CN109979872B - A pick up equipment that is used for chip processing to have an anti-drop function - Google Patents
A pick up equipment that is used for chip processing to have an anti-drop function Download PDFInfo
- Publication number
- CN109979872B CN109979872B CN201910238777.4A CN201910238777A CN109979872B CN 109979872 B CN109979872 B CN 109979872B CN 201910238777 A CN201910238777 A CN 201910238777A CN 109979872 B CN109979872 B CN 109979872B
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- pipe
- moving
- fixed
- block
- suction nozzle
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- 230000008093 supporting effect Effects 0.000 claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 230000000712 assembly Effects 0.000 claims abstract description 9
- 238000000429 assembly Methods 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 7
- 239000004519 grease Substances 0.000 claims description 4
- 239000010687 lubricating oil Substances 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 14
- 230000008569 process Effects 0.000 abstract description 12
- 230000009471 action Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910238777.4A CN109979872B (en) | 2019-03-27 | 2019-03-27 | A pick up equipment that is used for chip processing to have an anti-drop function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910238777.4A CN109979872B (en) | 2019-03-27 | 2019-03-27 | A pick up equipment that is used for chip processing to have an anti-drop function |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109979872A CN109979872A (en) | 2019-07-05 |
CN109979872B true CN109979872B (en) | 2020-12-11 |
Family
ID=67080997
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910238777.4A Active CN109979872B (en) | 2019-03-27 | 2019-03-27 | A pick up equipment that is used for chip processing to have an anti-drop function |
Country Status (1)
Country | Link |
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CN (1) | CN109979872B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111315203B (en) * | 2020-04-07 | 2021-08-27 | 上海裕科实业有限公司 | Novel chip processing is with subsides dress equipment |
CN113071050A (en) * | 2021-04-01 | 2021-07-06 | 重庆同力塑料制品有限公司 | Material taking and discharging device used after EPS foam product molding |
CN113428652A (en) * | 2021-05-25 | 2021-09-24 | 广州纵横同舟科技有限公司 | Protective glass plate processing and manufacturing equipment |
CN113506761B (en) * | 2021-07-01 | 2023-09-22 | 泉州盈创电子股份公司 | Ball mounting tool for maintaining set top box chip |
CN114464565B (en) * | 2022-01-25 | 2022-12-06 | 先之科半导体科技(东莞)有限公司 | High-precision adjustable patch diode suction pen structure |
CN117123981B (en) * | 2023-10-26 | 2024-03-15 | 江苏快克芯装备科技有限公司 | Micro-pressure device of chip suction mechanism and chip welding machine |
CN118123870A (en) * | 2024-05-07 | 2024-06-04 | 苏州微伏芯芯片科技有限公司 | Adjustable chip overturning mechanical arm and use method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4599037A (en) * | 1984-07-02 | 1986-07-08 | United Technologies Corporation | Method and apparatus for manipulating miniature parts |
KR100351052B1 (en) * | 2000-03-30 | 2002-09-05 | 삼성전자 주식회사 | Loader for semiconductor package processing having a guider and method for using the same |
JP4437415B2 (en) * | 2004-03-03 | 2010-03-24 | リンク・パワー株式会社 | Non-contact holding device and non-contact holding and conveying device |
CN101180548A (en) * | 2005-04-07 | 2008-05-14 | 株式会社爱德万测试 | Pick-and-place mechanism of electronic device, electronic device handling apparatus and suction method of electronic device |
CN103915368B (en) * | 2014-04-02 | 2016-08-31 | 华中科技大学 | A kind of chip pick-and-place device |
CN105023860B (en) * | 2014-04-16 | 2017-10-03 | 北京中电科电子装备有限公司 | A kind of chip accurate operation device |
-
2019
- 2019-03-27 CN CN201910238777.4A patent/CN109979872B/en active Active
Also Published As
Publication number | Publication date |
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CN109979872A (en) | 2019-07-05 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201126 Address after: 314000 south side of Hongyun Road, Honghe Town, Xiuzhou District, Jiaxing City, Zhejiang Province Applicant after: Jiaxing Meite e-commerce Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Qianhai Shenzhen Hong Kong cooperation zone before Bay Road No. 1 building 201 room A Applicant before: SHENZHEN NAISHIDI TECHNOLOGY DEVELOPMENT Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240511 Address after: 518000 No. 2, zone a, floor 3, building B1, Shenzhen digital technology park, No. 16, Gaoxin South 7th Road, high tech Zone community, Yuehai street, Nanshan District, Shenzhen, Guangdong Patentee after: Carbon core microelectronics technology (Shenzhen) Co.,Ltd. Country or region after: China Address before: 314000 south side of Hongyun Road, Honghe Town, Xiuzhou District, Jiaxing City, Zhejiang Province Patentee before: Jiaxing Meite e-commerce Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right |