JPH04306861A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To provide a method of manufacturing a semiconductor device which is enhanced in working and production efficiency. CONSTITUTION:A semiconductor manufacturing device 1 is provide with a wafer ID recognition section 3 inside. The wafer ID recognition section 3 recognizes the wafer ID of the semiconductor substrate which is not processed yet, and inquires the condition of processings to which the substrate is subjected from the host computer 11. The host computer 11 gives the processing conditions of a controller 9 provided inside the semiconductor device 11. The controller 9 which is given processing conditions directs a processing section 4 to execute processing according to the given conditions. By this setup, a semiconductor manufacturing device can be enhanced in production efficiency.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention recognizes a semiconductor substrate,
The present invention relates to a method for manufacturing a semiconductor device in which a semiconductor substrate is processed under processing conditions depending on the semiconductor substrate.

0002

2. Description of the Related Art When semiconductor substrates are loaded into semiconductor manufacturing equipment that processes semiconductor substrates in the process of manufacturing semiconductor devices, a cassette containing a plurality of semiconductor substrates is loaded, and the semiconductors stored in the cassette are A method is used in which all the substrates are processed at once under the same processing conditions.

By processing semiconductor substrates in cassette units, it is possible to reduce the number of steps required to move semiconductor substrates between devices and to reduce the number of times processing conditions must be set for semiconductor manufacturing equipment. It is possible to input cassette units at the semiconductor substrate supply section.

In the conventional semiconductor device manufacturing method, a cassette is used as one management unit, and all the semiconductor substrates stored in this cassette are processed into the same semiconductor device. In other words, when performing processing in semiconductor manufacturing equipment, all semiconductor substrates stored in the cassette can be processed in the same manner by setting processing conditions for the semiconductor manufacturing equipment according to the cassette to be processed. Processing will be carried out under the following conditions.

[0005]

SUMMARY OF THE INVENTION In such a conventional semiconductor device manufacturing method, one cassette is used as a manufacturing unit of one semiconductor device, and it is effective as a method for manufacturing a large number of the same semiconductor devices.

However, even when manufacturing a small amount of semiconductor devices, it is necessary to store semiconductor substrates for manufacturing the same semiconductor device in one cassette, so the number of semiconductor substrates stored in one cassette is limited. If the number of semiconductor substrates stored in one cassette is small and the operating time of the semiconductor manufacturing equipment is constant, then the number of semiconductor substrates stored in one cassette is smaller than the number of semiconductor substrates stored in one cassette. This results in an increase in the number of cassette exchanges and an increase in the number of processing conditions settings. In other words, there is a problem in that the manufacturing efficiency of semiconductor devices is reduced.

[0007] The present invention solves the above problems,
An object of the present invention is to provide a method for manufacturing a semiconductor device that can improve production efficiency.

[0008]

[Means for Solving the Problems] In order to achieve this object, the method for manufacturing a semiconductor device of the present invention includes attaching a wafer ID to a semiconductor substrate for recognizing each semiconductor substrate,
The wafer ID is recognized before processing the semiconductor substrate, and each semiconductor substrate is processed using processing conditions based on the recognition information.

[0009]

[Operation] With this configuration, it is possible to recognize each semiconductor substrate one by one and manufacture semiconductor devices according to each semiconductor substrate, so a semiconductor substrate can be used to manufacture a plurality of different semiconductor devices in one cassette. It becomes possible to manufacture semiconductor devices by storing the information. That is, the production efficiency of semiconductor devices can be improved in a semiconductor device manufacturing method that produces many types of semiconductor devices in small quantities.

0010

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 shows the configuration of a method for manufacturing a semiconductor device according to an embodiment of the present invention. In Figure 1,
1 is a semiconductor manufacturing device; 2 is a semiconductor substrate supply unit that supplies semiconductor substrates from a cassette in which semiconductor substrates are stored; and 3 is a wafer that recognizes wafer IDs such as letters, numbers, and symbols attached to semiconductor substrates. ID recognition section; 4 is a processing section that processes semiconductor substrates; 5 is a semiconductor substrate collection section that collects processed semiconductor substrates into cassettes; 6 is a semiconductor section from semiconductor substrate supply section 2 to wafer ID recognition section 3; a transport unit that transports the substrate; 7 is a transport unit that transports the semiconductor substrate from the wafer ID recognition unit 3 to the processing unit 4;
Reference numeral 8 denotes a transport unit that transports the semiconductor substrate processed in the processing unit 4 to the semiconductor substrate recovery unit 5, and 9 a controller that controls the semiconductor manufacturing apparatus. The controller 9 is connected through a communication line 10 to a host computer 11 that processes information regarding the manufacture of semiconductor devices.

FIG. 2 is a flowchart for explaining a method of manufacturing the semiconductor device of FIG. The operation of the method for manufacturing the semiconductor device of this embodiment configured as described above will be described below.

First, a cassette containing no semiconductor substrates is loaded into the semiconductor substrate recovery section 5. This is for recovering semiconductor substrates that have been processed. Next, the cassette containing the semiconductor substrates is put into the semiconductor substrate supply section 2.

The controller 9 instructs the semiconductor substrate supply section 2 to start supplying semiconductor substrates (step 21 in FIG. 2).

The semiconductor substrates in the semiconductor substrate supply section 2 are transferred to the wafer ID recognition section 3 by the transfer section 6 . Wafer ID
When the recognition unit 3 receives the semiconductor substrate, it aligns the semiconductor substrate using an orientation flat or the like, and then recognizes the wafer ID attached to the semiconductor substrate (step 22).

Wafer ID recognition unit 3 that recognizes the wafer ID
reports the recognized wafer ID to the controller 9. The controller 9 inquires of the host computer 11 through the communication line 10 regarding processing conditions for processing the semiconductor substrate recognized by the wafer ID recognition unit 3 (step 23).

The host computer 11 determines the processing conditions to be used when processing the corresponding semiconductor substrate based on the information of the wafer ID, and determines the processing conditions to be used (step 24).

[0018] The host computer 11 has a communication line 10.
The processing conditions are instructed to the controller 9 through the controller 9 (step 25).

The controller 9, which has received the instructions for the processing conditions, compares the processing conditions under which the previous semiconductor substrate was processed and the processing conditions to be processed from now on to see if they are the same, and determines whether or not to exchange the processing conditions. The necessity is determined (step 26).

If the previous processing conditions and the processing conditions to be processed from now on are the same, the transfer section 7 is instructed to transfer the semiconductor substrate present in the wafer ID recognition section 3 to the processing section 4. At the same time, it also instructs the processing unit 4 to carry out the processing.

[0021] If the previous processing conditions and the processing conditions to be processed from now on are different, the processing section 4
The processing section 4 instructs to exchange the processing conditions, and the processing section 4 executes the exchange of the processing conditions (step 27). After the environment for processing is prepared and the semiconductor substrate can be processed, the transfer section 7 is instructed to transfer the semiconductor substrate present in the wafer ID recognition section 3 to the processing section 4.

The processing unit 4 that receives the semiconductor substrate processes the semiconductor substrate according to the set processing conditions (step 28).

When no semiconductor substrate exists in the wafer ID recognition unit 3, the controller 9 recognizes the presence of a semiconductor substrate inside the cassette loaded into the semiconductor substrate supply unit 2, and detects the semiconductor substrate inside the cassette. If there is, the semiconductor substrate supply section 2 is instructed to supply the semiconductor substrate. If there is no semiconductor substrate inside the cassette of the semiconductor substrate supply section 2, when the semiconductor substrate currently present in the wafer ID recognition section 3 is collected by the semiconductor substrate recovery section 5,
It is determined that all the semiconductor substrates stored in the cassettes loaded into the semiconductor substrate supply section 2 have been processed, and the processing is ended (step 29).

As described above, according to this embodiment, the wafer ID recognition section 3 is provided between the semiconductor substrate supply section 2 and the processing section 4 to recognize the wafer ID, and one semiconductor substrate is sent to the host computer 11. By automatically inquiring about the processing conditions for each process, even when a single cassette contains semiconductor substrates for manufacturing multiple types of semiconductor devices, semiconductor devices can be manufactured automatically. be able to.

[0025]

[Effects of the Invention] As described above, the present invention recognizes the wafer ID attached to a semiconductor substrate before processing it in a semiconductor manufacturing device, and automatically exchanges processing conditions for each semiconductor substrate one by one. By performing the processing, it is possible to provide an excellent semiconductor device manufacturing method that can improve the operating efficiency of semiconductor manufacturing equipment and significantly improve production efficiency.

[Brief explanation of drawings]

FIG. 1 is a schematic configuration diagram of an apparatus for carrying out a method for manufacturing a semiconductor device according to an embodiment of the present invention.

[Figure 2] Flowchart showing the operation of the method for manufacturing the semiconductor device

[Explanation of symbols]

1 Semiconductor manufacturing equipment 2 Semiconductor substrate supply section 3 Wafer ID recognition unit ４　　　　　　Processing section 5 Semiconductor substrate recovery department 6　　　　　Transfer section 7　　　　　　Transport section 8　　　　　　Transport section 9 Controller 10 Communication line 11 Host computer

Claims (1)

[Claims] Claim 1: A wafer ID such as letters, numbers, symbols, etc. that can be used to recognize each semiconductor substrate is attached to each semiconductor substrate, and the wafer ID is recognized before processing the semiconductor substrate, and the recognized information is provided. A method for manufacturing a semiconductor device, characterized in that each semiconductor substrate is processed using processing conditions for each semiconductor substrate based on the following.