JP2013065603A - Dividing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dividing apparatus capable of housing a plurality of chips individually divided by cutting means and being downsized.SOLUTION: A dividing apparatus for dividing a workpiece having a plurality of regions partitioned by a plurality of scheduled division lines formed in a lattice shape, along the scheduled division lines, includes: a suction holding table 31 for the workpiece, in which escape grooves for a cutting edge of a cutting blade 43 are formed in a lattice shape in a region corresponding to the plurality of scheduled division lines and a plurality of regions partitioned by the escape grooves include suction holes, respectively; cutting means 4 having the cutting blade for cutting the unprocessed workpiece sucked and held by the holding table; drying means 14 for drying a plurality of chips individually divided by the cutting means; bulk housing means 15 for bulk-housing the plurality of dried chips; and chip dropping means 16 for dropping the plurality of chips dried by the drying means into the bulk housing means.

Description

  The present invention relates to a dividing apparatus that divides a workpiece having a plurality of regions formed on a surface in a lattice shape and having a plurality of regions partitioned by the plurality of scheduled division lines along the plurality of scheduled division lines. .

  In the semiconductor device manufacturing process, circuits such as ICs and LSIs are formed in a large number of regions arranged in a lattice pattern on the surface of a substantially disc-shaped semiconductor wafer, and each region where the circuits are formed is defined on a predetermined street. Individual semiconductor chips are manufactured by cutting along the division lines called. The semiconductor chip thus divided is packaged and widely used in electric devices such as mobile phones and personal computers.

  Electrical devices such as mobile phones and personal computers are required to be lighter and smaller, and a package technology capable of reducing the size of a semiconductor chip package called a chip size package (CSP) has been developed. As one of the CSP technologies, a package technology called Quad Flat Non-lead Package (QFN) has been put into practical use. This package technology called QFN is a method in which a plurality of connection terminals corresponding to the connection terminals of a semiconductor chip are formed and a plurality of electrode plates such as a copper plate are formed in a grid pattern with division lines divided for each semiconductor chip. A semiconductor chip is arranged in a matrix, and a CSP substrate (package substrate) is formed by integrating the electrode plate and the semiconductor chip by a resin portion obtained by molding resin from the back side of the semiconductor chip. The package substrate is cut along a division line to divide the package substrate into individually packaged chip size packages (CSP).

  A dividing device that divides the package substrate along the planned division line to divide the package substrate into individually packaged chip size packages (CSPs) has a relief groove that allows the cutting blade of the cutting blade to escape in an area corresponding to the planned division line. Is formed in a lattice shape, and holding tables each provided with suction holes in a plurality of regions partitioned by escape grooves, and a cutting blade that cuts the package substrate sucked and held by the holding table along a planned division line And a storage mechanism for storing a plurality of chip size packages (CSP) individually divided by the cutting means in a tray. (For example, refer to Patent Document 1.)

JP 2001-23936 A

  Thus, the accommodating mechanism for accommodating a plurality of individually divided chip size packages (CSP) arranged in a tray in the dividing apparatus described in Patent Document 1 includes a plurality of individually divided chip size packages (CSP). ) And a plurality of individually divided chip size packages (CSPs) placed on the pickup table are picked up one by one and transferred to be placed in a tray accommodated in a tray place. In addition to having a replacement means and a transfer means for transporting a tray filled with a plurality of individually divided chip size packages (CSPs) to a transport table, the overall configuration of the apparatus is complicated and large. At the same time, there is a problem that it becomes expensive and the equipment cost increases. In addition, the storage mechanism is configured to pick up a plurality of individually divided chip size packages (CSPs) one by one and store them side by side in a tray stored in the tray storage area. There is another problem that the working time for accommodating the chip size package (CSP) increases.

  The present invention has been made in view of the above-mentioned facts, and a main technical problem thereof is a dividing device that can easily accommodate a plurality of chips individually divided by a cutting means and can be downsized. It is to provide.

In order to solve the above-mentioned main technical problem, according to the present invention, a plurality of workpieces having a plurality of regions formed in a lattice shape on the surface and partitioned by the plurality of scheduled division lines. A dividing device for dividing along a planned dividing line,
A cassette placement area for placing a cassette containing the workpiece before processing;
A workpiece unloading means for unloading the unprocessed workpiece housed in the cassette placed in the cassette placement area to the temporary placing means;
Relief grooves that allow the cutting blades of the cutting blade to escape are formed in a lattice shape in areas corresponding to the plurality of division lines formed on the workpiece, and suction holes are provided in the plurality of areas defined by the escape grooves, respectively. A holding table for sucking and holding a workpiece;
A moving means for moving the holding table to a loading / unloading area for loading and unloading a workpiece and a machining area;
A workpiece carry-in means for carrying the workpiece before being carried to the temporary placement means to the holding table positioned in the carry-in / out region;
Imaging means for imaging a region to be processed of the workpiece held on the holding table;
A cutting means provided with a cutting blade for cutting a workpiece before processing disposed in the processing region and sucked and held by the holding table;
A drying means for drying the plurality of chips individually divided by cutting the workpiece along the plurality of scheduled division lines by the cutting means;
A suction holding pad having a plurality of suction holes is provided in a region corresponding to a plurality of individually divided chips placed on the holding table positioned in the carry-in / carry-out region, and positioned in the carry-in / carry-out region A workpiece conveying means for conveying a plurality of individually divided chips placed on the held table to the drying means;
Bulk accommodating means for bulk accommodating a plurality of chips dried by the drying means;
Chip dropping means for dropping a plurality of chips dried by the drying means into the bulk accommodation means;
Control means for controlling the workpiece unloading means, the holding table, the moving means, the workpiece carrying-in means, the imaging means, the cutting means, the drying means, the workpiece conveying means, and the chip dropping means. And comprising
A dividing device is provided.

Upper surface cleaning means for cleaning the upper surfaces of a plurality of individually divided chips sucked and held by the holding table, and lower surfaces of the plurality of individually divided chips whose upper surfaces are held by the workpiece transfer means And a lower surface cleaning means for cleaning.
The drying means includes an upper surface drying means for drying the upper surfaces of the plurality of individually divided chips cleaned by the lower surface cleaning means, and a lower surface drying means for drying the lower surfaces of the plurality of individually divided chips. Yes.
The lower surface drying means includes a drying table for sucking and holding a plurality of chips divided individually, and a heating means for heating the drying table, and the drying table has a suction portion formed of a shallow recess on the upper surface. From a heat-resistant fluorine-based rubber having a table body made of a metal plate and a plurality of suction holes that are disposed in a suction portion of the table body and open to areas corresponding to a plurality of chips divided individually on the upper surface And a plurality of suction holes communicated with the suction means.
Further, the control means operates the image pickup means to detect an escape groove formed on a holding table positioned in the carry-in / carry-out area, detects an escape groove position, and operates the image pickup means. A planned dividing line detecting step for detecting the position of the planned dividing line formed on the work piece placed on the holding table; and a deviation detecting step for obtaining a deviation amount between the position of the escape groove and the position of the planned dividing line; And a workpiece re-placement step of correcting the positional relationship between the holding table and the workpiece based on the deviation amount obtained in the deviation amount detecting step and re-place the workpiece on the holding table. To do.
Further, the control means operates the workpiece conveying means to press the suction holding pad against a plurality of individually divided chips placed on a holding table positioned in the loading / unloading area. A chip suction holding process is performed in which the operation and the operation of separating the plurality of individually divided chips from the holding surface of the holding table are repeated a plurality of times.

  The dividing apparatus according to the present invention is configured as described above, and includes a bulk storage unit that bulk stores a plurality of chips that are individually divided by the cutting unit, and the plurality of individually divided chips that have been dried in the drying unit are chips. Since it is dropped into the bulk accommodating means by the dropping means, the structure is simple and inexpensive compared to the accommodating mechanism that accommodates a plurality of individually divided chips arranged in the tray, which is equipped in the conventional dividing apparatus. Work time can be shortened.

The perspective view of the dividing device comprised by this invention. The perspective view of the holding table with which the dividing device shown in FIG. 1 is equipped. The perspective view of the lower surface drying means with which the dividing apparatus shown in FIG. 1 is equipped. Sectional drawing of the lower surface drying means shown in FIG. The perspective view of the chip | tip drop member and chip | tip container which comprise the bulk accommodation means with which the division | segmentation apparatus shown in FIG. 1 is equipped. The perspective view seen from the downward direction of the suction holding pad which comprises the workpiece conveyance means with which the dividing apparatus shown in FIG. 1 is equipped. The block block diagram of the control means with which the division | segmentation apparatus shown in FIG. 1 is equipped. FIG. 3 is a perspective view showing a state where a package substrate is sucked and held on the holding table shown in FIG. 2. Explanatory drawing of the cutting process implemented by the dividing apparatus shown in FIG. FIG. 3 is an explanatory view showing a state in which individual divided chips sucked and held by a suction holding pad constituting the workpiece conveying means provided in the dividing apparatus shown in FIG. 1 are positioned on a drying table of a lower surface drying means. The perspective view and sectional drawing of the package board | substrate as a to-be-processed object.

  Hereinafter, a preferred embodiment of a dividing apparatus constructed according to the present invention will be described in more detail with reference to the accompanying drawings.

  11A and 11B show a perspective view and a cross-sectional view of a package substrate as a workpiece. A package substrate 1 shown in FIGS. 11A and 11B includes an electrode plate 11, a plurality of first division lines 111 extending in a predetermined direction on the surface 11 a of the electrode plate 11, and the first Second division planned lines 112 extending in a direction orthogonal to the planned division lines 111 are formed in a lattice shape. A chip size package (CSP) 113 is arranged in each of a plurality of regions partitioned by the first planned division line 111 and the second planned division line 112, and this chip size package (CSP) 113 is arranged on the electrode plate 11. Molded by the synthetic resin portion 12 from the back side. The package substrate 1 formed in this way is divided into chip size packages (CSP) 113 which are cut along the first planned dividing line 111 and the second planned divided line 112 and individually packaged.

FIG. 1 shows a perspective view of a dividing apparatus configured in accordance with the present invention for cutting the package substrate 1 along a first scheduled dividing line 111 and a second scheduled dividing line 112.
The dividing device shown in FIG. 1 includes a device housing 2. A workpiece holding mechanism 3 for holding the workpiece and a cutting means 4 for cutting the workpiece held by the workpiece holding mechanism 3 are disposed at the center of the apparatus housing 2. ing. The workpiece holding mechanism 3 includes a holding table 31 that holds the package substrate 1 by suction and holding table support means 32 that supports the holding table 31. As shown in FIG. 2, the holding table 31 is formed in a rectangular shape, and a suction holding portion 310 that sucks and holds the package substrate 1 is provided at the center of the surface. On the upper surface (holding surface) of the suction holding unit 310, a relief groove for letting off a cutting blade of a cutting blade described later in a region corresponding to the first division planned line 111 and the second division planned line 112 formed on the package substrate 1. 311 and 312 are formed in a lattice shape. In addition, suction holes 313 are formed in the suction holding unit 310 in a plurality of regions partitioned by the first scheduled division line 111 and the second scheduled division line 112, and the suction holes 313 are not shown. Communicated with the means.

  Returning to FIG. 1, the description will be continued. The holding table support means 32 constituting the workpiece holding mechanism 3 rotates the holding table 31 about an axis perpendicular to the holding surface which is the upper surface (not shown). Means. The holding table support means 32 configured as described above is configured so that the holding table 31 can be moved between a loading / unloading area for loading and unloading the workpiece shown in FIG. 1 and a machining area by the cutting means 4. The X-axis direction moving means does not move in the machining feed direction (X-axis direction) indicated by the arrow X.

  The cutting means 4 includes a spindle housing 41 arranged along an index feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the X-axis direction, and a rotary spindle 42 rotatably supported by the spindle housing 41. A cutting blade 43 attached to the tip of the rotary spindle 42 and cutting water supply nozzles 44 disposed on both sides of the cutting blade 43 are provided. The spindle housing 41 is configured to be moved along the Y-axis direction by a Y-axis direction moving means (not shown). The rotary spindle 42 is driven to rotate by a drive source such as a servo motor (not shown). In the illustrated embodiment, the cutting blade 43 is an electroformed blade in which diamond abrasive grains are hardened by nickel plating on a blade base formed of aluminum in a disk shape. The cutting water supply nozzle 44 is connected to a cutting water supply means (not shown), and supplies the cutting water to the cutting portion by the cutting blade 43.

  Between the processing area by the cutting means 4 and the carry-in / out area, an upper surface cleaning means 5 for cleaning the upper surface of the workpiece that has been cut in the processing area and divided into individual chips is disposed. ing. The upper surface cleaning means 5 is disposed on the upper side of the movement path of the holding table 31 constituting the workpiece holding mechanism 3, and holds the workpiece that is held on the holding table 31 and cut by the cutting means 4. Spray cleaning water on top.

  On one side of the workpiece holding mechanism 3 in the Y-axis direction, there is provided a cassette placement area 6a for placing a cassette containing the workpiece before machining, and the cassette placement area 6a has a cassette placement area 6a. Is provided with a cassette table 60 which is moved up and down by a lifting means (not shown). On the cassette table 60, a cassette 6 in which a plurality of the package substrates 1 as workpieces are accommodated is placed. On the front side of the cassette placement area 6a, the package substrate 1 accommodated in the cassette 6 is temporarily placed and temporarily placed, and the package substrate 1 contained in the cassette 6 is carried out to the temporary placement means 7. A workpiece unloading means 8 is disposed.

  Between the temporary placement means 7 and the loading / unloading area, the package substrate 1, which is a workpiece before being processed and aligned with the temporary placement means 7, is positioned in the loading / unloading area. A workpiece carry-in means 9 for conveying onto a holding surface which is the upper surface of a holding table 31 constituting the workpiece holding mechanism 3 is provided. The workpiece carrying means 9 includes a suction holding pad 91 for sucking and holding the upper surface of the package substrate 1, an air cylinder mechanism 92 for supporting the suction holding pad 91 and moving the suction holding pad 91 in the vertical direction, and the air The working arm 93 supports the cylinder mechanism 92 and moving means (not shown) for moving the working arm 93 in the Y-axis direction.

  The dividing apparatus in the illustrated embodiment processes the package substrate 1 which is a workpiece held on a holding table 31 mounted on the air cylinder mechanism 92 of the workpiece loading means 9 and positioned in the loading / unloading area. An imaging means 12 for detecting a region to be detected is provided. The image pickup means 12 is composed of optical means such as a microscope and a CCD camera, and sends the picked up image signal to a control means described later.

  On the other side of the workpiece holding mechanism 3 in the Y-axis direction, a lower surface cleaning means 13 for cleaning the lower surface of the processed workpiece cut in the processing region and divided into individual chips is arranged. It is installed. The lower surface cleaning unit 13 includes a cleaning roller 131 made of a sponge or the like configured to be rotatable, and a cleaning water supply unit (not shown) that supplies cleaning water to the cleaning roller 131.

  In addition, the dividing apparatus in the illustrated embodiment includes a lower surface drying means 14 that is disposed adjacent to the lower surface cleaning means 13 and that dries the lower surface of the processed workpiece divided into individual chips. . The lower surface drying means 14 includes a drying table 141 as shown in FIGS. The drying table 141 includes a rectangular table main body 142 and a suction holding member 143 disposed on the upper surface of the table main body 142. The table body 142 is formed of a metal plate, and has a suction portion 142a formed of a rectangular shallow recess on the upper surface. The suction portion 142a includes a plurality of chip size packages (CSP) 113 of the package substrate 1 and A suction passage 142b is formed in each of a plurality of corresponding regions. The suction holding member 143 is formed in a size corresponding to the suction portion 142a formed of a shallow concave portion formed in the table main body 142 by heat-resistant fluorine-based rubber, and is fitted into the suction portion 142a. In the suction holding member 143 formed in this way, suction holes 143a are formed in a plurality of regions corresponding to the plurality of chip size packages (CSPs) 113 of the package substrate 1, and the suction holes 143a are formed in the table. The suction passage 142b formed in the main body 142 communicates with the suction passage 142b. In addition, as the fluorine-based rubber having heat resistance that forms the suction holding member 143, Teflon rubber “Zarak” manufactured and sold by DuPont can be used.

  A suction chamber forming member 144 for forming a suction chamber communicating with the suction passage 142b is mounted on the lower surface of the table main body 142 constituting the drying table 141. The suction chamber forming member 144 is formed in a rectangular shape by a metal plate, and a recess 144a is provided on the upper surface. A suction chamber 144b in which the suction passage 142b communicates with the recess 144a and the lower surface of the table body 142 is formed. The suction chamber forming member 144 is formed with a communication path 144c that opens to the recess 144a, and the communication path 144c communicates with suction means (not shown). A heater 145 as a heating unit is disposed below the suction chamber forming member 144 configured as described above.

  Referring back to FIG. 1, the description of the dividing apparatus in the illustrated embodiment includes a bulk accommodating means 15 that is disposed adjacent to the lower surface drying means 14 and accommodates a plurality of individually divided chips. ing. The bulk accommodating means 15 includes a chip dropping member 151 having an opening 151 a that opens adjacent to the lower surface drying means 14. As shown in FIG. 5, the chip drop member 151 is formed in a funnel shape downward from the opening 151a. A chip storage container 152 is disposed below the chip dropping member 151 configured as described above. As shown in FIG. 1, a drawer 153 for taking in and out the chip storage container 152 is provided on the front wall of the apparatus housing 2 in which the bulk storage means 15 including the chip drop member 151 and the chip storage container 152 is disposed. Is provided.

  1, the dividing device in the illustrated embodiment dries the upper surface of the processed workpiece divided into the individual chips placed on the lower surface drying means 14 and also lowers the lower surface. An upper surface drying means / chip dropping means 16 for dropping a plurality of chips placed on the drying means 14 and whose upper and lower surfaces are dried into the opening 151a of the chip dropping member 151 constituting the bulk accommodating means 15 is provided. Yes. The upper surface drying means / chip dropping means 16 supports the warm air blowing nozzle 161 for blowing warm air, the tip dropping brush 162 attached to the hot air blowing nozzle 161 and protruding downward, and the hot air blowing nozzle 161. It comprises an air cylinder mechanism 163 that moves the air blowing nozzle 161 in the vertical direction, an operating arm 164 that supports the air cylinder mechanism 163, and a moving means (not shown) that moves the operating arm 164 in the Y-axis direction.

  In the illustrated embodiment, the dividing apparatus is configured to process a processed workpiece divided into individual chips placed on a holding table 31 constituting the workpiece holding mechanism 3 positioned in the carry-in / out region. A workpiece conveying means 17 for conveying to the lower surface drying means 14 via the lower surface cleaning means 13 is provided. The workpiece conveying means 17 supports a suction holding pad 171 for sucking and holding the upper surface of the processed workpiece divided into individual chips placed on the holding table 31, and the suction holding pad 171. And an air cylinder mechanism 172 that moves the suction holding pad 171 in the vertical direction, an operating arm 173 that supports the air cylinder mechanism 172, and a moving means (not shown) that moves the operating arm 173 in the Y-axis direction. . As shown in FIG. 6, suction holes 171b are formed in a plurality of regions corresponding to the plurality of chip size packages (CSP) 113 of the package substrate 1 on the suction holding surface 171a, which is the lower surface, in the suction holding pad 171. The suction hole 171b communicates with a suction means (not shown).

  The dividing apparatus in the illustrated embodiment includes the control means 20 shown in FIG. The control means 20 is configured by a computer, and a central processing unit (CPU) 201 that performs arithmetic processing according to a control program, a read-only memory (ROM) 202 that stores control programs and the like, and a read / write that stores arithmetic results and the like. A random access memory (RAM) 203, an input interface 204, and an output interface 205 are provided. A detection signal from the imaging means 12 or the like is input to the input interface 204 of the control means 20 configured as described above. From the output interface 205 of the control means 20, the workpiece holding mechanism 3, the cutting means 4, the upper surface cleaning means 5, the workpiece unloading means 8, the workpiece loading means 9, the lower surface cleaning means 13, and the lower surface drying. A control signal is output to the means 14, the upper surface drying means / chip dropping means 16, the workpiece conveying means 17, and the like.

The dividing apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described below.
The unprocessed package substrate 1 accommodated in the cassette 6 placed on the cassette table 60 disposed in the cassette placement region 6a is positioned at the carry-out position by moving up and down by a lifting means (not shown). Next, the workpiece unloading means 8 moves forward and backward to unload the package substrate 1 positioned at the unloading position onto the temporary placing means 7. The package substrate 1 carried out to the temporary placing means 7 is aligned here. Next, the workpiece carry-in means 9 is operated to suck and hold the upper surface of the package substrate 1 aligned in the temporary placement means 7 by the suction holding pad 91 and hold the workpiece positioned in the carry-in / out area. It conveys on the holding surface which is the upper surface of the suction holding | maintenance part 310 of the holding table 31 which comprises the mechanism 3 (workpiece carrying-in process).

  Before carrying out the workpiece carrying-in step, the control means 20 operates the workpiece carrying-in means 9 to position the imaging means 12 mounted on the air cylinder mechanism 92 in the loading / unloading area. The workpiece holding mechanism 3 is positioned directly above the holding table 31. Next, the control means 20 operates the imaging means 12 to image the holding surface, which is the upper surface of the suction holding portion 310 of the holding table 31, and inputs an image signal obtained by imaging the escape groove (an escape groove detection step). Then, the control means 20 obtains the positions of the escape grooves 311 and 312 formed on the holding surface that is the upper surface of the suction holding unit 310 based on the input image signal, and stores the xy coordinate values in the random access memory (RAM) 203. Keep it.

  If the workpiece carrying-in process described above is carried out, the control means 20 operates the workpiece carrying-in means 9 to bring the image pickup means 12 mounted on the air cylinder mechanism 92 to the position where the escape groove detecting process is carried out. Position. Next, the control unit 20 operates the image pickup unit 12 to form the first scheduled dividing line 111 formed on the package substrate 1 placed on the holding surface which is the upper surface of the suction holding unit 310 of the holding table 31 and The second scheduled division line 112 is imaged, and the captured image signal is input (division planned line detection step). Then, the control means 20 obtains the positions of the first scheduled division line 111 and the second scheduled division line 112 formed on the package substrate 1 placed on the holding table 31 based on the input image signal xy. Coordinate values are stored in a random access memory (RAM) 203. In this way, when the scheduled division line detection step is performed, the control unit 20 releases the escape groove 311 formed on the holding surface which is the upper surface of the holding portion 310 of the suction holding table 31 detected by the escape groove detection step. And 312 and the positions of the first scheduled division line 111 and the second scheduled division line 112 formed on the package substrate 1 placed on the holding table 31 are obtained (deviation amount detection step). . Then, the control means 20 stores the deviation amount obtained in the deviation amount detection step in the random access memory (RAM) 203.

  When the above-described deviation amount detection step is performed, the control unit 20 operates the workpiece carry-in unit 9 to suck and hold the upper surface of the package substrate 1 placed on the holding table 31 by the suction holding pad 91. Then, the package substrate 1 is retracted upward from the holding surface of the holding table 31. Next, the control means 20 controls a rotation driving means (not shown) that rotates the holding table support means 32 constituting the workpiece holding mechanism 3 and moves the holding table 31 in the X-axis direction and moves the suction holding pad 91 to Y. The position of the holding table 31 supported by the holding table support means 32 is controlled to move in the axial direction, and is positioned at a position where the shift amount is corrected. In this way, when the holding table 31 is positioned at the position where the amount of deviation is corrected, the control means 20 operates the workpiece loading means 9 to lower the suction holding pad 91 and sucks the suction holding pad 91. The held package substrate 1 is placed on a holding surface which is the upper surface of the holding portion 310 of the holding table 31 (workpiece re-placement step). As a result, the relief grooves 311 and 312 formed on the holding surface which is the upper surface of the holding portion 310 of the holding table 31 and the first scheduled dividing line 111 and the first division line 111 formed on the package substrate 1 placed on the holding table 31. The second scheduled division lines 112 are coincident. When the workpiece repositioning step is performed in this way, the package substrate 1 is placed on the holding surface which is the upper surface of the holding portion 310 of the holding table 31 by operating a suction means (not shown) as shown in FIG. Suction hold.

  As described above, the relief groove formed on the holding surface which is the upper surface of the holding portion 310 of the holding table 31 by performing the escape groove detecting step, the division line detection step, the deviation amount detecting step, and the workpiece repositioning step. The grooves 311 and 312 and the first scheduled division line 111 and the second scheduled division line 112 formed on the package substrate 1 placed on the holding table 31 are aligned with each other on the upper surface of the holding unit 310 of the holding table 31. If the package substrate 1 is sucked and held on a certain holding surface, the control means 20 operates the workpiece carry-in means 9 and the image pickup means 12 mounted on the air cylinder mechanism 92 is held on the holding table 31. Position to 1. Next, the control unit 20 operates the imaging unit 12 to image the first scheduled division line 111 and the second scheduled division line 112 formed on the package substrate 1 held on the holding table 31, and the first division line 112 is captured. An alignment operation is performed to check whether the scheduled division line 111 and the second scheduled division line 112 are parallel to the X-axis direction and the Y-axis direction. If the first scheduled division line 111 and the second scheduled division line 112 are not parallel to the X-axis direction and the Y-axis direction, the control means 20 holds the holding table support means 32 constituting the workpiece holding mechanism 3. The first scheduled division line 111 and the second scheduled division line 112 formed on the package substrate 1 held on the holding table 31 by controlling a rotation driving means (not shown) that rotates the X axis direction and the Y axis direction. To be parallel to (alignment process).

  When the alignment step is performed as described above, the holding table 31 is moved to the machining area, and one end of the predetermined first division planned line 111 is moved directly below the cutting blade 43 as shown in FIG. It is positioned slightly on the right side in FIG. Next, the cutting blade 43 is rotated in the direction indicated by the arrow 43a, and a notch feeding means (not shown) is operated to cut and feed the cutting blade 43 by a predetermined amount in the direction indicated by the arrow Z1 from the retracted position indicated by the two-dot chain line. The cutting feed amount is set at a position where the outer peripheral edge, which is the cutting edge of the cutting blade 43, reaches an escape groove 311 (see FIG. 2) formed in the holding portion 310 of the holding table 31. Then, the X-axis direction moving means (not shown) is actuated to move the holding table 31 in the direction indicated by the arrow X1 in FIG. 9A at a predetermined cutting feed rate, and the package substrate 1 held on the holding table 31 is moved. When the other end of the formed first division planned line 111 reaches the left side slightly below the cutting blade 43 as shown in FIG. 9B, the movement of the holding table 31 is stopped and the cutting blade 43 is stopped. Is raised to the retracted position indicated by the two-dot chain line in the direction indicated by the arrow Z2. Then, the cutting is repeated by indexing and feeding to the first division line 111 to be cut next. As a result, the package substrate 1 is cut along the first scheduled dividing line 111 (cutting process). When performing the cutting process, cutting water is supplied to the cutting portion by the cutting blade 43 from the cutting water supply nozzle 44 (see FIG. 1).

  If the above-described cutting process is performed along all the first planned dividing lines 111 formed in the predetermined direction on the package substrate 1, the holding table 31 is rotated by 90 degrees. And the cutting process mentioned above is implemented along all the 2nd division | segmentation schedule lines 112 formed in the holding table 31 in the direction orthogonal to the said predetermined direction. As a result, the package substrate 1 held on the holding table 31 is cut along all the first planned division lines 111 and the second planned division lines 112. As described above, the package substrate 1 is cut into the individually packaged chip size package (CSP) 113 by cutting along all the first planned dividing lines 111 and the second planned divided lines 112 of the package substrate 1. Divided. The individually divided chip size package (CSP) 113 is sucked and held by the sucking and holding unit 310 of the holding table 31 and is maintained in a package substrate state. However, since the outer peripheral portion of the package substrate 1 is not sucked and held by the holding table 31, it is dropped from the holding table 31.

  If the cutting process is carried out as described above, the holding table 31 holding the package substrate 1 divided into the individual chip size packages (CSP) 113 by operating the X-axis direction moving means (not shown) is processed into the processing area. Move toward the loading / unloading area. At this time, the upper surface cleaning means 5 disposed on the upper side of the moving path of the holding table 31 is operated, and the package substrate 1 divided into individual chip size packages (CSP) 113 held on the holding table 31 is operated. The upper surface is cleaned (upper surface cleaning step).

  In this way, the upper surface cleaning step is performed while moving the holding table 31 holding the package substrate 1 divided into individual chip size packages (CSP) 113 from the processing area toward the loading / unloading area, When the holding table 31 reaches the carry-in / out area shown in FIG. 1, the movement of the holding table 31 is stopped. Then, the suction holding of the package substrate 1 divided into the individual chip size packages (CSP) 113 held on the holding table 31 is released.

  Next, the moving means (not shown) of the workpiece transfer means 17 is operated to bring the suction holding pad 171 shown in FIG. 6 into individual chip size packages placed on the holding table 31 positioned in the carry-in / out area. (CSP) 113 is positioned right above the package substrate 1 and the air cylinder mechanism 172 is operated to divide the suction holding surface 171a which is the lower surface of the suction holding pad 171 into individual chip size packages (CSP) 113. The package substrate 1 is brought into contact with the upper surface. Then, by operating a suction means (not shown), the chip size package (CSP) 113 divided individually is sucked and held by a plurality of suction holes 171b provided in the suction holding surface 171a. In addition, since the chip size package (CSP) 113 divided individually is subjected to the cutting process and the upper surface cleaning process and has water attached thereto, there are some which are not held by suction. In order to remove the influence of the adhering water, the control means 20 controls the air cylinder mechanism 172 of the workpiece conveying means 17 to move the suction holding pad 171 up and down, and the suction holding pad 171 is divided individually. The operation of pressing against the chip size package (CSP) 113 and the operation of separating the individually divided chip size package (CSP) 113 from the holding surface of the holding table 31 are repeated a plurality of times. As a result, all of the individually divided chip size packages (CSP) 113 on the holding table 31 are sucked and held by the suction holding pad 171 (chip suction holding process).

  If the above-described chip suction holding process is performed, the control means 20 operates a moving means (not shown) of the workpiece transfer means 17 to divide the chip size packages (CSPs) that are individually divided and held by the suction holding pad 171. ) 113 is positioned immediately above the lower surface cleaning means 13, and the air cylinder mechanism 172 is operated to lower the suction holding pad 171, and the chip size packages (CSP) individually divided that are sucked and held by the suction holding pad 171. 113 is brought into contact with the cleaning roller 131. At this time, the lower surface cleaning means 13 rotates the cleaning roller 131 and supplies cleaning water. As a result, the lower surface of the individually divided chip size package (CSP) 113 sucked and held by the suction holding pad 171 is cleaned (lower surface cleaning step).

  When the upper surface cleaning process is performed as described above, the control unit 20 operates the moving unit (not shown) of the workpiece conveying unit 17 to divide the chip size packages (individually divided) sucked and held by the suction holding pad 171 ( (CSP) 113 is positioned immediately above the lower surface drying means 14, and the air cylinder mechanism 172 is operated to lower the suction holding pad 171. As shown in FIG. The chip size package (CSP) 113 is positioned on the upper surface of the suction holding member 143 constituting the drying table 141 of the lower surface drying means 14. Then, the control unit 20 operates a suction unit (not shown) of the lower surface drying unit 14 and releases the suction holding by the suction holding pad 171. As a result, the suction means (not shown) passes through the communication passage 144c formed in the suction chamber forming member 144, the suction chamber 144b, the suction passage 142b formed in the table body 142, and the suction hole 143a formed in the suction holding member 143. Negative pressure acts on the lower surface of the individually divided chip size package (CSP) 113, and the individually divided chip size package (CSP) 113 is sucked and held on the upper surface of the suction holding member 143. At this time, since the suction holding member 143 is made of heat-resistant fluorine-based rubber, even if there are some irregularities on the lower surface of the individually divided chip size package (CSP) 113, negative pressure is followed. There is no leakage, and the chip size package (CSP) 113 divided individually can be surely sucked and held. Further, the control means 20 energizes (ON) the heater 145 of the lower surface drying means 14. As a result, the lower surface of the chip size package (CSP) 113 individually divided through the suction chamber forming member 144 and the table main body 142 and the suction holding member 143 constituting the drying table 141 is heated and dried. At this time, since the suction holding member 143 is made of heat-resistant fluorine-based rubber, there is no problem even if it is heated.

  At the same time, the control unit 20 operates the upper surface drying unit / chip dropping unit 16 to eject the warm air from the warm air ejection nozzle 161. Then, the control unit 20 controls a moving unit (not shown) to perform a plurality of reciprocating operations within the range of the chip size package (CSP) 113 that is placed on the upper surface of the lower surface drying unit 14 and divided individually. Implement once. At this time, the control unit 20 operates the air cylinder mechanism 163 of the upper surface drying unit / chip dropping unit 16 to position the chip dropping brush 162 mounted on the hot air ejection nozzle 161 at the upper retreat position. As a result, the lower surface and upper surface of the chip size package (CSP) 113 placed on the upper surface of the lower surface drying means 14 and individually divided are dried (chip drying process). In this drying process, the individually divided chip size package (CSP) 113 is sucked and held by the suction holding member 143 constituting the drying table 141, so that it is scattered even if hot air is jetted from the hot air jet nozzle 161. Never do.

  When the above-described chip drying process is performed, the control unit 20 releases the suction holding of the individually divided chip size package (CSP) 113 by the suction holding member 143 constituting the drying table 141 of the lower surface drying unit 14. Next, the control unit 20 operates a moving unit (not shown) of the upper surface drying unit / chip dropping unit 16 to move the chip dropping brush 162 mounted on the hot air jet nozzle 161 between the lower surface drying unit 14 and the lower surface drying unit 14. And the air cylinder mechanism 163 is operated to position the tip of the tip dropping brush 162 at a position in contact with the upper surface of the suction holding member 143 constituting the drying table 141. Then, the control unit 20 operates a moving unit (not shown) of the upper surface drying unit / chip dropping unit 16 to move the chip dropping brush 162 toward the opening 141 a of the chip dropping member 141 constituting the bulk housing unit 15. As a result, the individually divided chip size package (CSP) 113 placed on the upper surface of the lower surface drying means 14 and subjected to the drying process is accommodated in the chip accommodating container 152 through the opening 151a. At this time, the suction holding member 143 on which the individually divided chip size package (CSP) 113 is placed is made of heat-resistant fluorine-based rubber and has a low coefficient of friction. CSP) 113 can be moved smoothly.

  As described above, the dividing apparatus in the illustrated embodiment includes the bulk accommodating means 15 that bulk-accommodates a plurality of chip size packages (CSPs) 113 individually divided by the cutting means 4, and is dried on the lower surface drying means 14. Since the plurality of individually divided chip size packages (CSPs) 113 are dropped into the bulk accommodating means 15 by the upper surface drying means / chip dropping means 16, the individual divisions equipped in the conventional dividing apparatus are individually divided. The structure is simpler and less expensive than a storage mechanism that stores a plurality of chips arranged in a tray, and the working time can be shortened.

1: Package substrate 2: Device housing 3: Workpiece holding mechanism 31: Holding table 4: Cutting means 43: Cutting blade 5: Upper surface cleaning means 6: Cassette 6a: Cassette placement area 7: Temporary placing means 8: Workpiece Object unloading means 9: Workpiece carrying means 12: Imaging means 13: Lower surface cleaning means 14: Lower surface drying means 141: Drying table 143: Suction holding member 15: Bulk storage means 16: Upper surface drying means / chip dropping means 17: Subject Workpiece conveying means 20: Control means

Claims (6)

A dividing apparatus that divides a workpiece having a plurality of regions that are formed in a lattice shape on a surface and includes a plurality of regions partitioned by the plurality of scheduled division lines along the plurality of scheduled division lines,
A cassette placement area for placing a cassette containing the workpiece before processing;
A workpiece unloading means for unloading the unprocessed workpiece housed in the cassette placed in the cassette placement area to the temporary placing means;
Relief grooves that allow the cutting blades of the cutting blade to escape are formed in a lattice shape in areas corresponding to the plurality of division lines formed on the workpiece, and suction holes are provided in the plurality of areas defined by the escape grooves, respectively. A holding table for sucking and holding a workpiece;
A moving means for moving the holding table to a loading / unloading area for loading and unloading a workpiece and a machining area;
A workpiece carry-in means for carrying the workpiece before being carried to the temporary placement means to the holding table positioned in the carry-in / out region;
Imaging means for imaging a region to be processed of the workpiece held on the holding table;
A cutting means provided with a cutting blade for cutting a workpiece before processing disposed in the processing region and sucked and held by the holding table;
A drying means for drying the plurality of chips individually divided by cutting the workpiece along the plurality of scheduled division lines by the cutting means;
A suction holding pad having a plurality of suction holes is provided in a region corresponding to a plurality of individually divided chips placed on the holding table positioned in the carry-in / carry-out region, and positioned in the carry-in / carry-out region A workpiece conveying means for conveying a plurality of individually divided chips placed on the held table to the drying means;
Bulk accommodating means for bulk accommodating a plurality of chips dried by the drying means;
Chip dropping means for dropping a plurality of chips dried by the drying means into the bulk accommodation means;
Control means for controlling the workpiece unloading means, the holding table, the moving means, the workpiece carrying-in means, the imaging means, the cutting means, the drying means, the workpiece conveying means, and the chip dropping means. And comprising
A dividing apparatus characterized by that.   Upper surface cleaning means for cleaning the upper surfaces of a plurality of individually divided chips sucked and held by the holding table, and lower surfaces of the plurality of individually divided chips whose upper surfaces are held by the workpiece transfer means The dividing apparatus according to claim 1, further comprising a lower surface cleaning means for cleaning the surface.   The drying means includes: an upper surface drying means for drying the upper surfaces of the plurality of individually divided chips cleaned by the lower surface cleaning means; and a lower surface drying means for drying the lower surfaces of the plurality of individually divided chips. The dividing apparatus according to claim 1 or 2, further comprising: The lower surface drying means includes a drying table for sucking and holding a plurality of individually divided chips, and a heating means for heating the drying table,
The drying table has a table body made of a metal plate having a suction portion formed of a shallow recess on the top surface, and a region corresponding to a plurality of chips divided on the top surface disposed in the suction portion of the table body. A suction holding member made of a heat-resistant fluororubber having a plurality of suction holes opened, and the plurality of suction holes communicated with a suction means. Splitting device.   The control means operates the imaging means to detect an escape groove formed on a holding table positioned in the carry-in / out area, and detects the position of the escape groove, and operates the imaging means to operate the imaging means. A planned dividing line detecting step for detecting the position of the planned dividing line formed on the work piece placed on the holding table; and a deviation detecting step for obtaining a deviation amount between the position of the escape groove and the position of the planned dividing line; And a workpiece re-placement step of correcting the positional relationship between the holding table and the workpiece based on the deviation amount obtained in the deviation amount detecting step and re-place the workpiece on the holding table. The dividing device according to any one of claims 1 to 4.   The control means operates the workpiece conveying means to press the suction holding pad against a plurality of individually divided chips placed on a holding table positioned in the loading / unloading area. 6. The dividing device according to claim 1, wherein a chip sucking and holding step of repeating a plurality of times the operation of separating the plurality of individually divided chips from the holding surface of the holding table a plurality of times is performed.

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