CN110614728A - Processing equipment - Google Patents
Processing equipment Download PDFInfo
- Publication number
- CN110614728A CN110614728A CN201910531174.3A CN201910531174A CN110614728A CN 110614728 A CN110614728 A CN 110614728A CN 201910531174 A CN201910531174 A CN 201910531174A CN 110614728 A CN110614728 A CN 110614728A
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- China
- Prior art keywords
- processing
- machining
- processing device
- guide
- workpiece
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- 238000003754 machining Methods 0.000 claims abstract description 102
- 230000007246 mechanism Effects 0.000 claims abstract description 49
- 238000012423 maintenance Methods 0.000 claims abstract description 45
- 238000007689 inspection Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007516 diamond turning Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q39/00—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation
- B23Q39/04—Metal-working machines incorporating a plurality of sub-assemblies, each capable of performing a metal-working operation the sub-assemblies being arranged to operate simultaneously at different stations, e.g. with an annular work-table moved in steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D45/00—Sawing machines or sawing devices with circular saw blades or with friction saw discs
- B23D45/10—Sawing machines or sawing devices with circular saw blades or with friction saw discs with a plurality of circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q37/00—Metal-working machines, or constructional combinations thereof, built-up from units designed so that at least some of the units can form parts of different machines or combinations; Units therefor in so far as the feature of interchangeability is important
- B23Q37/005—Modular base frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2614—Means for mounting the cutting member
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
- B26D7/2628—Means for adjusting the position of the cutting member
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/414—Structure of the control system, e.g. common controller or multiprocessor systems, interface to servo, programmable interface controller
Abstract
Provided is a processing facility which ensures a space for maintenance and inspection of a plurality of processing devices when the processing devices are arranged in a predetermined work area. The processing equipment comprises a processing device, and the processing device is provided with: a holding member that holds a workpiece; a processing member that processes the workpiece held by the holding member; and a housing that houses the holding member and the processing member, wherein the processing apparatus has: a guide portion provided on a floor surface so that the machining device is moved by sliding between a machining position at which the machining device is positioned when the machining member machines the workpiece and a maintenance inspection position at which the machining device is positioned when the machining device is subjected to maintenance inspection, the maintenance inspection position being away from the machining position; a moving mechanism provided in the processing device, a part of which is in contact with the guide portion when the processing device slides and moves; and a fixing mechanism for fixing the processing device relative to the ground.
Description
Technical Field
The present invention relates to a processing apparatus provided with a processing device.
Background
As an example of a processing apparatus, a cutting apparatus is known which cuts a plate-like object to be processed such as a semiconductor wafer, a ceramic substrate, or a resin package substrate with an annular cutting tool. The cutting tool and the workpiece are relatively moved while cutting into the workpiece with the cutting tool rotating at a high speed, and the workpiece is cut along the path of the movement.
Generally, one machining device is used to machine one workpiece, but in order to improve work efficiency, a plurality of machining devices are sometimes used to machine a plurality of workpieces in parallel in terms of time. In this case, a plurality of processing devices are arranged in a row in a predetermined work area in a clean room of a factory or the like, for example.
In order to allow more machining devices to be installed in a predetermined work area, a reduction in the installation area (space occupied) of the machining devices has been developed. However, since the machining device needs to be periodically maintained (for example, patent document 1), even if the installation area of the machining device is reduced, a space for a worker to perform maintenance inspection on the machining device is required around the machining device.
Patent document 1: japanese patent laid-open publication No. 2015-open 98063
In order to secure a space for maintenance and inspection when a plurality of processing devices are installed in a predetermined work area in a clean room, the processing devices need to be installed separately from each other. For example, a space of about 700mm is provided between the two processing devices as a space required for an operator to perform work.
However, since the maintenance cost of the clean room is very high, when a space of about 700mm is provided between two processing apparatuses, the number of processing apparatuses installed in the clean room is reduced as compared with a case where a space of about 200mm is provided, which is required for loading and unloading the apparatuses. As a result, the maintenance cost of the clean room for each processing apparatus increases.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object of the present invention is to secure a space for maintenance and inspection of a processing device when a plurality of processing devices are arranged in a predetermined work area.
According to one aspect of the present invention, there is provided a processing apparatus including: a holding member that holds a workpiece; a processing member that processes the workpiece held by the holding member; and a housing that houses the holding member and the processing member, wherein the processing apparatus includes: a guide portion provided on a floor surface so that the machining device is moved by sliding between a machining position at which the machining device is positioned when the workpiece is machined by the machining member and a maintenance inspection position at which the machining device is positioned when the machining device is subjected to maintenance inspection, the maintenance inspection position being away from the machining position; a moving mechanism provided to the processing device, a part of the moving mechanism being in contact with the guide portion when the processing device slides and moves; and a fixing mechanism for fixing the processing device relative to the ground.
Preferably, the guide portion is provided from a surface of the floor surface to a predetermined depth position below the surface of the floor surface in a direction from the machining position to the maintenance inspection position, and the moving mechanism includes wheels.
Preferably, the machining device further includes an operation panel for operating the machining device on a front surface of the housing, and the guide portion is disposed along a direction from a rear surface of the machining device on a side opposite to the front surface toward the front surface.
The processing equipment of the invention is provided with the guide part and the moving mechanism, so that the processing device can slide from the processing position to move to the maintenance inspection position. A space for maintenance and inspection by an operator can be formed on the side and the back of the moved processing apparatus.
Therefore, even if a plurality of processing devices are provided in the clean room, the distance between the processing devices can be reduced to such an extent that the processing devices do not contact each other, and a space for maintenance and inspection of the processing devices can be secured.
Drawings
Fig. 1 is a perspective view of a processing apparatus according to embodiment 1.
Fig. 2 is a perspective view showing the inside of a door section of the processing device.
Fig. 3 is an enlarged view of the region C of fig. 1.
Fig. 4 is a plan view of the clean room of embodiment 1.
Fig. 5 is a plan view of the clean room of embodiment 2.
Fig. 6 is a plan view of a clean room of a comparative example.
Description of the reference symbols
2: processing equipment; 4a, 4 b: a processing device; 6: a ground surface; 8: a guide section; 10a, 10 b: a lower housing; 12a, 12 b: an upper housing; 12: a housing; 14a, 14 b: an operation panel; 16a, 16 b: a door section; 18a, 18 b: a moving mechanism; 20: a wheel; 22a, 22 b: a fixing mechanism; 24a, 24 b: a front side; 26a, 26 b: a back side; 28a, 28 b: a side surface; 30: a table cover; 31: a workpiece; 32: a corrugated cover; 33: a dicing tape (adhesive tape); 34: a chuck table (holding member); 34 a: a holding surface; 34 b: a frame body; 35: a frame; 36: a clamp; 37: a workpiece unit; 38: an opening; 40: processing the component; 42: a spindle housing; 44: a cutting tool; 46: a cutting water supply nozzle; 48a, 48 b: a warning light; 50: a support frame; 56x, 56y, 56 z: a foot portion; 52: a rubber foot pad; 54: a cover portion; 60: a clean room; 62: a side surface; 64: a front surface; 66: a rear surface.
Detailed Description
An embodiment of one embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view of a processing apparatus 2 according to embodiment 1. The processing facility 2 shown in fig. 1 includes a predetermined operation arranged in a clean roomMachining device 4a (4 a) on ground 6 of area1And 4a2) And a processing device 4b (4 b)1). Fig. 2 is a perspective view showing the inside of the door portion 16a of the processing device 4 a. Fig. 3 is an enlarged view of the region C of fig. 1.
The processing facility 2 shown in fig. 1 includes a pair of guide portions 8, and the pair of guide portions 8 are provided on the floor surface 6 of a predetermined working area in a clean room. The pair of guide portions 8 are provided at intervals in a predetermined direction (guide width direction D in fig. 1), and the processing device 4b is slidably provided on the guide portions 8.
The guide portion 8 of the present embodiment has a groove portion provided from the surface of the floor surface 6 to a predetermined depth position below the surface. The guide portion 8 also has a metal plate-like rail that contacts both side surfaces of the groove portion in the guide width direction D and a bottom portion of the groove portion. The plate-like rails provided on both side surfaces of the groove portion are also provided below the surface of the floor surface 6.
In this way, the guide portion 8 is provided so as not to protrude from the floor surface 6, and the operator can be prevented from being stumbled by the guide portion 8 in the clean room. In addition, even if an object is temporarily placed on the guide portion 8, the object and the guide portion 8 are not damaged.
When the processing device 4b is disposed at a position corresponding to one end in the longitudinal direction (guide longitudinal direction E in fig. 1) of the pair of guide portions 8, the processing devices 4a are provided on both sides of the processing device 4b in a predetermined direction perpendicular to the longitudinal direction. The guide portion 8 is not provided below the processing device 4a, and the processing device 4a is fixed to the floor surface 6.
In fig. 1, a machining device 4b located at one end in the guide longitudinal direction E is indicated by a dashed-dotted line. In the present embodiment, when a plurality of workpieces 31 are processed by a plurality of processing devices 4a and 4b in parallel in time, the processing device 4b is positioned at one end in the guide longitudinal direction E, and the plurality of processing devices 4a and 4b are arranged in a row along the guide width direction D.
In the present embodiment, the machining device 4b and the machining device are positioned at one end in the guide longitudinal direction E4a are arranged in a line along the guide width direction D, the machining device 4b is positioned at a machining position PA。
In contrast, when the maintenance inspection is performed on the machining devices 4a and 4b, the machining device 4b is slid to the other end on the opposite side to the one end in the guide longitudinal direction E. In FIG. 1, the solid line represents the maintenance inspection position PBThe processing apparatus 4 b. In the present embodiment, when the machining device 4b is disposed at the other end in the guide longitudinal direction E, the machining device 4b is positioned at the maintenance inspection position PB。
The processing facility 2 includes a plurality of processing devices 4a and 4b arranged on a floor surface 6 of a predetermined working area in a clean room. In fig. 1, two processing devices 4a (4 a) are shown1And 4a2) And a processing device 4b (4 b)1) However, the processing facility 2 according to embodiment 1 includes a total of nine processing devices 4a (4 a)1、4a2、4a3、4a4、4a5) And 4b (4 b)1、4b2、4b3、4b4) (refer to fig. 4).
The total number of the processing devices 4a and 4b included in the processing facility 2 is not limited to nine. The processing facility 2 may include two to eight processing devices 4a and 4b in total, or may include ten or more processing devices 4a and 4b in total.
The processing devices 4a and 4b are the same type of processing device. The machining devices 4a and 4b of the present embodiment are cutting devices that cut the workpiece 31. Since the processing devices 4a and 4b are the same processing device, the shape, structure, and the like of the processing device 4a will be described.
The length of the processing device 4a in the width direction (guide width direction D) is approximately 500mm, the length in the depth direction (guide length direction E) is approximately 900mm, and the length in the height direction (height direction F perpendicular to the guide width direction D and the guide length direction E) is approximately 1600 mm.
A lower housing 10a is provided in a substantially lower half of the processing device 4 a. The lower case 10a is a metal case, and houses a vacuum generation source, piping, wiring, and the like (none of which are shown) used for processing the workpiece 31.
An upper case 12a is provided above the lower case 10 a. In this specification, the lower case 10a and the upper case 12a are collectively referred to as a case 12.
An operation panel 14a is provided on the front surface 24a of the upper case 12 a. The operator can operate the machining device 4a via the operation panel 14 a. For example, the operator can set the machining conditions of the workpiece 31 via the operation panel 14 a. For example, the operator can select maintenance items via the operation panel 14 a.
The opposite side of the upper case 12a from the operation panel 14a is a rear surface 26a of the processing device 4 a. The direction from the back surface 26a to the front surface 24a of the processing device 4a is parallel to the guide longitudinal direction E.
A pair of side surfaces 28a is provided along the guide longitudinal direction E between the front surface 24a and the back surface 26a of the housing 12 in the processing device 4 a. A warning lamp 48a for notifying an operator of an abnormality or the like of the machining device 4a is provided on the upper surface of the machining device 4a surrounded by the front surface 24a, the rear surface 26a, and the pair of side surfaces 28 a.
A door portion 16a is provided below the operation panel 14a in the upper case 12 a. The operator can open the door portion 16a to access the inside of the upper case 12 a. Further, a part of the door portion 16a is transparent, and even in a state where the door portion 16a is closed, the inside of the upper case 12a can be visually recognized.
As shown in fig. 2, a processing member 40 or the like for processing the workpiece 31 is housed in the upper case 12a in the vicinity of the door portion 16 a. The machining member 40 of the present embodiment is a cutting unit, and has a spindle (not shown) as a rotation axis parallel to the Y-axis direction (indexing direction).
The spindle portion of the cutting unit is housed in a cylindrical spindle housing 42. The spindle housing 42 can rotatably support the spindle by a so-called air bearing.
A cutting tool 44 is attached to one end side of the spindle exposed to the outside of the spindle case 42. Further, a pair of cutting water supply nozzles 46 are provided so as to sandwich the cutting blade 44 in the Y-axis direction.
The cutting water supply nozzle 46 has a pipe portion provided along the X-axis direction (machining feed direction) and a plurality of ejection ports arranged so as to face the cutting tool 44. When cutting the workpiece 31, cutting water is supplied to the cutting tool 44 from the plurality of injection ports.
A rotation drive source (not shown) such as a motor is provided on the other end side of the spindle on the opposite side to the cutting tool 44. The motor is coupled to the main shaft and can rotate the main shaft at a high speed.
The workpiece 31 to be machined by the cutting means is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. The front side of the workpiece 31 is divided into a plurality of regions by a plurality of lines to divide (streets) intersecting each other, and devices such as ICs (Integrated circuits) are formed in each region.
The material, shape, structure, size, and the like of the workpiece 31 are not limited. For example, a substrate made of other materials such as a semiconductor, a ceramic, a resin, and a metal may be used as the object 31. Similarly, the kind, number, shape, configuration, size, arrangement, and the like of the device are not limited. A device may not be formed on the workpiece 31.
A dicing tape (adhesive tape) 33 having a larger area than the work 31 is attached to the back surface side of the work 31. The dicing tape 33 includes, for example, a base material layer and an adhesive layer provided on the entire surface of the base material layer. The adhesive layer is an ultraviolet-curable resin layer and exerts strong adhesive force to the workpiece 31 and the frame 35.
The adhesive layer of the outer peripheral portion of the dicing tape 33 is fixed to the annular frame 35. A workpiece unit 37 is formed by supporting a plate-like workpiece 31 on the dicing tape 33 in the opening of the frame 35.
The workpiece 31 is machined by the machining member 40 in the state of the workpiece unit 37. An opening 38 that is long in the X-axis direction is formed below the processing member 40. The table cover 30 and the corrugated cover 32 are disposed in the opening 38.
A ball screw type X-axis moving mechanism (machining feed unit) (not shown) is disposed below the table cover 30 and the corrugated cover 32. The region on the table cover 30 and the region where the X-axis moving mechanism is disposed are spatially separated by the table cover 30 and the corrugated cover 32.
The X-axis movement mechanism includes a pair of X-axis rails (not shown) provided along the X-axis direction, and an X-axis movement table (not shown) is slidably provided on the pair of X-axis rails.
A nut portion (not shown) is provided on the lower surface side of the X-axis moving table, and an X-axis ball screw parallel to the X-axis guide rail is screwed into the nut portion. An X-axis pulse motor (not shown) is connected to one end of the X-axis ball screw. The X-axis ball screw is rotated by an X-axis pulse motor, and the X-axis moving table is moved in the X-axis direction along the X-axis guide rail.
A chuck table 34 (holding member) is connected to the X-axis moving table. The chuck table 34 is disposed so as to be exposed above the table cover 30. Four clamps 36 are provided around the chuck table 34, and the annular frame 35 is fixed from four sides by the clamps 36. The chuck table 34 is movable in the X-axis direction together with the X-axis moving table.
The chuck table 34 has a circular frame 34b made of a conductive metal such as stainless steel. The frame 34b has a concave portion on the upper surface side, and a disc-shaped porous plate made of porous ceramics or the like having pores is disposed in the concave portion of the frame 34 b.
The pores of the porous plate are connected to a suction member (not shown) such as a vacuum pump through a flow path (not shown) provided below the chuck table 34. The work 31 placed on the chuck table 34 is sucked and held on the holding surface 34a of the porous plate via the dicing tape 33 by the negative pressure of the suction member.
The cutting tool 44 rotating at a high speed is moved relative to the chuck table 34 while cutting the workpiece 31 held on the holding surface 34a of the chuck table 34, and cuts the workpiece 31 along the path of the movement.
In the present embodiment, the X-axis direction, the Y-axis direction, and the Z-axis direction coincide with the guide width direction D, the guide length direction E, and the height direction F. That is, the X-axis direction is parallel to the guide width direction D, the Y-axis direction is parallel to the guide length direction E, and the Z-axis direction is parallel to the height direction F.
Returning to fig. 1, the processing apparatus 4b includes a lower housing 10b, and an upper housing 12b is provided above the lower housing 10b, as in the processing apparatus 4 a. The processing device 4b has an operation panel 14b and a door portion 16b on a front surface 24b, and a warning lamp 48b on an upper surface sandwiched between the front surface 24b and a rear surface 26 b. The machining device 4b includes a machining member 40, a chuck table 34, and the like in the upper case 12 b.
A moving mechanism 18b and a fixing mechanism 22b are provided at four corners of the bottom of the lower case 10b of the processing apparatus 4 b. Next, the support frame 50 to which the moving mechanism 18b and the fixing mechanism 22b are fixed will be described with reference to fig. 3.
A metal support frame 50 constituting a base of the processing device 4b is provided in the lower case 10 b. The support frame 50 has, for example, a plurality of legs provided in mutually perpendicular directions. The support frame 50 of the present embodiment has a prismatic leg portion 56Z provided along the Z-axis direction.
The leg 56z is connected to the upper surface of a prismatic leg 56X provided along the X-axis direction. A prismatic leg portion 56Y provided along the Y-axis direction is connected to the side surface of the leg portion 56x on the front surface 24b side.
The moving mechanism 18b and the fixing mechanism 22b are fixed to the prismatic leg portion 56 x. The moving mechanism 18b is located on the inner side in the X-axis direction than the fixing mechanism 22 b. Similarly, the moving mechanism 18b is located on the inner side in the X-axis direction than the fixing mechanism 22b in the other corner portions located at the bottom of the lower case 10 b.
The moving mechanism 18b of the present embodiment has wheels 20 positioned on the guide portion 8. The processing device 4b is arranged at the processing position PAIn the case of (3), a part of the wheel 20 of the moving mechanism 18b is in contact with the guide portion 8, and the processing device 4b is supported by the moving mechanism 18 b.
When performing maintenance inspection on the processing devices 4a and 4b, the processing device 4b is pulled out in the guide length direction E. At this time, the wheel 20 rotates along the guide portion 8. This allows the machining device 4b to smoothly slide and move along the guide longitudinal direction E.
In the present embodiment, when performing maintenance inspection of the machining devices 4a and 4b, the machining device 4b is moved from the machining position P by one or more workersAPulled out to a maintenance inspection position PB. The machining device 4b may be pushed out by one or more workers, or may be pulled out and pushed out simultaneously.
The fixing mechanism 22b includes: a cylindrical rubber foot pad 52; and a cover portion 54 made of metal and connected to the rubber foot 52 so as to cover the upper side of the rubber foot 52. For example, a male screw portion connected to the bottom surface of the prismatic leg 56x and movable in the Z-axis direction is provided at the upper end of the cover portion 54. By rotating the cover portion 54 about the Z-axis direction, the rubber foot 52 and the cover portion 54 can be moved in the Z-axis direction.
For example, by rotating cover 54 clockwise, rubber pad 52 and cover 54 can be lowered in height direction F, and by rotating cover 54 counterclockwise, rubber pad 52 and cover 54 can be raised in height direction F.
The rubber foot 52 and the cover 54 are lowered to press the rubber foot 52 against the surface of the floor surface 6, whereby the machining device 4b is fixed to the floor surface 6 by the weight of the machining device 4b and the frictional force between the fixing mechanism 22b and the floor surface 6.
Thus, the machining position P is setAIs supported by the fixing mechanism 22b and is fixed relative to the floor 6. When the processing device 4b is fixed to the floor surface 6, the moving mechanism 18b is in contact with the rail at the bottom of the guide portion 8, but is not supported by the moving mechanism 18 b.
However, when the processing device 4b is moved to a position away from the processing position PAMaintenance inspection position PBAt this time, the rubber foot 52 and the cover 54 are raised while being rotated counterclockwise. Thereby, the processing device 4b is supported by the moving mechanism 18 b.
As described above, the machining device 4b (the machining device 4b in fig. 1) is provided with1) A pair of guide portions 8 are provided on the lower floor surface 6 along the guide longitudinal direction E. When the processing device 4b is at the secondary processing position PAToward the maintenance inspection position PBWhen the machining device 4b is slid and moved in the guide longitudinal direction E, the moving mechanism 18b moves the machining device 4b along the guide portion 8.
The machining device 4b weighs about 400kg, but the machining device 4b can be moved by one or more operators by using the moving mechanism 18b and the guide 8. Maintenance inspection position PBFor example, with the machining position PAThe length in the guide longitudinal direction E of one processing device 4b is set apart.
Is positioned at a maintenance inspection position PBThe processing device 4b of (4 b) may be fixed again by the fixing mechanism 22b so as not to move along the guide portion 8. That is, the fixing mechanism 22b is lowered to support the processing device 4b by the fixing mechanism 22b, and the processing device 4b is not supported by the moving mechanism 18 b.
The processing device 4b is moved to the maintenance inspection position PBAfter that, maintenance inspection is performed on the processing devices 4a and 4b, respectively. After the maintenance inspection is completed, the fixing mechanism 22b is raised again to support the machining device 4b by the moving mechanism 18 b. Then, the machining device 4b is returned to the machining position P by sliding the machining device 4b by one or more operatorsA。
In the present embodiment, at the time of maintenance inspection, only the machining device 4b of the plurality of machining devices 4a and 4b is slid and pulled out to the maintenance inspection position PB. This ensures a space for maintenance and inspection in the vicinity of the side surfaces 28a and 28b of the processing devices 4a and 4 b.
In addition, in the present embodiment, during machining, the distance in the guide width direction D between the machining devices 4a and 4b is reduced to such an extent that the adjacent machining devices 4a and 4b do not come into contact with each other, and the plurality of machining devices 4a and 4b are arranged linearly along the guide width direction D.
This can suppress the floor area per processing device 4a and 4b obtained by dividing the floor area of the clean room floor 6 by the total number of processing devices 4a and 4b, and therefore can suppress the maintenance cost of the clean room per processing device 4a and 4 b. In addition, the number of processing devices 4a and 4b that can be arranged on the floor 6 can be increased.
In the present embodiment, since the processing device 4b is additionally provided between the two processing devices 4a, the space between the two processing devices 4a (i.e., the space for maintenance and inspection) can be secured by sliding the processing device 4b without changing the space between the two processing devices 4 a.
Normally, a predetermined length (for example, about 700mm) is required to be uniformly provided between the processing devices 4a as a space for maintenance and inspection, but this requirement can be satisfied in the present embodiment. In the present embodiment, the distance (d) between the two processing devices 4a can be set1) The area of arrangement with the processing devices 4a and 4b (i.e., occupied space: s1) Ratio of (d)1/S1) Is smaller than the interval (d) between the two processing devices 4a when only the processing device 4a is installed on the floor surface 62) Area (S) of installation of the machining device 4a2) Ratio of (d)2/S2)。
Further, the smaller the installation area of each processing device 4a (i.e., the smaller the size of the processing device 4 a), the smaller the distance (d) between the two processing devices 4a when only the processing device 4a is disposed on the floor surface 62) Area (S) of installation of the machining device 4a2) Ratio of (d)2/S2) The larger.
In contrast, in the present embodiment, the machining device 4b is provided, so that the ratio (d) can be set1/S1) Relatively small, and therefore, even when the installation area of each of the processing devices 4a and 4b is reduced, the ratio (d) can be relatively suppressed1/S1) Is increased.
In addition, at the processing position PAThe lower limit of the distance in the guide width direction D between the processing devices 4a and 4b disposed adjacent to each other may be a degree that a hand of a worker enters, and is, for example, 100mm to 200 mm. If the interval is setThe operator does not get in the way of the work when pulling out or pushing out the machining device 4 b.
In addition, at the processing position PAThe upper limit of the interval in the guide width direction D between the processing devices 4a and 4b disposed adjacent to each other is, for example, about one third of the length in the width direction of the processing device 4a or 4 b. However, as described above, it is desirable that the interval in the guide width direction D between the adjacent processing devices 4a and 4b is as small as possible.
Further, the moving mechanism 18a and the fixing mechanism 22a are also provided at four corners of the bottom portion of the lower case 10b of the processing device 4a, and the processing device 4a is also fixed to the floor surface 6 by the fixing mechanism 22 a.
Next, the arrangement of the plurality of processing devices 4a and 4b in the clean room 60 will be described. Fig. 4 is a plan view of the clean room 60 of embodiment 1. In embodiment 1, the processing devices 4a and 4b are arranged linearly along a direction (guide width direction D) from one side surface 62 to the other side surface 62 of the clean room 60 at an intermediate position between the front surface 64 and the rear surface 66 of the clean room 60.
In the present embodiment, five processing devices 4a (i.e., 4 a) are linearly arranged along the guide width direction D1、4a2、4a3、4a4And 4a5) And four processing devices 4b (i.e., 4 b)1、4b2、4b3And 4b4) The processing devices 4a and 4b are alternately arranged. In fig. 4, the solid line indicates the machining position PAThe machining device 4b is arranged at the maintenance inspection position P as indicated by a chain lineBThe processing apparatus 4 b.
By arranging the plurality of processing devices 4a and 4b in this manner, the plurality of workpieces 31 can be processed in parallel in time by using the plurality of processing devices 4a and 4 b. This can improve the work efficiency of machining the workpiece 31.
In addition, the machining positions P of the machining devices 4a and 4bAIt may not be necessary to set in the central portion of the clean room 60. Fig. 5 is a plan view of the clean room 60 of embodiment 2. In embodiment 2, a machining device4a and 4b machining position PAThe guide member is linearly arranged on the rear surface 66 side with respect to the intermediate position between the front surface 64 and the rear surface 66 along the guide width direction D.
Pipes and the like may be provided along the guide width direction D on the rear surface 66 of the clean room 60. Further, if the operator can access the front surface 24a and the side surface 28a of the machining device 4a, the maintenance inspection work may be performed even if the operator cannot access the rear surface 26a of the machining device 4 a.
Therefore, in embodiment 2, the space between the processing devices 4a and 4b and the rear surface 66 of the clean room 60 is intentionally made narrow, so that instead, the space between the processing devices 4a and 4b and the front surface 64 of the clean room 60 is made enlarged.
This makes it possible to provide necessary equipment, goods, and the like between the processing devices 4a and 4b and the front surface 64 of the clean room 60, and facilitates work in the space between the processing devices 4a and 4b and the front surface 64 of the clean room 60.
Next, a description will be given of a comparative example in which the machining device 4b according to embodiments 1 and 2 and the guide portion 8 below the machining device 4b are removed. Fig. 6 is a plan view of a clean room 60 of a comparative example. In the comparative example of fig. 6, the processing apparatus 4b is removed from the plurality of processing apparatuses 4a and 4b of embodiment 1.
In this comparative example, although the operator can easily access the periphery of the processing device 4a, the total number of the processing devices 4a and 4b provided in the clean room 60 is smaller than that of the first and second embodiments, and therefore, there is a problem in that the maintenance cost of the clean room 60 for each processing device 4a is increased.
Therefore, when considering both the ease of maintenance inspection of the processing devices 4a and 4b and the maintenance cost of the clean room 60 of each processing device 4a, it is desirable to configure the processing devices 4a and 4b as in the first and second embodiments.
Further, although the machining devices 4a and 4b of the above embodiments are cutting devices (i.e., dicers) having a cutting unit as the machining member 40, the machining devices 4a and 4b may have another machining unit. The processing devices 4a and 4b may be a grinder (grinder) having a grinding wheel, a laser cutter (laser saw) having a laser processing unit, or a finisher (surface finisher) having a diamond turning tool.
The processing devices 4a and 4b may be cleaning devices for cleaning the workpiece 31, or may be coating devices for coating the front surface of the workpiece 31 with a protective film of resin. In addition, the processing devices 4a and 4b may be expanding (expander) devices that expand the circular dicing tape 33 of the object unit 37 in the circumferential direction.
In addition, as a modification of the first and second embodiments 1 and 2, the fixing mechanisms 22a and 22b of the processing devices 4a and 4b may be provided on the floor surface 6 of the clean room 60 instead of the processing devices 4a and 4 b. For example, the fixing mechanism 22a pushes up the lower housing 10a of the processing device 4a, and the moving mechanism 18a attached to the processing device 4a is raised from the bottom of the guide portion 8.
In addition, the structure, method, and the like of the above embodiments may be modified and implemented as appropriate without departing from the scope of the object of the present invention. For example, two or more processing devices 4b may be adjacent to each other in the guide width direction D. In addition, all the processing apparatuses of the clean room 60 may be the processing apparatus 4b provided with the guide portion 8.
In addition, as a modification of embodiment 2 shown in fig. 5, the inspection position P may be maintainedBNine processing devices 4a and 4b are additionally arranged linearly along the guide width direction D at a position closer to the front surface 64 side than the intermediate position between the front surface 64 and the rear surface 66, with an imaginary line extending in the guide width direction D as a symmetry axis. In this case, the nine machining devices 4a and 4b on the front surface 64 side and the nine machining devices 4a and 4b on the rear surface 66 side are opposed to the above-described symmetry axis.
In addition, the additional nine machining devices 4a and 4b on the front surface 64 side may be provided along the machining device 4a on the rear surface 66 side with respect to the axis of symmetry1A processing device 4a facing the rear surface 66 side5The direction of the opposite position is in accordance with the processing device 4a1、4b1、4a2、4b2、4a3、4b3、4a4、4b4、4a5May be arranged in the order of the processing device 4b1、4a1、4b2、4a2、4b3、4a3、4b4、4a4And 4b5Are arranged in sequence.
In addition, as long as the processing device 4b and the processing device 4a can be arranged substantially in a line along the guide width direction D, the processing position P is processedAIt may not necessarily be one end of the guide length direction E. In addition, only the inspection position P needs to be maintainedBAlong the guide length direction E and the processing position PAThe length in the guide longitudinal direction E of one processing device 4b is set to be about the same, and the other end in the guide longitudinal direction E is not necessarily required.
Claims (3)
1. A processing apparatus comprising a processing device having: a holding member that holds a workpiece; a processing member that processes the workpiece held by the holding member; and a housing that houses the holding member and the processing member,
the processing equipment is characterized by comprising:
a guide portion provided on a floor surface so that the machining device is moved by sliding between a machining position at which the machining device is positioned when the workpiece is machined by the machining member and a maintenance inspection position at which the machining device is positioned when the machining device is subjected to maintenance inspection, the maintenance inspection position being away from the machining position;
a moving mechanism provided to the processing device, a part of the moving mechanism being in contact with the guide portion when the processing device slides and moves; and
a securing mechanism for securing the processing device relative to the ground.
2. The processing apparatus according to claim 1,
the guide part is provided from the surface of the floor surface to a predetermined depth position below the surface of the floor surface in a direction from the machining position to the maintenance inspection position,
the moving mechanism has wheels.
3. The processing plant according to claim 1 or 2,
the processing device is also provided with an operation panel on the front surface of the shell for operating the processing device,
the guide portion is disposed along a direction from a back surface of the processing device on a side opposite to the front surface toward the front surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-117134 | 2018-06-20 | ||
| JP2018117134A JP7098234B2 (en) | 2018-06-20 | 2018-06-20 | Processing facilities |
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| CN110614728A true CN110614728A (en) | 2019-12-27 |
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| JP (1) | JP7098234B2 (en) |
| KR (1) | KR102651670B1 (en) |
| CN (1) | CN110614728A (en) |
| TW (1) | TWI788575B (en) |
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2019
- 2019-05-28 KR KR1020190062332A patent/KR102651670B1/en active IP Right Grant
- 2019-06-17 TW TW108120945A patent/TWI788575B/en active
- 2019-06-19 CN CN201910531174.3A patent/CN110614728A/en active Pending
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| CN102233526A (en) * | 2010-04-21 | 2011-11-09 | 佳能株式会社 | Robotic cell |
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| KR102651670B1 (en) | 2024-03-26 |
| KR20190143361A (en) | 2019-12-30 |
| JP2019217598A (en) | 2019-12-26 |
| TWI788575B (en) | 2023-01-01 |
| TW202000363A (en) | 2020-01-01 |
| JP7098234B2 (en) | 2022-07-11 |
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