KR101350550B1 - Method of removing a collet - Google Patents
Method of removing a collet Download PDFInfo
- Publication number
- KR101350550B1 KR101350550B1 KR1020120121573A KR20120121573A KR101350550B1 KR 101350550 B1 KR101350550 B1 KR 101350550B1 KR 1020120121573 A KR1020120121573 A KR 1020120121573A KR 20120121573 A KR20120121573 A KR 20120121573A KR 101350550 B1 KR101350550 B1 KR 101350550B1
- Authority
- KR
- South Korea
- Prior art keywords
- collet
- pickup head
- head
- die
- opening
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
- B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
In the die bonding process, a collet for adsorbing the die is removed from the pickup head by using magnetic force coupled to a pickup head for picking up and transporting the die, and using a vacuum provided through a pneumatic pipe provided in the pickup head. A method, comprising: engaging members for limiting upward movement of the collet while moving the pickup head upwards on both sides of a path along which the pickup head travels to move the collet while the pickup head is moved upwards. Can be separated from. In addition, the air may be injected into the collet through the pneumatic pipe to assist the separation of the collet from the pickup head.
Description
Embodiments of the present invention relate to a collet removal method. More particularly, the present invention relates to a method of removing the collet from the pickup head for replacement of the collet for picking up and transferring the die in a die bonding process.
Generally, in the die bonding process, a pick-up unit that picks up and transports the dies from a wafer to bond individualized dies to the substrate through a sawing process can be used. The pickup unit may include a collet for picking up the die using the vacuum, a pickup head to which the collet is coupled, and a driving unit for moving the pickup head.
As an example, the pickup head and the collet may be coupled to each other using a magnetic force. In addition, the pick-up head may be provided with a pneumatic pipe for providing a vacuum, the collet may be provided with a plurality of suction holes connected to the pneumatic pipe to pick up the die.
On the other hand, the collet may be made of a flexible material, for example, a synthetic rubber, etc. in direct contact with the die, and may need to be replaced due to wear or the like after a certain period of time. Replacement of the collet may be made manually by an operator. However, the manual replacement method by the operator can take a considerable time, and the failure rate can be increased in the die bonding process if the new collet is not correctly attached to the pickup head. Accordingly, there is a continuing need for a method and apparatus for automatic replacement of the collet.
It is an object of the present invention to provide a method for automatically removing the collet for automatic replacement of the collet from the pickup head used in the die bonding process.
According to embodiments of the present invention, in the die bonding process, the die is sucked by using a vacuum provided through a pneumatic pipe provided to the pickup head for picking up and transferring the die and provided in the pickup head. A method of removing a collet from a pickup head, the method comprising: moving the pickup head upwards, and engaging members limiting upward movement of the collet on both sides of a path along which the pickup head travels; Separating the collet from the pickup head while moving upwards, and spraying air to the collet through the pneumatic pipe to assist the separation of the collet from the pickup head.
According to embodiments of the present invention, the air may be injected for a predetermined time from before the collet is caught by the catch member to after being separated from the pickup head.
According to embodiments of the present invention, the air may be injected simultaneously with the collet by the catching member.
According to embodiments of the present invention, the air may be injected toward the collet after the collet is separated from the catching member.
According to embodiments of the present invention, there is provided a panel having an opening through which the pickup head and the collet pass in the vertical direction, and the locking member to be rotated downward by a torsion spring on both inner surfaces of the opening. By mounting them, the collet may be moved downwardly through the opening so that the upward movement is restricted.
According to embodiments of the present invention, the pickup head may be provided with recesses through which the catching members pass.
According to embodiments of the present invention, collet receiving grooves may be provided on the panel to accommodate a plurality of collets provided for replacing the collets, respectively.
According to embodiments of the present invention, the panel may be configured to be movable so that the opening or the collet receiving grooves are positioned under the pickup head by a driving unit.
According to embodiments of the present invention, a chuck for supporting the die may be provided on the panel.
According to embodiments of the present invention, a container for recovering the collet removed from the pickup head may be provided under the opening of the panel.
According to the embodiments of the present invention as described above, when removing the collet for adsorbing the die from the pickup head to block the upward movement of the collet by using the engaging members while moving the pickup head upward, Air can be injected into the collet for complete removal of the collet separated from the pickup head by the catching members.
As a result, separation of the collet can be performed completely, whereby automatic replacement of the collet can be performed stably. In addition, the space required for the automatic replacement of the collet is disposed in the buffer unit where the die separated from the wafer is temporarily supported, by arranging the opening for the removal of the collet, the catching members and the collet accommodating grooves for accommodating the plurality of collets. Can be sufficiently reduced.
1 is a flowchart illustrating a collet removing method according to an embodiment of the present invention.
FIG. 2 is a schematic front view illustrating a buffer unit including a pickup unit and a collet removing unit to which the collet removing method illustrated in FIG. 1 is applied.
FIG. 3 is a schematic plan view for explaining the buffer unit shown in FIG. 2.
FIG. 4 is a schematic enlarged cross-sectional view for describing the pickup head and the collet illustrated in FIG. 2.
FIG. 5 is a bottom view illustrating the pickup head shown in FIG. 4.
6 to 8 are schematic enlarged cross-sectional views illustrating a method of removing the collet shown in FIG. 1.
Hereinafter, a head replacement apparatus and a die bonding system including the head replacement apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.
The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.
The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.
1 is a flowchart illustrating a collet removing method according to an embodiment of the present invention. FIG. 2 is a schematic front view illustrating a pickup unit to which the collet removing method illustrated in FIG. 1 and a buffer unit including a collet removing unit are applied, and FIG. 3 is a schematic plan view illustrating the buffer unit illustrated in FIG. 2. to be.
1 to 3, the collet removal method according to an embodiment of the present invention includes the
Specifically, in the die bonding process, the pick-
The pick-
4 is a schematic enlarged cross-sectional view illustrating the pickup head and the collet shown in FIG. 2, and FIG. 5 is a bottom view illustrating the pickup head shown in FIG. 4.
4 and 5, the
As an example, the
Meanwhile, the pick-up
Referring again to FIGS. 2 and 3, the
In addition, engaging
According to one embodiment of the invention, as shown in Figure 1, in order to remove the
In this case, the locking
6 to 8 are schematic enlarged cross-sectional views illustrating a method of removing the collet shown in FIG. 1.
6 to 8, as an example, the locking member may be rotated downward on both inner side surfaces of the
As a result, the
Meanwhile, as described above, the
Referring back to FIG. 1, according to an embodiment of the present disclosure, air may be injected to the upper surface of the
According to an embodiment of the present invention, the air may be injected from the
In addition, the air may be injected for a predetermined time until the
According to another embodiment of the present invention, the air may be injected at the same time as the
Meanwhile, a
After the
For example, the
On the other hand, the central portion of the
According to the embodiments of the present invention as described above, when removing the
As a result, separation of the
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.
10: pick-up unit 20: collet
30: pickup head 102: panel
104: opening 106: collet storage groove
110:
Claims (10)
Moving the pickup head upward;
Disposing the collet from the pick-up head while the pick-up head is moved upward by disposing the catching members restricting upward movement of the collet on both sides of a path along which the pick-up head moves; And
And injecting air into the collet through the pneumatic pipe to assist separation of the collet from the pickup head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120121573A KR101350550B1 (en) | 2012-10-30 | 2012-10-30 | Method of removing a collet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020120121573A KR101350550B1 (en) | 2012-10-30 | 2012-10-30 | Method of removing a collet |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101350550B1 true KR101350550B1 (en) | 2014-01-10 |
Family
ID=50145338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120121573A KR101350550B1 (en) | 2012-10-30 | 2012-10-30 | Method of removing a collet |
Country Status (1)
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KR (1) | KR101350550B1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150142716A (en) * | 2014-06-11 | 2015-12-23 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
KR20150142717A (en) * | 2014-06-11 | 2015-12-23 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
JP2021068785A (en) * | 2019-10-21 | 2021-04-30 | ハンファ精密機械株式会社 | Collet removal device |
CN114464565A (en) * | 2022-01-25 | 2022-05-10 | 先之科半导体科技(东莞)有限公司 | High-precision adjustable chip diode suction pen structure |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09186180A (en) * | 1995-09-16 | 1997-07-15 | Samsung Aerospace Ind Ltd | Die-bonding apparatus |
JP2001156083A (en) | 1999-11-24 | 2001-06-08 | Hitachi Ltd | Manufacturing method of semiconductor device and die bonding apparatus |
KR20080091730A (en) * | 2007-04-09 | 2008-10-14 | 마쯔시다덴기산교 가부시키가이샤 | Chip mounting apparatus and changing method for separation facilitation head in chip mounting apparatus |
KR20100034812A (en) * | 2008-09-25 | 2010-04-02 | 세크론 주식회사 | Nozzle apparatus of sawing sorter system |
-
2012
- 2012-10-30 KR KR1020120121573A patent/KR101350550B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09186180A (en) * | 1995-09-16 | 1997-07-15 | Samsung Aerospace Ind Ltd | Die-bonding apparatus |
JP2001156083A (en) | 1999-11-24 | 2001-06-08 | Hitachi Ltd | Manufacturing method of semiconductor device and die bonding apparatus |
KR20080091730A (en) * | 2007-04-09 | 2008-10-14 | 마쯔시다덴기산교 가부시키가이샤 | Chip mounting apparatus and changing method for separation facilitation head in chip mounting apparatus |
KR20100034812A (en) * | 2008-09-25 | 2010-04-02 | 세크론 주식회사 | Nozzle apparatus of sawing sorter system |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150142716A (en) * | 2014-06-11 | 2015-12-23 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
KR20150142717A (en) * | 2014-06-11 | 2015-12-23 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
KR102146776B1 (en) | 2014-06-11 | 2020-08-21 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
KR102146774B1 (en) | 2014-06-11 | 2020-08-21 | 세메스 주식회사 | Apparatus for exchanging a collet and a hood |
JP2021068785A (en) * | 2019-10-21 | 2021-04-30 | ハンファ精密機械株式会社 | Collet removal device |
JP7446765B2 (en) | 2019-10-21 | 2024-03-11 | ハンファ精密機械株式会社 | Collet removal device |
CN114464565A (en) * | 2022-01-25 | 2022-05-10 | 先之科半导体科技(东莞)有限公司 | High-precision adjustable chip diode suction pen structure |
CN114464565B (en) * | 2022-01-25 | 2022-12-06 | 先之科半导体科技(东莞)有限公司 | High-precision adjustable patch diode suction pen structure |
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