JP6448456B2 - Processing equipment - Google Patents

Description

  The present invention relates to a processing apparatus for processing a plate-shaped workpiece.

  In a semiconductor device manufacturing process, the surface of a wafer made of a semiconductor material such as silicon is partitioned by a plurality of division lines called streets, and an electronic circuit (device) such as an IC or LSI is formed in each region. For example, a wafer on which a device is formed is processed into an arbitrary thickness by a grinding apparatus (including a polishing apparatus) and then divided into a plurality of device chips corresponding to each device by a cutting apparatus or a laser processing apparatus. The

  The plate-like workpiece typified by the wafer described above is usually carried into a processing apparatus such as a grinding apparatus (polishing apparatus), a cutting apparatus, or a laser processing apparatus while being accommodated in a cassette (for example, a patent) Reference 1). A plurality of workpieces (workpieces of the same production lot) produced in the same process are accommodated in one cassette, and the machining conditions for the workpieces are set for each cassette.

JP 2011-159823 A

  In the processing apparatus described above, when the processing of all the workpieces contained in one cassette is completed, this cassette is replaced with the next cassette, and the processing of the workpiece is continued. However, for example, when the number of workpieces accommodated in one cassette is reduced as in the case of multi-product small-volume production, the frequency of interruption of processing accompanying the replacement of the cassette is increased, and the productivity is lowered.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a processing apparatus capable of realizing high productivity.

  According to the present invention, a cassette mounting for mounting a chuck table for holding a workpiece, a processing means for processing the workpiece held on the chuck table, and a cassette for storing a plurality of workpieces. An area, a cassette placed in the cassette placement area, a temporary placement area where the work piece is temporarily placed, and a conveying means for transporting the work piece between the chuck table, and a processing condition of the work piece A processing unit comprising: an input unit that inputs a storage condition; a storage unit that stores the processing conditions; and a control unit that controls each component. The cassette mounting area includes a first type of first cover. A first area on which a first cassette for accommodating a workpiece is placed; and a second area on which a second cassette for accommodating a second workpiece of a second type is placed, the storage means Is a first processing condition corresponding to the first workpiece, and the first processing condition A second machining condition corresponding to the workpiece, and before the last machining of the last workpiece to be machined last among the first workpieces stored in the first cassette is completed. The first second workpiece to be processed first among the second workpieces accommodated in the second cassette is temporarily placed in the temporary placement area, and the last first workpiece is processed. When the process is completed, the last first work piece held on the chuck table is unloaded from the chuck table, and the first second work piece temporarily placed in the temporary placement area is carried into the chuck table. There is provided a processing apparatus characterized by:

  In the present invention, the first area and the second area are arranged at positions overlapping each other when viewed in the vertical direction, and the second cassette is placed in a state where the first cassette is placed in the first area. The second cassette placed in the area can be taken out from the second area or replaced with another cassette, and the second cassette is placed in the second area. It is preferable that the mounted first cassette can be removed from the first area or replaced with another cassette.

  In the processing apparatus according to the present invention, before the processing of the last first workpiece to be processed last among the first workpieces stored in the first cassette is completed, the first stored in the second cassette. The first second workpiece to be processed first of the two workpieces is temporarily placed in the temporary placement area, and when the last first workpiece is finished, the last first workpiece held on the chuck table is finished. Since the workpiece is unloaded from the chuck table and the first second workpiece temporarily placed in the temporary placement area is loaded into the chuck table, the waiting time of the chuck table is reduced when switching from the first cassette to the second cassette. Disappear. Thereby, the process of a 1st workpiece and the process of a 2nd workpiece are continuously implemented, and high productivity is realizable.

It is a figure which shows typically the structural example of a cutting device (processing apparatus). It is a figure which shows typically a mode that a 1st cassette is replaced | exchanged during the cutting of the workpiece accommodated in the 2nd cassette.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram schematically illustrating a configuration example of a cutting device (processing device) according to the present embodiment. As shown in FIG. 1, the cutting device (processing device) 2 includes a base 4 that supports each structure. A part of the upper surface of the base 4 is covered with a housing 6.

  A space is formed inside the housing 6, and a cutting unit (processing means) 10 (see FIG. 2) including a cutting blade 8 (see FIG. 2) is accommodated. Cassette elevators (cassette placement areas) 12 are provided at corners of the base 4 that are not covered with the housing 6. A first cassette 14 a and a second cassette 14 b that can accommodate a plurality of workpieces 11 (see FIG. 2) are mounted on the cassette elevator 12.

  The cassette elevator 12 includes a first area 12a on which the first cassette 14a is mounted and a second area 12b on which the second cassette 14b is mounted. The first region 12a and the second region 12b are arranged at positions overlapping each other when viewed from the Z-axis direction (vertical direction), and the first cassette 14a and the second cassette 14b are supported at different heights.

  The cassette elevator 12 is configured to be movable up and down, and adjusts the position of the workpiece 11 accommodated in the first cassette 14a and the second cassette 14b in the Z-axis direction. The workpiece 11 is, for example, a disk-shaped wafer made of a semiconductor such as silicon, and is supported by an annular frame (not shown) via a dicing tape (not shown) attached to the back side. However, the material, shape, and the like of the workpiece 11 are not limited. For example, a substrate made of a material such as ceramic, resin, or metal can be used as the workpiece 11.

  On the upper surface of the base 4, a rectangular opening 4 a that is long in the X-axis direction is formed at a position adjacent to the cassette elevator 12. Within this opening 4a, a moving table 16 that moves between the inside and the outside of the housing 6 in the X-axis direction, an X-axis moving mechanism (not shown) that moves the moving table 16 in the X-axis direction, and an X-axis A dustproof and splashproof cover 18 is provided to cover the moving mechanism.

  A chuck table 20 that sucks and holds the workpiece 11 is provided above the moving table 16. Around the chuck table 20, four clamps 22 for fixing an annular frame for supporting the workpiece 11 from four directions are provided. The chuck table 20 and the clamp 22 move in the X-axis direction together with the moving table 16 described above.

  The chuck table 20 is connected to a rotation mechanism (not shown) including a motor and the like, and rotates around a rotation axis substantially parallel to the Z-axis direction. The upper surface of the chuck table 20 is a holding surface 20 a that sucks and holds the workpiece 11. The holding surface 20a is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 20.

  Above the opening 4 a, a temporary placement mechanism (temporary placement area) 24 for temporarily placing the workpiece 11 (frame) is provided at a position close to the cassette elevator 12. The temporary placement mechanism 24 includes a pair of guide rails 24a and 24b that are approached and separated while maintaining a state parallel to the Y-axis direction. Each guide rail 24a, 24b includes a support surface that supports the workpiece 11 and a side surface perpendicular to the support surface, and the workpiece 11 (frame) is sandwiched in the X-axis direction so as to be aligned with a predetermined position.

  A circular opening 4b is formed at a position opposite to the cassette elevator 12 with respect to the opening 4a. A cleaning unit 26 for cleaning the workpiece 11 after cutting is provided in the opening 4b.

  A side surface 6 a of the housing 6 is provided with a first Y-axis moving mechanism 30 that moves a first transport unit (transport means) 28 that transports the workpiece 11 in the Y-axis direction. The first Y-axis moving mechanism 30 includes a pair of guide rails 32 arranged on the side surface 6a of the housing 6 and parallel to the Y-axis direction. A first slide plate 34 is slidably attached to the guide rail 32.

  The first slide plate 34 is provided with a nut portion having a screw hole penetrating in the Y-axis direction, and a ball screw 36 substantially parallel to the guide rail 32 is screwed into the nut portion. A pulse motor 38 is connected to one end of the ball screw 36. The first slide plate 34 moves in the Y-axis direction along the guide rail 32 by rotating the ball screw 36 with the pulse motor 38.

  A first suction unit 42 and a gripping unit 44 are provided below the first slide plate 34 via a first lifting mechanism 40. The first transport unit 28 holds the workpiece 11 (frame) with the first suction unit 42 or the gripping unit 44, and the Y-axis with the first Y-axis moving mechanism 30 or the first lifting mechanism 40. Move in the direction or Z-axis direction.

  Above the first Y-axis movement mechanism 30, a second Y-axis movement mechanism 48 that moves the second conveyance unit 46 that conveys the workpiece 11 in the Y-axis direction is provided. The second Y-axis moving mechanism 48 includes a pair of guide rails 50 arranged on the side surface 6a of the housing 6 and parallel to the Y-axis direction. A second slide plate 52 is slidably attached to the guide rail 50.

  The second slide plate 52 is provided with a nut portion having a screw hole penetrating in the Y-axis direction, and a ball screw 54 substantially parallel to the guide rail 50 is screwed into the nut portion. A pulse motor 56 is connected to one end of the ball screw 54. By rotating the ball screw 54 with the pulse motor 56, the second slide plate 52 moves in the Y-axis direction along the guide rail 50.

  A second suction unit 60 is provided below the second slide plate 52 via a second lifting mechanism 58. The second transport unit 46 holds the workpiece 11 (frame) with the second suction unit 60, and the Y-axis direction or the Z-axis with the second Y-axis moving mechanism 48 or the second lifting mechanism 58. Move in the direction.

  A touch panel monitor (input means) 62 for inputting processing conditions and the like of the workpiece 11 is provided on the front surface 6 b of the housing 6. The monitor 62 includes a cutting unit 10, a cassette elevator 12, an X-axis moving mechanism, a chuck table 20, a cleaning unit 26, a first transport unit 28, a first Y-axis moving mechanism 30, a first lifting mechanism 40, a first Along with components such as the second transport unit 46, the second Y-axis moving mechanism 48, and the second lifting mechanism 58, the control unit (control means) 64 is connected. The control unit 64 includes a storage unit (storage unit) 64a formed of a rewritable memory or the like, and the machining conditions input to the monitor 62 are stored in the storage unit 64a.

  For example, when processing the first type of workpiece (first workpiece) 11 accommodated in the first cassette 14a with the processing apparatus 2, first, the cassette elevator 12 is moved up and down to move the workpiece. The workpiece 11 (frame) is adjusted to a height that can be gripped by the gripping unit 44 of the first transport unit 28.

  Next, the workpiece 11 in the first cassette 14a is gripped by the gripping unit 44 and pulled out to the temporary placement mechanism 24 (guide rails 24a, 24b). The guide rails 24a and 24b sandwich the drawn work piece 11 in the X-axis direction and adjust it to a predetermined position. Thereafter, the workpiece 11 on the guide rails 24 a and 24 b is sucked by the first suction unit 42 of the first transport unit 28 and transported to the chuck table 20.

  The workpiece 11 conveyed to the chuck table 20 is cut by the cutting unit 10 inside the housing 6. Cutting of the workpiece 11 is performed based on the processing conditions (first processing conditions) stored in the storage unit 64a. Before the cutting of the workpiece 11 is completed, the above-described procedure is repeated, and another workpiece (first workpiece) 11 is pulled out from the first cassette 14a to the temporary placement mechanism 24. .

  The workpiece 11 after cutting is sucked by the second suction unit 60 of the second transport unit 46 and transported to the cleaning unit 26. In addition, another workpiece 11 pulled out to the temporary placement mechanism 24 is similarly sucked by the first suction unit 42 of the first transport unit 28 and transported to the chuck table 20.

  The workpiece 11 cleaned by the cleaning unit 26 is sucked by the first suction unit 42 of the first transport unit 28 and transported to the temporary placement mechanism 24. Thereafter, the workpiece 11 is gripped by the gripping unit 44 and accommodated in the first cassette 14a. According to this procedure, since there is no waiting time for the chuck table 20 or the like, the workpiece 11 can be continuously cut.

  When all the first types of workpieces (first workpieces) 11 housed in the first cassette 14a have been cut, the second type of workpieces (the second cassette 14b) Cutting of the second workpiece 11) is started.

  The cutting procedure of the workpiece 11 accommodated in the second cassette 14b is substantially the same as the cutting procedure of the workpiece 11 accommodated in the first cassette 14a. However, the cutting of the workpiece 11 accommodated in the second cassette 14b is performed based on the processing conditions (second processing conditions) stored in the storage unit 64a.

  Here, for example, when the workpiece 11 processed at the end of the first cassette 14a is received in the first cassette 14a and the first workpiece 11 of the second cassette 14b is conveyed, the chuck table A waiting time of 20 or the like occurs and cutting cannot be performed continuously. As a result, productivity decreases. This problem is serious in the case of high-mix low-volume production with a small number of workpieces accommodated in one cassette.

  Therefore, in the cutting device 2 according to the present embodiment, the workpiece to be processed last (the first first workpiece) among the workpieces (first workpiece) 11 accommodated in the first cassette 14a. Before the cutting of 11 is completed, the first workpiece to be processed (first second workpiece) 11 among the workpieces (second workpiece) 11 accommodated in the second cassette 14b is removed. Pull out from the second cassette 14 b to the temporary placement mechanism 24.

  When the last workpiece 11 in the first cassette 14a is cut, the last workpiece 11 is unloaded from the chuck table 20 and the first cassette 14b temporarily placed on the temporary placement mechanism 24 is first transferred. The workpiece 11 is carried into the chuck table 20. That is, the workpiece 11 held on the chuck table 20 is exchanged from the last workpiece 11 of the first cassette 14a to the first workpiece 11 of the second cassette 14b.

  In this procedure, since there is no waiting time of the chuck table 20 when switching from the first cassette 14a to the second cassette 14b, the workpiece 11 stored in the first cassette 14a and the second cassette 14b are stored. Further, it is possible to realize high productivity by continuously performing the cutting of the workpiece 11.

  Note that after all the workpieces (first workpieces) 11 in the first cassette 14a have been cut, the first cassette 14a is replaced with another cassette. FIG. 2 is a diagram schematically showing how the first cassette 14a is replaced during the cutting of the workpiece 11 accommodated in the second cassette 14b.

  As shown in FIG. 2, the first region 12a on which the first cassette 14a is mounted and the second region 12b on which the second cassette 14b is mounted are configured to be slidable. Therefore, for example, when the second cassette 14b is mounted in the second region 12b, the first region 14a is taken out by sliding the first region 12a, and the first cassette 14a is taken out. The cassette 14c can be exchanged.

  Similarly, in the state where the first cassette 14a is mounted on the first area 12a, the second area 12b is slid and pulled out to take out the second cassette 14b mounted on the second area 12b, Can be replaced with a cassette. That is, high productivity can be realized by exchanging the cassette without interrupting the cutting of the workpiece 11.

  As described above, in the cutting device (processing device) 2 according to the present embodiment, the workpiece to be processed last (the last workpiece) among the workpieces (first workpiece) 11 accommodated in the first cassette 14a. Before the processing of the first workpiece 11) is completed, the workpiece to be processed first (the first second workpiece) among the workpieces (second workpiece) 11 accommodated in the second cassette 12b. (Workpiece) 11 is temporarily placed in the temporary placement area, and when the last work piece 11 of the first cassette 14a is finished, the last work piece 11 of the first cassette 14a held by the chuck table 20 is placed. Since the first workpiece 11 of the second cassette 12b unloaded from the chuck table 20 and temporarily placed in the temporary placement mechanism (temporary placement area) 24 is carried into the chuck table 20, the first cassette 14a to the second cassette 14b are loaded. When switching to The waiting time of the chuck table 20 is eliminated. Thereby, the processing of the workpiece 11 of the first cassette 14a and the processing of the workpiece 11 of the second cassette 14b are continuously performed, and high productivity can be realized.

  Further, in the cutting device 2 according to the present embodiment, the second cassette 14b mounted in the second region 12b is taken out from the second region 12b in a state where the first cassette 14a is mounted in the first region 12a, Alternatively, it can be exchanged with another cassette, and the second cassette 14b is mounted in the second region 12b, and the first cassette 14a mounted in the first region 12a is taken out from the first region 12a, or another cassette Therefore, high productivity can be realized by exchanging the cassette without interrupting the cutting of the workpiece 11.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the said embodiment, although illustrated about the cutting apparatus 2 which cuts the to-be-processed object 11, the processing apparatus which concerns on this invention is a grinding apparatus (polishing apparatus) which grind | polishes (polishing) a to-be-processed object, A laser processing apparatus or the like for laser processing the workpiece may be used.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

2 Cutting equipment (processing equipment)
4 Base 4a, 4b Opening 6 Housing 6a Side 6b Front 8 Cutting blade 10 Cutting unit (processing means)
DESCRIPTION OF SYMBOLS 12 Cassette elevator 12a 1st area | region 12b 2nd area | region 14a 1st cassette 14b 2nd cassette 14c Cassette 16 Moving table 18 Dust-proof drip-proof cover 20 Chuck table 20a Holding surface 22 Clamp 24 Temporary placement mechanism (temporary placement area)
24a, 24b Guide rail 26 Cleaning unit 28 First transport unit (transport means)
DESCRIPTION OF SYMBOLS 30 1st Y-axis movement mechanism 32 Guide rail 34 1st slide plate 36 Ball screw 38 Pulse motor 40 1st raising / lowering mechanism 42 1st adsorption | suction unit 44 Grasp unit 46 2nd conveyance unit 48 2nd Y-axis movement Mechanism 50 Guide rail 52 Second slide plate 54 Ball screw 56 Pulse motor 58 Second lifting mechanism 60 Second suction unit 62 Monitor (input means)
64 Control unit (control means)
64a Storage unit (storage means)
11 Workpiece

Claims (2)

A chuck table for holding a workpiece, a processing means for processing the workpiece held on the chuck table, a cassette placement area on which a cassette for storing a plurality of workpieces is placed, and the cassette mounting A cassette placed in the placement area, a temporary placement area where the work is temporarily placed, a transport means for transporting the work between the chuck table, and an input means for inputting the processing conditions of the work. A processing device comprising storage means for storing the processing conditions, and control means for controlling each component,
The cassette mounting area includes a first area in which a first cassette for storing a first type of first workpiece and a second cassette for storing a second type of second workpiece. A second region to be placed;
The storage means stores a first machining condition corresponding to the first workpiece and a second machining condition corresponding to the second workpiece,
The second workpiece housed in the second cassette before finishing the last first workpiece to be machined last among the first workpieces housed in the first cassette. The first second workpiece to be processed first is temporarily placed in the temporary placement region, and when the last first workpiece is finished, the last first workpiece held on the chuck table is finished. A processing apparatus for carrying out a workpiece from the chuck table and loading the first second workpiece temporarily placed in the temporary placement area into the chuck table. The first region and the second region are arranged at positions overlapping each other when viewed from the vertical direction,
With the first cassette placed in the first area, the second cassette placed in the second area can be taken out of the second area or replaced with another cassette,
The first cassette placed in the first area can be taken out from the first area or replaced with another cassette while the second cassette is placed in the second area. The processing apparatus according to claim 1.

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