CN114068383A - Carrying pad - Google Patents
Carrying pad Download PDFInfo
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- CN114068383A CN114068383A CN202110868526.1A CN202110868526A CN114068383A CN 114068383 A CN114068383 A CN 114068383A CN 202110868526 A CN202110868526 A CN 202110868526A CN 114068383 A CN114068383 A CN 114068383A
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- axis rail
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
- Dicing (AREA)
Abstract
The invention provides a conveying pad, which can properly convey a workpiece group with an annular frame, wherein the annular frame is locally provided with concave-convex parts. A conveying pad (2) is connected with a conveying mechanism (1) and can be sucked and held at four positions of an upper surface (930) of an annular frame (93) by a suction cup (25) and conveyed to a chuck workbench, wherein the conveying pad (2) comprises: an X-axis rail (21) extending in the X-axis direction of the horizontal plane; two Y-axis rails (23) which extend in a Y-axis direction perpendicular to the X-axis direction on a horizontal plane, are disposed on the X-axis rail (21), and are movable in the X-axis direction; and suction cups (25) which are respectively arranged on the Y-axis rails (23) in a manner of being capable of moving in the Y-axis direction, wherein the Y-axis rails (23) can be fixed on the X-axis rails (21) at any position in the X-axis direction, and the suction cups (25) can be fixed on the Y-axis rails (23) at any position in the Y-axis direction.
Description
Technical Field
The present invention relates to a conveying pad connected to a conveying mechanism.
Background
In a cutting device for cutting a wafer by a cutting tool, a workpiece group obtained by bonding the wafer on a tape bonded so as to seal an opening of an annular frame is held on a chuck table, the wafer is cut so as not to cut the tape to form chips, and the chips are supported by the tape.
The fully automatic cutting apparatus includes a conveying mechanism for conveying a workpiece group to a chuck table, and the conveying mechanism includes a conveying pad having four suction pads for sucking and holding an annular frame (see, for example, patent document 1 or patent document 2). Further, the conventional transfer pad can be positioned only at a predetermined position determined in advance according to the size of the ring frame by changing the position of the suction pad (see, for example, patent document 3).
Patent document 1: japanese patent laid-open publication No. 2003-243483
Patent document 2: japanese laid-open patent publication No. 2015-233065
Patent document 3: japanese laid-open patent publication No. H08-069985
The ring frame includes a ring frame made of metal such as stainless steel and a ring frame made of resin. The resin ring frame is injection molded. That is, a resin is injected from an injection nozzle for injecting the resin into a mold, the resin is cured, and the resin cured in the mold is cut and molded into an annular frame. When the resin is cut, irregularities are formed on the surface of the ring frame to be held. Further, when the suction pad is positioned on the unevenness during conveyance of the workpiece set, there is a problem that the annular frame cannot be sucked and held properly.
Therefore, the following problems exist in the conveying pad arranged in the processing device such as the cutting device: a workpiece group (or a single ring frame) having a ring frame with a surface to be held having a local concavity and convexity on the upper surface can be appropriately conveyed.
Disclosure of Invention
The present invention for solving the above-described problems is a transfer pad connected to a transfer mechanism, capable of sucking and holding four positions on an upper surface of an annular frame of a workpiece set having an opening with an inner diameter larger than a diameter of a wafer by a suction pad and transferring the workpiece set to a chuck table, the workpiece set being obtained by attaching the wafer to a tape attached so as to seal the opening of the annular frame, the transfer pad including: an X-axis rail extending in an X-axis direction of a horizontal plane; two Y-axis rails extending in a Y-axis direction perpendicular to the X-axis direction on a horizontal plane, the two Y-axis rails being disposed on the X-axis rail so as to be movable in the X-axis direction; and the suction cups, it disposes on the Y-axis rail respectively in the way of being able to move in Y-axis direction, the Y-axis rail can be fixed to the X-axis rail in the X-axis direction in arbitrary position, the suction cups can be fixed to the Y-axis rail in the Y-axis direction in arbitrary position.
Preferably, the X-axis rail has: a groove extending in the X-axis direction; a nut that can be fixed at an arbitrary position in the groove; and a recess formed in the nut, the Y-axis rail having: a holding part which holds the X-axis rail and can move in the X-axis direction; and a plunger disposed inside the holding portion facing the nut and fitted into the recess of the nut.
Preferably, the Y-axis rail has: a holding unit that holds the X-axis rail and is movable in an X-axis direction; and a biasing portion disposed at the gripping portion and configured to bias the X-axis rail so as to grip the X-axis rail.
Preferably, the X-axis rail has a magnetic body extending in an X-axis direction, and the Y-axis rail has: a holding part which holds the X-axis rail and can move in the X-axis direction; and a magnet disposed on the holding portion and magnetically attracted to the magnetic body.
The conveying pad of the invention comprises: an X-axis rail extending in an X-axis direction of a horizontal plane; two Y-axis rails extending in a Y-axis direction perpendicular to the X-axis direction on a horizontal plane, the two Y-axis rails being disposed on the X-axis rail so as to be movable in the X-axis direction; and suction pads which are respectively arranged on the Y-axis rails in a movable manner in the Y-axis direction, wherein the Y-axis rails can be fixed on the X-axis rails at any position in the X-axis direction, and the suction pads can be fixed on the Y-axis rails at any position in the Y-axis direction, therefore, even if the concave-convex parts such as traces of ejection openings formed on the annular frame of the resin are at the positions where the suction pads suck the annular frame, the suction pads can be moved in the X-axis direction and/or the Y-axis direction, positioned at any position avoiding the concave-convex parts, and the annular frame is sucked and held by the conveying pads appropriately. That is, it is not necessary to create a separate type of transfer pad for changing the arrangement of the suction pads so as to avoid the uneven portion, and it is not necessary to replace the type of transfer pad for each type of the ring frame.
In the transfer pad of the present invention, the X-axis rail includes: a groove extending in the X-axis direction; a nut which can be fixed at an arbitrary position in the groove; and a recess formed in the nut, the Y-axis rail having: a holding part which holds the X-axis rail and can move in the X-axis direction; and a plunger which is disposed inside the grip portion facing the nut and is fitted into the concave portion of the nut, whereby even when an uneven portion such as a trace formed on an injection port of the resin ring frame is located at a position where the suction pad sucks the ring frame, the suction pad can be moved in at least one of the X-axis direction and the Y-axis direction, positioned at an arbitrary position while avoiding the uneven portion, and the ring frame can be appropriately sucked and held by the transfer pad.
In the case of using a plurality of ring frames having different sizes such as 8 inches or 12 inches, the position is determined in advance by a nut, and the Y-axis rail is moved in the X-axis direction and the suction pad is moved in the Y-axis direction, whereby the appropriate suction position corresponding to the ring frame having a different diameter can be switched.
In the transfer pad of the present invention, the Y-axis rail includes: a holding part which holds the X-axis rail and can move in the X-axis direction; and a biasing unit disposed on the holding unit and biasing the holding unit so as to hold the X-axis rail, whereby even when an uneven portion such as a trace formed on an injection port of the resin ring frame is at a position where the suction pad sucks the ring frame, the suction pad can be moved in at least one of the X-axis direction and the Y-axis direction, positioned at an arbitrary position while avoiding the uneven portion, and the ring frame can be appropriately sucked and held by the conveying pad.
In the transfer pad of the present invention, the X-axis rail includes a magnetic body extending in the X-axis direction, and the Y-axis rail includes: a holding part which holds the X-axis rail and can move in the X-axis direction; and a magnet disposed on the grip portion and magnetically attracted to the magnetic body, whereby even when an uneven portion such as a trace formed on an injection port of the annular frame of the resin is located at a position where the suction pad sucks the annular frame, the suction pad can be moved in at least one of the X-axis direction and the Y-axis direction, positioned at an arbitrary position while avoiding the uneven portion, and the annular frame can be appropriately sucked and held by the transfer pad.
Drawings
Fig. 1 is a perspective view illustrating a case where a 12-inch ring frame formed of a resin and having an uneven portion is sucked and held by a conveying mechanism to which a conveying pad according to embodiment 1 is attached, and a workpiece group is conveyed.
Fig. 2 is a perspective view illustrating a case where an 8-inch ring frame formed of resin and having concave and convex portions is sucked and held by a conveying mechanism to which a conveying pad according to embodiment 1 is attached, and a workpiece group is conveyed.
Fig. 3 is a perspective view of a transfer pad according to embodiment 2.
Fig. 4 is a perspective view of a transfer pad according to embodiment 3.
Fig. 5 is a perspective view illustrating a case where a 12-inch ring frame made of resin and having an uneven portion is sucked and held by a conveying mechanism to which a conventional conveying pad is connected, and a workpiece group is conveyed.
Fig. 6 is a perspective view illustrating a case where a conveying mechanism to which a conventional conveying pad is connected sucks and holds an 8-inch ring frame made of resin and having a concave-convex portion, and conveys a workpiece group.
Description of the reference symbols
9: a workpiece group; 91: a wafer; 92: a belt; 93: a 12 inch ring frame; 930: an upper surface of the annular frame; 933: a concave-convex portion; 932: 1 st flat surface; 934: a 2 nd flat surface; 99: a workpiece group; 95: a wafer; 938: an 8 inch ring frame; 937: a concave-convex portion; 1: a conveying mechanism; 11: a lifting unit; 111: a cylinder barrel; 112: a rod; 114: a support arm; 12: a mobile unit; 2: the transfer pad of embodiment 1; 21: an X-axis rail; 212: a groove; 213: a protruding part; 215: an 8 inch threaded nut; 2155: a stopper; 217: a recess; 216: a 12 inch threaded nut; 23: a Y-axis rail; 230: a grip portion; 235: a movable hole; 239: a plunger; 25: a suction cup; 254: a suction tube; 2547: a joint; 27: a fixing member; 271: 1, fixing plate; 272: a 2 nd fixing plate; 273: adjusting the bolt; 4: the transfer pad of embodiment 2; 41: an X-axis rail; 49: a Y-axis rail; 490: a grip portion; 492: an urging portion (coil spring); 494: a stopper; 5: the transfer pad of embodiment 3; 51: an X-axis rail; 59: a Y-axis rail; 590: a grip portion; 593: a magnet; 6: conventional carrying pads; 61: an X-axis rail; 611: 8 inch plunger fixing holes; 613: 12 inch plunger fixing holes; 63: a Y-axis rail; 65: a suction cup; 66: and a plunger.
Detailed Description
The conveyance mechanism 1 shown in fig. 1 includes at least: a conveyance pad 2 of the present invention for sucking and holding the ring frame 93; a lifting unit 11 for lifting the conveying pad 2; and a moving means 12 such as a ball screw mechanism for moving the transport mat 2 in the horizontal plane direction (X-axis Y-axis plane direction).
The conveying target conveyed by the conveying mechanism 1 is, for example, a workpiece set 9 described below. The object to be conveyed by the conveying mechanism 1 may be only the ring frame 93.
The wafer 91 having a circular outer shape shown in fig. 1 is, for example, a wafer having silicon as a base material, but may be a wafer made of gallium arsenide, sapphire, gallium nitride, ceramic, resin, silicon carbide, or the like, or may be a rectangular package substrate or the like. Further, the wafer 91 may be a wafer on which devices are formed or a wafer which is sliced from an ingot and on which no devices are formed.
The wafer 91 has a lower surface to which a circular tape 92 having a larger diameter than the wafer 91 is attached, for example. Further, the outer peripheral portion of the belt 92 is attached to a 12-inch ring frame 93. Thus, the wafer 91 is integrated with the ring frame 93 via the tape 92, and the work group 9 in which the wafer 91 is attached to the tape 92 attached so as to seal the opening of the ring frame 93 having an opening with an inner diameter larger than the diameter of the wafer 91 is formed. Further, the wafer 91 can be handled by the ring frame 93, and damage and the like during conveyance can be prevented. The center of the opening of the ring frame 93 and the center of the wafer 91 are substantially aligned.
The annular frame 93 is formed of, for example, a plastic resin, and has, on the upper surface 930, for example, a planar circular uneven portion 933 formed at the time of cutting after injection molding. In the example shown in fig. 1, the concave-convex portions 933 are formed at four positions on the upper surface 930 of the ring frame 93, but the formation positions are not limited to four positions, and the shape is not limited to a circular shape in plan view, but the same number of concave-convex portions are formed at substantially the same position for each type of ring frame 93.
The annular frame 93 is formed with, for example, two 1 st flat surfaces 932 facing in parallel and two 2 nd flat surfaces 934 facing in parallel in a direction perpendicular to the 1 st flat surfaces 932, by cutting out a part of the outer periphery into a flat surface. The 1 st flat surface 932 and the 2 nd flat surface 934 are used for positioning the ring frame 93 by a centering guide or the like, not shown.
The lifting unit 11 is an electric cylinder or the like, and a support arm 114 that supports the transport mat 2 is connected to a rod 112 that moves in the-Z direction from a cylinder 111 of the lifting unit 11.
(carrying mat 2 of embodiment 1)
The conveyance pad 2 shown in fig. 1 (hereinafter, referred to as conveyance pad 2 of embodiment 1) connected to the lower surface of the tip of the support arm 114 extending horizontally in the + Y direction includes: an X-axis rail 21 extending in the X-axis direction of the horizontal plane; two Y-axis rails 23 extending in a Y-axis direction perpendicular to the X-axis direction on a horizontal plane, disposed on the X-axis rail 21, and movable in the X-axis direction; and suction pads 25 which are respectively disposed on the Y-axis rails 23 so as to be movable in the Y-axis direction, the Y-axis rails 23 being fixable to the X-axis rails 21 at arbitrary positions in the X-axis direction, the suction pads 25 being fixable to the Y-axis rails 23 at arbitrary positions in the Y-axis direction.
The X-axis rail 21, which is formed of, for example, a predetermined metal or the like or a hard resin, has a rectangular outer shape in a plan view, and the distal end lower surface of the support arm 114 is connected to a central portion of the X-axis rail 21. In the present embodiment, a single groove 212 extending in the X-axis direction is formed in the upper surface of the X-axis rail 21. The groove 212 has a convex cross section when viewed from the X-axis direction, and the protrusion 213 extending inward from the upper portion in the groove 212 restricts the 8-inch nut 215 or the 12-inch nut 216 entering the groove 212 from falling off from the groove 212.
At least two or more nuts capable of being fixed at arbitrary positions in the X-axis direction in the groove 212 are disposed in the groove 212. In the example shown in fig. 1, four nuts are arranged, and for example, a pair of nuts near the center of the X-axis rail 21 is an 8-inch nut 215, and a pair of nuts located outside the 8-inch nut 215 is a 12-inch nut 216. The nut may be only one of the pair of 8-inch nuts 215 and the pair of 12-inch nuts 216.
Since the 8-inch nut 215 and the 12-inch nut 216 have the same structure, the 8-inch nut 215 will be described below. The 8-inch nut 215 has a convex cross section when viewed from the X-axis direction, is set to a size loosely fitted in the groove 212, and is slidable in the X-axis direction in the groove 212.
A cylindrical recess 217 is formed in the center of the upper surface of the 8-inch nut 215, for example. The 8-inch nut 215 has a stopper 2155 such as a lock pin for fixing to an arbitrary position of the X-axis rail 21 in the groove 212, for example.
Instead of having the stopper 2155, the 8-inch nut 215 may be disposed in the groove 212 in a state of being combined with a resin frame, not shown, for example. The resin frame has a certain degree of elasticity, for example, and has a quadrangular ring shape in plan view, and an 8-inch nut 215 is fitted into an opening of the resin frame. Further, for example, when a force is applied by an operator to the 8-inch nut 215 that has entered the groove 212, the resin frame is slightly deformed and can slide in the X-axis direction, which is the extending direction of the groove 212, and when no force is applied to the 8-inch nut 215, the resin frame is fixed in the groove 212 by the frictional force acting between the resin frame and the inner surface of the groove 212.
In fig. 1, the Y-axis rails 23 positioned at both ends of the X-axis rail 21 are formed in a substantially rectangular plate shape extending in the Y-axis direction in a plan view, and in the present embodiment, the center portion of the Y-axis rail 23 is a gripping portion 230 that grips the X-axis rail 21 and enables the Y-axis rail 23 itself to move in the X-axis direction on the X-axis rail 21. For example, the grip portion 230 has a substantially inverted concave shape in cross section when viewed from the X-axis direction, and is movably loosely fitted to the X-axis rail 21.
A through hole, not shown, is formed from the upper surface of the grip portion 230 of the Y-axis rail 23 to the lower surface facing the 12-inch nut 216. The Y-axis rail 23 further includes a plunger 239, and the plunger 239 is disposed inside the grip portion 230 facing the 12-inch nut 216 and is fitted into the recess 217 of the 12-inch nut 216.
In fig. 1, the recess 217 formed in the 12-inch nut 216 is overlapped with the through hole, and the projection of the plunger 239 (for example, an indexing plunger) is inserted into the through hole and the recess 217, whereby the Y-axis rail 23 is fixed to the 12-inch nut 216 positioned at a desired position on the X-axis rail 21. When the worker lifts the plunger 239 exposed on the upper surface of the grip portion 230, for example, the projection is disengaged from the recess 217, and the Y-axis rail 23 can be moved in the X-axis direction relative to the 12-inch nut 216 in the fixed state.
The suction pad 25 is formed of an elastic material such as rubber, which is deformable, so as to have a circular shape in plan view and have a diameter expanding downward. The lower surface of the suction pad 25 serves as a suction surface, a suction tube 254 extending in the Z-axis direction is communicated with the suction pad 25, and the upper end side of the suction tube 254 is inserted into the movable hole 235.
A fixing member 27 for fixing the suction tube 254 to a predetermined position of the Y-axis rail 23 is disposed on the upper end side of the suction tube 254. The fixing member 27 has at least: a 1 st fixing plate 271 which abuts against the upper surface of the Y-axis rail 23 and fixes the suction tube 254; a 2 nd fixing plate 272 which abuts against the lower surface of the Y-axis rail 23 and fixes the suction tube 254; and an adjusting bolt 273 inserted through the 1 st fixing plate 271 and screwed with the 2 nd fixing plate 272.
In the example shown in fig. 1, the adjustment bolt 273 is tightened, and the Y-axis rail 23 is sandwiched from both sides in the ± Z-axis direction by the 1 st fixing plate 271 and the 2 nd fixing plate 272, and the suction tube 254 is fixed at positions substantially on both end sides of the Y-axis rail 23 in fig. 1. By loosening the adjustment bolt 273, a gap is generated between the 2 nd fixing plate 272 and the lower surface of the Y-axis rail 23, the clamping and fixing of the Y-axis rail 23 by the 1 st fixing plate 271 and the 2 nd fixing plate 272 are released, and the suction tube 254 can be moved in the Y-axis direction in the movable hole 253, whereby the suction pad 25 can be moved to an arbitrary position in the Y-axis direction.
Fig. 1 is a perspective view illustrating a case where a 12-inch ring frame 93 formed of a resin and having concave and convex portions 933 is sucked and held by a conveying mechanism 1 having a conveying pad 2 according to embodiment 1, and a workpiece group 9 is conveyed. Fig. 2 is a perspective view illustrating a case where the positions of the two Y-axis rails 23 and the four suction pads 25 of the transfer pad 2 are moved from the state shown in fig. 1, and the 8-inch ring frame 938 made of resin and having the concave and convex portions 937 is sucked and held to transfer the workpiece group 99 having the wafer 95 having a smaller diameter than the wafer 91, for example.
The suction tube 254 shown in fig. 1 is in communication with an ejector mechanism or a vacuum generator, i.e., a suction source, which is not shown, via a joint 2547, a flexible resin tube, which is not shown, and the like. Then, a suction force generated by the operation of a suction source, not shown, is transmitted to the suction pad 25.
(carrying pad 4 of embodiment 2)
The conveying mechanism 1 may be configured such that the conveying pad 4 of embodiment 2 shown in fig. 3 is connected to the support arm 114.
The X-axis rail 41 of the conveyance pad 4 according to embodiment 2 is formed of SUS or the like, for example, and has a rectangular shape in plan view, and the front end lower surface of the support arm 114 is connected to the center portion of the X-axis rail 41.
The transport pad 4 of embodiment 2 has the Y-axis rail 49, and the structure of the Y-axis rail 49 is similar to that of the Y-axis rail 23 described in embodiment 1 except for the constituent elements described below. The Y-axis rail 49 has: a grip 490 for gripping the X-axis rail 41 and allowing the Y-axis rail 49 itself to move in the X-axis direction; and a biasing portion 492 which is disposed on the gripping portion 490 and biases the X-axis rail 41 to be gripped.
For example, the grip portion 490 has a substantially inverted concave shape in cross section when viewed from the X-axis direction, and is movably fitted to the X-axis rail 41. Movable holes 497 are formed at both end sides of the Y-axis rail 49, and the suction pads 25 are disposed so as to be movable in the Y-axis direction as in the conveyance pad 2 of embodiment 1.
A through hole 491 is formed from the upper surface of the grip portion 490 of the Y-axis rail 49 to the lower surface facing the X-axis rail 41. A coil spring 492 is disposed as an urging portion 492 on the upper surface of the grip portion 490. The inner diameter of the opening of the coil spring 492 is set larger than the diameter of the through hole 491, the lower end side of the coil spring 492 is fixed to the upper surface of the grip portion 490, and the coil spring 492 surrounds the through hole 491. A stopper 494 having a substantially T-shaped longitudinal section is connected to an upper end side of the coil spring 492 which is expandable and contractible in the Z-axis direction. The stopper 494 has, for example, a disk-shaped head portion and a pin portion having a smaller diameter than the head portion, the pin portion extending from a lower surface of the head portion toward the-Z direction. Then, the pin portion enters the central opening portion of the coil spring 492, and the upper end of the coil spring 492 is fixed to the lower surface of the head. In the illustrated example, the coil spring 492 which is to be contracted biases the stopper 494 in the-Z direction, and the lower end surface of the pin portion inserted into the through hole 491 presses the X-axis rail 41 from above, thereby fixing the grip portion 490 to, for example, the end side of the X-axis rail 41. For example, a slip prevention member or the like may be provided on a lower end surface of the pin portion of the stopper 494 that abuts on the upper surface of the X-axis rail 41.
In addition, as the anti-slip member, a suction cup may be provided at a lower end of the stopper 494.
For example, when the worker lifts up the stopper 494, the urging force of the coil spring 492 to be restored by being expanded is accumulated between the stopper 494 and the upper surface of the grip portion 490, and the fixing of the Y-axis rail 49 to the X-axis rail 41 by the stopper 494 is released, so that the Y-axis rail 49 can move on the X-axis rail 41.
(carrying mat 5 of embodiment 3)
The conveying mechanism 1 may be configured such that the conveying pad 5 according to embodiment 3 shown in fig. 4 is connected to the support arm 114.
The X-axis rail 51 of the transport pad 5 according to embodiment 3 has, for example, a rectangular shape in plan view, and the lower surface of the distal end of the support arm 114 is connected to the center portion of the X-axis rail 51. The X-axis rail 51 has a magnetic body extending in the X-axis direction. In the present embodiment, the entire X-axis rail 51 is made of a metal such as iron, cobalt, or nickel, but the present invention is not limited thereto. For example, a long plate-like magnetic body extending from one end of the X-axis rail 51 on the-X direction side to the other end on the + X direction side may be embedded in the upper surface of the X-axis rail 51.
The transfer pad 5 of embodiment 3 has the Y-axis rail 59, and the structure of the Y-axis rail 59 is similar to that of the Y-axis rail 49 described in embodiment 2 except for the constituent elements described below. The Y-axis rail 59 has: a gripping portion 590 that grips the X-axis rail 51 and enables the Y-axis rail 59 itself to move in the X-axis direction; and a magnet 593 disposed on the grip 590 and magnetically attracted to the X-axis rail 51 as a magnetic body.
For example, the grip 590 has a substantially inverted concave shape in cross section when viewed from the X-axis direction, and is movably loosely fitted to the X-axis rail 51. Movable holes 597 are formed on both end sides of the Y-axis rail 59, and the suction pads 25 are disposed so as to be movable in the Y-axis direction, as in the conveyance pad 2 of embodiment 1 shown in fig. 1.
For example, a through hole, not shown, in a horizontal state, having a substantially semi-cylindrical shape is formed from the upper surface of the grip portion 590 of the Y-axis rail 59 to the lower surface facing the X-axis rail 51.
The magnet 593 in the present embodiment is formed in a plate shape extending in the X axis direction, for example, and is embedded in one region of the side surface of the columnar rotating member 595 accommodated in the approximately semi-columnar through hole. The rotating member 595 is, for example, a half of the rotating member 595 accommodated in the through hole, and is rotatable in the direction of the arrow R1 or the direction of the arrow R2 in the through hole by a bearing or the like not shown.
In the state shown in fig. 4, the magnet 593 embedded in one region of the side surface of the rotating member 595 is in a state of facing the upper surface of the X-axis rail 51, and the Y-axis rail 59 is in a state of being fixed at the position of the end of the X-axis rail 51 by a magnetic force generated between the X-axis rail 51 made of a magnetic material and the magnet 593.
A handle 594 is attached to a side surface of the rotary member 595, and when the operator holds the handle 594 and rotates the rotary member 595 in the direction of the arrow R2, the magnet 593 is separated from the X-axis rail 51 and faces the + Y direction side, and no magnetic force acts between the X-axis rail 51 made of a magnetic material and the magnet 593. As a result, the fixation of the Y-axis rail 59 to the X-axis rail 51 by the magnet 593 is released, and the Y-axis rail 59 can move on the X-axis rail 51.
The magnet 593 may be an electromagnet that generates a magnetic force by energization, and the fixation and release of the fixation of the Y-axis rail 59 to the X-axis rail 51 may be switched by energization of the magnetic force.
Hereinafter, a case will be described in which the target first workpiece set 9 is sucked and held by the conveyance mechanism 1 shown in fig. 1 having the conveyance pad 2 of embodiment 1 and conveyed to a chuck table, not shown.
For example, the operator fixes the positions of the two Y-axis rails 23 of the transport mat 2 on the X-axis rail 21 in advance so as to be able to suck and hold the 12-inch ring frame 93. For fixing the Y-axis rail 23, first, a pair of 12-inch nuts 216 are fixed to the X-axis rail 21 at positions at which the 12-inch ring frame 93 is sucked and held, and further, the Y-axis rail 23 is fixed to the 12-inch nuts 216 using the plunger 239. When only a pair of 8-inch nuts 215 are disposed on the X-axis rail 21, the 8-inch nuts 215 are fixed to the 12-inch ring frame 93 at the position where the ring frame is sucked and held, and the Y-axis rail 23 is fixed to the 8-inch nuts 215 fixed to the position.
For example, the workpiece group 9 having the 12-inch ring frame 93 shown in fig. 1 is centered by a centering guide, a centering table, or the like, not shown, after being carried out from the wafer cassette accommodated in a shelf shape, and is placed on the centering guide or the like. That is, the 1 st flat surface 932 of the annular frame 93 is parallel to the Y-axis direction, and the 2 nd flat surface 934 is parallel to the X-axis direction.
Then, for example, the transfer pad 2 is moved in the horizontal direction by the moving means 12, and each suction pad 25 is positioned above the ring frame 93. The positioning is performed by a control unit (not shown) such as a CPU that controls the moving unit 12, for example, so that the center of the transfer pad 2 substantially coincides with the center of the wafer 91 of the workpiece group 9 (the center of the opening of the ring frame 93) in the centered state.
The lifting and lowering unit 11 lowers the transfer pad 2 to position the suction pad 25 at a predetermined height position where the suction pad does not contact the upper surface 930 of the ring frame 93. Here, for example, the operator confirms whether or not the uneven portion 933 is located at the contact position of the suction pad 25 and the ring frame 93. When it is determined that the concave-convex part 933 is located at the contact position of the suction pad 25 and the ring frame 93, the position of the suction pad 25 is slightly shifted in the Y-axis direction. That is, the worker releases the clamping and fixing of the Y-axis rail 23 by the first fixing plate 271 and the second fixing plate 272 by loosening the adjusting bolt 273, moves the suction tube 254 in the movable hole 235 in the Y-axis direction, and positions each suction pad 25 so as not to face the uneven portion 933 of the ring frame 93 in the Z-axis direction. Then, the position of the suction cup 25 is fixed by retightening the adjusting bolt 273.
In addition, the adjustment for displacing the suction pad 25 from the uneven portion 933 of the ring frame 93 may be performed by adjusting the position of the Y-axis rail 23 in the X-axis direction, in addition to the position adjustment of the suction pad 25 in the Y-axis direction, or may be performed only by adjusting the position of the Y-axis rail 23 in the X-axis direction.
For example, the confirmation of whether or not the uneven portion 933 is located at the contact position of the suction pad 25 and the ring frame 93 may be performed by the conveyance mechanism 1 itself, and not by the operator. For example, a reflective photosensor having a light projecting portion and a light receiving portion may be disposed near each of the suction pads 25, and whether or not the uneven portion 933 partially formed on the flat upper surface 930 of the ring-shaped frame 93 is at the suction position of the suction pad 25 may be determined based on the light receiving time, the light receiving amount, and the like of the reflected light from the ring-shaped frame 93 detected by the light receiving portion.
After the position of the suction pad 25 is adjusted by the operator, the conveyance pad 2 is lowered by the lifting and lowering unit 11, and the suction pad 25 is brought into contact with the flat upper surface 930 of the ring frame 93 where the uneven portion 933 is not formed. Then, a suction force generated by a suction source, not shown, is transmitted to the lower surface of the suction pad 25 through the suction tube 254, and the conveyance pad 2 is sucked and held by the suction pad 25 with respect to the ring frame 93.
Here, a problem in the conventional transfer pad 6 shown in fig. 5 and 6 will be described. The transfer pad 6 has an H-shaped outer shape in plan view, and the transfer pad 6 includes at least: a rectangular plate-shaped X-axis rail 61; two Y-axis rails 63 that can be fixed only at prescribed two different positions of the X-axis rail 61; and suction pads 65 fixed to both end sides of the Y-axis rails 63, respectively. Fig. 5 is a perspective view illustrating a case where the conveying means 1 having the conventional conveying pad 6 conveys the workpiece group 9 by sucking and holding the 12-inch ring frame 93 formed of a resin and having the uneven portion 933. Fig. 6 is a perspective view illustrating a case where the positions of the two Y-axis rails 63 and the four suction pads 65 of the transfer pad 6 are moved from the state shown in fig. 5, and the 8-inch ring frame 938 made of resin and having the concave and convex portions 937 is sucked and held to transfer the workpiece group 99 having the wafer 95.
On the upper surface of the X-axis rail 61 of the transfer pad 6 shown in fig. 5, a pair of 8-inch plunger fixing holes 611 are formed at positions close to the center of the X-axis rail 61, and a 12-inch plunger fixing hole 613 is formed at a position outside the 8-inch plunger fixing holes 611.
The thickness of the center portion of the Y-axis rail 63 is formed thicker than the other portions, and a through-insertion hole 633 through which the X-axis rail 61 is inserted is formed. The Y-axis rail 63, through which the X-axis rail 61 is inserted, is movable in the X-axis direction along the X-axis rail 61, is positioned so as to overlap the 8-inch plunger fixing hole 611 or the 12-inch plunger fixing hole 613, and is fixed to either position by the plunger 66.
When the workpiece group 9 is sucked and held by the conveying mechanism 1 shown in fig. 5 having the conveying pad 6 and conveyed to a chuck table, not shown, the positions of the two Y-axis rails 63 of the conveying pad 6 on the X-axis rail 61 are fixed in advance by an operator so that the 12-inch ring frame 93 can be sucked and held.
For example, the transfer pad 6 is moved in the horizontal direction by the moving unit 12, and the respective suction pads 65 are positioned above the ring frame 93 such that the center of the transfer pad 6 substantially coincides with the center of the wafer 91 of the workpiece set 9 in the centered state. Here, when the uneven portion 933 is present at the contact position of the suction pad 65 and the ring frame 93, the position of the suction pad 65 in the Y axis direction cannot be moved, and the Y axis rail 63 can be fixed and positioned only in the X axis direction at the position of the plunger fixing hole 611 for 8 inches or the plunger fixing hole 613 for 12 inches, and therefore, there are the following problems in such a state: even if the transfer pad 6 is lowered by the elevating unit 11 and the suction pad 65 is brought into contact with the upper surface 930 of the ring frame 93, the uneven portion 933 causes vacuum leakage between the suction pad 65 and the upper surface 930 of the ring frame 93, and thus the ring frame 93 cannot be sucked and held properly. This problem is also similar to the case of suction-holding the 8-inch ring frame 938 shown in fig. 6.
On the other hand, in the transfer pad 2 shown in fig. 1 of the present invention, as described above, even if the uneven portion 933 such as a trace formed in the injection hole of the resin ring frame 93 is at the position where the suction pad 25 sucks the ring frame 93, the suction pad 25 can be moved in the X-axis direction or the Y-axis direction and positioned at an arbitrary position avoiding the uneven portion 933, and the ring frame 93 can be sucked and held by the transfer pad 2 without any vacuum leakage. That is, it is not necessary to create individual types of transport pads for changing the arrangement of the suction pads 25 so as to avoid the uneven portions 933, and it is not necessary to replace the types of transport pads for each type of ring frame.
The conveyance pad 2 that has sucked and held the ring-shaped frame 93 by the suction pads 25 conveys the workpiece group 9 to a not-shown chuck table by the elevating means 11 and the moving means 12, and the workpiece group 9 is placed on the chuck table by the conveyance pad 2 in a state where the holding surface of the chuck table substantially coincides with the center of the wafer 91 of the workpiece group 9 held by the conveyance pad 2 in a state where the center position is grasped by centering, and the chuck table sucks and holds the workpiece group and also clamps and fixes the ring-shaped frame 93. Then, the transfer pad 2 is separated from the workpiece group 9.
The number of the concave-convex portions 933 formed on the upper surface 930 and the positions of the concave-convex portions 933 of the ring frame 93 centered on the centering guide are substantially the same for each type of the ring frame 93. Further, when the transfer pad 2 sucks and holds the target workpiece set 9 of the second and subsequent sheets on the centering guide, not shown, as described above, the position of the uneven part 933 of the ring frame 93 of the workpiece set 9 in the centered state on the centering guide is the same as the position of the first sheet, and the suction pad 25 is also provided at the X-axis and Y-axis position avoiding the uneven part 933 with respect to the transfer pad 2, so that the center of the transfer pad 2 is substantially aligned with the center of the wafer 91 to position the transfer pad 2 with respect to the workpiece set 9, whereby the ring frame 93 can be sucked and held by the transfer pad 2 without vacuum leakage.
The following will be explained: for example, when the transfer target of the transfer pad 2 is changed from the workpiece set 9 having the 12-inch ring frame 93 shown in fig. 1 to the workpiece set 99 having the wafer 95 and the 8-inch ring frame 938 shown in fig. 2, the workpiece set 99 is sucked and held by the transfer mechanism 1 having the transfer pad 2 of embodiment 1 and transferred to the chuck table, not shown.
The operator fixes the positions of the two Y-axis rails 23 of the transport mat 2 on the X-axis rail 21 so as to be able to suck and hold the 8-inch ring frame 938. In this fixing of the Y-axis rail 23, the plunger 239 is lifted up to release the fixing of the Y-axis rail 23 to the X-axis rail 21, and the Y-axis rail 23 can be moved in the X-axis direction toward the 8-inch nut 215. Then, the Y-axis rail 23 is moved to the position of the 8-inch nut 215 fixed to a predetermined position in advance, and the Y-axis rail 23 is fixed to the 8-inch nut 215 fixed to the predetermined position of the X-axis rail 21. In the case where only one pair of 12-inch nuts 216 are disposed on the X-axis rail 21, the 12-inch nuts 216 may be moved together with the Y-axis rail 23 to a predetermined position of the X-axis rail 21 when the ring frame 938 is sucked and held, and the 12-inch nuts 216 may be fixed to the predetermined position at the predetermined position.
For example, the workpiece group 99 shown in fig. 2 is centered by a centering guide, a centering table, or the like, and is placed on the centering guide or the like. That is, the 1 st flat surface 9382 and the 2 nd flat surface 9384 of the ring frame 938 are parallel to the Y axis direction and the X axis direction, respectively. Then, for example, the transfer pad 2 is moved in the horizontal direction, and the suction pads 25 are positioned above the ring frame 938. This positioning is performed, for example, so that the center of the transfer pad 2 substantially coincides with the center of the wafer 95 of the workpiece group 9 in the centered state.
The lifting unit 11 lowers the transfer pad 2 to position the suction pad 25 at a predetermined height position where the suction pad does not contact the upper surface 9380 of the ring frame 938. Here, for example, when the operator determines that the concave-convex portion 937 is located at the contact position between the suction pad 25 and the ring frame 938, the position of the suction pad 25 is slightly shifted in the Y-axis direction in the same manner as described above. In addition, the adjustment for slightly offsetting the suction pad 25 from the concave-convex portion 937 of the ring frame 938 may be performed by performing the position adjustment of the Y-axis rail 23 in the X-axis direction, in addition to the position adjustment of the suction pad 25 in the Y-axis direction, or may be performed only by the position adjustment of the Y-axis rail 23 in the X-axis direction.
After the position of the suction pad 25 is adjusted by the operator, the conveyance pad 2 is lowered by the lifting unit 11, and the suction pad 25 is brought into contact with the flat upper surface 9380 of the ring frame 938 on which the uneven portion 937 is not formed. Then, a suction force generated by a suction source, not shown, is transmitted to the lower surface of the suction pad 25 through the suction tube 254, and the conveyance pad 2 sucks and holds the ring frame 938 by the suction pad 25 without vacuum leakage.
As described above, in the transfer pad 2 of the present invention, the X-axis rail 21 includes: a groove 212 extending in the X-axis direction; for example, 8 inch nuts 215 and 12 inch nuts 216, which can be fixed at any position in the groove 212; and a recess 217 formed in the 8-inch nut 215 and the 12-inch nut 216, wherein the Y-axis rail 23 includes: a grip 230 that grips the X-axis rail 21 and is movable in the X-axis direction; and a plunger 239 that is disposed inside the grip 230 facing the 8-inch nut 215 or the 12-inch nut 216 and that fits into the concave portion 217 of the 8-inch nut 215 or the 12-inch nut 216, whereby even when the concave-convex portion 933, such as a trace formed in the injection port of the 12-inch ring frame 93 made of resin, is at a position where the suction pad 25 sucks the ring frame 93, the suction pad 25 can be moved in the X-axis direction and the Y-axis direction, positioned at an arbitrary position avoiding the concave-convex portion 933, and the ring frame 93 can be appropriately sucked and held by the transfer pad 2 without vacuum leakage.
When a plurality of ring frames 93 having different sizes such as 8 inches or 12 inches are used, the position is determined in advance by the 8-inch nut 215 or the 12-inch nut 216, the Y-axis rail 23 is moved in the X-axis direction, and the suction pad 25 is moved in the Y-axis direction, whereby the appropriate suction position corresponding to the ring frame 93 or the ring frame 938 having different diameters can be switched.
When the conveyance pad 4 of embodiment 2 shown in fig. 3 is connected to the conveyance mechanism 1, adjustment for displacing the suction pads 25 from the uneven portions 933 of the ring frame 93 shown in fig. 1 can be performed substantially in the same manner as in the conveyance pad 2 of embodiment 1. That is, the operator fixes the positions of the two Y-axis rails 49 of the transport pad 4 shown in fig. 3 on the X-axis rail 41 so as to be able to suck and hold the ring frame 93. In this fixing of the Y-axis rail 49, the operator lifts up the stopper 494, and the urging force of the coil spring 492 to be expanded and restored is accumulated between the stopper 494 and the upper surface of the grip portion 490, and the fixing of the Y-axis rail 49 to the X-axis rail 41 by the stopper 494 is released, so that the Y-axis rail 49 can move on the X-axis rail 41. Then, the Y-axis rail 49 moves to a predetermined position for holding the 12-inch ring frame 93, and the stopper 494 returns toward the X-axis rail 41, thereby fixing the Y-axis rail 49 to the predetermined position of the X-axis rail 41. Further, by adjusting the Y-axis direction position of the suction pad 25 in the same manner as the conveyance pad 2 of embodiment 1, even when the suction pad 25 is at the position to suck the ring frame 93, the suction pad 25 can be moved in the X-axis direction and the Y-axis direction, positioned at an arbitrary position avoiding the uneven portion 933, and the ring frame 93 can be appropriately sucked and held by the conveyance pad 4 without vacuum leakage.
When the conveyance pad 5 of embodiment 3 shown in fig. 4 is connected to the conveyance mechanism 1, adjustment for displacing the suction pads 25 from the uneven portions 933 of the ring frame 93 shown in fig. 1 can be performed substantially in the same manner as in the conveyance pad 2 of embodiment 1. That is, the operator fixes the positions of the two Y-axis rails 59 of the transport pad 5 shown in fig. 4 on the X-axis rail 51 so as to be able to suck and hold the ring frame 93. In the fixing of the Y-axis rail 59, the worker holds the handle 594 and rotates the rotating member 595 in the direction of the arrow R2, whereby the magnet 593 is separated from the X-axis rail 51 and directed to the + Y direction side, and no magnetic force acts between the X-axis rail 51 made of a magnetic material and the magnet 593. As a result, the fixation of the Y-axis rail 59 to the X-axis rail 51 by the magnet 593 is released, and the Y-axis rail 59 can move on the X-axis rail 51. After the Y-axis rail 59 is moved to a predetermined position for holding the 12-inch ring frame 93 on the X-axis rail 51, the operator rotates the rotating member 595 in the direction of the arrow R1 using the handle 594, thereby causing the magnet 593 to face the X-axis rail 51 again and applying a magnetic force to fix the Y-axis rail 59 to the X-axis rail 51. Further, by adjusting the Y-axis direction position of the suction pad 25 in the same manner as the conveyance pad 5 of embodiment 1, even when the suction pad 25 is at the position to suck the ring frame 93, the suction pad 25 can be moved in the X-axis direction and the Y-axis direction, positioned at an arbitrary position avoiding the uneven portion 933, and the ring frame 93 can be appropriately sucked and held by the conveyance pad 5 without vacuum leakage.
The conveying pad of the present invention is not limited to the above-described embodiments 1 to 3, and the configurations of the conveying mechanism 1 and the configurations of the tool set 9 shown in the drawings are not limited to the illustrated examples, and may be appropriately modified within a range in which the effects of the present invention can be exhibited.
Claims (4)
1. A transfer pad connected to a transfer mechanism and capable of transferring a workpiece group, which is obtained by bonding a wafer to a tape bonded so as to seal an opening of an annular frame having an inner diameter larger than a diameter of the wafer, to a chuck table by sucking and holding four positions on an upper surface of the annular frame by a suction pad,
the carrying pad has:
an X-axis rail extending in an X-axis direction of a horizontal plane;
two Y-axis rails extending in a Y-axis direction perpendicular to the X-axis direction on a horizontal plane, the two Y-axis rails being disposed on the X-axis rail so as to be movable in the X-axis direction; and
the suction cups are respectively arranged on the Y-axis rails in a manner of being capable of moving in the Y-axis direction,
the Y-axis rail can be fixed to the X-axis rail at an arbitrary position in the X-axis direction,
the suction cup can be fixed to the Y-axis rail at an arbitrary position in the Y-axis direction.
2. The carrying pad according to claim 1,
the X-axis rail has:
a groove extending in the X-axis direction;
a nut that can be fixed at an arbitrary position in the groove; and
a recess formed in the nut,
the Y-axis rail has:
a holding part which holds the X-axis rail and can move in the X-axis direction; and
and a plunger which is disposed inside the holding portion facing the nut and is fitted into the recess of the nut.
3. The carrying pad according to claim 1,
the Y-axis rail has:
a holding unit that holds the X-axis rail and is movable in an X-axis direction; and
and a biasing portion disposed at the holding portion and configured to bias the X-axis rail to be held.
4. The carrying pad according to claim 1,
the X-axis rail has a magnetic body extending in an X-axis direction,
the Y-axis rail has:
a holding part which holds the X-axis rail and can move in the X-axis direction; and
and a magnet disposed on the grip portion and magnetically attracted to the magnetic body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020134550A JP2022030478A (en) | 2020-08-07 | 2020-08-07 | Carrier pad |
| JP2020-134550 | 2020-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114068383A true CN114068383A (en) | 2022-02-18 |
Family
ID=80233421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110868526.1A Pending CN114068383A (en) | 2020-08-07 | 2021-07-30 | Carrying pad |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2022030478A (en) |
| KR (1) | KR20220018913A (en) |
| CN (1) | CN114068383A (en) |
| TW (1) | TW202207349A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240015831A (en) | 2022-07-28 | 2024-02-06 | 주식회사 오피리아 | Heated vibration ultrasonic humidifier |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3424052B2 (en) | 1994-08-30 | 2003-07-07 | 株式会社ディスコ | Table mechanism of dicing machine |
| JP4323129B2 (en) | 2002-02-15 | 2009-09-02 | 株式会社ディスコ | Plate-like material transport mechanism |
| JP2015233065A (en) | 2014-06-09 | 2015-12-24 | 株式会社ディスコ | Transport device |
-
2020
- 2020-08-07 JP JP2020134550A patent/JP2022030478A/en active Pending
-
2021
- 2021-07-21 KR KR1020210095898A patent/KR20220018913A/en active Search and Examination
- 2021-07-22 TW TW110126976A patent/TW202207349A/en unknown
- 2021-07-30 CN CN202110868526.1A patent/CN114068383A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220018913A (en) | 2022-02-15 |
| TW202207349A (en) | 2022-02-16 |
| JP2022030478A (en) | 2022-02-18 |
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