JP2012144261A - Transport tray - Google Patents

Abstract

A transport tray capable of efficiently transferring a device from a jig to a transport tray regardless of the size of the device is provided.
A transport tray that accommodates and transports a plurality of devices, and includes a device support portion having a surface that supports the plurality of devices, and a frame portion that surrounds the outer periphery of the device support portion. A tray body, and a tack layer attached to the surface of the device support portion of the tray body and having tack force.
[Selection] Figure 8

Description

  The present invention relates to a transport tray that houses and transports semiconductor devices divided by a dicing apparatus such as a cutting apparatus.

  In the semiconductor device manufacturing process, devices such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a substantially wafer-shaped semiconductor wafer, and each region where the devices are formed is partitioned. Individual devices are manufactured by cutting along planned lines. Devices divided in this way are packaged and widely used in electric devices such as mobile phones and personal computers.

  Electrical devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology capable of reducing the size of a semiconductor device package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-Lead Package (QFN) has been put into practical use. This package technology called QFN is a method in which a plurality of devices are provided on a metal plate such as a copper plate in which a plurality of connection terminals corresponding to the connection terminals of the device are formed and the division lines to be divided for each device are formed in a lattice shape. A CSP substrate (package substrate) is formed by integrating the metal plate and the device with a resin portion that is arranged in a matrix and molded with resin from the back side of the device. The package substrate is cut along a predetermined division line to divide the package substrate into individually packaged devices (chip size packages).

  The package substrate is generally cut by a cutting apparatus having a cutting blade. This cutting apparatus is provided with jigs in which relief grooves for escaping the cutting blade of the cutting blade are formed in a lattice shape in an area corresponding to the division line, and suction holes are provided in a plurality of areas partitioned by the relief grooves. The package substrate is sucked and held by the jig positioned on the holding table, and the holding table is relatively moved along the planned dividing line of the package substrate while rotating the cutting blade, thereby dividing the package substrate into the planned dividing line. Cut along and split into individual devices. Thereafter, the individually divided devices are stored in a transfer tray having a plurality of storage chambers and transferred to an assembly process (see, for example, Patent Document 1).

JP 2001-239365 A

Thus, the plurality of storage chambers provided in the transport tray are partitioned by partition walls corresponding to the size of the device (chip size package), and accordingly, a transport tray of a type corresponding to the size of the device is prepared. There is a problem that management is complicated.
In addition, each of the divided devices must be transferred from the jig to the transport tray one by one, and this transfer process takes time and is not necessarily satisfactory in terms of productivity.

  The present invention has been made in view of the above facts, and its main technical problem is to provide a transport tray that can efficiently transfer a device from a jig to a transport tray regardless of the size of the device. There is to do.

In order to solve the main technical problem, according to the present invention, a transport tray that accommodates and transports a plurality of devices,
A tray body including a device support portion having a surface for supporting a plurality of devices, and a frame portion formed to surround the outer periphery of the device support portion;
A tack layer attached to the surface of the device support portion of the tray body and having tack force,
The conveyance tray characterized by this is provided.

  It is desirable that the device support portion and the tack layer of the tray main body have optical transparency.

  A transport tray according to the present invention includes a tray main body including a device support portion having a surface for supporting a plurality of devices, a frame portion formed so as to surround an outer periphery of the device support portion, and a device support for the tray main body. Since it has a tack layer that is attached to the surface of the unit and has tack force, it is not necessary to provide a plurality of storage chambers that are partitioned corresponding to individual devices, and the type corresponding to the size of each device There is no need to prepare a tray. Accordingly, various types of devices can be handled with one type of transport tray, and management is simplified. In addition, since the transport tray according to the present invention is provided with a tack layer having a tack force on the surface of the device support portion, a plurality of devices divided by a dicing apparatus such as a cutting apparatus are collectively collected by the device transport apparatus. It can be transferred onto the tack layer, and productivity can be improved.

The perspective view and sectional drawing of the package board | substrate as a to-be-processed object. The perspective view which shows the state which hold | maintained the package board | substrate to the holding jig and holding jig | tool for holding the package board | substrate shown in FIG. The perspective view of the cutting apparatus for dividing | segmenting the package board | substrate shown in FIG. 1 into each device. Explanatory drawing of the cutting process implemented by the cutting device shown in FIG. The perspective view which shows the state by which the package substrate in which the cutting process shown in FIG. 4 was implemented was divided | segmented into each device. FIG. 3 is a perspective view of a transport tray configured according to the present invention. AA sectional view in FIG. Explanatory drawing which shows the state which transfers the some device shown in FIG. 5 to the conveyance tray shown in FIG. 6 and FIG. Explanatory drawing which shows the state which picks up the several device transferred to the conveyance tray as shown in FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a transport tray configured according to the present invention will be described in more detail with reference to the accompanying drawings.

  1A and 1B show a perspective view and a cross-sectional view of a package substrate as a workpiece. A package substrate 1 shown in FIGS. 1A and 1B includes a metal plate 11, a plurality of first division lines 111 extending in a predetermined direction on a surface 11 a of the metal plate 11, and the first Second division planned lines 112 extending in a direction orthogonal to the planned division lines 111 are formed in a lattice shape. Devices (chip size packages) 113 are respectively arranged in a plurality of regions partitioned by the first scheduled dividing line 111 and the second scheduled dividing line 112, and this device 113 is formed of a synthetic resin from the back side of the metal plate 11. Molded by the part 12. The package substrate 1 formed in this way is cut along the first planned dividing line 111 and the second planned divided line 112 and divided into individually packaged devices 113.

In order to cut the package substrate 1 along the plurality of first division lines 111 and the second division lines 112, the package substrate 1 is held by the holding jig 2 as shown in FIGS. Is done.
As shown in FIG. 2A, the holding jig 2 is formed in a rectangular shape, and a suction holding portion 20 for sucking and holding the package substrate 1 is provided at the center of the surface. On the upper surface (holding surface) of the suction holding unit 20, an escape groove for letting off a cutting blade of a cutting blade, which will be described later, in a region corresponding to the first scheduled division line 111 and the second scheduled division line 112 formed on the package substrate 1. 21 and 22 are formed in a lattice shape. Further, the suction holding member 20 is formed with suction holes 23 in a plurality of regions defined by the first scheduled division line 111 and the second scheduled division line 112, and the suction holes 23 are not shown. Communicating with the means. In addition, positioning holes 24 are provided at four corners of the holding jig 2. In the holding jig 2 configured as described above, the package substrate 1 is placed on the upper surface (holding surface) of the suction holding unit 20 as shown in FIG.

Next, a cutting apparatus that cuts the package substrate 1 placed on the above-described holding path tool 2 along the first scheduled division line 111 and the second scheduled division line 112 will be described with reference to FIG. .
The cutting device 3 shown in FIG. 3 includes a device housing 31 having a substantially rectangular parallelepiped shape. In the apparatus housing 31, a suction table 32 that holds a workpiece is disposed so as to be movable in a direction indicated by an arrow X that is a cutting feed direction. A suction recess 321 is provided on the upper surface of the suction table 32, and a suction port 322 communicating with suction means (not shown) is opened in the suction recess 321. Further, at the four corners on the upper surface of the suction table 32, positioning pins 323 are erected so that the positioning holes 24 provided at the four corners of the holding jig 2 are fitted. The suction table 32 is configured to be rotatable by a rotation mechanism (not shown). The suction table 32 configured as described above is moved in a cutting feed direction indicated by an arrow X by a cutting feed means (not shown).

  The cutting device 3 includes a spindle unit 33 as cutting means. The spindle unit 33 is moved in the index feed direction indicated by arrow Y in FIG. 3 by an index feed means (not shown), and is moved in the cut feed direction indicated by arrow Z in FIG. 3 by a notch feed means (not shown). ing. The spindle unit 33 is mounted on a moving base (not shown) and is adjusted to move in a direction indicated by an arrow Y that is an indexing direction and a direction indicated by an arrow Z that is a cutting direction, and the spindle housing 331 is freely rotatable. And a cutting blade 333 attached to the front end of the rotating spindle 332.

  Further, the cutting device 3 includes an image pickup means 34 for picking up an image of the surface of the workpiece held on the suction table 32 and detecting a region to be cut by the cutting blade 333. The imaging unit 34 includes an optical system including a microscope and an imaging device (CCD), and sends a captured image signal to a control unit (not shown).

The cutting apparatus 3 shown in FIG. 3 is configured as described above, and hereinafter the cutting substrate 3 is used to cut the package substrate 1 along a plurality of first scheduled division lines 111 and second scheduled division lines 112. The cutting operation to be performed will be described.
First, the package substrate 1 is placed on the suction table 32 of the cutting device 3 and the holding path 2 is placed. At this time, the package substrate 1 is placed by fitting a plurality of positioning holes 24 provided at the four corners of the holding path tool 2 to the positioning pins 323 provided at the four corners of the suction table 32. The holding path tool 2 is positioned at a predetermined position. Then, by operating a suction means (not shown), the suction holding portion 20 of the holding jig 2 is brought into contact with the suction port 322 of the suction table 32, the suction concave portion 321, and the plurality of suction holes 23 provided in the holding jig 2. A negative pressure acts on each device 113 of the package substrate 1 placed thereon, and each device 113 of the package substrate 1 is sucked and held on the suction holding portion 20 of the holding jig 2 (package substrate holding step).

  When the package substrate holding step is performed, the cutting feed means (not shown) is operated to move the holding jig 2 holding the package substrate 1 to a position immediately below the imaging means 34. When the holding jig 2 is positioned immediately below the image pickup means 34, an alignment operation for detecting a processing region to be cut on the package substrate 1 is executed by the image pickup means 34 and a control means (not shown). That is, the imaging unit 34 and the control unit (not shown) are arranged such that the positions of the first division line 111 formed in a predetermined direction of the package substrate 1 and the cutting blade 333 that cuts along the first division line 111 are cut. Image processing such as pattern matching for matching is executed, and the processing region to be cut is aligned. In addition, the alignment of the machining area to be cut is similarly performed on the second division line 112 extending in the direction orthogonal to the predetermined direction formed on the package substrate 1.

  As described above, when the alignment operation for detecting the machining area to be cut of the package substrate 1 is executed, the holding jig 2 is moved to the cutting area, and a predetermined first as shown in FIG. One end of one division planned line 111 is positioned slightly to the right in FIG. 4A from directly below the cutting blade 333. Then, the cutting blade 333 is rotated in the direction indicated by the arrow 333a and the notch feeding means (not shown) is operated to cut and feed the cutting blade 333 by the predetermined amount in the direction indicated by the arrow Z1 to be positioned at the predetermined cutting depth. This cutting depth is set at a position where the outer peripheral edge of the cutting blade 333 reaches the escape groove 21 (see FIG. 2A) formed in the suction holding portion 20 of the holding jig 2. Next, the cutting feed means (not shown) is operated to move the suction table 32 at a predetermined cutting feed speed in the direction indicated by the arrow X1 in FIG. Then, the other end of the predetermined first division planned line 111 of the package substrate 1 held on the suction table 32 via the holding jig 2 is slightly below the cutting blade 333 as shown in FIG. When the left side is reached, the movement of the suction table 32 is stopped, the cutting blade 333 is raised in the direction indicated by the arrow Z2, and the cutting operation is repeated by indexing and feeding to the first division line 111 to be cut next. . As a result, the package substrate 1 is cut along the first scheduled division line 111 (first cutting step).

  If the 1st cutting process mentioned above was implemented, the suction table 32 will be rotated 90 degree | times, and the 2nd division | segmentation schedule line formed in the package board | substrate 1 hold | maintained through the holding jig 2 on the suction table 32 will be carried out. 112 is positioned in the direction indicated by the arrow X, which is the cutting feed direction, and the above-described first cutting step is similarly performed on the package substrate 1 along all the second scheduled division lines 112 ( Second cutting step).

  The package substrate 1 that has been subjected to the first cutting step and the second cutting step as described above is cut along the first scheduled division line 111 and the second scheduled division line 112 as shown in FIG. And divided into individual devices (chip size packages) 113. The individual devices 113 thus divided are maintained in a state of being sucked and held by the suction holding unit 20 of the holding jig 2.

The device 113 divided as described above is accommodated in a later-described transport tray and transferred to the next assembly process. Here, a transport tray configured according to the present invention will be described with reference to FIGS.
The transport tray 5 shown in FIGS. 6 and 7 includes a rectangular tray main body 51 and a tack layer 52 mounted on the surface of the tray main body 51. The tray body 51 is formed of a light-transmitting synthetic resin (for example, acrylic resin), and includes a device support portion 511 having a surface 511a that supports the plurality of devices (chip size packages) 113, and the device support portion. And a frame portion 512 formed around the outer periphery of 511. The device support portion 511 has a rectangular recess formed on the upper surface of the tray main body 51, and the bottom surface of the rectangular recess functions as a surface 511 a that supports the plurality of devices 113. On the bottom surface of the device support portion 511, two engagement recesses 511b and 511b that engage with a support member of a transport device (not shown) are provided on both sides in the short-side direction (FIG. 6 shows one side of the device support portion 511). Only the engagement recesses 511b and 511b are shown). The tack layer 52 is attached to the surface 511a of the device support 511 formed in this way. The tack layer 52 is made of a sheet having tack force. As the sheet having tack force, the product name “Separless” or “Hand Deco Tack” manufactured and sold by New Tack Kasei Co., Ltd. can be used. As for the conveyance tray 5 comprised in this way, it is desirable for the device support part 511 and the tack layer 52 of the tray main body 51 to have a light transmittance.

Next, referring to FIG. 8, a method for accommodating a plurality of devices (chip size packages) 113 that are individually divided as shown in FIG. 5 from the suction holding unit 20 of the holding jig 2 in the transport tray 5 will be described. explain.
In order to accommodate a plurality of devices 113 on the transport tray 5 from above the suction holding unit 20 of the holding jig 2, the device transport apparatus 6 is used in the illustrated embodiment. The device transport apparatus 6 includes a suction holding pad 61 that sucks and holds a plurality of devices, and a transport arm 62 that supports the suction holding pad 61 at one end, and the transport arm 62 is operated by an operating mechanism (not shown). It is done. The suction holding pad 61 is fitted in a pad main body 611 having a rectangular concave portion 611a having a size similar to that of the package substrate 1 forming the plurality of devices 113 on the lower surface, and the concave portion 611a of the pad main body 711. It consists of a suction pad 612. The pad main body 611 is provided with a suction port 611b communicating with the concave portion 611a at the center. The suction port 611b communicates with suction means (not shown). The suction pad 612 is formed in a rectangular shape, and a plurality of suction holes 612a are provided at positions corresponding to the plurality of devices 113 in the same manner as the suction holes 23 provided in the suction holding portion 20 of the holding jig 2. ing. Therefore, when a suction means (not shown) is operated, a negative pressure is applied to the plurality of suction holes 612a via the suction port 611b and the recess 611a.

  In order to accommodate the plurality of devices 113 on the transport tray 5 from the suction holding unit 20 of the holding jig 2 using the device transport apparatus 6 described above, an operation mechanism (not shown) is operated as shown in FIG. Then, the lower surface of the suction pad 612 of the suction holding pad 61 is positioned on the upper surfaces of the plurality of devices 113 placed on the suction holding unit 20 of the holding jig 2. Then, suction by the suction means connected to the suction table 32 side is released and suction means (not shown) connected to the suction port 611b of the suction holding pad 61 is operated, so that suction is performed via the suction port 611b and the recess 611a. A negative pressure is applied to the plurality of suction holes 612 a provided in the pad 612. As a result, the plurality of devices 113 are sucked and held in the plurality of suction holes 612 a provided in the suction pad 612. When the plurality of devices 113 are sucked and held in the plurality of suction holes 612a provided in the suction pad 612 as described above, the suction holding pad 61 is moved as shown in FIG. The lower surfaces of the plurality of devices 113 that are transported onto the transport tray 5 and sucked and held on the lower surface (suction surface) of the suction pad 612 are placed on the tack layer 52 that is mounted on the surface 511 a of the device support portion 511 of the tray body 51. Place. Next, a plurality of devices 113 are removed as shown in FIG. 8C by releasing suction by a suction means (not shown) and operating an operation mechanism (not shown) to retract the suction holding pad 61 from the transport tray 5. Is transferred onto the tack layer 52 mounted on the surface 511 a of the device support 511 of the transport tray 5. The plurality of devices 113 transferred onto the tack layer 52 of the transport tray 5 are held without falling off due to the tack force of the tack layer 52.

  As described above, the transport tray 5 according to the present invention is provided with the tack layer 52 having tack force on the surface 511 a of the device support portion 511. There is no need to provide a tray, and there is no need to prepare a tray of a type corresponding to the size of each device 113. Therefore, it is possible to deal with various devices 113 with one type of transport tray 5, and management is simplified. Further, since the transport tray 5 according to the present invention has the tack layer 52 having tack force on the surface 511a of the device support portion 511, the plurality of devices 113 are described above from the suction holding portion 20 of the holding jig 2. It is possible to transfer them all together by the device transport device 6 and improve productivity.

  The plurality of devices 113 housed in the transport tray 5 as described above are transported to the assembly process. In the assembly process, as shown in FIG. 9, each device 113 is picked up by the pickup collet 7 of the pip-up device. At this time, the device support portion 511 and the tack layer 52 of the tray body 51 constituting the transport tray 5 are optically connected. Since it has transparency, each device 113 can be reliably recognized by irradiating light from the lower side of the transport tray 5 by the light source 8. That is, since the individual devices 113 are divided by the cutting grooves cut along the first scheduled dividing line 111 and the second scheduled divided line 112 as described above, light is transmitted from the lower side of the transport tray 5. By irradiating, light passes through the cutting grooves divided into the individual devices 113, so that the device 113 surrounded by the passed light can be reliably recognized.

1: Package substrate 113: Device 2: Holding jig 20: Suction holding unit 21, 22: Relief groove 23: Suction hole 3: Cutting device 32: Suction table 33: Spindle unit 333: Cutting blade 5: Transport tray 51: Tray Main body 511: Device support portion 512: Frame portion 52: Tack layer 6: Device transfer device 61: Suction holding pad 7: Pickup collet

Claims (2)

A transport tray that houses and transports a plurality of devices,
A tray body including a device support portion having a surface for supporting a plurality of devices, and a frame portion formed to surround the outer periphery of the device support portion;
A tack layer attached to the surface of the device support portion of the tray body and having tack force,
A transport tray characterized by that.   The transport tray according to claim 1, wherein the device support portion and the tack layer of the tray main body are light transmissive.

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