JPH0738370B2 - Method for manufacturing semiconductor device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor device manufacturing method capable of performing real-time production control and achieving high productivity.

[Conventional technology]

As a conventional method of managing a semiconductor device manufacturing system, for example, as described in JP-A-59-67638, there is a method of inquiring the central computer of the ID of a lot that has arrived at a manufacturing device and receiving instructions such as its manufacturing conditions. Has been submitted. However, in order to carry out more precise management aiming at the efficiency of the manufacturing system, it is necessary to manage even the work procedure of the manufacturing apparatus, but this point was not taken into consideration.

[Problems to be Solved by the Invention] The above conventional technology does not consider managing the work order of each manufacturing apparatus in a semiconductor device system, and when a plurality of lots arrive at the same apparatus at the same time, Whether the priority is given to the processing of the lot, or when the processing result is judged to be defective in a certain process, the work plan should be changed by the operator's on-the-spot judgment or by the supervisor. There was a problem that it was necessary to temporarily stop work in order to obtain instructions.

The object of the present invention is to process a plurality of different types of lots in parallel. In a semiconductor device manufacturing system, a method of manufacturing a semiconductor device is provided, which enables precise and real-time instruction management of the work order of each manufacturing device in order to achieve system efficiency and reduction of work mistakes. Especially.

[Means for solving problems]

In order to achieve the above-mentioned object, the present invention provides, at the entrance of each manufacturing apparatus, a monitoring device for transmitting to a central computer the time when a lot scheduled to be processed next arrives,
The central computer estimates the estimated end time of the process currently being processed and stores it so that when some abnormality occurs in a part of the semiconductor device manufacturing system, the time at which the device arrives at the device and the process created in advance. It is possible to detect this abnormality from the comparison with the schedule. Further, the central computer judges whether or not it is necessary to recreate the work order instruction, and if necessary, the estimated end time of the currently processing step stored in the central computer is used as the latest data to realize real-time operation. It is possible to give the work order instruction. As a result, it is possible to configure a semiconductor device manufacturing system capable of precisely controlling the work order of each manufacturing device and managing the operation in real time.

[Action]

In the present invention, each manufacturing apparatus of the semiconductor manufacturing system,
Since the central computer instructs the optimum work sequence, the maximum production efficiency is always demonstrated, and the manufacturing conditions can also be instructed by the central computer, which reduces the operator's work mistakes. It is possible to perform stable quality production. Located at the entrance of each manufacturing device,
The monitoring device communicates the arrival time of the lot to the central computer. Thereby, the central computer predicts and stores the end time of the process. Also, the central computer
By comparing the arrival time with the work order instruction created in advance, it is determined whether the work order instruction needs to be recreated, and if necessary, the work order instruction is made based on the latest data. Recreate. As a result, the semiconductor device manufacturing system is always managed by the latest data, so that the efficiency of the system can be maximized.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1, 2 and 3. The semiconductor device manufacturing system in this embodiment has the layout shown in FIG. Before and after each manufacturing apparatus 3, a monitoring apparatus 2 such as an ID card reader or a mark reader on a wafer and an inspection apparatus 4 for judging the quality of the processing result by the manufacturing apparatus 3 are provided as shown in FIG. It is arranged. Lots of different varieties are loaded from the lot loading section 6 and the central computer 1
Is guided to each manufacturing apparatus 3 in accordance with the order of steps via a lot transport path 5 which can be controlled by. After that, the necessary steps are sequentially processed, but when the processing device 3 of the next step is in use by another lot or needs to stand by for a reason such as a failure, the lot is set in the lot waiting section 7 To wait for you. In this way, by system operation under the control of the central computer 1, each lot stacks up the necessary processes and finally reaches the lot carry-out section 8 to complete the lot process.

In the present embodiment described above, when a certain lot is guided to the manufacturing apparatus 3 by the lot conveying path 5 according to the work order instruction determined by the central computer 1, the monitoring apparatus 2 provided immediately before the manufacturing apparatus 3 causes The arrival of the lot is confirmed, and the arrival time is transmitted to the central computer 1. Upon receiving the information from the monitoring device 2, the central computer 1 performs the processing shown in FIG. As a first step, the central computer 1 stores the end time of the process in advance in the central computer. It is predicted from the data such as the processing specification of the lot and the device condition and is stored. As a second step, a manufacturing condition instruction is given to the manufacturing apparatus 3, and the processing of the process is started by this instruction. As a third step, the arrival time of the lot is compared with the expected end time of the previous process,
Determine whether it is necessary to change the work order instruction. As a result, if it is judged necessary, change the work order instruction,
An instruction is given to each manufacturing apparatus 3 and the lot transport path 5. When the work order instruction is changed, the estimated work end time of each process currently being processed is used as data, so that the work order instruction can be managed in real time. Further, even if some abnormality occurs in the manufacturing apparatus 3, the manufacturing apparatus 3 transmits information to that effect to the central computer 1, and the central computer 1 changes the work order instruction. The inspection device 4 also has a procedure of transmitting information to the central computer 1, and if the processing result is judged to be defective, the defective can be analyzed by the central computer 1 and the processing can be reproduced, or It is possible to change the work order instruction by judging whether it is impossible to continue.

According to the present embodiment, the instruction management of the optimum work order is always performed regardless of the internal disturbance of the semiconductor device manufacturing system such as the delay of the work in each manufacturing device 3, the occurrence of an abnormality in each manufacturing device 3, the defective processing result, and the like. Can be done. As a result, work mistakes can be reduced and the production effect of the semiconductor device manufacturing system can be maximized at all times.

In the present embodiment, the layout of the semiconductor device manufacturing system may be a loop-shaped or radial layout. It is also possible to use a terminal connected to the central computer 1 by the operator, instead of the monitoring device 2, to input the lot arrival time. Alternatively, the central computer 1 transmits a manufacturing condition instruction to the terminal, It is also possible to give instructions to the operator.

Although it is possible to change the work order instruction at regular time intervals, even in such a case, by using the estimated end time of the process currently being processed as data, the work order can be instructed and managed in near real time.

〔The invention's effect〕

According to the present invention, in a semiconductor device manufacturing system that processes a plurality of different types of lots in parallel, the work order of each device in the system can always be kept optimal, and for the worker or the manufacturing device, Since it is possible to accurately instruct the manufacturing conditions and the like, it is possible to reduce work mistakes and maximize the production efficiency of the semiconductor device production system. Further, according to the present invention, it becomes possible to automate the semiconductor device manufacturing system including the transfer system, and there is an effect of improving cleanliness, stabilizing quality, and saving labor.

[Brief description of drawings]

FIG. 1 is a system diagram showing an embodiment of the present invention, FIG. 2 is a layout diagram of a semiconductor device manufacturing system to which the present invention is applied, and FIG. 3 is a flow chart showing an example of a program used in the present invention. Is. 1 ... Central computer, 2 ... Monitoring device, 3 ... Manufacturing device, 4 ... Inspection device, 5 ... Transport path, 6 ... Rot carry-in section, 7 ... Rot standby section, 8 ... Rot carry-out section .

Claims (1)

[Claims] 1. A step of introducing a lot to be processed into a conveyance path connecting a plurality of manufacturing apparatuses, a step of storing manufacturing conditions according to a product type to be processed in the manufacturing apparatus, A step of storing the work order, a step of confirming and identifying the arrival time of the lot conveyed in the work order at the manufacturing apparatus entrance and the kind of the lot,
Storing the lot arrival time; predicting a processing end time in the manufacturing apparatus from the lot arrival time and the manufacturing condition; storing the predicted processing end time; To the manufacturing apparatus, comparing the lot arrival time with the estimated end time of the lot being processed in the manufacturing apparatus to determine whether the work order is changed, and the work order according to the determination. A method of manufacturing a semiconductor device, comprising: