 for gripping the outer surface of the bracket 120. . The base block 212 has a receiving portion for receiving the bracket 120, and the gripping member 230 can grasp the bracket 120 received by the receiving portion of the base block 212. For example, the base block 212 has an opening 214 to receive the bracket 120 and the gripping member 230 can be placed in the opening 214.

The gripping member 230 can be moved forward and backward by the gripping driver 240 on both sides of the base block 212. For example, the pneumatic cylinders as the gripping drive 240 can be placed on both sides of the base block 212, and the recess in which the gripping member 230 is placed is located on the inner surface of the opening 214 of the base block 212.

In accordance with an embodiment of the present invention, the gripping block 250 is placed in a recess on the inner surface of the opening 214 and is connectable to the gripper driver 240, respectively. In the present embodiment, the gripping member 230 can be placed on the gripping block 250. For example, the two gripping members 230 can be placed on the individual gripping blocks 250.

In particular, the gripping member 230 is elastically disposed on the gripping block 250, and the direction in which the gripping member 230 is elastically moved is perpendicular to the outer surface of the bracket 120, respectively. In detail, the gripping member 230 may be disposed in the gripping block 250 to elastically move in a radial direction with respect to a central axis of the bracket 120. When the gripping member 230 is tightly coupled to the outer surface of the bracket 120 by the gripping driver 240, the contact surface of the individual gripping members 230 is the same as the tangent plane of the outer surface of the bracket 120.

On the other hand, as shown in FIG. 10, the side of the gripping block 250 facing the bracket 120 includes a first side 252 and a second side 254 which form an obtuse angle, and the gripping member 230 can elastically position the first side 252, respectively. And a second side 254. Moreover, the angle of the clamping member 230 disposed on the first side 252 and the second side 254 may be an acute angle. Therefore, when the bracket 120 is grasped, it is sufficient to apply sufficient elastic restoring force to the bracket 120 by the gripping member 230.

For example, the gripping member 230 as shown can be supported by the spring 232 elastic force. In detail, the spring 232 and the holes 256 into which the gripping members 230 are inserted are respectively located on the first side 252 and the second side 254 of the gripping block 250. Also, the gripping members 230 are respectively disposed to be protruded by the first side surface 252 and the second side surface 254. In this embodiment, as shown, the stop element 258, which limits the extent to which the gripping member 230 projects, is located in the aperture 256 of the gripping block 250.

However, the elastic support structure of the gripping member 230 can be variously changed, and thus the present invention is not limited thereto. For example, a well-known spring plunger can be placed on the gripping block 250.

On the other hand, as shown in FIG. 3, the groove 128 into which the gripping member 230 is inserted may be disposed on the outer surface of the bracket 120, that is, on the outer surface of the outer casing 125. In detail, when the bracket 120 is gripped, the bracket 120 is inserted into the opening 214 of the base block 212 as the bracket transport unit 200 is lowered, and then the gripping member 230 is inside the groove 128 by the grip driver 240. The surface is tightly connected.

Referring to FIG. 8, the stop block 220, which limits the upward movement of the support 120 above the base block 212, is located at the base block 212. The stop block 220 can limit the extent to which the bracket 120 is inserted into the opening 214 of the base block 212 when the bracket 120 is gripped. Moreover, when the bracket 120 is disposed on the body 140, the stop block 220 can be vertically transmitted. The delivery member 290 transmits pressure to the bracket 120. On the other hand, the base block 212 has a structure in which the top end of the opening 214 is closed. In this embodiment, the stop block 220 can be omitted.

In another aspect, the stent gripper 210 includes a sensor that senses the stent 120 received by the opening 214. For example, the optical sensor 260 for detecting the bracket 120 in the opening 214 can be disposed at one side of the base block 212, and the through hole 216 connects the opening 214 and the optical sensor 260 to each other. That is, the optical sensor 260 can emit light through the perforations 216, and can also receive the light reflected by the bracket 120, thereby determining whether the bracket 120 is present.

Fig. 11 is an enlarged schematic cross-sectional view showing the carrier carrying unit 300 shown in Fig. 1. Figs. 12 and 13 are enlarged cross-sectional views showing the operation of the holder carrying unit 300 shown in Fig. 11.

Referring to Figures 11 through 13, the rack carrying unit 300 includes a plurality of rack carrying members 310. According to an embodiment of the present invention, the rack carrying unit 300 includes a base panel 302 having a disk shape and a rotary driver 304 for rotating the base panel 302 and the plurality of bracket bearing members 310 disposed on the base panel 302 (refer to FIG. 1). .

When the bracket needs to be replaced, the rotary drive 304 can rotate the base panel 302 to place the idle bracket carrier member 310 on the path of the bracket grabber 210 to the carrier bracket 120 by the bracket transport unit 200, and then rotate the base panel 302 in a specific manner. One of the brackets 120 still on the base panel 302 is grasped by the bracket grabber 210.

The bracket carrier member 310 can be disposed to the base panel 302 in a circumferential direction. The bracket carrying members 310 can be respectively included to be inserted under the housing 124 The open chuck 320 and the inner surface for projecting from the outer surface of the chuck 320 and open to the bottom of the outer casing 124 are closely coupled to grip the bracket 120 and the plurality of contact members 330.

The chuck 320 can be disposed on the base panel 302, and the piston 340 that can vertically move the drive contact member 330 can be placed on the chuck 320. In particular, the piston 340 can be moved vertically by the piston driver 360 placed under the base panel 302, and the perforations through which the drive shaft of the piston driver 360 passes can be placed on the base panel 302. For example, the piston driver 360 can be a pneumatic or hydraulic cylinder, but is not limited thereto.

Piston 340 is approximately cylindrical and, as shown, includes a slope 342 having a predetermined gradient. In particular, the individual contact elements 330 have an outer surface that is in intimate contact with the inner surface of the opening below the outer casing 124, and an inner surface that is in intimate contact with the upper side 342. The inner surface of the contact element 330 slides over the upper slope 342 of the piston 340.

In particular, as shown, because of the vertical movement of the piston 340, the contact member 330 can be moved toward the interior or exterior of the chuck 320, thereby grasping or lowering the bracket 120.

On the other hand, the moving path 322 that the contact element 330 moves can be provided by the chuck 320. The moving path 322 has a gradient that gradually rises from the inside of the chuck 320 to the outside of the chuck 320. Thus, as shown, as the piston 340 is raised, the contact member 330 can slide over the upper slope 342 of the piston 340 and thus project outwardly from the chuck 320.

As described above, according to an embodiment of the present invention, when the bracket 120 transmitted by the bracket transport unit 200 is coupled to the chuck 320, the piston 340 rises, borrowing This allows the contact element 330 to be in intimate contact with the inner surface of the opening below the outer casing 124. Therefore, the central axis of the bracket 120 and the central axis of the chuck 320 can be accurately overlapped, so that when the bracket 120 is grasped from the chuck 320, the gripping error caused by the misalignment of the shaft center can be avoided.

In accordance with an embodiment of the present invention, the permanent magnet 350 can be built into the piston 340, thereby allowing the contact element 330 to be in intimate contact with the upper slope 342 forever due to the magnetic force of the permanent magnet 350. Therefore, when the piston 340 is raised and lowered, the contact member 330 can be moved to the inside and outside of the chuck 320.

Referring to Fig. 8, the bracket 120 supported by the gripping member 230 in the opening 214 of the stent gripper 210 is supported by the elastic force of the gripping member 230, so that the bracket 120 can be horizontally moved in the opening 214. In particular, the bracket 120 is movable in the direction in which the gripping block 250 moves back and forth, and thus the direction in which the gripping block 250 of the bracket gripper 210 moves back and forth is exactly the arrangement of the gripping driver 240 and the gripping block 250. The direction is parallel to the direction in which the horizontal transport member 280 transmits the stent gripper 210. This is used to stably grasp or place the stent 120, although slight misalignment occurs between the central axis of the body 140 or the chuck 320 and the central axis of the stent 120 when the stent 120 is grasped or placed by the stent grasper 210.

Moreover, although not shown in the figure, in order to stably grasp or place the bracket 120, the inner corner of the opening below the outer casing 124 is guided, and the upper corner of the body 140 and the upper corner of the chuck 320 are also led.

As described above, according to the present embodiment, the rack carrying unit 300 is located opposite the clip 12 such that the base 40 can be placed between the rack carrying unit 300 and the clip 12. Further, the stent gripper 210 and the gripper 60 can be transported using the horizontal transfer member 280. Therefore, the overall size of the die exit device 100 can be reduced. The area, the cost of manufacturing the die exit device 100 can also be reduced.

Although the die exit device is described with reference to a specific embodiment, it is not limited thereto. Therefore, those skilled in the art can understand that various modifications and variations can be made without departing from the spirit and scope defined by the scope of the invention.

1‧‧‧ device

10‧‧‧矽 wafer

12‧‧‧Card holder

40‧‧‧Base

60‧‧‧Clipper

70‧‧‧rails

100‧‧‧ die exit device

102‧‧‧ die exitor

200‧‧‧Bracket transfer unit

210‧‧‧ bracket grabber

270‧‧‧Transfer parts

280‧‧‧ horizontal transfer parts

290‧‧‧Vertical transmission parts

300‧‧‧ bracket bearing unit

302‧‧‧Base panel

304‧‧‧Rotary drive

Claims (9)

A die exit device includes: a pedestal for supporting a dicing tape attached to a plurality of dies; and a die ejector for placing the pedestal under the pedestal for selectively selecting one of the dies Pushing up one of the exit units, including a body for vertically moving the exit unit and a first bracket, wherein the exit unit is built in the first bracket and the first bracket has a lower opening to allow one of the top ends of the body Inserting; a bracket carrying unit disposed on one side of the base, the bracket carrying unit having a plurality of second brackets and a plurality of exit units; and a bracket transporting unit for transporting the die exiting device and the bracket carrying The second bracket between the units is replaced by one of the second brackets in the bracket carrying unit. The die exiting device of claim 1, wherein the bracket carrying unit comprises: a base panel having a disc shape; and a plurality of bracket carrying members disposed on the base panel along a circumferential direction, To respectively carry the second bracket; and a rotary driver for rotating the base panel. The die exit device of claim 2, wherein the bracket carrying unit is placed opposite a clip carrying one of the plurality of wafers, and the base is placed between the bracket carrying unit and the clip. The die exit device of claim 3, wherein the bracket transfer unit comprises: a bracket grabber for gripping an outer surface of one of the first brackets; a transporting member for transporting the bracket grabber horizontally or vertically, wherein the bracket gripper and the transporting member and the The clip exits and one of the above-mentioned wafers is transferred to one of the grippers on the base. The die exit device of claim 4, wherein a groove for coupling with the bracket grabber is formed on the outer surface of the bracket. The die exiting device of claim 2, wherein the bracket bearing member comprises: a chuck for inserting the lower opening of the first bracket; and a plurality of contact elements for the chuck One of the sides protrudes and is tightly coupled to an inner surface of one of the lower openings of the bracket to grasp the first bracket. The die exit device of claim 6, wherein the piston for vertically moving comprises an upper slope having a predetermined gradient, the piston is placed in the chuck, and the contact elements are respectively included An outer surface closely coupled to the inner surface of the lower opening of the bracket and an inner surface for tightly connecting to the upper slope of the piston, and the vertical movement of the piston and the first bracket The inner surface of the lower opening is closely connected. The die exit device of claim 7, wherein the plurality of moving paths of the contact elements are provided in the chuck, and the moving path has a ladder gradually increasing from the inside of the chuck to the outside of the chuck. degree. The die exit device of claim 7, wherein a permanent magnet is built in the piston, and the contact member is in close contact with the upper slope because of the permanent magnet.