CN105702627A - Cutting device - Google Patents
Cutting device Download PDFInfo
- Publication number
- CN105702627A CN105702627A CN201510869904.2A CN201510869904A CN105702627A CN 105702627 A CN105702627 A CN 105702627A CN 201510869904 A CN201510869904 A CN 201510869904A CN 105702627 A CN105702627 A CN 105702627A
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- Prior art keywords
- packaging
- chuck table
- base plate
- remainder
- machined object
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Package Closures (AREA)
Abstract
The invention provides a cutting device, which can highly effectively maintain the production of the device packaging. The cutting device comprises a clamp plate table (12), a cutting member (16), a processing supply member which performs processing on the working table of the clamping table, a box loading area (4a) which is loaded with the boxes of the plurality processed units (11), a delivery member (42) which is arranged in the box loading area and between the box and the working table for delivering the processed member, a shooting member (36), and a control member (44) which controls all structure elements. When the position of the segmentation reservation line (21) of the packaging substrate which is maintained on the clamping plate working table faces beyond the regulated range, the processed units are delivered out of the clamping plate working table, the positions and the facing direction of the clamping plate working table and the processed article unit are regulated in order to make the preset position and the facing direction of the segmentation line are in the regulated range, and the processed article units are carried into the clamping plate working table.
Description
Technical field
The present invention relates to topping machanism, to utilizing resin etc., the base plate for packaging of multiple device sealings is cut。
Background technology
In the semiconductor packagings such as CSP (ChipSizePackage: chip size packages), QFN (QuadFlatNon-leadedPackage: quad flat non-leaded chip package), use utilizes the base plate for packaging that multiple devices (or, device chip) are sealed by resin etc.。Base plate for packaging is made up of the remainder in the multiple device portions comprising multiple device respectively and each device portion of encirclement。
Each device portion is divided into the multiple device packaging areas corresponding with each device by the segmentation preset lines of face side。By splitting base plate for packaging along this segmentation preset lines, and the multiple devices encapsulation corresponding with each device (device chip) can be formed。
When utilizing the method segmentation base plate for packaging such as cutting, in order to prevent dispersing of the device formed encapsulation, and at the bonding adhesive tape of rear side (for example, referring to patent documentation 1) of base plate for packaging。Further, there is also the situation (for example, referring to patent documentation 2) of the framework that the peripheral part of the adhesive tape being bonded on base plate for packaging is fixed on ring-type。So, by adhesive tape is bonded on base plate for packaging, and can suitably keep and cut base plate for packaging。
Patent documentation 1: Japanese Unexamined Patent Publication 2000-208445 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2000-232080 publication
After methods such as utilizing cutting has split base plate for packaging, pick up the encapsulation of (stripping) device from adhesive tape。But, if on adhesive tape, remaining has remainder when pickup device encapsulates, it is possible to produce pick up the mistakes such as remainder mistakenly, make the efficiency of operation reduce。
Particularly when the multiple device encapsulation of disposable pickup, it is possible to make the efficiency of operation be greatly reduced。Therefore, generally pick up before pickup device encapsulates and remove remainder。
But, if along segmentation preset lines segmentation base plate for packaging, then remainder also can be divided into small pieces。Its result is, the pickup of remainder needs the long period, and the productivity of device encapsulation reduces。For a fairly large number of base plate for packaging of this problem device is encapsulated smaller and segmentation preset lines deep especially。
Summary of the invention
The present invention completes in view of this problem points, its object is to provide a kind of topping machanism, it is possible to maintain the productivity of device encapsulation higher。
A kind of topping machanism is provided according to the present invention, the machined object unit of the opening that base plate for packaging is supported on ring-shaped frame across adhesive tape is cut, and base plate for packaging is divided into each device encapsulate, this base plate for packaging comprises: device portion, and this device portion is set in the segmentation preset lines in front and is divided into multiple device packaging area；And remainder, this remainder is around this device portion, and this topping machanism is characterised by having: chuck table, and base plate for packaging is carried out attracting holding across this adhesive tape by it；Cutting member, the base plate for packaging being maintained on this chuck table is cut by it；Processing feeding component, this chuck table is processed feeding by it；Box mounting region, loads region at this box and is placed with the box receiving multiple machined object unit；Conveyance component, it transports machined object unit along the direction vertical with the direction of this processing feeding between this box and this chuck table of being placed in this box mounting region；Shooting component, the base plate for packaging being maintained on this chuck table is shot by it；And control member, each structural element is controlled by it, and this chuck table has: main part, and it has holding surface base plate for packaging supported in the region except this remainder and is formed at the recess in the region corresponding with this remainder；And rotating part, it utilizes the rotating shaft vertical with this holding surface to make this main part rotate, utilize this shooting component that this chuck table is shot and by the location registers of this holding surface or this recess in this control member after, the base plate for packaging being maintained on this chuck table is shot and determine this segmentation preset lines position and towards, when the position of this segmentation preset lines determined with towards when being in outside the scope of regulation, this conveyance component is utilized to be taken out of from this chuck table by machined object unit, to this rotating part, this processing feeding component and this conveyance component are controlled, adjust this chuck table and machined object unit position and towards so that this segmentation preset lines position and towards in the scope being in regulation, and then machined object unit is moved into this chuck table, thus this remainder of base plate for packaging is positioned at the position corresponding with this recess of this chuck table。
Owing to the topping machanism of the present invention has chuck table, this chuck table has holding surface base plate for packaging supported in the region except remainder and the recess being formed at the region corresponding with remainder, by making the recess of this chuck table produce negative pressure, and the adhesive tape being adhered to the region corresponding with remainder can be peeled off from base plate for packaging。Thereby, it is possible to when utilizing cutting member cutting base plate for packaging, make remainder disperse and remove from adhesive tape。That is, owing to remainder need not be picked up, therefore, it is possible to maintain the productivity of device encapsulation higher。
And, in the topping machanism of the present invention, due to when the position of the segmentation preset lines of the base plate for packaging that be maintained on chuck table with towards when being in outside the scope of regulation, adjust chuck table and machined object unit position and towards, therefore, it is possible to the remainder of base plate for packaging to be properly located in the position corresponding with the recess of chuck table。Thereby, it is possible to the adhesive tape being adhered to the region corresponding with remainder is suitably peeled off from base plate for packaging。
Accompanying drawing explanation
Fig. 1 is the figure schematically showing topping machanism。
(A) of Fig. 2 is the axonometric chart schematically showing machined object unit, and (B) of Fig. 2 is the sectional view schematically showing machined object unit。
Fig. 3 is the axonometric chart schematically showing chuck table。
Fig. 4 is an illustration for the top view of register step。
Fig. 5 is an illustration for moving into the top view of step。
Fig. 6 is an illustration for the top view of determination step。
(A) of Fig. 7 is an illustration for the sectional view of strip step, (B) of Fig. 7 is an illustration for the side elevation in partial section of segmentation step, and (C) of Fig. 7 is the side elevation in partial section schematically showing the situation that remainder in segmentation step disperses。
Label declaration
2: topping machanism；4: base station；4a: box mounting region；4b, 4c: opening；6: box；8:X axle mobile working platform；10: dust-proof drip shield；12: chuck table；14: fixture；16: cutting unit (cutting member)；18: supporting construction；20: cutting unit travel mechanism；22:Y axis rail；24:Y axle movable plate；26:Y axle ball-screw；28:Z axis rail；30:Z axle movable plate；32:Z axle ball-screw；34:Z axle pulse motor；36: photographing unit (shooting component)；38: cutting tool；40: cleaning unit；42: transport unit (conveyance component)；44: control device (control member)；46: holding surface；46a: region；48: recess；11: machined object unit；13: base plate for packaging；15: framework；15a: front；15b: the back side；17: device portion；19: remainder；21: segmentation preset lines (spacing track)；23: device packaging area；25: sealing；25a: front；27: target spot；31: adhesive tape；33: substrate layer；35: paste layer；37: framework (ring-shaped frame)。
Detailed description of the invention
With reference to accompanying drawing, embodiments of the present invention are illustrated。Fig. 1 is the figure of the topping machanism schematically showing present embodiment。As it is shown in figure 1, topping machanism 2 has the base station 4 supporting each structure。It is provided with the box mounting region 4a of general planar in the corner in the front of base station 4, loads region 4a at this box and be placed with the box 6 receiving multiple machined object unit 11。
(A) of Fig. 2 is the axonometric chart schematically showing machined object unit 11, and (B) of Fig. 2 is the sectional view schematically showing machined object unit 11。As shown in (A) of Fig. 2 and (B) of Fig. 2, the machined object unit 11 of present embodiment comprises the base plate for packaging 13 of the object as cutting。Base plate for packaging 13 has top view framework 15 in the form of a substantially rectangular。
Framework 15 is such as formed by metal materials such as 42 alloys (alloy of ferrum and nickel) or copper, and 15a side, its front is divided into multiple device portion 17 (being 3 device portions 17 here) and surrounds the remainder 19 in each device portion 17。As shown in (A) of Fig. 2, a plurality of segmentation preset lines (spacing track) 21 that each device portion 17 is intersected is further divided into multiple device packaging area 23 (being 36 device packaging areas 23 here)。
The position corresponding with each device packaging area 21 of the 15b side, the back side of framework 15 is provided with the devices such as IC, LED (device chip) (not shown)。These devices (device chip) are sealed by sealing 25 as shown in (B) of Fig. 2, and this sealing 25 is formed at the region corresponding with each device portion 17。
Sealing 25 is formed as the thickness of regulation by materials such as resins, highlights from the back side 15b of framework 15。In the present embodiment, the front 25a of this sealing 25 is called the back side of base plate for packaging 13, the front 15a of framework 15 is called the front of base plate for packaging 13。
The front 25a of the sealing 25 at the back side being equivalent to base plate for packaging 13 is bonded with the adhesive tape 31 of the circular bigger than base plate for packaging 13。As shown in (B) of Fig. 2, the fusible paste layer 35 that has of the adhesive tape 31 membranaceous substrate layer 33 formed by materials such as resins and the one side (upper surface) being configured at substrate layer 33 is constituted。
By making the back side (that is, the front 25a of sealing 25) of paste layer 35 and base plate for packaging 13 be close to, and adhesive tape 31 can be adhered to base plate for packaging 13。It addition, paste layer 35 can also comprise the resin etc. of ultraviolet ray hardening type。In this case, it is possible to by making paste layer 35 that the cohesive of base plate for packaging 13 grade to be reduced paste layer 35 irradiation ultraviolet radiation (ultraviolet light)。
Peripheral part at adhesive tape 31 is fixed with the framework (ring-shaped frame) 37 of ring-type。In such manner, it is possible to form machined object unit 11 by supporting base plate for packaging 13 at the opening of framework 37 across adhesive tape 31。
As it is shown in figure 1, be formed with the opening 4b of rectangle longer in X-direction (fore-and-aft direction) in the side of box mounting region 4a。The X-axis travel mechanism (processing feeding component) (not shown) be provided with X-axis mobile working platform 8 in this opening 4b, making X-axis mobile working platform 8 move in the X-axis direction and the dust-proof drip shield 10 covering X-axis travel mechanism。
X-axis travel mechanism has a pair parallel in the X-axis direction X-axis guide rail (not shown), and X-axis mobile working platform 8 is can be arranged in the way of sliding on X-axis guide rail。Lower face side at X-axis mobile working platform 8 is provided with nut portions (not shown), screws togather with the X-axis ball-screw (not shown) of X-axis guide rail parallel and this nut portions。
One end at X-axis ball-screw is linked with X-axis pulse motor (not shown)。X-axis mobile working platform 8 is made to move in the X-axis direction along X-axis guide rail by utilizing X-axis pulse motor to make X-axis ball-screw rotate。
Being provided with chuck table 12 on X-axis mobile working platform 8, this chuck table 12 is across adhesive tape 31 attracting holding base plate for packaging 13。4 fixtures 14 being provided around being gripped by the framework 37 of ring-type from four directions at chuck table 12。About the details of chuck table 12 followed by description。
Being configured with the supporting construction 18 of gate on the upper surface of base station 4 in the way of crossing over opening 4b, the cutting unit (cutting member) 16 of cutting base plate for packaging 13 is supported by this supporting construction 18。The cutting unit travel mechanism 20 making cutting unit 16 in the upper movement of Y direction (left and right directions) and Z-direction (vertical) it is provided with on the front surface top of supporting construction 18。
Cutting unit travel mechanism 20 has the front surface being arranged in supporting construction 18 and a pair parallel in the Y-axis direction Y-axis guide rail 22。So that the Y-axis movable plate 24 being constituted cutting unit travel mechanism 20 can be provided with in the way of sliding on Y-axis guide rail 22。
Rear side (below side) at Y-axis movable plate 24 is provided with nut portions (not shown), and the Y-axis ball-screw 26 parallel with Y-axis guide rail 22 screws togather with this nut portions。One end at Y-axis ball-screw 26 is linked with Y-axis pulse motor (not shown)。Make Y-axis ball-screw 26 rotate if, with Y-axis pulse motor, then Y-axis movable plate 24 moves in the Y-axis direction along Y-axis guide rail 22。
The front (front surface) of Y-axis movable plate 24 is provided with a pair parallel in the Z-axis direction Z axis guide rail 28。So that Z axis movable plate 30 can be provided with in the way of sliding on Z axis guide rail 28。
Rear side (below side) at Z axis movable plate 30 is provided with nut portions (not shown), and the Z axis ball-screw 32 parallel with Z axis guide rail 28 screws togather with this nut portions。One end at Z axis ball-screw 32 is linked with Z axis pulse motor 34。Make Z axis ball-screw 32 rotate if, with Z axis pulse motor 34, then Z axis movable plate 30 moves in the Z-axis direction along Z axis guide rail 28。
The cutting unit 16 that base plate for packaging 13 is cut it is provided with in the bottom of Z axis movable plate 30。The position adjacent with cutting unit 16 is provided with the photographing unit (shooting component) 36 that the face side to base plate for packaging 13 shoots。Making Y-axis movable plate 24 move in the Y-axis direction if, with cutting unit travel mechanism 20, then cutting unit 16 and photographing unit 36 are carried out index feed, if making Z axis movable plate 30 move in the Z-axis direction, then cutting unit 16 and photographing unit 36 lift。
Cutting unit 16 has the circular cutting tool 38 of the end side being installed on main shaft (not shown), and this main shaft constitutes the rotating shaft parallel with Y direction。It is linked with the rotary driving sources such as motor (not shown) in another side of main shaft, makes the cutting tool 38 being installed on main shaft rotate。
Loading with box of opening 4b, the position of 4a opposition side, region is formed with circular opening 4c。The cleaning unit 40 that base plate for packaging 13 is carried out it is provided with in opening 4c。
Being provided above transport unit (conveyance component) 42 at opening 4b, this transport unit (conveyance component) 42 is conveyance machined object unit 11 between the box 6 and the chuck table 12 that are placed in box mounting region 4a。This transport unit 42 is upper mobile in the direction (Y direction) of the index feed vertical with the direction (X-direction) of processing feeding when keeping machined object unit 11。
Above-mentioned X-axis travel mechanism, chuck table 12, cutting unit 16, cutting unit travel mechanism 20, photographing unit 36, transport unit 42 etc. are connected with controlling device (control member) 44。Control device 44 according to processing conditions etc., the action of above-mentioned each structural element to be controlled。The concrete control controlling device 44 is illustrated later。
Fig. 3 is the axonometric chart schematically showing chuck table 12。The front (upper surface) of chuck table 12 becomes, across adhesive tape 31, base plate for packaging 13 is carried out the holding surface 46 of attracting holding。This holding surface 46 is formed the recess 48 corresponding with the remainder 19 of base plate for packaging 13。Except this recess 48, holding surface 46 is shaped generally as smooth。
The main part of the chuck table 12 comprising holding surface 46 and recess 48 links with the rotating part (not shown) of motor etc., and rotates around the rotating shaft parallel with Z-direction (vertical)。Further, above-mentioned X-axis travel mechanism is utilized in the X-axis direction chuck table 12 to be processed feeding。
Holding surface 46 and recess 48 are connected with attraction source (not shown) respectively through the attraction path etc. being formed at main part。If making the suction function in attraction source in holding surface 46, then across adhesive tape 31 attracting holding base plate for packaging 13, if making the suction function in attraction source in recess 48, then the adhesive tape 31 corresponding with remainder 19 can be attracted and peels off from base plate for packaging 13。
Then, to utilizing above-mentioned topping machanism 2 that the example of the treatment process that base plate for packaging 13 carries out cutting etc. is illustrated。It addition, before base plate for packaging 13 is carried out cutting etc., implement register step, by the location registers of holding surface 46 (or recess 48) in controlling device 44。Fig. 4 is an illustration for the top view of register step。
In register step, first, utilize photographing unit 36 to shoot the face side of chuck table 12, and detect the position of holding surface 46 (or recess 48)。Specifically, for instance the region 46a near the end of the holding surface 46 that the device portion 17 with base plate for packaging 13 divides accordingly is shot, the position (coordinate) of the end and according to acquired image detection holding surface 46。
The position (coordinate) of the end of the holding surface 46 detected is registered in control device 44。Thus, control device 44 and be capable of identify that holding surface 46 and the position of recess 48。It addition, in the present embodiment, in controlling device 44, the position of the end of holding surface 46 is registered but it also may the position of other parts of registration holding surface 46。
And, it is also possible to the position of registration recess 48 in controlling device 44。The such as instruction according to operator of this register step is implemented。It is however also possible to utilize automatically controlling of device 44 of control to implement register step。
As mentioned above by the location registers of holding surface 46 (or recess 48) after controlling in device 44, implement base plate for packaging 13 is carried out the treatment process of cutting etc.。First, that implements to move into machined object unit 11 chuck table 12 moves into step。Fig. 5 is an illustration for moving into the top view of step。
In moving into step, first, control device 44 in the way of the remainder 19 of base plate for packaging 13 and the recess 48 of chuck table 12 are corresponding, according to the position of the holding surface 46 (or recess 48) registered, rotating part and X-axis travel mechanism are controlled。Specifically, by make chuck table 12 on the direction R1 of rotating shaft rotate and move along the direction X1 parallel with X-direction, and substantially adjust chuck table 12 position and towards。
Have adjusted the position of chuck table 12 and towards afterwards, utilizing transport unit 42 to be taken out of by machined object unit 11 from box 6, and being positioned in the holding surface 46 of chuck table 12。Now, control device 44 according to the position of the holding surface 46 (or recess 48) registered, transport unit 42 to be controlled。Specifically, make the transport unit 42 maintaining machined object unit 11 move along the direction Y1 parallel with Y direction, and substantially adjust the machined object unit 11 position relative to chuck table 12。
After moving into step, implement determination step, it is determined that the position of segmentation preset lines 21 and towards, and judge the position relationship of the remainder 19 of base plate for packaging 13 and the recess 48 of chuck table 12。Fig. 6 is an illustration for the top view of determination step。In determination step, first, utilize photographing unit 36 to shoot the base plate for packaging 13 being maintained on chuck table 12, and detect as position and towards multiple target spots 27 of index。
The position relationship of multiple target spots 27 and segmentation preset lines 21 is known。Thus, control device 44 can according to the position (coordinate) of multiple target spots 27 calculate segmentation preset lines 21 position and towards。By the position of the segmentation preset lines 21 calculated with towards being registered in control device 44。
Then, control device 44 and to the position of segmentation preset lines 21 and compare towards the position with holding surface 46 (or recess 48), and judge whether the remainder 19 of base plate for packaging 13 is positioned in the recess 48 of chuck table 12。
Specifically, in the position of segmentation preset lines 21 with towards, when being in the scope of regulation relative to the position of holding surface 46 (or recess 48), controlling device 44 and be judged to that remainder 19 is located in the position corresponding with recess 48。On the other hand, when splitting the position of preset lines 21 and towards, when being in outside the scope of regulation, controlling device 44 and be judged to that remainder 19 is not located in the position corresponding with recess 48。
When being judged to that in determination step remainder 19 is not located in the position corresponding with recess 48, implement set-up procedure, adjust chuck table 12 and machined object unit 11 position and towards。On the other hand, when being judged to that remainder 19 is located in the position corresponding with recess 48, do not implement set-up procedure and implement strip step, the adhesive tape 31 corresponding with remainder 19 is peeled off。
In set-up procedure, first, transport unit 42 is utilized to take out of machined object unit 11 from chuck table 12。Then, control device 44 according to the position of the segmentation preset lines 21 registered and towards and the position of holding surface 46 (or recess 48) control rotating part, X-axis travel mechanism and transport unit 42 so that split the position of preset lines 21 and in the scope being in regulation。
Specifically, by making chuck table 12 rotate on the direction R1 of rotating shaft and move along the direction X1 parallel with X-direction, the transport unit 42 making maintenance machined object unit 11 moves along the direction Y1 parallel with Y direction, and adjust machined object unit 11 relative to the position of chuck table 12 and towards。
Have adjusted machined object unit 11 relative to the position of chuck table 12 with towards afterwards, transport unit 42 is utilized to move into machined object unit 11 to chuck table 12。Thereby, it is possible to the remainder 19 of base plate for packaging 13 is positioned at the position corresponding with the recess 48 of chuck table 12。
After implementing set-up procedure (when not implementing set-up procedure, after implementing determination step), implement strip step, the adhesive tape 31 corresponding with remainder 19 is peeled off。(A) of Fig. 7 is an illustration for the sectional view of strip step。In strip step, make the suction function in attraction source in recess 48, as shown in (A) of Fig. 7, attract the adhesive tape 31 in the region corresponding with remainder 19。Thereby, it is possible to the adhesive tape 31 in the region corresponding with remainder 19 is peeled off from base plate for packaging 13。
It addition, when paste layer 35 comprises the resin etc. of ultraviolet ray hardening type, it is also possible to irradiation ultraviolet radiation etc. before implementing strip step and make the cohesive local in the region corresponding with remainder 19 reduce。And, it is also possible to before to the bonding adhesive tape 31 of base plate for packaging 13, at the region overlay releasing agent corresponding with remainder 19。In these cases, it is possible to be easier to and suitably release adhesive band 31。
After the splitting step, implement segmentation step, cut base plate for packaging 13 along segmentation preset lines 21, remove remainder 19 and be divided into multiple device to encapsulate base plate for packaging 13。(B) of Fig. 7 is an illustration for the side elevation in partial section of segmentation step, and (C) of Fig. 7 schematically shows the side elevation in partial section of the situation that remainder 19 disperses in segmentation step。
In segmentation step, cutting tool 38 is positioned at the height of incision adhesive tape 31, makes base plate for packaging 13 and cutting tool 38 relatively move。Thus, as shown in (B) of Fig. 7 and (C) of Fig. 7, it is possible to remove remainder 19 and be divided into multiple device to encapsulate base plate for packaging 13。
As mentioned above, owing to the topping machanism 2 of present embodiment has chuck table 12, this chuck table 12 has in the holding surface 46 of the area supporting base plate for packaging 13 except remainder 19 and forms the recess 48 in the region corresponding with remainder 19, therefore, it is possible to peeled off from base plate for packaging 13 by the adhesive tape 31 being adhered to the region corresponding with remainder 19 by making the recess 48 of this chuck table 12 produce negative pressure。Thus, when utilizing cutting unit (cutting member) 16 to cut base plate for packaging 13, it is possible to make remainder 19 disperse and remove from adhesive tape 31。That is, owing to remainder 19 need not be picked up, therefore, it is possible to maintain the productivity of device encapsulation higher。
And, in the topping machanism 2 of present embodiment, due to when the position of the segmentation preset lines 21 of the base plate for packaging 13 that be maintained on chuck table 12 with towards when being in outside the scope of regulation, to the position of chuck table 12 and machined object unit 11 with towards being adjusted, therefore, it is possible to the remainder of base plate for packaging 13 is appropriately positioned in the position corresponding with the recess 48 of chuck table 12。Thereby, it is possible to the adhesive tape 31 being adhered to the region corresponding with remainder 19 is suitably peeled off from base plate for packaging 13。
It addition, the invention is not restricted to the record of above-mentioned embodiment, it is possible to carry out various change and implement。Such as, in the topping machanism 2 of above-mentioned embodiment, utilize and control device (control member) the 44 various controls of enforcement but it also may utilize the manual work of operator to implement a part therein。And, it is possible to so that all of control is control automatically controlling of carrying out of device 44。
Additionally, the structure of above-mentioned embodiment, method etc. can suitably change in without departing from the scope of the purpose of the present invention and implement。
Claims (1)
1. a topping machanism, the machined object unit of the opening that base plate for packaging is supported on ring-shaped frame across adhesive tape is cut, and base plate for packaging is divided into each device encapsulate, this base plate for packaging comprises: device portion, and this device portion is set in the segmentation preset lines in front and is divided into multiple device packaging area；And remainder, this remainder is around this device portion, and this topping machanism is characterised by having:
Chuck table, base plate for packaging is carried out attracting holding across this adhesive tape by it；
Cutting member, the base plate for packaging being maintained on this chuck table is cut by it；
Processing feeding component, this chuck table is processed feeding by it；
Box mounting region, loads region at this box and is placed with the box receiving multiple machined object unit；
Conveyance component, it transports machined object unit along the direction vertical with the direction of this processing feeding between this box and this chuck table of being placed in this box mounting region；
Shooting component, the base plate for packaging being maintained on this chuck table is shot by it；And
Control member, each structural element is controlled by it,
This chuck table has:
Main part, it has holding surface base plate for packaging supported in the region except this remainder and is formed at the recess in the region corresponding with this remainder；And
Rotating part, it utilizes the rotating shaft vertical with this holding surface to make this main part rotate,
Utilize this shooting component that this chuck table is shot and by the location registers of this holding surface or this recess in this control member after, the base plate for packaging being maintained on this chuck table is shot and determine this segmentation preset lines position and towards, when the position of this segmentation preset lines determined with towards when being in outside the scope of regulation, this conveyance component is utilized to be taken out of from this chuck table by machined object unit, to this rotating part, this processing feeding component and this conveyance component are controlled, adjust this chuck table and machined object unit position and towards so that this segmentation preset lines position and towards in the scope being in regulation, and then machined object unit is moved into this chuck table, thus this remainder of base plate for packaging is positioned at the position corresponding with this recess of this chuck table。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-249644 | 2014-12-10 | ||
| JP2014249644A JP6415292B2 (en) | 2014-12-10 | 2014-12-10 | Cutting equipment |
Publications (2)
| Publication Number | Publication Date |
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| CN107887299A (en) * | 2016-09-30 | 2018-04-06 | 株式会社迪思科 | Processing unit (plant) |
| CN108527499A (en) * | 2017-03-06 | 2018-09-14 | 株式会社迪思科 | Processing unit (plant) |
| CN108724010A (en) * | 2017-04-24 | 2018-11-02 | 株式会社迪思科 | water jet machining device |
| CN110600395A (en) * | 2018-06-12 | 2019-12-20 | 株式会社迪思科 | Processing apparatus |
| CN110587450A (en) * | 2018-05-25 | 2019-12-20 | 株式会社迪思科 | Conveying jig and method for replacing cutting tool |
| CN110614728A (en) * | 2018-06-20 | 2019-12-27 | 株式会社迪思科 | Processing equipment |
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| US9824811B2 (en) | 2014-12-19 | 2017-11-21 | Texas Instruments Incorporated | Embedded coil assembly and method of making |
| JP6765751B2 (en) * | 2016-06-21 | 2020-10-07 | 株式会社ディスコ | Work piece holding mechanism and processing equipment |
| CN106335065A (en) * | 2016-10-31 | 2017-01-18 | 上海新朋联众汽车零部件有限公司 | Robot visual guiding system |
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| CN108527499A (en) * | 2017-03-06 | 2018-09-14 | 株式会社迪思科 | Processing unit (plant) |
| CN108527499B (en) * | 2017-03-06 | 2021-06-04 | 株式会社迪思科 | Processing device |
| CN108724010A (en) * | 2017-04-24 | 2018-11-02 | 株式会社迪思科 | water jet machining device |
| CN110587450A (en) * | 2018-05-25 | 2019-12-20 | 株式会社迪思科 | Conveying jig and method for replacing cutting tool |
| CN110600395A (en) * | 2018-06-12 | 2019-12-20 | 株式会社迪思科 | Processing apparatus |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20160070703A (en) | 2016-06-20 |
| JP6415292B2 (en) | 2018-10-31 |
| JP2016111282A (en) | 2016-06-20 |
| CN105702627B (en) | 2020-07-03 |
| KR102313927B1 (en) | 2021-10-15 |
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