TWI689027B - Carrying pallets of processed objects - Google Patents
Carrying pallets of processed objects Download PDFInfo
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- TWI689027B TWI689027B TW105107363A TW105107363A TWI689027B TW I689027 B TWI689027 B TW I689027B TW 105107363 A TW105107363 A TW 105107363A TW 105107363 A TW105107363 A TW 105107363A TW I689027 B TWI689027 B TW I689027B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
- B65D1/34—Trays or like shallow containers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0235—Containers
- B65G2201/0258—Trays, totes or bins
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Packaging Frangible Articles (AREA)
Abstract
提供一種可刪減被加工物之加工成本的被加 工物之搬運托盤。 Provide an added cost-reducing processing cost Handling pallets for works.
搬運托盤(5)係具備有形成為與習知之 環狀框架為大致相同的外形的本體框架部(5a),在本體框架部(5a)設有開口部(5b)。開口部(5b)係具備有:支持被加工物的下面側的外周區域的外周支持部(5d)、及規制被加工物對面方向移動的移動規制部(5e)。藉此,若不需要將被加工物進行全切時,不使用黏著帶而僅將被加工物載置在搬運托盤(5)的開口部(5b)即可固定。 The transport tray (5) is equipped with The ring frame is a body frame portion (5a) having substantially the same outer shape, and an opening portion (5b) is provided in the body frame portion (5a). The opening (5b) includes an outer peripheral support portion (5d) that supports the outer peripheral region on the lower surface side of the workpiece, and a movement regulation portion (5e) that regulates the movement of the workpiece in the opposite direction. Thereby, if it is not necessary to cut the workpiece completely, it is possible to fix the workpiece only by placing it on the opening (5b) of the transport tray (5) without using an adhesive tape.
Description
本發明係關於被加工物之搬運托盤。 The present invention relates to a conveying pallet of a workpiece.
在將半導體晶圓等板狀被加工物切割成各個元件晶片、或形成分割用溝槽時,係使用利用切削刀的切削裝置、或藉由雷射進行加工的雷射加工裝置。在該等裝置中,係使用在環狀框架的開口部透過黏著帶(dicing tape)支持有被加工物的框架單元,而容易搬運被加工物(專利文獻1)。 When cutting a plate-shaped workpiece such as a semiconductor wafer into individual element wafers or forming a groove for division, a cutting device using a cutting blade or a laser processing device processed by laser is used. In these devices, a frame unit that supports a workpiece through an opening of a ring-shaped frame through an adhesive tape (dicing tape) makes it easy to transport the workpiece (Patent Document 1).
[專利文獻1]日本特開2002-110777號公報 [Patent Document 1] Japanese Unexamined Patent Publication No. 2002-110777
但是,由於黏著帶為消耗品,若被加工物的 加工結束,每次均要被重貼,因此有加工成本增加的課題。 However, since the adhesive tape is a consumable, if the At the end of the processing, it has to be reposted every time, so there is a problem of increased processing costs.
因此,本發明係鑑於上述情形而完成者,目的在提供可刪減被加工物之加工成本的被加工物之搬運托盤。 Therefore, the present invention has been completed in view of the above circumstances, and an object of the present invention is to provide a conveying tray for processed objects that can reduce the processing cost of the processed objects.
為解決上述課題,以達成目的,本發明之被加工物之搬運托盤係使用在以具備有:具備保持被加工物的保持面的吸盤台、及將被保持在該吸盤台的被加工物進行加工的加工手段的加工裝置,將板狀的被加工物搬出入至該吸盤台之時的搬運托盤,其特徵為:具備有:環狀的本體框架部,其係具備有比該板狀的被加工物的外形為更大的內周;外周支持部,其係由該本體框架部的內周朝向中心突出,且支持被加工物的下面側的外周區域;及移動規制部,其係被形成在該本體框架部與該外周支持部的交界,規制所載置的被加工物朝面方向移動。 In order to solve the above-mentioned problems and achieve the objective, the conveyance tray of the processed object of the present invention is used to include a chuck table provided with a holding surface for holding the processed object, and the processed object to be held on the chuck table The processing device of the processing means for processing, a transport tray when carrying out a plate-shaped object to and from the chuck table, is characterized by comprising: a ring-shaped body frame portion which is provided with a plate-shaped object The outer shape of the workpiece is a larger inner periphery; the outer peripheral support portion, which protrudes from the inner periphery of the body frame portion toward the center, and supports the outer peripheral area on the lower side of the processed object; and the movement regulation portion, which is A boundary formed between the main body frame portion and the outer peripheral support portion regulates movement of the mounted object in the face direction.
此外,在上述被加工物之搬運托盤中,較佳為該加工裝置係具備有:匣盒載置區域,其係載置收容複數在環狀框架的開口透過黏著帶支持有被加工物的框架單元的匣盒;及搬運手段,其係在被載置於該匣盒載置區域的該匣盒與該吸盤台之間支持該環狀框架而搬運該框架單元,該本體框架部係形成為與該環狀框架為相同外徑,可收容在該匣盒。 In addition, in the above-mentioned to-be-processed pallet, it is preferable that the processing apparatus includes: a cassette placement area which mounts and accommodates a plurality of frames that support the to-be-processed objects through an adhesive tape at an opening of the ring-shaped frame A cassette of the unit; and a conveying means, which supports the ring frame and transports the frame unit between the cassette placed in the cassette mounting area and the chuck table, and the body frame portion is formed as It has the same outer diameter as the ring frame and can be housed in the box.
本發明之被加工物之搬運托盤係具備有:支持被加工物的下面側的外周區域的外周支持部、及規制被加工物對面方向移動的移動規制部,藉此,不使用黏著帶即可將被加工物固定在搬運托盤,因此可大幅刪減加工成本。 The conveyance pallet of the processed object of the present invention includes an outer peripheral support portion that supports the outer peripheral area of the lower surface of the processed object, and a movement regulation portion that regulates the movement of the processed object in the opposite direction, thereby eliminating the need to use an adhesive tape The workpiece is fixed on the transport tray, so the processing cost can be greatly reduced.
1:加工裝置 1: processing device
2:裝置本體 2: Device body
3:第1門型框架 3: The first door frame
4:第2門型框架 4: 2nd door frame
5、6:搬運托盤 5, 6: Carrying pallets
5a、6a:本體框架部 5a, 6a: Body frame
5b、6b:開口部 5b, 6b: opening
5c、6c:開口上部 5c, 6c: upper part of the opening
5d、6d:外周支持部 5d, 6d: peripheral support
5e、6e:移動規制部 5e, 6e: Mobile Regulation Department
5f、6f:支持面 5f, 6f: support surface
10A:吸盤台 10A: suction cup table
10B:凸狀的吸盤台 10B: convex sucker table
11a、11b:保持面 11a, 11b: keep the surface
12:夾具部 12: Fixture Department
20:加工手段 20: Processing means
21:切削刀 21: Cutter
22:心軸 22: mandrel
23:外殼 23: Shell
30:加工進給手段 30: Processing and feeding means
40:切入進給手段 40: Cutting feed method
50:第1搬運手段 50: The first means of transportation
51:夾持部 51: clamping part
52:吸附部 52: Adsorption section
52a:吸附墊 52a: Adsorption pad
60:第2搬運手段 60: Second transportation means
61:吸附部 61: Adsorption section
70:軌條 70: rail
80:洗淨手段 80: cleaning method
81:旋轉台 81: Rotating table
90:匣盒機構 90: cassette mechanism
91:匣盒 91: Cartridge
91a:開口部 91a: opening
91b:收容棚架 91b: containment scaffold
91c:支持板 91c: Support board
92:匣盒載置手段 92: Box mounting method
92a:匣盒載置區域 92a: Cartridge mounting area
F:環狀框架 F: ring frame
H1:長度 H1: Length
T:黏著帶 T: Adhesive tape
W(W1、W2):被加工物 W(W1, W2): object to be processed
W1c:被加工物W1的側面 W1c: Side of the workpiece W1
U:被加工物保持單元 U: Workpiece holding unit
U1A、U1B:搬運托盤單元 U1A, U1B: Carrying pallet unit
U2:框架單元 U2: Frame unit
圖1係顯示實施形態1之加工裝置的構成例的斜視圖。 Fig. 1 is a perspective view showing a configuration example of a processing apparatus according to the first embodiment.
圖2係顯示實施形態1之匣盒的構成例的正面圖。 Fig. 2 is a front view showing a configuration example of the cassette in the first embodiment.
圖3係顯示實施形態1之被加工物的構成例的斜視圖。 Fig. 3 is a perspective view showing a configuration example of a workpiece to be processed in the first embodiment.
圖4係顯示實施形態1之搬運托盤的構成例的斜視圖。 FIG. 4 is a perspective view showing an example of the configuration of the transport tray in the first embodiment.
圖5係顯示在實施形態1之搬運托盤載置被加工物的載置例的斜視圖。 FIG. 5 is a perspective view showing an example of placing a workpiece on a transfer tray according to the first embodiment.
圖6係顯示在實施形態1之搬運托盤載置被加工物的載置例的P-P箭號的剖面圖。 6 is a cross-sectional view of a P-P arrow showing an example of placing a workpiece on a transfer tray according to the first embodiment.
圖7係顯示在實施形態1之吸盤台搬入載置有被加工物的搬運托盤的搬入例的剖面圖。 7 is a cross-sectional view showing an example of carrying in a conveying tray on which workpieces are placed on the chuck table of the first embodiment.
圖8係顯示將被保持在實施形態1之吸盤台的被加工 物進行加工的加工例的剖面圖。 Fig. 8 shows the processing to be held on the chuck table of the first embodiment A cross-sectional view of a processing example in which an object is processed.
圖9係顯示在實施形態2之搬運托盤載置被加工物的載置例的剖面圖。 FIG. 9 is a cross-sectional view showing an example of placing a workpiece on the transfer tray according to the second embodiment.
圖10係顯示在實施形態2之吸盤台搬入載置有加工物的搬運托盤的搬入例的剖面圖。 10 is a cross-sectional view showing an example of carrying in a carrying tray on which a processed object is placed on a chuck table of the second embodiment.
圖11係顯示將被保持在實施形態2之吸盤台的被加工物進行加工的加工例的剖面圖。 11 is a cross-sectional view showing a processing example of processing a workpiece held on the chuck table of the second embodiment.
一邊參照圖示,一邊詳加說明用以實施本發明的形態(實施形態)。並非為藉由以下實施形態所記載之內容,來限定本發明者。此外,在以下記載的構成要素中係包含該領域熟習該項技術者可輕易想定者、實質上為相同者。此外,以下記載的構成係可適當組合。此外,可在不脫離本發明之要旨的範圍內,進行構成的各種省略、置換或變更。 The embodiment (embodiment) for implementing the present invention will be described in detail while referring to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include those that can be easily imagined by those skilled in the art and are substantially the same. In addition, the configuration systems described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.
說明實施形態1之加工裝置及被加工物之搬運托盤的構成例。圖1係顯示實施形態1之加工裝置的構成例的斜視圖。圖2係顯示實施形態1之匣盒的構成例的正面圖。圖3係顯示實施形態1之被加工物的構成例的斜視圖。圖4係顯示實施形態1之搬運托盤的構成例的斜視圖。圖5係顯示在實施形態1之搬運托盤載置被加工物的載置例的
斜視圖。圖6係顯示在實施形態1之搬運托盤載置被加工物的載置例的P-P箭號的剖面圖。
A configuration example of the processing apparatus and the conveyance tray of the workpiece in the first embodiment will be described. Fig. 1 is a perspective view showing a configuration example of a processing apparatus according to the first embodiment. Fig. 2 is a front view showing a configuration example of the cassette in the first embodiment. Fig. 3 is a perspective view showing a configuration example of a workpiece to be processed in the first embodiment. FIG. 4 is a perspective view showing an example of the configuration of the transport tray in the first embodiment. FIG. 5 is a diagram showing an example of placing a workpiece on a transport pallet according to
加工裝置1係將被加工物W進行加工者。加工裝置1係如圖1所示,具備有:吸盤台10A、加工手段20、加工進給手段30、切入進給手段40、第1搬運手段50、第2搬運手段60、暫時放置用的軌條70、洗淨手段80、匣盒機構90、未圖示之割出進給手段、及未圖示之控制手段。
The
吸盤台10A係可以X軸方向移動地被配設在裝置本體2的上面。吸盤台10A係形成為圓板狀,具備有:保持面11a、及夾具部12。吸盤台10A係藉由未圖示之旋轉手段,以與保持面11a的中心呈正交的旋轉軸予以旋轉。保持面11a係吸盤台10A的鉛直方向的上端面,相對水平面形成為平坦。保持面11a係以例如多孔陶瓷等所構成,藉由未圖示之真空吸引源的負壓,吸引保持被加工物保持單元U(例如搬運托盤單元U1A或框架單元U2)的被加工物W。夾具部12係夾持被加工物保持單元U者,由上下夾著被加工物保持單元U的外周緣來進行保持。
The chuck table 10A is arranged on the upper surface of the
加工手段20係將被保持在吸盤台10A的被加工物W進行加工者。加工手段20係透過割出進給手段及切入進給手段40而被配設在第1門型框架3。在此,第1門型框架3係以Y軸方向跨越吸盤台10A的X軸方向中的移動路徑的方式被立設在裝置本體2。加工手段20係
具備有:將被加工物W進行切削的切削刀21;可安裝卸下地裝設切削刀21的心軸22;及可繞Y軸方向的旋轉軸旋轉自如地支持心軸22的外殼23。
The processing means 20 is a person who processes the workpiece W held on the chuck table 10A. The processing means 20 is arranged on the first
加工進給手段30係使吸盤台10A及加工手段20以X軸方向作相對移動者。例如,加工進給手段30係具有以X軸方向延伸存在之未圖示之滾珠螺桿或脈衝馬達等驅動源,使支持吸盤台10A之未圖示之X軸移動基台以X軸方向移動。 The processing feed means 30 is a relative movement of the chuck table 10A and the processing means 20 in the X-axis direction. For example, the processing feed means 30 has a drive source such as a ball screw or a pulse motor (not shown) extending in the X-axis direction, and moves an unillustrated X-axis moving base supporting the chuck table 10A in the X-axis direction.
割出進給手段係使吸盤台10A及加工手段20以Y軸方向作相對移動者。例如,割出進給手段係具有以Y軸方向延伸存在之未圖示之滾珠螺桿或脈衝馬達等驅動源,使支持切入進給手段40之未圖示之Y軸移動基台以Y軸方向移動。 The cutting-out feed means is a relative movement of the chuck table 10A and the processing means 20 in the Y-axis direction. For example, the cut-out feed means has a drive source such as a ball screw or a pulse motor that extends in the Y-axis direction, and the Y-axis moving base that supports the cut-in feed means 40 in the Y-axis direction mobile.
切入進給手段40係以與吸盤台10A的保持面11a呈大致正交的Z軸方向,使加工手段20移動者。例如,切入進給手段40係具有以Z軸方向延伸存在之未圖示之滾珠螺桿或脈衝馬達等驅動源,使支持加工手段20之未圖示之Z軸移動構件以Z軸方向移動。
The cut-in feed means 40 moves the processing means 20 in the Z-axis direction substantially orthogonal to the holding
第1搬運手段50係可以Y、Z軸方向移動地被配設在第2門型框架4,藉由未圖示之致動器予以驅動。在此,第2門型框架4係與第1門型框架3同樣地,以Y軸方向跨越吸盤台10A的移動路徑的方式被立設在裝置本體2。第1搬運手段50係具備有:夾持部51、及吸附部52。第1搬運手段50係藉由夾持部51由匣盒機
構90夾持固定有加工前的被加工物W的被加工物保持單元U而取出,且將被加工物保持單元U暫時放置在一對暫時放置用的軌條70。此外,第1搬運手段50係藉由吸附部52吸附保持被暫時放置在軌條70的被加工物保持單元U而搬運至吸盤台10A。此外,第1搬運手段50係吸附保持固定有洗淨後的被加工物W的被加工物保持單元U而暫時放置在軌條70。
The first conveyance means 50 is arranged on the
第2搬運手段60係可以X、Y、Z軸方向移動地被配設在第2門型框架4,藉由未圖示之致動器予以驅動。第2搬運手段60係具備有:吸附部61,將固定有被保持在吸盤台10A的加工後的被加工物W的被加工物保持單元U暫時放置在軌條70。此外,第2搬運手段60係藉由吸附部61吸附保持被暫時放置在軌條70的加工後的被加工物保持單元U而搬運至洗淨手段80。
The second conveyance means 60 is arranged in the
洗淨手段80係將被加工物保持單元U的被加工物W洗淨而使其乾燥者。洗淨手段80係具備有:保持被加工物保持單元U的旋轉台81。洗淨手段80係藉由旋轉台81吸引保持被加工物保持單元U,一邊以高速使其旋轉,一邊朝向被加工物W噴射純水等洗淨液來進行洗淨,朝向被加工物W噴射清淨的空氣(壓縮空氣)等而使其乾燥。
The washing means 80 is a person who washes and dries the workpiece W of the workpiece holding unit U. The cleaning means 80 includes a
匣盒機構90係收容被加工物保持單元U者,具備有:匣盒91、及匣盒載置手段92。例如,匣盒91係收容複數被加工物保持單元U者。匣盒91係如圖2所
示,具備有:搬出入用的開口部91a、及收容棚架91b。匣盒91的開口部91a係以與第1搬運手段50相對向的方式作配設,藉由第1搬運手段50搬出入被加工物保持單元U。收容棚架91b係由相對向的側壁以匣盒91的寬幅方向(X軸方向)突出而形成有複數支持被加工物保持單元U的支持板91c。支持板91c係以高度方向(Z軸方向)以等間隔作配設。高度方向中的支持板91c的間隔係設定為大於被加工物保持單元U的厚度。在匣盒91的寬幅方向中相對向的一對支持板91c係水平支持被加工物保持單元U。在本實施形態1中,在匣盒91係藉由本發明之搬運托盤5,收容3枚支持有被加工物W1的搬運托盤單元U1A,且收容5枚在習知之環狀框架F的開口透過黏著帶T支持有被加工物W2的框架單元U2。
The
匣盒載置手段92係以Z軸方向上下移動自如地載置匣盒91者。匣盒載置手段92係具備有:匣盒載置區域92a、及使匣盒載置區域92a以Z軸方向作升降之未圖示之升降手段。在匣盒載置區域92a係以匣盒91的開口部91a與第1搬運手段50相對向的方式載置有匣盒91。匣盒載置手段92係使被載置於匣盒載置區域92a的匣盒91藉由升降手段作升降,藉此將匣盒91定位在藉由第1搬運手段50搬出入被加工物保持單元U的位置。
The cassette placing means 92 is a case where the
搬運托盤單元U1A係由被加工物W1、及搬運托盤5所構成。被加工物W1係在矽或砷化鎵等基板形成有半導體元件、或在藍寶石或SiC等基板形成有光元件
者,半導體晶圓或光元件晶圓、無機材料基板、延展性樹脂材料基板、陶瓷基板或玻璃板等各種加工材料。被加工物W1係如圖3所示,形成為矩形板狀。
The conveyance tray unit U1A is composed of the workpiece W1 and the
搬運托盤5係使用在將被加工物W1搬出入至吸盤台10A或洗淨手段80之時者。搬運托盤5係如圖4所示,具備有:形成為與環狀框架F為相同外形的本體框架部5a。其中,本體框架部5a的外徑係可以第1及第2搬運手段50、60與環狀框架F相同的方式進行搬運,若可藉由吸盤台10A進行保持,並非限定為與環狀框架F為完全相同的外徑。本體框架部5a係具備有開口部5b,其具有大於被加工物W1的外形的內周。開口部5b係具有固定被加工物W1的功能,具備有:比被加工物W1的外形稍微大地形成開口的開口上部5c;形成在開口部5b的下方,支持被加工物W1的外周部的外周支持部5d;及規制被加工物W1朝面方向移動的移動規制部5e。
The
外周支持部5d係由開口部5b的下部的內周朝向中心突出預定長度而形成。例如,外周支持部5d係在本體框架部5被形成有開口的開口孔的下部的內周壁面,藉由熔接或接著劑等,固定有沿著內周壁面的周方向為一定寬幅的板狀構件。外周支持部5d係形成有比被加工物W1的外形稍微小的開口。在外周支持部5d的支持面5f係遍及全域形成有矽酮等合成樹脂。外周支持部5d係如圖6所示,支持被載置在開口部5b的被加工物W1的下面側的外周區域。
The outer
移動規制部5e係形成在外周支持部5d與本體框架部5a的交界,亦即開口部5b的內周壁面。移動規制部5e係形成為相對本體框架部5a的面方向為大致垂直。移動規制部5e係抵接於被載置於開口部5b的被加工物W1的側面W1c,規制被加工物W1朝面方向移動。其中,在移動規制部5e與被加工物W1的側面W1c之間具有間隙,但是由於在將被加工物W1進行加工時實施對準,因此即使在被加工物W1與被加工物W1的側面W1c之間具有間隙,在加工時亦不會有問題。
The
控制手段係控制加工裝置1的各構成要素者。例如,控制手段係與驅動加工進給手段30、割出進給手段、切入進給手段40的脈衝馬達的未圖示之驅動電路相連接,控制驅動電路,來決定吸盤台10A的X軸方向的位置、或加工手段20的Y軸方向及Z軸方向的位置。
The control means controls each constituent element of the
接著,說明實施形態1之加工裝置的動作例。若將被加工物W進行加工時,首先,加工裝置1的控制手段係控制匣盒載置手段92,且使匣盒91以Z軸方向作升降而定位在預定位置。接著,控制手段係控制第1搬運手段50,取出被收容在匣盒91的加工對象的被加工物保持單元U,例如搬運托盤單元U1A而暫時放置在軌條70。例如,第1搬運手段50係藉由夾持部51夾持搬運托盤單元U1A的本體框架部5a而由匣盒91取出搬運托盤單元U1A。
Next, an operation example of the processing device of the first embodiment will be described. When processing the workpiece W, first, the control means of the
接著,控制手段係控制第1搬運手段50,藉由吸附部52吸附保持被暫時放置在軌條70的搬運托盤單元U1A而搬運至吸盤台10A。例如,第1搬運手段50係如圖7所示,藉由吸附部52的吸附墊52a,吸附保持本體框架部5a的外周部而將搬運托盤單元U1A搬運至吸盤台10A。此時,搬運托盤單元U1A的被加工物W1係藉由移動規制部5e規制面方向的移動,且被固定在開口部5b。吸盤台10A係藉由保持面11a吸引保持搬運托盤單元U1A。接著,吸盤台10A係如圖8所示,在吸附部52的吸附墊52a由本體框架部5a的外周部被解放之後,藉由夾具部12夾持本體框架部5a的外周緣。在外周支持部5d的支持面5f係形成有合成樹脂,因此被支持面5f支持的被加工物W1係與吸盤台10A的保持面11a呈氣密狀態。藉此,被加工物W1係若在保持面11a作用負壓,透過外周支持部5d而被吸引保持在保持面11a。
Next, the control means controls the first conveyance means 50 to suck and hold the conveyance tray unit U1A temporarily placed on the
接著,控制手段係實施被保持在吸盤台10A的搬運托盤單元U1A的被加工物W1的對準。接著,控制手段係控制加工手段20,且將被加工物W1進行切削加工。例如,加工手段20係藉由切削刀21,將被加工物W1未進行全切地,切削至被加工物W1的途中。若被加工物W1的切削結束,控制手段係控制第2搬運手段60,將被保持在吸盤台10A的搬運托盤單元U1A暫時放置在軌條70。接著,控制手段係控制第2搬運手段60,且將被暫時放置在軌條70的搬運托盤單元U1A搬運至洗淨手
段80。接著,控制手段係控制洗淨手段80,將搬運托盤單元U1A的被加工物W1洗淨而使其乾燥。接著,控制手段係控制第1搬運手段50,將藉由洗淨手段80使被加工物W1被洗淨及乾燥後的搬運托盤單元U1A暫時放置在軌條70。接著,控制手段係控制第1搬運手段50及匣盒機構90,將被暫時放置在軌條70的搬運托盤單元U1A收容在匣盒91的預定的收容棚架91b。
Next, the control means performs the alignment of the workpiece W1 held by the transport tray unit U1A of the chuck table 10A. Next, the control means controls the processing means 20 and cuts the workpiece W1. For example, the processing means 20 uses the
如以上所示,藉由實施形態1之搬運托盤5,具備有:支持被加工物W1的下面側的外周區域的外周支持部5d;及規制被加工物W1朝面方向移動的移動規制部5e者。藉此,若不需要實施用以將被加工物W1完全分離的全切,僅將被加工物W1載置在搬運托盤5即可固定,因此不需要黏著帶T,可大幅刪減加工成本。此外,由於可省略如習知般,將黏著帶T黏貼在環狀框架F,將被加工物W2黏貼在被黏貼在環狀框架F的黏著帶T來進行固定的作業,因此可減低作業的勞力。此外,搬運托盤5係形成為與習知之環狀框架F為相同外徑,因此無須改造習知之搬運手段,即可搬運被加工物W1,因此達成不會耗費導入成本的效果。
As described above, the
接著,說明實施形態1的變形例。以上說明將1個被加工物W1固定在搬運托盤5之例,惟亦可將複數個被加工物W1固定在搬運托盤5。此時,例如在搬運托盤5的
本體框架部5a設置複數個開口部5b,且在各自的開口部5b固定被加工物W1。
Next, a modification of the first embodiment will be described. As described above, the example in which one workpiece W1 is fixed to the
此外,外周支持部5d係在本體框架部5被形成有開口的開口孔的下部的內周壁面,藉由熔接或接著劑等固定有沿著內周壁面的周方向為一定寬幅的板狀構件的別體成形之例,但是外周支持部5d亦可與本體框架部5一體成型。此外,若將外周支持部5d與本體框架部5形成為別體成形,由於將外周支持部5d強固地固定在本體框架部5,因此亦可在本體框架部5的開口孔的下部的內周壁面設置用以嵌合板狀構件的外周支持部5d的凹部,而在本體框架部5的凹部固定外周支持部5d。
In addition, the outer
接著,說明實施形態2之被加工物之搬運托盤的構成例。圖9係顯示在實施形態2之搬運托盤載置被加工物的載置例的剖面圖。圖10係顯示在實施形態2之吸盤台搬入載置有被加工物的搬運托盤的搬入例的剖面圖。圖11係顯示將被保持在實施形態2之吸盤台的被加工物進行加工的加工例的剖面圖。 Next, a configuration example of the conveyance tray of the workpiece in the second embodiment will be described. FIG. 9 is a cross-sectional view showing an example of placing a workpiece on the transfer tray according to the second embodiment. FIG. 10 is a cross-sectional view showing an example of carrying in a transport tray on which a workpiece is placed on a chuck table of the second embodiment. 11 is a cross-sectional view showing a processing example of processing a workpiece held on the chuck table of the second embodiment.
實施形態2之搬運托盤6係在具有可適用在形成為圓狀且凸狀的吸盤台10B的構成方面與實施形態1為不同。
The
搬運托盤6係使用在將被加工物W1搬出入至凸狀的吸盤台10B或洗淨手段80之時者。搬運托盤6係
如圖9所示,具備有形成為與環狀框架F為相同外形的本體框架部6a。其中,本體框架部6a的外徑係若可以第1及第2搬運手段50、60與環狀框架F相同的方式搬運搬運托盤6,並非限定於與環狀框架F為完全相同的外徑。本體框架部6a係具備有:開口部6b,其具有比被加工物W1的外形為更大的內周。開口部6b係具有固定被加工物W1的功能,具備有:比被加工物W1的外形稍微大地形成開口的開口上部6c;形成在開口部6b的下方,支持被加工物W1的外周部的外周支持部6d;及規制被加工物W1移動的移動規制部6e。
The
外周支持部6d係由開口部6b的下部的內周朝向中心突出預定長度而形成。例如,外周支持部6d係在本體框架部6被形成有開口的開口孔的下部的內周壁面,藉由熔接或接著劑等固定有沿著內周壁面的周方向為一定寬幅的板狀構件。外周支持部6d係形成有比被加工物W1的外形為稍微小的開口。外周支持部6d係如圖9所示,支持被載置於開口部6b的被加工物W1的下面側的外周區域。
The outer
在此,若藉由凸狀的吸盤台10B吸引保持被固定在搬運托盤6的開口部6b的被加工物W1時,凸狀的吸盤台10B的保持面11b被插入在搬運托盤6的開口部6b。此時,保持面11b直接抵接於被加工物W1的底面來進行吸引保持,因此在外周支持部6d的支持面6f亦可未形成有合成樹脂。此外,外周支持部6d的寬幅方向的長
度H1係形成地比實施形態1的外周支持部5d的寬幅方向的長度H2為更短。此係由於凸狀的吸盤台10B的保持面11b必須強固地吸引保持被加工物W1,因此以儘可能加寬抵接於被加工物W1的底面的區域的方式予以設計,外周支持部6d係必須使其內周比保持面11b的外周為更大之故。
Here, when the workpiece W1 fixed to the
移動規制部6e係形成在外周支持部6d與本體框架部6a的交界,亦即開口部6b的內周壁面。移動規制部6e係形成為相對本體框架部6a的面方向為大致垂直。移動規制部6e係抵接於被載置於開口部6b的被加工物W1的側面W1c,以規制被加工物W1朝面方向移動。
The
接著,說明使用搬運托盤6來搬運被加工物W1的搬運例。第1搬運手段50係如圖10所示,藉由吸附部52的吸附墊52a,吸附保持本體框架部6a的外周部來搬運至凸狀的吸盤台10B。此時,搬運托盤單元U1B的被加工物W1係藉由移動規制部6e規制面方向的移動,且被固定在開口部6b。凸狀的吸盤台10B係如圖11所示,藉由保持面11b,僅吸引保持搬運托盤單元U1B的被加工物W1。例如,當搬運托盤單元U1B被載置在凸狀的吸盤台10B時,保持面11b係由搬運托盤6上推被加工物W1,保持面11b抵接於被加工物W1的背面而吸引保持被加工物W1。在被加工物W1被吸引保持在保持面11b的狀態下,加工手段20係將被加工物W1進行切削加工。
Next, a conveyance example of conveying the workpiece W1 using the
如以上所示,藉由實施形態2之搬運托盤6,
具備有:比實施形態1的外周支持部5d較短地形成寬幅方向的長度H1的外周支持部6d;及規制被加工物W1朝面方向移動的移動規制部6e,藉此具有與實施形態1為同等的效果,並且可對凸狀的吸盤台10B,適當地搬運被加工物W1。例如,若由於必須強固地吸引保持被加工物W1,因此以儘可能加寬抵接於被加工物W1的底面的區域的方式設計保持面11b時,外周支持部6d不會有碰撞保持面11b的情形,可將被加工物W1搬入至凸狀的吸盤台10B。
As shown above, with the
接著,說明實施形態2的變形例。以上說明外周支持部6d係在本體框架部6被形成有開口的開口孔的下部的內周壁面,藉由熔接或接著劑等固定有沿著內周壁面的周方向為一定寬幅的板狀構件的別體成形之例,但是外周支持部6d亦可與本體框架部6一體成型。此外,若將外周支持部6d與本體框架部6形成為別體成形,為了將外周支持部6d強固地固定在本體框架部6,亦可在本體框架部6的開口孔的下部的內周壁面設置用以嵌合板狀構件的外周支持部6d的凹部,在本體框架部6的凹部固定外周支持部6d。
Next, a modification of the second embodiment will be described. As described above, the outer
5‧‧‧搬運托盤 5‧‧‧pallet
5a‧‧‧本體框架部 5a‧‧‧Body frame
5b‧‧‧開口部 5b‧‧‧Opening
5c‧‧‧開口上部 5c‧‧‧Upper opening
5d‧‧‧外周支持部 5d‧‧‧Peripheral Support Department
5e‧‧‧移動規制部 5e‧‧‧Mobile Regulation Department
5f‧‧‧支持面 5f‧‧‧Support
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