KR101350550B1 - Method of removing a collet - Google Patents

Method of removing a collet Download PDF

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Publication number
KR101350550B1
KR101350550B1 KR1020120121573A KR20120121573A KR101350550B1 KR 101350550 B1 KR101350550 B1 KR 101350550B1 KR 1020120121573 A KR1020120121573 A KR 1020120121573A KR 20120121573 A KR20120121573 A KR 20120121573A KR 101350550 B1 KR101350550 B1 KR 101350550B1
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KR
South Korea
Prior art keywords
collet
pickup head
head
die
opening
Prior art date
Application number
KR1020120121573A
Other languages
Korean (ko)
Inventor
정연혁
김동진
문강현
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020120121573A priority Critical patent/KR101350550B1/en
Application granted granted Critical
Publication of KR101350550B1 publication Critical patent/KR101350550B1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

In the die bonding process, a collet for adsorbing the die is removed from the pickup head by using magnetic force coupled to a pickup head for picking up and transporting the die, and using a vacuum provided through a pneumatic pipe provided in the pickup head. A method, comprising: engaging members for limiting upward movement of the collet while moving the pickup head upwards on both sides of a path along which the pickup head travels to move the collet while the pickup head is moved upwards. Can be separated from. In addition, the air may be injected into the collet through the pneumatic pipe to assist the separation of the collet from the pickup head.

Description

Method of removing a collet}

Embodiments of the present invention relate to a collet removal method. More particularly, the present invention relates to a method of removing the collet from the pickup head for replacement of the collet for picking up and transferring the die in a die bonding process.

Generally, in the die bonding process, a pick-up unit that picks up and transports the dies from a wafer to bond individualized dies to the substrate through a sawing process can be used. The pickup unit may include a collet for picking up the die using the vacuum, a pickup head to which the collet is coupled, and a driving unit for moving the pickup head.

As an example, the pickup head and the collet may be coupled to each other using a magnetic force. In addition, the pick-up head may be provided with a pneumatic pipe for providing a vacuum, the collet may be provided with a plurality of suction holes connected to the pneumatic pipe to pick up the die.

On the other hand, the collet may be made of a flexible material, for example, a synthetic rubber, etc. in direct contact with the die, and may need to be replaced due to wear or the like after a certain period of time. Replacement of the collet may be made manually by an operator. However, the manual replacement method by the operator can take a considerable time, and the failure rate can be increased in the die bonding process if the new collet is not correctly attached to the pickup head. Accordingly, there is a continuing need for a method and apparatus for automatic replacement of the collet.

It is an object of the present invention to provide a method for automatically removing the collet for automatic replacement of the collet from the pickup head used in the die bonding process.

According to embodiments of the present invention, in the die bonding process, the die is sucked by using a vacuum provided through a pneumatic pipe provided to the pickup head for picking up and transferring the die and provided in the pickup head. A method of removing a collet from a pickup head, the method comprising: moving the pickup head upwards, and engaging members limiting upward movement of the collet on both sides of a path along which the pickup head travels; Separating the collet from the pickup head while moving upwards, and spraying air to the collet through the pneumatic pipe to assist the separation of the collet from the pickup head.

According to embodiments of the present invention, the air may be injected for a predetermined time from before the collet is caught by the catch member to after being separated from the pickup head.

According to embodiments of the present invention, the air may be injected simultaneously with the collet by the catching member.

According to embodiments of the present invention, the air may be injected toward the collet after the collet is separated from the catching member.

According to embodiments of the present invention, there is provided a panel having an opening through which the pickup head and the collet pass in the vertical direction, and the locking member to be rotated downward by a torsion spring on both inner surfaces of the opening. By mounting them, the collet may be moved downwardly through the opening so that the upward movement is restricted.

According to embodiments of the present invention, the pickup head may be provided with recesses through which the catching members pass.

According to embodiments of the present invention, collet receiving grooves may be provided on the panel to accommodate a plurality of collets provided for replacing the collets, respectively.

According to embodiments of the present invention, the panel may be configured to be movable so that the opening or the collet receiving grooves are positioned under the pickup head by a driving unit.

According to embodiments of the present invention, a chuck for supporting the die may be provided on the panel.

According to embodiments of the present invention, a container for recovering the collet removed from the pickup head may be provided under the opening of the panel.

According to the embodiments of the present invention as described above, when removing the collet for adsorbing the die from the pickup head to block the upward movement of the collet by using the engaging members while moving the pickup head upward, Air can be injected into the collet for complete removal of the collet separated from the pickup head by the catching members.

As a result, separation of the collet can be performed completely, whereby automatic replacement of the collet can be performed stably. In addition, the space required for the automatic replacement of the collet is disposed in the buffer unit where the die separated from the wafer is temporarily supported, by arranging the opening for the removal of the collet, the catching members and the collet accommodating grooves for accommodating the plurality of collets. Can be sufficiently reduced.

1 is a flowchart illustrating a collet removing method according to an embodiment of the present invention.
FIG. 2 is a schematic front view illustrating a buffer unit including a pickup unit and a collet removing unit to which the collet removing method illustrated in FIG. 1 is applied.
FIG. 3 is a schematic plan view for explaining the buffer unit shown in FIG. 2.
FIG. 4 is a schematic enlarged cross-sectional view for describing the pickup head and the collet illustrated in FIG. 2.
FIG. 5 is a bottom view illustrating the pickup head shown in FIG. 4.
6 to 8 are schematic enlarged cross-sectional views illustrating a method of removing the collet shown in FIG. 1.

Hereinafter, a head replacement apparatus and a die bonding system including the head replacement apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

1 is a flowchart illustrating a collet removing method according to an embodiment of the present invention. FIG. 2 is a schematic front view illustrating a pickup unit to which the collet removing method illustrated in FIG. 1 and a buffer unit including a collet removing unit are applied, and FIG. 3 is a schematic plan view illustrating the buffer unit illustrated in FIG. 2. to be.

1 to 3, the collet removal method according to an embodiment of the present invention includes the collet 20 to replace the collet 20, which is required to be replaced by wear or the like in the die bonding process. ) Can be used to remove.

Specifically, in the die bonding process, the pick-up unit 10 is individualized through the dicing process and then picked up a die (not shown) from the wafer provided attached to the dicing tape and transferred to the buffer unit 100. It may also be used, and may also be transferred from the buffer unit 100 to the substrate for bonding the die on a substrate (not shown). Alternatively, the pickup unit 10 may be used to transfer the die from the wafer to the substrate.

The pick-up unit 10 may include a pick-up head 30 and a collet 20 attached to the pick-up head 30. The collet 20 may be mounted to the pick-up head 30 using a magnetic force. . In particular, the collet 20 may be provided with a plurality of adsorption holes 22 (see FIG. 4) for adsorbing the die, and the pickup head 30 may provide a vacuum to the adsorption holes 22. Pneumatic piping 32 (see FIG. 4) may be provided.

4 is a schematic enlarged cross-sectional view illustrating the pickup head and the collet shown in FIG. 2, and FIG. 5 is a bottom view illustrating the pickup head shown in FIG. 4.

4 and 5, the collet 20 may have a substantially rectangular shape and may include a hard upper pad 24 and a soft lower pad 26. The suction holes 22 for sucking the die may be provided through the upper pad 24 and the lower pad 26 and communicate with the pneumatic piping 32 of the pickup head 30 .

As an example, the pickup head 30 may have a substantially rectangular shape so that the collet 20 may be mounted, and include a drive shaft connected to a transfer unit (not shown) for transferring the pickup unit 10. Can be. Hollow shaft may be used as the drive shaft, it may function as the pneumatic pipe (32). However, the shape of the pick-up head 30 and the collet 20 is not limited to a square, and various shapes such as a circle may be used in some cases, so that the scope of the present invention is not limited thereto.

Meanwhile, the pick-up head 30 and the collet 20 can be coupled to each other by a magnetic force. As an example, the pickup head 30 may be provided with a permanent magnet 34 for the head to provide the magnetic force, the upper pad 24 of the collet 20 may be made of a magnetic material. On the other hand, guide members 36 for guiding the mounting position of the collet 20 may be disposed at a lower edge portion of the pick-up head 30.

Referring again to FIGS. 2 and 3, the buffer unit 100 includes regions in which a plurality of collets 20 are disposed to replace the collets 20, the pickup head 30, and the collets 20, respectively. ) May include a panel 102 having an opening 104 formed to pass in a vertical direction. For example, the upper surface of the panel 102 may be provided with collet receiving grooves 106 in which the plurality of collets 20 are received, respectively, and the lower surface of the collet receiving grooves 106 Permanent magnets 108 for holding the plurality of collets 20 may be provided.

In addition, engaging members 110 may be provided in the opening 104 to separate the collet 20 from the pickup head.

According to one embodiment of the invention, as shown in Figure 1, in order to remove the collet 20 from the pickup head 30, the pickup head 30 and the collet 20 in step S100 It can be moved downward through the opening 104 by the transfer unit, and then can be moved upward through the opening 104 in step S110.

In this case, the locking members 110 may be provided at both sides of the vertical movement path of the pickup head 30 in the opening 104. In particular, the locking members 110 may allow downward and upward movement of the pickup head 30, but allow downward movement with respect to the collet 20, but limit upward movement. As a result, in operation S120, the locking members 110 may separate the collet 20 from the pickup head 30 while the pickup head 30 is moved upward through the opening 104. .

6 to 8 are schematic enlarged cross-sectional views illustrating a method of removing the collet shown in FIG. 1.

6 to 8, as an example, the locking member may be rotated downward on both inner side surfaces of the opening 104 by a spring (not shown), for example, a coil spring or a torsion spring. Field 110 may be mounted. The collet 20 may be rotated downward to allow the collet 20 to move downward. However, after the collet 20 is passed downward, the collet 20 is returned to its initial position by the torsion spring, 20 can be restricted. Alternatively, the engaging members 110 may be configured to be able to move forward and backward by a spring from the inner side of the opening 104.

As a result, the collet 20 can be separated from the pickup head 30 by being caught by the locking members 110 while the pickup head 30 is moved upwardly through the opening 104. . In this case, as shown in FIG. 5, both side surfaces of the pickup head 30 may be provided with recesses 38, respectively, and the vertical movement of the pickup head 30 may be performed by the recesses 38. Interference with the locking members 110 may be prevented.

Meanwhile, as described above, the collet 20 may be separated from the pickup head 30 by blocking the upward movement of the collet 20 by the catching members 110, but in some cases, the collet ( 20 may be lifted while being suspended from the pickup head 30 without being completely separated from the pickup head 30. That is, when the upper surface of the collet 20 is separated from the lower surface of the pickup head 30, the side of the collet 20 immediately reattaches to the lower surface of the pickup head 30 by magnetic force. May be generated.

Referring back to FIG. 1, according to an embodiment of the present disclosure, air may be injected to the upper surface of the collet 20 through the pneumatic pipe 32 in step S130. For example, the air injected from the pneumatic pipe 32 exerts downward force on the upper surface of the collet 20, thereby assisting the separation operation of the collet 20. That is, the air may be used to completely separate the collet 20 from the pickup head 30 after the collet 20 is separated from the pickup head 30 by the catching members 110. .

According to an embodiment of the present invention, the air may be injected from the pickup head 30 before the collet 20 is caught by the catching member 110, and the air is adsorbed by the collet 20. It may be discharged downward through the holes 22. In this case, the air pressure acting on the collet 20 by the air is preferably smaller than the magnetic force applied by the permanent magnets 108 for the head. In other words, the wind pressure may weaken the magnetic force to a certain degree and may allow the removing step of the collet 20 by the catching members 110 to be easily performed.

In addition, the air may be injected for a predetermined time until the collet 20 is separated from the pickup head 30. This is to prevent the collet 20 from being detached from the pickup head 30 and then reattached to the pickup head 30.

According to another embodiment of the present invention, the air may be injected at the same time as the collet 20 is caught by the locking member 110, after the collet 20 is separated from the pickup head 30 It may be sprayed toward the collet 20.

Meanwhile, a container 120 for recovering the collet 20 separated from the pickup head 30 may be provided below the opening 104. The container 120 may be mounted on the panel 102, or alternatively, may be provided separately from the panel 102.

After the collet 20 is removed from the pickup head 30 as described above, the pickup head 30 may mount one of the plurality of collets 20 provided on the panel 102. For example, the panel 102 may be configured to be movable by the driving unit 130 such that the opening 104 or the collet receiving grooves 106 are positioned below the pickup head 30.

For example, the panel 102 may have a disk shape, and the opening 104 and the collet receiving grooves 106 may be disposed in the circumferential direction of the panel 102. In this case, the driving unit 130 rotates the panel 102 so that one of the collets 20 accommodated in the collet receiving grooves 106 is under the pickup head 30 from which the collet 20 is removed. Can be positioned.

On the other hand, the central portion of the panel 102 may be provided with a chuck 140 for supporting the die transferred from the wafer. That is, the buffer unit 100 temporarily supports the die transferred from the wafer, and then the buffer unit 100 may be transferred to be adjacent to an area where the die bonding process is performed by the driving unit.

According to the embodiments of the present invention as described above, when removing the collet 20 for adsorbing the die from the pickup head 30, the locking members 110 are moved while moving the pickup head 30 upward. To block the upward movement of the collet 20, and further air toward the collet 20 for complete removal of the collet 20 separated from the pickup head 30 by the catching members 110. Can be sprayed.

As a result, separation of the collet 20 can be performed completely, whereby automatic replacement of the collet 20 can be performed stably. In addition, the opening 104 for removing the collet 20, the catching members 110, and the plurality of collets 20 are stored in the buffer unit 100 where the die separated from the wafer is temporarily supported. By arranging the collet receiving grooves 106, the space required for the automatic replacement of the collet 20 can be sufficiently reduced.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

10: pick-up unit 20: collet
30: pickup head 102: panel
104: opening 106: collet storage groove
110:

Claims (10)

In the die bonding process, a collet for adsorbing the die is removed from the pickup head by using magnetic force coupled to a pickup head for picking up and transporting the die, and using a vacuum provided through a pneumatic pipe provided in the pickup head. In the method,
Moving the pickup head upward;
Disposing the collet from the pick-up head while the pick-up head is moved upward by disposing the catching members restricting upward movement of the collet on both sides of a path along which the pick-up head moves; And
And injecting air into the collet through the pneumatic pipe to assist separation of the collet from the pickup head. The method of claim 1, wherein the air is ejected for a predetermined time from before the collet is caught by the catch member to after being separated from the pickup head. The method of claim 1, wherein the air is ejected at the same time as the collet is caught by the locking member. The method of claim 1, wherein the air is ejected toward the collet after the collet is separated from the locking member. The method of claim 1, further comprising: providing a panel having an opening through which the pickup head and the collet pass in a vertical direction, and mounting the locking members to be rotated downward by a torsion spring on both inner surfaces of the opening. And the collet is moved downwardly through the opening to limit movement upward. 6. The method of claim 5, wherein the pick-up head is provided with recesses through which the catching members pass. The method of claim 5, wherein the collet receiving method characterized in that the collet receiving grooves are each provided with a plurality of collets provided for the replacement of the collet. 8. The method of claim 7, wherein the panel is configured to be movable so that the opening or the collet receiving grooves are positioned below the pickup head by a driving unit. 6. The method of claim 5, wherein a chuck for supporting the die is provided on the panel. The method of claim 5, wherein the lower portion of the opening of the panel is provided with a container for recovering the collet removed from the pickup head.
KR1020120121573A 2012-10-30 2012-10-30 Method of removing a collet KR101350550B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150142716A (en) * 2014-06-11 2015-12-23 세메스 주식회사 Apparatus for exchanging a collet and a hood
KR20150142717A (en) * 2014-06-11 2015-12-23 세메스 주식회사 Apparatus for exchanging a collet and a hood
JP2021068785A (en) * 2019-10-21 2021-04-30 ハンファ精密機械株式会社 Collet removal device
CN114464565A (en) * 2022-01-25 2022-05-10 先之科半导体科技(东莞)有限公司 High-precision adjustable chip diode suction pen structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09186180A (en) * 1995-09-16 1997-07-15 Samsung Aerospace Ind Ltd Die-bonding apparatus
JP2001156083A (en) 1999-11-24 2001-06-08 Hitachi Ltd Manufacturing method of semiconductor device and die bonding apparatus
KR20080091730A (en) * 2007-04-09 2008-10-14 마쯔시다덴기산교 가부시키가이샤 Chip mounting apparatus and changing method for separation facilitation head in chip mounting apparatus
KR20100034812A (en) * 2008-09-25 2010-04-02 세크론 주식회사 Nozzle apparatus of sawing sorter system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09186180A (en) * 1995-09-16 1997-07-15 Samsung Aerospace Ind Ltd Die-bonding apparatus
JP2001156083A (en) 1999-11-24 2001-06-08 Hitachi Ltd Manufacturing method of semiconductor device and die bonding apparatus
KR20080091730A (en) * 2007-04-09 2008-10-14 마쯔시다덴기산교 가부시키가이샤 Chip mounting apparatus and changing method for separation facilitation head in chip mounting apparatus
KR20100034812A (en) * 2008-09-25 2010-04-02 세크론 주식회사 Nozzle apparatus of sawing sorter system

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150142716A (en) * 2014-06-11 2015-12-23 세메스 주식회사 Apparatus for exchanging a collet and a hood
KR20150142717A (en) * 2014-06-11 2015-12-23 세메스 주식회사 Apparatus for exchanging a collet and a hood
KR102146776B1 (en) 2014-06-11 2020-08-21 세메스 주식회사 Apparatus for exchanging a collet and a hood
KR102146774B1 (en) 2014-06-11 2020-08-21 세메스 주식회사 Apparatus for exchanging a collet and a hood
JP2021068785A (en) * 2019-10-21 2021-04-30 ハンファ精密機械株式会社 Collet removal device
JP7446765B2 (en) 2019-10-21 2024-03-11 ハンファ精密機械株式会社 Collet removal device
CN114464565A (en) * 2022-01-25 2022-05-10 先之科半导体科技(东莞)有限公司 High-precision adjustable chip diode suction pen structure
CN114464565B (en) * 2022-01-25 2022-12-06 先之科半导体科技(东莞)有限公司 High-precision adjustable patch diode suction pen structure

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