JP2016078132A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device which can prevent dryness of a work-piece during movement of a chuck table.SOLUTION: A processing device 2, which includes: a chuck table 22 for holding a work-piece; polishing means 38a, 38b for polishing the work-piece held by the chuck table; polishing water supply means which supplies polishing water to an exposed surface of the work-piece held by the chuck table when polishing the work-piece by the polishing means; a circular turn table 20 which moves the chuck table between a carry-in/carry-out position A at which carry-in/carry-out of the work-piece with respect to the chuck table is performed and polishing positions B, C at which the work-piece held by the chuck table is polished, is further equipped with a liquid supply nozzle 50 as liquid supply means which supplies a liquid to the work-piece when the chuck table is moved by rotation of the turn table.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a processing apparatus for processing a plate-shaped workpiece.

  In recent years, opportunities for thinly processing plate-like workpieces such as semiconductor wafers are increasing. For example, the workpiece can be roughly ground with a grinding wheel with a large abrasive grain size to make it thin to the finish thickness, finish grinding with a grinding wheel with a small abrasive grain size to improve the flatness of the work surface, and the work surface can be processed into a mirror surface It is processed in a series of steps including polishing.

  For processing a workpiece, for example, a processing apparatus including a rotating circular turntable and a plurality of processing units (rough grinding unit, finish grinding unit, polishing unit) arranged in the circumferential direction above the turntable Is used (see, for example, Patent Document 1).

  The turntable is provided with a plurality of chuck tables. By fixing the work piece to the chuck table and rotating the turntable, a series of steps are performed without removing the work piece from the chuck table. To process the workpiece.

JP 2006-344878 A

  By the way, in the processing apparatus mentioned above, while removing liquids (processing waste) generated by processing by supplying a liquid such as pure water from a nozzle provided corresponding to each processing unit toward the workpiece, Process the work piece.

  However, with this nozzle, the liquid cannot be supplied to the workpiece when the chuck table is moved by rotating the turntable. For this reason, when the chuck table is moved, there is a problem that the workpiece is dried and the generated waste is fixed to the processing surface.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a processing apparatus capable of preventing the workpiece from being dried when the chuck table is moved.

  According to the present invention, a chuck table for holding a workpiece, a grinding means for grinding the workpiece held on the chuck table, and a chuck table held when the workpiece is ground by the grinding means. Grinding water supply means for supplying grinding water to the exposed surface of the processed workpiece, a loading / unloading position for loading / unloading the workpiece to / from the chuck table, and the workpiece held on the chuck table And a circular turntable for moving the chuck table to a grinding position to be machined, wherein the workpiece is disposed on the turntable, and liquid is processed when the chuck table is moved by rotation of the turntable. There is provided a processing apparatus comprising a liquid supply means for supplying to the substrate.

  It is preferable that the processing apparatus of the present invention further includes a polishing unit that polishes the workpiece held on the chuck table.

  The processing apparatus according to the present invention includes a liquid supply unit that supplies a liquid to the workpiece when the chuck table is moved by the rotation of the turntable. Therefore, the workpiece can be prevented from drying when the chuck table is moved.

It is a perspective view which shows the example of a structure of a processing apparatus typically. It is a perspective view which shows typically the grinding | polishing unit with which a processing apparatus is provided. FIG. 3A is a plan view schematically showing how the workpiece is processed by the grinding unit and the polishing unit, and FIG. 3B is a plan view schematically showing how the chuck table is moved. It is.

  Embodiments of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a processing apparatus according to this embodiment. As shown in FIG. 1, the processing apparatus 2 includes a base 4 that supports each structure.

  An opening 4a is formed on the front end side of the upper surface of the base 4, and a first transport unit 6 for transporting the workpiece 11 (see FIG. 3) is provided in the opening 4a. Further, in the region further forward of the opening 4a, mounting tables 10a and 10b for mounting cassettes 8a and 8b capable of accommodating a plurality of workpieces 11 are formed.

  The workpiece 11 is, for example, a substantially circular plate (wafer) formed of a material such as silicon, and the upper surface side is processed by the processing apparatus 2 of the present embodiment. A protective member (not shown) made of resin or the like is attached to the lower surface of the workpiece 11. However, the structure of the workpiece processed with the processing apparatus 2 of this embodiment is not limited to this.

  An alignment mechanism 12 that aligns the workpiece 11 is provided obliquely behind the opening 4a. The alignment mechanism 12 includes a temporary placement table 14 on which the workpiece 11 is temporarily placed. For example, the workpiece 11 is transported from the cassette 8 a by the first transport unit 6 and temporarily placed on the temporary placement table 14. Align the center of.

  A gate-type support structure 16 that straddles the alignment mechanism 12 is disposed on the side surface of the base 4. The support structure 16 is provided with a second transport unit 18 that transports the workpiece 11. The second transport unit 18 is movable in the left-right direction (X-axis direction), the front-rear direction (Y-axis direction), and the up-down direction (Z-axis direction). For example, the work piece aligned by the alignment mechanism 12 The object 11 is conveyed backward.

  An opening 4 b is formed behind the opening 4 a and the alignment mechanism 12. A disc-shaped turntable 20 that rotates around a rotation axis extending in the vertical direction is disposed in the opening 4b. On the upper surface of the turntable 20, four chuck tables 22 that suck and hold the workpiece 11 are installed at substantially equal angular intervals.

  The workpiece 11 unloaded from the alignment mechanism 12 by the second transfer unit 18 is loaded into the chuck table 22 positioned at the loading / unloading position A on the front side. The turntable 20 rotates, for example, in the direction of the rotation direction R shown in the figure, and positions the chuck table 22 in the order of the carry-in / out position A, the rough grinding position B, the finish grinding position C, and the polishing position D.

  Each chuck table 22 is connected to a rotation drive source (not shown) such as a motor, and rotates around a rotation axis extending in the vertical direction. The upper surface of each chuck table 22 is a holding surface that holds the workpiece 11 by suction. This holding surface is connected to a suction source (not shown) through a flow path (not shown) formed inside the chuck table 22. The workpiece 11 carried into the chuck table 22 is sucked on the lower surface side (protective member side) by the negative pressure of the suction source acting on the holding surface.

  A wall-like support structure 24 is erected on the rear side of the turntable 20. Two sets of lifting units 26 are provided on the front surface of the support structure 24. Each lifting unit 26 includes two lifting guide rails 28 extending in the vertical direction (Z-axis direction), and a lifting table 30 is slidably installed on the lifting guide rails 28.

  A nut portion (not shown) is provided on the rear surface side (back surface side) of the lifting table 30, and a lifting ball screw 32 parallel to the lifting guide rail 28 is screwed to the nut portion. A lifting pulse motor 34 is connected to one end of the lifting ball screw 32. The lifting table 30 moves up and down along the lifting guide rail 28 by rotating the lifting ball screw 32 by the lifting pulse motor 34.

  A fixture 36 is provided on the front surface (front surface) of the lifting table 30. A grinding unit (grinding means) 38a for rough grinding for roughly grinding the workpiece 11 is fixed to the fixture 36 of the lifting table 30 positioned above the rough grinding position B. On the other hand, a grinding unit (grinding means) 38b for finish grinding for finish-grinding the workpiece 11 is fixed to the fixture 36 of the lift table 30 positioned above the finish grinding position C.

  Each of the spindle housings 40 of the grinding units 38a and 38b accommodates a spindle 42 that constitutes a rotating shaft, and a disk-like wheel mount 44 is fixed to the lower end portion (tip portion) of each spindle 42. Yes.

  A grinding wheel 46a provided with a grinding wheel for rough grinding is mounted on the lower surface of the wheel mount 44 of the grinding unit 38a, and a grinding wheel for finish grinding is provided on the lower surface of the wheel mount 44 of the grinding unit 38b. A grinding wheel 46b is mounted. A rotational drive source (not shown) such as a motor is connected to the upper end side of each spindle 42, and the grinding wheels 46a and 46b rotate with the rotational force transmitted from the rotational drive source.

  In the vicinity of the grinding wheels 46a and 46b, a grinding water supply nozzle (grinding water) that extends from the base 4 and supplies grinding water (pure water or the like) to the upper surface of the workpiece 11 that is held by the chuck table 22 and exposed. Supply means) (not shown) are respectively arranged. By rotating the chuck table 22 and the spindle 42, the grinding wheels 46a and 46b are lowered and brought into contact with the upper surface of the workpiece 11 while supplying grinding water, whereby the workpiece 11 can be roughly ground or finish ground.

  In the vicinity of the polishing region D, a polishing unit (polishing means) 48 for polishing the upper surface of the workpiece 11 ground by the grinding units 38a and 38b is provided. Further, four liquid supply nozzles (liquid supply means) 50 for supplying a liquid (pure water or the like) to the workpiece 11 held on each chuck table 22 are arranged at the center of the turntable 20. .

  For example, when the chuck table 22 is moved by rotating the turntable 20, the liquid is supplied from the liquid supply nozzle 50 to the workpiece 11 held on each chuck table 22. Thereby, the to-be-processed object 11 at the time of moving the chuck table 22 can be prevented.

  A cleaning unit 52 for cleaning the workpiece 11 is provided in front of the alignment mechanism 12, and the processed workpiece 11 is transported from the chuck table 22 to the cleaning unit 52 by the second transport unit 18. Is done. The workpiece 11 cleaned by the cleaning unit 52 is transported by the first transport unit 6 and accommodated in the cassette 8b.

  FIG. 2 is a perspective view schematically showing a polishing unit 48 provided in the processing apparatus 2. As shown in FIGS. 1 and 2, a block-like support structure 54 is erected on the upper surface of the base 4. A horizontal movement unit 56 that moves the polishing unit 48 in the horizontal direction (here, the X-axis direction) is provided on the rear surface of the support structure 54.

  The horizontal moving unit 56 includes a pair of horizontal guide rails 58 fixed to the rear surface of the support structure 54 and parallel to the horizontal direction (X-axis direction). A horizontal movement table 60 is slidably installed on the horizontal guide rail 58. A nut portion (not shown) is provided on the rear surface side of the horizontal movement table 60, and a horizontal ball screw (not shown) parallel to the horizontal guide rail 58 is screwed into the nut portion.

  A pulse motor 62 is connected to one end of the horizontal ball screw. By rotating the horizontal ball screw with the pulse motor 62, the horizontal movement table 60 moves in the horizontal direction (X-axis direction) along the horizontal guide rail 58.

  On the rear surface side of the horizontal movement table 60, a vertical movement unit 64 for moving the polishing unit 48 in the vertical direction (Z-axis direction) is provided. The vertical movement unit 64 includes a pair of vertical guide rails 66 fixed to the rear surface of the horizontal movement table 60 and parallel to the vertical direction (Z-axis direction).

  A vertical movement table 68 is slidably installed on the vertical guide rail 66. A nut portion (not shown) is provided on the front side (back side) of the vertical moving table 68, and a vertical ball screw (not shown) parallel to the vertical guide rail 66 is screwed into the nut portion. Yes.

  A pulse motor 70 is connected to one end of the vertical ball screw. By rotating the vertical ball screw with the pulse motor 70, the vertical movement table 68 moves in the vertical direction (Z-axis direction) along the vertical guide rail 66.

  A polishing unit 48 for polishing the upper surface of the workpiece 11 is fixed to the rear surface (front surface) of the vertical moving table 68. The spindle housing 72 of the polishing unit 48 accommodates a spindle 74 that constitutes a rotation shaft, and a disc-shaped wheel mount 76 is fixed to the lower end (tip) of the spindle 74.

  A polishing wheel 78 having substantially the same diameter as the wheel mount 76 is attached to the lower surface of the wheel mount 76. The polishing wheel 78 includes a wheel base 78a formed of a metal material such as stainless steel. A disc-shaped polishing pad 78b is fixed to the lower surface of the wheel base 78a.

  In the vicinity of the polishing wheel 78, a polishing liquid supply nozzle (polishing liquid supply means) (not shown) for supplying a polishing liquid (slurry or the like) to the upper surface of the workpiece 11 held and exposed by the chuck table 22 is disposed. Yes.

  The workpiece 11 can be polished by lowering the polishing wheel 78 while rotating the chuck table 22 and the spindle 74 and bringing the polishing pad 78b into contact with the upper surface of the workpiece 11 while supplying the polishing liquid.

  Next, a usage example of the liquid supply nozzle 50 provided in the processing apparatus 2 of the present embodiment will be described. FIG. 3A is a plan view schematically showing how the workpiece 11 is processed by the grinding units 38a, 38b and the polishing unit 48, and FIG. 3B shows how the chuck table 22 is moved. It is a top view shown typically.

  As shown in FIG. 3A, when the workpiece 11 is processed by the grinding units 38 a and 38 b and the polishing unit 48, first, the chuck table 22 is positioned at a predetermined position by the turntable 20.

  Specifically, the chuck table 22 holding the workpiece 11 before processing is positioned at the rough grinding position B, the chuck table 22 holding the workpiece 11 after rough grinding is positioned at the finish grinding position C, and finish grinding. The chuck table 22 holding the subsequent workpiece is positioned at the polishing position D.

  In this state, while rotating the chuck table 22 and the spindles 42 and 74, the grinding wheels 46 a and 46 b and the polishing wheel 78 are lowered to contact the upper surface of the workpiece 11 while supplying grinding water or polishing liquid. Thus, the workpiece 11 can be processed.

  While the workpiece 11 is being processed, the new workpiece 11 is held on the chuck table 22 positioned at the loading / unloading position A as shown in FIG. It is good to prepare for.

  After the processing is completed, the turntable 20 is rotated and the chuck table 22 is moved. For example, as shown in FIG. 3B, the chuck table 22 at the loading / unloading position A is moved to the rough grinding position B, the chuck table 22 at the rough grinding position B is moved to the finish grinding position C, and the finish grinding position C is obtained. The turn table 20 is rotated in the rotation direction R so that the chuck table 22 is moved to the polishing position D and the chuck table 22 at the polishing position D is moved to the loading / unloading position A.

  At this time, the liquid L is supplied from the liquid supply nozzle 50 disposed on the turntable 20 to the workpiece 11 held on each chuck table 22. Since the liquid supply nozzle 50 moves together with the chuck table 22 in accordance with the rotation of the turntable 20, the liquid L can be supplied to prevent drying even in a situation where the grinding water or the polishing liquid cannot be supplied to the workpiece 11.

  Note that the turntable 20 is connected to a pipe or the like extending from the base 4 and cannot be rotated indefinitely. Therefore, after rotating the turntable 20 to a certain angle, it is necessary to rotate it in the reverse direction to return to the initial position. For example, after repeating the operation of rotating the turntable 20 90 degrees in the forward direction (rotation direction R) three times, the turntable 20 is rotated 270 degrees in the reverse direction to return the turntable 20 to the initial position.

  Since the time required for this reverse rotation is relatively long, in the conventional processing apparatus, drying of the workpiece 11 during the reverse rotation has been a serious problem. On the other hand, in the processing apparatus 20 of the present embodiment, the liquid L can be supplied to the workpiece 11 by the liquid supply nozzle 50 even during the period in which the turntable 20 rotates in the reverse direction.

  As described above, the processing apparatus 2 according to this embodiment includes the liquid supply nozzle (liquid supply means) 50 that supplies the liquid L to the workpiece 11 when the chuck table 22 is moved by the rotation of the turntable 20. When the chuck table 22 is moved, the workpiece 11 can be prevented from drying.

  In addition, this invention is not limited to description of the said embodiment, A various change can be implemented. For example, in the above embodiment, the processing apparatus 2 including the grinding units 38a and 38b and the polishing unit 48 is described, but the processing apparatus of the present invention is not limited to this.

  For example, any of the grinding units 38a and 38b and the polishing unit 48 can be omitted. In this case, the number of chuck tables 22 and liquid supply nozzles (liquid supply means) 50 may be changed together.

  In addition, the configurations, methods, and the like according to the above-described embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

DESCRIPTION OF SYMBOLS 2 Processing apparatus 4 Base 4a, 4b Opening 6 1st conveyance unit 8a, 8b Cassette 10a, 10b Mounting stand 12 Alignment mechanism 14 Temporary placement table 16 Support structure 18 2nd conveyance unit 20 Turntable 22 Chuck table 24 Support structure 26 Lifting Unit 28 Lifting Guide Rail 30 Lifting Table 32 Lifting Ball Screw 34 Lifting Pulse Motor 36 Fixing Tool 38a, 38b Grinding Unit (Grinding Means)
40 Spindle housing 42 Spindle 44 Wheel mount 46a, 46b Grinding wheel 48 Polishing unit (polishing means)
50 Liquid supply nozzle (liquid supply means)
52 Cleaning unit 54 Support structure 56 Horizontal moving unit 58 Horizontal guide rail 60 Horizontal moving table 62 Pulse motor 64 Vertical moving unit 66 Vertical guide rail 68 Vertical moving table 70 Pulse motor 72 Spindle housing 74 Spindle 76 Wheel mount 78 Polishing wheel 78a Wheel base Table 78b Polishing pad 11 Work piece A Loading / unloading position B Coarse grinding position C Finish grinding position D Polishing position L Liquid

Claims (2)

A chuck table for holding a workpiece, a grinding means for grinding the workpiece held on the chuck table, and a workpiece held on the chuck table when the workpiece is ground by the grinding means. Grinding water supply means for supplying grinding water to the exposed surface, a loading / unloading position for loading / unloading the workpiece onto / from the chuck table, and a grinding position for grinding the workpiece held on the chuck table. A circular turntable for moving the chuck table, and a processing device comprising:
A processing apparatus comprising: a liquid supply unit disposed on the turntable and configured to supply a liquid to a workpiece when the chuck table is moved by rotation of the turntable. The processing apparatus according to claim 1, further comprising a polishing means for polishing a workpiece held on the chuck table.