CN103794531A - Bare core removing device - Google Patents
Bare core removing device Download PDFInfo
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- CN103794531A CN103794531A CN201310522203.2A CN201310522203A CN103794531A CN 103794531 A CN103794531 A CN 103794531A CN 201310522203 A CN201310522203 A CN 201310522203A CN 103794531 A CN103794531 A CN 103794531A
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- naked core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Robotics (AREA)
- Manipulator (AREA)
Abstract
The invention provides a bare core removing device. The device comprises a workbench, a bare core removing apparatus, a carriage holding unit and a carriage transmitting unit. The workbench is configured to support a cutting belt, and multiple bare cores are adhered to the cutting belt. The bare core removing apparatus includes removing units, a main body and carriages. The removing units are arranged under the workbench and are configured to selectively lift one of the bare cores. The main body has a driving unit configured to be a vertical mobile removing unit. The removing units are arranged inside the carriages each of which has a lower opening to allow the top of the main body to be inserted into the carriages. The carriage holding unit is disposed at one side of the workbench. The carriages with the removing units inside are accommodated in the carriage holding unit. The carriage transmitting unit is configured between the bare core removing apparatus and the carriage holding unit to transmit the carriages, so one of the carriages accommodated in the carriage holding unit replaces another carriage.
Description
Technical field
Embodiments of the present invention relate to a kind of naked core discharger, more specifically, relate to a kind ofly in semiconductor fabrication, comprise semiconductor device, at interior naked core, naked core are bonded in to on-chip naked core discharger thereby isolate from wafer.
Background technology
Generally, can form semiconductor device as on the Silicon Wafer of semiconductor chip by repeatedly carrying out a series of manufacturing process.The semiconductor device forming as mentioned above can be separated and can be bonded to substrate by bonding process by cutting process.
The device of carrying out naked core bonding process can comprise pickup model and bonding module, and pickup model picks up and isolate naked core from wafer (be divided into and comprise semiconductor device at interior naked core), and bonding module is attached to the naked core picking up on substrate.Pickup model can comprise supporting wafer ring (wafer is attached on this wafer central) thus countertop unit, be configured to vertically to move and the wafer supporting from countertop unit, isolate selectively the discharger of naked core and from wafer, pick up naked core and naked core is pasted to the pickup unit of substrate.
Usually, naked core discharger can comprise vertical lifting naked core in case from cutting belt, isolate naked core deliverying unit, hold the bracket of deliverying unit, the driver element of vertical mobile deliverying unit, and hold the main body of driver element.The example of naked core discharger described above is disclosed in Korean Patent Registration No.10-0975500 and Korean Patent notification number No.10-2009-0108447.
On the other hand, in the time changing deliverying unit and bracket with the size of corresponding naked core, because quite a large amount of time is for the anglec of rotation and the center of align deliverying unit and bracket, therefore use the utilization of capacity of the naked core bonding facility of naked core discharger to become reduction significantly.
Summary of the invention
Embodiments of the present invention provide a kind of naked core discharger, and it can change naked core deliverying unit and bracket very simply.
According to the execution mode of some demonstrations, naked core discharger can comprise workbench, naked core displacer, bracket accomodating unit and bracket transfer unit.Workbench is configured to support cutting belt, and multiple naked cores are attached in cutting belt.Naked core displacer comprises deliverying unit, main body and bracket; Deliverying unit is arranged on below workbench and is configured to selectively in lifting naked core upwards; Main body has the driver element that is configured to vertical mobile deliverying unit; Deliverying unit is built in bracket, and bracket has under shed and inserts wherein with the top that allows main body.Bracket accomodating unit is arranged in a side of workbench, and multiple deliverying units respectively built-in multiple brackets are wherein contained in respectively in this bracket accomodating unit.Thereby bracket transfer unit is configured to transmit bracket one of them bracket being contained in bracket accomodating unit between naked core displacer and bracket accomodating unit and changes this bracket.
According to the execution mode of some demonstrations, described bracket accomodating unit can comprise the base portion panel that is plate-like; Multiple being along the circumferential direction arranged on respectively on base portion panel to hold the bracket accommodation section of bracket; And be configured to rotate the rotary driving part of base portion panel.
According to the execution mode of some demonstrations, described bracket accomodating unit can be arranged on the opposite of the box that accommodates multiple wafers.Now, workbench can be arranged between bracket accomodating unit and box.
According to the execution mode of some demonstrations, described bracket transfer unit can comprise the bracket fixture that is configured to clamp bracket outer surface; And be configured to level and transmit vertically the transfer part of bracket fixture.Now, bracket fixture can be connected with transfer part together with clip, and described clip is for taking out wafer and be delivered to workbench from box.
According to the execution mode of some demonstrations, on the outer surface of bracket, can form and be configured to the groove that engages with bracket fixture.
According to the execution mode of some demonstrations, described bracket accommodation section can comprise respectively and is configured to insert the chuck in bracket under shed; And multiple being configured to stretched out and forms close contact to clamp the contact element of bracket with the inner surface of bracket under shed from a side of chuck.
According to the execution mode of some demonstrations, be configured to vertically to move and comprise that the plunger of the side that tilts with predetermined inclination can be arranged in chuck, and contact element can comprise respectively and is configured to form the outer surface of close contact and be configured to form with the side that tilts of plunger the inner surface of close contact with the inner surface of bracket under shed, and contact element can be by the vertical movement of plunger and the inner surface of bracket under shed formation close contact.
According to the execution mode of some demonstrations, the mobile route of contact element can be arranged in chuck.Now, mobile route has the gradient rising gradually to outside from chuck inside.
According to the execution mode of some demonstrations, can built-in permanent magnet in plunger, contact element can remain close contact by the magnetic force of permanent magnet and the side that tilts.
Accompanying drawing explanation
By reference to the accompanying drawings, can understand in further detail from the following description the execution mode of demonstration, wherein:
Fig. 1 is the schematic diagram of naked core discharger of execution mode of demonstrating according to the present invention;
Fig. 2 is the schematic sectional view of the workbench shown in Fig. 1;
Fig. 3 is the constructed profile of the naked core displacer shown in Fig. 2;
Figure 4 and 5 are to utilize the naked core displacer shown in Fig. 3 to discharge the constructed profile of the method for naked core;
Fig. 6 is the end view of the bracket shown in Fig. 3 and main body;
Fig. 7 is the constructed profile of another embodiment of the bracket shown in Fig. 3 and deliverying unit;
Fig. 8 is the schematic isometric of the bracket fixture of the bracket transfer unit shown in Fig. 1;
Fig. 9 is the schematic sectional view of the bracket fixture shown in Fig. 8;
Figure 10 is the amplification profile of the fixture block shown in Fig. 9 and folder;
Figure 11 is the schematic diagram of the bracket accomodating unit shown in Fig. 1; And
Figure 12 and 13 is signal amplification views of the operation of the bracket accomodating unit shown in Figure 11.
Embodiment
Below, describe embodiments of the present invention in detail with reference to accompanying drawing.But the present invention is not limited to execution mode described below, and can embody with various form thus.It is in order to make those skilled in the art fully understand scope of the present invention that execution mode is below provided, rather than ideally completes the present invention.
In the time that element of description is arranged on or is connected to another element or layer, this element can be set directly at or be connected directly to another element and other elements or layer and can be arranged at therebetween.Differently, in the time that an element of description is set directly at or is connected directly to another element, do not have other elements therebetween here.In order to describe different elements, assembly, region, layer and/or parts, can use the such term of first, second, third, etc.But element, assembly, region, layer and/or parts are not limited to this.
Technical term is below used for describing the execution mode of demonstration, but is not limited to the present invention.Or if there is no different definition, all terms that comprise technology and scientific terminology have can be by the same implication that those skilled in the art understood.The term defining in general dictionary is understood to, describing correlation technique and have the implication identical with its context implication in embodiment of the present invention.If not restriction clearly, they not will appreciate that into idealized ground or outside implication exceedingly.
Schematic diagram with reference to the execution mode of wherein demonstrating is described embodiments of the present invention.According to it, can fully expect the change of shape of view, for example, the variation in manufacture method and/or admissible error.So, embodiments of the present invention can not be described as and are limited to the concrete shape of demonstration area in view but comprised form variations, and the region of demonstrating in view can be to illustrate substantially, its shape is neither describe the exact shape in this region and also do not limit the scope of the invention.
Fig. 1 is the schematic diagram of naked core discharger 100 of execution mode of demonstrating according to the present invention, and Fig. 2 is the schematic sectional view of the workbench 40 shown in Fig. 1.In addition, Fig. 3 is the constructed profile of the naked core displacer 102 shown in Fig. 2.
Referring to figs. 1 through 3, naked core discharger 100 can be used in naked core bonding process, for isolate the naked core 20 that comprises semiconductor device from wafer 10, then naked core 20 is bonded to substrate.Especially, wafer 10 can be arranged to be attached to cutting belt 32, and cutting belt 32 can be arranged on its diameter than on the large wafer central 30 of wafer 10 diameters.
Wafer central 30 can be clamped by the fixture 42 being arranged on workbench 40, and the marginal portion of cutting belt 32 can be supported by the extension ring 44 being arranged on workbench 40.Fixture 42 straight down mobile wafer central 30 so that stretching cutting belt 32.As its result, can extend the interval between the naked core 20 that is attached to cutting belt 32.
In addition, as shown in Figure 1, the device 1 of carrying out naked core bonding process can comprise the box 12 that holds multiple wafers 10, and from box 12, takes out one of them wafer 10 and be delivered to the clip 60 on workbench 40.
On the other hand, do not illustrate in the drawings, fixture 42 can have general toroidal.Especially, fixture 42 can be divided into two clamping components toward each other so that the bang path of clip 60 to be provided, and result clip 60 can transmit by the gap between two clamping components.
With reference to Fig. 3, naked core discharger 100 can be used to discharge naked core 20 from cutting belt 32.
According to present embodiment, naked core discharger 100 can comprise have the deliverying unit 110 of lifting naked core 20 upwards naked core displacer 102, hold the bracket 120 of deliverying unit 110, the driver element 130 of vertical mobile deliverying unit 110, and hold the main body 140 of driver element 130.
In order to discharge selectively one of them naked core 20, deliverying unit 110 is the selected naked core 20 of lifting upwards.Driver element 130 can comprise the head 132 that is connected with deliverying unit 110 and the driving shaft 134 of transmission of drive force.Although be not shown specifically, driving shaft 134 can be connected to provides the actuating force of actuating force feed unit (not shown), and actuating force feed unit can be by motor, cylinder, actuating force transmitting element, and utilizes the analog of the whole bag of tricks to form.
As embodiment, deliverying unit 110 can have roughly square column type, and can have as shown in the figure the air chamber 112 with upper shed.For example, deliverying unit 110 can comprise the support portion of plate-like and is arranged on support portion and has the discharge portion of square column type.Compressed air can be supplied in air chamber 112 by driving shaft 134.
The under shed of shell 124 can be connected with main body 140, and the head 132 of driver element 130 and driving shaft 134 can vertically move in main body 140.
As embodiment, shell 124 and the main body 140 of bracket 120 can have roughly round tube shape.But scope of the present invention is not limited to the shape of this shell 124 and main body 140.
The top of main body 140 can be inserted in the under shed of shell 124.As embodiment, as shown in the figure, the threshold that restriction main body 140 is inserted degree can be arranged on the upper outer surface of main body 140.
On the other hand, supporting member 126 can be arranged on the inner surface of shell 124.Supporting member 126 can be used for limiting moving down of deliverying unit 110, and also for support deliverying unit 110 in the time that bracket 120 separates with main body 140 with deliverying unit 110.
Be contained in the restriction that moving horizontally of deliverying unit 110 in bracket 120 is subject to the through hole 122A forming in plate 122 in the above, so only allow it vertically to move.Especially, moving up of deliverying unit 110 can be subject to the restriction of top panel 122, its move down the restriction that can be subject to supporting member 126.As its result, deliverying unit 110 is only allowed to vertically mobile one section of predetermined distance in bracket 120.If necessary, deliverying unit 110 and bracket 120 can together be replaced.
According to present embodiment, in the time must changing deliverying unit 110 with the change in size of corresponding naked core 20, bracket 120 and deliverying unit 110 can be changed simultaneously.Especially, can prepare in advance corresponding to the replacing group being formed by deliverying unit 110 and bracket 120 each naked core 20, each, and can use selectively deliverying unit 110 and bracket 120 according to the size of corresponding naked core 20.
Especially, as shown in Figure 1, naked core discharger 100 can comprise pick up and transmit bracket 120(and comprise deliverying unit 110) to change the bracket transfer unit 200 of deliverying unit 110 and bracket 120, and hold the bracket accomodating unit 300 of the bracket 120 being transmitted by bracket transfer unit 200.For size and the shape of corresponding naked core 20, multiple brackets 120 respectively with built-in deliverying unit can be contained in bracket accomodating unit 300.Bracket transfer unit 200 and bracket accomodating unit 300 are described below.
In addition, the structure that connects the structure of bracket 120 and main body 140 and be connected deliverying unit 110 and driver element 130 can be configured to complete more simply the replacing of deliverying unit 110 and bracket 120.
As embodiment, do not illustrate in the drawings, main body 140 and shell 124 can utilize magnetic picture to connect.In other words, permanent magnet (not shown) can be arranged on above in main body 140 and shell 124 to interconnect main body 140 and shell 124.
In addition, deliverying unit 110 can utilize magnetic force to be connected with the head 132 of driver element 130.For example, can be arranged on permanent magnet 136 is set in head 132, and the support portion of deliverying unit 110 can be made up of magnetic material.
Figure 4 and 5 are to utilize the naked core displacer 102 shown in Fig. 3 to discharge the constructed profile of the method for naked core 20.
With reference to Fig. 4 to 5, do not illustrate in the drawings, naked core displacer 102 can move up by additional driver element (not shown), so that the top panel 122 of bracket 120 can form close contact with cutting belt 32.
Then, as shown in Figure 4, deliverying unit 110 can move up to stretch out from the end face of top panel 122 by driver element 130, thus upwards the selected naked core 20 of lifting and cutting belt 32.In this case, top panel 122 can have multiple for the vacuum hole 122B(that holds part cutting belt 32 with reference to Fig. 3).
For example, as shown in the figure, multiple vacuum hole 122B can arrange (deliverying unit 110 is arranged in this through hole 122A) around through hole 122A, and can hold and be positioned at the outer part cutting belt 32 of placing of selected naked core 20.This makes to be positioned at the outer part cutting belt 32 of placing of selected naked core 20 by holding, and selected naked core 20 is easily separated from cutting belt 32.
Especially, as shown in Figure 4, in the time that deliverying unit 110 protrudes upward from top panel 122, the marginal portion of selected naked core 20 can be separated from cutting belt 32.
Then, as shown in Figure 5, compressed air can inject air chamber 112.In this case, because end face and the cutting belt 32 of deliverying unit 110 form close contact, being positioned at part cutting belt 32 on deliverying unit 110 can local inflation, therefore allows selected naked core 20 to separate gradually from cutting belt 32.
On the other hand, compressed air can be supplied with by driving shaft 134 and head 132, and vacuum can be provided in bracket 120 by main body 140.In this case, as shown in the figure, potted component 170 and 172 can be separately positioned between main body 140 and shell 124 and deliverying unit 110 and head 132.
Fig. 6 is the end view of the bracket 120 shown in Fig. 3 and main body 140.
With reference to Fig. 6, can be arranged on the outer surface of upper of main body 140 for the alignment pin 148 of bracket 120 and deliverying unit 110 anglecs of rotation alignings, corresponding to this, alignment slot 129(alignment pin 148 inserts wherein) can be arranged in the under shed of bracket 120.
Especially, according to present embodiment, prepare in advance many group brackets 120 and deliverying unit 110 according to the kind of naked core 20, in the time must changing, the replacing of bracket 120 and deliverying unit 110 can complete at short notice.As its result, owing to having reduced the time that is used for changing one group of bracket 120 and deliverying unit 110, can improve the utilization of capacity of the naked core stamping device that comprises naked core discharger 100.
Fig. 7 is the constructed profile of the bracket 120 shown in Fig. 3 and deliverying unit 110 another embodiment.
With reference to Fig. 7, another demonstration execution mode according to the present invention, be arranged on bracket 190(and comprise top panel 192 and shell 194) in deliverying unit 180 can comprise knock pin 182 and support panel 184, knock pin 182 is inserted in the through hole 192A forming in the top panel 192 of bracket 190, and support panel 184 is arranged on and in bracket 190, supports knock pin 182.
As shown in the figure, support panel 184 can comprise the permanent magnet 186 corresponding with being arranged on permanent magnet 136 in driver element 130 heads 132, so deliverying unit 180 connect with the magnetic picture that head 132 can produce by permanent magnet 136 and 186.In addition, knock pin 182 also can be connected with support panel 184 by the magnetic force that is arranged on the permanent magnet 186 in support panel 184.
Fig. 8 is the schematic isometric of the bracket fixture 210 of the bracket transfer unit shown in Fig. 1, and Fig. 9 is the schematic sectional view of the bracket fixture 210 shown in Fig. 8, and Figure 10 is the amplification profile of the fixture block shown in Fig. 9 and folder.
With reference to Fig. 8 to 10, bracket transfer unit 200 can pick up and transmit the bracket 120 that accommodates deliverying unit 110 to change deliverying unit 110 and bracket 120.Namely, bracket 120 can take out and can be passed to bracket accomodating unit 300 from main body 140, and then new bracket 120 can take out and can engage with main body 140 from bracket accomodating unit 300.
Especially, bracket transfer unit 200 can comprise that the transfer part 270(that clamps the bracket fixture 210 of bracket 120 outer surfaces and level and transmit vertically this bracket fixture 210 is with reference to Fig. 1).In this case, transfer part 270 can be used for transmitting clip 60.Namely, bracket fixture 210 can connect with transfer part 270 together with clip 60.
As embodiment, as shown in Figure 1, the straight line setting that box 12, naked core displacer 102, workbench 40 and bracket accomodating unit 300 can along continuous straight runs, so horizontal transfer part 280 can be transmitted clip 60 and bracket fixture 210 in the horizontal direction.
Namely, bracket accomodating unit 300 can be arranged on a side of workbench 40, and workbench 40 can be arranged between box 12 and bracket accomodating unit 300.The direction that horizontal transfer part 280 can be arranged along box 12, workbench 40 and bracket accomodating unit 300 is transmitted clip 60 and bracket fixture 210.As embodiment, horizontal transfer part 280 can be utilized drive division configuration, and this drive division comprises motor, ball screw and ball nut etc. and the linear guide element such as Linear-moving guide portion.
As mentioned above, because bracket accomodating unit 300 is arranged in a side of workbench 40, the lower space (naked core displacer 102 is positioned at wherein) therefore with the workbench 40 at broad edge can be used.And, because bracket fixture 210 transmits together with clip 60, therefore needn't provide extra drive division for bracket transfer unit 200.So, can reduce the occupied area of naked core discharger 100, and can further reduce the cost of manufacturing naked core discharger 100.
On the other hand, vertically transfer part 290 can be connected with horizontal transfer part 280, and can along continuous straight runs transmission.And vertically transfer part 290 can vertically be transmitted bracket fixture 210 to take out and to place bracket 120.As embodiment, vertically transfer part 290 can be utilized pneumatic or hydraulic cylinder formation.
According to present embodiment, as shown in FIG. 8 and 9, bracket fixture 210 can comprise and is mounted to the matrix 212 of vertical transfer part 290 and multiple for clamping the folder 230 of bracket 120 outer surfaces.Matrix 212 can have accommodation section to hold bracket 120, and folder 230 can be clamped the bracket 120 in the accommodation section that is contained in matrix 212.For example, matrix 212 can have opening 214 to hold bracket 120, and folder 230 can be arranged in opening 214.
According to present embodiment, fixture block 250 can be separately positioned in the recess on the inner surface that is arranged on opening 214, and can be connected to respectively folder drive division 240.In this case, folder 230 can be arranged on fixture block 250.As embodiment, two folders 230 can be arranged on fixture block 250 separately.
Especially, folder 230 can elasticity be mounted to fixture block 250, and the direction of folder 230 resilient movement can be vertically to respectively the outer surface of bracket 120.Particularly, thus folder 230 can be mounted to the central shaft radially resilient movement of fixture block 250 about bracket 120.In the time that folder 230 forms close contact by folder drive division 240 with the outer surface of bracket 120, the contact-making surface of each folder 230 can be consistent with the tangent plane of bracket 120 outer surfaces.
On the other hand, as shown in figure 10, fixture block 250 can comprise obtuse-angulate the first side 252 of shape and the second side 254 towards a side surface of bracket 120, and folder 230 respectively elasticity be arranged on the first side 252 and the second side 254.And the angle being arranged between the folder 230 on the first side 252 and the second side 254 can be acute angle.Therefore,, in the time clamping bracket 120, elastic restoring force can fully act on bracket 120 by folder 230.
For example, as shown in the figure, folder 230 can be by spring 232 resiliency supported.Particularly, on the first side 252 of fixture block 250 and the second side 254, hole 256(spring 232 can be respectively set and folder 230 inserts wherein).And folder 230 can be arranged to respectively stretch out from the first side 252 and the second side 254.In this case, as shown in the figure, the limit element 258 that restriction folder 230 stretches out degree can be arranged in the hole 256 of fixture block 250.
But the elastic support structure of folder 230 can have various variations, therefore scope of the present invention is not limited to this.For example, common well-known spring detent can be arranged on fixture block 250.
On the other hand, as shown in Figure 3, groove 128(folder 230 inserts wherein) can be arranged on the outer surface of bracket 120, namely, on the outer surface of shell 124.Particularly, in the time taking out bracket 120, along with bracket fixture 200 declines, bracket 120 is inserted in the opening 214 of matrix 212, and then, folder 230 can form close contact by clamping drive division 240 and the inner surface of groove 128.
With reference to Fig. 8, the guide vane end stop 220 moving up than matrix 212 height, restriction bracket 120 can be arranged on matrix 212.In the time taking out bracket 120, guide vane end stop 220 can limit bracket 120 and insert the degree in matrix 212 openings 214.And in the time that bracket 120 is mounted to main body 140, guide vane end stop 220 can transmit by vertical transfer part 290 applied pressures to bracket 120.Or matrix 212 can have the structure of the top closure of opening 214.In this case, can omit guide vane end stop 220.
On the other hand, bracket fixture 210 can comprise the transducer that is contained in the bracket 120 among opening 214 for sensing.As embodiment, the optical pickocff 260 of the bracket 120 in sensing opening 214 can be arranged in a side of matrix 212, and can arrange and make opening 214 and the interconnective through hole 216 of optical pickocff 260.Namely, optical pickocff 260 can send the light through through hole 216, and can receive the light being reflected by bracket 120, judges thus whether bracket 120 exists.
Figure 11 is the schematic diagram of the bracket accomodating unit 300 shown in Fig. 1, and Figure 12 and 13 is signal amplification views of the operation of the bracket accomodating unit 300 shown in Figure 11.
With reference to Figure 11 to 13, bracket accomodating unit 300 can comprise multiple brackets accommodation section 310.According to present embodiment, bracket accomodating unit 300 can comprise that the rotary driving part 304(of base portion panel 302, rotation base portion panel 302 of plate-like is with reference to Fig. 1) and multiple bracket accommodation section 310 being arranged on base portion panel 302.
In the time that needs are changed bracket 120, the rotatable base portion panel 302 of rotary driving part 304 is to be arranged on empty bracket accommodation section 310 on the path of bracket fixture 210 to hold the bracket 120 being transmitted by bracket transfer unit 200, then, can rotate like this base portion panel 302, one of them bracket 120 that, makes to remain on base portion panel 302 can be taken out by bracket fixture 210.
Chuck 320 can be arranged on base portion panel 302, and the plunger 340 that is configured to can vertically move to drive contact element 330 can be arranged in chuck 320.Especially, plunger 340 can vertically move by being arranged on base portion panel 302 plunger actuation portion 360 below, and through hole (driving shaft of plunger actuation portion 360 is through this through hole) can be arranged on base portion panel 302.As embodiment, plunger actuation portion 360 can utilize pneumatic or hydraulic cylinder configuration, but is not limited to this.
As shown in the figure, plunger 340 can have substantial cylindrical, can comprise the side 342 that tilts with predetermined inclination.Especially, each contact element 330 can have with the inner surface of shell 124 under sheds and forms the outer surface of close contact and form the inner surface of close contact with the side 342 that tilts.The inner surface of contact element 330 can slide in the side 342 that tilts of plunger 340.
Especially, as shown in the figure, due to the vertical movement of plunger 340, contact element 330 can towards the inner side of chuck 320 or outside side shifting, can clamp and discharge thus bracket 120.
On the other hand, the mobile route 322 that contact element moves through can be arranged on chuck 320.Mobile route 322 can have the gradient rising gradually to outside from chuck 320 inside.So as shown in the figure, in the time that plunger 340 rises, contact element 330 can slide in the side 342 that tilts of plunger 340, then can be protruding from chuck 320.
As mentioned above, according to present embodiment, after the bracket 120 being transmitted by bracket transfer unit 200 engages with chuck 320, plunger 340 can rise, and therefore allows contact element 330 and the inner surface of shell 124 under sheds to form close contact.As a result, the axis of the axis of bracket 120 and chuck 320 can overlap exactly, therefore, in the time taking out bracket 120 below from chuck 320, can prevent the taking-up mistake being produced by axis misalignment.
According to present embodiment, permanent magnet 350 can be built in plunger 340, allows thus contact element 330 and the side 342 that tilts to form all the time close contact by the magnetic force of permanent magnet 350.As a result, contact element 330 can be along with the rising of plunger 340 and decline and is moved into and shift out chuck 320.
With reference to Fig. 8, be supported on bracket 120 in the opening 214 of bracket fixture 210 by folder 230 by folder 230 resiliency supported, therefore bracket 120 can move horizontally in opening 214.Especially, the direction that bracket 120 can move forward and backward along fixture block 250 moves, therefore the fixture block 250 of bracket fixture 210 move forward and backward direction, namely, it is desirable that the orientation of folder drive division 240 and fixture block 250 is parallel to the direction that bracket fixture 210 transmitted by horizontal transfer part 280.This is in order to take out reposefully or to place bracket 120, although in the time utilizing bracket fixture 210 take out or place bracket 120, having produced some misalignments between the axis of main body 140 or chuck 320 and the axis of bracket 120.
And in order to take out reposefully or to place bracket 120, although do not illustrate in the drawings, the inner corners of shell 124 under sheds can be chamfering, the upper corners of the upper corners of main body 140 and chuck 320 can be also chamfering in addition.
As mentioned above, according to present embodiment, bracket accomodating unit 300 can be positioned at the opposition side of box 12, and workbench 40 can be arranged between bracket accomodating unit 300 and box 12.And bracket fixture 210 and clip 60 can utilize a horizontal transfer part 280 to transmit.Therefore, the gross area that naked core discharger 100 occupies can be reduced, and the cost of manufacturing naked core discharger 100 can be reduced.
Although described naked core discharger with reference to embodiment, be not limited to this.Therefore, should easily understand person of ordinary skill in the field and can make thus various remodeling and variation, and can not depart from the spirit and scope of the invention that are defined by the following claims.
Claims (9)
1. a naked core discharger, comprising:
Be configured to support the workbench of cutting belt, multiple naked cores are attached in described cutting belt;
Comprise the naked core displacer of deliverying unit, main body and bracket, described deliverying unit is arranged on below described workbench and is configured to selectively in naked core described in upwards lifting, described main body has the driver element that is configured to vertically move described deliverying unit, described deliverying unit is built in described bracket, and described bracket has under shed and inserts wherein with the top that allows described main body;
Be arranged on the bracket accomodating unit of described workbench one side, multiple deliverying units respectively built-in multiple brackets are wherein contained among described bracket accomodating unit; And
Thereby be configured to transmit the bracket transfer unit that bracket is changed with one of them bracket being contained in described bracket accomodating unit between described naked core displacer and described bracket accomodating unit.
2. device according to claim 1, wherein said bracket accomodating unit comprises:
The base portion panel of plate-like;
Multiple being along the circumferential direction arranged on respectively on described base portion panel to hold the bracket accommodation section of described bracket; And
Be configured to rotate the rotary driving part of described base portion panel.
3. device according to claim 2, wherein said bracket accomodating unit is arranged on the opposite of the box that accommodates multiple wafers, and described workbench is arranged between described bracket accomodating unit and described box.
4. device according to claim 3, wherein said bracket transfer unit comprises:
Be configured to clamp the bracket fixture of described bracket outer surface; And
Be configured to level and transmit vertically the transfer part of described bracket fixture,
Wherein said bracket fixture be connected with described transfer part together for the clip that takes out described wafer from described box and be delivered on described workbench.
5. device according to claim 4 is wherein formed with and is configured to the groove that engages with described bracket fixture on the outer surface of described bracket.
6. device according to claim 2, wherein said bracket accommodation section comprises respectively:
Be configured to insert the chuck in described bracket under shed; And
Multiple being configured to stretched out and forms close contact to clamp the contact element of described bracket with the inner surface of described bracket under shed from a side of described chuck.
7. device according to claim 6 is wherein provided with the plunger that is configured to can vertically move and comprise the side that tilts with predetermined inclination in described chuck, and
Described contact element comprises respectively and is configured to form the outer surface of close contact and be configured to form with the side that tilts described in described plunger the inner surface of close contact with the inner surface of described bracket under shed, and described contact element is by the vertical movement of described plunger and the inner surface of described bracket under shed formation close contact.
8. device according to claim 7, the mobile route of wherein said contact element is arranged in described chuck, and described mobile route has the gradient rising gradually to outside from described chuck inside.
9. device according to claim 7 is wherein built-in with permanent magnet in described plunger, and described contact element by the magnetic force of described permanent magnet with described in the side that tilts remain close contact.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120121458A KR101471715B1 (en) | 2012-10-30 | 2012-10-30 | Die ejecting apparatus |
| KR1020120121458 | 2012-10-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103794531A true CN103794531A (en) | 2014-05-14 |
| CN103794531B CN103794531B (en) | 2016-09-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310522203.2A Active CN103794531B (en) | 2012-10-30 | 2013-10-29 | Naked core discharger |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101471715B1 (en) |
| CN (1) | CN103794531B (en) |
| TW (1) | TWI521586B (en) |
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|---|---|---|---|---|
| CN107452666A (en) * | 2016-05-27 | 2017-12-08 | 细美事有限公司 | Push rod component and the naked core liftout attachment with the push rod component |
| CN107731723A (en) * | 2016-08-10 | 2018-02-23 | 细美事有限公司 | Naked core liftout attachment |
| CN109524319A (en) * | 2017-09-19 | 2019-03-26 | 细美事有限公司 | Naked core platform unit and naked core bonder with it |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101593801B1 (en) * | 2014-05-29 | 2016-02-12 | 세메스 주식회사 | Apparatus for ejecting dies |
| KR102146774B1 (en) * | 2014-06-11 | 2020-08-21 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
| KR102146776B1 (en) * | 2014-06-11 | 2020-08-21 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
| KR102207869B1 (en) * | 2014-08-18 | 2021-01-26 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
| KR102386333B1 (en) * | 2015-06-12 | 2022-04-13 | 세메스 주식회사 | A stacker unit |
| KR102371538B1 (en) * | 2015-06-30 | 2022-03-07 | 세메스 주식회사 | A stacker unit and apparatus for exchanging a collet and a hood including the stacker unit |
| KR102559271B1 (en) * | 2016-06-03 | 2023-07-25 | 세메스 주식회사 | Apparatus for binding dies |
| JP6797569B2 (en) * | 2016-06-13 | 2020-12-09 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing equipment and manufacturing method of semiconductor equipment |
| KR102594542B1 (en) | 2018-10-31 | 2023-10-26 | 세메스 주식회사 | Die ejecting apparatus |
| KR102189274B1 (en) | 2019-07-02 | 2020-12-09 | 세메스 주식회사 | Die pickup method and die pickup apparatus |
| KR102330648B1 (en) | 2019-07-02 | 2021-11-23 | 세메스 주식회사 | Die ejecting apparatus |
| KR102245805B1 (en) | 2019-07-18 | 2021-04-28 | 세메스 주식회사 | Die ejector and die pickup apparatus including the same |
| KR102288927B1 (en) | 2019-09-06 | 2021-08-12 | 세메스 주식회사 | Die ejector and die pickup apparatus including the same |
| KR20220052718A (en) | 2020-10-21 | 2022-04-28 | 세메스 주식회사 | Die ejector and die pickup apparatus including the same |
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- 2012-10-30 KR KR1020120121458A patent/KR101471715B1/en active IP Right Grant
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| US6386815B1 (en) * | 1999-01-20 | 2002-05-14 | Nec Corporation | Pick-up apparatus for semiconductor chips |
| US20080086874A1 (en) * | 2006-10-16 | 2008-04-17 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
| US20090242124A1 (en) * | 2008-03-26 | 2009-10-01 | Fujitsu Microelectronics Limited | Method and apparatus for peeling electronic component |
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| CN107452666A (en) * | 2016-05-27 | 2017-12-08 | 细美事有限公司 | Push rod component and the naked core liftout attachment with the push rod component |
| CN107452666B (en) * | 2016-05-27 | 2020-10-23 | 细美事有限公司 | Ejector rod assembly and bare core ejection device with ejector rod assembly |
| CN107731723A (en) * | 2016-08-10 | 2018-02-23 | 细美事有限公司 | Naked core liftout attachment |
| CN107731723B (en) * | 2016-08-10 | 2021-08-13 | 细美事有限公司 | Bare core liftout attachment |
| CN109524319A (en) * | 2017-09-19 | 2019-03-26 | 细美事有限公司 | Naked core platform unit and naked core bonder with it |
| CN109524319B (en) * | 2017-09-19 | 2023-07-07 | 细美事有限公司 | Die table unit and die bonding device with same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI521586B (en) | 2016-02-11 |
| TW201430927A (en) | 2014-08-01 |
| CN103794531B (en) | 2016-09-14 |
| KR20140055104A (en) | 2014-05-09 |
| KR101471715B1 (en) | 2014-12-10 |
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