CN114464565B - High-precision adjustable patch diode suction pen structure - Google Patents

High-precision adjustable patch diode suction pen structure Download PDF

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Publication number
CN114464565B
CN114464565B CN202210086814.6A CN202210086814A CN114464565B CN 114464565 B CN114464565 B CN 114464565B CN 202210086814 A CN202210086814 A CN 202210086814A CN 114464565 B CN114464565 B CN 114464565B
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deviation
block
cavity
deviation preventing
fan
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CN202210086814.6A
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CN114464565A (en
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刘吉海
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Semtech Semiconductor Technology Dongguan Co Ltd
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Semtech Semiconductor Technology Dongguan Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

The invention provides a high-precision adjustable chip diode suction pen structure which comprises a suction pen body, wherein a conical suction nozzle is formed at the bottom of the suction pen body, and a vacuum air cavity is coaxially arranged in the suction pen body; a limiting sleeve is sleeved at the position, close to the suction nozzle, of the suction pen body, and an anti-deviation block is connected below the limiting sleeve through a bolt; the center position of the bottom of the deviation preventing block is provided with a deviation preventing yielding cavity; the bottom of the suction nozzle penetrates through the deviation preventing block, and the vacuum air cavity is communicated with the deviation preventing yielding cavity; auxiliary clamping structures are arranged on the two opposite sides of the deviation preventing abdicating cavity of the deviation preventing block; the auxiliary clamping structure comprises fan-shaped blocks arranged on two opposite sides of the deviation prevention yielding cavity respectively and buffer springs connected with the fan-shaped blocks; the two opposite side walls of the deviation prevention yielding cavity are provided with displacement yielding grooves for accommodating the fan-shaped blocks and the buffer springs. The invention has the beneficial effects that: the clamping device can be matched with a product to automatically adjust the size of a clamping space, and the problem of clamping or crushing is effectively solved.

Description

High-precision adjustable patch diode suction pen structure
Technical Field
The invention relates to the technical field of diode processing, in particular to a high-precision adjustable surface mount diode suction pen structure.
Background
Chinese utility model patent publication No. CN 212449623U, publication date 2021 year 02 month 02 date, entitled diode suction nozzle structure, which discloses the following technical contents: the suction nozzle comprises a suction nozzle body, wherein the suction nozzle body sequentially comprises a grabbing part, a connecting part and a suction part from top to bottom, one end of the connecting part is connected with the grabbing part, the other end of the connecting part is connected with the suction part, a first air cavity penetrates through the grabbing part, a second air cavity penetrates through the connecting part, a third air cavity penetrates through the suction part, and the first air cavity, the second air cavity and the third air cavity are communicated with each other; one end of the suction part, which is far away from the connecting part, is provided with a yielding groove corresponding to the shape of the diode. One side in the groove of stepping down is provided with limiting plate A, one side of absorption portion with the position that limiting plate A corresponds is provided with adjusting screw, adjusting screw's afterbody with limiting plate A connects, the opposite side in the groove of stepping down be provided with limiting plate B that limiting plate A corresponds, the opposite side of absorption portion with the position that limiting plate B corresponds is provided with adjusting screw, adjusting screw's afterbody with limiting plate B connects. When diodes with different sizes are required to be adsorbed, the size of the abdicating groove can be adjusted according to the size of the diode shell, and the relative distance between the limiting plate A and the limiting plate B can be adjusted only by rotating the adjusting screws at corresponding positions. The structure has the defects that the relative distance between the limiting plate A and the limiting plate B needs to be manually adjusted, products with different sizes cannot be automatically adapted, and some diode products belong to the same model when being processed, but the volumes of diode shells are different, so that clamping or crushing can be caused when adsorption is carried out, workers need to manually clean the diode products, and the maintenance cost is increased. In view of such circumstances, improvement is urgently required.
Disclosure of Invention
Based on the above, the invention aims to provide a high-precision adjustable suction pen structure for a surface mount diode, which can be matched with a product to automatically adjust the size of a clamping space and effectively solve the problem of clamping or crushing.
The invention provides a high-precision adjustable chip diode suction pen structure which comprises a suction pen body, wherein a conical suction nozzle is formed at the bottom of the suction pen body, and a vacuum air cavity is coaxially arranged in the suction pen body; a limiting sleeve is sleeved at a position, close to the suction nozzle, of the suction pen body, and an anti-deviation block is connected to the lower side of the limiting sleeve through a bolt; the center position of the bottom of the deviation preventing block is provided with a deviation preventing yielding cavity; the bottom of the suction nozzle penetrates through the deviation preventing block, and the vacuum air cavity is communicated with the deviation preventing abdication cavity; auxiliary clamping structures are arranged on the two opposite sides of the deviation preventing abdicating cavity of the deviation preventing block; the auxiliary clamping structure comprises fan-shaped blocks arranged on two opposite sides of the deviation prevention yielding cavity respectively and buffer springs connected with the fan-shaped blocks; displacement yielding grooves for accommodating the fan-shaped blocks and the buffer springs are formed in two opposite side walls of the deviation preventing yielding cavity; guide grooves are formed in the two opposite sides of the deviation preventing block corresponding to the fan-shaped block, and guide convex particles inserted into the guide grooves are arranged on the two opposite sides of the fan-shaped block; the anti-deviation device is characterized in that lugs are arranged on two opposite sides of the outer side surface of the limiting sleeve, the lugs are connected with L-shaped arms through rotating shafts, and arc-shaped embedding grooves are formed in the positions, corresponding to the free ends of the L-shaped arms, of the outer side surface of the anti-deviation block.
Preferably, the limiting sleeve is provided with a waist-shaped hole, and the bolt penetrates through the waist-shaped hole and is connected with the deviation preventing block.
Preferably, a guide convex column is arranged on one side face, close to the buffer spring, of the sector block, and the buffer spring is sleeved outside the guide convex column.
As a preferred scheme, a silica gel cushion layer is attached to the bottom of the deviation prevention yielding cavity.
As a preferred scheme, the arc-shaped surfaces of the two fan-shaped blocks are arranged close to the deviation prevention yielding cavity to form a clamping space with a narrow top and a wide bottom.
As a preferable scheme, the lower part of the outer side surface of the deviation preventing block is provided with a thread pushing block at the position close to the displacement abdicating groove; one side of the thread pushing block transversely extends into the displacement yielding groove to be abutted and contacted with the buffer spring, and the other side of the thread pushing block is exposed out of the anti-deviation block.
The beneficial effects of the invention are as follows: the auxiliary clamping structure comprises fan-shaped blocks and buffer springs, the fan-shaped blocks are respectively arranged on two opposite sides of the deviation prevention yielding cavity, the buffer springs are connected with the fan-shaped blocks, displacement yielding grooves for containing the fan-shaped blocks and the buffer springs are formed in two opposite side walls of the deviation prevention yielding cavity, so that when the surface mount diode is subjected to adsorption operation, the fan-shaped blocks on two sides are abutted and contacted with the surface mount diode, and then the surface mount diode is adsorbed through the vacuum cavity, on one hand, the deviation prevention function is realized during adsorption operation, on the other hand, the adaptability adjustment of the surface mount diode can be realized through the springs, the problem of clamping or crushing is effectively solved, when the surface mount diodes of different types are processed, the deviation prevention blocks do not need to be replaced, the maintenance equipment is greatly reduced, and the adjusting time is saved; through setting up L shape arm, when loosening the bolt and carrying out the fine-tuning to preventing inclined to one side piece, need not to hold on one hand and prevent inclined to one side piece and adjust on the other hand, only need under the supporting force of L shape arm, be absorbed in the adjustment prevent inclined to one side piece the relative position can, promote the degree of simplicity and convenience when adjusting.
Drawings
Fig. 1 is a front view of the present invention.
Fig. 2 is a cross-sectional view of the present invention.
Fig. 3 is a cross-sectional view of the present invention (threaded push block).
The reference signs are: the suction pen comprises a suction pen body 10, a limiting sleeve 11, an anti-deviation block 12, an anti-deviation abdicating cavity 13, a bolt 14, a fan-shaped block 15, a guide groove 16, a guide convex particle 17, a vacuum air cavity 18, a displacement abdicating groove 19, a guide convex column 20, a buffer spring 21, an auxiliary clamping structure 22, a suction nozzle 23, a silica gel cushion layer 24, a lug 25, a rotating shaft 26, an L-shaped arm 27, an arc-shaped embedding groove 28 and a thread pushing block 29.
Detailed Description
For a better understanding of the features and technical solutions of the present invention, together with the specific objects and functions attained by the invention, reference is made to the following detailed description and accompanying drawings that form a part hereof.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
Referring to fig. 1-2, the invention provides a high-precision adjustable chip diode suction pen structure, which comprises a suction pen body 10, wherein a conical suction nozzle 23 is formed at the bottom of the suction pen body 10, and a vacuum air cavity 18 is coaxially arranged inside the suction pen body 10; a limiting sleeve 11 is sleeved at the position, close to the suction nozzle 23, of the suction pen body 10, and an anti-deviation block 12 is connected below the limiting sleeve 11 through a bolt; an anti-deviation yielding cavity 13 is formed in the center of the bottom of the anti-deviation block 12; the bottom of the suction nozzle 23 penetrates through the deviation preventing block, and the vacuum air cavity 18 is communicated with the deviation preventing abdicating cavity 13; auxiliary clamping structures 22 are arranged on the two opposite sides of the deviation preventing abdicating cavity 13 of the deviation preventing block 12; the auxiliary clamping structure 22 comprises fan-shaped blocks 15 respectively arranged on two opposite sides of the deviation prevention yielding cavity 13 and buffer springs 21 connected with the fan-shaped blocks 15; two opposite side walls of the deviation preventing abdicating cavity 13 are provided with displacement abdicating grooves 19 for accommodating the fan-shaped blocks 15 and the buffer springs 21; the opposite sides that the anti-deviation block corresponds with sector 15 have all been seted up guide way 16, and the opposite sides of sector 15 all is provided with the protruding grain 17 of direction that inserts in guide way 16. Through the structure arrangement, the fan-shaped block 15 is ensured to be displaced back and forth along the guide groove 16 through the guide convex particles 17 in the displacement process without shaking, and the adsorption effect is not influenced. Two opposite sides of the outer side surface of the limiting sleeve 11 are respectively provided with a lug 25, the two lugs 25 are respectively connected with an L-shaped arm 27 through a rotating shaft 26, and the outer side surface of the deviation preventing block 12 is provided with an arc-shaped embedding groove 28 corresponding to the free end of the L-shaped arm 27. Through setting up L shape arm, when loosening the bolt and carrying out the fine-tuning to preventing inclined to one side piece, need not to hold on one hand and prevent inclined to one side piece and adjust on the other hand, only need under the supporting force of L shape arm, be absorbed in the adjustment prevent inclined to one side piece the relative position can, promote the degree of simplicity and convenience when adjusting.
In a preferred embodiment, the position-limiting sleeve 11 is provided with a waist-shaped hole, the bolt 14 penetrates through the waist-shaped hole and is connected with the anti-deviation block 12, the relative position between the anti-deviation block 12 and the position-limiting sleeve 11 can be adjusted according to the requirement through the structure, and the position-limiting sleeve is fixed through the bolt, so that the precision of the structure is ensured, and the adjusting speed of the structure is increased.
In a preferred embodiment, a guide boss 20 is disposed on one side surface of the segment 15 close to the buffer spring 21, and the buffer spring 21 is sleeved outside the guide boss 20. The length of the guide boss 20 is smaller than that of the buffer spring 21 in the non-compressed state.
As preferred embodiment, the bottom of the deviation prevention yielding cavity 13 is provided with a silica gel cushion layer 24 in an attached manner, the outer surface of a product is prevented from being scratched by the silica gel cushion layer 24, and after the deviation prevention yielding cavity is used for a long time, the silica gel cushion layer 24 can be directly replaced without replacing the deviation prevention block 12.
As a preferred embodiment, the arc-shaped surfaces of the two segments 15 are arranged close to the anti-deviation abdicating cavity 13 to form a clamping space with a narrow top and a wide bottom, and through the structure arrangement, when discharging, the clamping acting force is reduced, so that the discharging is facilitated.
In the embodiment, the auxiliary clamping structure comprises fan-shaped blocks and buffer springs, the fan-shaped blocks are respectively arranged on two opposite sides of the deviation prevention abdicating cavity, the buffer springs are connected with the fan-shaped blocks, and displacement abdicating grooves for containing the fan-shaped blocks and the buffer springs are formed in two opposite side walls of the deviation prevention abdicating cavity, so that when the patch diode is adsorbed, the fan-shaped blocks on two sides are abutted to the patch diode and then the patch diode is adsorbed through the vacuum cavity, on one hand, the deviation prevention function is ensured to be realized during adsorption operation, on the other hand, the adaptive adjustment of the patch diode can be realized through the springs, and the clamping or crushing condition is effectively solved; moreover, for some products which are in a placement position and have a deviation condition, the fan-shaped blocks with elastic buffering force can be used for adsorbing the products and then adjusting the positions of the products to correct positions; when the surface mount diodes of different models are processed, the anti-deviation block does not need to be replaced, so that the maintenance equipment is greatly reduced, and the adjusting time is saved.
Referring to fig. 1-3, as a preferred embodiment, the lower portion of the outer side surface of the deviation preventing block 12 is provided with a screw pushing block 29 at a position close to the displacement yielding groove 19; one side of the thread pushing block 29 transversely extends into the displacement yielding groove 19 to be abutted and contacted with the buffer spring 21, and the other side of the thread pushing block 29 is exposed out of the anti-deviation block 12; in actual operation, the relative distance between the fan-shaped blocks 15 on the two opposite sides can be adjusted by controlling the distance that the thread pushing block 29 extends into the yielding groove 19, so that the adsorption precision of the structure is further improved.
The above-mentioned embodiment only expresses one embodiment of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (5)

1. A high-precision adjustable chip diode suction pen structure comprises a suction pen body (10), wherein a conical suction nozzle (23) is formed at the bottom of the suction pen body (10), and a vacuum air cavity (18) is coaxially arranged inside the suction pen body (10); the method is characterized in that: a limiting sleeve (11) is sleeved at a position, close to the suction nozzle (23), of the suction pen body (10), and an anti-deviation block (12) is connected below the limiting sleeve (11) through a bolt; the center position of the bottom of the deviation preventing block (12) is provided with a deviation preventing yielding cavity (13); the bottom of the suction nozzle (23) penetrates through the deviation preventing block, and the vacuum air cavity (18) is communicated with the deviation preventing abdication cavity (13); auxiliary clamping structures (22) are arranged on the two opposite sides of the deviation preventing block (12) positioned in the deviation preventing yielding cavity (13); the auxiliary clamping structure (22) comprises fan-shaped blocks (15) which are respectively arranged on two opposite sides of the deviation prevention yielding cavity (13) and buffer springs (21) connected with the fan-shaped blocks (15); two opposite side walls of the deviation-preventing yielding cavity (13) are provided with displacement yielding grooves (19) for accommodating the fan-shaped blocks (15) and the buffer springs (21); guide grooves (16) are formed in the two opposite sides of the deviation preventing block, which correspond to the fan-shaped blocks (15), and guide convex particles (17) inserted into the guide grooves (16) are arranged on the two opposite sides of the fan-shaped blocks (15); two opposite sides of the outer side surface of the limiting sleeve (11) are respectively provided with a lug (25), the two lugs (25) are respectively connected with an L-shaped arm (27) through a rotating shaft (26), and an arc-shaped embedding groove (28) is formed in the position, corresponding to the free end of the L-shaped arm (27), of the outer side surface of the deviation preventing block (12); the lower part of the outer side surface of the deviation preventing block (12) close to the displacement abdicating groove (19) is provided with a thread pushing block (29); one side of the thread pushing block (29) transversely extends into the displacement yielding groove (19) to be abutted against and contacted with the buffer spring (21), and the other side of the thread pushing block (29) is exposed out of the deviation preventing block (12).
2. The high-precision adjustable patch diode suction pen structure as claimed in claim 1, wherein: the limiting sleeve (11) is provided with a waist-shaped hole, and the bolt (14) penetrates through the waist-shaped hole to be connected with the deviation preventing block (12).
3. The high-precision adjustable patch diode suction pen structure as claimed in claim 1, wherein: a guide convex column (20) is arranged on one side face, close to the buffer spring (21), of the sector block (15), and the buffer spring (21) is sleeved outside the guide convex column (20).
4. The high-precision adjustable patch diode suction pen structure as claimed in claim 1, wherein: and a silica gel cushion layer (24) is attached to the bottom of the deviation prevention yielding cavity (13).
5. The high-precision adjustable patch diode suction pen structure as claimed in claim 1, wherein: the arc-shaped surfaces of the two fan-shaped blocks (15) are arranged close to the deviation prevention yielding cavity (13) to form a clamping space with a narrow top and a wide bottom.
CN202210086814.6A 2022-01-25 2022-01-25 High-precision adjustable patch diode suction pen structure Active CN114464565B (en)

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CN202210086814.6A CN114464565B (en) 2022-01-25 2022-01-25 High-precision adjustable patch diode suction pen structure

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CN202210086814.6A CN114464565B (en) 2022-01-25 2022-01-25 High-precision adjustable patch diode suction pen structure

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CN114464565B true CN114464565B (en) 2022-12-06

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114929005B (en) * 2022-05-27 2023-08-11 宁波复洋光电有限公司 Auxiliary device convenient to four-color patch is installed

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US4527327A (en) * 1982-04-16 1985-07-09 U.S. Philips Corporation Device for transferring an electric or electronic component to a mounting board
KR101350550B1 (en) * 2012-10-30 2014-01-10 세메스 주식회사 Method of removing a collet
DE102014226212A1 (en) * 2014-12-17 2016-06-23 Robert Bosch Gmbh Tool head for an ultrasonic welding device
CN209582977U (en) * 2019-01-28 2019-11-05 深圳市通构科技有限公司 A kind of sheet metal automatic charging device
CN110641991A (en) * 2019-09-06 2020-01-03 佛山科学技术学院 Composite clamp for pipe fitting
CN112242334A (en) * 2019-07-17 2021-01-19 台湾积体电路制造股份有限公司 Conveying device
CN212449623U (en) * 2020-05-25 2021-02-02 中之半导体科技(东莞)有限公司 Diode suction nozzle structure

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JPH07105638B2 (en) * 1990-05-31 1995-11-13 三洋電機株式会社 Parts mounting device
JP5056769B2 (en) * 2009-01-30 2012-10-24 パナソニック株式会社 Electronic component mounting apparatus and electronic component mounting head
CN109979872B (en) * 2019-03-27 2020-12-11 嘉兴觅特电子商务有限公司 A pick up equipment that is used for chip processing to have an anti-drop function
TWM601240U (en) * 2019-05-15 2020-09-11 信錦企業股份有限公司 Suction device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4527327A (en) * 1982-04-16 1985-07-09 U.S. Philips Corporation Device for transferring an electric or electronic component to a mounting board
KR101350550B1 (en) * 2012-10-30 2014-01-10 세메스 주식회사 Method of removing a collet
DE102014226212A1 (en) * 2014-12-17 2016-06-23 Robert Bosch Gmbh Tool head for an ultrasonic welding device
CN209582977U (en) * 2019-01-28 2019-11-05 深圳市通构科技有限公司 A kind of sheet metal automatic charging device
CN112242334A (en) * 2019-07-17 2021-01-19 台湾积体电路制造股份有限公司 Conveying device
CN110641991A (en) * 2019-09-06 2020-01-03 佛山科学技术学院 Composite clamp for pipe fitting
CN212449623U (en) * 2020-05-25 2021-02-02 中之半导体科技(东莞)有限公司 Diode suction nozzle structure

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