JP2017199863A - cassette - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cassette capable of accommodating workpieces of different sizes and reducing burden on an operator.SOLUTION: A cassette 30 includes: a first cassette unit 80 and a second cassette unit 90 having different side wall spacings; and a connection plate 100 connecting the first cassette unit 80 and the second cassette unit 90. The second cassette part 90 is connected onto the first cassette part 80 via the connection plate 100. Further, the first cassette unit 80 and the second cassette unit 90 are made to be detachable using positioning pins 88, 103.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a cassette for accommodating a plurality of plate-like workpieces such as semiconductor wafers.

  In general, a processing apparatus that performs laser processing or cutting processing on a workpiece such as a semiconductor wafer, an optical device wafer (formed of sapphire, SiC, or the like), a package substrate, or a ceramic substrate is known (for example, Patent Document 1). 2). There is also known a grinding apparatus that performs a grinding process for thinning these plate-like workpieces with a grindstone (see, for example, Patent Document 3). When a workpiece is set in these apparatuses, a cassette having a plurality of guide rails in the height direction and inserting and storing the workpiece along each guide rail is widely used. These cassettes usually contain workpieces of the same size (size).

JP2015-119003A JP 2014-222748 A Japanese Patent Laid-Open No. 2002-66865

  By the way, in the above-described processing apparatus or grinding apparatus (hereinafter referred to as a processing apparatus or the like), the size of a workpiece to be processed may be changed. In this case, the cassette that accommodates the workpiece before the change is removed from the machining apparatus or the like, and another cassette that accommodates the workpiece having a different size is newly mounted on the machining apparatus or the like. For this reason, every time the size of the workpiece is changed, the processing operation is interrupted by the operation of changing the cassette, which increases the burden on the worker and may cause a problem of reducing the processing efficiency of the workpiece. is there. In particular, in an apparatus for processing a small amount of various kinds of workpieces, the size of the workpiece is frequently changed. In this case, for example, several sheets are placed in a general cassette having 25-step guide rails. In many cases, workpieces are accommodated, and the workload of workers is often increased.

  This invention is made | formed in view of the above, Comprising: It aims at providing the cassette which can accommodate the workpiece of a several different magnitude | size, and can reduce a worker's burden.

  In order to solve the above-described problems and achieve the object, the present invention includes an upper wall, a bottom wall, and a pair of side walls that face each other in parallel with a space therebetween and connect the upper wall and the bottom wall. A cassette in which a plurality of guide rails for supporting a plate-shaped workpiece to be housed are installed inside the side wall, wherein the side wall interval is set to a first interval, And a second cassette part in which the interval between the side walls is set to a second interval different from the first interval, and the second cassette part is detachably connected to the first cassette part. And

  According to this configuration, a plurality of cassette portions having different side wall intervals are provided, and by making these cassette portions detachable, workpieces having different sizes can be accommodated in each cassette, and these cassette portions can be easily attached and detached. can do. As a result, when changing the size of the workpiece, by storing the workpieces of a desired size in a plurality of cassette portions in advance, the work of replacing the cassette becomes unnecessary, and the operator's work The burden can be reduced.

  In this configuration, the first cassette portion and the second cassette portion may be configured to be detachable via a connecting plate. The workpiece may be held on the guide rail in the form of a frame unit supported by an adhesive tape at the opening of the annular frame.

  According to the present invention, by providing a plurality of cassette portions with different side wall intervals and making these cassette portions detachable, workpieces having different sizes can be accommodated in each cassette, and these cassette portions can be easily attached and detached. can do. As a result, when changing the size of the workpiece, by storing the workpieces of a desired size in a plurality of cassette portions in advance, the work of replacing the cassette becomes unnecessary, and the operator's work The burden can be reduced.

FIG. 1 is a perspective view of a processing apparatus on which a cassette according to the first embodiment is mounted. FIG. 2 is an exploded perspective view of the cassette according to the first embodiment. FIG. 3 is a side sectional view of the cassette. FIG. 4 is a perspective view of a cassette according to the second embodiment. FIG. 5 is an exploded perspective view of the cassette. FIG. 6 is a side sectional view of the cassette. FIG. 7 is an enlarged perspective view showing a connection configuration between the second cassette portion and the first cassette portion. FIG. 8A is a schematic diagram illustrating a connecting operation between the connecting hole and the connecting piece. FIG. 8-2 is a schematic diagram illustrating a connecting operation between the connecting hole and the connecting piece. FIG. 8-3 is a schematic diagram illustrating a connection operation between the connection hole and the connection piece. FIG. 9A is a diagram illustrating a second package substrate as an example of a workpiece. FIG. 9-2 is a diagram illustrating a first package substrate as an example of a workpiece.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

[First Embodiment]
FIG. 1 is a perspective view of a processing apparatus on which a cassette according to the first embodiment is mounted. The processing apparatus 1 is an apparatus that performs a cutting process on a wafer W (workpiece) such as a disk-shaped semiconductor wafer or an optical device wafer. The workpiece includes not only the disk-shaped wafer W but also a package substrate, a ceramic substrate, a glass substrate and the like formed in a rectangular shape. As shown in FIG. 1, the processing apparatus 1 is disposed on a rectangular parallelepiped base 2 and holds a wafer unit (frame unit) WU having the wafer W, and a wafer held by the chuck table 10. And a cutting unit 20 for cutting the wafer W of the unit WU. In this configuration, the wafer W as a workpiece includes a first wafer W1 and a second wafer W2 formed smaller than the first wafer W1. Similarly, the wafer unit WU includes a first wafer unit WU1 having a first wafer W1, and a second wafer unit WU2 having a second wafer W2 and being smaller than the first wafer unit WU1. In addition, when not distinguishing the 1st wafer W1 and the 2nd wafer W2, it describes only as the wafer W. The same applies to the wafer unit WU. Moreover, as a magnitude | size of the wafer W, the diameter of 200 mm and 300 mm is mentioned, for example. Moreover, as a magnitude | size of the wafer unit WU, a thing with a diameter of 230 mm, 300 mm, or 400 mm is mentioned, for example.

  Further, the processing apparatus 1 includes a cassette mounting mechanism (cassette mounting table) 40 on which a cassette 30 that houses the first wafer unit WU1 and the second wafer unit WU2 before and after the cutting process is mounted, and a wafer after the cutting process. And a cleaning unit 50 for cleaning the unit WU. The cassette placing mechanism 40 moves the cassette 30 placed on the cassette placing mechanism 40 up and down in the Z-axis direction (vertical direction). Further, the processing apparatus 1 includes a cassette transport unit 60 that transports the wafer unit WU between the cassette 30 and the chuck table 10, and a cleaning transport unit 70 that transports the wafer unit WU between the chuck table 10 and the cleaning unit 50. With.

  As shown in FIG. 1, the first wafer unit WU1 includes a first frame F1 formed in an annular shape, and a first wafer W1 formed in a disk shape disposed in the opening Fa1 of the first frame F1. The first wafer W1 and the adhesive tape T attached to the back surface of the first frame F1 are provided. In the present embodiment, the first wafer W1 is held by the adhesive tape T in the opening Fa1 of the first frame F1. The first wafer W1 has devices such as ICs and LSIs formed in a large number of regions partitioned by streets (division lines) formed in a lattice pattern on the surface. The second wafer unit WU2 is different in that the size (size) is smaller than that of the first wafer unit WU1. Specifically, the second wafer W2 is formed smaller than the first wafer W1, and similarly, the second frame F2 and the opening Fa2 are also formed smaller than the first frame F1 and the opening Fa1. Other configurations are the same and will not be described.

  The chuck table 10 is provided on the base 2 so as to be movable in the X-axis direction (cutting feed direction). The chuck table 10 has a holding surface 11 on which the wafer unit WU is placed and sucked. The chuck table 10 is configured to be rotatable about the Z axis as a rotation axis by a rotation mechanism (not shown).

  Further, on the upper surface of the base 2, portal-type support structures 12 and 14 are provided that extend along the Y-axis direction (index direction) and are disposed across the chuck table 10. One support structure 14 is provided with a cutting unit 20 movably in the Y-axis direction (index direction) and the Z-axis direction (vertical direction). The cutting unit 20 includes a cutting blade 21 mounted on a rotating spindle (not shown) that is driven to rotate, and the cutting blade 21 descends in the Z-axis direction while rotating, thereby cutting the surface of the wafer W. Is done. In the processing apparatus 1 shown in FIG. 1, the cutting unit 20 including the cutting blade 21 is exemplified as the processing means. However, laser irradiation is performed on the wafer W by irradiating the wafer W with a laser beam. It is good also as a structure provided with a part as a process means.

  The other support structure 12 is provided with a cassette transport section 60. The cassette transport unit 60 transports the wafer unit WU to the cassette 30 along the Y-axis direction (carrying in / out direction) parallel to the above-described indexing direction. The cassette transport unit 60 includes a guide rail 61 that is disposed on the side surface of the support structure 12 and is parallel to the Y-axis direction, and a moving unit 62 that is slidable on the guide rail 61. The moving unit 62 includes a nut portion (not shown) on the side facing the guide rail 61, and this nut portion is attached to a ball screw 61 </ b> A provided on the guide rail 61 so as to freely advance and retract. A pulse motor (not shown) is connected to one end of the ball screw 61A. When the ball screw 61A is rotated by the pulse motor, the moving unit 62 moves along the guide rail 61 in the Y-axis direction. The moving unit 62 includes a cylinder portion 63 that extends downward in the Z-axis direction (vertical direction), a holding portion 64 that is coupled to the lower end portion of the cylinder portion 63, and a gripping portion 65 that is provided on the holding portion 64. Prepare. The cylinder part 63 expands and contracts in the Z-axis direction (vertical direction), and adjusts the height position of the holding part 64 and the grip part 65 in the Z-axis direction. The holding part 64 is formed in an H shape, and a vacuum pad (not shown) is provided at the lower part of the tip of the holding part 64. This vacuum pad holds the wafer unit WU by sucking the surface of the frame F of the wafer unit WU. The gripping portion 65 is provided at the front end portion in the Y-axis direction so as to face the cassette 30 and grips the edge portion of the frame F of the wafer unit WU. The wafer unit WU is gripped by the gripping portion 65, and the wafer unit WU is carried out from the cassette 30 to the rail 13 described later or from the rail 13 into the cassette 30.

  As with the cassette transport unit 60, the cleaning transport unit 70 is provided on the support structure 12, and transports the wafer unit WU to the cleaning unit 50 along the Y-axis direction (the carry-in / out direction) parallel to the indexing direction described above. To do. The cleaning and conveying unit 70 includes a guide rail 71 that is disposed on the side surface of the support structure 12 and is parallel to the Y-axis direction, and a moving unit 72 that is slidable on the guide rail 71. The moving unit 72 includes a nut portion (not shown) on the side facing the guide rail 71, and this nut portion is attached to a ball screw 71 </ b> A provided on the guide rail 71 so as to freely advance and retract. A pulse motor (not shown) is connected to one end of the ball screw 71A. When the ball screw 71A is rotated by the pulse motor, the moving unit 72 moves in the Y-axis direction along the guide rail 71. The moving unit 72 includes an arm portion 73 extending from the guide rail 71 in the X-axis direction, a cylinder portion 74 extending downward from the tip of the arm portion 73 in the Z-axis direction (vertical direction), and a lower end of the cylinder portion 74. The holding part 75 provided is provided. The holding portion 75 is formed in an H shape, and a vacuum pad (not shown) is provided at the lower part of the tip of the holding portion 75. This vacuum pad holds the wafer unit WU by sucking the surface of the frame F of the wafer unit WU. The cylinder part 74 extends and contracts in the Z-axis direction (vertical direction), and adjusts the height position of the holding part 75 in the Z-axis direction.

  In the present embodiment, the cassette 30 and the cleaning unit 50 are located on the transport path of the cassette transport unit 60 and the cleaning transport unit 70, and the base is sandwiched by an area where the chuck table 10 can move in the X-axis direction. 2 on both sides. Further, the cassette 30 is formed with an opening on the cassette transport unit 60 side, and the cleaning unit 50 is formed with an upper surface opened. A pair of rails 13 and 13 on which the wafer unit WU is temporarily placed are provided between the cassette 30 and the cleaning unit 50. On the rails 13 and 13, an unprocessed wafer unit WU unloaded from the cassette 30 by the gripping unit 65 of the cassette transport section 60 or a processed wafer unit WU loaded into the cassette 30 is temporarily placed. . The unprocessed wafer unit WU temporarily placed on the rails 13 and 13 is sucked and held by the vacuum pad of the holding unit 64 of the cassette transfer unit 60 and transferred from the rail 13 to the chuck table 10. The wafer unit WU that has been cut on the chuck table 10 is sucked and held by the vacuum pad of the holding unit 75 of the cleaning transfer unit 70 and transferred to the cleaning unit 50. The wafer unit WU cleaned by the cleaning unit 50 is sucked and held by the vacuum pad of the holding unit 64 of the cassette transport unit 60 and temporarily placed on the rail 13 from the cleaning unit 50. Further, the rails 13 and 13 are configured to be movable in the X-axis direction so as to approach or separate from each other. The rails 13 and 13 come close to each other with the wafer unit WU placed thereon, so that the center position of the wafer unit WU is positioned at a predetermined position. The center of the WU can be aligned. Similarly, the rails 13 and 13 can be aligned with the center of the cassette 30 and the center of the wafer unit WU by being close to each other with the wafer unit WU mounted thereon.

  By the way, in this kind of processing apparatus 1, the size of the wafer W to be processed may be changed. In this case, generally, the cassette for storing the wafer W before the change is removed from the cassette mounting mechanism 40 of the processing apparatus 1, and another cassette for storing the wafer W having a different size is newly added to the cassette mounting mechanism 40. Mounted on. As described above, every time the size of the wafer W is changed, an operation of changing the cassette is required. Therefore, the processing operation is interrupted by the change operation, and the burden on the worker is increased, and the processing efficiency of the wafer W is reduced. May cause problems. In particular, in the processing apparatus 1 that processes a small amount of various types of wafers W, the size of the wafer W is frequently changed. In this case, for example, only a few sheets are provided in a general cassette having 25-step guide rails. In many cases, the wafer W is accommodated, and the work load of the worker is often increased.

  This structure is characterized by the structure of a cassette that can accommodate wafers W of different sizes. Next, the cassette 30 will be described. FIG. 2 is an exploded perspective view of the cassette according to the first embodiment, and FIG. 3 is a side sectional view of the cassette. As shown in FIG. 2, the cassette 30 includes a first cassette unit 80, a second cassette unit 90, and a connecting plate 100 that connects the first cassette unit 80 and the second cassette unit 90. In the first embodiment, the first cassette unit 80 is formed larger than the second cassette unit 90 in the width direction (X-axis direction) and the depth direction (Y-axis direction). The first cassette unit 80 is mounted on the cassette mounting mechanism 40, and the second cassette unit 90 is connected to the first cassette unit 80 via the connection plate 100.

  As shown in FIG. 3, the first cassette unit 80 includes an upper wall 81, a bottom wall 82, a pair of side walls 83, 83, and an opening formed by the upper wall 81, the bottom wall 82, and the side walls 83, 83. The back wall 84 (FIG. 2) which closes is comprised. The side walls 83, 83 are opposed to each other in parallel with a first interval L 1, and connect the upper wall 81 and the bottom wall 82. Further, a plurality of guide rails 85 for supporting the first wafer unit WU1 are formed on the inner surfaces 83A and 83A of the side walls 83 and 83, respectively. An opening 80A is formed on the front side of the first cassette unit 80, and the first wafer unit WU1 is carried in or out through the opening 80A. On the upper surface 81 </ b> A of the upper wall 81, a protruding portion 86 protruding upward is provided, and a handle 87 is attached to the protruding portion 86. The handle 87 is configured to fall around the protrusion 86. Further, on the upper surface 81A of the upper wall 81, for example, positioning pins 88 are provided at the edge portions located above the side walls 83, 83. The positioning pins 88 are used for positioning when the first cassette unit 80 and the connecting plate 100 are connected. In addition, a positioning hole 89 is provided in the bottom surface 82A of the bottom wall 82, for example, at an edge located below the side walls 83, 83. The positioning hole 89 is for installing the first cassette unit 80 at a predetermined position, and is formed, for example, at a position and size that fits the positioning pin 41 provided in the cassette mounting mechanism 40. As a result, the first cassette unit 80 is arranged so that the positioning holes 89 fit into the positioning pins 41 of the cassette mounting mechanism 40, so that the first cassette unit 80 can be easily placed at a specified position on the cassette mounting mechanism 40. Can be installed.

  As shown in FIG. 3, the second cassette unit 90 includes an upper wall 91, a bottom wall 92, a pair of side walls 93, 93, and an opening formed by the upper wall 91, the bottom wall 92, and the side walls 93, 93. The back wall 94 (FIG. 2) which closes is comprised. The side walls 93, 93 are arranged to face each other in parallel with a second interval L 2 that is smaller than the first interval L 1 of the first cassette unit 80, and connect the upper wall 91 and the bottom wall 92. A plurality of stages of guide rails 95 that support the second wafer unit WU2 are formed on the inner surfaces 93A and 93A of the side walls 93 and 93, respectively. An opening 90A is formed on the front side of the second cassette unit 90, and the second wafer unit WU2 is carried in or out through the opening 90A. A protrusion 96 protruding upward is provided on the upper surface 91 </ b> A of the upper wall 91, and a handle 97 is attached to the protrusion 96. The handle 97 is configured to fall around the protrusion 96. Further, on the upper surface 91A of the upper wall 91, for example, a positioning pin 98 is provided at an edge located above the side walls 93, 93. In addition, a positioning hole 99 is provided on the bottom surface 92A of the bottom wall 92, for example, at an edge located below the side walls 93, 93. The positioning hole 99 is for installing the second cassette portion 90 at a predetermined position. For example, the positioning hole 99 is formed at a position and size that fits in the second cassette positioning pin 103 provided in the connecting plate 100. Yes.

  The connecting plate 100 is a member for connecting the first cassette unit 80 and the second cassette unit 90 in a state where they are positioned at a predetermined position. As shown in FIG. 2, the connecting plate 100 is configured as a plate material having a size equivalent to the upper wall 81 of the first cassette unit 80. As shown in FIG. 3, a positioning hole 101 into which the positioning pin 88 is fitted is formed in the bottom surface 100 </ b> A of the connecting plate 100 at a position corresponding to the positioning pin 88 of the first cassette unit 80. In addition, a recess 102 that avoids the protrusion 86 and the handle 87 is formed on the bottom surface 100 </ b> A of the connecting plate 100 at a position corresponding to the protrusion 86 and the handle 87 of the first cassette portion 80. The recess 102 has a size and depth (height) that does not interfere with the protruding portion 86 and the handle 87, and the first cassette portion 80 does not generate a gap between the first cassette portion 80 and the connecting plate 100. And the connecting plate 100 are connected. A second cassette positioning pin 103 that fits into the positioning hole 99 of the second cassette portion 90 is provided on the upper surface 100 </ b> B of the connection plate 100. This second cassette positioning pin 103 fits into the positioning hole 99 of the second cassette portion 90, and as shown in FIG. 3, the width direction center line S of the first cassette portion 80 and the second cassette portion 90 is It can be easily installed at the specified position matched. A first cassette positioning pin 104 that fits into the positioning hole 89 of the first cassette unit 80 is also provided on the upper surface 100 </ b> B of the connecting plate 100. The first cassette positioning pins 104 are used when connecting the first cassette unit 80 to the connecting plate 100.

  In the above-described configuration, the cassette 30 includes the first cassette portion 80 and the second cassette portion 90 having different side wall intervals, and the first cassette portion 80 and the second cassette portion 90 can be attached and detached using positioning pins. Accordingly, the first wafer unit WU1 and the second wafer unit WU2 having different sizes are accommodated in the first cassette unit 80 and the second cassette unit 90, respectively, and the first cassette unit 80 and the second cassette unit 90 are accommodated. It can be easily attached and detached. As a result, when processing is performed with the wafer unit W being changed in size, the first wafer unit WU1 and the second wafer unit WU2 are respectively stored in the first cassette unit 80 and the second cassette unit 90 in advance. Thus, it is not necessary to replace the cassette with the cassette mounting mechanism 40 as in the prior art, and the burden on the operator can be reduced. Further, it is not necessary to own a cassette having a different size in accordance with the size of the wafer unit WU, and the cost and the cassette accommodation area can be reduced.

  In the above-described configuration, each of the first cassette unit 80 and the second cassette unit 90 includes a plurality of stages (five levels in FIG. 3) of guide rails. For example, a plurality of cassette sections are stacked. At this time, it is preferable that the total number of stages including the guide rails of each cassette portion is formed so as to be equal to or less than the number of generally used cassette stages (for example, 25 stages). According to this configuration, it is possible to install and use a cassette in which a plurality of cassette units are connected to the cassette mounting mechanism 40.

[Second Embodiment]
Next, a cassette according to the second embodiment will be described. 4 is a perspective view of the cassette according to the second embodiment, FIG. 5 is an exploded perspective view of the cassette, and FIG. 6 is a side sectional view of the cassette. As shown in FIGS. 4 and 5, the cassette 130 includes a first cassette unit 110 and a second cassette unit 120. In the second embodiment, the first cassette unit 110 is formed larger than the second cassette unit 120 in the width direction (X-axis direction) and the depth direction (Y-axis direction). Further, as shown in FIG. 6, the first cassette unit 110 is mounted on the cassette mounting mechanism 40, and the second cassette unit 120 is connected to the first cassette unit 110.

  As shown in FIG. 6, the first cassette unit 110 includes an upper wall 111, a bottom wall 112, a pair of side walls 113, 113, and openings formed by the upper wall 111, the bottom wall 112, and the side walls 113, 113. And a back wall 114 (FIG. 4) is provided. The side walls 113, 113 are arranged to face each other in parallel with a first interval L 1, and connect the upper wall 111 and the bottom wall 112. A plurality of guide rails 115 that support the first wafer unit WU1 are formed on the inner surfaces 113A and 113A of the side walls 113 and 113, respectively. An opening 110A is formed on the front side of the first cassette unit 110, and the first wafer unit WU1 is carried in or out through the opening 110A. The upper wall 111 is formed such that at least the edge on the side wall 113, 113 side travels outside the side wall 113. A protrusion 116 protruding upward is provided on the upper surface 111A of the upper wall 111, and a handle 117 is attached to the protrusion 116. The handle 117 is configured to fall around the protrusion 116. In addition, a plurality (for example, four) of connection holes 140 for connecting to the second cassette unit 120 are provided on the upper surface 111A of the upper wall 111. These connection holes 140 are formed in a region smaller than at least the projected area of the bottom wall 122 (described later) of the second cassette unit 120. Further, on the upper surface 111A of the upper wall 111, a second cassette positioning member 150 and a first cassette positioning member 160 are formed side by side on one side wall side. The connecting hole 140, the second cassette positioning member 150, and the first cassette positioning member 160 will be described later.

  Further, a connecting piece 145 is provided on the bottom surface 112 </ b> A of the bottom wall 112 at a position corresponding to the connecting hole 140 described above. The connecting piece 145 is for installing the first cassette unit 110 at a predetermined position. For example, the connecting piece 145 fits into a hole 42 provided in the cassette mounting mechanism 40, so The first cassette unit 110 can be easily installed at a specified position. A recess 118 is formed on the bottom surface 112 </ b> A of the bottom wall 112.

  As shown in FIG. 6, the second cassette unit 120 includes an upper wall 121, a bottom wall 122, a pair of side walls 123, 123, and an opening formed by the upper wall 121, the bottom wall 122, and the side walls 123, 123. The rear wall 124 (FIG. 4) is configured to be closed. The side walls 123, 123 are opposed to each other in parallel with a second interval L 2 smaller than the first interval L 1 of the first cassette unit 110, and connect the upper wall 121 and the bottom wall 122. A plurality of guide rails 125 that support the second wafer unit WU2 are formed on the inner surfaces 123A and 123A of the side walls 123 and 123, respectively. An opening 120A is formed on the front side of the second cassette unit 120, and the second wafer unit WU2 is carried in or out through the opening 120A. The upper wall 121 is formed in the same size and shape as the upper wall 111 of the first cassette unit 110 described above, and the upper wall 121 has at least the side wall 123, the edge on the side of the 123 travel outside the side wall 123. Formed. A protrusion 126 protruding upward is provided on the upper surface 121A of the upper wall 121, and a handle 127 is attached to the protrusion 126. The handle 127 is configured to fall around the protrusion 126. In addition, a plurality of connection holes 140 are formed on the upper surface 121A of the upper wall 121 in the same manner as the upper wall 111 of the first cassette unit 110, and the second cassette positioning member 150 and the first cassette positioning member 160 Are formed side by side. The connecting hole 140, the second cassette positioning member 150, and the first cassette positioning member 160 are formed at the same position as the connecting hole 140 of the upper wall 111 of the first cassette unit 110.

  A connecting piece 145 is provided on the bottom surface 122 </ b> A of the bottom wall 122 at a position corresponding to the connecting hole 140 described above. The connecting piece 145 is for installing the second cassette unit 120 at a predetermined position. For example, the connecting piece 145 engages with the connecting hole 140 of the first cassette unit 110 to engage the second cassette unit 120 and the first cassette unit. 110 is connected. On the bottom surface 122A of the bottom wall 122, a recess 128 that avoids the protrusion 116 and the handle 117 is formed at a position corresponding to the protrusion 116 and the handle 117 of the first cassette section 110. The recess 128 has a size and depth (height) that does not interfere with the protrusion 116 and the handle 117, and is between the upper wall 111 of the first cassette unit 110 and the bottom wall 122 of the second cassette unit 120. The 1st cassette part 110 and the 2nd cassette part 120 are connected, without producing a clearance gap.

  Next, a connection configuration between the second cassette unit 120 and the first cassette unit 110 will be described. FIG. 7 is an enlarged perspective view showing a connection configuration between the second cassette portion and the first cassette portion. FIGS. 8A, 8B, and 8C are schematic diagrams illustrating a connection operation between the connection hole and the connection piece. As shown in FIG. 7, the connecting piece 145 is formed to protrude downward from the bottom surface 122A (FIG. 6) of the bottom wall 122 of the second cassette portion. Further, the connecting piece 145 includes a claw portion 145A that protrudes in the width direction (X direction) of the second cassette portion 120. The connection hole 140 is formed larger than the connection piece 145, and the connection piece 145 is loosely fitted thereto. Furthermore, the connecting hole 140 has an engaging hole 140A extending in the width direction (X direction) of the second cassette portion 120. When the connecting piece 145 is slid in the connecting hole 140, the connecting hole 140A is connected to the engaging piece 140A. 145 claw portion 145A enters. Thereby, since the connection piece 145 and the connection hole 140 engage, the 2nd cassette part 120 and the 1st cassette part 110 are connected.

  The second cassette positioning member 150 positions the second cassette unit 120 connected to the first cassette unit 110 in the width direction (X direction). As shown in FIG. It is provided at the position of the outer surface of one side wall 123. The first cassette positioning member 160 positions the first cassette unit 110 in the width direction (X direction) when the first cassette unit 110 is connected to the first cassette unit 110. As shown in FIG. 6, the first cassette unit 110 is provided on the outer surface of one side wall 113. Since the first cassette positioning member 160 and the second cassette positioning member 150 are different only in the provided positions and the other configurations are the same, the second cassette positioning member 150 will be described. As shown in FIG. 7, the second cassette positioning member 150 includes a receiving hole 151 formed in the upper wall 111 of the first cassette unit 110, a positioning piece 152 received in the receiving hole 151, and this positioning piece. And a spring member (biasing member) 153 that urges 152 in a direction protruding from the accommodation hole 151.

  When connecting the connecting hole 140 and the connecting piece 145, the second cassette unit 120 is lowered and the connecting piece 145 is inserted into the connecting hole 140 as shown in FIG. 8A. In this case, since the second cassette positioning member 150 is pushed downward by the bottom wall 122 of the second cassette portion 120 as shown in FIG. Next, the second cassette part 120 is slid in the direction (X1 direction in the figure) in which the claw part 145A of the connecting piece 145 protrudes. As a result, as shown in FIG. 8C, when the claw portion 145A of the connecting piece 145 enters the engaging hole 140A of the connecting hole 140, the first cassette portion 110 and the connecting piece 145 in which the connecting hole 140 is formed. Are connected to the second cassette part 120 provided with. In this case, since the second cassette positioning member 150 is provided on the side opposite to the direction in which the claw portion 145A protrudes, the second cassette positioning member 150 advances from the accommodation hole 151 by the urging force of the spring member 153 (FIG. 7). 2 Located along the side surface of the bottom wall 122 of the cassette portion 120. Accordingly, the connecting piece 145 can be prevented from sliding in the direction in which the claw portion 145A is detached from the engagement hole 140A, and the first cassette portion 110 and the second cassette portion 120 can be prevented from moving as shown in FIG. It can be easily installed at a specified position where the center line S in the width direction is matched.

  In the configuration described above, the cassette 130 includes the first cassette unit 110 and the second cassette unit 120 having different side wall intervals, and the connection piece 145 of the second cassette unit 120 is inserted into the connection hole 140 of the first cassette unit 110. The first wafer unit WU1 and the second wafer unit WU2 having different sizes are accommodated in the first cassette unit 110 and the second cassette unit 120, respectively, so that the first cassette unit 110 can be attached and detached. And the 2nd cassette part 120 can be attached or detached easily. As a result, when processing is performed with the wafer unit W being changed in size, the first wafer unit WU1 and the second wafer unit WU2 are respectively stored in the first cassette unit 110 and the second cassette unit 120 in advance. Thus, it is not necessary to replace the cassette with the cassette mounting mechanism 40 as in the prior art, and the burden on the operator can be reduced. Further, it is not necessary to own a cassette having a different size in accordance with the size of the wafer unit WU, and the cost and the cassette accommodation area can be reduced.

  As mentioned above, although one Embodiment of this invention was described, the said embodiment was shown as an example and is not intending limiting the range of invention. Specifically, in the above-described embodiment, the wafer W is used as the workpiece. However, a package substrate formed in a rectangular shape can also be used. FIG. 9A is a diagram illustrating a second package substrate as an example of a workpiece, and FIG. 9B is a diagram illustrating a first package substrate as an example of the workpiece. As illustrated in FIG. 9A, the second package substrate P2 includes a plurality of (for example, three) device regions having devices D formed in an area divided by a predetermined street ST on the surface 200A side of the substrate 200. Is provided. A mold resin 201 is formed on the back surface 200B side of the substrate 200 corresponding to the device region.

  Similarly, as shown in FIG. 9B, the first package substrate P1 includes a plurality (for example, three) of devices D formed in areas separated by a predetermined street ST on the surface 210A side of the substrate 210. Device area. A mold resin 211 is formed on the back surface 210B side of the substrate 210 corresponding to the device region. The first package substrate P1 is formed such that the length 210 in the short direction of the substrate 210 is longer than the length PL2 in the short direction of the substrate 200 of the second package substrate P2. The first package substrate P1 and the second package substrate P2 are the same except for the length in the short direction. That is, there is a difference in the size of the peripheral portion of the device region. In this configuration, the first package substrate P1 is accommodated in the first cassette portions 80 and 110, and the second package substrate P2 is accommodated in the second cassette portions 90 and 120.

  In FIG. 9A, reference numeral 202 denotes a suction position at which the vacuum pads of the cassette transport unit 60 and the cleaning transport unit 70 suck when the second package substrate P2 is transported. Similarly, in FIG. 9B, reference numeral 212 denotes a suction position for suction when the vacuum pads of the cassette transport unit 60 and the cleaning transport unit 70 transport the first package substrate P1. In this configuration, the first package substrate P1 and the second package substrate P2 are different in the size of the peripheral portion of the device region, but the suction positions 202 and 212 sucked by the vacuum pad are the same position. The length WA1 in the short direction and the length WA2 in the short direction between the suction centers 202A and 202A of the two package substrates P2 are the length WA1 and the length in the short direction between the suction centers 212A and 212A of the first package substrate P1. It is the same as the direction length WA2. For this reason, for example, even when the object to be processed is changed from the first package substrate P1 to the second package substrate P2, there is no need to adjust the positions of the vacuum pads of the cassette transport unit 60 and the cleaning transport unit 70. Processing efficiency can be increased.

  In the embodiment described above, the cassettes 30 and 130 have been described with respect to a configuration in which two cassette units are connected, but it is needless to say that three or more cassette units may be connected.

DESCRIPTION OF SYMBOLS 1 Processing apparatus 30, 130 Cassette 40 Cassette mounting mechanism 80, 110 1st cassette part 81, 91, 111, 121 Upper wall 82, 92, 112, 122 Bottom wall 83, 93, 113, 123 Side wall 85, 95, 115 , 125 Guide rail 88, 98 Positioning pin 89, 99, 101 Positioning hole 90, 120 Second cassette part 100 Connection plate 103 Second cassette positioning pin 104 First cassette positioning pin 140 Connection hole 140A Engagement hole 145 Connection piece 145A Claw 150 Positioning member for second cassette 151 Accommodating hole 152 Positioning piece 153 Spring member S Center line in width direction L1 First interval L2 Second interval W1 First wafer (workpiece)
W2 2nd wafer (workpiece)
WU1 First wafer unit (frame unit)
WU2 Second wafer unit (frame unit)

Claims (3)

An upper wall, a bottom wall, and a pair of side walls that face each other in parallel with a space therebetween and connect the upper wall and the bottom wall, and support a plate-like workpiece to be accommodated inside the side walls A cassette with a plurality of guide rails installed,
A first cassette portion in which the interval between the side walls is set to the first interval;
A second cassette portion in which the interval between the side walls is set to a second interval different from the first interval;
And the second cassette part is detachably connected to the first cassette part.   The cassette according to claim 1, wherein the first cassette part and the second cassette part are configured to be detachable via a connecting plate.   The cassette according to claim 1 or 2, wherein the workpiece is held on the guide rail in the form of a frame unit supported by an adhesive tape in an opening of an annular frame.

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