CN111063651A - Contact extrusion type self-centering wafer clamping manipulator - Google Patents
Contact extrusion type self-centering wafer clamping manipulator Download PDFInfo
- Publication number
- CN111063651A CN111063651A CN201911354717.5A CN201911354717A CN111063651A CN 111063651 A CN111063651 A CN 111063651A CN 201911354717 A CN201911354717 A CN 201911354717A CN 111063651 A CN111063651 A CN 111063651A
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- pressing
- wafer
- bottom plate
- pressing block
- block
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The invention discloses a contact extrusion type self-centering wafer clamping manipulator which comprises a bottom plate, an elastic clamping unit, a supporting pad and a suction plate with a vacuum chuck, wherein the elastic clamping unit comprises a mounting seat, a sliding block, a pressing block, an inclined pressing block and a pressing spring; the wafer is not contacted with the three pressing blocks and does not slide in the placing process, so that the risk of abrasion and scratching of the wafer is avoided; meanwhile, the slider is extruded after the suction plate is contacted with the inclined pressing block, so that the pressing block is pressed outwards, stronger downward force can be provided compared with the downward pressing of a wafer, the pressing block can be matched with a pressing spring with higher rigidity, enough clamping force is provided for the pressing block to act on the wafer, and the clamping is firmer and more stable.
Description
Technical Field
The invention relates to a contact extrusion type self-centering wafer clamping manipulator.
Background
In the production of semiconductor integrated circuits, wafers are frequently transferred between different processes, which involves the handling of the wafers after they are picked from the stations and placed on the carriers. Most of the existing gripper carriers do not have the function of positioning and clamping, and wafers are easy to shift and even slide when being impacted in the transferring process, so that the wafers are broken and scrapped.
The invention patent No. 201210218852.9 proposes a wafer holding device using a spring clip, which has the advantages of wafer holding and positioning functions and no excessive requirement on positioning accuracy when placing a wafer; but the wafer extrudes the spring to enable the slide block to retreat through the positioning mode of the wafer, so that the fragile wafer is obviously damaged, sliding friction exists between the wafer and the slide block, and scraps generated by friction can generate secondary pollution on the surface of the wafer; in addition, due to the thin and brittle characteristics of the wafer, the wafer cannot provide enough downward pressure, and the wafer is ensured to push the slider away smoothly, so that the elasticity of the spring is very small, which causes that the spring cannot provide enough clamping force for the slider to act on the wafer.
Disclosure of Invention
The invention aims to overcome the defects and provide a contact extrusion type self-centering wafer clamping manipulator.
In order to achieve the purpose, the invention adopts the following specific scheme:
a contact extrusion type self-centering wafer clamping manipulator comprises a disc-shaped bottom plate, three groups of elastic clamping units arranged on the bottom plate and three groups of supporting pads arranged on the bottom plate, wherein the three groups of elastic clamping units and the three groups of supporting pads are arranged in an equilateral triangle, and the distance from the supporting pads to the center of the bottom plate is smaller than the distance from the elastic clamping units to the center of the bottom plate;
the elastic clamping unit comprises an L-shaped mounting seat, a sliding block, a pressing block, an inclined pressing block and a pressing spring, wherein a long arm of the mounting seat is fixed on a bottom plate, the sliding block is connected to the long arm of the mounting seat in a sliding mode, the pressing block is arranged at one end, close to the center of the bottom plate, of the sliding block, two ends of the pressing spring are respectively abutted against a short arm of the mounting seat and one end, far away from the center of the bottom plate, of the sliding block, the inclined pressing block and the sliding block are arranged perpendicular to each other, the inclined pressing block is provided with a downward pressing inclined plane, the sliding block is provided with an inclined plane groove matched with the inclined pressing block, the downward pressing inclined plane of the inclined pressing block is abutted against the inclined plane of the inclined plane groove, and under the action of the pressing spring;
the wafer positioning device further comprises a disc-shaped suction plate with a vacuum chuck on one side, the suction plate is used for grabbing the wafer and placing the wafer on the supporting pad, and the radius of the suction plate is larger than the distance from the inclined pressing block to the center of the bottom plate.
The elastic clamping unit further comprises a first guide seat and a second guide seat, the long arm of the mounting seat is arranged on the first guide seat, one end, close to the pressing block, of the first guide seat is arranged on the second guide seat, the first guide seat is provided with a first central through hole and a notch communicated with the first central through hole, the second guide seat is provided with a second central through hole, the slider is movably arranged in the first central through hole in a penetrating mode, the second central through hole is communicated with the first central through hole through the notch, and the inclined pressing block is movably arranged in the second central through hole and is abutted against the inclined plane groove of the slider after stretching into the first central through hole through the notch.
The side surface of the pressing block facing the center of the bottom plate is provided with a groove for being embedded with the outer circular wall of the wafer; the groove wall of the groove is arc-shaped.
The sliding block is provided with a blind hole at one end far away from the center of the bottom plate, and one end of the compression spring extends into the blind hole and then is abutted to the sliding block.
The invention has the beneficial effects that: through the structural arrangement, the wafer is not contacted with the three pressing blocks and does not slide in the placing process, so that the risk of abrasion and scratching of the wafer is avoided; in addition, the slider is extruded after the suction plate is contacted with the oblique pressing block, so that the pressing block is pressed outwards, stronger downward force can be provided compared with the downward pressing of a wafer, the pressing block can be matched with a pressing spring with higher rigidity, enough clamping force is provided for the pressing block to act on the wafer, and the clamping is firmer and more stable.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a diagram illustrating a state of use of the present invention in clamping a wafer;
FIG. 3 is a schematic structural view of an elastic clamping unit according to the present invention;
FIG. 4 is a cross-sectional view of the elastic clamp unit of the present invention;
description of reference numerals: 1-a bottom plate; 2-an elastic clamping unit; 21-a mounting seat; 22-a slide block; 221-bevel groove; 23-a compact block; 231-a groove; 24-inclined pressing block; 241-pressing the inclined plane; 25-a hold-down spring; 26-a first guide seat; 27-a second guide shoe; 3-a support pad; 4-suction plate.
Detailed Description
The invention will be described in further detail with reference to the following figures and specific examples, without limiting the scope of the invention.
As shown in fig. 1 to 4, the contact extrusion type self-centering wafer clamping manipulator according to the present embodiment includes a disk-shaped bottom plate 1, which is convenient for matching with the shape of a wafer, three sets of elastic clamping units 2 and three sets of support pads 3 respectively disposed on the bottom plate 1, wherein the three sets of elastic clamping units 2 and the three sets of support pads 3 are arranged in an equilateral triangle, and the distance from the support pads 3 to the center of the bottom plate 1 is smaller than the distance from the elastic clamping units 2 to the center of the bottom plate 1; preferably, the three groups of elastic clamping units 2 are located in the radial direction, so that the clamping force acting on the wafer is convenient to be along the radial direction of the wafer, and the wafer is favorably stressed in a balanced manner and is kept in a stable state.
The elastic clamping unit 2 comprises an L-shaped mounting seat 21, a sliding block 22, a pressing block 23, an inclined pressing block 24 and a pressing spring 25, wherein the long arm of the mounting seat 21 is fixed on the bottom plate 1 along the radial direction of the bottom plate 1, the sliding block 22 is slidably connected to the long arm of the mounting seat 21, the pressing block 23 is arranged at one end of the sliding block 22 close to the center of the bottom plate 1, two ends of the pressing spring 25 are respectively abutted against the short arm of the mounting seat 21 and one end of the sliding block 22 far away from the center of the bottom plate 1, the inclined pressing block 24 and the sliding block 22 are arranged perpendicular to each other, the inclined pressing block 24 is provided with a pressing inclined surface 241, the sliding block 22 is provided with an inclined surface groove 221 matched with the inclined pressing block 24, namely the inclined surface groove 221 is provided with an inclined surface, the inclined pressing block 24 extends into the inclined surface groove 221, and the pressing inclined surface 241 of the inclined pressing block 24 is, the slide block 22 and the pressing block 23 protrude inwards towards the center of the bottom plate 1, and the inclined pressing block 24 is pushed upwards, namely when the inclined pressing block 24 is not extruded by external force, the inclined pressing block 24 is in an upwards-pushed state, the maximum height of the supporting pad 3 is smaller than that of the pressing block 23, and the pressing block 23 can be ensured to be abutted against the outer circular wall of a wafer after the wafer is placed on the supporting pad 3;
and a sucking plate 4 which is disc-shaped and has a vacuum chuck (not shown) on one side, wherein the sucking plate 4 is used for sucking the wafer and placing the wafer on the three supporting pads 3, the radius of the sucking plate 4 is larger than the distance from the inclined pressing block 24 to the center of the bottom plate 1, and the sucking plate 4 can be simultaneously contacted with the top surfaces of the three inclined pressing blocks 24.
When the wafer placing device is actually used, the suction plate 4 is driven by the external moving mechanism to suck a wafer through the vacuum chuck, then the suction plate 4 together with the wafer moves to the position right above the bottom plate 1 under the driving of the external moving mechanism, then downward probing is carried out until the wafer is contacted with the three support pads 3, in the process of placing the wafer on the support pads 3 under the downward probing of the suction plate 4, the suction plate 4 is firstly contacted with the top surfaces of the three inclined pressing blocks 24 at the same time and presses the inclined pressing blocks 24 downwards, at the moment, the downward pressing inclined surface 241 of the inclined pressing block 24 and the inclined surface of the inclined surface groove 221 slide relatively, the three sliding blocks 22 slide outwards along the radial direction at the same time, and the compression spring 25 is compressed, so that the effective area of a wafer placing area is enlarged, after the suction plate 4 places the wafer on the support pads 3 after the suction plate 4 probes to a preset height, the suction plate 4 moves under the driving of the external moving mechanism, at the moment, the downward pressure, the compression spring 25 recovers elastic deformation, the slide blocks 22 protrude inwards along the radial direction under the action of the compression spring 25, the three slide blocks 22 are connected with the three compression blocks 23 to protrude, and the wafer is clamped among the three compression blocks 23, so that the wafer is automatically positioned on the supporting pad 3; due to the arrangement, the wafer is not in contact with the three pressing blocks 23 or slides in the placing process, so that the risk of abrasion and scratching of the wafer is avoided; in addition, the slider 22 is squeezed after the suction plate 4 is contacted with the inclined pressing block 24, so that the pressing block 23 is pressed to move outwards, and compared with the wafer pressing, stronger pressing force can be provided, and the clamping device can be matched with a pressing spring 25 with higher rigidity, so that enough clamping force is provided for the pressing block 23 to act on the wafer, and the clamping is firmer and more stable.
As shown in fig. 3 and 4, in the embodiment of the contact extrusion type self-centering wafer clamping manipulator, the elastic clamping unit 2 further includes a first guide seat 26 and a second guide seat 27, the first guide seat 26 is disposed on the long arm of the mounting seat 21, the second guide seat 27 is disposed at one end of the first guide seat 26 close to the pressing block 23, the first guide seat 26 has a first central through hole and a notch communicated with the first central through hole, the second guide seat 27 has a second central through hole, the slider 22 is movably disposed through the first central through hole, the second central through hole is communicated with the first central through hole through the notch, and the oblique pressing block 24 is movably disposed through the second central through hole and abuts against the oblique groove 221 of the slider 22 after extending into the first central through hole through the notch. With such an arrangement, the first guide seat 26 is used for guiding the slider 22, so that the slider 22 slides more stably relative to the first guide seat 26, and it is ensured that the pressing block 23 does not generate relative friction with the wafer, and the second guide seat 27 is used for guiding the oblique pressing block 24, so that the oblique pressing block 24 slides more stably relative to the second guide seat 27, and the overall structure is more reliable.
In the contact extrusion type self-centering wafer clamping manipulator of the present embodiment, as shown in fig. 4, a groove 231 for being embedded with an outer circular wall of a wafer is disposed on a side surface of the pressing block 23 facing to the center of the bottom plate 1, so that the wafer can be limited in a vertical direction, and the wafer can be more accurately located; the groove wall of the groove 231 is arc-shaped, so that the damage to the outer circular arm of the wafer is further avoided.
In the contact extrusion type self-centering wafer clamping manipulator described in this embodiment, a blind hole (not labeled in the figure) is formed in one end, away from the center of the bottom plate 1, of the slider 22, and one end of the compression spring 25 is abutted to the slider 22 after extending into the blind hole. So set up, make the elasticity of pressure spring 25 concentrate on radial direction, provide sufficient clamping force for compact heap 23, the centre gripping is more firm.
Through the structural arrangement, the wafer is not contacted with the three pressing blocks 23 and does not slide in the placing process, so that the risk of abrasion and scratching of the wafer is avoided; in addition, the slider 22 is squeezed after the suction plate 4 is contacted with the inclined pressing block 24, so that the pressing block 23 is pressed to move outwards, and compared with the wafer pressing, stronger pressing force can be provided, and the clamping device can be matched with a pressing spring 25 with higher rigidity, so that enough clamping force is provided for the pressing block 23 to act on the wafer, and the clamping is firmer and more stable.
The above description is only a preferred embodiment of the present invention, and all equivalent changes or modifications of the structure, characteristics and principles described in the present patent application are included in the protection scope of the present patent application.
Claims (4)
1. The contact extrusion type self-centering wafer clamping manipulator is characterized by comprising a disc-shaped bottom plate (1) (1) (1), three groups of elastic clamping units (2) arranged on the bottom plate (1) and three groups of supporting pads (3) arranged on the bottom plate (1), wherein the three groups of elastic clamping units (2) and the three groups of supporting pads (3) are arranged in an equilateral triangle shape, and the distance from the supporting pads (3) to the center of the bottom plate (1) is smaller than the distance from the elastic clamping units (2) to the center of the bottom plate (1);
the elastic clamping unit (2) comprises an L-shaped mounting seat (21), a sliding block (22), a pressing block (23), an inclined pressing block (24) and a pressing spring (25), a long arm of the mounting seat (21) is fixed on the bottom plate (1), the sliding block (22) is connected to the long arm of the mounting seat (21) in a sliding mode, the pressing block (23) is arranged at one end, close to the center of the bottom plate (1), of the sliding block (22), two ends of the pressing spring (25) abut against a short arm of the mounting seat (21) and one end, far away from the center of the bottom plate (1), of the sliding block (22), the inclined pressing block (24) and the sliding block (22) are arranged in a mutually perpendicular mode, the inclined pressing block (24) is provided with a pressing inclined plane (241), the sliding block (22) is provided with an inclined plane groove (221) matched with the inclined plane (24), the pressing inclined plane (241) of the inclined pressing block (24) abuts against an inclined plane of, under the action of the compression spring (25), the sliding block (22) and the compression block (23) are protruded inwards towards the center of the bottom plate (1) and push out the inclined compression blocks (24) (24) (24) upwards;
the wafer-clamping device is characterized by further comprising a disc-shaped suction plate (4) with a vacuum chuck on one side, the suction plate (4) is used for grabbing wafers and placing the wafers on the supporting pad (3), and the radius of the suction plate (4) is larger than the distance from the inclined pressing block (24) to the center of the bottom plate (1).
2. The contact extrusion type self-centering wafer clamping manipulator of claim 1, the elastic clamping unit (2) further comprises a first guide seat (26) and a second guide seat (27), the first guide seat (26) is arranged on the long arm of the mounting seat (21), the second guide seat (27) is arranged at one end of the first guide seat (26) close to the pressing block (23), the first guide seat (26) is provided with a first central through hole and a notch communicated with the first central through hole, the second guide seat (27) is provided with a second central through hole, the slide block (22) is movably arranged in the first central through hole in a penetrating way, the second central through hole is communicated with the first central through hole through a notch, and the inclined pressing block (24) is movably arranged in the second central through hole in a penetrating mode and abuts against the inclined plane groove (221) of the sliding block (22) after stretching into the first central through hole through the notch.
3. The contact extrusion type self-centering wafer clamping manipulator as claimed in claim 1, wherein a side surface of the pressing block (23) facing to the center of the base plate (1) is provided with a groove (231) for being embedded with an outer circular wall of a wafer; the groove wall of the groove (231) is arranged in an arc shape.
4. The contact extrusion type self-centering wafer clamping manipulator as claimed in claim 1, wherein a blind hole is formed in one end, away from the center of the bottom plate (1), of the sliding block (22), and one end of the pressing spring (25) extends into the blind hole and abuts against the sliding block (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911354717.5A CN111063651A (en) | 2019-12-25 | 2019-12-25 | Contact extrusion type self-centering wafer clamping manipulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911354717.5A CN111063651A (en) | 2019-12-25 | 2019-12-25 | Contact extrusion type self-centering wafer clamping manipulator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111063651A true CN111063651A (en) | 2020-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911354717.5A Withdrawn CN111063651A (en) | 2019-12-25 | 2019-12-25 | Contact extrusion type self-centering wafer clamping manipulator |
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| CN (1) | CN111063651A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113764330A (en) * | 2020-06-03 | 2021-12-07 | 中芯北方集成电路制造(北京)有限公司 | Wafer clamping device |
| CN114274386A (en) * | 2021-12-30 | 2022-04-05 | 深圳市陆芯半导体有限公司 | High-precision wafer cutting positioning device and wafer cutting machine |
| CN114476655A (en) * | 2022-02-21 | 2022-05-13 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Clamping piece mechanism |
| CN115338747A (en) * | 2022-09-13 | 2022-11-15 | 芜湖弘度智能科技有限公司 | Refrigerator handle processingequipment |
| CN116960035A (en) * | 2023-09-20 | 2023-10-27 | 微纳动力(北京)科技有限责任公司 | Wafer bonding device and wafer bonding system |
-
2019
- 2019-12-25 CN CN201911354717.5A patent/CN111063651A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113764330A (en) * | 2020-06-03 | 2021-12-07 | 中芯北方集成电路制造(北京)有限公司 | Wafer clamping device |
| CN114274386A (en) * | 2021-12-30 | 2022-04-05 | 深圳市陆芯半导体有限公司 | High-precision wafer cutting positioning device and wafer cutting machine |
| CN114476655A (en) * | 2022-02-21 | 2022-05-13 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Clamping piece mechanism |
| CN115338747A (en) * | 2022-09-13 | 2022-11-15 | 芜湖弘度智能科技有限公司 | Refrigerator handle processingequipment |
| CN116960035A (en) * | 2023-09-20 | 2023-10-27 | 微纳动力(北京)科技有限责任公司 | Wafer bonding device and wafer bonding system |
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Application publication date: 20200424 |
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| WW01 | Invention patent application withdrawn after publication |