KR101422350B1 - Method of mounting a collet to a pickup head - Google Patents
Method of mounting a collet to a pickup head Download PDFInfo
- Publication number
- KR101422350B1 KR101422350B1 KR20120122105A KR20120122105A KR101422350B1 KR 101422350 B1 KR101422350 B1 KR 101422350B1 KR 20120122105 A KR20120122105 A KR 20120122105A KR 20120122105 A KR20120122105 A KR 20120122105A KR 101422350 B1 KR101422350 B1 KR 101422350B1
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- KR
- South Korea
- Prior art keywords
- collet
- pick
- head
- die
- mounting
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Abstract
A pick-up head having a collet with a plurality of suction holes for adsorbing the die, a pneumatic piping for providing a vacuum through the suction holes, the collet being mounted on the pick-up head, The pick-up head having a flat lower surface on which the collet is mounted, the pick-up head having a permanent magnet for holding the collet, wherein the pick-up head is mounted on the die- The method of mounting the collet on the pick-up head includes the steps of: providing a panel having a first region in which the collet is disposed; and mounting the collet on a lower surface of the pick-up head and between the die- Lowering the pick-up head to a predetermined position so as to generate an elastic displacement in the vertical direction , There is the collet by comparing the predetermined value and the displacement can include the step of determining that properly mounted to the pick-up head.
Description
Embodiments of the invention relate to a method of mounting a collet. More particularly, the present invention relates to a method for mounting a new collet to a pick-up head after removing the collet from a pick-up head for replacement of a collet for picking up and transporting a die in a die bonding process.
Generally, in the die bonding process, a pick-up unit that picks up and transports the dies from a wafer to bond individualized dies to the substrate through a sawing process can be used. The pick-up unit may include a pick-up body to which the collet is coupled and a pick-up body to which the pick-up head is mounted, the collet for picking up the die using the vacuum. The pick-up unit may be mounted so as to be resiliently supported in a direction perpendicular to the die transferring portion for transferring the die.
The collet may be coupled to the pick-up head using a magnetic force, and may be made of a flexible material, such as synthetic rubber, in direct contact with the die. Therefore, the collet may be required to be replaced for reasons such as abrasion after a certain period of use.
When replacing the collet, the collet may be removed from the pick-up head and a new collet may be attached to the pick-up head. The pick-up replacement operation can be manually performed by the operator, and after the attachment of the new collet, visual inspection or the like can be performed to check whether the collet is normally attached. On the other hand, when the collet is not normally mounted, a vacuum for sucking the die may be leaked in the process of bonding the die picked up by the collet to the substrate, and the horizontal state of the collet may be poor, A uniform pressure may not be applied.
However, in the case of pick-up replacement which depends on manual operation as described above, it is possible to determine whether or not the collet is normally mounted according to the skill level of the operator, and a considerable time is required to perform the mounting, The overall operation rate of the die bonding equipment using the pick-up unit can be remarkably lowered.
Embodiments of the present invention are directed to a method of mounting a collet to a pick-up head in a die bonding process and to confirm a mounting state of the collet.
According to embodiments of the present invention, there is provided a method of manufacturing a semiconductor device, including a collet having a plurality of suction holes for sucking a die, a pickup head having a pneumatic piping for providing a vacuum through the suction holes, Wherein the pick-up head has a flat bottom surface on which the collet is mounted, and the pick-up head includes a pick-up body mounted on the die- And a permanent magnet. The method of mounting the collet on the pick-up head includes the steps of: providing a panel having a first region in which the collet is disposed and a second region having a flat top surface; Lowering the pick-up head to a predetermined position so as to generate a displacement in a vertical direction between the die transferring part and the pick-up body, comparing the displacement with a predetermined value, determining whether the collet is normally mounted on the pick- A step of bringing the lower surface of the collet mounted on the pick-up head into close contact with the upper surface of the second area; providing a vacuum inside the suction holes through the pneumatic piping; And measuring the degree of vacuum inside the suction holes to confirm the mounting state of the collet.
According to embodiments of the present invention, a guide member for guiding the collet to the normal mounting position may be provided at a lower edge portion of the pick-up head.
According to embodiments of the present invention, the first region may be provided with a collet receiving groove for receiving the collet.
delete
According to embodiments of the present invention, the second region may be provided with a chuck for supporting the die, and the lower surface of the collet mounted on the pickup head may be in close contact with the upper surface of the chuck.
According to embodiments of the present invention, the step of obtaining an image of the collet mounted on the pick-up head and comparing the obtained image with the reference image may be performed to confirm the mounting state of the collet.
According to embodiments of the present invention as described above, the vertical displacement amount of the pick-up head while mounting the collet positioned on the panel to the pick-up head is measured, and the measured displacement amount is compared with a preset value, You can check the mounting status.
Further, it is possible to additionally confirm the mounting state of the collet by bringing the collet into close contact with the chuck, then providing a vacuum to the collet and confirming the degree of vacuum inside the collet, further obtaining an image of the mounted collet, The mounting state of the collet can be finally confirmed.
As described above, the mounting of the collet is automatically performed, and the mounting state of the collet is automatically confirmed through various steps, so that the time required for mounting the collet can be significantly shortened as compared with the prior art, The problem of being mounted can be sufficiently improved.
1 is a flowchart illustrating a method of mounting a collet on a pick-up head according to an embodiment of the present invention.
2 is a schematic diagram for explaining a pickup unit and a die transferring unit used in the die bonding process.
3 is a schematic cross-sectional view for explaining the pickup unit shown in Fig.
4 is a schematic plan view for explaining a panel for removal and replacement of a collet;
Figs. 5 and 6 are schematic cross-sectional views showing a state where the collet is abnormally mounted on the pickup head. Fig.
Hereinafter, a head replacement apparatus and a die bonding system including the head replacement apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.
The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.
The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.
1 is a flowchart illustrating a method of mounting a collet on a pick-up head according to an embodiment of the present invention. 2 is a schematic structural view for explaining a pick-up unit and a die feeder used in a die bonding process, and Fig. 3 is a schematic sectional view for explaining a pick-up unit shown in Fig.
Referring to FIGS. 1 to 3, a collet mounting method according to an embodiment of the present invention includes a pick-
The pick-
In addition, the pick-
According to an embodiment of the present invention, although not shown in detail, the pick-up
The
Referring to FIG. 3, the
For example, the pick-up
On the other hand, the
When the
4 is a schematic plan view for explaining a panel for removal and replacement of a collet;
Referring to FIG. 4, the removal of the
For example, the locking
Although not shown in detail, a recess may be provided on both sides of the pick-up
According to one embodiment of the present invention, the
In addition, the
Next, a collet mounting method according to an embodiment of the present invention will be described with reference to the accompanying drawings.
Referring to FIG. 1, a
For example, the drive may rotate the
Particularly, the
Then, in step S120, the measured displacement may be compared with a predetermined value to determine whether the
Figs. 5 and 6 are schematic cross-sectional views showing a state where the collet is abnormally mounted on the pickup head. Fig.
5, when the
However, when the difference between the measured displacement and the predetermined value is within the error range, the
According to an embodiment of the present invention, in step S130, the lower surface of the
The lower surface of the
However, when the
Also, even when the
On the other hand, the degree of vacuum can be measured by mounting a vacuum sensor (not shown) on a vacuum line connected to the
When the
Although not shown, an under-vision camera (not shown) for inspecting a die picked up by the pick-up
According to an embodiment of the present invention, an image of the
The image of the
According to the embodiments of the present invention as described above, the vertical displacement amount of the pick-up
The mounting state of the
The mounting of the
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.
10: pick-up unit 20: collet
30: pick-up head 40: pick-up body
50: die feed section 60: encoder
70: chuck 102: panel
104: opening 106: collet storage groove
110:
Claims (6)
Wherein the pick-up head has a flat lower surface on which the collet is mounted, and has a permanent magnet for gripping the collet,
The method of mounting the collet to the pick-
Providing a panel having a first region in which the collet is disposed and a second region having a flat top surface;
Lowering the pick-up head to a predetermined position such that the collet is mounted on a lower surface of the pick-up head and a displacement occurs in a vertical direction between the die feed portion and the pick-up body;
Comparing the displacement with a predetermined value to determine whether the collet is properly mounted on the pick-up head;
Attaching a lower surface of the collet mounted on the pickup head to the upper surface of the second area;
Providing a vacuum within the adsorption holes through the pneumatic piping; And
And measuring the degree of vacuum in the pneumatic piping and the suction holes to confirm the mounting state of the collet.
Further comprising the step of comparing the obtained image with a reference image to confirm the mounting state of the collet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20120122105A KR101422350B1 (en) | 2012-10-31 | 2012-10-31 | Method of mounting a collet to a pickup head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20120122105A KR101422350B1 (en) | 2012-10-31 | 2012-10-31 | Method of mounting a collet to a pickup head |
Publications (2)
Publication Number | Publication Date |
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KR20140056730A KR20140056730A (en) | 2014-05-12 |
KR101422350B1 true KR101422350B1 (en) | 2014-07-23 |
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Application Number | Title | Priority Date | Filing Date |
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KR20120122105A KR101422350B1 (en) | 2012-10-31 | 2012-10-31 | Method of mounting a collet to a pickup head |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102559271B1 (en) * | 2016-06-03 | 2023-07-25 | 세메스 주식회사 | Apparatus for binding dies |
JP6899314B2 (en) | 2017-11-17 | 2021-07-07 | 浜松ホトニクス株式会社 | Adsorption method |
KR102042268B1 (en) * | 2018-03-19 | 2019-11-27 | 주식회사 아이플렉스 | Picker unit |
KR102185034B1 (en) * | 2018-06-27 | 2020-12-01 | 세메스 주식회사 | Module for aligning bonding tool and die bonding apparatus having the same |
KR102288925B1 (en) * | 2018-06-27 | 2021-08-12 | 세메스 주식회사 | Module for aligning bonding tool and die bonding apparatus having the same |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080007716A (en) * | 2006-07-18 | 2008-01-23 | 삼성전자주식회사 | Die attach apparatus which can compensate collet tilt automatically |
KR20100034812A (en) * | 2008-09-25 | 2010-04-02 | 세크론 주식회사 | Nozzle apparatus of sawing sorter system |
KR20100048126A (en) * | 2008-10-30 | 2010-05-11 | 오토윈주식회사 | Simultaneous separating and absorbing device |
-
2012
- 2012-10-31 KR KR20120122105A patent/KR101422350B1/en active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080007716A (en) * | 2006-07-18 | 2008-01-23 | 삼성전자주식회사 | Die attach apparatus which can compensate collet tilt automatically |
KR20100034812A (en) * | 2008-09-25 | 2010-04-02 | 세크론 주식회사 | Nozzle apparatus of sawing sorter system |
KR20100048126A (en) * | 2008-10-30 | 2010-05-11 | 오토윈주식회사 | Simultaneous separating and absorbing device |
Also Published As
Publication number | Publication date |
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KR20140056730A (en) | 2014-05-12 |
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