CN106057715B - Conveying tray for processed object - Google Patents

Conveying tray for processed object Download PDF

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Publication number
CN106057715B
CN106057715B CN201610186899.XA CN201610186899A CN106057715B CN 106057715 B CN106057715 B CN 106057715B CN 201610186899 A CN201610186899 A CN 201610186899A CN 106057715 B CN106057715 B CN 106057715B
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CN
China
Prior art keywords
workpiece
conveying
outer peripheral
chuck table
main frame
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Active
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CN201610186899.XA
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Chinese (zh)
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CN106057715A (en
Inventor
田中英明
井上克己
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Disco Corp
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Disco Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D1/00—Containers having bodies formed in one piece, e.g. by casting metallic material, by moulding plastics, by blowing vitreous material, by throwing ceramic material, by moulding pulped fibrous material, by deep-drawing operations performed on sheet material
    • B65D1/34—Trays or like shallow containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0235—Containers
    • B65G2201/0258—Trays, totes or bins

Abstract

Provided is a conveyance tray for a workpiece, which can reduce the processing cost of the workpiece. The conveying tray (5) has a main frame part (5a) formed into an outline substantially identical to that of a conventional annular frame, and an opening part (5b) is provided in the main frame part (5 a). The opening (5b) has: an outer periphery support part (5d) for supporting the outer periphery area on the lower surface side of the workpiece; and a movement restriction unit (5e) for restricting the movement of the workpiece in the plane direction. Thus, when the workpiece does not need to be completely cut, the workpiece can be fixed by merely placing the workpiece in the opening (5b) of the conveying tray (5) without using an adhesive tape.

Description

Conveying tray for processed object
Technical Field
The present invention relates to a workpiece conveying tray.
Background
When dividing a plate-shaped object to be processed such as a semiconductor wafer into individual device chips or forming grooves for division, a cutting device using a cutting tool or a laser processing device that performs processing with a laser beam is used. In these apparatuses, the workpiece is easily conveyed by using a frame unit that supports the workpiece via an adhesive tape (dicing tape) in an opening of an annular frame (patent document 1).
Patent document 1: japanese laid-open patent publication No. 2002-110777
However, since the adhesive tape is a consumable product, the adhesive tape is attached again every time the processing of the object to be processed is completed, which causes a problem of an increase in processing cost.
Disclosure of Invention
Therefore, the present invention has been made in view of the above problems, and an object thereof is to provide a conveyance tray capable of reducing the processing cost of a workpiece.
In order to solve the above-described problems and achieve the object, a workpiece transport tray according to the present invention is a workpiece transport tray used when a plate-shaped workpiece is carried in and out with respect to a chuck table in a machining apparatus including the chuck table having a holding surface for holding the workpiece and a machining member for machining the workpiece held on the chuck table, the workpiece transport tray including: an annular main frame portion having an inner periphery larger than an outer shape of the plate-shaped workpiece; an outer peripheral support portion that protrudes from an inner periphery of the main frame portion toward a center and supports an outer peripheral region on a lower surface side of the workpiece; and a movement restricting portion formed at a boundary between the main frame portion and the outer peripheral support portion, for restricting movement of the workpiece placed thereon in the plane direction.
In the above workpiece transport tray, the processing apparatus preferably includes: a cassette mounting area for mounting a cassette housing a plurality of frame units for supporting a workpiece via an adhesive tape in an opening of an annular frame; and a conveying member for conveying the frame unit by supporting the annular frame between the cartridge placed in the cartridge placing region and the chuck table, wherein the main frame portion is formed to have the same outer diameter as the annular frame and can be accommodated in the cartridge.
The present invention provides a conveying tray for processed objects, comprising: an outer periphery support portion that supports an outer periphery region on a lower surface side of the workpiece; and a movement restricting section that restricts movement of the workpiece in the planar direction, whereby the workpiece can be fixed to the conveyance tray without using an adhesive tape, and therefore, the processing cost can be significantly reduced.
Drawings
Fig. 1 is a perspective view showing a configuration example of a processing apparatus according to embodiment 1.
Fig. 2 is a front view showing a configuration example of the cartridge of embodiment 1.
Fig. 3 is a perspective view showing a configuration example of a workpiece according to embodiment 1.
Fig. 4 is a perspective view showing a configuration example of the conveyance tray according to embodiment 1.
Fig. 5 is a perspective view showing an example of placement of a workpiece on the conveyance tray according to embodiment 1.
Fig. 6 is a cross-sectional view of a P-P arrow showing an example of placement of a workpiece on the conveyance tray according to embodiment 1.
Fig. 7 is a cross-sectional view showing an example of carrying in a transport tray on which a workpiece is placed to a chuck table in embodiment 1.
Fig. 8 is a cross-sectional view showing an example of machining a workpiece held on a chuck table according to embodiment 1.
Fig. 9 is a cross-sectional view showing an example of placement of a workpiece on the conveyance tray according to embodiment 2.
Fig. 10 is a cross-sectional view showing an example of carrying in a transport tray on which a workpiece is loaded to a chuck table in embodiment 2.
Fig. 11 is a cross-sectional view showing a processing example of processing a workpiece held on a chuck table in embodiment 2.
Description of the reference symbols
1: a processing device; 5. 6: a carrying tray; 5a, 6 a: a main body frame portion; 5b, 6 b: an opening part; 5d, 6 d: an outer peripheral support portion; 5e, 6 e: a movement restricting section; 10A: a chuck table; 10B: a convex chuck table; 11a, 11 b: a holding surface; 50: a 1 st conveying member; 60: a 2 nd conveying member; 91: a cartridge; 92: a cartridge loading member; w (W1, W2): a workpiece; u: a workpiece holding unit; U1A, U1B: a conveying tray unit; u2: a frame unit.
Detailed Description
Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include components that can be easily conceived by those skilled in the art or substantially the same components. Further, the structures described below may be combined as appropriate. Various configurations may be omitted, and substitutions and changes may be made without departing from the scope of the present invention.
[ embodiment mode 1 ]
A description will be given of a configuration example of a processing apparatus and a workpiece conveying tray according to embodiment 1. Fig. 1 is a perspective view showing a configuration example of a processing apparatus according to embodiment 1. Fig. 2 is a front view showing a configuration example of the cartridge of embodiment 1. Fig. 3 is a perspective view showing a configuration example of a workpiece according to embodiment 1. Fig. 4 is a perspective view showing a configuration example of the conveyance tray according to embodiment 1. Fig. 5 is a perspective view showing an example of placement of a workpiece on the conveyance tray according to embodiment 1. Fig. 6 is a cross-sectional view of a P-P arrow showing an example of placement of a workpiece on the conveyance tray according to embodiment 1.
The machining apparatus 1 machines a workpiece W. As shown in fig. 1, the processing apparatus 1 includes a chuck table 10A, a processing member 20, a processing feed member 30, a cutting feed member 40, a 1 st conveyance member 50, a 2 nd conveyance member 60, a rail 70 for temporary placement, a cleaning member 80, a cassette mechanism 90, an index feed member not shown, and a control member not shown.
The chuck table 10A is disposed on the upper surface of the apparatus main body 2 so as to be movable in the X-axis direction. The chuck table 10A is formed in a disk shape and has a holding surface 11a and a clamping portion 12. The chuck table 10A is rotated by a rotation member, not shown, by a rotation axis perpendicular to the center of the holding surface 11 a. The holding surface 11a is an upper end surface of the chuck table 10A in the vertical direction, and is formed flat with respect to a horizontal plane. The holding surface 11a is made of, for example, a porous ceramic material, and sucks and holds the workpiece W in the workpiece holding unit U (for example, the conveyance tray unit U1A or the frame unit U2) by a negative pressure of a vacuum suction source (not shown). The clamping portion 12 clamps the workpiece holding unit U, and vertically clamps and holds the outer peripheral edge of the workpiece holding unit U.
The machining member 20 machines the workpiece W held on the chuck table 10A. The processing member 20 is disposed on the 1 st gate frame 3 via the index feed member and the cutting feed member 40. Here, the 1 st gate frame 3 is provided upright on the apparatus main body 2 so as to cross a movement path of the chuck table 10A in the X axis direction in the Y axis direction. The processing member 20 includes: a cutting tool 21 for cutting a workpiece W, a spindle 22 detachably attached to the cutting tool 21, and a housing 23 for supporting the spindle 22 to be rotatable about a rotation axis in the Y-axis direction.
The machining feed member 30 relatively moves the chuck table 10A and the machining member 20 in the X-axis direction. For example, the machining feed means 30 has a drive source such as a ball screw, a pulse motor, and the like, not shown, extending in the X-axis direction, and moves an X-axis moving base, not shown, that supports the chuck table 10A in the X-axis direction.
The indexing member relatively moves the chuck table 10A and the processing member 20 in the Y-axis direction. For example, the indexing-feed member has a driving source such as a ball screw, a pulse motor, and the like, not shown, extending in the Y-axis direction, and moves a Y-axis moving base, not shown, that supports the plunge-feed member 40 in the Y-axis direction.
The cutting and feeding member 40 moves the processing member 20 in the Z-axis direction substantially perpendicular to the holding surface 11a of the chuck table 10A. For example, the cutting and feeding means 40 has a driving source such as a ball screw, a pulse motor, and the like, not shown, extending in the Z-axis direction, and moves a Z-axis moving member, not shown, supporting the processing means 20 in the Z-axis direction.
The 1 st conveying member 50 is disposed on the 2 nd gate frame 4 so as to be movable in the Y, Z axial direction, and is driven by an actuator not shown. Here, the 2 nd gate frame 4 is erected on the apparatus main body 2 so as to cross the movement path of the chuck table 10A in the Y-axis direction, similarly to the 1 st gate frame 3. The 1 st conveying member 50 has a nip portion 51 and a suction portion 52. The 1 st conveying member 50 takes out the workpiece holding unit U to which the workpiece W before processing is fixed by clamping the workpiece holding unit U from the cassette mechanism 90 by the clamp 51, and temporarily places the workpiece holding unit U on the pair of temporarily placing rails 70. Then, the 1 st conveying member 50 sucks and holds the workpiece holding unit U temporarily placed on the rail 70 by the suction portion 52 and conveys it to the chuck table 10A. The 1 st conveying member 50 temporarily mounts the workpiece holding unit U, to which the cleaned workpiece W is fixed, on the rail 70 by suction holding.
The 2 nd conveying member 60 is disposed on the 2 nd gate frame 4 so as to be movable in the X, Y, Z axial direction, and is driven by an actuator not shown. The 2 nd conveying member 60 has a suction portion 61, and temporarily places a workpiece holding unit U, which holds the processed workpiece W on the chuck table 10A and to which the processed workpiece W is fixed, on the rail 70. Then, the 2 nd conveying member 60 sucks and holds the processed object holding unit U temporarily placed on the rail 70 by the suction portion 61 and conveys the same to the cleaning member 80.
The cleaning member 80 cleans and dries the workpiece W in the workpiece holding unit U. The cleaning member 80 includes a rotary table 81 for holding the workpiece holding unit U. The cleaning member 80 sucks and holds the workpiece holding unit U by the rotary table 81, rotates the unit U at a high speed, sprays a cleaning liquid such as pure water toward the workpiece W to clean the workpiece W, and sprays clean air (compressed air) or the like toward the workpiece W to dry the workpiece W.
The cassette mechanism 90 houses the workpiece holding unit U, and includes a cassette 91 and a cassette mounting member 92. For example, the cassette 91 houses a plurality of workpiece holding units U. As shown in fig. 2, the cassette 91 has an opening 91a for carrying in and out and a storage rack 91 b. The opening 91a of the cassette 91 is disposed to face the 1 st conveying member 50, and the object holding unit U is carried in and out by the 1 st conveying member 50. The storage rack 91b has a plurality of support plates 91c that support the workpiece holding unit U and protrude from the opposite side walls in the width direction (X-axis direction) of the cassette 91. The support plates 91c are disposed at equal intervals in the height direction (Z-axis direction). The interval of the support plates 91c in the height direction is set to be larger than the thickness of the workpiece holding unit U. A pair of support plates 91c facing each other in the width direction of the cassette 91 horizontally support the workpiece holding unit U. In embodiment 1, 3 transport tray units U1A and 5 conventional frame units U2 are stored in a cassette 91, the transport tray unit U1A supports a workpiece W1 by the transport tray 5 of the present invention, and the frame unit U2 supports a workpiece W2 through an adhesive tape T in an opening of an annular frame F.
The cartridge mounting member 92 mounts the cartridge 91 so as to be movable up and down in the Z-axis direction. The cartridge mounting member 92 includes a cartridge mounting region 92a and a not-shown elevating member that elevates the mounting region 92a in the Z-axis direction. In the cassette mounting area 92a, the cassette 91 is mounted such that the opening 91a of the cassette 91 faces the 1 st conveying member 50. The cassette mounting member 92 moves up and down the cassette 91 mounted on the cassette mounting area 92a by the lifting member, thereby positioning the cassette 91 at a position where the object holding unit U is carried in and out by the 1 st conveying member 50.
The conveyance tray unit U1A is composed of a workpiece W1 and a conveyance tray 5. The object W1 is a material in which a semiconductor device is formed on a substrate such as silicon or gallium arsenide or an optical device is formed on a substrate such as sapphire or SiC, and is a semiconductor wafer or an optical device wafer, an inorganic material substrate, a ductile resin material substrate, a ceramic substrate, a glass plate, or other various processing materials. As shown in fig. 3, the workpiece W1 is formed in a rectangular plate shape.
The conveyance tray 5 is a member used when the workpiece W1 is carried into and out of the chuck table 10A or the cleaning member 80. As shown in fig. 4, the conveyance tray 5 has a main frame portion 5a formed in the same outer shape as the ring frame F. The outer diameter of the main frame 5a is not limited to the same outer diameter as the annular frame F as long as the 1 st and 2 nd conveying members 50 and 60 can convey the same in the same manner as the annular frame F and can hold the same by the chuck table 10A. The main frame portion 5a has an opening portion 5b, and the opening portion 5b has an inner periphery larger than the outer shape of the workpiece W1. The opening 5b has a function of fixing the workpiece W1, and includes: an opening upper portion 5c having an opening slightly larger than the outer shape of the workpiece W1; an outer peripheral support portion 5d formed below the opening portion 5b and supporting an outer peripheral portion of the workpiece W1; and a movement restriction unit 5e for restricting the movement of the workpiece W1 in the planar direction.
The outer peripheral support portion 5d is formed to protrude from the inner periphery of the lower portion of the opening portion 5b toward the center by a predetermined length. For example, as the outer peripheral support portion 5d, a plate-like member having a constant width is fixed to an inner peripheral wall surface of a lower portion of an opening hole formed by opening the main body frame portion 5 by welding, an adhesive, or the like along a circumferential direction of the inner peripheral wall surface. The outer peripheral support portion 5d is formed as an opening slightly smaller than the outer shape of the workpiece W1. A synthetic resin such as silicon is formed on the entire support surface 5f of the outer peripheral support portion 5 d. As shown in fig. 6, the outer peripheral support portion 5d supports the outer peripheral region on the lower surface side of the workpiece W1 placed on the opening portion 5 b.
The movement restricting portion 5e is formed on the boundary between the outer peripheral support portion 5d and the main frame portion 5a, that is, the inner peripheral wall surface of the opening portion 5 b. The movement restricting portion 5e is formed substantially perpendicular to the surface direction of the main frame portion 5 a. The movement restriction portion 5e abuts against the side surface W1c of the workpiece W1 placed on the opening portion 5b to restrict the movement of the workpiece W1 in the surface direction. Further, although there is a gap between the movement restriction portion 5e and the side surface W1c of the workpiece W1, there is no problem in processing even if there is a gap between the workpiece W1 and the side surface W1c of the workpiece W1 because alignment is performed when the workpiece W1 is processed.
The control means controls each component of the processing apparatus 1. For example, the control means is connected to a drive circuit, not shown, of a pulse motor that drives the machining feed means 30, the indexing feed means, and the cutting feed means 40, and controls the drive circuit to determine the position of the chuck table 10A in the X-axis direction and the position of the machining means 20 in the Y-axis direction and the Z-axis direction.
Next, an operation example of the processing apparatus according to embodiment 1 will be described. When the workpiece W is processed, first, the control means of the processing apparatus 1 controls the cassette mounting means 92 to move the cassette 91 up and down in the Z-axis direction to position the cassette at a predetermined position. Next, the control means controls the 1 st conveying means 50 to take out the object holding unit U to be processed, for example, the conveying tray unit U1A, stored in the cassette 91 and temporarily set it on the rail 70. For example, the 1 st conveying member 50 takes out the conveying tray unit U1A from the cassette 91 by clamping the main frame portion 5a of the conveying tray unit U1A by the clamping portion 51.
Next, the control means controls the 1 st conveyance means 50, and conveys the conveyance tray unit U1A temporarily placed on the rails 70 to the chuck table 10A while holding it by suction by the suction portion 52. For example, as shown in fig. 7, the 1 st conveying member 50 conveys the conveying tray unit U1A to the chuck table 10A by suction-holding the outer peripheral portion of the main body frame portion 5a by the suction pads 52a of the suction portion 52. At this time, the workpiece W1 of the conveyance tray unit U1A is restricted from moving in the planar direction by the movement restricting portion 5e and is fixed to the opening 5 b. The chuck table 10A suctions and holds the conveyance tray unit U1A by the holding surface 11 a. As shown in fig. 8, as the chuck table 10A, after the suction pads 52a of the suction portion 52 are released from the outer peripheral portion of the main frame portion 5a, the outer peripheral edge of the main frame portion 5a is clamped by the clamping portion 12. Since the synthetic resin is formed on the support surface 5f of the outer peripheral support portion 5d, the workpiece W1 supported by the support surface 5f and the holding surface 11a of the chuck table 10A are in an airtight state. Thus, when a negative pressure is applied to the holding surface 11a, the workpiece W1 is sucked and held on the holding surface 11a via the outer circumferential support portion 5 d.
Next, the control means performs alignment of the object W1 of the conveyance tray unit U1A held on the chuck table 10A. The control means controls the machining means 20 to perform cutting on the workpiece W1. For example, the machining member 20 is cut by the cutting tool 21 to the middle of the workpiece W1 without cutting the workpiece W1 completely. When the cutting of the workpiece W1 is completed, the control means controls the 2 nd conveying means 60 to temporarily place the conveying tray unit U1A held on the chuck table 10A on the rail 70. Then, the control unit controls the 2 nd conveyance unit 60 to convey the conveyance tray unit U1A temporarily placed on the rails 70 to the cleaning unit 80. Next, the control unit controls the cleaning unit 80 to clean and dry the workpiece W1 of the conveyance tray unit U1A. The control unit controls the 1 st conveyance unit 50 to temporarily place the conveyance tray unit U1A, which has been cleaned and dried by the cleaning unit 80 with respect to the workpiece W1, on the rail 70. The control means controls the 1 st conveying means 50 and the cassette mechanism 90 to store the conveying tray unit U1A temporarily placed on the rails 70 in the predetermined storage rack 91b of the cassette 91.
As described above, the conveyance tray 5 according to embodiment 1 includes the outer peripheral support portion 5d that supports the outer peripheral region on the lower surface side of the workpiece W1, and the movement restricting portion 5e that restricts the movement of the workpiece W1 in the planar direction. Accordingly, when it is not necessary to perform full cutting for completely separating the workpiece W1, the workpiece W1 can be fixed by simply placing it on the conveyance tray 5, so that the adhesive tape T is not necessary, and the processing cost can be significantly reduced. Further, since the work of attaching and fixing the adhesive tape T to the ring frame F and the work W2 to the adhesive tape T attached to the ring frame F as in the conventional art is omitted, the labor for the work can be reduced. Further, since the conveying tray 5 is formed to have the same outer diameter as the conventional annular frame F, the workpiece W1 can be conveyed without modifying the conventional conveying member, and therefore, the effect of not incurring the introduction cost is achieved.
[ modified example ]
Next, a modification of embodiment 1 will be described. Although the example in which 1 workpiece W1 is fixed to the conveyance tray 5 has been described, a plurality of workpieces W1 may be fixed to the conveyance tray 5. In this case, for example, a plurality of openings 5b are provided in the main frame portion 5a of the transport tray 5, and the workpiece W1 is fixed to each of the openings 5 b.
Further, the outer peripheral support portion 5d is described as an example of a separate molding in which a plate-like member having a constant width is fixed by welding, an adhesive, or the like along the circumferential direction of the inner peripheral wall surface on the inner peripheral wall surface of the lower portion of the opening hole formed by opening the main frame portion 5, but the outer peripheral support portion 5d may be integrally molded with the main frame portion 5. In addition, when the outer peripheral support portion 5d and the main frame portion 5 are molded separately, a recess for fitting the outer peripheral support portion 5d of the plate-like member may be provided in the inner peripheral wall surface of the lower portion of the opening of the main frame portion 5 so that the outer peripheral support portion 5d is firmly fixed to the main frame portion 5, and the outer peripheral support portion 5d may be fixed to the recess of the main frame portion 5.
[ embodiment 2 ]
Next, a description will be given of a configuration example of a workpiece conveying tray according to embodiment 2. Fig. 9 is a cross-sectional view showing an example of placement of a workpiece on the conveyance tray according to embodiment 2. Fig. 10 is a cross-sectional view showing an example of carrying in a conveyance tray in which a workpiece is placed on a chuck table in embodiment 2. Fig. 11 is a cross-sectional view showing a processing example of processing a workpiece held on a chuck table in embodiment 2.
The conveyance tray 6 of embodiment 2 is different from embodiment 1 in that it has a configuration applicable to a chuck table 10B formed in a circular and convex shape.
The conveyance tray 6 is a member used for carrying the workpiece W1 in and out of the convex chuck table 10B or the cleaning member 80. As shown in fig. 9, the conveyance tray 6 has a main frame portion 6a formed in the same outer shape as the ring frame F. The outer diameter of the main frame 6a is not limited to the same outer diameter as the annular frame F as long as the 1 st and 2 nd conveying members 50 and 60 can convey the conveying tray 6 in the same manner as the annular frame F. The main frame 6a has an opening 6b, and the opening 6b has an inner periphery larger than the outer shape of the workpiece W1. The opening 6b has a function of fixing the workpiece W1, and includes: an opening upper portion 6c having an opening slightly larger than the outer shape of the workpiece W1; an outer peripheral support portion 6d formed below the opening portion 6b and supporting an outer peripheral portion of the workpiece W1; and a movement restriction unit 6e for restricting movement of the workpiece W1.
The outer peripheral support portion 6d is formed to protrude from the inner periphery of the lower portion of the opening portion 6b by a predetermined length toward the center. For example, the outer peripheral support portion 6d is obtained by fixing a plate-like member having a constant width to the inner peripheral wall surface of the lower portion of the opening hole formed by opening the main body frame portion 6 by welding, an adhesive, or the like along the circumferential direction of the inner peripheral wall surface. The outer peripheral support portion 6d has an opening slightly smaller than the outer shape of the workpiece W1. As shown in fig. 9, the outer peripheral support portion 6d supports the outer peripheral region on the lower surface side of the workpiece W1 placed on the opening portion 6 b.
Here, when the work W1 fixed to the opening 6B of the conveyance tray 6 is sucked and held by the convex chuck table 10B, the holding surface 11B of the convex chuck table 10B is inserted into the opening 6B of the conveyance tray 6. At this time, since the holding surface 11b directly contacts the bottom surface of the workpiece W1 and performs suction holding, synthetic resin need not be formed on the support surface 6f of the outer peripheral support portion 6 d. Further, the width-directional length H1 of the outer peripheral support portion 6d is formed shorter than the width-directional length H2 of the outer peripheral support portion 5d according to embodiment 1. This is because the holding surface 11B of the convex chuck table 10B needs to firmly suck and hold the workpiece W1, and therefore, the region in contact with the bottom surface of the workpiece W1 is designed to be as large as possible, and the inner periphery of the outer peripheral support portion 6d needs to be larger than the outer periphery of the holding surface 11B.
The movement restricting portion 6e is formed on the boundary between the outer peripheral support portion 6d and the main frame portion 6a, i.e., the inner peripheral wall surface of the opening portion 6 b. The movement restricting portion 6e is formed substantially perpendicular to the surface direction of the main body frame portion 6 a. The movement regulating portion 6e abuts against the side surface W1c of the workpiece W1 placed on the opening portion 6b, and regulates the movement of the workpiece W1 in the surface direction.
Next, a conveying example of conveying the workpiece W1 using the conveying tray 6 will be described. As shown in fig. 10, the 1 st conveying member 50 conveys the outer periphery of the main frame portion 6a to the convex chuck table 10B by sucking and holding the outer periphery by the suction pad 52a of the suction portion 52. At this time, the workpiece W1 of the conveyance tray unit U1B is restricted from moving in the planar direction by the movement restricting portion 6e and is fixed to the opening 6 b. As shown in fig. 11, the convex chuck table 10B sucks and holds only the workpiece W1 of the conveyance tray unit U1B by the holding surface 11B. For example, when the conveyance tray unit U1B is placed on the convex chuck table 10B, the holding surface 11B pushes up the workpiece W1 from the conveyance tray 6, and the holding surface 11B abuts against the back surface of the workpiece W1 to suck and hold the workpiece W1. In a state where the workpiece W1 is sucked and held on the holding surface 11b, the machining member 20 performs a cutting process on the workpiece W1.
As described above, the conveyance tray 6 according to embodiment 2 includes the outer circumferential support portion 6d formed such that the length H1 in the width direction is shorter than the outer circumferential support portion 5d of embodiment 1; and a movement regulating section 6e for regulating the movement of the workpiece W1 in the planar direction, whereby the workpiece W1 can be efficiently conveyed to the convex chuck table 10B with the same effect as that of embodiment 1. For example, when the holding surface 11B is designed to expand the area in contact with the bottom surface of the workpiece W1 as much as possible in order to strongly suck and hold the workpiece W1, the workpiece W1 can be carried into the convex chuck table 10B without the outer peripheral support portion 6d colliding with the holding surface 11B.
[ modified example ]
Next, a modification of embodiment 2 will be described. The outer peripheral support portion 6d is formed by a separate molding in which a plate-like member having a constant width is fixed to an inner peripheral wall surface of a lower portion of an opening hole formed by opening the main frame portion 6 by welding, an adhesive, or the like along a circumferential direction of the inner peripheral wall surface, but the outer peripheral support portion 6d may be formed integrally with the main frame portion 6. In addition, when the outer peripheral support portion 6d and the main frame portion 6 are molded separately, a recess for fitting the outer peripheral support portion 6d of the plate-like member may be provided in the inner peripheral wall surface of the lower portion of the opening of the main frame portion 6, and the outer peripheral support portion 6d may be fixed to the recess of the main frame portion 6, in order to firmly fix the outer peripheral support portion 6d to the main frame portion 6.

Claims (1)

1. A pallet for conveying a workpiece, in a processing device having a chuck table, a processing member, a cassette mounting area, and a conveying member, the conveying tray is used when the plate-shaped object to be processed is carried in and out relative to the chuck worktable, the chuck table has a holding surface for holding the workpiece supported by the frame unit, the frame unit supports the processed object through an adhesive tape in an opening of the annular frame, the processing member processes the processed object held on the chuck worktable, the cassette mounting area mounts a cassette accommodating a plurality of the frame units, and the conveying member supports the annular frame between the cassette mounted in the cassette mounting area and the chuck table to convey the frame units, wherein the conveying tray for the workpiece includes:
an annular main frame portion having an inner periphery larger than an outer shape of the plate-shaped workpiece;
an outer peripheral support portion that protrudes from an inner periphery of the main frame portion toward a center and supports an outer peripheral region on a lower surface side of the workpiece; and
a movement restricting portion formed at a boundary between the main frame portion and the outer peripheral support portion, for restricting movement of the workpiece placed thereon in a plane direction,
the main frame portion is formed to have the same outer diameter as the annular frame and is capable of being housed in the case.
CN201610186899.XA 2015-04-08 2016-03-29 Conveying tray for processed object Active CN106057715B (en)

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CN106057715A (en) 2016-10-26
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TW201705339A (en) 2017-02-01
JP6491017B2 (en) 2019-03-27
TWI689027B (en) 2020-03-21

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