TWI689027B - Carrying pallets of processed objects - Google Patents

Carrying pallets of processed objects Download PDF

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Publication number
TWI689027B
TWI689027B TW105107363A TW105107363A TWI689027B TW I689027 B TWI689027 B TW I689027B TW 105107363 A TW105107363 A TW 105107363A TW 105107363 A TW105107363 A TW 105107363A TW I689027 B TWI689027 B TW I689027B
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Taiwan
Prior art keywords
workpiece
cassette
chuck table
body frame
outer peripheral
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TW105107363A
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Chinese (zh)
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TW201705339A (en
Inventor
田中英明
井上克己
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日商迪思科股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
    • B65D1/34—Trays or like shallow containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0235—Containers
    • B65G2201/0258—Trays, totes or bins

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Dicing (AREA)

Abstract

提供一種可刪減被加工物之加工成本的被加 工物之搬運托盤。 Provide an added cost-reducing processing cost Handling pallets for works.

搬運托盤(5)係具備有形成為與習知之 環狀框架為大致相同的外形的本體框架部(5a)，在本體框架部(5a)設有開口部(5b)。開口部(5b)係具備有：支持被加工物的下面側的外周區域的外周支持部(5d)、及規制被加工物對面方向移動的移動規制部(5e)。藉此，若不需要將被加工物進行全切時，不使用黏著帶而僅將被加工物載置在搬運托盤(5)的開口部(5b)即可固定。 The transport tray (5) is equipped with The ring frame is a body frame portion (5a) having substantially the same outer shape, and an opening portion (5b) is provided in the body frame portion (5a). The opening (5b) includes an outer peripheral support portion (5d) that supports the outer peripheral region on the lower surface side of the workpiece, and a movement regulation portion (5e) that regulates the movement of the workpiece in the opposite direction. Thereby, if it is not necessary to cut the workpiece completely, it is possible to fix the workpiece only by placing it on the opening (5b) of the transport tray (5) without using an adhesive tape.

Description

被加工物之搬運托盤 Carrying pallets of processed objects

本發明係關於被加工物之搬運托盤。 The present invention relates to a conveying pallet of a workpiece.

在將半導體晶圓等板狀被加工物切割成各個元件晶片、或形成分割用溝槽時，係使用利用切削刀的切削裝置、或藉由雷射進行加工的雷射加工裝置。在該等裝置中，係使用在環狀框架的開口部透過黏著帶(dicing tape)支持有被加工物的框架單元，而容易搬運被加工物(專利文獻1)。 When cutting a plate-shaped workpiece such as a semiconductor wafer into individual element wafers or forming a groove for division, a cutting device using a cutting blade or a laser processing device processed by laser is used. In these devices, a frame unit that supports a workpiece through an opening of a ring-shaped frame through an adhesive tape (dicing tape) makes it easy to transport the workpiece (Patent Document 1).

[先前技術文獻] [Prior Technical Literature] [專利文獻] [Patent Literature]

[專利文獻1]日本特開2002-110777號公報 [Patent Document 1] Japanese Unexamined Patent Publication No. 2002-110777

但是，由於黏著帶為消耗品，若被加工物的 加工結束，每次均要被重貼，因此有加工成本增加的課題。 However, since the adhesive tape is a consumable, if the At the end of the processing, it has to be reposted every time, so there is a problem of increased processing costs.

因此，本發明係鑑於上述情形而完成者，目的在提供可刪減被加工物之加工成本的被加工物之搬運托盤。 Therefore, the present invention has been completed in view of the above circumstances, and an object of the present invention is to provide a conveying tray for processed objects that can reduce the processing cost of the processed objects.

為解決上述課題，以達成目的，本發明之被加工物之搬運托盤係使用在以具備有：具備保持被加工物的保持面的吸盤台、及將被保持在該吸盤台的被加工物進行加工的加工手段的加工裝置，將板狀的被加工物搬出入至該吸盤台之時的搬運托盤，其特徵為：具備有：環狀的本體框架部，其係具備有比該板狀的被加工物的外形為更大的內周；外周支持部，其係由該本體框架部的內周朝向中心突出，且支持被加工物的下面側的外周區域；及移動規制部，其係被形成在該本體框架部與該外周支持部的交界，規制所載置的被加工物朝面方向移動。 In order to solve the above-mentioned problems and achieve the objective, the conveyance tray of the processed object of the present invention is used to include a chuck table provided with a holding surface for holding the processed object, and the processed object to be held on the chuck table The processing device of the processing means for processing, a transport tray when carrying out a plate-shaped object to and from the chuck table, is characterized by comprising: a ring-shaped body frame portion which is provided with a plate-shaped object The outer shape of the workpiece is a larger inner periphery; the outer peripheral support portion, which protrudes from the inner periphery of the body frame portion toward the center, and supports the outer peripheral area on the lower side of the processed object; and the movement regulation portion, which is A boundary formed between the main body frame portion and the outer peripheral support portion regulates movement of the mounted object in the face direction.

此外，在上述被加工物之搬運托盤中，較佳為該加工裝置係具備有：匣盒載置區域，其係載置收容複數在環狀框架的開口透過黏著帶支持有被加工物的框架單元的匣盒；及搬運手段，其係在被載置於該匣盒載置區域的該匣盒與該吸盤台之間支持該環狀框架而搬運該框架單元，該本體框架部係形成為與該環狀框架為相同外徑，可收容在該匣盒。 In addition, in the above-mentioned to-be-processed pallet, it is preferable that the processing apparatus includes: a cassette placement area which mounts and accommodates a plurality of frames that support the to-be-processed objects through an adhesive tape at an opening of the ring-shaped frame A cassette of the unit; and a conveying means, which supports the ring frame and transports the frame unit between the cassette placed in the cassette mounting area and the chuck table, and the body frame portion is formed as It has the same outer diameter as the ring frame and can be housed in the box.

本發明之被加工物之搬運托盤係具備有：支持被加工物的下面側的外周區域的外周支持部、及規制被加工物對面方向移動的移動規制部，藉此，不使用黏著帶即可將被加工物固定在搬運托盤，因此可大幅刪減加工成本。 The conveyance pallet of the processed object of the present invention includes an outer peripheral support portion that supports the outer peripheral area of the lower surface of the processed object, and a movement regulation portion that regulates the movement of the processed object in the opposite direction, thereby eliminating the need to use an adhesive tape The workpiece is fixed on the transport tray, so the processing cost can be greatly reduced.

1:加工裝置 1: processing device

2:裝置本體 2: Device body

3:第1門型框架 3: The first door frame

4:第2門型框架 4: 2nd door frame

5、6:搬運托盤 5, 6: Carrying pallets

5a、6a:本體框架部 5a, 6a: Body frame

5b、6b:開口部 5b, 6b: opening

5c、6c:開口上部 5c, 6c: upper part of the opening

5d、6d:外周支持部 5d, 6d: peripheral support

5e、6e:移動規制部 5e, 6e: Mobile Regulation Department

5f、6f:支持面 5f, 6f: support surface

10A:吸盤台 10A: suction cup table

10B:凸狀的吸盤台 10B: convex sucker table

11a、11b:保持面 11a, 11b: keep the surface

12:夾具部 12: Fixture Department

20:加工手段 20: Processing means

21:切削刀 21: Cutter

22:心軸 22: mandrel

23:外殼 23: Shell

30:加工進給手段 30: Processing and feeding means

40:切入進給手段 40: Cutting feed method

50:第1搬運手段 50: The first means of transportation

51:夾持部 51: clamping part

52:吸附部 52: Adsorption section

52a:吸附墊 52a: Adsorption pad

60:第2搬運手段 60: Second transportation means

61:吸附部 61: Adsorption section

70:軌條 70: rail

80:洗淨手段 80: cleaning method

81:旋轉台 81: Rotating table

90:匣盒機構 90: cassette mechanism

91:匣盒 91: Cartridge

91a:開口部 91a: opening

91b:收容棚架 91b: containment scaffold

91c:支持板 91c: Support board

92:匣盒載置手段 92: Box mounting method

92a:匣盒載置區域 92a: Cartridge mounting area

F:環狀框架 F: ring frame

H1:長度 H1: Length

T:黏著帶 T: Adhesive tape

W(W1、W2):被加工物 W(W1, W2): object to be processed

W1c:被加工物W1的側面 W1c: Side of the workpiece W1

U:被加工物保持單元 U: Workpiece holding unit

U1A、U1B:搬運托盤單元 U1A, U1B: Carrying pallet unit

U2:框架單元 U2: Frame unit

圖1係顯示實施形態1之加工裝置的構成例的斜視圖。 Fig. 1 is a perspective view showing a configuration example of a processing apparatus according to the first embodiment.

圖2係顯示實施形態1之匣盒的構成例的正面圖。 Fig. 2 is a front view showing a configuration example of the cassette in the first embodiment.

圖3係顯示實施形態1之被加工物的構成例的斜視圖。 Fig. 3 is a perspective view showing a configuration example of a workpiece to be processed in the first embodiment.

圖4係顯示實施形態1之搬運托盤的構成例的斜視圖。 FIG. 4 is a perspective view showing an example of the configuration of the transport tray in the first embodiment.

圖5係顯示在實施形態1之搬運托盤載置被加工物的載置例的斜視圖。 FIG. 5 is a perspective view showing an example of placing a workpiece on a transfer tray according to the first embodiment.

圖6係顯示在實施形態1之搬運托盤載置被加工物的載置例的P-P箭號的剖面圖。 6 is a cross-sectional view of a P-P arrow showing an example of placing a workpiece on a transfer tray according to the first embodiment.

圖7係顯示在實施形態1之吸盤台搬入載置有被加工物的搬運托盤的搬入例的剖面圖。 7 is a cross-sectional view showing an example of carrying in a conveying tray on which workpieces are placed on the chuck table of the first embodiment.

圖8係顯示將被保持在實施形態1之吸盤台的被加工 物進行加工的加工例的剖面圖。 Fig. 8 shows the processing to be held on the chuck table of the first embodiment A cross-sectional view of a processing example in which an object is processed.

圖9係顯示在實施形態2之搬運托盤載置被加工物的載置例的剖面圖。 FIG. 9 is a cross-sectional view showing an example of placing a workpiece on the transfer tray according to the second embodiment.

圖10係顯示在實施形態2之吸盤台搬入載置有加工物的搬運托盤的搬入例的剖面圖。 10 is a cross-sectional view showing an example of carrying in a carrying tray on which a processed object is placed on a chuck table of the second embodiment.

圖11係顯示將被保持在實施形態2之吸盤台的被加工物進行加工的加工例的剖面圖。 11 is a cross-sectional view showing a processing example of processing a workpiece held on the chuck table of the second embodiment.

一邊參照圖示，一邊詳加說明用以實施本發明的形態(實施形態)。並非為藉由以下實施形態所記載之內容，來限定本發明者。此外，在以下記載的構成要素中係包含該領域熟習該項技術者可輕易想定者、實質上為相同者。此外，以下記載的構成係可適當組合。此外，可在不脫離本發明之要旨的範圍內，進行構成的各種省略、置換或變更。 The embodiment (embodiment) for implementing the present invention will be described in detail while referring to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include those that can be easily imagined by those skilled in the art and are substantially the same. In addition, the configuration systems described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[實施形態1] [Embodiment 1]

說明實施形態1之加工裝置及被加工物之搬運托盤的構成例。圖1係顯示實施形態1之加工裝置的構成例的斜視圖。圖2係顯示實施形態1之匣盒的構成例的正面圖。圖3係顯示實施形態1之被加工物的構成例的斜視圖。圖4係顯示實施形態1之搬運托盤的構成例的斜視圖。圖5係顯示在實施形態1之搬運托盤載置被加工物的載置例的 斜視圖。圖6係顯示在實施形態1之搬運托盤載置被加工物的載置例的P-P箭號的剖面圖。 A configuration example of the processing apparatus and the conveyance tray of the workpiece in the first embodiment will be described. Fig. 1 is a perspective view showing a configuration example of a processing apparatus according to the first embodiment. Fig. 2 is a front view showing a configuration example of the cassette in the first embodiment. Fig. 3 is a perspective view showing a configuration example of a workpiece to be processed in the first embodiment. FIG. 4 is a perspective view showing an example of the configuration of the transport tray in the first embodiment. FIG. 5 is a diagram showing an example of placing a workpiece on a transport pallet according to Embodiment 1. Oblique view. 6 is a cross-sectional view of a P-P arrow showing an example of placing a workpiece on a transfer tray according to the first embodiment.

加工裝置1係將被加工物W進行加工者。加工裝置1係如圖1所示，具備有：吸盤台10A、加工手段20、加工進給手段30、切入進給手段40、第1搬運手段50、第2搬運手段60、暫時放置用的軌條70、洗淨手段80、匣盒機構90、未圖示之割出進給手段、及未圖示之控制手段。 The processing device 1 is a person who processes a workpiece W. As shown in FIG. 1, the processing device 1 includes: a chuck table 10A, processing means 20, processing feed means 30, plunge feed means 40, first conveyance means 50, second conveyance means 60, and rails for temporary placement Bar 70, cleaning means 80, cassette mechanism 90, cutting-out feed means (not shown), and control means (not shown).

吸盤台10A係可以X軸方向移動地被配設在裝置本體2的上面。吸盤台10A係形成為圓板狀，具備有：保持面11a、及夾具部12。吸盤台10A係藉由未圖示之旋轉手段，以與保持面11a的中心呈正交的旋轉軸予以旋轉。保持面11a係吸盤台10A的鉛直方向的上端面，相對水平面形成為平坦。保持面11a係以例如多孔陶瓷等所構成，藉由未圖示之真空吸引源的負壓，吸引保持被加工物保持單元U(例如搬運托盤單元U1A或框架單元U2)的被加工物W。夾具部12係夾持被加工物保持單元U者，由上下夾著被加工物保持單元U的外周緣來進行保持。 The chuck table 10A is arranged on the upper surface of the device body 2 so as to be movable in the X-axis direction. The chuck table 10A is formed in a disk shape, and includes a holding surface 11 a and a jig portion 12. The chuck table 10A is rotated by a rotation axis that is orthogonal to the center of the holding surface 11a by a rotation means not shown. The holding surface 11a is a vertically upper end surface of the chuck table 10A, and is formed flat with respect to the horizontal plane. The holding surface 11a is made of, for example, porous ceramics and the like, and sucks and holds the workpiece W of the workpiece holding unit U (for example, the transport tray unit U1A or the frame unit U2) by the negative pressure of a vacuum suction source (not shown). The jig portion 12 clamps the workpiece holding unit U, and holds it by sandwiching the outer periphery of the workpiece holding unit U up and down.

加工手段20係將被保持在吸盤台10A的被加工物W進行加工者。加工手段20係透過割出進給手段及切入進給手段40而被配設在第1門型框架3。在此，第1門型框架3係以Y軸方向跨越吸盤台10A的X軸方向中的移動路徑的方式被立設在裝置本體2。加工手段20係 具備有：將被加工物W進行切削的切削刀21；可安裝卸下地裝設切削刀21的心軸22；及可繞Y軸方向的旋轉軸旋轉自如地支持心軸22的外殼23。 The processing means 20 is a person who processes the workpiece W held on the chuck table 10A. The processing means 20 is arranged on the first portal frame 3 through the cutting-out feeding means and the cutting-in feeding means 40. Here, the first door frame 3 is erected on the device body 2 so as to cross the movement path in the X-axis direction of the chuck table 10A in the Y-axis direction. Processing means 20 series A cutting blade 21 for cutting the workpiece W; a mandrel 22 for detachably mounting the cutting blade 21; and a housing 23 for rotatably supporting the mandrel 22 about a rotation axis in the Y-axis direction.

加工進給手段30係使吸盤台10A及加工手段20以X軸方向作相對移動者。例如，加工進給手段30係具有以X軸方向延伸存在之未圖示之滾珠螺桿或脈衝馬達等驅動源，使支持吸盤台10A之未圖示之X軸移動基台以X軸方向移動。 The processing feed means 30 is a relative movement of the chuck table 10A and the processing means 20 in the X-axis direction. For example, the processing feed means 30 has a drive source such as a ball screw or a pulse motor (not shown) extending in the X-axis direction, and moves an unillustrated X-axis moving base supporting the chuck table 10A in the X-axis direction.

割出進給手段係使吸盤台10A及加工手段20以Y軸方向作相對移動者。例如，割出進給手段係具有以Y軸方向延伸存在之未圖示之滾珠螺桿或脈衝馬達等驅動源，使支持切入進給手段40之未圖示之Y軸移動基台以Y軸方向移動。 The cutting-out feed means is a relative movement of the chuck table 10A and the processing means 20 in the Y-axis direction. For example, the cut-out feed means has a drive source such as a ball screw or a pulse motor that extends in the Y-axis direction, and the Y-axis moving base that supports the cut-in feed means 40 in the Y-axis direction mobile.

切入進給手段40係以與吸盤台10A的保持面11a呈大致正交的Z軸方向，使加工手段20移動者。例如，切入進給手段40係具有以Z軸方向延伸存在之未圖示之滾珠螺桿或脈衝馬達等驅動源，使支持加工手段20之未圖示之Z軸移動構件以Z軸方向移動。 The cut-in feed means 40 moves the processing means 20 in the Z-axis direction substantially orthogonal to the holding surface 11a of the chuck table 10A. For example, the cut-in feed means 40 has a drive source such as a ball screw or a pulse motor (not shown) extending in the Z-axis direction, and moves a not-shown Z-axis moving member supporting the processing means 20 in the Z-axis direction.

第1搬運手段50係可以Y、Z軸方向移動地被配設在第2門型框架4，藉由未圖示之致動器予以驅動。在此，第2門型框架4係與第1門型框架3同樣地，以Y軸方向跨越吸盤台10A的移動路徑的方式被立設在裝置本體2。第1搬運手段50係具備有：夾持部51、及吸附部52。第1搬運手段50係藉由夾持部51由匣盒機 構90夾持固定有加工前的被加工物W的被加工物保持單元U而取出，且將被加工物保持單元U暫時放置在一對暫時放置用的軌條70。此外，第1搬運手段50係藉由吸附部52吸附保持被暫時放置在軌條70的被加工物保持單元U而搬運至吸盤台10A。此外，第1搬運手段50係吸附保持固定有洗淨後的被加工物W的被加工物保持單元U而暫時放置在軌條70。 The first conveyance means 50 is arranged on the second door frame 4 so as to be movable in the Y and Z axis directions, and is driven by an actuator (not shown). Here, the second portal frame 4 is erected on the apparatus body 2 so as to cross the movement path of the chuck table 10A in the Y-axis direction, similar to the first portal frame 3. The first conveyance means 50 includes a holding portion 51 and a suction portion 52. The first conveying means 50 is controlled by the cassette machine through the holding portion 51 The mechanism 90 sandwiches and removes the workpiece holding unit U to which the workpiece W before processing is fixed, and temporarily places the workpiece holding unit U on a pair of rails 70 for temporary placement. In addition, the first conveying means 50 sucks and holds the workpiece holding unit U temporarily placed on the rail 70 by the suction portion 52 and conveys it to the chuck table 10A. In addition, the first conveyance means 50 sucks and holds the workpiece holding unit U to which the washed workpiece W is fixed, and temporarily places it on the rail 70.

第2搬運手段60係可以X、Y、Z軸方向移動地被配設在第2門型框架4，藉由未圖示之致動器予以驅動。第2搬運手段60係具備有：吸附部61，將固定有被保持在吸盤台10A的加工後的被加工物W的被加工物保持單元U暫時放置在軌條70。此外，第2搬運手段60係藉由吸附部61吸附保持被暫時放置在軌條70的加工後的被加工物保持單元U而搬運至洗淨手段80。 The second conveyance means 60 is arranged in the second door frame 4 so as to be movable in the X, Y, and Z axis directions, and is driven by an actuator (not shown). The second conveyance means 60 is provided with a suction part 61 that temporarily places the workpiece holding unit U on which the processed workpiece W held on the chuck table 10A is fixed on the rail 70. In addition, the second conveyance means 60 is conveyed to the cleaning means 80 by the adsorption section 61 adsorbing and holding the processed object holding unit U temporarily placed on the rail 70.

洗淨手段80係將被加工物保持單元U的被加工物W洗淨而使其乾燥者。洗淨手段80係具備有：保持被加工物保持單元U的旋轉台81。洗淨手段80係藉由旋轉台81吸引保持被加工物保持單元U，一邊以高速使其旋轉，一邊朝向被加工物W噴射純水等洗淨液來進行洗淨，朝向被加工物W噴射清淨的空氣(壓縮空氣)等而使其乾燥。 The washing means 80 is a person who washes and dries the workpiece W of the workpiece holding unit U. The cleaning means 80 includes a turntable 81 that holds the workpiece holding unit U. The cleaning means 80 sucks and holds the workpiece holding unit U by the rotary table 81, and while rotating at a high speed, sprays a cleaning liquid such as pure water toward the workpiece W to perform cleaning, and sprays toward the workpiece W Dry it with clean air (compressed air), etc.

匣盒機構90係收容被加工物保持單元U者，具備有：匣盒91、及匣盒載置手段92。例如，匣盒91係收容複數被加工物保持單元U者。匣盒91係如圖2所 示，具備有：搬出入用的開口部91a、及收容棚架91b。匣盒91的開口部91a係以與第1搬運手段50相對向的方式作配設，藉由第1搬運手段50搬出入被加工物保持單元U。收容棚架91b係由相對向的側壁以匣盒91的寬幅方向(X軸方向)突出而形成有複數支持被加工物保持單元U的支持板91c。支持板91c係以高度方向(Z軸方向)以等間隔作配設。高度方向中的支持板91c的間隔係設定為大於被加工物保持單元U的厚度。在匣盒91的寬幅方向中相對向的一對支持板91c係水平支持被加工物保持單元U。在本實施形態1中，在匣盒91係藉由本發明之搬運托盤5，收容3枚支持有被加工物W1的搬運托盤單元U1A，且收容5枚在習知之環狀框架F的開口透過黏著帶T支持有被加工物W2的框架單元U2。 The cassette mechanism 90 accommodates the workpiece holding unit U, and includes a cassette 91 and cassette mounting means 92. For example, the cassette 91 accommodates a plurality of workpiece holding units U. Box 91 is shown in Figure 2 As shown, it is provided with an opening 91a for carrying in and out, and a storage shelf 91b. The opening 91a of the cassette 91 is arranged so as to face the first conveyance means 50, and the first conveyance means 50 carries out the workpiece holding unit U. The storage shelf 91b protrudes from the opposing side wall in the width direction (X-axis direction) of the cassette 91 to form a plurality of support plates 91c that support the workpiece holding unit U. The support plates 91c are arranged at equal intervals in the height direction (Z-axis direction). The interval of the support plate 91c in the height direction is set to be greater than the thickness of the workpiece holding unit U. A pair of support plates 91c facing each other in the width direction of the cassette 91 horizontally support the workpiece holding unit U. In the first embodiment, the cassette 91 accommodates three conveying tray units U1A supporting the workpiece W1 by the conveying tray 5 of the present invention, and accommodates five through the opening of the conventional ring frame F through adhesion The belt T supports a frame unit U2 of the workpiece W2.

匣盒載置手段92係以Z軸方向上下移動自如地載置匣盒91者。匣盒載置手段92係具備有：匣盒載置區域92a、及使匣盒載置區域92a以Z軸方向作升降之未圖示之升降手段。在匣盒載置區域92a係以匣盒91的開口部91a與第1搬運手段50相對向的方式載置有匣盒91。匣盒載置手段92係使被載置於匣盒載置區域92a的匣盒91藉由升降手段作升降，藉此將匣盒91定位在藉由第1搬運手段50搬出入被加工物保持單元U的位置。 The cassette placing means 92 is a case where the cassette 91 is movably mounted up and down in the Z-axis direction. The cassette mounting means 92 is provided with a cassette mounting area 92a, and an unillustrated lifting means for raising and lowering the cassette mounting area 92a in the Z-axis direction. In the cassette mounting area 92a, the cassette 91 is placed such that the opening 91a of the cassette 91 faces the first conveyance means 50. The cassette placing means 92 lifts and lowers the cassette 91 placed in the cassette placing area 92a by the lifting means, thereby positioning the cassette 91 to be carried in and out of the workpiece by the first conveying means 50 Location of unit U.

搬運托盤單元U1A係由被加工物W1、及搬運托盤5所構成。被加工物W1係在矽或砷化鎵等基板形成有半導體元件、或在藍寶石或SiC等基板形成有光元件 者，半導體晶圓或光元件晶圓、無機材料基板、延展性樹脂材料基板、陶瓷基板或玻璃板等各種加工材料。被加工物W1係如圖3所示，形成為矩形板狀。 The conveyance tray unit U1A is composed of the workpiece W1 and the conveyance tray 5. The workpiece W1 is a semiconductor element formed on a substrate such as silicon or gallium arsenide, or an optical element formed on a substrate such as sapphire or SiC In addition, various processing materials such as semiconductor wafers, optical element wafers, inorganic material substrates, malleable resin material substrates, ceramic substrates, or glass plates. The workpiece W1 is formed in a rectangular plate shape as shown in FIG. 3.

搬運托盤5係使用在將被加工物W1搬出入至吸盤台10A或洗淨手段80之時者。搬運托盤5係如圖4所示，具備有：形成為與環狀框架F為相同外形的本體框架部5a。其中，本體框架部5a的外徑係可以第1及第2搬運手段50、60與環狀框架F相同的方式進行搬運，若可藉由吸盤台10A進行保持，並非限定為與環狀框架F為完全相同的外徑。本體框架部5a係具備有開口部5b，其具有大於被加工物W1的外形的內周。開口部5b係具有固定被加工物W1的功能，具備有：比被加工物W1的外形稍微大地形成開口的開口上部5c；形成在開口部5b的下方，支持被加工物W1的外周部的外周支持部5d；及規制被加工物W1朝面方向移動的移動規制部5e。 The conveyance tray 5 is used when the workpiece W1 is carried in and out to the chuck table 10A or the washing means 80. As shown in FIG. 4, the transport tray 5 includes a body frame portion 5 a formed to have the same outer shape as the ring frame F. However, the outer diameter of the body frame portion 5a can be transported in the same manner as the ring frame F by the first and second transport means 50, 60, and if it can be held by the chuck table 10A, it is not limited to the ring frame F It is the same outer diameter. The main body frame portion 5a is provided with an opening 5b having an inner periphery larger than the outer shape of the workpiece W1. The opening 5b has a function of fixing the workpiece W1, and includes: an opening upper portion 5c that forms an opening slightly larger than the outer shape of the workpiece W1; and is formed below the opening 5b and supports the outer periphery of the outer periphery of the workpiece W1 The support part 5d; and the movement regulation part 5e which regulates the movement of the to-be-processed object W1 to the surface direction.

外周支持部5d係由開口部5b的下部的內周朝向中心突出預定長度而形成。例如，外周支持部5d係在本體框架部5被形成有開口的開口孔的下部的內周壁面，藉由熔接或接著劑等，固定有沿著內周壁面的周方向為一定寬幅的板狀構件。外周支持部5d係形成有比被加工物W1的外形稍微小的開口。在外周支持部5d的支持面5f係遍及全域形成有矽酮等合成樹脂。外周支持部5d係如圖6所示，支持被載置在開口部5b的被加工物W1的下面側的外周區域。 The outer peripheral support portion 5d is formed by the inner periphery of the lower portion of the opening 5b projecting toward the center by a predetermined length. For example, the outer peripheral support portion 5d is an inner peripheral wall surface of the lower portion of the body frame portion 5 where the opening hole is formed, and a plate with a certain width along the circumferential direction of the inner peripheral wall surface is fixed by welding or adhesive, etc. Shaped member. The outer peripheral support portion 5d is formed with an opening slightly smaller than the outer shape of the workpiece W1. On the support surface 5f of the outer peripheral support portion 5d, synthetic resin such as silicone is formed over the entire area. As shown in FIG. 6, the outer peripheral support portion 5d supports the outer peripheral area on the lower surface side of the workpiece W1 placed in the opening 5b.

移動規制部5e係形成在外周支持部5d與本體框架部5a的交界，亦即開口部5b的內周壁面。移動規制部5e係形成為相對本體框架部5a的面方向為大致垂直。移動規制部5e係抵接於被載置於開口部5b的被加工物W1的側面W1c，規制被加工物W1朝面方向移動。其中，在移動規制部5e與被加工物W1的側面W1c之間具有間隙，但是由於在將被加工物W1進行加工時實施對準，因此即使在被加工物W1與被加工物W1的側面W1c之間具有間隙，在加工時亦不會有問題。 The movement regulation portion 5e is formed at the boundary between the outer peripheral support portion 5d and the main body frame portion 5a, that is, the inner peripheral wall surface of the opening 5b. The movement regulation portion 5e is formed to be substantially perpendicular to the plane direction of the body frame portion 5a. The movement regulation portion 5e abuts on the side surface W1c of the workpiece W1 placed on the opening 5b, and regulates the movement of the workpiece W1 in the face direction. Among them, there is a gap between the movement regulation portion 5e and the side surface W1c of the workpiece W1, but since the alignment is performed when the workpiece W1 is processed, even on the side surface W1c of the workpiece W1 and the workpiece W1 There is a gap between them, and there will be no problem during processing.

控制手段係控制加工裝置1的各構成要素者。例如，控制手段係與驅動加工進給手段30、割出進給手段、切入進給手段40的脈衝馬達的未圖示之驅動電路相連接，控制驅動電路，來決定吸盤台10A的X軸方向的位置、或加工手段20的Y軸方向及Z軸方向的位置。 The control means controls each constituent element of the processing device 1. For example, the control means is connected to a drive circuit (not shown) that drives a pulse motor of the machining feed means 30, the cut-out feed means, and the cut-in feed means 40, and controls the drive circuit to determine the X-axis direction of the chuck table 10A Or the position of the processing means 20 in the Y-axis direction and the Z-axis direction.

接著，說明實施形態1之加工裝置的動作例。若將被加工物W進行加工時，首先，加工裝置1的控制手段係控制匣盒載置手段92，且使匣盒91以Z軸方向作升降而定位在預定位置。接著，控制手段係控制第1搬運手段50，取出被收容在匣盒91的加工對象的被加工物保持單元U，例如搬運托盤單元U1A而暫時放置在軌條70。例如，第1搬運手段50係藉由夾持部51夾持搬運托盤單元U1A的本體框架部5a而由匣盒91取出搬運托盤單元U1A。 Next, an operation example of the processing device of the first embodiment will be described. When processing the workpiece W, first, the control means of the processing apparatus 1 controls the cassette placing means 92, and moves the cassette 91 up and down in the Z-axis direction to position it at a predetermined position. Next, the control means controls the first conveyance means 50 to take out the workpiece holding unit U of the processing object accommodated in the cassette 91, for example, conveys the tray unit U1A and temporarily places it on the rail 70. For example, the first transport means 50 grips the main body frame portion 5a of the transport tray unit U1A by the gripping portion 51, and takes out the transport tray unit U1A from the cassette 91.

接著，控制手段係控制第1搬運手段50，藉由吸附部52吸附保持被暫時放置在軌條70的搬運托盤單元U1A而搬運至吸盤台10A。例如，第1搬運手段50係如圖7所示，藉由吸附部52的吸附墊52a，吸附保持本體框架部5a的外周部而將搬運托盤單元U1A搬運至吸盤台10A。此時，搬運托盤單元U1A的被加工物W1係藉由移動規制部5e規制面方向的移動，且被固定在開口部5b。吸盤台10A係藉由保持面11a吸引保持搬運托盤單元U1A。接著，吸盤台10A係如圖8所示，在吸附部52的吸附墊52a由本體框架部5a的外周部被解放之後，藉由夾具部12夾持本體框架部5a的外周緣。在外周支持部5d的支持面5f係形成有合成樹脂，因此被支持面5f支持的被加工物W1係與吸盤台10A的保持面11a呈氣密狀態。藉此，被加工物W1係若在保持面11a作用負壓，透過外周支持部5d而被吸引保持在保持面11a。 Next, the control means controls the first conveyance means 50 to suck and hold the conveyance tray unit U1A temporarily placed on the rail 70 by the suction portion 52 and convey it to the chuck table 10A. For example, as shown in FIG. 7, the first conveyance means 50 sucks and holds the outer peripheral portion of the main body frame portion 5a by the suction pad 52a of the suction portion 52 to convey the conveyance tray unit U1A to the chuck table 10A. At this time, the workpiece W1 of the transport tray unit U1A regulates movement in the plane direction by the movement regulating portion 5e, and is fixed to the opening 5b. The chuck table 10A sucks and holds the transport tray unit U1A by the holding surface 11a. Next, as shown in FIG. 8, the chuck table 10A is such that after the suction pad 52a of the suction portion 52 is released from the outer peripheral portion of the main body frame portion 5a, the outer peripheral edge of the main body frame portion 5a is clamped by the clamp portion 12. Since the support surface 5f of the outer peripheral support portion 5d is formed of synthetic resin, the workpiece W1 supported by the support surface 5f is in an airtight state with the holding surface 11a of the chuck table 10A. Thereby, when a negative pressure acts on the holding surface 11a, the workpiece W1 is sucked and held on the holding surface 11a through the outer peripheral support portion 5d.

接著，控制手段係實施被保持在吸盤台10A的搬運托盤單元U1A的被加工物W1的對準。接著，控制手段係控制加工手段20，且將被加工物W1進行切削加工。例如，加工手段20係藉由切削刀21，將被加工物W1未進行全切地，切削至被加工物W1的途中。若被加工物W1的切削結束，控制手段係控制第2搬運手段60，將被保持在吸盤台10A的搬運托盤單元U1A暫時放置在軌條70。接著，控制手段係控制第2搬運手段60，且將被暫時放置在軌條70的搬運托盤單元U1A搬運至洗淨手 段80。接著，控制手段係控制洗淨手段80，將搬運托盤單元U1A的被加工物W1洗淨而使其乾燥。接著，控制手段係控制第1搬運手段50，將藉由洗淨手段80使被加工物W1被洗淨及乾燥後的搬運托盤單元U1A暫時放置在軌條70。接著，控制手段係控制第1搬運手段50及匣盒機構90，將被暫時放置在軌條70的搬運托盤單元U1A收容在匣盒91的預定的收容棚架91b。 Next, the control means performs the alignment of the workpiece W1 held by the transport tray unit U1A of the chuck table 10A. Next, the control means controls the processing means 20 and cuts the workpiece W1. For example, the processing means 20 uses the cutting blade 21 to cut the workpiece W1 halfway without cutting the workpiece W1. When the cutting of the workpiece W1 is completed, the control means controls the second conveyance means 60 to temporarily place the conveyance tray unit U1A held by the chuck table 10A on the rail 70. Next, the control means controls the second conveyance means 60, and conveys the conveyance tray unit U1A temporarily placed on the rail 70 to the washing hands Segment 80. Next, the control means controls the washing means 80 to wash and dry the workpiece W1 of the transport tray unit U1A. Next, the control means controls the first conveyance means 50 to temporarily place the conveyance tray unit U1A after the workpiece W1 is washed and dried by the cleaning means 80 on the rail 70. Next, the control means controls the first conveyance means 50 and the cassette mechanism 90, and accommodates the conveyance tray unit U1A temporarily placed on the rail 70 in a predetermined storage shelf 91b of the cassette 91.

如以上所示，藉由實施形態1之搬運托盤5，具備有：支持被加工物W1的下面側的外周區域的外周支持部5d；及規制被加工物W1朝面方向移動的移動規制部5e者。藉此，若不需要實施用以將被加工物W1完全分離的全切，僅將被加工物W1載置在搬運托盤5即可固定，因此不需要黏著帶T，可大幅刪減加工成本。此外，由於可省略如習知般，將黏著帶T黏貼在環狀框架F，將被加工物W2黏貼在被黏貼在環狀框架F的黏著帶T來進行固定的作業，因此可減低作業的勞力。此外，搬運托盤5係形成為與習知之環狀框架F為相同外徑，因此無須改造習知之搬運手段，即可搬運被加工物W1，因此達成不會耗費導入成本的效果。 As described above, the transport pallet 5 of the first embodiment includes: an outer peripheral support portion 5d that supports the outer peripheral area of the lower surface side of the workpiece W1; and a movement regulation portion 5e that regulates the movement of the workpiece W1 in the face direction By. Thereby, if it is not necessary to perform a full cut to completely separate the workpiece W1, the workpiece W1 can be fixed only by placing it on the transport tray 5, so that the adhesive tape T is not required, and the processing cost can be greatly reduced. In addition, since it is possible to omit the sticking tape T to the ring frame F and fix the work W2 to the sticking tape T to the ring frame F for fixing, as is conventional, the work can be reduced Labor. In addition, since the transport tray 5 is formed to have the same outer diameter as the conventional ring frame F, it is possible to transport the workpiece W1 without modifying the conventional transport means, thus achieving the effect of not consuming introduction cost.

[變形例] [Variation]

接著，說明實施形態1的變形例。以上說明將1個被加工物W1固定在搬運托盤5之例，惟亦可將複數個被加工物W1固定在搬運托盤5。此時，例如在搬運托盤5的 本體框架部5a設置複數個開口部5b，且在各自的開口部5b固定被加工物W1。 Next, a modification of the first embodiment will be described. As described above, the example in which one workpiece W1 is fixed to the transport pallet 5 is described. However, a plurality of workpieces W1 may be fixed to the transport pallet 5. At this time, for example The body frame portion 5a is provided with a plurality of openings 5b, and the workpiece W1 is fixed to the respective openings 5b.

此外，外周支持部5d係在本體框架部5被形成有開口的開口孔的下部的內周壁面，藉由熔接或接著劑等固定有沿著內周壁面的周方向為一定寬幅的板狀構件的別體成形之例，但是外周支持部5d亦可與本體框架部5一體成型。此外，若將外周支持部5d與本體框架部5形成為別體成形，由於將外周支持部5d強固地固定在本體框架部5，因此亦可在本體框架部5的開口孔的下部的內周壁面設置用以嵌合板狀構件的外周支持部5d的凹部，而在本體框架部5的凹部固定外周支持部5d。 In addition, the outer peripheral support portion 5d is formed on the inner peripheral wall surface of the lower portion of the body frame portion 5 where the opening hole is formed, and is fixed by welding or adhesive or the like in the shape of a plate with a constant width along the circumferential direction of the inner peripheral wall surface An example of forming a member separately, but the outer peripheral support portion 5d may be integrally formed with the body frame portion 5. In addition, if the outer peripheral support portion 5d and the main body frame portion 5 are formed as separate bodies, the outer peripheral support portion 5d is firmly fixed to the main body frame portion 5, so that the inner periphery of the lower portion of the opening hole of the main body frame portion 5 The wall surface is provided with a recess for fitting the outer peripheral support 5d of the plate-like member, and the outer peripheral support 5d is fixed to the recess of the body frame 5.

[實施形態2] [Embodiment 2]

接著，說明實施形態2之被加工物之搬運托盤的構成例。圖9係顯示在實施形態2之搬運托盤載置被加工物的載置例的剖面圖。圖10係顯示在實施形態2之吸盤台搬入載置有被加工物的搬運托盤的搬入例的剖面圖。圖11係顯示將被保持在實施形態2之吸盤台的被加工物進行加工的加工例的剖面圖。 Next, a configuration example of the conveyance tray of the workpiece in the second embodiment will be described. FIG. 9 is a cross-sectional view showing an example of placing a workpiece on the transfer tray according to the second embodiment. FIG. 10 is a cross-sectional view showing an example of carrying in a transport tray on which a workpiece is placed on a chuck table of the second embodiment. 11 is a cross-sectional view showing a processing example of processing a workpiece held on the chuck table of the second embodiment.

實施形態2之搬運托盤6係在具有可適用在形成為圓狀且凸狀的吸盤台10B的構成方面與實施形態1為不同。 The conveyance tray 6 of the second embodiment is different from the first embodiment in that it has a configuration that can be applied to a chuck table 10B formed in a circular and convex shape.

搬運托盤6係使用在將被加工物W1搬出入至凸狀的吸盤台10B或洗淨手段80之時者。搬運托盤6係 如圖9所示，具備有形成為與環狀框架F為相同外形的本體框架部6a。其中，本體框架部6a的外徑係若可以第1及第2搬運手段50、60與環狀框架F相同的方式搬運搬運托盤6，並非限定於與環狀框架F為完全相同的外徑。本體框架部6a係具備有：開口部6b，其具有比被加工物W1的外形為更大的內周。開口部6b係具有固定被加工物W1的功能，具備有：比被加工物W1的外形稍微大地形成開口的開口上部6c；形成在開口部6b的下方，支持被加工物W1的外周部的外周支持部6d；及規制被加工物W1移動的移動規制部6e。 The conveyance tray 6 is used when the workpiece W1 is carried in and out to the convex chuck table 10B or the cleaning means 80. Carrying tray 6 series As shown in FIG. 9, the main body frame portion 6 a having the same outer shape as the ring frame F is provided. However, the outer diameter of the main body frame portion 6a is not limited to having the same outer diameter as the ring frame F if the first and second transfer means 50, 60 can transfer the transfer tray 6 in the same manner as the ring frame F. The body frame portion 6a is provided with an opening 6b having an inner circumference that is larger than the outer shape of the workpiece W1. The opening 6b has a function of fixing the workpiece W1, and includes: an opening upper portion 6c that forms an opening slightly larger than the outer shape of the workpiece W1; and is formed below the opening 6b and supports the outer periphery of the outer periphery of the workpiece W1 The support part 6d; and the movement regulation part 6e which regulates the movement of the workpiece W1.

外周支持部6d係由開口部6b的下部的內周朝向中心突出預定長度而形成。例如，外周支持部6d係在本體框架部6被形成有開口的開口孔的下部的內周壁面，藉由熔接或接著劑等固定有沿著內周壁面的周方向為一定寬幅的板狀構件。外周支持部6d係形成有比被加工物W1的外形為稍微小的開口。外周支持部6d係如圖9所示，支持被載置於開口部6b的被加工物W1的下面側的外周區域。 The outer peripheral support portion 6d is formed by the inner periphery of the lower portion of the opening 6b projecting toward the center by a predetermined length. For example, the outer peripheral support portion 6d is formed on the inner peripheral wall surface of the lower portion of the body frame portion 6 where the opening hole is formed, and a plate shape with a constant width along the circumferential direction of the inner peripheral wall surface is fixed by welding or adhesive member. The outer peripheral support portion 6d is formed with an opening slightly smaller than the outer shape of the workpiece W1. As shown in FIG. 9, the outer peripheral support portion 6d supports the outer peripheral area on the lower surface side of the workpiece W1 placed in the opening 6b.

在此，若藉由凸狀的吸盤台10B吸引保持被固定在搬運托盤6的開口部6b的被加工物W1時，凸狀的吸盤台10B的保持面11b被插入在搬運托盤6的開口部6b。此時，保持面11b直接抵接於被加工物W1的底面來進行吸引保持，因此在外周支持部6d的支持面6f亦可未形成有合成樹脂。此外，外周支持部6d的寬幅方向的長 度H1係形成地比實施形態1的外周支持部5d的寬幅方向的長度H2為更短。此係由於凸狀的吸盤台10B的保持面11b必須強固地吸引保持被加工物W1，因此以儘可能加寬抵接於被加工物W1的底面的區域的方式予以設計，外周支持部6d係必須使其內周比保持面11b的外周為更大之故。 Here, when the workpiece W1 fixed to the opening 6b of the transport tray 6 is sucked and held by the convex chuck table 10B, the holding surface 11b of the convex chuck table 10B is inserted into the opening of the transport tray 6 6b. At this time, the holding surface 11b directly abuts on the bottom surface of the workpiece W1 for suction holding. Therefore, the supporting surface 6f of the outer peripheral supporting portion 6d may not be formed with a synthetic resin. In addition, the length of the peripheral support portion 6d in the width direction The degree H1 is formed to be shorter than the length H2 in the width direction of the outer peripheral support portion 5d of the first embodiment. In this system, the holding surface 11b of the convex chuck table 10B must strongly attract and hold the workpiece W1, so it is designed to widen as much as possible the area that abuts on the bottom surface of the workpiece W1. The outer peripheral support portion 6d is The inner circumference must be larger than the outer circumference of the holding surface 11b.

移動規制部6e係形成在外周支持部6d與本體框架部6a的交界，亦即開口部6b的內周壁面。移動規制部6e係形成為相對本體框架部6a的面方向為大致垂直。移動規制部6e係抵接於被載置於開口部6b的被加工物W1的側面W1c，以規制被加工物W1朝面方向移動。 The movement regulation portion 6e is formed at the boundary between the outer peripheral support portion 6d and the main body frame portion 6a, that is, the inner peripheral wall surface of the opening portion 6b. The movement regulation portion 6e is formed to be substantially perpendicular to the plane direction of the body frame portion 6a. The movement regulation portion 6e abuts on the side surface W1c of the workpiece W1 placed on the opening 6b to regulate the movement of the workpiece W1 in the face direction.

接著，說明使用搬運托盤6來搬運被加工物W1的搬運例。第1搬運手段50係如圖10所示，藉由吸附部52的吸附墊52a，吸附保持本體框架部6a的外周部來搬運至凸狀的吸盤台10B。此時，搬運托盤單元U1B的被加工物W1係藉由移動規制部6e規制面方向的移動，且被固定在開口部6b。凸狀的吸盤台10B係如圖11所示，藉由保持面11b，僅吸引保持搬運托盤單元U1B的被加工物W1。例如，當搬運托盤單元U1B被載置在凸狀的吸盤台10B時，保持面11b係由搬運托盤6上推被加工物W1，保持面11b抵接於被加工物W1的背面而吸引保持被加工物W1。在被加工物W1被吸引保持在保持面11b的狀態下，加工手段20係將被加工物W1進行切削加工。 Next, a conveyance example of conveying the workpiece W1 using the conveyance tray 6 will be described. As shown in FIG. 10, the first conveying means 50 sucks and holds the outer peripheral portion of the main body frame portion 6a by the suction pad 52a of the suction portion 52 and conveys it to the convex chuck table 10B. At this time, the workpiece W1 of the conveyance tray unit U1B regulates the movement in the plane direction by the movement regulating portion 6e, and is fixed to the opening 6b. As shown in FIG. 11, the convex chuck table 10B attracts and holds only the workpiece W1 of the transport tray unit U1B through the holding surface 11 b. For example, when the transport tray unit U1B is placed on the convex chuck table 10B, the holding surface 11b pushes the workpiece W1 from the transport tray 6, and the holding surface 11b abuts on the back surface of the workpiece W1 to attract and hold the Workpiece W1. In a state where the workpiece W1 is attracted and held on the holding surface 11b, the processing means 20 performs cutting processing on the workpiece W1.

如以上所示，藉由實施形態2之搬運托盤6， 具備有：比實施形態1的外周支持部5d較短地形成寬幅方向的長度H1的外周支持部6d；及規制被加工物W1朝面方向移動的移動規制部6e，藉此具有與實施形態1為同等的效果，並且可對凸狀的吸盤台10B，適當地搬運被加工物W1。例如，若由於必須強固地吸引保持被加工物W1，因此以儘可能加寬抵接於被加工物W1的底面的區域的方式設計保持面11b時，外周支持部6d不會有碰撞保持面11b的情形，可將被加工物W1搬入至凸狀的吸盤台10B。 As shown above, with the transport tray 6 of the second embodiment, Equipped with: an outer peripheral support portion 6d that is shorter than the outer peripheral support portion 5d of the first embodiment to form a width H1 in the width direction; and a movement regulation portion 6e that regulates the movement of the workpiece W1 in the face direction, thereby having 1 has the same effect, and the workpiece W1 can be appropriately transported to the convex chuck table 10B. For example, if it is necessary to strongly attract and hold the workpiece W1, if the holding surface 11b is designed to widen as much as possible the area that abuts on the bottom surface of the workpiece W1, the outer peripheral support portion 6d does not have the collision holding surface 11b In the case of, the workpiece W1 can be carried into the convex chuck table 10B.

[變形例] [Variation]

接著，說明實施形態2的變形例。以上說明外周支持部6d係在本體框架部6被形成有開口的開口孔的下部的內周壁面，藉由熔接或接著劑等固定有沿著內周壁面的周方向為一定寬幅的板狀構件的別體成形之例，但是外周支持部6d亦可與本體框架部6一體成型。此外，若將外周支持部6d與本體框架部6形成為別體成形，為了將外周支持部6d強固地固定在本體框架部6，亦可在本體框架部6的開口孔的下部的內周壁面設置用以嵌合板狀構件的外周支持部6d的凹部，在本體框架部6的凹部固定外周支持部6d。 Next, a modification of the second embodiment will be described. As described above, the outer peripheral support portion 6d is formed on the inner peripheral wall surface of the lower portion of the body frame portion 6 where the opening hole is formed, and is fixed by welding or adhesive to a plate shape having a constant width along the circumferential direction of the inner peripheral wall surface An example of forming a member separately, but the outer peripheral support portion 6d may be integrally formed with the body frame portion 6. In addition, if the outer peripheral support portion 6d and the main body frame portion 6 are formed separately, in order to firmly fix the outer peripheral support portion 6d to the main body frame portion 6, the inner peripheral wall surface at the lower part of the opening hole of the main body frame portion 6 A recess for fitting the outer peripheral support portion 6d of the plate-like member is provided, and the outer peripheral support portion 6d is fixed to the recess of the body frame portion 6.

5‧‧‧搬運托盤 5‧‧‧pallet

5a‧‧‧本體框架部 5a‧‧‧Body frame

5b‧‧‧開口部 5b‧‧‧Opening

5c‧‧‧開口上部 5c‧‧‧Upper opening

5d‧‧‧外周支持部 5d‧‧‧Peripheral Support Department

5e‧‧‧移動規制部 5e‧‧‧Mobile Regulation Department

5f‧‧‧支持面 5f‧‧‧Support

Claims (1)

一種被加工物之搬運托盤，其係使用在以具備有：吸盤台，其係具備保持在環狀框架的開口透過黏著帶支持有被加工物的框架單元的被加工物的保持面；加工手段，其係將被保持在該吸盤台的被加工物進行加工；匣盒載置區域，其係載置收容複數該框架單元的匣盒；及搬運手段，其係在被載置於該匣盒載置區域的該匣盒與該吸盤台之間支持該環狀框架而搬運該框架單元的加工裝置，將板狀的被加工物搬出入至該吸盤台之時的搬運托盤，其特徵為：具備有：環狀的本體框架部，其係具備有比該板狀的被加工物的外形為更大的內周；外周支持部，其係由該本體框架部的內周朝向中心突出，且支持被加工物的下面側的外周區域；及移動規制部，其係被形成在該本體框架部與該外周支持部的交界，規制所載置的被加工物朝面方向移動，該本體框架部係形成為與該環狀框架為相同外徑，可收容在該匣盒。 A transport pallet for a workpiece, which is used to include: a chuck table, which is a holding surface of a workpiece having a frame unit that supports the workpiece held in an opening of a ring-shaped frame through an adhesive tape; processing means , Which is to process the object to be held on the chuck table; the cassette placement area, which houses the cassette that houses the plurality of frame units; and the conveying means, which is placed on the cassette The processing device that supports the ring frame between the cassette and the chuck table in the placement area and transports the frame unit, and the transport tray when the plate-shaped workpiece is carried in and out of the chuck table is characterized by: Equipped with: a ring-shaped body frame portion having an inner circumference larger than the outer shape of the plate-shaped workpiece; an outer peripheral support portion protruding from the inner circumference of the body frame portion toward the center, and An outer peripheral area supporting the lower side of the workpiece; and a movement regulation portion formed at the boundary between the body frame portion and the peripheral support portion, regulating the movement of the workpiece placed on the surface, the body frame portion It is formed to have the same outer diameter as the ring frame and can be housed in the cassette.
TW105107363A 2015-04-08 2016-03-10 Carrying pallets of processed objects TWI689027B (en)

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